Unit stress adjusting device used in process of preparing substrate glass by overflow method

Abstract

The utility model discloses a unit stress adjusting device used when substrate glass is prepared through an overflow method, and belongs to the technical field of liquid crystal substrate glass manufacturing. Comprising a plurality of stress adjusting units arranged on the two sides of substrate glass. The stress adjusting unit comprises a soaking plate and a cooling plate; a heating device is arranged in the vapor chamber; and the cooling plate is connected with a cooling water inlet pipe and a cooling water outlet pipe. A plurality of stress adjusting units are arranged on the two sides of the substrate glass, each stress adjusting unit comprises a soaking plate and a cooling plate, the substrate glass can be cooled or heated in different areas, stress adjustment is carried out, transverse and longitudinal temperature differences in the cooling process of the substrate glass are made up, the accuracy of stress control is improved, and the service life of the substrate glass is prolonged. In addition, the unitized independent cooling plate reduces the operation difficulty of the traditional process and improves the production efficiency.

Description

Technical Field

[0001] The utility model belongs to the technical field of liquid crystal substrate glass manufacturing, and relates to a unit stress regulating device when preparing substrate glass by an overflow method. Background Art

[0002] Substrate glass is one of the key materials for flat panel display devices and is the carrier of panel manufacturing technology. It has high requirements for its flatness and thermal stability. Especially with the development of high-generation and high-precision display technology, the requirements for substrate glass are getting higher and higher. Overflow method substrate glass occupies an important market position due to its surface quality characteristics that do not require secondary processing. However, its process control technology is extremely difficult, especially in the control of stress during rapid cooling and annealing. As the width of the glass plate increases, its production difficulty also increases exponentially. The traditional technology is to control the temperature of the glass plate by adding cooling water pipes and heating devices on both sides of the glass plate to achieve the purpose of controlling stress. However, with the development of high-generation substrate glass, the length of molding equipment is getting longer and longer, the speed of leading the plate is getting faster and faster, and the quality requirements are getting higher and higher. Traditional stress process control technology has overlapping cooling and heating, cannot be accurately controlled, and the on-site operation is becoming more and more difficult, the operation is inconvenient, and it cannot meet high quality requirements. Such as Figure 1 and Figure 2 As shown, when the molten glass flows down from the overflow brick 101 and is gradually cooled and formed during the annealing process, in order to quickly adjust the temperature of the glass plate, multiple groups of heating units 301 and through-type cooling pipes 401 are distributed from top to bottom on both sides of the substrate glass 201, and heating and cooling are performed according to the temperature distribution of the glass. However, since the lateral temperature distribution of the glass plate generally has local uneven cold and heat, and the cooling device of the prior art is a through-type, it will affect the entire effective area 204 around the substrate glass 201 during cooling, and it is difficult to achieve local cooling or heating of the glass plate, resulting in stress in the glass plate. In addition, the traditional heating device directly faces the glass plate, and the glass plate will be locally overheated, aggravating the deterioration of the stress state. Utility Model Content

[0003] The utility model aims to solve the technical problem in the prior art that substrate glass cannot be locally adjusted during stress adjustment, and to provide a unit stress adjustment device for preparing substrate glass by an overflow method.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] In the first aspect, the utility model provides a unit stress adjustment device for preparing substrate glass by an overflow method, including a plurality of stress adjustment units arranged on both sides of the substrate glass; the stress adjustment unit includes a heat spreader and a cooling plate; a heating device is arranged in the heat spreader; the cooling plate is connected to a cooling water inlet pipe and a cooling water outlet pipe.

[0006] The further improvement of the utility model is:

[0007] The stress adjustment units on both sides of the substrate glass are symmetrically arranged.

[0008] The plurality of stress adjustment units on one side of the substrate glass are evenly arranged vertically and horizontally; at least two stress adjustment units are arranged vertically, and at least three stress adjustment units are arranged horizontally.

[0009] With the substrate glass as the origin, the heat spreader is arranged behind the cooling plate.

[0010] A cooling coil is arranged in the cooling plate; the inlet of the cooling coil is connected to a cooling water inlet pipe; and the outlet of the cooling coil is connected to a cooling water outlet pipe.

[0011] The cooling water inlet pipe of each stress adjustment unit is connected to the cooling integrated water inlet pipe; the cooling water outlet pipe of each stress adjustment unit is connected to the cooling integrated water outlet pipe.

[0012] The heat spreader is made of high thermal conductivity material.

[0013] The heating device adopts electric heating.

[0014] A cooling control valve is arranged on the cooling water inlet pipe.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] The utility model discloses a unit stress regulating device for preparing substrate glass by an overflow method. A plurality of stress regulating units are arranged on both sides of the substrate glass. The stress regulating units include a heat spreader and a cooling plate. The substrate glass can be cooled or heated in different regions to adjust the stress. The lateral and longitudinal temperature differences in the cooling process of the substrate glass are compensated, and the accuracy of stress control is improved. In addition, the unitized independent cooling plate of the utility model reduces the difficulty of traditional process operation and improves production efficiency.

