Special quartz combined outer ring for semiconductor etching process

Abstract

The utility model discloses a special quartz combined outer ring for a semiconductor etching process, which relates to the technical field of integrated circuit manufacturing, and comprises a reactive ion etching machine, an embedding groove is arranged in the quartz ring, a reinforcing groove is arranged on the surface of the top end of a bump, and the reinforcing groove is arranged in the embedding groove. And a slot is formed in the clamping column. The quartz rings, the embedding grooves, the reinforcing grooves and the inserting grooves are matched with one another, the quartz rings can be more stably combined together due to the existence of the embedding grooves, the assembly accuracy and stability are ensured, the firmness of connection is further enhanced due to the design of the reinforcing grooves and the clamping columns, vibration and impact of external force on the quartz rings are effectively relieved, and the service life of the quartz rings is prolonged. Therefore, the durability and the stability of mechanical parts are improved, the assembly difficulty caused by errors is reduced, the influence of human factors on product assembly is reduced, damaged parts can be quickly disassembled and replaced, and the maintenance time is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit manufacturing, in particular to a quartz combination outer ring dedicated to semiconductor etching technology. Background Art

[0002] Reactive ion etcher (RIE) is a kind of equipment commonly used in semiconductor processing, especially suitable for precise semiconductor etching process. Reactive ion etcher can accurately etch the chip surface in a high vacuum environment by means of ion bombardment and chemical reaction. This equipment is commonly used in the manufacture of semiconductor devices and integrated circuits. It can accurately control the etching depth and etching profile, and install the designed quartz combination outer ring on the chip surface or around the device structure. The quartz combination outer ring plays a protective and positioning role in the etching process, ensuring that the etching only acts on the area that needs to be etched.

[0003] When an existing reactive ion etcher performs semiconductor etching on a quartz ring, the quartz ring needs to be fixed. The existing quartz ring is simply fixed by adsorption, which can easily cause the position of the quartz ring to shift during the semiconductor etching process. The quartz ring shift may cause uneven etching depth or contour deformation, affecting the quality and performance of the quartz ring device. Utility Model Content

[0004] The utility model provides a quartz combination outer ring specially used for semiconductor etching process, which has the advantage that a reactive ion etcher can stably fix the quartz combination outer ring to perform semiconductor etching process, so as to solve the problem that the reactive ion etcher can not stably fix the quartz combination outer ring to perform semiconductor etching process, resulting in deviation of the quartz combination outer ring.

[0005] In order to achieve the purpose of stably fixing a quartz combination outer ring in a reactive ion etcher for a semiconductor etching process, the utility model provides the following technical solutions: a quartz combination outer ring specially used for a semiconductor etching process, comprising a reactive ion etcher and a grounded carrier plate installed on the outer surface of the reactive ion etcher, a wafer carrier plate installed on the top surface of the grounded carrier plate, a quartz ring movably installed on the top of the wafer carrier plate, an embedding groove provided in the quartz ring, protrusions evenly distributed on the inner wall of the embedding groove, a reinforcement groove provided on the top surface of the protrusion, pillars evenly distributed on the inner wall of the reinforcement groove, a slot provided inside the pillar, a vacuum adsorption component installed inside the grounded carrier plate, a top extrusion and fixing component evenly distributed on the top surface of the wafer carrier plate, a pressure plate installed on the outer surface of the top extrusion and fixing component, and a bottom end surface of the pressure plate movably contacting with the top surface of the quartz ring.

[0006] As a preferred technical solution of the utility model, the top extrusion fixing assembly includes a limiting column and a limiting groove, the limiting column is installed on the top surface of the wafer carrier plate, and the limiting groove is opened on the inner wall of the limiting column.

[0007] As a preferred technical solution of the utility model, an electromagnet plate is installed on the inner wall of the limiting groove, and a connecting spring is installed on the top surface of the electromagnet plate.

