Improved silicon wafer vacuum adsorption device

Abstract

The utility model discloses an improved silicon wafer vacuum adsorption device, and relates to the technical field of silicon wafer vacuum adsorption. Comprising a chassis, the top of the chassis is sleeved with a V-shaped rubber ring, a supporting ring is embedded in the top of the chassis, the bottom of the supporting ring is tightly attached to the top of the V-shaped rubber ring, and the top of the supporting ring and the top of the chassis are jointly provided with an adsorption pad. The supporting ring made of glass fiber is more stable in physical property and chemical property, has the advantages of being high in hardness and rigidity and not prone to warping and deformation in the using process, the overall plane precision of the adsorption pad is guaranteed, a silicon wafer can be stably and accurately adsorbed to the adsorption pad, the risk that the silicon wafer falls off and is broken in the machining process is reduced, and the service life of the silicon wafer is prolonged. The processing efficiency and the yield of the silicon wafer are improved, the top of the V-shaped rubber ring is tightly attached to the bottom of the supporting ring, the air tightness of base plate adsorption is guaranteed, the fluff layer can protect the surface of the silicon wafer from being scratched, and meanwhile the silicon wafer can be attached more tightly in the adsorption process.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer vacuum adsorption, in particular to an improved silicon wafer vacuum adsorption device. Background Art

[0002] During the front-end production process of silicon wafers, the saw marks caused by the cutting process often do not meet the expected use requirements for the surface flatness and surface roughness of the silicon wafers. The silicon wafers need to be polished and cleaned, including front and back polishing and edge polishing, to remove the residual micro defects and damage layers on the surface of the silicon wafers, and obtain "mirror" silicon wafers with excellent geometric accuracy and extremely low surface roughness, so that the flatness and surface roughness of the silicon wafer plane meet the use requirements. During the process of polishing the edge of the silicon wafer, the silicon wafer needs to be stably and accurately fixed on the carrier, and the edge of the silicon wafer needs to be processed using a polishing device with the assistance of a polishing liquid.

[0003] The silicon wafer adsorption structure commonly used at present is a vacuum adsorption structure including a chassis, an elastic ring, a support ring and an adsorption pad, wherein the material used for the support ring is PVC, which has the characteristics of soft texture and high elasticity. It is easy to produce warping and deformation during repeated use, and the plane accuracy is reduced and the service life is not high. During the long-term silicon wafer processing process, the PVC support ring will produce warping and deformation, which will reduce the plane accuracy of the entire adsorption carrier, resulting in uneven force on the silicon wafer adsorption, vacuum abnormality alarm, and the silicon wafer cannot be stably and accurately fixed on the carrier, affecting the silicon wafer processing accuracy and even processing fragments, increasing costs, and reducing the overall semiconductor processing yield. Utility Model Content

[0004] The utility model provides an improved silicon wafer vacuum adsorption device to solve the problems in the background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an improved silicon wafer vacuum adsorption device, comprising a chassis, a V-shaped rubber ring is arranged in a circle on the top of the chassis, a support ring is embedded in the top of the chassis, the bottom of the support ring is tightly fitted with the top of the V-shaped rubber ring, the support ring and the top of the chassis are jointly provided with an adsorption pad, and the top of the adsorption pad is provided with a silicon wafer to be processed.

[0006] Furthermore, the support ring is made of glass fiber.

[0007] Furthermore, a groove with a V-shaped cross section is formed around the top of the chassis, and the V-shaped rubber ring is sleeved inside the groove.

[0008] Furthermore, a circle of sinking grooves is provided on the top of the chassis, and the support ring is embedded in the sinking grooves.

[0009] Furthermore, the top of the support ring and the top of the chassis are at the same level.

[0010] Furthermore, a fluff layer is provided on the top of the adsorption pad.

[0011] Furthermore, the interior of the adsorption pad is provided with a plurality of circles of arc-shaped adsorption holes with diameters increasing successively from the inside to the outside.

