Fixing device for integrated circuit board production and processing
By designing a heat dissipation mechanism in the fixed device for production and processing of integrated circuit boards, and using a heat dissipation fan to pass air through the surface of the circuit board, the problem of the inability to effectively dissipate heat in the prior art is solved, and the effective cooling of the integrated circuit board and the stability of the processing process is achieved.
Patent Information
- Application Number
- CN202421257079.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-04
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2034-06-04
AI Technical Summary
The existing fixed devices for the production and processing of integrated circuit boards cannot effectively dissipate heat, resulting in the integrated circuit board being prone to failure in high temperature states.
A fixed device for the production and processing of integrated circuit boards is designed, including a heat dissipation mechanism, which includes a through-slot, a support cylinder, a heat dissipation fan, a power source and a dustproof net. The air is sucked in and passed through the surface of the circuit board through the rotation of the heat dissipation fan to achieve heat dissipation effect.
Through the use of the heat dissipation mechanism, the temperature of the integrated circuit board can be effectively reduced, prevent failures caused by high temperatures, and ensure the stability and safety of the processing process.
Smart Images

Figure CN222582672U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of integrated circuit boards, and in particular relates to a fixing device for producing and processing integrated circuit boards. Background Art
[0002] An integrated circuit board is a carrier for carrying integrated circuits. It is mainly composed of silicone, so it is generally green. The integrated circuit board adopts semiconductor manufacturing technology to make many transistors, resistors, capacitors and other components on a smaller single crystal silicon wafer, and combines the components into a complete electronic circuit according to the method of multi-layer wiring or tunnel wiring. In the entire production process of the integrated circuit board, it is necessary to install or remove the fixtures for operation in different production processes.
[0003] The publication number is CN220043778U, which discloses a fixing device for integrated circuit board production and processing, and relates to the technical field of integrated circuit board processing, including a processing table unit, a circuit board fixing device 1 is installed on the processing table unit, and a circuit board fixing device 2 is fixedly installed on the front side of the processing table unit. The utility model can fix the integrated circuit board in two limit frames by installing the circuit board fixing device 1, and can adjust the positions of the two limit frames according to the length of the integrated circuit board, so as to fix and clamp the integrated circuit board, and the applicable scope is increased, and the effect of fixing the integrated circuit board is good. A shock absorbing component is arranged at one end of the limit frame, and the impact force generated by the fixation can be weakened by the damper and the buffer spring to reduce the shock. When fixing, the impact between the limit frame and the circuit board causes the damper to be squeezed and deformed, and at the same time, the buffer spring is squeezed and deformed, and the reaction force generated by the buffer spring restores the limit frame to the previous position.
[0004] Although this technology can provide shock-absorbing force when clamping the integrated circuit board and prevent the limit frame from damaging the circuit board, the integrated circuit board is prone to excessive heat during processing, and this technology cannot dissipate the heat of the integrated circuit board, causing the integrated circuit board to easily malfunction under high temperature conditions. Utility Model Content
[0005] The purpose of the utility model is to provide a fixing device for producing and processing integrated circuit boards, which can dissipate heat for the integrated circuit boards, in view of the above-mentioned existing technical problems.
[0006] In view of this, the utility model provides a fixing device for integrated circuit board production and processing, comprising:
[0007] Support seat;
[0008] A workbench is arranged on the support base;
[0009] A fixing mechanism, arranged on a workbench, for clamping and fixing the circuit board;
[0010] A shock absorbing mechanism is arranged on the workbench, and cooperates with the fixing mechanism to enable the fixing mechanism to play a shock absorbing role when clamping the circuit board;
[0011] A heat dissipation mechanism is arranged on the workbench and is used to dissipate heat from the circuit board;
[0012] The heat dissipation mechanism comprises:
[0013] A through slot is provided on both sides of the workbench, and the through slot extends upward to pass through the workbench;
[0014] A supporting cylinder is arranged in the through groove;
[0015] The cooling fan is arranged in the supporting tube by means of bolt connection;
[0016] A power source, used to provide power and drive the cooling fan to rotate;
[0017] The dustproof net is arranged on the upper side of the through slot.