[0008] As a preferred technical solution of the utility model, a magnetic base is installed on one end surface of the connecting spring, a telescopic column is installed on the top surface of the magnetic base, and the outer surface of the telescopic column and the outer surface of the magnetic base are both in active contact with the inner wall of the limiting groove.

[0009] As a preferred technical solution of the utility model, a rotating column is movably mounted on the inner surface of the telescopic column, and the outer surface of the rotating column is fixedly connected to one end surface of the pressing plate.

[0010] As a preferred technical solution of the utility model, a pressure plate groove is provided on the outer surface of the telescopic column, the interior of the pressure plate groove is in movably contact with the outer surface of the pressure plate, a clamping plate is installed on the top surface of the pressure plate, and the outer surface of the clamping plate is in movably contact with the inner surface of the telescopic column.

[0011] As a preferred technical solution of the utility model, the vacuum adsorption assembly includes a hydraulic rod and a piston. The hydraulic rod is installed on the outer surface of a grounded carrier plate, and the piston is installed on the outer surface of an output end of the hydraulic rod. A sealed cavity is provided inside the grounded carrier plate and inside the wafer carrier plate, and the outer surface of the piston is in active contact with the inner wall of the sealed cavity.

[0012] Compared with the prior art, the utility model provides a quartz combination outer ring for semiconductor etching process, which has the following beneficial effects:

[0013] 1. The quartz combined outer ring specially used for semiconductor etching process cooperates with each other through the quartz ring, embedded groove, bump, reinforcement groove, clamping column and slot. The existence of the embedded groove can make the quartz ring more firmly combined together to ensure the accuracy and stability of assembly, and the design of the reinforcement groove and the clamping column further enhances the firmness of the connection. Through the design of the embedded groove, reinforcement groove and slot, the vibration and impact of external force on the quartz ring can be effectively reduced, thereby improving the durability and stability of mechanical parts. The quartz ring designed with embedded groove, reinforcement groove and slot can improve the efficiency of assembly, reduce the difficulty of assembly caused by errors, and reduce the influence of human factors on product assembly. The design of embedded groove, reinforcement groove and slot makes the maintenance of the quartz ring more convenient, and the damaged parts can be quickly disassembled and replaced, saving maintenance and repair time.

[0014] 2. The quartz combined outer ring specially used in the semiconductor etching process can fix the quartz ring firmly on the wafer carrier through the electromagnet plate, magnetic base, pressure plate, pressure plate groove, sealing chamber, hydraulic rod and pistons that cooperate with each other, so that the pressure is uniform and the control is precise, which can effectively enhance the stability of the quartz ring, avoid displacement or shaking during the process, and not be affected by external vibration or impact. By fixing the quartz ring more firmly on the wafer carrier, the accuracy and repeatability of the processing process can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the overall structure of the reactive ion etcher of the utility model;

[0016] Figure 2 This is a schematic diagram of the internal structure of the quartz ring of the utility model;

[0017] Figure 3 The utility model provides Figure 2 A schematic diagram of the structure enlargement of part A;

[0018] Figure 4 This is a schematic diagram of the external structure of the grounding bearing plate of the utility model;

[0019] Figure 5 This is a schematic diagram of the overall structure of the vacuum adsorption component of the utility model;

[0020] Figure 6 It is a schematic diagram of the internal structure of the top extrusion fixing component of the utility model.

