Sectional type attached high-conductivity strong-heat-dissipation buffer gasket for computer mainboard

Abstract

The utility model discloses a segmented attached high-conductivity strong-heat-dissipation buffer gasket for a computer mainboard. The segmented attached high-conductivity strong-heat-dissipation buffer gasket comprises a silica gel protective film, silica gel, a double-sided adhesive tape, a first single-sided copper foil adhesive tape, a first single-sided adhesive tape, a second single-sided adhesive tape, a second single-sided copper foil adhesive tape, a third single-sided copper foil adhesive tape and a release film which are sequentially arranged from top to bottom. The gasket provided by the utility model is mainly used for conducting, radiating, buffering and shielding a computer mainboard, when the gasket is used, the release film layer, the silica gel protective film and the release film are removed and then are attached, the viscosity of the silica gel protective film is stable, the surface of the silica gel cannot be damaged when the silica gel protective film is removed, the silica gel can play a relatively strong buffering role, components are more effectively protected, and the service life of the components is prolonged. The first single-sided copper foil adhesive tape, the second single-sided copper foil adhesive tape and the third single-sided copper foil adhesive tape have good conductivity, shielding effect and heat dissipation function, the first single-sided adhesive tape and the second single-sided adhesive tape are single-sided MYLAR adhesive tapes, the insulation function is good, the overall structure is simple, and practicability is high.

Description

Technical Field

[0001] The utility model belongs to the technical field of computers, and in particular relates to a segmented attached high-conductivity and strong heat dissipation buffer pad for a computer mainboard. Background Art

[0002] With the continuous development of science and technology, modern society has higher and higher requirements for computer performance. As one of the most important components in a computer, the computer motherboard is installed with the main circuit system of the computer. To a certain extent, the quality of the computer motherboard determines the overall performance, service life and function expansion capability of a computer.

[0003] As the number and types of electronic components inside computers increase, the internal structure of computers becomes more and more complex. Computers will generate a lot of heat after long-term use. In order to dissipate the heat in time, the industry mainly installs radiators to conduct heat and dissipate heat on computer motherboards. However, the efficiency needs to be improved, the functions are relatively simple, and there is still a lot of room for improvement. Utility Model Content

[0004] In order to solve the technical problems existing in the prior art, the purpose of the utility model is to provide a segmented attached high-conductivity and strong heat dissipation buffer gasket for a computer motherboard, so as to achieve the effects of high conductivity, strong heat dissipation and strong buffering.

[0005] In order to achieve the above purpose and the above technical effect, the technical solution adopted by the utility model is:

[0006] A segmented high-conductivity and high-heat dissipation buffer pad for a computer motherboard comprises a silicone protective film, silicone, double-sided adhesive tape, a first single-sided copper foil tape, a first single-sided tape, a second single-sided tape, a second single-sided copper foil tape, a third single-sided copper foil tape and a release film which are arranged in sequence from top to bottom and matched with each other.

[0007] Furthermore, the thickness of the silicone protective film is 50±2 μm, the adhesive surface faces downward, and the viscosity is 150-450g / 25mm.

[0008] Furthermore, the silicone and the double-sided tape have the same shape, the thickness of the silicone is 0.542±0.05 mm, the hardness is 70±5°, the thickness of the double-sided tape is 0.1 mm, and the silicone surface of the double-sided tape is in contact with the silicone.

[0009] Furthermore, the first single-sided copper foil tape has a viscosity of ≥4.5 N / cm, a surface impedance of <0.7 Ω / sq, and a vertical impedance of <0.1 Ω / in. 2 , glue side down.

[0010] Furthermore, the viscosity of the first single-sided tape is: ≥1224 g / in, with the adhesive surface facing downward.

[0011] Furthermore, the thickness of the second single-sided tape is 0.02-0.025 mm, the viscosity is ≥1000 g / 25 mm, and the adhesive surface faces downward.

[0012] Furthermore, the thickness of the second single-sided copper foil tape is 45±4 μm, the viscosity is ≥1000 g / in, the impedance is <0.03 ohms, the shielding efficiency is 40-70 dB, and the adhesive surface faces downward.