[0018] In the above technical solution, further, the fixing mechanism includes:
[0019] Brackets are arranged at the front and rear ends of the left and right sides of the workbench;
[0020] A first motor is arranged on the bracket;
[0021] A ball screw is arranged on the output shaft of the first motor;
[0022] A connecting plate, threadedly arranged on the ball screw;
[0023] The clamp is arranged between two connecting plates on the same side, and the clamp is located on the workbench.
[0024] In any of the above technical solutions, further, the shock absorbing mechanism includes:
[0025] Support plates are arranged at the front and rear ends of the left and right sides of the bottom of the workbench;
[0026] A guide cylinder is arranged on the supporting plate;
[0027] A slide rod is slidably arranged in the guide cylinder, and the slide rod is fixedly connected to the bracket;
[0028] The shock absorbing spring is arranged between the guide tube and the slide rod.
[0029] In any of the above technical solutions, further, the clamp is provided with an auxiliary mechanism for improving the stability of clamping the circuit board, and the auxiliary mechanism includes:
[0030] A limit rod is slidably arranged on the front and rear sides of the top of the clamp, and the limit rod extends downward to penetrate the clamp;
[0031] A fixed block is arranged at the upper end of the limit rod;
[0032] The return spring is sleeved on the limiting rod and arranged between the fixing block and the clamp.
[0033] In any of the above technical solutions, further, an epoxy board for insulation is provided on the top of the workbench.
[0034] In any of the above technical solutions, further, a plurality of protrusions are provided in the middle of the top of the epoxy board to increase the friction between the epoxy board and the circuit board.
[0035] In any of the above technical solutions, further, a moving mechanism is included, and the moving mechanism includes:
[0036] The support frame is arranged on the left and right sides of the bottom of the workbench;
[0037] A screw rod is rotatably arranged in the support frame;
[0038] A second motor, wherein an output shaft of the second motor is connected to the screw rod;
[0039] Slide blocks, threadedly arranged at the front and rear ends of the screw;
[0040] A rotating frame is disposed between two sliders on the same side and is rotatably connected to the sliders;
[0041] A mounting plate, arranged at the bottom of the rotating frame;
[0042] The universal wheel is arranged at the bottom of the mounting plate.
[0043] The beneficial effects of the utility model are:
[0044] 1. The power source provides power and drives the cooling fan to rotate. The air is sucked in and passes through the surface of the circuit board to dissipate the heat on its surface, thereby achieving the effect of heat dissipation to ensure the stability and safety of the processing process;
[0045] 2. The first motor drives the ball screw to rotate forward and reverse, so that the clamps on both sides are close to or away from each other, thereby fixing or loosening the circuit board. In this way, the circuit board can be fixed to ensure that its position is stable and does not move during the processing;
[0046] 3. When the circuit board is subjected to external shock or vibration, the fixture drives the fixing mechanism to slide in the guide cylinder through the slide rod, the shock absorbing spring is stretched, and the shock absorbing spring is reset accordingly. The shock absorbing spring will absorb part of the energy, thereby reducing the vibration force transmitted to the circuit board, protecting the circuit board from external interference, and improving the processing accuracy and stability;
[0047] 4. The epoxy board is used as an insulating layer on the top of the workbench. Its main function is to isolate the circuit board from direct contact with other metal parts or surfaces during processing, thereby preventing the generation or conduction of static electricity. This helps protect the circuit board from static interference or damage and ensures the stability and reliability of processing;
[0048] 5. The bumps on the top of the epoxy board increase the friction between the board and the circuit board, ensuring that it is stably fixed on the workbench, thus jointly ensuring the stability and accuracy of the processing process;
[0049] 6. The universal wheels can be easily moved to the required position to better adapt to the working environment or cooperate with other equipment, and the universal wheels can be folded and lowered. When folded, the support base is in contact with the ground, providing stable support for the device. When the universal wheels are lowered, the device can be easily moved to the place where work is required. BRIEF DESCRIPTION OF THE DRAWINGS
[0050] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;
[0051] Figure 2 It is a schematic diagram of a partial three-dimensional structure of the utility model;
[0052] Figure 3 This is a schematic diagram of the first three-dimensional structure of the heat dissipation mechanism of the utility model;
[0053] Figure 4 This is a schematic diagram of the second three-dimensional structure of the heat dissipation mechanism of the utility model;
[0054] Figure 5 It is a three-dimensional structural schematic diagram of the fixing mechanism of the utility model;
[0055] Figure 6 It is a cross-sectional view of the fixing mechanism of the utility model;
[0056] Figure 7 It is a three-dimensional structural schematic diagram of the mobile mechanism of the utility model;
[0057] The reference numerals in the figure are: 1. support seat; 2. workbench; 3. heat dissipation mechanism; 31. through groove; 32. support cylinder; 33. heat dissipation fan; 34. power source; 35. dustproof net; 4. fixing mechanism; 41. bracket; 42. first motor; 43. ball screw; 44. connecting plate; 45. clamp; 5. shock absorbing mechanism; 51. support plate; 52. guide cylinder; 53. slide bar; 54. shock absorbing spring; 6. auxiliary mechanism; 61. limit rod; 62. fixed block; 63. reset spring; 7. epoxy plate; 8. bump; 9. moving mechanism; 91. support frame; 92. screw; 93. second motor; 94. slider; 95. rotating frame; 96. mounting plate; 97. universal wheel. DETAILED DESCRIPTION
[0058] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.
