Integrated vibration transmitter

Abstract

The utility model discloses an integrated vibration transmitter. The periphery of a transmitter assembly is wrapped by a heat shrink tube, so that a better insulation effect is realized; the height of the heat shrink tube is not lower than the height of a printed circuit board at the top of the transmitter assembly, and gaps among all parts of the transmitter assembly in the heat shrink tube are filled with silica gel, so that the problem of deformation or displacement of electronic components caused by original epoxy resin packaging can be solved, and external impact can be buffered to better protect the electronic components; meanwhile, the length, reserved below the bottom of the transmitter assembly, of the heat shrink tube is smaller than the radius of the bottom of the transmitter assembly, so that part of the central area of the bottom of the transmitter assembly cannot be completely wrapped by the heat shrink tube, and epoxy resin is filled between the area and the shell to guarantee good vibration transmission performance; and finally, epoxy resin is encapsulated between the heat shrink tube and the shell until the position near the height of the encapsulation opening on the shell, so that the integrated vibration transmitter which is high in pressure resistance, good in use performance and resistant to impact is formed.

Description

Technical Field

[0001] The utility model belongs to the technical field of mechanical vibration detection, and in particular relates to an integrated vibration transmitter. Background Art

[0002] Vibration transmitters are widely used in the vibration detection of rotating machinery and other equipment such as blowers, centrifuges, compressors, steam turbines, pumps, motors, fans, large pumps, turbochargers, etc. in the fields of electricity, steel, petrochemicals, coal mines, etc., and are the main source of information for fault diagnosis and health monitoring of related equipment. Based on the vibration detection principle and the equipment on-site installation environment, in general, vibration transmitters are required to have small size, light weight, strong and durable, high pressure resistance, high temperature resistance, impact resistance, waterproof and explosion-proof, etc., and generally adopt epoxy resin integrated packaging structure.

[0003] However, this type of structure still has many shortcomings during use, mainly including:

[0004] 1. The sensitive components inside the transmitter are isolated from the shell only by epoxy resin, and the shell is generally a metal structure. Since the epoxy resin package is brittle, it cannot completely isolate the static electricity and moisture in the air for a long time. Sometimes the sensitive components are in direct contact with the shell, so the insulation withstand voltage effect is poor. Generally, the withstand voltage of such transmitters is only about 500VAC. When used under special working conditions, the risk of the transmitter being broken down and damaged is high.

[0005] 2. The stress generated by epoxy resin during curing may cause deformation or displacement of electronic components, resulting in failure of the transmitter.

[0006] 3. Since epoxy resin is brittle and fragile, the transmitter may be dropped, vibrated, or collided during transportation, installation, and use, causing deformation or displacement of the internal electronic components of the transmitter, thereby causing the transmitter to fail. Utility Model Content

[0007] In view of the above problems, the utility model proposes an integrated vibration transmitter which has good insulation effect, good impact resistance and can realize accurate measurement.

[0008] The integrated vibration transmitter designed by the utility model includes a transmitter component encapsulated in a shell, the filler between the inner side of the shell and the transmitter component includes a first encapsulant, the transmitter component includes a fixedly connected detector and at least one printed circuit board, and a lead is arranged on at least one of the printed circuit boards; the transmitter component is wrapped with a heat shrink tube on the outside, the shell is covered with a shell on the outside, the filler between the heat shrink tube and the shell includes a first encapsulant, and the filler inside the transmitter component in the heat shrink tube includes a second encapsulant with a height not lower than the topmost printed circuit board; the bottom edge part of the transmitter component is covered with the heat shrink tube, the bottom center part is not covered by the heat shrink tube, and the bottom center part is connected to the shell through the first encapsulant. The detector is electrically connected to the printed circuit board to transmit electrical signals. The printed circuit board can have multiple layers as needed. The transmitter component is fixedly connected to the inner side of the bottom of the shell through a first encapsulant that is first poured (or dripped), and is fixedly connected to the inner side of the shell around the first encapsulant that is poured for the second time. There is no obvious boundary between the first encapsulant that is poured first and the first encapsulant that is poured for the second time in the final physical object.

[0009] Furthermore, the first encapsulant includes epoxy resin, and the second encapsulant includes silicone.

[0010] Furthermore, a support member is provided between the printed circuit boards.

[0011] Furthermore, one end of the lead is electrically connected to the printed circuit board, and the other end is located outside the housing or connected to the connector.

[0012] Furthermore, the height of the heat shrink tube is not lower than the height of the topmost printed circuit board of the transmitter assembly, and the reserved length a of the bottom of the heat shrink tube beyond the bottom of the transmitter assembly is less than the radius r of the bottom of the transmitter assembly.

