Internal heat dissipation structure of sealed instrument

Abstract

The utility model discloses an internal heat dissipation structure of a sealed instrument. The internal heat dissipation structure comprises a shell, a soaking assembly, a first heat source assembly, a second heat source assembly and a heat dissipation fan. And a sealed cavity is arranged in the shell. The soaking assembly is arranged in the cavity and comprises a heat dissipation substrate, the heat dissipation substrate is provided with a first surface and a second surface which are oppositely arranged, and the first surface is attached to one or more shell walls of the shell. The first heat source assembly is arranged on the second surface of the heat dissipation substrate. The second heat source assembly is arranged on the second surface of the heat dissipation substrate and spaced from the first heat source assembly, and the heating value of the second heat source assembly is smaller than that of the first heat source assembly. The cooling fan is arranged in the cavity, the air outlet side of the cooling fan faces the first heat source assembly, and the air suction side of the cooling fan faces the second heat source assembly. According to the internal heat dissipation structure of the sealed instrument in the embodiment of the utility model, the layout of the heating elements in the sealed instrument is optimized, so that the heat on the shell of the sealed instrument is uniformly distributed, and the heat is prevented from being concentrated.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation of sealed instruments, and in particular relates to an internal heat dissipation structure of a sealed instrument. Background Art

[0002] Since the air inside the sealed instrument is not easy to circulate, the heat dissipation capacity has always been a technical problem that has yet to be solved by technicians in this field. For example, for traditional weighing instrument products, in order to enable them to be used in harsh environments with high temperature, high humidity and strong corrosion, the air shell needs to be made of high-quality stainless steel materials and meet high-level IP protection. Its IP protection level generally needs to reach IP64, IP65, IP66, IP67, IP68 or IP69K.

[0003] The operating systems of traditional weighing instruments are mostly embedded software and hardware systems, and the internal circuits generate less heat. In most cases, installing general or specially designed heat sinks, thermal conductive silicone or thermal conductive grease and other thermal conductive materials inside can meet the heat dissipation requirements. Alternatively, if the shell does not have extremely strict sealing requirements, ventilation holes can be opened on the shell, or a fan can be added inside to take active heat dissipation methods to blow out or conduct the internal heat out of the shell.

[0004] With the rapid development of computer technology, industrial weighing instruments have higher and higher requirements for data calculation, image processing capabilities and the use of various application software. To meet these diverse customer needs, it is necessary to continuously improve the electronic performance of weighing instruments. At present, high-end instruments are equipped with multi-core processors, touch screens, large display screens, Windows operating systems, multiple weighing platforms and other components, as well as compatibility with multiple communication protocols, a large number of DIO control points and other functions. This is a major trend.

[0005] The above configuration will cause more and more heat inside the weighing instrument, but the physical use environment on site changes little, and heat concentration areas are prone to appear on the shell surface of the weighing instrument, which cannot meet the heat dissipation requirements of sealed instruments under high-level IP protection conditions. Utility Model Content

[0006] The utility model aims to provide an internal heat dissipation structure of a sealed instrument, which optimizes the layout of heating elements inside the sealed instrument so that the heat on the sealed instrument shell is evenly distributed to prevent heat concentration.

[0007] In order to achieve the above-mentioned purpose, a specific embodiment of the utility model provides an internal heat dissipation structure of a sealed instrument, including a shell, a heat-saturating assembly, a first heat source assembly, a second heat source assembly and a heat dissipation fan. A sealed cavity is provided inside the shell. The heat-saturating assembly is arranged in the cavity, and the heat-saturating assembly includes a heat dissipation substrate, and the heat dissipation substrate has a first surface and a second surface arranged opposite to each other, and the first surface is close to one or more shell walls of the shell. The first heat source assembly is arranged on the second surface of the heat dissipation substrate. The second heat source assembly is arranged on the second surface of the heat dissipation substrate and is spaced apart from the first heat source assembly, and the heat generation of the second heat source assembly is less than that of the first heat source assembly. The heat dissipation fan is arranged in the cavity, and the air outlet side of the heat dissipation fan faces the first heat source assembly, and the air intake side thereof faces the second heat source assembly.

[0008] In one or more embodiments of the present invention, the shell includes a bottom plate, a top plate and an annular side plate, the bottom plate and the top plate are sealed to the bottom and top of the annular side plate, the heat dissipation substrate is close to the bottom plate, and the heat spreader assembly also includes one or more first heat conducting plates, the first heat conducting plate is close to the annular side plate, and one end is close to the bottom plate.

