Refrigeration mirror cabinet and heat dissipation device for semiconductor refrigeration module

Abstract

The utility model discloses a refrigeration mirror cabinet and a heat dissipation device for a semiconductor refrigeration module. The heat dissipation device comprises a refrigerant box (1) and a heat conduction pipe (2) located above the refrigerant box (1), and the two tail ends of the heat conduction pipe (2) are connected with the refrigerant box (1). The heat conduction pipe (2) comprises an inflow branch pipe (21), a conveying branch pipe (22), a heat dissipation branch pipe (23) and an outflow branch pipe (24), the outflow branch pipe (24) is located between the lower tail end of the heat dissipation branch pipe (23) and the refrigerant box (1), and the outflow branch pipe (24) is vertically arranged downwards or obliquely arranged downwards towards the refrigerant box (1), so that a refrigerant medium in the heat dissipation branch pipe (23) rapidly flows back into the refrigerant box (1). By optimizing the heat conduction pipe structure of the heat dissipation device, the refrigerant medium flows in the heat conduction pipe more smoothly, so that the heat dissipation capacity of the heat dissipation device is improved, and the refrigeration performance of the semiconductor refrigeration module is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration, in particular to a heat dissipation device for a semiconductor refrigeration module and a refrigeration mirror cabinet with the semiconductor refrigeration module. Background Art

[0002] Chinese patent CN2021224623461 discloses a heat dissipation device for a semiconductor refrigeration box, such as Figure 1 As shown, the heat dissipation device is used to provide heat dissipation function for the semiconductor refrigeration plate 91, and the heat dissipation device includes a refrigerant box 92 for storing a refrigerant, a heat pipe 93, and a heat network component 94 for providing heat exchange for the refrigerant flowing through the heat pipe 93, and the heat network component 94 is in contact with the heat pipe 93. Among them, the two ends 931 and 932 of the heat pipe 93 are connected to the refrigerant box 92, and the two ends 931 and 932 of the heat pipe 93 are both arranged horizontally. The prior art has the following shortcomings: since the two ends of the heat pipe are arranged horizontally, it is not conducive to the refrigerant in the heat pipe to flow back to the refrigerant box through the horizontal ends, resulting in the circulation of the refrigerant between the refrigerant box and the heat pipe. The flow is not smooth, which restricts the heat dissipation efficiency of the heat pipe and thus affects the refrigeration performance of the semiconductor refrigeration plate. Utility Model Content

[0003] The utility model aims to at least solve the technical problems existing in the prior art, and provides a heat dissipation device for a semiconductor refrigeration module and a refrigeration mirror cabinet with the semiconductor refrigeration module.

[0004] The utility model provides a heat dissipation device for a semiconductor refrigeration module, comprising a refrigerant box 1 and a heat conducting pipe 2 located above the refrigerant box 1, wherein both ends of the heat conducting pipe 2 are connected to the refrigerant box 1;

[0005] Among them, the heat pipe 2 includes: an inlet branch 21, which provides the refrigerant medium in the refrigerant box 1 to flow into the heat pipe 2; a delivery branch 22, which extends upward from the upper end of the inlet branch 21 to transport the refrigerant medium upward; a heat dissipation branch 23, including a multi-layer heat dissipation sub-branch 231 extending downward layer by layer from the upper end of the delivery branch 22; an outflow branch 24, which is located between the lower end of the heat dissipation branch 23 and the refrigerant box 1, and the outflow branch 24 is vertically arranged downward or inclined downward toward the refrigerant box 1, so that the refrigerant medium in the heat dissipation branch 23 can quickly flow back to the refrigerant box 1.

[0006] Preferably, the junction between two adjacent layers of heat dissipation sub-branch pipes 231 has an arc-shaped bent pipe 232 extending downward.

[0007] Preferably, the heat dissipation sub-branch pipe 231 has a downward inclination angle of 5-30° relative to the horizontal plane.

[0008] Preferably, the junction between the upper end of the inflow branch pipe 21 and the lower end of the delivery branch pipe 22 has a first arc-shaped transition pipe 221 extending upward, and the junction between the lower end of the heat dissipation branch pipe 23 and the upper end of the outflow branch pipe 24 has a second arc-shaped transition pipe 233 extending downward.

[0009] Preferably, the delivery branch pipe 22 is a straight pipe extending upward or a spiral pipe extending upward layer by layer.