[0012] Furthermore, negative pressure air holes are provided inside the chassis, and a circle of grooves connected to the negative pressure air holes are provided inside the chassis at equal intervals.

[0013] Furthermore, the outer diameter of the top of the V-shaped rubber ring is greater than the outer diameter of the bottom thereof.

[0014] Compared with the prior art, the utility model provides an improved silicon wafer vacuum adsorption device, which has the following beneficial effects:

[0015] The improved silicon wafer vacuum adsorption device has a support ring made of fiberglass material with more stable physical and chemical properties, and has the characteristics of high hardness and strong rigidity. It is not prone to warping and deformation during use, ensuring the overall plane accuracy of the adsorption pad, and can enable the silicon wafer to be adsorbed on the adsorption pad stably and accurately, reducing the risk of silicon wafer falling off and fragmentation during processing, and improving the processing efficiency and yield of silicon wafers. The top of the V-shaped rubber ring fits tightly with the bottom of the support ring to ensure the airtightness of the chassis adsorption, and the fluff layer can protect the surface of the silicon wafer from scratches, and can also make the silicon wafer fit more closely during the adsorption process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the utility model;

[0017] Figure 2 for Figure 1 Structural cross-section at AA in the middle;

[0018] Figure 3 This is a cross-sectional view of the V-shaped rubber ring structure of the utility model;

[0019] Figure 4 It is a structural explosion diagram of the utility model.

[0020] In the figure: 1. chassis; 11. card slot; 12. sink; 13. negative pressure air hole; 14. groove; 2. V-shaped rubber ring; 3. support ring; 4. adsorption pad; 41. arc-shaped suction hole; 5. silicon wafer. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4 The utility model discloses an improved silicon wafer vacuum adsorption device, comprising a chassis 1, a V-shaped rubber ring 2 is provided on the top of the chassis 1, a support ring 3 is embedded on the top of the chassis 1, the bottom of the support ring 3 is tightly fitted with the top of the V-shaped rubber ring 2, the support ring 3 and the top of the chassis 1 are jointly provided with an adsorption pad 4, and a silicon wafer 5 to be processed is provided on the top of the adsorption pad 4.

[0023] Specifically, a groove 11 with a V-shaped cross section is formed around the top of the chassis 1 , and the V-shaped rubber ring 2 is sleeved inside the groove 11 .

[0024] Specifically, a circle of grooves 12 is opened on the top of the chassis 1, and the support ring 3 is embedded in the inside of the groove 12. The top of the support ring 3 and the top of the chassis 1 are at the same horizontal height, so that the adsorption pad 4 is stably bonded to the chassis 1 and the support ring 3, ensuring the planar accuracy of the entire wafer device, and then ensuring the accuracy and stability of the silicon wafer 5 adsorption. At the same time, the support ring 3 can assist in replacing the adsorption pad 4, making the adsorption pad 4 more convenient and quick during the replacement process.

[0025] Specifically, a fluff layer is provided on the top of the adsorption pad 4, which can protect the surface of the silicon wafer 5 from scratches and can also make the silicon wafer 5 fit more closely during the adsorption process, avoiding the generation of gaps that cause a decrease in vacuum and unstable adsorption of the silicon wafer 5.

[0026] Specifically, the material of the support ring 3 is glass fiber. The support ring 3 made of glass fiber has higher flatness and stronger rigidity. The support ring 3 made of glass fiber has more stable physical and chemical properties and a longer service life. It is less likely to warp and deform during long-term use and replacement, so that the overall plane accuracy of the silicon wafer 5 adsorption device does not fluctuate much. During the processing of the silicon wafer 5, the silicon wafer 5 can be subjected to more uniform force, and vacuum alarms and fragments are less likely to occur. At the same time, the support ring 3 made of glass fiber has more stable physical and chemical properties and a longer service life, which is beneficial to reduce the replacement frequency of the support ring 3 and reduce the cost in production.