[0009] In one or more embodiments of the present invention, the heat spreader assembly further includes one or more second heat conducting plates, the second heat conducting plates are close to the first surface or the second surface of the heat dissipation substrate, and one end of the second heat conducting plates is connected to the first heat conducting plate.

[0010] In one or more embodiments of the present invention, the heat dissipation substrate is bonded to the bottom plate.

[0011] In one or more embodiments of the present invention, the first heat conducting plate is in contact with the annular side plate.

[0012] In one or more embodiments of the present invention, the second heat conducting plate is attached to the heat dissipation substrate.

[0013] In one or more embodiments of the present invention, one or more first heat-conducting layers are provided between the heat dissipation substrate and the bottom plate.

[0014] In one or more embodiments of the present invention, one or more second heat-conducting layers are provided between the heat dissipation substrate and the first heat source component.

[0015] In one or more embodiments of the present invention, one or more third heat-conducting layers are provided between the heat dissipation substrate and the second heat source assembly.

[0016] In one or more embodiments of the present invention, one or more fourth heat conducting layers are provided between the first heat conducting plate and the annular side plate.

[0017] In one or more embodiments of the present invention, one or more fifth heat conducting layers are provided between the second heat conducting plate and the heat dissipating substrate.

[0018] In one or more embodiments of the present invention, the first heat source assembly includes one or more primary heating elements and one or more secondary heating elements, and the primary heating elements and the secondary heating elements are spaced apart along a direction perpendicular to the first surface.

[0019] In one or more embodiments of the present invention, the internal heat dissipation structure of the sealed instrument also includes a third heat source component, which is sealed to the top of the annular side plate, the outer shell of the third heat source component forms a top plate, and there is a gap between the first heat source component, the second heat source component and the third heat source component.

[0020] In one or more embodiments of the present invention, the internal heat dissipation structure of the sealed instrument also includes one or more fourth heat source components, the fourth heat source component is arranged on the bottom wall of the third heat source component, and there is a gap between the first heat source component and the second heat source component and the fourth heat source component.

[0021] In one or more embodiments of the present invention, the heat dissipation substrate is a heat spreader, a copper alloy plate or an aluminum alloy plate.

[0022] In one or more embodiments of the present invention, the heat dissipation fan is disposed between the first heat source component and the second heat source component.

[0023] Compared with the prior art, the utility model optimizes the layout of heating elements inside the sealed instrument according to the calorific value, separates heating elements with large calorific value and heating elements with small calorific value, and reduces the heat transfer between the two types of heating elements.

[0024] Moreover, on the basis of the above layout, the air outlet side of the heat dissipation fan is directed toward the heat generating element with large heat generation, and the air intake side is directed toward the heat generating element with small heat generation, so that the heat dissipation fan can blow the airflow in the low-temperature area to the high-temperature area, forming a circulating airflow in the shell, carrying the heat in the shell to each shell wall of the shell, so that the heat on each shell wall of the shell is evenly distributed, preventing heat concentration, improving the heat exchange efficiency between the shell and the outside, and meeting the heat dissipation requirements of sealed instruments under high-level IP protection conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the implementation or the prior art description. Obviously, the drawings described below are only some implementations recorded in the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 This is an exploded structural diagram of the internal heat dissipation structure of the sealed instrument in one embodiment of the utility model;

[0027] Figure 2 This is a cross-sectional structural diagram of the internal heat dissipation structure of the sealed instrument in one embodiment of the utility model;

[0028] Figure 3 for Figure 2 A partial enlarged view of part A;

[0029] Figure 4 It is a partial cross-sectional view of a heat dissipation substrate and a second heat conducting plate in one embodiment of the utility model;

[0030] Figure 5 It is a planar structural diagram of a bottom plate, a heat dissipation substrate, a first heat source component and a second heat source component in one embodiment of the utility model;

[0031] Figure 6 It is a cross-sectional view of a heat dissipation substrate, a first heat conducting plate and a housing in one embodiment of the utility model;

[0032] Figure 7 It is a planar structural diagram of a heat dissipation substrate and a second heat conducting plate in one embodiment of the utility model;

[0033] Figure 8 It is a partial three-dimensional structural diagram of the heat dissipation substrate, the bottom plate and the heat insulation layer in one embodiment of the utility model.

