Automatic wafer traction mechanism for gas cleaning machine

Abstract

The utility model relates to the technical field of wafer processing, in particular to an automatic wafer traction mechanism for a gas cleaning machine, which comprises a limiting pressing plate, a traction plate and a support, a lifting type connecting piece is arranged on one side of the outer wall of the limiting pressing plate, and a horizontal liquid rod is arranged on the other side of the lifting type connecting piece. A vertical plate is installed at one end of the outer side of the horizontal liquid rod, a traction plate is arranged on the outer side of the bottom of the vertical plate, a support is installed at the bottom of the traction plate, an external connection frame is installed on the outer side of the support, a limiting plate is installed on the other side of the external connection frame, a push plate is arranged on the outer side of the bottom of the limiting plate, and an embedded groove is formed in the inner side of the traction plate. A movable pressing rod is mounted in the embedded groove; according to the wafer traction mechanism, the problems that in the prior art, most of existing wafer traction mechanisms adopt pushing structures to push wafers to cleaning positions, but the wafers need to be pushed out again after cleaning, the whole traction process is tedious, the pushing structures cannot be synchronized, and the collision risk is increased are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to an automatic wafer pulling mechanism for a gas cleaning machine. Background Art

[0002] In electronics, chips are a way of miniaturizing circuits and are often manufactured on the surface of semiconductor wafers. During the processing of chips, gas cleaning machines, as chip production equipment, can clean the chips and ensure the cleanliness of the chip surface through gas cleaning. When the chip is moving, it is necessary to move the chip to the cleaning position of the gas cleaning machine to facilitate the cleaning operation.

[0003] Most of the existing wafer pulling mechanisms use a pushing structure to push the wafer to the cleaning position, but the wafer needs to be pushed out again after cleaning. The entire pulling process is relatively cumbersome, and the pushing structure cannot be synchronized, increasing the risk of collision.

[0004] Therefore, in view of this, the existing structure and defects are studied and improved, and an automatic wafer pulling mechanism for a gas cleaning machine is proposed, in order to achieve a more practical purpose. Utility Model Content

[0005] The utility model aims to provide a wafer automatic pulling mechanism for a gas cleaning machine to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an automatic wafer traction mechanism for a gas cleaning machine, comprising a limiting pressure plate, a traction plate and a bracket, a lifting connection piece is arranged on one side of the outer wall of the limiting pressure plate, and a horizontal liquid rod is arranged on the other side of the lifting connection piece, a vertical plate is installed on one end of the outer side of the horizontal liquid rod, a traction plate is arranged on the outer side of the bottom of the vertical plate, a bracket is installed on the bottom of the traction plate, and an external frame is installed on the outer side of the bracket, a limiting plate is installed on the other side of the external frame, and a push plate is arranged on the outer side of the bottom of the limiting plate;

[0007] An embedded groove is provided on the inner side of the traction plate, and a movable pressure rod is installed inside the embedded groove. A return spring is installed on the inner side of the embedded groove and the movable pressure rod, and a needle embedding rod is provided at the bottom of the movable pressure rod.

[0008] Furthermore, an adjusting bolt is provided at the connection between the vertical plate and the traction plate.

[0009] Furthermore, insertion rods are arranged on both sides of the bottom of the bracket, and a slide rail is arranged on the central axis of the bottom of the bracket.

[0010] Furthermore, a connecting assembly is installed on the upper surface of the bracket, and the connecting assembly includes a connecting block, a connecting rod and a connecting plate. The connecting rod is inserted into the inside of the connecting block, and connecting plates are provided at both ends of the connecting rod. An electric push rod is horizontally installed on the outer side of the connecting plate.

[0011] Furthermore, an adjustment rod is provided at the connection between the limiting plate and the external frame.

[0012] Furthermore, the raised portion of the limiting pressure plate and the position of the movable pressure rod cooperate with each other, and the limiting pressure plate can squeeze the movable pressure rod to rotate when it moves.