[0013] Furthermore, the height of the second encapsulant filled inside the transmitter component is higher than other electronic components on the top printed circuit board except the adjustment knob of the adjustable potentiometer.

[0014] Furthermore, the height of the shell is higher than the height of the heat shrink tube.

[0015] Furthermore, the first encapsulant or the second encapsulant is filled on top of the second encapsulant filled inside the transmitter component, and the height is close to or lower than the upper end surface of the shell.

[0016] Furthermore, a red steel paper gasket is provided between the printed circuit board and the detector.

[0017] Furthermore, a red steel paper gasket is provided between the printed circuit boards.

[0018] Furthermore, a fastener is provided at the bottom end of the outer portion of the shell, and the fastener includes a fixing bolt structure for fixing the integrated vibration transmitter to the object to be measured.

[0019] Compared with the prior art, the beneficial effects of the utility model are as follows: by wrapping the transmitter assembly with a heat shrink tube and then placing it in the shell, static electricity and moisture in the working environment can be effectively prevented from entering the interior of the transmitter assembly, thereby achieving a better insulation effect and making the integrated vibration transmitter have a higher withstand voltage. The measured results show that the withstand voltage can be increased from the traditional 500V to 1500V; at the same time, a small area not covered by the heat shrink tube is left at the bottom of the component, which is conducive to the transmission of vibration between the detector and the shell, so that the detection accuracy is almost unaffected. The actual vibration detection accuracy test results of the trial product XDG2202 integrated vibration transmitter of the utility model are consistent with the accuracy of the previous traditional process YZHB type vibration transmitter; and, silicone potting is used between the components of the transmitter assembly inside the heat shrink tube, which can not only protect the components and reduce the impact of external impact on the components, but also avoid the problem of easy failure of the components caused by deformation or uneven stress release during the epoxy resin curing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is the structural diagram of the integrated vibration transmitter.

[0021] Markings in the figure:

[0022] 100. Integrated vibration transmitter; 110. Transmitter assembly; 111. Detector; 112. Printed circuit board; 113. Red steel paper gasket; 114. Support member; 115. Lead wire; 120. Heat shrink tubing; 130. First encapsulant poured in first; 140. First encapsulant poured in second time; 150. Housing; 160. Second encapsulant; 170. Fastener. DETAILED DESCRIPTION

[0023] The following is a further description of the specific implementation of the present invention in conjunction with the accompanying drawings and embodiments. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and cannot be used to limit the protection scope of the present invention. Example 1

[0024] like Figure 1As shown, an integrated vibration transmitter, the vibration transmitter 100 includes a transmitter component 110 encapsulated in a shell 150, the filler between the inner side of the shell 150 and the transmitter component 110 includes a first encapsulant, the transmitter component includes a fixedly connected detector 111 and at least one printed circuit board 112, and a lead 115 is arranged on at least one of the printed circuit boards; the transmitter component is wrapped with a heat shrink tube 120 on the outside, the shell 150 is covered on the outside of the heat shrink tube, the filler between the heat shrink tube and the shell includes a first encapsulant, and the filler inside the transmitter component in the heat shrink tube includes a second encapsulant 160 with a height not lower than the topmost printed circuit board 112; the bottom edge part of the transmitter component is covered with the heat shrink tube, and the bottom center part is not covered by the heat shrink tube, and the bottom center part is connected to the shell through the first encapsulant. After curing, the first encapsulant should ensure the fixed connection characteristics of the encapsulated object, that is, it becomes a hard material after curing, and its hardness is relatively high, and generally the Shore hardness should be greater than 80D; the second encapsulant becomes an elastic material after curing, and the stress release during the curing process is small, and generally it only needs to have relatively obvious elasticity.

[0025] In this embodiment, the first encapsulant is epoxy resin, and HT6302 epoxy resin and curing agent are mixed in a ratio of 5:1 before use. The second encapsulant is silica gel.

[0026] The transmitter assembly includes a detector 111 and several (layers) of printed circuit boards 112. The detector is a vibration sensitive element. Generally, the printed circuit board is arranged on the detector, and the two are electrically connected to transmit electrical signals. The detector 111 is fixedly connected to the housing 150 (in this embodiment, the hard connection is achieved through the epoxy resin after the bottom is cured) to achieve vibration transmission and detection. A lead 115 is installed above the topmost printed circuit board 112 to realize the input and output of power and signals externally. The transmitter assembly is fixedly connected to the bottom of the inner side of the housing 150 through the first encapsulant 130 poured (or dripped) first, and is fixedly connected to the inner side of the housing 150 through the first encapsulant 140 poured for the second time. The first encapsulant 130 poured first and the first encapsulant 140 poured for the second time have no obvious boundary in the final physical object. The transmitter assembly described in this embodiment is cylindrical in structure, with an outer diameter of 30 mm, so a heat shrink tube with an inner diameter of 35 mm (larger than the outer diameter of the transmitter assembly of 30 mm) is selected, and the cut height during assembly is 60 mm.