[0059] In the description of the present application, it should be noted that the terms used herein are only for describing specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. For ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.
[0060] Embodiment 1:
[0061] like Figure 1-Figure 4 As shown, this embodiment provides a fixing device for integrated circuit board production and processing, including:
[0062] Support seat 1;
[0063] A workbench 2 is arranged on the support base 1;
[0064] A fixing mechanism 4 is arranged on the workbench 2 and is used to clamp and fix the circuit board;
[0065] A shock absorbing mechanism 5 is arranged on the workbench 2, and cooperates with the fixing mechanism 4 to enable the fixing mechanism 4 to play a shock absorbing role when clamping the circuit board;
[0066] A heat dissipation mechanism 3 is arranged on the workbench 2 and is used to dissipate heat from the circuit board;
[0067] The heat dissipation mechanism 3 comprises:
[0068] A through slot 31 is provided at both the front and rear sides of the workbench 2, and the through slot 31 extends upward to pass through the workbench 2;
[0069] The support tube 32 is disposed in the through groove 31;
[0070] The cooling fan 33 is arranged in the support tube 32 by bolt connection;
[0071] A power source 34, used to provide power and drive the cooling fan 33 to rotate;
[0072] The dustproof net 35 is disposed on the upper inner side of the through slot 31 .
[0073] In the present technical scheme, the support seat 1 provides the basic support of the device, and the workbench 2 is located on the support seat 1 as a platform for placing the circuit board. The fixing mechanism 4 is arranged on the workbench 2 for clamping and fixing the circuit board to ensure that it is in a stable position and does not move during the processing. The shock absorbing mechanism 5 is arranged on the workbench 2 and is used in conjunction with the fixing mechanism 4. Its function is to reduce vibration and vibration when fixing the circuit board, thereby improving the processing accuracy and stability. The heat dissipation mechanism 3 is arranged on the workbench 2 for dissipating the heat of the circuit board to prevent it from being overheated and damaged due to long-term work. The through groove 31 is located on the front and rear sides of the workbench 2 and extends upward to pass through the entire workbench 2. The support tube 32 is arranged in the through groove 31 to play a supporting role. The heat dissipation fan 33 is arranged in the support tube 32 by bolt connection. The power source 34 provides power and drives the heat dissipation fan 33 to rotate. When the heat dissipation fan 33 rotates, air is sucked in and passes through the surface of the circuit board to dissipate the heat on its surface, thereby achieving the heat dissipation effect. The dustproof net 35 is arranged on the upper side of the through groove 31 to prevent dust or other debris from entering the through groove 31, affecting the heat dissipation effect or damaging the heat dissipation device. This fixing device maintains the position of the circuit board stable through the fixing mechanism 4, the shock absorbing mechanism 5 reduces the vibration during the processing, and the heat dissipation mechanism 3 dissipates the heat of the circuit board to ensure the accuracy, stability and safety of the processing process.
[0074] Embodiment 2:
[0075] This embodiment provides a fixing device for producing and processing integrated circuit boards, which, in addition to the technical solutions of the above-mentioned embodiments, also has the following technical features.
