Rapid surface mounting device for integrated circuit board processing
By designing a fast patch device for integrated circuit board processing, the stable clamping and rapid positioning of the circuit board is achieved using movable horizontal strips and conveyor belts, the problem of circuit board damage in the prior art is solved, and the patch efficiency and equipment adaptability are improved.
Patent Information
- Application Number
- CN202420652292.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-01
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2034-04-01
AI Technical Summary
The existing patch customization device does not set up protective devices on the circuit board during use, which causes the patch mechanism to crash into the circuit board when the staff fails to program, causing damage and affecting the efficiency of proofing.
A fast patch device for integrated circuit board processing is designed to clamp the circuit board through movable horizontal strips on both sides, combining longitudinally moving conveyor belts and transversely moving moving boxes to achieve rapid positioning and stepless adjustment, and the horizontal strip spacing is controlled through the worm gear and worm mechanism to adapt to circuit boards of different sizes.
The stable clamping and rapid positioning of the circuit board is achieved, the patch efficiency is improved, and the circuit board is prevented from being damaged by stepless adjustment and protective mechanism.
Smart Images

Figure CN222582681U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of customized chip mounter equipment, and in particular relates to a fast chip mounter for processing integrated circuit boards. Background Art
[0002] Circuit board patch is also called SMT patch. SMT patch refers to the abbreviation of a series of process flows based on PCB. PCB is printed circuit board, and SMT is surface mount technology (surface mount technology). It is the most popular technology and process in the electronic assembly industry. After the design of the circuit board is completed, it needs to be customized for proofing. Only after the proofing is completed can it be mass-produced. During the proofing process, the staff needs to fix the circuit board on the customized device, and then program the patch mechanism so that the patch mechanism can stick the components on the circuit board. However, the existing patch customization device does not set a protective device for the circuit board during use. When the staff makes a programming error, the patch mechanism will hit the circuit board, and the circuit board is in a fixed state, which will cause damage to the circuit board and affect the efficiency of proofing.
[0003] For example, the prior art discloses a circuit board patch processing and customization device with good protection performance, patent announcement number (CN 214800079 U), which supports the circuit board through pressure plates at the four corners, and a spring is arranged at the bottom of the pressure plate, which can move down when the circuit board is overloaded, thereby preventing damage to the circuit board, and adjusting the position of the pressure plate through the mounting holes on the surface of the mounting plate, resulting in limitations in the adjustment of the distance of the pressure plate, and the distance between the two mounting holes is fixed, and stepless adjustment cannot be achieved, resulting in the instability of the circuit board mounting part. Utility Model Content
[0004] In view of the problems existing in the prior art, the purpose of the utility model is to provide a rapid patch device for integrated circuit board processing, which can achieve the use of horizontal bars on both sides that can move relative to each other to clamp and fix the circuit board to keep the circuit board stable during the patch process. At the same time, the longitudinally moving conveyor belt and the transversely moving mobile box cooperate to achieve express positioning and improve the patch speed.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] A rapid patch device for processing integrated circuit boards comprises a workbench, wherein side plates are symmetrically arranged on both sides of the upper surface of the workbench, and conveyor belts are installed on the sides where the two side plates are close to each other, and mounting plates are fixedly arranged on the upper surfaces of the two conveyor belts, and a slide groove is transversely provided on the surface of the mounting plate, and a double screw is transversely installed inside the slide groove through a bearing, and moving blocks are symmetrically screwed on the surface of the double screw, and the two moving blocks both penetrate the upper surface of the mounting plate, and a receiving groove is provided on the upper surface of the moving block, and a lifting bolt is vertically slidably installed above the receiving groove, and a spring is provided inside the receiving groove, and the top of the spring contacts the lower surface of the lifting bolt, and a horizontal bar is provided on the side where the two lifting bolts are close to each other, and a card slot is provided on the side where the horizontal bar is close to each other.
[0007] Furthermore, a worm gear is arranged at the center of the twin screws, and extension protrusions are symmetrically arranged on the lower surface of the mounting plate, and a worm is installed between the two extension protrusions via a bearing.
[0008] Furthermore, the worm is placed below the worm wheel, and the worm and the worm wheel are meshed with each other.
[0009] Furthermore, a hexagon socket joint is provided at the front end of the worm, and the hexagon socket joint is in contact with the front side surface of the extension protrusion.
[0010] Furthermore, a frame is provided across the tops of the two side panels, a motor is provided on one side of the frame, and a threaded rod is provided at an output end of the motor.