[0027] This embodiment is provided with two upper and lower printed circuit boards. Preferably, a support 114 is provided between the printed circuit boards. One end of the lead 115 is electrically connected to the printed circuit board, and the other end is located outside the housing, so as to facilitate electrical connection with monitoring equipment, power supply, adjustable potentiometer, etc., or to be connected with the connector when the upper cover of the finished housing is sealed. The test and calibration adjustable potentiometer of the integrated vibration transmitter described in this embodiment is externally connected through the lead wire, and the second encapsulant for the first encapsulation covers the electronic components of the topmost printed circuit board, that is, the height of the second encapsulant filled inside the transmitter assembly is higher than the electronic components on the top printed circuit board.

[0028] After the internal packaging material of the transmitter assembly is changed to silicone, the printed circuit board components are not easy to deform and are not easily affected by external impacts due to the toughness and elasticity of silicone after curing; and after the heat shrink tube is added between the transmitter assembly and the cured epoxy resin, the transmitter assembly will no longer short-circuit or contact with the shell due to unexpected circumstances, thereby ensuring and improving the voltage resistance characteristics of the vibration transmitter, which can be increased from 500V before the improvement to 1500V; a heat shrink tube folded and wrapped around the bottom of the transmitter assembly is also reserved along the circumference to ensure that the transmitter assembly will not directly contact the inside of the shell, thereby ensuring its voltage resistance characteristics, and an area is reserved in the middle of the bottom to use the first packaging agent to realize the hard connection between the detector and the shell, thereby better ensuring that the object under test transmits the vibration signal to the detector through the shell.

[0029] Preferably, the height of the heat shrink tube is not less than the height of the topmost printed circuit board of the transmitter assembly to ensure that the electronic components of the topmost printed circuit board can be covered when the second encapsulant is encapsulated, and the second encapsulant does not overflow to the outside of the heat shrink tube. The reserved length a of the bottom of the heat shrink tube beyond the bottom of the transmitter assembly is less than the radius r of the bottom of the transmitter assembly, and the reserved portion covers a portion of the edge (circumference) of the bottom of the transmitter assembly after the heat shrink tube is heated and shrunk. Generally, r / 10≤a≤4r / 5 is preferred, and a=r / 2 is taken in this embodiment. It should be noted that the length of the heat shrink tube reserved at the bottom should not be too long, otherwise it will cause the heat shrink tube 120 to have uneven thickness after folding at the bottom of the transmitter assembly 110 in actual process operation. This unevenness can easily cause the transmitter assembly 110 to be asymmetric relative to the housing 150 during assembly, thereby affecting the actual performance.

[0030] Preferably, the height of the shell is higher than the height of the heat shrink tube, and the integrated vibration transmitter after final molding only has leads, a shell and a packaging material on the upper part of the shell, such as epoxy resin.

[0031] Preferably, the first encapsulant or the second encapsulant is filled on top of the second encapsulant filled inside the transmitter assembly, and the height is close to or lower than the upper end face of the shell. The final encapsulant (filler) is generally an encapsulant with a higher hardness after curing, and the first encapsulant, the second encapsulant or other encapsulants can be used. That is, after the first encapsulation, the second encapsulant is used to cover the upper printed circuit board, and the first encapsulant is poured in for the second time. After the vibration transmitter test and calibration are completed, the first encapsulant or the second encapsulant or other curable materials can be used for the last time to completely encapsulate the transmitter assembly except the leads together with the heat shrink tube in the shell. This embodiment Figure 1 The last encapsulation shown in the figure still uses the first encapsulant epoxy resin, and there is no obvious boundary between the first encapsulant injected for the second time.

[0032] Preferably, a red steel paper gasket 113 is provided between the printed circuit board and the detector to isolate and seal them from each other and prevent impurities or foreign objects from entering.

[0033] Preferably, a red steel paper gasket 113 is provided between the printed circuit boards, and its function is the same as above.