[0076] like Figure 1 , Figure 5 and Figure 6 As shown, in this embodiment, the fixing mechanism 4 is optimized to include:
[0077] Brackets 41 are arranged at the front and rear ends of the left and right sides of the workbench 2;
[0078] A first motor 42 is disposed on the bracket 41;
[0079] The ball screw 43 is arranged on the output shaft of the first motor 42;
[0080] The connecting plate 44 is threadedly arranged on the ball screw 43;
[0081] The clamp 45 is disposed between two connecting plates 44 on the same side, and the clamp 45 is located on the workbench 2 .
[0082] In the present technical solution, when it is necessary to fix the circuit board, first place the circuit board on the workbench 2, then start the first motor 42, the output shaft of the first motor 42 drives the ball screw 43 to rotate, the ball screw 43 is threadedly connected to the connecting plate 44, so that the connecting plate 44 drives the clamp 45 to move inward, the clamps 45 on both sides approach each other, and fix the circuit board, so that the circuit board can be fixed, and then the circuit board can be processed. After the operation is completed, the first motor 42 drives the ball screw 43 to rotate in the opposite direction, so that the connecting plate 44 drives the clamp 45 to move outward, the clamps 45 on both sides move away from each other, and the circuit board is released, and then the first motor 42 is turned off, so that the circuit board can be fixed to ensure that its position is stable and does not move during the processing.
[0083] like Figure 1 , Figure 5 and Figure 6 As shown, in this embodiment, the optimized damping mechanism 5 includes:
[0084] Support plates 51 are arranged at the front and rear ends of the left and right sides of the bottom of the workbench 2;
[0085] The guide cylinder 52 is disposed on the support plate 51;
[0086] A slide bar 53 is slidably disposed in the guide cylinder 52, and the slide bar 53 is fixedly connected to the bracket 41;
[0087] The damping spring 54 is disposed between the guide tube 52 and the slide rod 53 .
[0088] In the present technical solution, the support plate 51 is arranged at the front and rear ends of the left and right sides of the bottom of the workbench 2, providing a support base for the entire shock absorbing mechanism 5. The guide cylinder 52 is arranged on the support plate 51, and plays a role in guiding and positioning the slide bar 53, ensuring the stability and accuracy of its motion trajectory. The slide bar 53 is arranged in the guide cylinder 52 in a sliding manner and is fixedly connected to the bracket 41. When the circuit board is subjected to external shock or vibration, the clamp 45 drives the fixing mechanism 4 to slide in the guide cylinder 52 through the slide bar 53, the shock absorbing spring 54 is stretched, and the shock absorbing spring 54 is reset accordingly. The shock absorbing spring 54 will absorb part of the energy, thereby reducing the vibration force transmitted to the circuit board, which helps to protect the circuit board from external interference, improve the processing accuracy and stability, and ensure its stability and accuracy during the processing.
[0089] Embodiment 3:
[0090] This embodiment provides a fixing device for producing and processing integrated circuit boards, which, in addition to the technical solutions of the above-mentioned embodiments, also has the following technical features.
[0091] like Figure 1 , Figure 5 and Figure 6 As shown, in this embodiment, the fixture 45 is optimized to be provided with an auxiliary mechanism 6 for improving the stability of clamping the circuit board, and the auxiliary mechanism 6 includes:
[0092] A limit rod 61 is slidably disposed on the front and rear sides of the top of the clamp 45, and the limit rod 61 extends downward to penetrate the clamp 45;
[0093] A fixing block 62 is arranged at the upper end of the limiting rod 61;
[0094] The return spring 63 is sleeved on the limiting rod 61 and is disposed between the fixing block 62 and the clamp 45 .
[0095] In the present technical scheme, in order to improve the stability of the clamp 45 fixing the circuit board, the user pulls the limit rod 61 to move upward along the clamp 45, the reset spring 63 is stretched, and after the limit rod 61 is moved upward to a suitable position, the first motor 42 drives the ball screw 43 to rotate, so that the clamps 45 are close to each other to fix the circuit board. At this time, the user slowly releases the limit rod 61, and under the reset action of the reset spring 63, the limit rod 61 moves downward along the clamp 45, and the limit rod 61 moves to contact with the circuit board and fix it, thereby enhancing the stability of the circuit board fixation. When the circuit board processing is completed, the user pulls the limit rod 61 to move upward, the reset spring 63 is stretched, and the limit rod 61 moves to disengage from the circuit board. The ball screw 43 is driven to rotate in the opposite direction by the first motor 42, so that the connecting plate 44 drives the clamp 45 to move outward, and the clamp 45 no longer clamps the circuit board. At this time, the user can remove the processed circuit board, thereby improving the stability of the clamp 45 fixing the circuit board and ensuring the processing accuracy.