[0021] In the figure: 1. Reactive ion etcher; 2. Wafer carrier plate; 3. Quartz ring; 31. Embedding groove; 32. Bump; 33. Reinforcement groove; 34. Clamping column; 35. Slot; 4. Grounding carrier plate; 5. Limiting column; 6. Limiting groove; 7. Electromagnetic iron plate; 8. Magnetic base; 9. Telescopic column; 10. Rotating column; 11. Pressure plate; 12. Pressure plate groove; 13. Sealing chamber; 14. Hydraulic rod; 15. Piston; 16. Connecting spring; 17. Clamping plate. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] refer to Figure 1-6The utility model discloses a quartz combination outer ring for semiconductor etching process, including a reactive ion etcher 1 and a grounded carrier plate 4 installed on the outer surface of the reactive ion etcher 1, a wafer carrier plate 2 is installed on the top surface of the grounded carrier plate 4, a quartz ring 3 is movably installed on the top of the wafer carrier plate 2, an embedding groove 31 is provided in the quartz ring 3, protrusions 32 are evenly distributed on the inner wall of the embedding groove 31, a reinforcement groove 33 is provided on the top surface of the protrusion 32, a card column 34 is evenly distributed on the inner wall of the reinforcement groove 33, a slot 35 is provided inside the card column 34, the embedding groove 31, the reinforcement groove 33 and the slot 35 are etched inside the quartz ring 3, and the existence of the embedding groove 31 can make the quartz ring 3 more stable The quartz ring 3 is firmly combined with the reinforcing groove 33 to ensure the accuracy and stability of assembly, and the design of the reinforcing groove 33 and the clamping column 34 further enhances the firmness of the connection. The design of the embedding groove 31, the reinforcing groove 33 and the slot 35 can effectively reduce the vibration and impact of external force on the quartz ring 3, thereby improving the durability and stability of the mechanical parts. The quartz ring 3 designed with the embedding groove 31, the reinforcing groove 33 and the slot 35 can improve the efficiency of assembly, reduce the assembly difficulties caused by errors, and reduce the influence of human factors on product assembly. The design of the embedding groove 31, the reinforcing groove 33 and the slot 35 makes the maintenance of the quartz ring 3 more convenient, and the damaged parts can be quickly disassembled and replaced, saving maintenance and repair time.

[0024] A vacuum adsorption component is installed inside the grounded carrier plate 4, and a top extrusion fixing component is evenly distributed on the top surface of the wafer carrier plate 2. A pressure plate 11 is installed on the outer surface of the top extrusion fixing component. The bottom surface of the pressure plate 11 is in active contact with the top surface of the quartz ring 3. The top extrusion fixing component includes a limit column 5 and a limit groove 6. The limit column 5 is installed on the top surface of the wafer carrier plate 2, and the limit groove 6 is opened on the inner wall of the limit column 5. An electromagnet plate 7 is installed on the inner wall of the limit groove 6. A connecting spring 16 is installed on the top surface of the electromagnet plate 7. One end of the connecting spring 16 A magnetic base 8 is installed on the surface, and a telescopic column 9 is installed on the top surface of the magnetic base 8. The outer surface of the telescopic column 9 and the outer surface of the magnetic base 8 are both in active contact with the inner wall of the limit groove 6. A rotating column 10 is movably installed on the inner surface of the telescopic column 9. The outer surface of the rotating column 10 is fixedly connected to one end surface of the pressure plate 11. A pressure plate groove 12 is opened on the outer surface of the telescopic column 9. The inner part of the pressure plate groove 12 is in active contact with the outer surface of the pressure plate 11. A clamping plate 17 is installed on the top surface of the pressure plate 11. The outer surface of the clamping plate 17 is movably connected to the inner surface of the telescopic column 9. The vacuum adsorption assembly includes a hydraulic rod 14 and a piston 15. The hydraulic rod 14 is mounted on the outer surface of the grounded carrier plate 4, and the piston 15 is mounted on the outer surface of the output end of the hydraulic rod 14. The inside of the grounded carrier plate 4 and the inside of the wafer carrier plate 2 are both provided with a sealed cavity 13. The outer surface of the piston 15 is in active contact with the inner wall of the sealed cavity 13, so that the quartz ring 3 is firmly fixed on the wafer carrier plate 2, ensuring that the position of the quartz ring 3 on the wafer carrier plate 2 is fixed, so that the pressure is uniform and the control is precise, which can effectively enhance the stability of the quartz ring 3 and avoid displacement during the process. When the quartz ring 3 is out of position or shakes, the hydraulic rod 14 drives the piston 15 to move in the sealed chamber 13, and the atmospheric pressure in the sealed chamber 13 is reduced, thereby forming a stronger fixing effect around the quartz ring 3, which can ensure that the quartz ring 3 is firmly fixed on the wafer carrier plate 2 and is not affected by external vibrations or impacts. By making the quartz ring 3 more firmly fixed on the wafer carrier plate 2, the accuracy and repeatability of the processing process can be improved, which is crucial for precision processing processes such as semiconductor etching, and can ensure the quality and performance of the final product, and can achieve rapid adjustment and stable fixation of the position of the quartz ring 3.