[0034] Explanation of main figure marks: 1. Shell, 101. Bottom plate, 102. Top plate, 103. Annular side plate, 2. Heat spreader assembly, 201. Heat dissipation substrate, 2011. First surface, 2012. Second surface, 202. First heat conduction plate, 203. Second heat conduction plate, 3. First heat source assembly, 301. Main heating element, 302. Secondary heating element, 4. Second heat source assembly, 5. Cooling fan, 6. First heat conduction layer, 7. Second heat conduction layer, 8. Third heat conduction layer, 9. Fourth heat conduction layer, 10. Fifth heat conduction layer, 11. Heat insulation layer, 12. Third heat source assembly, 13. Fourth heat source assembly. DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the implementation of the present invention will be clearly and completely described below in conjunction with the drawings in the implementation of the present invention. Obviously, the described implementation is only a part of the implementation of the present invention, not all of the implementations. Based on the implementation of the present invention, all other implementations obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0036] In the description of the present invention, it is necessary to understand that the terms "top", "bottom", "up", "down", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0037] like Figures 1 to 8 As shown, the internal heat dissipation structure of the sealed instrument in one embodiment of the utility model includes a shell 1, a heat-saturating component 2, a first heat source component 3, a second heat source component 4 and a heat dissipation fan 5. A sealed cavity is provided inside the shell 1. The heat-saturating component 2 is arranged in the cavity, and the heat-saturating component 2 includes a heat dissipation substrate 201, and the heat dissipation substrate 201 has a first surface 2011 and a second surface 2012 arranged opposite to each other, and the first surface 2011 is close to one or more shell walls of the shell 1. The first heat source component 3 is arranged on the second surface 2012 of the heat dissipation substrate 201, and the second heat source component 4 is arranged on the second surface 2012 of the heat dissipation substrate 201 and is spaced from the first heat source component 3, and the heat generation of the second heat source component 4 is less than that of the first heat source component 3. The heat dissipation fan 5 is arranged in the cavity, and the air outlet side of the heat dissipation fan 5 faces the first heat source component 3, and the air intake side faces the second heat source component 4.

[0038] In the above embodiment, the layout of the heating elements inside the sealed instrument is optimized according to the heat generation, and the heating elements with high and low heat generation are separated to reduce the heat transfer between the two types of heating elements, avoid the heating elements with high heat generation transferring their own heat to the heating elements with low heat generation, and improve the overall heat dissipation efficiency of the heating elements.

[0039] Moreover, based on the above layout, the layout of the heat dissipation fan 5 is also optimized, with the air outlet side of the heat dissipation fan 5 facing the heating element with large heat generation, and the air intake side facing the heating element with small heat generation, so that the heat dissipation fan 5 can blow the airflow in the low temperature area to the high temperature area, forming a circulating airflow in the housing 1, and transferring the heat generated by the heating element to various parts of the housing 1. The heat on the housing 1 is evenly distributed, avoiding the occurrence of heat concentration areas on the housing 1, improving the heat exchange efficiency between the housing 1 and the external environment, and meeting the heat dissipation requirements of the sealed instrument under high-level IP protection conditions.

[0040] In one embodiment, the housing 1 includes a bottom plate 101, a top plate 102 and an annular side plate 103, and the bottom plate 101 and the top plate 102 are respectively sealed and connected to the bottom and top of the annular side plate 103. In order to make the temperature on the housing 1 more evenly distributed, the heat dissipation substrate 201 in this embodiment is close to the bottom plate 101, and the heat spreader assembly 2 also includes one or more first heat conducting plates 202, which are arranged close to the annular side plate 103 and one end of which is close to the bottom plate 101. The first heat conducting plate 202 is used to transfer part of the heat on the heat dissipation substrate 201 to the annular side plate 103 to prevent excessive heat concentration on the bottom plate 101 close to the heat dissipation substrate 201, so that the heat distribution on the housing 1 is more even.

[0041] Furthermore, in order to improve the heat exchange efficiency between the heat dissipation substrate 201 and the first heat conducting plate 202 , the heat spreader assembly 2 further includes one or more second heat conducting plates 203 .

[0042] Specifically, in this embodiment, the area of ​​the heat dissipation substrate 201 is almost equal to the area of ​​the bottom plate 101, each first heat conducting plate 202 is close to different parts of the annular side plate 103, the second heat conducting plate 203 is in contact with the first surface 2011 of the heat dissipation substrate 201, and one end is connected to the first heat conducting plate 202, and the cross-sectional shape of the first heat conducting plate 202 and the second heat conducting plate 203 is approximately L-shaped.

