Semiconductor detection bearing frame
By designing the flip assembly and adjustable clamping assembly of the semiconductor detection carrier, the problem of insufficient safety and adaptability of semiconductor detection in the prior art is solved, and the adaptability of semiconductor double-sided detection and semiconductors of different sizes is realized, and the detection is improved Efficiency and reliability.
Patent Information
- Application Number
- CN202323478384.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-20
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2033-12-20
AI Technical Summary
Existing semiconductor detection technology cannot ensure the safe and reliable performance of semiconductors, and the adaptability of fixed specific semiconductors is too low to meet the needs of detecting multiple semiconductors.
A semiconductor detection carrier is designed, including a flip assembly, an adjustable clamping assembly and a position adjustment device. The double-sided detection of the semiconductor is achieved by driving the rotating shaft and telescopic rod by the motor, and the semiconductor is fixed through an adjustable clamping device to adapt to different sizes. semiconductors.
The double-sided detection of semiconductors is realized, which reduces work flow and improves work efficiency. The automatic clamping device prevents semiconductors from falling off, meeting the detection needs of semiconductors in different volumes.
Smart Images
Figure CN222190688U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor frames, in particular to a semiconductor detection carrier frame. Background Art
[0002] With the rapid development of science and technology, people are increasingly exposed to machines containing semiconductor equipment. In order to ensure the reliability of the products, the performance of semiconductors is increasingly tested during the production process to prevent unqualified products from entering the market. During the semiconductor testing process, it must be fixed with a bracket to avoid deviation.
[0003] For example, Chinese utility model patent CN216354186U discloses a semiconductor frame, which fixes the semiconductor to facilitate the detection of one side of the semiconductor, and at the same time locks a specific semiconductor device to prevent it from falling off and causing detection failure.
[0004] However, it still has the following disadvantages: only fixing one side of the semiconductor for testing cannot ensure the safety and reliability of the semiconductor; at the same time, the adaptability of fixing a specific semiconductor for testing is too low, and it cannot meet the needs of the equipment to test multiple semiconductors.
[0005] Based on this, the utility model designs a semiconductor testing carrier to solve the above problems. Utility Model Content
[0006] In view of the above-mentioned shortcomings of the prior art, the utility model provides a semiconductor testing carrier.
[0007] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:
[0008] A semiconductor testing carrier comprises a bottom plate, wherein a flip assembly for flipping is installed on the upper end of the bottom plate;
[0009] The flip assembly includes a supporting device and a driving device, and the supporting device is connected to the driving device;
[0010] The support device is provided with an adjustable clamping assembly for adjusting the installation position;
[0011] The supporting device is provided with a position adjusting device 1 for fixing the device.
[0012] Furthermore, the supporting device includes a supporting frame and a supporting plate, the left and right sides of the upper end of the base plate are respectively fixedly connected with supporting frames, the supporting frame is connected to the driving device, the driving device is connected to the supporting plate, a clamping groove is opened at one end of the supporting plate facing each other, and the clamping groove is connected to an adjustable clamping assembly; the supporting plate is connected to a position adjustment device and an adjustable clamping assembly.
[0013] Furthermore, the driving device includes a motor, a rotating shaft, a limit plate and a telescopic rod. The left wall of the left end support frame is fixedly connected to the motor, the output end of the motor passes through the support frame and is fixedly connected to the rotating shaft, the upper end of the right end support frame is rotatably connected to the telescopic rod, the right end of the telescopic rod is fixedly connected to the limit plate, the limit plate is in contact with the right end motor, and the end of the telescopic rod facing the rotating shaft is fixedly connected to the support plate.
[0014] Furthermore, the adjustable clamping assembly includes a second position adjustment device and an automatic clamping device, the second position adjustment device is connected to the automatic clamping device and the support plate, and the automatic clamping device is connected to the support plate.
[0015] Furthermore, the second position adjustment device includes a support block, a second rotating shaft, a limit block, a slide groove, a first clamping plate and a limit groove.
[0016] Furthermore, the left and right end support plates are respectively provided with limit grooves on the opposite sides thereof, and the limit blocks are slidably connected in the limit grooves, and a support block is fixedly connected on the opposite side thereof, and a slide groove is provided in the support block, and a first clamping plate is slidably connected in the slide groove, and a second rotating shaft is rotatably connected at one end thereof, and the second rotating shaft is threadedly connected to the support block, and the support block is connected to an automatic clamping device.
[0017] Furthermore, the automatic clamping device includes slot two, a spring, a sliding column, a clamping plate and a limit column. The left and right ends of the supporting plates facing each other are respectively provided with slot two, the inner wall of the opposite end of the slot two is fixedly connected to one end of the spring, the other end of the spring is fixedly connected to a sliding column, the sliding column is slidably connected to the slot two, the upper ends of the left and right supports are fixedly connected to the limit columns, and the left and right sides of the front end of the clamping slot are respectively fixedly connected to the limit columns.