[0025] The working principle and use process of the utility model are as follows: when the quartz ring 3 needs to be fixedly placed, the quartz ring 3 is placed on the wafer carrier plate 2, and the quartz ring 3 is placed between the four limit columns 5. The quartz ring 3 squeezes the pressure plate 11, and the pressure plate 11 drives the clamping plate 17 to move. The pressure plate synchronously drives the rotating column 10 to rotate, so that the pressure plate 11 moves into the pressure plate groove 12, which is convenient for the quartz ring 3 to be placed on the wafer carrier plate 2, so that the clamping plate 17 is in contact with the internal movement of the telescopic column 9, so that the position of the pressure plate 11 is fixed, and the electromagnet plate 7 is connected The electromagnet plate 7 is magnetic, and the magnetism of the corresponding surfaces of the electromagnet plate 7 and the magnetic base 8 is opposite, and the interior of the pressure plate 11 is made of magnetic material, and the magnetism of the corresponding surfaces of the pressure plate 11 and the magnetic base 8 is the same, so that a discharge force is generated between the pressure plate 11 and the magnetic base 8, so that the pressure plate 11 returns to its original position, and the electromagnet plate 7 and the magnetic base 8 directly generate an attractive force, so that the magnetic base 8 drives the telescopic column 9 to squeeze the connecting spring 16, so that the telescopic column 9 moves into the limiting groove 6, so that the pressure plate 11 contacts the outer side of the limiting column 5, so that the pressure plate 11 is in position The clamping block is also in contact with the inside of the telescopic column 9, so that the pressure plate 11 can stably fix the quartz ring 3 around, and then the hydraulic rod 14 is controlled to work, so that the hydraulic rod 14 drives the piston 15 to move in the sealed chamber 13, so that the atmospheric pressure in the sealed chamber 13 is reduced, and the quartz ring 3 is further reinforced on the wafer carrier plate 2, so that the quartz ring 3 is stably fixed on the wafer carrier plate 2, ensuring that the position of the quartz ring 3 on the wafer carrier plate 2 is fixed, so that the pressure is uniform and the control is precise, which can effectively enhance the stability of the quartz ring 3 and avoid displacement or shaking during the process. When the hydraulic rod 14 drives the piston 15 to move in the sealed chamber 13, the atmospheric pressure in the sealed chamber 13 decreases, thereby forming a stronger fixing effect around the quartz ring 3, which can ensure that the quartz ring 3 is firmly fixed on the wafer carrier plate 2 and is not affected by external vibrations or impacts. By making the quartz ring 3 more firmly fixed on the wafer carrier plate 2, the accuracy and repeatability of the processing process can be improved, which is crucial for precision processing processes such as semiconductor etching. It can ensure the quality and performance of the final product and can achieve rapid adjustment and stable fixation of the position of the quartz ring 3.