[0010] Preferably, there are multiple heat dissipation branch pipes 23, and the multiple heat dissipation branch pipes 23 are arranged in parallel and at intervals.

[0011] Preferably, there are multiple delivery branch pipes 22 , which are arranged in parallel and at intervals, and the upper end of each delivery branch pipe 22 is respectively connected to the upper end of one of the heat dissipation branch pipes 23 .

[0012] Preferably, a heat dissipation net 29 is connected to the outer side of the heat dissipation branch pipe 23 .

[0013] Preferably, a fixing bracket 25 is provided on the delivery branch pipe 22 and / or the heat dissipation branch pipe 23 .

[0014] The utility model also discloses a refrigeration mirror cabinet, comprising a cabinet body 8 having a refrigeration cavity and a mirror cabinet door rotatably connected to the cabinet body 8, a semiconductor refrigeration module for providing refrigeration function to the refrigeration cavity is provided on the cabinet body 8, the semiconductor refrigeration module has the heat dissipation device, and the heat dissipation device is located at the upper end of the back side of the cabinet body 8 and is exposed.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] By optimizing the heat pipe structure of the heat dissipation device, the heat dissipation branch pipe is designed to include a multi-layer heat dissipation sub-branch pipe extending downward layer by layer from the upper end of the delivery branch pipe, and the outflow branch pipe is designed to be vertically arranged downward or inclined downward toward the refrigerant box. The multi-layer heat dissipation sub-branch pipe and the outflow branch pipe cooperate with each other to allow the refrigerant medium to flow back downward more smoothly in the heat conduction pipe and quickly flow back to the refrigerant box, thereby realizing the rapid circulation of the refrigerant medium in the heat conduction pipe, thereby improving the heat dissipation capacity of the heat dissipation device and further improving the refrigeration performance of the semiconductor refrigeration module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The present invention is a schematic diagram of the internal structure of a heat dissipation device in the prior art.

[0018] Figure 2 It is a structural schematic diagram of the heat dissipation device disclosed in this application.

[0019] Figure 3 It is a structural diagram of a refrigeration mirror cabinet. DETAILED DESCRIPTION

[0020] In order to further explain the technical means and effects adopted by the present application to achieve the predetermined purpose, the specific implementation methods, structures, features and effects of the present application are described in detail below in conjunction with the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "embodiment" does not necessarily refer to the same embodiment. In addition, specific features, structures, or characteristics in one or more embodiments may be combined in any suitable form.

[0021] The semiconductor refrigeration module includes a semiconductor refrigeration plate and a heat dissipation device. The two opposite sides of the semiconductor refrigeration plate are respectively configured as a heat dissipation surface and a cooling surface. The heat dissipation device is fixedly connected to the heat dissipation surface of the semiconductor refrigeration plate. The heat dissipation device is used to quickly dissipate the heat of the heat dissipation surface of the semiconductor refrigeration plate so that the cooling surface of the semiconductor refrigeration plate can obtain better cooling performance.

[0022] The utility model discloses a heat dissipation device for a semiconductor refrigeration module. By optimizing the heat pipe structure of the heat dissipation device, a refrigerant medium can flow more smoothly in the heat pipe, thereby improving the heat dissipation capacity of the heat dissipation device and further improving the refrigeration performance of the semiconductor refrigeration module.

[0023] Specifically, if Figure 2 As shown, a heat dissipation device for a semiconductor refrigeration module includes a refrigerant box 1 and a heat pipe 2 located above the refrigerant box 1, both ends of the heat pipe 2 are connected to the refrigerant box 1, and the refrigerant medium in the refrigerant box 1 circulates in the refrigerant box 1 and the heat pipe 2. By utilizing the characteristics of the heat pipe 2 having small thermal resistance, fast heat conduction and a large heat dissipation surface, the heat carried by the refrigerant medium is quickly dissipated to the outside through the heat pipe 2, thereby quickly dissipating the heat on the heat dissipation surface of the semiconductor refrigeration plate matched with the heat dissipation device.

[0024] The heat pipe 2 specifically includes: an inlet branch pipe 21, which provides the refrigerant medium in the refrigerant box 1 to flow into the heat pipe 2; a delivery branch pipe 22, which extends upward from the upper end of the inlet branch pipe 21 to transport the refrigerant medium upward; a heat dissipation branch pipe 23, including a multi-layer heat dissipation sub-branch pipe 231 extending downward layer by layer from the upper end of the delivery branch pipe 22; an outflow branch pipe 24, which is located between the lower end of the heat dissipation branch pipe 23 and the refrigerant box 1, and the outflow branch pipe 24 is vertically arranged downward or inclined downward toward the refrigerant box 1, so that the refrigerant medium in the heat dissipation branch pipe 23 can quickly flow back to the refrigerant box 1.