[0013] Furthermore, the viscosity of the third single-sided copper foil tape is: ≥1000 g / in, impedance is: <0.03 ohms, shielding efficiency is: 40-70 dB, and the adhesive surface faces downward.

[0014] Furthermore, the release force of the release film is 30±8 g / in.

[0015] Furthermore, the size of the silicone protective film is larger than that of the silicone and the double-sided tape, and the silicone protective film can completely cover the silicone and the double-sided tape. The silicone and the double-sided tape are attached to the middle of one side of the first single-sided copper foil tape, the first single-sided tape and the second single-sided tape are attached to the middle of the other side of the first single-sided copper foil tape, and the second single-sided copper foil tape and the third single-sided copper foil tape are attached to the bottom of the other side of the first single-sided copper foil tape.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] The utility model discloses a segmented attachment high-conductivity and strong heat dissipation buffer pad for a computer motherboard, which is mainly used for the conduction, heat dissipation, buffering and shielding of the computer motherboard. When in use, the suspended position of the silicone protective film is taken, the product is removed from the whole release film layer, and then the product is attached to the corresponding position of the computer motherboard, and then the silicone protective film and the release film are removed for secondary attachment, thereby realizing segmented attachment, the attachment process is simple and clear, and the operability is strong. The viscosity of the silicone protective film is stable, and the surface of the silicone will not be damaged when it is removed. The silicone can play a strong Buffering effect, more effectively protect components, the first single-sided copper foil tape, the second single-sided copper foil tape and the third single-sided copper foil tape have good conductivity, shielding effect and heat dissipation function, the first single-sided copper foil tape, the second single-sided copper foil tape, and the third single-sided copper foil tape are superimposed on each other to better enhance the heat dissipation effect and strengthen the heat dissipation efficiency. The first single-sided tape and the second single-sided tape are made of single-sided MYLAR tape with good insulation function. The gasket product has multiple properties such as high conductivity, strong heat dissipation and strong buffering. The overall structure is simple and practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0019] Figure 2It is a front view of the utility model;

[0020] Figure 3 It is an exploded view of the utility model. DETAILED DESCRIPTION

[0021] The present invention is described in detail below so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0022] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or critical elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0023] like Figure 1-3 As shown, a segmented attached high-conductivity and strong heat dissipation buffer gasket for a computer motherboard is mainly used for the conduction, heat dissipation, buffering and shielding of the computer motherboard, including a silicone protective film 1, silicone 2, double-sided tape 3, a first single-sided copper foil tape 4, a first single-sided tape 5, a second single-sided tape 6, a second single-sided copper foil tape 7, a third single-sided copper foil tape 8, and a release film 9 which are arranged in sequence from top to bottom and adapted to each other.

[0024] The model of the silicone protective film 1 is CYB38500S, blue, with blue PET (polyester film) as the base material, coated with silicone on one side, with a thickness of 50±2μm, the adhesive side facing down, and a viscosity of 150-450g / 25mm. The viscosity is stable and the surface of the silicone 2 will not be damaged when the protective film is removed.

[0025] The model of silicone 2 is YH-BK70542U, black, with a thickness of 0.542±0.05mm and a hardness of 70±5°. It can play a strong buffering role and protect components more effectively.

[0026] Double-sided tape 3 is AB double-sided tape, model SH-98510AS, transparent, 0.1mm thick, one side is silicone surface, viscosity is 1.1N / mm, the other side is acrylic adhesive surface, viscosity is 0.44N / mm, the silicone surface can be directly attached to silicone 2, and the surface of silicone 2 does not need to be brushed with treatment agent, which is convenient for operation.

[0027] The silicone protective film 1 , silicone 2 and double-sided adhesive tape 3 are all rectangular structures. The size of the silicone protective film 1 is larger than that of the silicone 2 and the double-sided adhesive tape 3 , and the silicone protective film 1 can completely cover the silicone 2 and the double-sided adhesive tape 3 .

[0028] The first single-sided copper foil tape 4 is provided with steps at opposite ends thereof, and the silica gel 2 and the double-sided tape 3 are attached to the middle of the upper surface of the first single-sided copper foil tape 4, corresponding to the positions of the steps.