[0034] Preferably, a fastener 170 is provided at the bottom end of the outer portion of the housing, and the fastener comprises a fixing bolt structure for fixing the integrated vibration transmitter to the object to be measured. Example 2

[0035] The difference from Example 1 is that the outer diameter of the transmitter assembly in this embodiment is 25 mm, a heat shrink tube with an inner diameter of 30 mm is selected, and the cut height during assembly is 50 mm. Example 3

[0036] The difference from Example 1 is that in this embodiment a=r / 4. Example 4

[0037] The difference from Example 1 is that the transmitter assembly described in this embodiment has only one printed circuit board. Example 5

[0038] The difference from Example 1 is that the test calibration adjustment potentiometer described in this embodiment is set on the topmost printed circuit board, the second encapsulant for the first time exposes the potentiometer adjustment knob for easy adjustment during calibration test, and the encapsulant for the last time completely covers the upper port of the shell. After the first second encapsulant is encapsulated, the calibration test of the integrated vibration transmitter is carried out according to the process. After the calibration is completed, the potentiometer resistance is calibrated and then encapsulated again with encapsulant near the upper end surface of the shell.

[0039] The basic principle of the utility model is: the utility model encapsulates the transmitter component wrapped with heat shrink tube into the shell, which can effectively prevent static electricity and moisture in the working environment from entering the inside of the transmitter component, so as to achieve better insulation effect; at the same time, an annular ring is still wrapped with heat shrink tube around the bottom of the detector, which is conducive to good insulation, and an area not covered by the heat shrink tube is left in the center. The area is fixed to the shell by epoxy resin, which is conducive to the transmission of vibration, so that the detection accuracy is not affected; and the traditional single encapsulant packaging is changed to two encapsulants with different curing properties for time and position packaging, that is, the transmitter component uses a second encapsulant (such as silicone) that is elastic after curing, which can protect the internal components and reduce the influence of external impact on the internal components. The silicone hardly generates stress when curing, and will not squeeze the internal components to cause component failure; and the traditional first encapsulant (such as epoxy resin) with high hardness after curing is still used between the heat shrink tube and the inner side of the shell, which can ensure the vibration detection performance of the transmitter. After actual testing, the improved integrated vibration transmitter has a withstand voltage of greater than or equal to 1500V in actual work, which is a huge improvement compared to the original product, and the impact resistance has been significantly improved, while the vibration detection accuracy and sensitivity are consistent with the product before the improvement.

[0040] The above is only a preferred specific implementation of the present invention, but the protection scope of the present invention is not limited thereto. For example, if the filler is changed or added, any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical solution and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An integrated vibration transmitter (100), comprising a transmitter assembly (110) encapsulated in a housing (150), wherein a filler between the inner side of the housing (150) and the transmitter assembly (110) comprises a first encapsulant, wherein the transmitter assembly (110) comprises a fixedly connected detector (111) and at least one printed circuit board (112), wherein at least one of the printed circuit boards is provided with a lead (115), wherein: The transmitter component is wrapped with a heat shrink tube (120) on the outside, and a shell (150) is sleeved on the outside of the heat shrink tube. The filler between the heat shrink tube and the shell includes a first encapsulant, and the filler inside the transmitter component includes a second encapsulant (160) whose height is not lower than the topmost printed circuit board (112). The bottom edge area of ​​the transmitter component is covered with the heat shrink tube, and the bottom center area is not covered with the heat shrink tube. The bottom center area is connected to the shell through the first encapsulant.

2. The integrated vibration transmitter according to claim 1, characterized in that: The first encapsulant includes epoxy resin, and the second encapsulant includes silicone.

3. The integrated vibration transmitter according to claim 1, characterized in that: A support member (114) is arranged between the printed circuit boards.

4. The integrated vibration transmitter according to claim 1, characterized in that: One end of the lead wire (115) is electrically connected to the printed circuit board, and the other end is located outside the housing or connected to the connector.

5. The integrated vibration transmitter according to claim 1, characterized in that: The height of the heat shrink tube (120) is not lower than the height of the topmost printed circuit board of the transmitter component, and the reserved length a of the bottom of the heat shrink tube beyond the bottom of the transmitter component is less than the radius r of the bottom of the transmitter component.

6. The integrated vibration transmitter according to claim 1, characterized in that: The height of the second encapsulant filled inside the transmitter component is higher than other electronic components on the top printed circuit board except the adjusting knob of the adjustable potentiometer.

7. The integrated vibration transmitter according to claim 1, characterized in that: The height of the housing (150) is higher than the height of the heat shrink tube (120).

8. The integrated vibration transmitter according to claim 7, characterized in that: The first encapsulant or the second encapsulant is filled on top of the second encapsulant filled inside the transmitter component, and the height is close to or lower than the upper end surface of the shell.

9. The integrated vibration transmitter according to claim 1, characterized in that: A red steel paper gasket is provided between the printed circuit board and the detector, and / or a red steel paper gasket (113) is provided between the printed circuit boards.

10. The integrated vibration transmitter according to claim 1, characterized in that: A fastener is provided at the outer bottom end of the housing (150).

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