[0026] When the etching of the quartz ring 3 is completed, an embedding groove 31 is opened inside the quartz ring 3, and the inner wall of the embedding groove 31 is on the same horizontal line as the end surface of the pressure plate 11, and the inner wall of the embedding groove 31 is evenly etched with bumps 32, and the top surface of the bump 32 is etched with a reinforcement groove 33, and the reinforcement groove 33 is evenly etched with a card column 34, and the card column 34 has a slot 35 inside. The embedding groove 31, the reinforcement groove 33 and the slot 35 are etched inside the quartz ring 3. The existence of the embedding groove 31 can make the quartz ring 3 more firmly combined together, ensuring the accuracy and stability of the assembly, and the reinforcement groove 33 and the card column 3 The design of 4 further enhances the firmness of the connection. Through the design of the embedding groove 31, the reinforcement groove 33 and the slot 35, the vibration and impact of the external force on the quartz ring 3 can be effectively reduced, thereby improving the durability and stability of the mechanical parts. The quartz ring 3 designed with the embedding groove 31, the reinforcement groove 33 and the slot 35 can improve the efficiency of assembly, reduce the assembly difficulties caused by errors, and reduce the influence of human factors on product assembly. The design of the embedding groove 31, the reinforcement groove 33 and the slot 35 makes the maintenance of the quartz ring 3 more convenient, and the damaged parts can be quickly disassembled and replaced, saving maintenance and repair time.

Claims

1. A quartz composite outer ring for semiconductor etching process, comprising a reactive ion etcher (1) and a grounded carrier plate (4) mounted on the outer surface of the reactive ion etcher (1), characterized in that: A wafer carrier plate (2) is mounted on the top surface of the grounded carrier plate (4), a quartz ring (3) is movably mounted on the top of the wafer carrier plate (2), an embedding groove (31) is provided in the quartz ring (3), protrusions (32) are evenly distributed on the inner wall of the embedding groove (31), a reinforcement groove (33) is provided on the top surface of the protrusion (32), clamping columns (34) are evenly distributed on the inner wall of the reinforcement groove (33), a slot (35) is provided inside the clamping column (34), a vacuum adsorption component is mounted inside the grounded carrier plate (4), a top extrusion fixing component is evenly distributed on the top surface of the wafer carrier plate (2), a pressure plate (11) is mounted on the outer surface of the top extrusion fixing component, and the bottom surface of the pressure plate (11) is in movably contact with the top surface of the quartz ring (3).

2. The quartz composite outer ring for semiconductor etching process according to claim 1, characterized in that: The top extrusion fixing assembly comprises a limiting column (5) and a limiting groove (6), wherein the limiting column (5) is installed on the top surface of the wafer carrier plate (2), and the limiting groove (6) is opened on the inner wall of the limiting column (5).

3. The quartz composite outer ring for semiconductor etching process according to claim 2, characterized in that: An electromagnet plate (7) is installed on the inner wall of the limiting groove (6), and a connecting spring (16) is installed on the top surface of the electromagnet plate (7).

4. The quartz composite outer ring for semiconductor etching process according to claim 3, characterized in that: A magnetic base (8) is mounted on one end surface of the connecting spring (16), a telescopic column (9) is mounted on the top surface of the magnetic base (8), and the outer surface of the telescopic column (9) and the outer surface of the magnetic base (8) are both in active contact with the inner wall of the limiting groove (6).

5. The quartz composite outer ring for semiconductor etching process according to claim 4, characterized in that: A rotating column (10) is movably mounted on the inner surface of the telescopic column (9), and the outer surface of the rotating column (10) is fixedly connected to one end surface of the pressing plate (11).

6. The quartz composite outer ring for semiconductor etching process according to claim 5, characterized in that: The outer surface of the telescopic column (9) is provided with a pressure plate groove (12), the interior of the pressure plate groove (12) is in active contact with the outer surface of the pressure plate (11), and a clamping plate (17) is installed on the top surface of the pressure plate (11), and the outer surface of the clamping plate (17) is in active contact with the inner surface of the telescopic column (9).

7. The quartz composite outer ring for semiconductor etching process according to claim 1, characterized in that: The vacuum adsorption assembly comprises a hydraulic rod (14) and a piston (15), wherein the hydraulic rod (14) is mounted on the outer surface of a grounded carrier plate (4), and the piston (15) is mounted on the outer surface of an output end of the hydraulic rod (14). A sealed cavity (13) is provided inside the grounded carrier plate (4) and inside the wafer carrier plate (2), and the outer surface of the piston (15) is in active contact with the inner wall of the sealed cavity (13).

Images