[0011] Furthermore, the threaded rod is transversely mounted on the inside of the frame through a bearing, a moving box is screwed on the surface of the threaded rod, and a telescopic patch mechanism is provided at the bottom of the moving box.
[0012] Compared with the prior art, the beneficial effects of the utility model are as follows: the mounting plate is fixed on the conveyor belts on both sides, and then the mounting plate can be driven to move longitudinally by the movement of the conveyor belts, and the telescopic patch mechanism can be driven to move horizontally in cooperation with the upper threaded rod, so as to achieve rapid positioning and improve patch efficiency. The distance between the two horizontal bars can be controlled by the cooperation of the worm gear and the worm inside the mounting plate to adapt to the fixing work of circuit boards of different sizes and realize stepless adjustment. When the circuit board is subjected to excessive force, it can move downward to prevent the circuit board from being damaged. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;
[0014] Figure 2 This is a schematic diagram of the three-dimensional structure of the mounting plate of the utility model;
[0015] Figure 3 This is a schematic diagram of the front view structure of the framework of the utility model;
[0016] Figure 4 It is a schematic diagram of the longitudinal sectional structure of the mounting plate of the utility model.
[0017] In the accompanying drawings, the components represented by the reference numerals are listed as follows:
[0018] 1. Workbench; 2. Side panel; 3. Conveyor belt; 4. Frame; 5. Motor; 6. Threaded rod; 7. Moving box; 8. Telescopic patch mechanism; 9. Mounting plate; 10. Slide; 11. Double screw; 12. Moving block; 13. Storage slot; 14. Spring; 15. Lifting bolt; 16. Horizontal bar; 17. Slot; 18. Worm gear; 19. Extension protrusion; 20. Worm; 21. Hexagon socket joint. DETAILED DESCRIPTION
[0019] In order to make the purpose and advantages of the utility model more clear, the utility model is specifically described in combination with the following embodiments. It should be understood that the following text is only used to describe one or several specific implementations of the utility model, and does not strictly limit the protection scope of the specific request of the utility model.
[0020] like Figure 1 , Figure 2 and Figure 4 A rapid patch device for processing an integrated circuit board is shown, comprising a workbench 1, with side plates 2 symmetrically arranged on both sides of the upper surface of the workbench 1, a conveyor belt 3 is installed on the side where the two side plates 2 are close to each other, a mounting plate 9 is fixedly arranged on the upper surface of the two conveyor belts 3, a slide groove 10 is transversely opened on the surface of the mounting plate 9, a double screw 11 is transversely installed inside the slide groove 10 through a bearing, a moving block 12 is symmetrically screwed on the surface of the double screw 11, the two moving blocks 12 both penetrate the upper surface of the mounting plate 9, a receiving groove 13 is opened on the upper surface of the moving block 12, a lifting bolt 15 is vertically slidably installed above the receiving groove 13, a spring 14 is arranged inside the receiving groove 13, the top of the spring 14 is in contact with the lower surface of the lifting bolt 15, a horizontal bar 16 is arranged on the side where the two lifting bolts 15 are close to each other, and a card slot 17 is opened on the side where the horizontal bar 16 is close to each other.
[0021] According to the above structure, the card slot 17 limits the two sides and the rear side of the circuit board, fixes the circuit board, prevents it from moving, and ensures the accuracy of the patch. The elastic force of the spring 14 makes the lifting bolt 15 be placed at the top of the stroke when it is not under force, and can move down when the pressure is too large to protect the circuit board.
[0022] like Figure 2 and Figure 4As shown, a worm wheel 18 is provided at the center of the twin screw 11, and extension protrusions 19 are symmetrically provided on the front and rear sides of the lower surface of the mounting plate 9. A worm 20 is installed between the two extension protrusions 19 through a bearing. The worm 20 is placed below the worm wheel 18, and the worm 20 and the worm wheel 18 are meshed with each other. A hexagon socket joint 21 is provided at the front end of the worm 20, and the hexagon socket joint 21 is in contact with the front side surface of the extension protrusion 19.
[0023] According to the above structure, during adjustment, the rotation of the twin screws 11 can be controlled by the cooperation between the external hexagonal wrench and the internal hexagonal joint 21, and then the distance between the two moving blocks 12 can be controlled to achieve stepless adjustment.