[0029] The model of the first single-sided copper foil tape 4 is TESA 60238, one side is black, the other side is copper, the thickness is 0.045 mm, the viscosity is ≥4.5 N / cm, the surface impedance is <0.7 Ω / sq, and the vertical impedance is <0.1 Ω / in 2 , glue side down.

[0030] The first single-sided tape 5 and the second single-sided tape 6 are adapted to the middle part of the lower surface of the first single-sided copper foil tape 4. The first single-sided tape 5 and the second single-sided tape 6 are attached to the middle part of the lower surface of the first single-sided copper foil tape 4, corresponding to the step position. The first single-sided tape 5 cannot completely cover the lower surface of the first single-sided copper foil tape 4. The second single-sided tape 6 cannot completely cover the first single-sided tape 5. The second single-sided copper foil tape 7 and the third single-sided copper foil tape 8 are adapted to the bottom of the lower surface of the first single-sided copper foil tape 4. The second single-sided copper foil tape 7 and the third single-sided copper foil tape 8 are attached to the bottom of the lower surface of the first single-sided copper foil tape 4. The second single-sided copper foil tape 7 and the third single-sided copper foil tape 8 can completely cover the second single-sided tape 6.

[0031] The first single-sided tape 5 is a single-sided MYLAR tape with an insulating function, model SH-93005AB, black, 0.05 mm thick, viscous: ≥1224 g / in, with the adhesive side facing downward.

[0032] The second single-sided tape 6 uses single-sided MYLAR tape with insulation function, model FTBFAP-20, which is a matte black coated acrylic PET single-sided ultra-thin tape, the surface of the tape has uniform color, matte effect, no fading, high light shielding, can maintain high adhesion and no residual glue, thickness is 0.02-0.025mm, viscosity: ≥1000g / 25mm, adhesive side facing down. The second single-sided tape 6 is a rectangular structure.

[0033] The model of the second single-sided copper foil tape 7 is 3M 1060TC-45, copper color, thickness of 45±4 μm, viscosity: ≥1000 g / in, impedance: <0.03 ohms, shielding efficiency: 40-70 dB, adhesive side facing downward.

[0034] The model of the third single-sided copper foil tape 8 is 3M 1060TC-45, copper color, thickness of 0.045 mm, viscosity: ≥1000 g / in, impedance: <0.03 ohms, shielding efficiency: 40-70 dB, adhesive side facing downward.

[0035] The first single-sided copper foil tape 4, the second single-sided copper foil tape 7, and the third single-sided copper foil tape 8 have conductive properties in the XY direction and the Z direction, shielding effect, and heat dissipation function. The first single-sided copper foil tape 4, the second single-sided copper foil tape 7, and the third single-sided copper foil tape 8 are superimposed on each other to better enhance the heat dissipation function.

[0036] The first single-sided tape 5 cannot completely cover the top of the lower surface of the first single-sided copper foil tape 4, and the exposed portion is covered by the release film 9. The model of the release film 9 is 75T055B, blue, 0.075 mm thick, and the release force is 30±8 g / in.

[0037] The release film 9 adopts a local release film design, which can protect the colloid in the secondary attachment area from contamination.

[0038] Before use, stick the gasket as a whole on the whole release film layer. When using, take the suspended position of the silicone protective film 1, remove the product from the whole release film layer; stick the product to the corresponding position of the computer motherboard; then remove the silicone protective film 1; then remove the release film 9 for a second attachment, so as to complete the segmented attachment.

[0039] Example 1

[0040] like Figure 1-3 As shown, a segmented attached high-conductivity and strong heat dissipation buffer gasket for a computer motherboard is mainly used for the conduction, heat dissipation, buffering and shielding of the computer motherboard, including a silicone protective film 1, silicone 2, double-sided tape 3, a first single-sided copper foil tape 4, a first single-sided tape 5, a second single-sided tape 6, a second single-sided copper foil tape 7, a third single-sided copper foil tape 8, and a release film 9 which are arranged in sequence from top to bottom and adapted to each other.