[0013] Furthermore, when the limiting pressure plate and the traction plate are in contact with each other, the movable pressure rod is in a vertical state.

[0014] Furthermore, the movable pressure rod is elastically connected to the traction plate via a return spring.

[0015] The utility model provides an automatic wafer pulling mechanism for a gas cleaning machine, which has the following beneficial effects:

[0016] 1. The utility model adopts a bottom slide rail structure, which is convenient for the entire traction mechanism to be accurately transferred in a horizontal position, and through a limiting structure, the traction mechanism is accurately positioned and accurately docked with the semiconductor wafer.

[0017] 2. In the utility model, the entire traction mechanism adopts an embedded needle rod at one end of the front side to realize the pulling function. The tip of the embedded needle rod is docked and inserted into the positioning hole at the frame of the semiconductor wafer. A hard push plate is adopted at one end of the rear side to push the wafer to move horizontally. When the wafer to be cleaned is processed, the embedded needle rod will pull the wafer to be cleaned to the cleaning table, and the push plate at the other end will simultaneously push the cleaned wafer out of the cleaning table. The whole process is automatic and efficient, saving extra operations and improving the traction rate.

[0018] 3. In the utility model, the needle-embedding rod is in an active rotating state, and is limited by the outer needle-embedding rod during operation, so that the needle-embedding rod is transformed from an outwardly inclined state to a vertically downward state, thereby engaging with the wafer limiting hole to achieve position positioning;

[0019] In addition, a reset spring is passed through the rear side of the needle rod, so that the reset spring can bounce the needle rod to prevent the needle rod from scratching the surface of the chip during docking, thereby causing damage to the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The disclosure of the present invention will become easier to understand with reference to the accompanying drawings. It is easy for those skilled in the art to understand that these drawings are only used to illustrate the technical solution of the present invention and are not intended to limit the scope of protection of the present invention. In the drawings:

[0021] Figure 1 It is a left-side perspective structural diagram of an automatic wafer pulling mechanism for a gas cleaning machine according to the utility model;

[0022] Figure 2 It is a right-side perspective structural diagram of an automatic wafer pulling mechanism for a gas cleaning machine according to the utility model;

[0023] Figure 3 The utility model is a bottom-up stereoscopic structural schematic diagram of a wafer automatic pulling mechanism for a gas cleaning machine.

[0024] In the figure: 1. limit pressure plate; 101. lifting connector; 2. vertical plate; 201. adjusting bolt; 3. traction plate; 301. embedded groove; 302. movable pressure rod; 303. reset spring; 304. needle rod; 4. bracket; 401. plug rod; 402. slide rail; 5. external frame; 6. connecting assembly; 601. connecting block; 602. connecting rod; 603. connecting plate; 7. limit plate; 701. adjusting rod; 702. push plate; 8. horizontal liquid rod; 9. electric push rod. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1-3 The utility model provides a technical solution: an automatic wafer traction mechanism for a gas cleaning machine, comprising a limiting pressure plate 1, a traction plate 3 and a bracket 4, a lifting connection piece 101 is arranged on one side of the outer wall of the limiting pressure plate 1, and a horizontal liquid rod 8 is arranged on the other side of the lifting connection piece 101, a vertical plate 2 is installed on one end of the outer side of the horizontal liquid rod 8, a traction plate 3 is arranged on the outer side of the bottom of the vertical plate 2, a bracket 4 is installed on the bottom of the traction plate 3, and an external frame 5 is installed on the outer side of the bracket 4, a limiting plate 7 is installed on the other side of the external frame 5, and a push plate 702 is arranged on the outer side of the bottom of the limiting plate 7;

[0027] An inner groove 301 is provided on the inner side of the traction plate 3, and a movable pressure rod 302 is installed inside the inner groove 301. A return spring 303 is installed inside the inner groove 301 and the movable pressure rod 302, and a needle rod 304 is provided at the bottom of the movable pressure rod 302.