[0096] Embodiment 4:
[0097] This embodiment provides a fixing device for producing and processing integrated circuit boards, which, in addition to the technical solutions of the above-mentioned embodiments, also has the following technical features.
[0098] like Figure 1 and Figure 7 As shown, in this embodiment, an epoxy plate 7 for insulation is provided on the top of the workbench 2 in an optimized manner.
[0099] In the present technical solution, the epoxy board 7 serves as an insulating layer on the top of the workbench 2. Its main function is to isolate the circuit board from direct contact with other metal parts or surfaces during processing, thereby preventing the generation or conduction of static electricity. This helps to protect the circuit board from static electricity interference or damage, and ensure the stability and reliability of processing.
[0100] like Figure 7 As shown, in this embodiment, it is optimized that a plurality of protrusions 8 are provided in the middle of the top of the epoxy board 7 to increase the friction between the epoxy board and the circuit board.
[0101] In the present technical solution, a plurality of protrusions 8 are provided in the middle of the top of the epoxy board 7, and their function is to increase the friction between the epoxy board and the circuit board. These protrusions 8 can increase the friction coefficient between the circuit board and the workbench 2, making the position of the circuit board on the fixing device more stable. By increasing the friction, the sliding or displacement of the circuit board during the processing can be reduced, thereby improving the processing accuracy and stability.
[0102] Embodiment 5:
[0103] This embodiment provides a fixing device for producing and processing integrated circuit boards, which, in addition to the technical solutions of the above-mentioned embodiments, also has the following technical features.
[0104] like Figure 1 and Figure 7 As shown, in this embodiment, the optimization further includes a moving mechanism 9, and the moving mechanism 9 includes:
[0105] The support frame 91 is arranged on the left and right sides of the bottom of the workbench 2;
[0106] The screw 92 is rotatably disposed in the support frame 91;
[0107] A second motor 93, the output shaft of the second motor 93 is connected to the screw rod 92;
[0108] Slide blocks 94 are threadedly disposed at the front and rear ends of the screw rod 92;
[0109] The rotating frame 95 is disposed between the two sliders 94 on the same side and is rotatably connected to the sliders 94;
[0110] A mounting plate 96, disposed at the bottom of the rotating frame 95;
[0111] Universal wheels 97 are arranged at the bottom of the mounting plate 96 .
[0112] In the present technical solution, the universal wheel 97 allows the device to move freely on a smooth surface and rotate in all directions, providing flexibility and convenience of the device. The design of the universal wheel 97 allows the entire device to be easily moved to the required position without complicated disassembly or reinstallation. This portability allows the device to be easily moved and deployed between different workplaces and laboratories to better adapt to the working environment or cooperate with other equipment. When the device is moved to the place where the operation is required, the user starts the second motor 93, and the second motor 93 drives the screw 92 to rotate. The screw 92 is threadedly connected to the slider 94, so that the two sliders 94 on the screw 92 move in opposite directions. The movement of the slider 94 causes the rotating frame 95 to rotate, and the rotating frame 95 folds during the rotation, thereby driving the universal wheel 97 to move upward and fold. The universal wheels 97 are folded up, and the support seat 1 is in contact with the ground, serving as the support of the device. When it needs to be moved, the second motor 93 drives the screw 92 to rotate in the opposite direction, so that the sliders 94 on both sides are close to each other, and drives the rotating frame 95 to rotate in the opposite direction. The rotating frame 95 rotates in the opposite direction and opens, and drives the universal wheels 97 to move downward. At this time, the support seat 1 is out of contact with the ground, and the device can be easily moved to the place where work is required through the universal wheels 97. After the work is completed, the second motor 93 is turned off, so that the entire device can be easily moved to the required position, so as to better adapt to the working environment or cooperate with other equipment, and the universal wheels 97 can be folded and put down. When folded, the support seat 1 is in contact with the ground, which provides stable support for the device. When the universal wheels 97 are put down, the device can be easily moved to the place where work is required.
