Probe card and testing device

Abstract

The utility model discloses a probe card and a testing device, and belongs to the field of crimping testing. The probe card comprises a substrate, a fixing piece and a PCB which are sequentially arranged in the first direction. The first surface of the substrate is provided with a plurality of MEMS cantilever needles which are arranged at intervals, the MEMS cantilever needles protrude out of the substrate in the first direction, the fixing part comprises a connecting plate and a boss, the second surface of the substrate is fixed on the boss, the boss is inserted into the connecting plate and is elastically connected with the connecting plate so as to provide deflection for the MEMS cantilever needles, and the MEMS cantilever needles are arranged on the substrate in the first direction. The connecting plate is fixed on the first surface of the PCB in parallel, the PCB is provided with an avoiding hole for accommodating the boss, and the PCB is connected with the MEMS cantilever needles through the FPC. According to the probe card provided by the embodiment of the utility model, not only can a product be tested through the MEMS cantilever needle, but also the deflection of the MEMS cantilever needle can be increased, so that the requirement of unevenness of the surface of the product during crimping contact is met.

Description

Technical Field

[0001] The utility model belongs to the field of crimping test, and in particular relates to a probe card and a test device. Background Art

[0002] In semiconductors, integrated circuits, new displays and other electronic component modules, electrical properties such as crimping and conduction are tested during the manufacturing process. Probe cards are widely used as a testing tool. The principle is to crimp one end of the cantilever needle to contact the test pin of the product, and the other end is connected to the PCB board; then the signal is interacted with the signal generator to achieve power-on detection.

[0003] At present, the technology of preparing MEMS cantilever needles using MEMS technology (surface micromachining, such as deposition and lithography) has gradually matured, and the MEMS cantilever needles in the obtained probe card are high in density and large in number. However, the existing MEMS cantilever needles are small in size and have limited deflection, which often cannot meet the requirements of product surface unevenness (the flatness of the surface of the product surface test pin). Utility Model Content

[0004] In view of the above defects or improvement needs of the prior art, the utility model provides a probe card and a testing device, the purpose of which is not only to test the product through the MEMS cantilever needle, but also to increase the deflection of the MEMS cantilever needle, so as to adapt to the requirements of product surface unevenness during crimping contact.

[0005] In a first aspect, the utility model provides a probe card, the probe card comprising a substrate, a fixing member and a PCB board arranged in sequence along a first direction;

[0006] A plurality of MEMS cantilever needles are arranged at intervals on the first surface of the substrate, and the plurality of MEMS cantilever needles are arranged protruding from the substrate in a first direction. The fixing member includes a connecting plate and a boss. The second surface of the substrate is fixed on the boss. The boss is inserted into the connecting plate and elastically connected to the connecting plate to provide flexibility for the plurality of MEMS cantilever needles. The connecting plate is fixed parallel to the first surface of the PCB board. The PCB board has a avoidance hole for accommodating the boss. The PCB board and the plurality of MEMS cantilever needles are connected via an FPC.

[0007] Optionally, the fixing member further comprises a connecting frame, the inner edge and the outer edge of the connecting frame are respectively connected to the outer edge of the boss and the inner edge of the connecting plate, and the connecting frame has a plurality of staggered strip holes.

[0008] Optionally, the probe card further comprises a fixing plate, wherein the fixing plate is fixed parallel to the second surface of the PCB board, and the fixing plate has a positioning platform, and the positioning platform is inserted into the avoidance hole.

[0009] Optionally, a plurality of spaced-apart connecting bolts are inserted on the fixing plate, and the connecting bolts penetrate through the fixing plate and the PCB board and are connected to the connecting plate.

[0010] Optionally, the probe card further comprises an adjustment plate, which is parallelly attached to the second surface of the PCB board, and a plurality of interval adjustment bolts are inserted on the adjustment plate, and the plurality of adjustment bolts are arranged relative to the avoidance holes to push up the boss.

[0011] Optionally, the adjustment plate has a measuring hole, and the measuring hole is arranged opposite to the avoidance hole.