[0018] Furthermore, the fixed end of the first clamping plate is made of rubber material.
[0019] Furthermore, the position adjustment device 1 includes a handle, a threaded rod, a slot 1 and a first limit block.
[0020] Furthermore, the front and rear ends of the support plate are respectively rotatably connected with threaded rods, the right end of the threaded rod is fixedly connected with a handle, and the inner walls of the front and rear ends of the left support plate are provided with a slot hole 1, and the first limit block is contacted and connected in the slot hole 1, and the right end of the first limit block is fixedly connected to the threaded rod.
[0021] The utility model has the following technical effects:
[0022] 1. The utility model fixes the motor of the driving device through the support frame of the support device of the flip assembly, and the motor provides power to drive the rotating shaft 1 and the support plate at the right end to rotate. The support plate at the right end drives the support plate at the left end to rotate through the position adjustment device 1, and the telescopic rod is driven to rotate through the support plate at the left end. The telescopic rod is prevented from being offset by the fixation of the limit plate. The flipping of the driving device facilitates the detection of both sides of the semiconductor at one time, reduces the work process and improves the work efficiency.
[0023] 2. The utility model drives the limit block to move left and right along the limit groove provided on the support plate by moving the support fastener of the position adjustment device 2 of the adjustable clamping assembly. When it is adjusted to a suitable installation position, the first clamping plate is driven to move along the direction of the slide groove provided on the support fastener by rotating the second rotating shaft to fix the device. The semiconductor is inserted into the limit column of the automatic clamping device, a spring is placed through the second slot hole provided in the support plate, the sliding column is pushed to move along the second slot hole by the spring, and the clamping plate is driven by the sliding column to clamp the device. The position of the device can be adjusted to meet the installation requirements of semiconductors of different sizes. At the same time, the semiconductor is automatically clamped to prevent it from falling off and causing detection failure.
[0024] 3. The utility model drives the threaded rod to rotate by rotating the handle of the position adjustment device, and drives the first limit block in the slot hole to move by the rotation of the threaded rod. The size of the installation position of the adjustment device is adjusted by moving the driving device to meet the needs of semiconductor detection of different volumes. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0026] Figure 1 A three-dimensional semiconductor testing carrier of the utility model Figure 1 ;
[0027] Figure 2 It is a front view of a semiconductor testing carrier of the utility model;
[0028] Figure 3 It is a left view of a semiconductor testing carrier of the utility model;
[0029] Figure 4 A three-dimensional semiconductor testing carrier of the utility model Figure 2 ;
[0030] Figure 5For along Figure 3 AA direction cross-sectional view;
[0031] Figure 6 For along Figure 3 BB direction cross-sectional view;
[0032] Figure 7 for Figure 6 Enlarged view of point C in the middle.
[0033] The numbers in the figure represent:
[0034] 1. Bottom plate 2. Flip assembly 21. Support device 22. Driving device 211. Support frame 212. Support plate 213. Clamping groove 221. Motor 222. Rotating shaft 1 223. Limiting plate 224. Telescopic rod 3. Position adjustment device 1 31. Handle 32. Threaded rod 33. Slot 1 34. First limiting block 4. Adjustable clamping assembly 41. Position adjustment device 2 42. Automatic clamping device 411. Support fastener 412. Rotating shaft 2 413. Limiting block 414. Slide 415. First clamping plate 416. Limiting groove 421. Slot 2 422. Spring 423. Sliding column 424. Clamping plate 425. Limiting column. DETAILED DESCRIPTION
[0035] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0036] The utility model is further described below in conjunction with embodiments.
[0037] The terms “left”, “right”, “front”, “back”, “up” and “down” mentioned in the following description are oriented in the viewing direction of the front view.
[0038] Example 1
[0039] Please refer to the instruction manual Figure 1-7 , a semiconductor testing carrier, comprising a base plate 1;
[0040] A flip assembly 2 for flipping is installed at the upper end of the bottom plate 1, and the flip assembly 2 is connected to a position adjustment device 3 and an adjustable clamping assembly 4;
[0041] The flip assembly 2 includes a supporting device 21 and a driving device 22, and the supporting device 21 is connected to the driving device 22, a position adjustment device 3 and an adjustable clamping assembly 4;
[0042] The supporting device 21 includes a supporting frame 211 and a supporting plate 212. The supporting frames 211 are fixedly connected to the left and right sides of the upper end of the bottom plate 1, respectively. The supporting frame 211 is connected to the driving device 22, and the driving device 22 is connected to the supporting plate 212. A clamping groove 213 is opened at one end of the supporting plate 212 facing each other, and the clamping groove 213 is connected to the adjustable clamping assembly 4; the supporting plate 212 is connected to the position adjustment device 3 and the adjustable clamping assembly 4;
[0043] The driving device 22 includes a motor 221, a rotating shaft 222, a limiting plate 223 and a telescopic rod 224. The left wall of the left end support frame 211 is fixedly connected to the motor 221. The output end of the motor 221 passes through the support frame 211 and is fixedly connected to the rotating shaft 222. The upper end of the right end support frame 211 is rotatably connected to the telescopic rod 224. The right end of the telescopic rod 224 is fixedly connected to the limiting plate 223. The limiting plate 223 is in contact with the right end motor 221. The end of the telescopic rod 224 facing the rotating shaft 222 is fixedly connected to the support plate 212.