[0024] like Figure 1 and Figure 3 As shown, a frame 4 spans across the tops of the two side panels 2, a motor 5 is provided on one side of the frame 4, a threaded rod 6 is provided at the output end of the motor 5, the threaded rod 6 is transversely installed on the inside of the frame 4 through a bearing, a moving box 7 is screwed on the surface of the threaded rod 6, and a telescopic patch mechanism 8 is provided at the bottom of the moving box 7.
[0025] According to the above structure, the movable box 7 is controlled to move horizontally by the rotation of the threaded rod 6, and the circuit board is controlled to move longitudinally by the conveyor belt 3, so as to achieve fast and accurate positioning and improve the patch efficiency.
[0026] The working principle of the utility model is as follows: before use, the distance between the two horizontal bars 16 is adjusted according to the size of the circuit board to be processed by patch processing. At this time, the worm 20 can be controlled to rotate by the cooperation of the hexagonal head and the hexagonal socket joint 21, and then the worm gear 18 is driven to rotate by the worm 20 to drive the double screw 11 to rotate, and then the two moving blocks 12 can be controlled to approach or move away from each other to adjust the distance, and the mounting plate 9 is moved to the front end by the conveyor belts 3 on both sides, and then the circuit board is placed between the two card slots 17, and then the mounting plate 9 is controlled to move toward the direction of the frame 4, and the threaded rod 6 is controlled to rotate by the motor 5, and then the moving box 7 is controlled to move horizontally, and the patch work is realized by the telescopic patch mechanism 8. When the downward pressure of the telescopic patch mechanism 8 on the circuit board is too large, the lifting bolt 15 can be moved downward by pressing down the horizontal bar 16 to prevent damage to the circuit board. The elastic force of the spring 14 ensures that the height of the lifting bolt 15 will not change during the patch process.
[0027] The above is only a preferred embodiment of the present invention. It should be noted that, for ordinary technicians in the technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to the conventional means in the field unless otherwise specified and limited.
Claims
1. A rapid chip placement device for processing integrated circuit boards, comprising a workbench (1), characterized in that: Side plates (2) are symmetrically arranged on both sides of the upper surface of the workbench (1). Conveyor belts (3) are installed on the sides of the two side plates (2) that are close to each other. Mounting plates (9) are fixedly arranged on the upper surfaces of the two conveyor belts (3). A slide groove (10) is transversely opened on the surface of the mounting plate (9). A double screw (11) is transversely installed inside the slide groove (10) through a bearing. Moving blocks (12) are symmetrically screwed on the surface of the double screw (11). The two moving blocks (12) both penetrate the upper surface of the mounting plate (9). A receiving groove (13) is opened on the upper surface of the moving block (12). A lifting bolt (15) is vertically slidably installed above the receiving groove (13). A spring (14) is arranged inside the receiving groove (13). The top of the spring (14) contacts the lower surface of the lifting bolt (15). A horizontal bar (16) is arranged on the sides of the two lifting bolts (15) that are close to each other. A clamping groove (17) is opened on the sides of the horizontal bar (16) that are close to each other.
2. The rapid chip placement device for integrated circuit board processing according to claim 1, characterized in that: A worm wheel (18) is arranged at the center of the twin screws (11), and extension protrusions (19) are symmetrically arranged on the lower surface of the mounting plate (9) in the front and rear directions, and a worm (20) is mounted between the two extension protrusions (19) via a bearing.
3. The rapid chip placement device for integrated circuit board processing according to claim 2, characterized in that: The worm (20) is placed below the worm wheel (18), and the worm (20) and the worm wheel (18) are meshed with each other.
4. The rapid chip placement device for integrated circuit board processing according to claim 3, characterized in that: A hexagon socket joint (21) is provided at the front end of the worm (20), and the hexagon socket joint (21) is in contact with the front side surface of the extension protrusion (19).
5. The rapid chip placement device for integrated circuit board processing according to claim 1, characterized in that: A frame (4) spans across the tops of the two side panels (2); a motor (5) is provided on one side of the frame (4); and a threaded rod (6) is provided at the output end of the motor (5).
6. The rapid chip placement device for integrated circuit board processing according to claim 5, characterized in that: The threaded rod (6) is transversely mounted on the inside of the frame (4) via a bearing, a movable box (7) is screwed onto the surface of the threaded rod (6), and a telescopic patch mechanism (8) is provided at the bottom of the movable box (7).
Citation Information
Patent Citations
Circuit board patch processing customization device with good protection performance
CN214800079U
Cited By
A rapid patching device for integrated circuit board processing
CN224733910U