[0113] The embodiments of the present application are described above in conjunction with the accompanying drawings. In the absence of conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.
Claims
1. A fixing device for integrated circuit board production and processing, characterized in that: include: Support seat (1); A workbench (2) is arranged on the support base (1); A fixing mechanism (4) is arranged on the workbench (2) and is used to clamp and fix the circuit board; A shock absorbing mechanism (5) is arranged on the workbench (2), and the shock absorbing mechanism (5) cooperates with the fixing mechanism (4) to enable the fixing mechanism (4) to play a shock absorbing role when clamping the circuit board; A heat dissipation mechanism (3) is arranged on the workbench (2) and is used to dissipate heat from the circuit board; The heat dissipation mechanism (3) comprises: A through groove (31) is provided on both sides of the front and rear of the workbench (2), and the through groove (31) extends upward to pass through the workbench (2); A support tube (32) is disposed in the through groove (31); A heat dissipation fan (33) is arranged in the support tube (32) by means of bolt connection; A power source (34) for providing power and driving the heat dissipation fan (33) to rotate; The dustproof net (35) is arranged on the upper inner side of the through slot (31).
2. A fixing device for integrated circuit board production and processing according to claim 1, characterized in that: The fixing mechanism (4) comprises: A bracket (41) is arranged at the front and rear ends of the left and right sides of the workbench (2); A first motor (42) is disposed on the bracket (41); A ball screw (43) is arranged on the output shaft of the first motor (42); A connecting plate (44) threadably disposed on the ball screw (43); A clamp (45) is arranged between the two connecting plates (44) on the same side, and the clamp (45) is located on the workbench (2).
3. A fixing device for producing and processing integrated circuit boards according to claim 2, characterized in that: The shock absorbing mechanism (5) comprises: A support plate (51) is arranged at the front and rear ends of the left and right sides of the bottom of the workbench (2); A guide cylinder (52) is arranged on the support plate (51); A slide rod (53) is slidably disposed in the guide cylinder (52), and the slide rod (53) is fixedly connected to the bracket (41); A shock absorbing spring (54) is arranged between the guide cylinder (52) and the slide rod (53).
4. A fixing device for producing and processing integrated circuit boards according to claim 3, characterized in that: The clamp (45) is provided with an auxiliary mechanism (6) for improving the stability of clamping the circuit board, and the auxiliary mechanism (6) comprises: A limiting rod (61) is slidably arranged on the front and rear sides of the top of the clamp (45), and the limiting rod (61) extends downward to pass through the clamp (45); A fixing block (62) is arranged on the upper end of the limiting rod (61); A return spring (63) is sleeved on the limiting rod (61) and is arranged between the fixing block (62) and the clamp (45).
5. The fixing device for producing and processing integrated circuit boards according to claim 1, characterized in that: An epoxy plate (7) for insulation is provided on the top of the workbench (2).
6. A fixing device for producing and processing integrated circuit boards according to claim 5, characterized in that: A plurality of protrusions (8) are provided in the middle of the top of the epoxy board (7) to increase the friction force between the epoxy board and the circuit board.
7. The fixing device for integrated circuit board production and processing according to claim 1, characterized in that: The invention also comprises a moving mechanism (9), wherein the moving mechanism (9) comprises: A support frame (91) is arranged on the left and right sides of the bottom of the workbench (2); A screw rod (92) is rotatably disposed in the support frame (91); A second motor (93), wherein an output shaft of the second motor (93) is connected to the screw rod (92); Slide blocks (94) are threadedly arranged at the front and rear ends of the screw rod (92); A rotating frame (95) is disposed between the two sliders (94) on the same side and is rotatably connected to the sliders (94); A mounting plate (96) is disposed at the bottom of the rotating frame (95); The universal wheel (97) is arranged at the bottom of the mounting plate (96).
Citation Information
Patent Citations
Fixing device for integrated circuit board production and processing
CN220043778U
Cited By
A dustproof fixing device for integrated circuit boards
CN224638269U