[0044] In the embodiment of the utility model, when the device is ready for detection, the motor 221 of the driving device 22 is fixed by the support frame 211 of the supporting device 21 of the flip assembly 2, and the motor 221 provides power to drive the rotating shaft 222 and the support plate 212 at the right end to rotate. The support plate 212 at the right end drives the support plate 212 at the left end to rotate through the position adjustment device 3, and the telescopic rod 224 is driven to rotate through the support plate 212 at the left end. The telescopic rod 224 is fixed by the limit plate 223 to prevent it from deviating. By flipping the driving device, it is convenient to detect both sides of the semiconductor at one time, which reduces the work process and improves the work efficiency.
[0045] An adjustable clamping assembly 4 for adjusting the installation position is installed on the flip assembly 2;
[0046] The adjustable clamping assembly 4 includes a second position adjustment device 41 and an automatic clamping device 42, the second position adjustment device 41 is connected to the automatic clamping device 42 and the support plate 212, and the automatic clamping device 42 is connected to the support plate 212;
[0047] The second position adjustment device 41 includes a support block 411, a second rotating shaft 412, a limit block 413, a slide groove 414, a first clamping plate 415 and a limit groove 416. The limit grooves 416 are respectively provided on the opposite sides of the left and right end support plates 212. The limit blocks 413 are slidably connected in the limit grooves 416. The limit blocks 413 are fixedly connected to the opposite side of the support block 413. The support block 411 is provided with a slide groove 414. The first clamping plate 415 is slidably connected in the slide groove 414. The first clamping plate 415 is rotatably connected to the rotating shaft 412 at one end. The rotating shaft 412 is threadedly connected to the support block 411. The support block 411 is connected to the automatic clamping device 42.
[0048] The automatic clamping device 42 includes a second slot hole 421, a spring 422, a sliding column 423, a clamping plate 424 and a limiting column 425. The left and right ends of the supporting plates 212 facing each other are respectively provided with a second slot hole 421. The inner wall of the opposite end of the second slot hole 421 is fixedly connected to one end of the spring 422. The other end of the spring 422 is fixedly connected to a sliding column 423. The sliding column 423 is slidably connected to the second slot hole 421. The upper ends of the left and right ends of the supporting plates 411 are fixedly connected to the limiting column 425. The left and right sides of the front end of the clamping slot 213 are respectively fixedly connected to the limiting column 425.
[0049] Preferably, the fixed end of the first clamping plate 415 is made of rubber material;
[0050] The rubber material is soft and strong, which can increase the friction at the contact point with the device, making the device more tightly fixed;
[0051] In the embodiment of the utility model, when the device is ready to be installed, the support block 411 of the second position adjustment device 41 of the adjustable clamping assembly 4 is moved to drive the limit block 413 to move left and right along the limit groove 416 provided on the support plate 212. When adjusted to a suitable installation position, the first clamping plate 415 is driven to move along the direction of the slide groove 414 provided on the support block 411 by rotating the second shaft 412 to fix the device. The semiconductor is inserted into the limit column 425 of the automatic clamping device 42, and a spring 422 is placed through the second slot 421 provided in the support plate 212. The sliding column 423 is pushed to move along the second slot 421 by the spring 422, and the device is clamped by the clamping plate 424 driven by the sliding column 423. The position of the device is adjusted to meet the installation of semiconductors of different sizes, and the semiconductor is automatically clamped to prevent it from falling off and causing detection failure.
[0052] A position adjustment device 3 for fixing the device is installed on the flip assembly 2;
[0053] The position adjustment device 13 includes a handle 31, a threaded rod 32, a slot 133 and a first limit block 34. The front and rear ends of the support plate 212 are rotatably connected to the threaded rod 32 respectively, and the right end of the threaded rod 32 is fixedly connected to the handle 31. The inner walls of the front and rear ends of the left support plate 212 are provided with a slot 133, and the first limit block 34 is contacted and connected in the slot 133. The right end of the first limit block 34 is fixedly connected to the threaded rod 32.