[0025] When the semiconductor refrigeration module is working, the heat generated by the heat dissipation surface of the semiconductor refrigeration plate is transferred to the refrigerant box 1, so that the refrigerant medium in the refrigerant box 1 absorbs heat and produces a phase change. Part of the refrigerant changes from liquid to gas, which increases the pressure in the refrigerant box 1, and pushes the gaseous refrigerant mixed with the liquid refrigerant in the refrigerant box 1 from the inlet branch 21 into the rear heat transfer pipe 2, and flows upward along the delivery branch 22 under the action of pressure, and then enters the heat dissipation branch 23, and continuously exchanges heat with the refrigerant by using the multi-layer heat dissipation sub-branch 231 extending downward layer by layer, so that the gaseous refrigerant gradually loses heat and changes into a liquid refrigerant. The liquid refrigerant continuously flows downward along the heat dissipation sub-branch 231, and finally quickly flows back to the refrigerant box 1 through the downward vertical or downward inclined outflow branch 24, realizing the rapid circulation of the refrigerant in the heat transfer pipe 2, thereby improving the heat dissipation performance of the heat dissipation device.

[0026] Each layer of heat dissipation sub-branch pipes 231 is tilted downward, and the junction of two adjacent layers of heat dissipation sub-branch pipes 231 has an arc bent pipe 232 extending downward, so that the refrigerant medium has less resistance and smoother reflux when flowing downward through the arc bent pipe 232.

[0027] The heat dissipation sub-branch pipe 231 has a downward inclination angle α of 5-30° relative to the horizontal plane 0-0'. A larger inclination angle α is more conducive to the coolant flowing downward in the heat dissipation sub-branch pipe 231, but considering that the height of the coolant flowing upward using the delivery branch pipe 22 is limited, the number of layers of the heat dissipation sub-branch pipe 231 will be reduced when a larger inclination angle α is used within the limited height range. The heat dissipation sub-branch pipe 231 with fewer layers has a small heat dissipation area, which is not conducive to using the heat dissipation branch pipe 23 to improve the heat dissipation efficiency of the coolant.

[0028] The junction between the upper end of the inflow branch pipe 21 and the lower end of the delivery branch pipe 22 has a first arc-shaped transition pipe 221 extending upward, and the junction between the lower end of the heat dissipation branch pipe 23 and the upper end of the outflow branch pipe 24 has a second arc-shaped transition pipe 233 extending downward. The first arc-shaped transition pipe 221 and the second arc-shaped transition pipe 233 can reduce the resistance of the coolant flow, so that the coolant flows more smoothly.

[0029] The delivery branch pipe 22 is a straight pipe extending upward or / and a spiral pipe extending upward layer by layer, and the present invention is not limited thereto.

[0030] There are multiple heat dissipation branch pipes 23, which are arranged in parallel and spaced apart. There are multiple delivery branch pipes 22, which are arranged in parallel and spaced apart, and the upper end of each delivery branch pipe 22 is connected to the upper end of one of the heat dissipation branch pipes 23.

[0031] For example Figure 2As shown, the number of the heat dissipation branch pipes 23 and the number of the delivery branch pipes 22 are both 3, and the three delivery branch pipes 22 are connected to the three heat dissipation branch pipes 23 one by one, respectively.

[0032] A heat dissipation net 29 is connected to the outer side of the heat dissipation branch pipe 23. The heat dissipation net 29 has a large heat radiation surface area, which further increases the heat dissipation surface area of ​​the heat pipe 2, thereby improving the heat dissipation performance of the heat dissipation device.

[0033] The heat dissipation net 29 is generally welded to the outer side surface of the heat dissipation branch pipe 23 using fine steel wire.

[0034] Of course, heat sinks and / or heat fans may be added to the heat dissipation net 29 to further improve the heat dissipation performance of the heat dissipation device.

[0035] Furthermore, a fixing bracket 25 is provided on the delivery branch pipe 22 and / or the heat dissipation branch pipe 23. The fixing bracket 25 can be used to fix and assemble the heat dissipation device in the application environment.