[0027] Specifically, the interior of the adsorption pad 4 is provided with a plurality of circles of arc-shaped suction holes 41 with increasing diameters from the inside to the outside, the interior of the chassis 1 is provided with negative pressure pores 13, and the interior of the chassis 1 is provided with a circle of grooves 14 connected to the negative pressure pores 13 at equal intervals. The number of the grooves 14 is not less than four and is used to remove water and gas. By connecting a vacuum pumping device through the negative pressure pores 13, the silicon wafer 5 can be vacuum adsorbed.

[0028] Specifically, the top outer diameter of the V-shaped rubber ring 2 is larger than the bottom outer diameter thereof. Figure 3 The top outer diameter of the V-shaped rubber ring 2 is larger and the top extends to be parallel to the sink 12, so that the top of the V-shaped rubber ring 2 fits tightly with the bottom of the support ring 3 to maintain the airtightness of the chassis 1 adsorption.

[0029] To sum up, in the improved silicon wafer vacuum adsorption device, the support ring 3 made of glass fiber material has more stable physical and chemical properties, and has the characteristics of high hardness and strong rigidity. It is not easy to warp and deform during use, which ensures the overall plane accuracy of the adsorption pad 4, and can make the silicon wafer 5 stably and accurately adsorbed on the adsorption pad 4, reducing the risk of silicon wafer 5 falling off and fragmentation during processing, and improving the processing efficiency and yield of silicon wafer 5. The top of the V-shaped rubber ring 2 fits tightly with the bottom of the support ring 3, ensuring the airtightness of the chassis 1 adsorption, and the fluff layer can protect the surface of the silicon wafer 5 from scratches, and also can make the silicon wafer 5 fit more closely during the adsorption process.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An improved silicon wafer vacuum adsorption device, comprising a base plate (1), characterized in that: A V-shaped rubber ring (2) is provided in a circle on the top of the chassis (1), a support ring (3) is embedded in the top of the chassis (1), the bottom of the support ring (3) is tightly fitted with the top of the V-shaped rubber ring (2), the support ring (3) and the top of the chassis (1) are jointly provided with an adsorption pad (4), and a silicon wafer (5) to be processed is provided on the top of the adsorption pad (4).

2. The improved silicon wafer vacuum adsorption device according to claim 1, characterized in that: The support ring (3) is made of glass fiber.

3. The improved silicon wafer vacuum adsorption device according to claim 1, characterized in that: A groove (11) with a V-shaped cross section is formed around the top of the chassis (1), and the V-shaped rubber ring (2) is sleeved inside the groove (11).

4. The improved silicon wafer vacuum adsorption device according to claim 1, characterized in that: A circle of sink grooves (12) is provided on the top of the chassis (1), and the support ring (3) is embedded in the sink groove (12).

5. The improved silicon wafer vacuum adsorption device according to claim 1, characterized in that: The top of the support ring (3) is at the same level as the top of the bottom plate (1).

6. The improved silicon wafer vacuum adsorption device according to claim 1, characterized in that: A fluff layer is provided on the top of the adsorption pad (4).

7. The improved silicon wafer vacuum adsorption device according to claim 1, characterized in that: The interior of the adsorption pad (4) is provided with a plurality of circles of arc-shaped adsorption holes (41) with diameters increasing in sequence from the inside to the outside.

8. The improved silicon wafer vacuum adsorption device according to claim 1, characterized in that: Negative pressure air holes (13) are provided inside the chassis (1).

9. The improved silicon wafer vacuum adsorption device according to claim 1, characterized in that: The interior of the chassis (1) is provided with a circle of grooves (14) at equal intervals, all of which are connected to the negative pressure air holes (13).

10. The improved silicon wafer vacuum adsorption device according to claim 1, characterized in that: The outer diameter of the top of the V-shaped rubber ring (2) is greater than the outer diameter of the bottom thereof.

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