[0041] The model of the silicone protective film 1 is CYB38500S, blue, with blue PET (polyester film) as the base material, coated with silicone on one side, with a thickness of 50μm, the adhesive side facing down, and the viscosity is 300g / 25mm. The viscosity is stable and the surface of the silicone 2 will not be damaged when the protective film is removed.

[0042] The model of silicone 2 is YH-BK70542U, black, 0.542mm thick, 70° hardness, which can play a strong buffering role and protect components more effectively.

[0043] Double-sided tape 3 is AB double-sided tape, model SH-98510AS, transparent, 0.1mm thick, one side is silicone surface, viscosity is 1.1N / mm, the other side is acrylic adhesive surface, viscosity is 0.44N / mm, the silicone surface can be directly attached to silicone 2, and the surface of silicone 2 does not need to be brushed with treatment agent, which is convenient for operation.

[0044] The silicone protective film 1 , silicone 2 and double-sided adhesive tape 3 are all rectangular structures. The size of the silicone protective film 1 is larger than that of the silicone 2 and the double-sided adhesive tape 3 , and the silicone protective film 1 can completely cover the silicone 2 and the double-sided adhesive tape 3 .

[0045] The first single-sided copper foil tape 4 is provided with steps at opposite ends thereof, and the silica gel 2 and the double-sided tape 3 are attached to the middle of the upper surface of the first single-sided copper foil tape 4, corresponding to the positions of the steps.

[0046] The model of the first single-sided copper foil tape 4 is TESA 60238, one side is black, the other side is copper, the thickness is 0.045 mm, the viscosity is ≥4.5 N / cm, the surface impedance is <0.7 Ω / sq, and the vertical impedance is <0.1 Ω / in 2 , glue side down.

[0047] The first single-sided tape 5 and the second single-sided tape 6 are adapted to the middle part of the lower surface of the first single-sided copper foil tape 4. The first single-sided tape 5 and the second single-sided tape 6 are attached to the middle part of the lower surface of the first single-sided copper foil tape 4, corresponding to the step position. The first single-sided tape 5 cannot completely cover the lower surface of the first single-sided copper foil tape 4. The second single-sided tape 6 cannot completely cover the first single-sided tape 5. The second single-sided copper foil tape 7 and the third single-sided copper foil tape 8 are adapted to the bottom of the lower surface of the first single-sided copper foil tape 4. The second single-sided copper foil tape 7 and the third single-sided copper foil tape 8 are attached to the bottom of the lower surface of the first single-sided copper foil tape 4. The second single-sided copper foil tape 7 and the third single-sided copper foil tape 8 can completely cover the second single-sided tape 6.

[0048] The first single-sided tape 5 is a single-sided MYLAR tape with an insulating function, model SH-93005AB, black, 0.05 mm thick, viscous: ≥1224 g / in, with the adhesive side facing downward.

[0049] The second single-sided tape 6 uses single-sided MYLAR tape with insulation function, model FTBFAP-20, which is a matte black coated acrylic PET single-sided ultra-thin tape, the surface of the tape has uniform color, matte effect, no fading, high light shielding, can maintain high adhesion and no residual glue, thickness is 0.02mm, viscosity: ≥1000g / 25mm, adhesive side facing down. The second single-sided tape 6 is a rectangular structure.

[0050] The model of the second single-sided copper foil tape 7 is 3M 1060TC-45, copper color, thickness of 45 μm, viscosity: ≥1000 g / in, impedance: <0.03 ohms, shielding efficiency: 40 dB, adhesive side facing downward.

[0051] The model of the third single-sided copper foil tape 8 is 3M 1060TC-45, copper color, thickness of 0.045 mm, viscosity: ≥1000 g / in, impedance: <0.03 ohms, shielding efficiency: 40 dB, adhesive side facing downward.

[0052] The first single-sided copper foil tape 4, the second single-sided copper foil tape 7, and the third single-sided copper foil tape 8 have conductive properties in the XY direction and the Z direction, shielding effect, and heat dissipation function. The first single-sided copper foil tape 4, the second single-sided copper foil tape 7, and the third single-sided copper foil tape 8 are superimposed on each other to better enhance the heat dissipation function.