[0036] Combination Figure 3 The figure is a schematic diagram of the back side of a refrigeration mirror cabinet. The refrigeration mirror cabinet comprises a cabinet body 8 having a refrigeration cavity and a mirror cabinet door rotatably connected to the cabinet body 8. The cabinet body 8 is provided with a semiconductor refrigeration module for providing refrigeration function to the refrigeration cavity.

[0037] The semiconductor refrigeration module includes a semiconductor refrigeration sheet and the above-mentioned heat dissipation device. An assembly platform 81 is provided at the upper end of the back side of the cabinet 8, and the refrigerant box 1 is fixed on the assembly platform 81 and connected to the heating surface of the semiconductor refrigeration sheet. The cooling surface of the semiconductor refrigeration sheet is used to provide cooling for the refrigeration cavity of the cabinet 8.

[0038] The heat pipe 2 is fixed above the assembly table 81 through the refrigerant box 1, and is fixed to the back side of the cabinet 1 by using multiple fixing brackets 25. The entire heat dissipation device is exposed on the back side of the upper end of the cabinet 1 to facilitate heat exchange between the heat dissipation device and the outside world to obtain better heat dissipation performance, thereby ensuring that the semiconductor refrigeration module can improve the cooling capacity of the refrigeration chamber.

[0039] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A heat dissipation device for a semiconductor refrigeration module, comprising a refrigerant box (1) and a heat conducting pipe (2) located above the refrigerant box (1), wherein both ends of the heat conducting pipe (2) are connected to the refrigerant box (1), and characterized in that: The heat conducting pipe (2) comprises: The inflow branch pipe (21) allows the refrigerant in the refrigerant box (1) to flow into the heat transfer pipe (2); A delivery branch pipe (22) extending upward from the upper end of the inflow branch pipe (21) to deliver the refrigerant medium upward; The heat dissipation branch pipe (23) comprises a plurality of heat dissipation sub-branch pipes (231) extending downward layer by layer from the upper end of the delivery branch pipe (22); The outflow branch pipe (24) is located between the lower end of the heat dissipation branch pipe (23) and the refrigerant box (1). The outflow branch pipe (24) is vertically arranged downward or inclined downward toward the refrigerant box (1) so that the refrigerant in the heat dissipation branch pipe (23) can quickly flow back into the refrigerant box (1).

2. The heat dissipation device according to claim 1, characterized in that: The junction of two adjacent layers of heat dissipation sub-branch pipes (231) is provided with an arc-shaped bent pipe (232) extending downward.

3. The heat dissipation device according to claim 2, characterized in that: The heat dissipation sub-branch pipe (231) has a downward inclination angle of 5-30° relative to the horizontal plane.

4. The heat dissipation device according to claim 1, characterized in that: A first arc-shaped transition pipe (221) extending upward is provided at the junction between the upper end of the inflow branch pipe (21) and the lower end of the delivery branch pipe (22), and a second arc-shaped transition pipe (233) extending downward is provided at the junction between the lower end of the heat dissipation branch pipe (23) and the upper end of the outflow branch pipe (24).

5. The heat dissipation device according to claim 1, characterized in that: The delivery branch pipe (22) is a straight pipe extending upward or a spiral pipe extending upward layer by layer.

6. The heat dissipation device according to claim 1, characterized in that: There are a plurality of heat dissipation branch pipes (23), and the plurality of heat dissipation branch pipes (23) are arranged in parallel and at intervals.

7. The heat dissipation device according to claim 6, characterized in that: There are a plurality of delivery branch pipes (22), the plurality of delivery branch pipes (22) are arranged in parallel and at intervals, and the upper end of each delivery branch pipe (22) is respectively connected to the upper end of one of the heat dissipation branch pipes (23).

8. The heat dissipation device according to claim 1, characterized in that: A heat dissipation net (29) is connected to the outer side surface of the heat dissipation branch pipe (23).

9. The heat dissipation device according to claim 1, characterized in that: A fixing bracket (25) is provided on the delivery branch pipe (22) and / or the heat dissipation branch pipe (23).

10. A refrigeration mirror cabinet, comprising a cabinet body (8) having a refrigeration cavity and a mirror cabinet door rotatably connected to the cabinet body (8), wherein a semiconductor refrigeration module for providing refrigeration function to the refrigeration cavity is provided on the cabinet body (8), characterized in that: The semiconductor refrigeration module has a heat dissipation device as claimed in any one of claims 1 to 9, wherein the heat dissipation device is located at the upper end of the back side of the cabinet (8) and is exposed.

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