[0043] In other embodiments, the second heat conducting plate 203 may also be close to the second surface 2012 of the heat dissipation substrate 201 .

[0044] There are many ways to achieve heat conduction connection, for example, heat conduction can be achieved by direct bonding. Specifically, the heat dissipation substrate 201 is bonded to the bottom plate 101, the first heat conduction plate 202 is bonded to the annular side plate 103, and the second heat conduction plate 203 is bonded to the heat dissipation substrate 201.

[0045] In other embodiments, heat conduction can be achieved by heat conduction of heat conducting materials, specifically, as Figure 6 As shown, a first heat-conducting layer 6 is provided between the heat-dissipating substrate 201 and the bottom plate 101 , a second heat-conducting layer 7 is provided between the heat-dissipating substrate 201 and the first heat source component 3 , and a third heat-conducting layer 8 is provided between the heat-dissipating substrate 201 and the second heat source component 4 .

[0046] In other embodiments, Figure 7 As shown, a fourth heat conducting layer 9 is provided between the first heat conducting plate 202 and the annular side plate 103.

[0047] In other embodiments, Figure 8 As shown, a fifth heat conducting layer 10 is provided between the second heat conducting plate 203 and the heat dissipating substrate 201 .

[0048] The first heat-conducting layer 6 , the second heat-conducting layer 7 , the third heat-conducting layer 8 , the fourth heat-conducting layer 9 and the fifth heat-conducting layer 10 may be made of heat-conducting silica gel, heat-conducting silicone grease or other heat-conducting materials.

[0049] The number and size of the first heat conducting layer 6 , the second heat conducting layer 7 , the third heat conducting layer 8 , the fourth heat conducting layer 9 and the fifth heat conducting layer 10 can be selected according to actual heat dissipation requirements.

[0050] As an example, when multiple heat concentration areas appear between the heat dissipation substrate 201 and the first heat source component 3 and the intervals between the heat concentration areas are large, multiple second heat conductive layers 7 may be provided corresponding to each heat concentration area, while the second heat conductive layer 7 may not be required in the areas between the heat concentration areas.

[0051] As another example, when a single heat concentration area appears between the heat dissipation substrate 201 and the first heat source component 3, or when multiple heat concentration areas appear and the intervals between the heat concentration areas are small, only one second thermal conductive layer 7 may be set to cover the heat concentration area of ​​the heat dissipation substrate 201, or to cover the entire heat dissipation substrate 201.

[0052] In order to further optimize the layout of the heating elements in the housing 1, the layout of the heating elements included in the first heat source assembly 3 is optimized. Figure 2 As shown, the first heat source component 3 includes one or more main heating elements 301 and one or more secondary heating elements 302. The heat generated by the main heating element 301 is greater than that of the secondary heating element 302. The main heating element 301 and the secondary heating element 302 are spaced apart in a direction perpendicular to the heat dissipation substrate 201.

[0053] The specific distribution positions of the primary heating element 301 and the secondary heating element 302 can be set according to actual conditions.

[0054] As an example, the heat generated by the main heating element 301 is greater than the total heat generated by all the secondary heating elements 302, and the main heating element 301 can be set closer to the heat dissipation substrate 201, that is, the distance between the main heating element 301 and the heat dissipation substrate 201 is smaller than the distance between the secondary heating element 302 and the heat dissipation substrate 201.

[0055] As another example, the heat generated by the main heating element 301 is less than the total heat generated by all the secondary heating elements 302, and the secondary heating element 302 can be set farther away from the heat dissipation substrate 201, that is, the distance between the main heating element 301 and the heat dissipation substrate 201 is greater than the distance between the secondary heating element 302 and the heat dissipation substrate 201.

[0056] The gap between the main heating element 301 and the secondary heating element 302, and the gap between the secondary heating element 302 and the heat dissipation substrate 201 can also form an air duct, thereby increasing the contact area between the wind flow and the main heating element 301 and the secondary heating element 302, so that the wind flow can carry away the heat generated by the main heating element 301 and the secondary heating element 302 more quickly.

[0057] In addition, when the second heat-conducting layer 7 is disposed on the second surface 2012 of the heat-dissipating substrate 201 , the second heat-conducting layer 7 may be disposed only in the region where the heat-dissipating substrate 201 is connected to the main heating element 301 .

[0058] Furthermore, in this embodiment, a plurality of secondary heating elements 302 are provided, and the secondary heating elements 302 are spaced and layered along a direction perpendicular to the first surface 2011 , each layer is provided with one or more secondary heating elements 302 , and there is a gap between the secondary heating element 302 closest to the top plate 102 and the top plate 102 .