[0053] The first single-sided tape 5 cannot completely cover the top of the lower surface of the first single-sided copper foil tape 4, and the exposed portion is covered by the release film 9. The model of the release film 9 is 75T055B, blue, 0.075 mm thick, and has a release force of 30 g / in.

[0054] The release film 9 adopts a local release film design, which can protect the colloid in the secondary attachment area from contamination.

[0055] Before use, stick the gasket as a whole on the whole release film layer. When using, take the suspended position of the silicone protective film 1, remove the product from the whole release film layer; stick the product to the corresponding position of the computer motherboard; then remove the silicone protective film 1; then remove the release film 9 for a second attachment, so as to complete the segmented attachment.

[0056] Parts or structures not specifically described in the present invention may adopt existing technologies or existing products and will not be described in detail here.

[0057] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A segmented high-conductivity heat dissipation buffer pad for a computer motherboard, characterized in that: It includes a silicone protective film, silicone, double-sided adhesive tape, a first single-sided copper foil tape, a first single-sided tape, a second single-sided tape, a second single-sided copper foil tape, a third single-sided copper foil tape and a release film which are arranged in sequence from top to bottom and matched with each other.

2. According to claim 1, a segmented high-conductivity and high-heat dissipation buffer pad for a computer motherboard is characterized in that: The thickness of the silicone protective film is 50±2μm, the adhesive surface faces downward, and the viscosity is 150-450g / 25mm.

3. The segmented high-conductivity and high-heat dissipation buffer gasket for a computer motherboard according to claim 1, characterized in that: The shapes of the silica gel and the double-sided tape are the same. The thickness of the silica gel is 0.542±0.05 mm, and the hardness is 70±5°. The thickness of the double-sided tape is 0.1 mm, and the silica gel surface of the double-sided tape is in contact with the silica gel.

4. The segmented high-conductivity and high-heat dissipation buffer gasket for computer motherboard according to claim 1, characterized in that: The first single-sided copper foil tape has a viscosity of ≥4.5 N / cm, a surface impedance of <0.7 Ω / sq, and a vertical impedance of <0.1 Ω / in. 2 , glue side down.

5. The segmented high-conductivity and high-heat dissipation buffer pad for a computer motherboard according to claim 1, characterized in that: The viscosity of the first single-sided tape is: ≥1224 g / in, with the adhesive surface facing downward.

6. The segmented high-conductivity and high-heat dissipation buffer gasket for computer motherboard according to claim 1, characterized in that: The second single-sided adhesive tape has a thickness of 0.02-0.025 mm, a viscosity of ≥1000 g / 25 mm, and an adhesive surface facing downward.

7. The segmented high-conductivity and high-heat dissipation buffer gasket for a computer motherboard according to claim 1, characterized in that: The second single-sided copper foil tape has a thickness of 45±4 μm, a viscosity of ≥1000 g / in, an impedance of <0.03 ohms, a shielding efficiency of 40-70 dB, and the adhesive surface faces downward.

8. The segmented high-conductivity and high-heat dissipation buffer gasket for a computer motherboard according to claim 1, characterized in that: The third single-sided copper foil tape has a viscosity of ≥1000 g / in, an impedance of <0.03 ohms, a shielding efficiency of 40-70 dB, and the adhesive surface faces downward.

9. The segmented high-conductivity and high-heat dissipation buffer gasket for a computer motherboard according to claim 1, characterized in that: The release force of the release film is 30±8 g / in.

10. The segmented high-conductivity and high-heat dissipation buffer gasket for a computer motherboard according to claim 1, characterized in that: The size of the silicone protective film is larger than that of the silicone and the double-sided tape, and the silicone protective film can completely cover the silicone and the double-sided tape. The silicone and the double-sided tape are attached to the middle of one side of the first single-sided copper foil tape, the first single-sided tape and the second single-sided tape are attached to the middle of the other side of the first single-sided copper foil tape, and the second single-sided copper foil tape and the third single-sided copper foil tape are attached to the bottom of the other side of the first single-sided copper foil tape.

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