[0028] An adjusting bolt 201 is provided at the connection between the vertical plate 2 and the traction plate 3;

[0029] Insertion rods 401 are provided on both sides of the bottom of the bracket 4, and a slide rail 402 is provided at the central axis of the bottom of the bracket 4;

[0030] A connecting assembly 6 is installed on the upper surface of the bracket 4. The connecting assembly 6 includes a connecting block 601, a connecting rod 602 and a connecting plate 603. The connecting rod 602 is inserted into the connecting block 601, and connecting plates 603 are provided at both ends of the connecting rod 602. An electric push rod 9 is horizontally installed on the outer side of the connecting plate 603.

[0031] An adjusting rod 701 is provided at the connection between the limiting plate 7 and the external frame 5;

[0032] The raised portion of the limiting pressure plate 1 and the movable pressure rod 302 are matched with each other, and when the limiting pressure plate 1 moves, it can squeeze the movable pressure rod 302 to rotate;

[0033] When the limiting pressing plate 1 and the pulling plate 3 are in contact, the movable pressing rod 302 is in a vertical state;

[0034] The movable pressure rod 302 is elastically connected to the traction plate 3 via a return spring 303;

[0035] The bottom slide rail structure is adopted, and the slide rail 402 is used to realize the horizontal movement of the entire mechanism, so as to ensure its accuracy when transferring the horizontal position. And through the limit structure, the insertion rod 401 on both sides of the slide rail 402 ensures the accurate position of the traction mechanism and the accurate docking with the semiconductor wafer.

[0036] The entire traction mechanism uses a needle rod 304 at one end of the front side to realize the pulling function. The tip of the needle rod 304 is docked and inserted into the positioning hole at the frame of the semiconductor wafer. The hard push plate 702 is used at one end of the rear side to push the wafer to move horizontally. When the wafer to be cleaned is processed, the needle rod 304 will pull the wafer to be cleaned to the cleaning table, and the push plate 702 at the other end will simultaneously push the cleaned wafer out of the cleaning table. The whole process is automatic and efficient, saving extra operations and improving the traction rate.

[0037] The needle-embedding rod 304 is in an active rotating state, and is limited by the outer needle-embedding rod 304 during operation, so that the needle-embedding rod 304 is transformed from an outwardly inclined state to a vertically downward state, thereby engaging with the wafer limiting hole to achieve position positioning;

[0038] The back side of the needle rod 304 is provided with a return spring 303, so that the return spring 303 can bounce up the needle rod 304, so as to prevent the needle rod 304 from scratching the surface of the wafer and causing damage to the wafer during docking.

[0039] The entire traction mechanism supports modular disassembly, and multiple parts are combined with each other. The distance between them can be adjusted in all directions, up, down, left, and right, making it easy to adjust according to positioning requirements.

[0040] Working principle: For this type of gas cleaning machine, the automatic wafer traction mechanism is first installed on the guide rail between the gas cleaning machine and the semiconductor wafer, and the slide rail 402 is used to ensure the accurate position of the entire automatic traction mechanism. Then, the electric push rod 9 on the connecting plate 603 is used to horizontally extend and retract the electric push rod 9 to move the front connecting plate 603 and insert the insertion rod 401 into the semiconductor material box, so that the traction plate 3 is moved to the upper position of the wafer. Then, by controlling the horizontal liquid rod 8 on the top, the horizontal liquid rod 8 on the front side is driven to gradually approach the vertical plate 2, and when approaching, the raised part at the bottom of the limiting pressure plate 1 will gradually contact with the movable pressure rod 302, and when gradually contacting, the inner movable pressure rod 302 will be squeezed, causing the movable pressure rod 302 to move. The rod 302 rotates, and when the limiting pressure plate 1 and the traction plate 3 are in contact, the entire movable pressure rod 302 reaches the maximum extrusion state. At this time, the movable pressure rod 302 is in a vertical state, and the position of the movable pressure rod 302 can be accurately grasped, which is convenient for positioning in combination with the semiconductor wafer positioning hole in the material box, and the needle rod 304 is accurately engaged with the wafer positioning hole. Then, the electric push rod 9 drives the entire mechanism to move backward, and the needle rod 304 pulls the wafer to be cleaned to the cleaning table, while the push plate 702 at the other end simultaneously pushes the cleaned wafer out of the cleaning table. The cleaned wafer will be blocked by the limiting plate 7, and after gradually moving, the wafer will be transferred to the cleaned area to synchronously complete the entire loading and unloading operations, speed up the wafer loading and unloading rates, and improve the cleaning efficiency of the wafer gas cleaning machine.