[0059] Wind ducts can also be formed between the upper and lower secondary heating elements 302 and between the top secondary heating elements 302 and the top plate 102, thereby increasing the contact area between the secondary heating elements 302 and the wind flow, increasing the flow range of the wind flow in the shell 1, and reducing the heat dissipation dead angle in the shell 1.

[0060] Based on the above structural design, if the second heat source component 4 also includes multiple heating elements with different heat generation, the layout of the second heat source component 4 can also be optimized. Similarly, the heating elements with high heat generation can be installed at a position relatively close to the heat dissipation substrate 201, and the heating elements with low heat generation can be installed at a position relatively far away from the heat dissipation substrate 201.

[0061] In one embodiment, if Figure 2 As shown, the internal heat dissipation structure of the sealed instrument also includes a third heat source component 12, which is sealed and connected to the top of the annular side plate 103. The outer shell of the third heat source component 12 forms a top plate 102, and there is a gap between the first heat source component 3 and the second heat source component 4 and the third heat source component 12.

[0062] The internal heat dissipation structure of the sealed instrument also includes one or more fourth heat source components 13. The fourth heat source component 13 is arranged on the bottom wall of the third heat source component 12. There is a gap between the first heat source component 3, the second heat source component 4 and the fourth heat source component 13.

[0063] The gaps between the first heat source assembly 3 and the second heat source assembly 4 and the third heat source assembly 12 and the fourth heat source assembly 13 can also form air ducts, thereby increasing the contact area between each heating element inside the sealed instrument and the wind flow, so that the wind flow can quickly carry away the heat from the heating elements.

[0064] In order to improve the heat exchange efficiency between the heat dissipation substrate 201 and the first heat source component 3 and the second heat source component 4, quickly absorb the heat generated by the first heat source component 3 and the second heat source component 4, and evenly conduct the heat to various parts of the heat dissipation substrate 201 to prevent the occurrence of heat concentration areas on the shell 1, the heat dissipation substrate 201 can be selected from a heat spreader, a copper alloy plate, an aluminum alloy plate or other substrates with high heat dissipation efficiency.

[0065] The heat spreader can adopt an existing heat spreader, which has a microstructured cavity inside, and there is coolant in the cavity. When heat is conducted from the first heat source component 3 and the second heat source component 4 to the heat spreader, the coolant in the heat spreader cavity quickly absorbs heat and vaporizes. The volume of the coolant expands rapidly and begins to flow. The gaseous coolant carries the heat to various parts of the heat spreader. When the gaseous coolant flows to an area with relatively low temperature, it condenses. The heat accumulated during evaporation is released through the condensation phenomenon, and the condensed coolant can be recycled again.

[0066] In other embodiments, the heat dissipation substrate 201 may be made of copper, aluminum, or other metals with high thermal conductivity.

[0067] like Figure 2 As shown, the heat dissipation fan 5 in this embodiment is arranged between the first heat source component 3 and the second heat source component 4.

[0068] like Figure 2 As shown, there is a gap between the first heat source assembly 3 and the second heat source assembly 4 and the annular side plate 103 to form an air duct to improve the overall heat dissipation efficiency of the sealed instrument.

[0069] The sealing instrument in the above-mentioned embodiment of the utility model can be a weighing instrument in a measuring instrument, and the sealing instrument has a display screen, which is installed on the side of the annular side plate 103 away from the bottom plate 101. The first heat source component 3 includes a CPU and other boards with high heat generation, and the second heat source component 4 includes a power supply component, wherein the heat generation of the CPU is relatively large, and its installation position can be relatively close to the heat dissipation substrate 201. The third heat source component 12 is a display screen, and the outer shell of the display screen forms the top plate 102. The fourth heat source component 13 is other types of components.

[0070] In a situation contrary to the general situation, the heat exchange efficiency between the heat dissipation substrate 201 and the first heat source component 3 and the second heat source component 4 is too fast, resulting in the first heat conducting plate 202 and the second heat conducting plate 203 being unable to transfer the heat on the heat dissipation substrate 201 to the annular side plate 103 in time, causing the temperature of the bottom plate 101 to be too high.

[0071] To solve the above problems, Figure 8As shown, a heat insulation layer 11 is provided between the heat dissipation substrate 201 and the bottom plate 101, and the heat insulation layer 11 is used to appropriately reduce the heat exchange efficiency between the heat dissipation substrate 201 and the bottom plate 101 to prevent the bottom plate 101 from being too hot. The number, size and position of the heat insulation layer 11 can be set according to the heat dissipation requirements.