[0054] In the embodiment of the utility model, when the device starts to adjust the installation position, the handle 31 of the rotating position adjustment device 3 drives the threaded rod 32 to rotate, and the rotation of the threaded rod 32 drives the first limit block 34 in the slot 33 to move, and the size of the installation position of the adjustment device is adjusted by moving the driving device to meet the needs of semiconductor detection of different volumes.
[0055] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. A semiconductor testing carrier, comprising a base plate (1), characterized in that: A turning assembly (2) for turning over is installed at the upper end of the bottom plate (1); The flip assembly (2) comprises a supporting device (21) and a driving device (22), wherein the supporting device (21) is connected to the driving device (22); The support device (21) is provided with an adjustable clamping assembly (4) for adjusting the installation position; The supporting device (21) is provided with a position adjusting device (3) for fixing the device.
2. The semiconductor testing carrier according to claim 1, characterized in that: The support device (21) comprises a support frame (211) and a support plate (212); the support frames (211) are fixedly connected to the left and right sides of the upper end of the base plate (1); the support frame (211) is connected to the driving device (22); the driving device (22) is connected to the support plate (212); a clamping groove (213) is provided at one end of the support plate (212) facing each other; the clamping groove (213) is connected to an adjustable clamping assembly (4); and the support plate (212) is connected to a position adjustment device (3) and the adjustable clamping assembly (4).
3. The semiconductor testing carrier according to claim 2, characterized in that: The driving device (22) comprises a motor (221), a rotating shaft (222), a limiting plate (223) and a telescopic rod (224); the left wall of the left end support frame (211) is fixedly connected to the motor (221); the output end of the motor (221) passes through the support frame (211) and is fixedly connected to the rotating shaft (222); the upper end of the right end support frame (211) is rotatably connected to the telescopic rod (224); the right end of the telescopic rod (224) is fixedly connected to the limiting plate (223); the limiting plate (223) is in contact with the right end motor (221); and the end of the telescopic rod (224) facing the rotating shaft (222) is fixedly connected to the support plate (212).
4. The semiconductor testing carrier according to claim 3, characterized in that: The adjustable clamping assembly (4) comprises a second position adjustment device (41) and an automatic clamping device (42); the second position adjustment device (41) is connected to the automatic clamping device (42) and a support plate (212); and the automatic clamping device (42) is connected to the support plate (212).
5. The semiconductor testing carrier according to claim 4, characterized in that: The second position adjustment device (41) comprises a support block (411), a second rotating shaft (412), a limit block (413), a slide groove (414), a first clamping plate (415) and a limit groove (416).
6. The semiconductor testing carrier according to claim 5, characterized in that: The support plates (212) at the left and right ends are respectively provided with limiting grooves (416) on the opposite sides thereof, and the limiting blocks (413) are slidably connected in the limiting grooves (416). The limiting blocks (413) are fixedly connected with a support block (411) on the opposite side thereof, and a slide groove (414) is provided in the support block (411), and a first clamping plate (415) is slidably connected in the slide groove (414). The first clamping plate (415) is rotatably connected with a second rotating shaft (412) at the opposite end thereof, and the second rotating shaft (412) is threadedly connected to the support block (411), and the support block (411) is connected to the automatic clamping device (42).
7. The semiconductor testing carrier according to claim 6, characterized in that: The automatic clamping device (42) comprises a second slot hole (421), a spring (422), a sliding column (423), a clamping plate (424) and a limiting column (425). The left and right ends of the supporting plates (212) facing each other are respectively provided with a second slot hole (421). The inner wall of the opposite end of the second slot hole (421) is fixedly connected to one end of the spring (422). The other end of the spring (422) is fixedly connected to the sliding column (423). The sliding column (423) is slidably connected to the second slot hole (421). The upper ends of the left and right ends of the supporting plates (411) are fixedly connected to the limiting columns (425). The left and right sides of the front end of the clamping slot (213) are respectively fixedly connected to the limiting columns (425).
8. The semiconductor testing carrier according to claim 7, characterized in that: The fixed end of the first clamping plate (415) is made of rubber material.
9. The semiconductor testing carrier according to claim 8, characterized in that: The position adjustment device (3) comprises a handle (31), a threaded rod (32), a slot hole (33) and a first limit block (34).
10. The semiconductor testing carrier according to claim 9, characterized in that: The front and rear ends of the support plate (212) are rotatably connected to threaded rods (32), the right end of the threaded rod (32) is fixedly connected to a handle (31), the front and rear inner walls of the left support plate (212) are provided with a slot hole (33), the slot hole (33) is contact-connected with a first limit block (34), and the right end of the first limit block (34) is fixedly connected to the threaded rod (32).