[0017] Furthermore, with the substrate glass as the origin, the heat spreader is arranged behind the cooling plate, so as to avoid the heating device directly facing the substrate glass, which would cause local overheating of the substrate glass and aggravate the deterioration of the stress state.

[0018] Furthermore, a cooling control valve is provided on the cooling water inlet pipe of each cooling plate, and the amount of cooling medium entering the cooling plate can be controlled by adjusting the opening of the cooling control valve, thereby controlling the degree of temperature reduction and more accurately adjusting the stress of the substrate glass. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a front view of an existing substrate glass stress adjustment device;

[0021] Figure 2 It is a cross-sectional top view of an existing substrate glass stress adjustment device;

[0022] Figure 3 It is a front view of a unit stress regulating device for preparing substrate glass by an overflow method in the utility model;

[0023] Figure 4 It is a cross-sectional top view of a unit stress regulating device for preparing substrate glass by an overflow method in the utility model;

[0024] Figure 5 It is a bottom view of a unit stress regulating device for preparing substrate glass by an overflow method in the utility model;

[0025] Figure 6 It is a schematic diagram of the cooling module structure of a unit stress regulating device for preparing substrate glass by an overflow method in the utility model;

[0026] Figure 7 The diagram is a schematic diagram of stress area division and stress distribution of substrate glass when a unit stress adjustment method is used when the substrate glass is prepared by the overflow method in an embodiment of the utility model.

[0027] Wherein: 1- substrate glass zone 1; 2- substrate glass zone 2; 11- zone 1 first stress regulating unit; 12- zone 1 second stress regulating unit; 13- zone 1 third stress regulating unit; 21- zone 2 first stress regulating unit; 22- zone 2 second stress regulating unit; 23- zone 2 third stress regulating unit; 101- overflow brick; 201- substrate glass; 301- heating unit; 401- cooling pipe; 501- stress regulating unit; 502- cooling integrated water inlet pipe; 503- cooling integrated water outlet pipe; 504- heat plate; 505- cooling plate; 506- cooling control valve; 507- cooling coil; 202- glass substrate transverse stress distribution; 203- glass substrate longitudinal stress distribution; 204- effective area. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0031] In the description of the embodiments of the present utility model, it should be noted that if the terms "upper", "lower", "horizontal", "inner", etc. indicate an orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed when in use, it is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0032] In addition, if the term "horizontal" appears, it does not mean that the component must be absolutely horizontal, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", which does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0033] In the description of the embodiments of the present utility model, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0034] The utility model is further described in detail below with reference to the accompanying drawings:

[0035] See also Figure 3 , Figure 4 and Figure 5 The embodiment of the utility model discloses a unit stress adjustment device for preparing substrate glass by overflow method, including 12 stress adjustment units 501 arranged on both sides of substrate glass 201; the stress adjustment units 501 on both sides of the substrate glass 201 are symmetrically arranged, with 6 on each side. The several stress adjustment units 501 on one side of the substrate glass 201 are evenly arranged vertically and horizontally; 2 stress adjustment units 501 are arranged vertically, and 3 stress adjustment units 501 are arranged horizontally. The stress adjustment unit 501 includes a heat spreader 504 and a cooling plate 505, and the heat spreader 504 is made of high thermal conductivity material. With the substrate glass 201 as the origin, the heat spreader 504 is arranged behind the cooling plate 505, so as to avoid the heating device directly facing the substrate glass, so that the substrate glass is locally overheated, and the stress state is aggravated. A heating device is arranged in the heat spreader 504, and the heating device adopts electric heating. The cooling plate 505 is connected to a cooling water inlet pipe and a cooling water outlet pipe. A cooling control valve 506 is provided on the cooling water inlet pipe. The amount of cooling medium entering the cooling plate can be controlled by adjusting the opening of the cooling control valve, thereby controlling the degree of temperature reduction and more accurately adjusting the stress of the substrate glass.

[0036] See also Figure 6 The cooling plate 505 is provided with a cooling coil 507; the inlet of the cooling coil 507 is connected to the cooling water inlet pipe; the outlet of the cooling coil 507 is connected to the cooling water outlet pipe. The cooling water inlet pipe of each stress adjustment unit 501 is connected to the cooling integrated water inlet pipe 502; the cooling water outlet pipe of each stress adjustment unit 501 is connected to the cooling integrated water outlet pipe 503.

[0037] The utility model discloses a unit stress regulating device for preparing substrate glass by an overflow method. A plurality of stress regulating units are arranged on both sides of the substrate glass. The stress regulating units include a heat spreader and a cooling plate. The substrate glass can be cooled or heated in different regions to adjust the stress. The lateral and longitudinal temperature differences in the cooling process of the substrate glass are compensated, and the accuracy of stress control is improved. In addition, the unitized independent cooling plate of the utility model reduces the difficulty of traditional process operation and improves production efficiency.