[0072] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0073] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A sealed instrument internal heat dissipation structure, characterized in that: include: A housing (1) having a sealed cavity therein; A heat spreader assembly (2) is disposed in the cavity, the heat spreader assembly (2) comprising a heat dissipation substrate (201), the heat dissipation substrate (201) having a first surface (2011) and a second surface (2012) disposed opposite to each other, the first surface (2011) being close to one or more shell walls of the shell (1); A first heat source component (3) is disposed on the second surface (2012) of the heat dissipation substrate (201); a second heat source component (4), which is disposed on the second surface (2012) of the heat dissipation substrate (201) and is spaced apart from the first heat source component (3), and the heat generated by the second heat source component (4) is smaller than that of the first heat source component (3); and A heat dissipation fan (5) is disposed in the cavity, wherein the air outlet side of the heat dissipation fan (5) faces the first heat source component (3), and the air intake side of the heat dissipation fan (5) faces the second heat source component (4).

2. The internal heat dissipation structure of the sealed instrument according to claim 1, characterized in that: The shell (1) comprises a bottom plate (101), a top plate (102) and an annular side plate (103); the bottom plate (101) and the top plate (102) are sealed and connected to the bottom and top of the annular side plate (103); the heat dissipation substrate (201) is close to the bottom plate (101); the heat spreader assembly (2) further comprises one or more first heat conducting plates (202); the first heat conducting plates (202) are close to the annular side plate (103) and one end of the first heat conducting plates (202) is close to the bottom plate (101).

3. The internal heat dissipation structure of the sealed instrument according to claim 2, characterized in that: The heat spreader assembly (2) further comprises one or more second heat conducting plates (203), wherein the second heat conducting plates (203) are close to the first surface (2011) or the second surface (2012) of the heat dissipation substrate (201), and one end of the second heat conducting plates (203) is connected to the first heat conducting plate (202).

4. The internal heat dissipation structure of the sealed instrument according to claim 3, characterized in that: The heat dissipation substrate (201) is bonded to the bottom plate (101); and / or, The first heat conducting plate (202) is in contact with the annular side plate (103); and / or, The second heat conducting plate (203) is bonded to the heat dissipation substrate (201).

5. The internal heat dissipation structure of the sealed instrument according to claim 3, characterized in that: One or more first heat-conducting layers (6) are provided between the heat dissipation substrate (201) and the bottom plate (101); and / or, One or more second heat-conducting layers (7) are provided between the heat dissipation substrate (201) and the first heat source component (3); and / or, One or more third heat-conducting layers (8) are provided between the heat dissipation substrate (201) and the second heat source assembly (4); and / or, One or more fourth heat-conducting layers (9) are provided between the first heat-conducting plate (202) and the annular side plate (103); and / or, One or more fifth heat-conducting layers (10) are provided between the second heat-conducting plate (203) and the heat-dissipating substrate (201).

6. The internal heat dissipation structure of the sealed instrument according to claim 1, characterized in that: The first heat source component (3) comprises one or more main heating elements (301) and one or more secondary heating elements (302), wherein the main heating elements (301) and the secondary heating elements (302) are arranged at intervals along a direction perpendicular to the first surface (2011).

7. The internal heat dissipation structure of the sealed instrument according to claim 2, characterized in that: The internal heat dissipation structure of the sealed instrument also includes a third heat source component (12), which is sealed and connected to the top of the annular side plate (103), and the outer shell of the third heat source component (12) forms the top plate (102), and there is a gap between the first heat source component (3) and the second heat source component (4) and the third heat source component (12).

8. The internal heat dissipation structure of the sealed instrument according to claim 7, characterized in that: The internal heat dissipation structure of the sealed instrument also includes one or more fourth heat source components (13), and the fourth heat source component (13) is arranged on the bottom wall of the third heat source component (12), and there is a gap between the first heat source component (3) and the second heat source component (4) and the fourth heat source component (13).

9. The internal heat dissipation structure of a sealed instrument according to claim 1, characterized in that: The heat dissipation substrate (201) is a heat spreader, a copper alloy plate or an aluminum alloy plate.

10. The internal heat dissipation structure of a sealed instrument according to claim 1, characterized in that: The heat dissipation fan (5) is arranged between the first heat source component (3) and the second heat source component (4).

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