[0041] The above description is only a specific implementation method of the utility model, but the protection scope of the utility model is not limited to this. Any changes or substitutions that can be thought of by any technician familiar with the field within the technical scope disclosed by the utility model without creative work should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope defined in the claims.

Claims

1. An automatic wafer pulling mechanism for a gas cleaning machine, comprising a limiting pressure plate (1), a pulling plate (3) and a bracket (4), characterized in that: A lifting connection piece (101) is provided on one side of the outer wall of the limit pressure plate (1), and a horizontal liquid rod (8) is provided on the other side of the lifting connection piece (101); a vertical plate (2) is installed on one end of the outer side of the horizontal liquid rod (8); a traction plate (3) is provided on the outer side of the bottom of the vertical plate (2); a bracket (4) is installed on the bottom of the traction plate (3), and an external frame (5) is installed on the outer side of the bracket (4); a limit plate (7) is installed on the other side of the external frame (5), and a push plate (702) is provided on the outer side of the bottom of the limit plate (7); An inner groove (301) is provided on the inner side of the traction plate (3), and a movable pressure rod (302) is installed inside the inner groove (301). A return spring (303) is installed on the inner side of the inner groove (301) and the movable pressure rod (302), and a needle insertion rod (304) is provided at the bottom of the movable pressure rod (302).

2. The automatic wafer pulling mechanism for a gas cleaning machine according to claim 1, characterized in that: An adjusting bolt (201) is provided at the connection between the vertical plate (2) and the pulling plate (3).

3. The automatic wafer pulling mechanism for a gas cleaning machine according to claim 1, characterized in that: Insertion rods (401) are arranged on both sides of the bottom of the bracket (4), and a slide rail (402) is arranged at the central axis of the bottom of the bracket (4).

4. The automatic wafer pulling mechanism for a gas cleaning machine according to claim 1, characterized in that: A connecting assembly (6) is installed on the upper surface of the bracket (4), and the connecting assembly (6) includes a connecting block (601), a connecting rod (602) and a connecting plate (603). The connecting block (601) is inserted with a connecting rod (602), and connecting plates (603) are arranged at both ends of the connecting rod (602). An electric push rod (9) is horizontally installed on the outer side of the connecting plate (603).

5. The automatic wafer pulling mechanism for a gas cleaning machine according to claim 1, characterized in that: An adjustment rod (701) is provided at the connection between the limiting plate (7) and the external frame (5).

6. The automatic wafer pulling mechanism for a gas cleaning machine according to claim 1, characterized in that: The raised portion of the position-limiting pressure plate (1) and the movable pressure rod (302) are positioned in coordination with each other, and when the position-limiting pressure plate (1) moves, it can squeeze the movable pressure rod (302) to rotate.

7. The automatic wafer pulling mechanism for a gas cleaning machine according to claim 6, characterized in that: When the limiting pressure plate (1) and the pulling plate (3) are in contact with each other, the movable pressure rod (302) is in a vertical state.

8. The automatic wafer pulling mechanism for a gas cleaning machine according to claim 1, characterized in that: The movable pressure rod (302) is elastically connected to the traction plate (3) via a return spring (303).

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