[0038] The working process of the utility model is as follows:

[0039] During the annealing and cooling process of the substrate glass 201, the substrate glass 201 needs to be heated and cooled according to the actual stress state. When cooling is required, the cooling water or air cooling control valve 506 is opened or increased, and the cooling water or air enters the cooling plate 505 through the cooling coil 507, and quickly exchanges heat with the local substrate glass in the corresponding area, and is output through the cooling water outlet pipe to achieve the purpose of rapid and uniform cooling. When the corresponding substrate glass 201 needs to be heated, the heating device is adjusted to heat the regional substrate glass through the heat plate 504 through the electric heating method. Due to the function of the cooling plate 505, the regional substrate glass can be evenly heated and the temperature can be raised.

[0040] See also Figure 7 During the cooling process of the substrate glass 201, the annealing area of ​​the substrate glass 201 is respectively corresponding to six areas A1, B1, C1, A2, B2, and C2 according to the stress adjustment units (including the first stress adjustment unit 11 of the first area, the second stress adjustment unit 12 of the first area, the third stress adjustment unit 13 of the first area, the first stress adjustment unit 21 of the second area, the second stress adjustment unit 22 of the second area, and the third stress adjustment unit 23 of the second area). When a transverse stress distribution morphology appears, that is, the substrate glass 201 presents tensile stress on both sides and compressive stress in the middle, the corresponding first stress adjustment unit 11 of the first area, the third stress adjustment unit 13 of the first area, the first stress adjustment unit 21 of the second area, and the third stress adjustment unit 23 of the second area, that is, the heating modules in the corresponding areas A1, A2 and C1, C2 are adjusted to increase the temperature of the corresponding areas, and at the same time, the cooling plates 505 in the second stress adjustment unit 12 of the first area and the second stress adjustment unit 22 of the second area corresponding to B1 and B2 are adjusted to reduce the temperature of the corresponding areas of the substrate glass 201, so as to achieve the purpose of reducing the stress of the whole plate.

[0041] When the stress of the substrate glass 201 shows a longitudinal stress distribution shape, the substrate glass zone 1 is compressive stress, and the substrate glass zone 2 is tensile stress distribution, the general reason is the residual stress caused by the temperature difference between the upper and lower parts of the substrate glass 201. The corresponding adjustment method is to increase the temperature of the corresponding glass area by adjusting the heat spreader 504 of the first stress adjustment unit 11, the second stress adjustment unit 12 and the third stress adjustment unit 13 of the first zone 1 corresponding to the substrate glass zone 1, and at the same time adjust the cooling plate 505 of the first stress adjustment unit 21, the second stress adjustment unit 22 and the third stress adjustment unit 23 of the second zone 2 corresponding to the substrate glass zone 2 to reduce the temperature of the corresponding glass area, so as to achieve the purpose of reducing the stress of the whole plate.

[0042] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A unit stress regulating device for preparing substrate glass by an overflow method, characterized in that: The invention comprises a plurality of stress adjustment units (501) arranged on both sides of a substrate glass (201); the stress adjustment unit (501) comprises a heat spreader (504) and a cooling plate (505); a heating device is arranged in the heat spreader (504); and the cooling plate (505) is connected to a cooling water inlet pipe and a cooling water outlet pipe.

2. The unit stress adjustment device for preparing substrate glass by overflow method according to claim 1, characterized in that: The stress adjustment units (501) on both sides of the substrate glass (201) are symmetrically arranged.

3. The unit stress adjustment device for preparing substrate glass by overflow method according to claim 2, characterized in that: The plurality of stress adjustment units (501) on one side of the substrate glass (201) are evenly arranged in the vertical and horizontal directions; at least two stress adjustment units (501) are arranged in the vertical direction, and at least three stress adjustment units (501) are arranged in the horizontal direction.

4. The unit stress regulating device for preparing substrate glass by overflow method according to claim 1, characterized in that: With the substrate glass (201) as the origin, the heat spreader (504) is arranged behind the cooling plate (505).

5. The unit stress adjustment device for preparing substrate glass by overflow method according to claim 1, characterized in that: The cooling plate (505) is provided with a cooling coil (507); the inlet of the cooling coil (507) is connected to a cooling water inlet pipe; and the outlet of the cooling coil (507) is connected to a cooling water outlet pipe.

6. The unit stress regulating device for preparing substrate glass by overflow method according to claim 1, characterized in that: The cooling water inlet pipe of each stress adjustment unit (501) is connected to the cooling integrated water inlet pipe (502); and the cooling water outlet pipe of each stress adjustment unit (501) is connected to the cooling integrated water outlet pipe (503).

7. The unit stress adjustment device for preparing substrate glass by overflow method according to claim 1, characterized in that: The heat spreader (504) is made of a high thermal conductivity material.

8. The unit stress regulating device for preparing substrate glass by overflow method according to claim 1, characterized in that: The heating device adopts electric heating.

9. The unit stress regulating device for preparing substrate glass by overflow method according to claim 1, characterized in that: The cooling water inlet pipe is provided with a cooling control valve (506).

Images