[0012] Optionally, the probe card further includes a temperature-resistant plate, and the substrate, the temperature-resistant plate and the boss are bonded together in sequence.

[0013] Optionally, the MEMS cantilever needle is a Z-shaped structure.

[0014] Optionally, the PCB board and the connecting board each have a plurality of positioning holes arranged at intervals to insert corresponding positioning pins.

[0015] In a second aspect, the utility model provides a testing device, which includes a probe card as described in the first aspect.

[0016] The above-mentioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0017] In general, compared with the prior art, the above technical solutions conceived by the utility model have the following beneficial effects:

[0018] For a probe card provided by an embodiment of the utility model, during testing, multiple test pins of a product (e.g., a chip) are crimped and contacted with the needle tips of multiple MEMS cantilever needles, and a signal generator transmits an electrical signal to a PCB board, and the electrical signal is transmitted to the product through an FPC and multiple MEMS cantilever needles, thereby realizing testing of the product. Among them, the substrate serves as a carrier of multiple MEMS cantilever needles (multiple MEMS cantilever needles are formed on the surface of the substrate through MEMS technology), and the fixing member serves to support the substrate.

[0019] Furthermore, the PCB board has a avoidance hole for accommodating the boss, the second surface of the substrate is fixed on the boss, the boss is inserted in the connecting plate, and is elastically connected to the connecting plate. At this time, the boss is elastically connected to the connecting plate, and when crimped in the first direction, the boss can be avoided by the avoidance hole to achieve displacement of the boss in the first direction, which can also drive the displacement of the substrate and multiple MEMS cantilever needles, thereby increasing the deflection of the MEMS cantilever needles, and then adapting to the requirements of product surface unevenness.

[0020] That is to say, the probe card provided by the embodiment of the utility model can not only test the product through the MEMS cantilever needle, but also increase the deflection of the MEMS cantilever needle, so as to adapt to the requirements of the unevenness of the product surface during crimping contact. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a first view of a probe card provided by an embodiment of the utility model;

[0022] Figure 2 This is a second view of a probe card provided by an embodiment of the utility model;

[0023] Figure 3 is a third view of a probe card provided by an embodiment of the utility model;

[0024] Figure 4 It is a partial enlarged view of the substrate provided in the embodiment of the utility model;

[0025] Figure 5 It is a structural schematic diagram of a fixing member provided in an embodiment of the utility model;

[0026] Figure 6 It is a structural schematic diagram of a PCB board provided by an embodiment of the utility model;

[0027] Figure 7 It is a structural schematic diagram of a fixing plate provided in an embodiment of the utility model;

[0028] Figure 8 It is a schematic diagram of the assembly of the temperature-resistant plate provided in the embodiment of the utility model.

[0029] In all the drawings, the same reference numerals represent the same technical features, specifically:

[0030] 1. Substrate; 11. MEMS cantilever needle; 2. Fixing piece; 21. Connecting plate; 211. Support plate; 22. Boss; 221. Bump; 23. Connecting frame; 231. Strip hole; 3. PCB board; 31. Avoidance hole; 4. FPC; 5. Fixing plate; 51. Positioning table; 52. Connecting bolt; 6. Adjusting plate; 61. Adjusting bolt; 62. Measuring hole; 7. Temperature-resistant plate. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model. In addition, the technical features involved in each embodiment of the utility model described below can be combined with each other as long as they do not conflict with each other.

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0034] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0036] Example:

[0037] Figure 1 This is a first view of a probe card provided by an embodiment of the utility model. Figure 2 This is a second view of a probe card provided by an embodiment of the utility model. Figure 3 This is a third view of a probe card provided by an embodiment of the utility model, combined with Figure 1-Figure 3 As shown, the probe card includes a substrate 1, a fixing member 2 and a PCB board 3 which are sequentially arranged along a first direction (Z direction, for example, a direction perpendicular to the PCB board 3).

[0038] Figure 4 is a partial enlarged view of the substrate provided in the embodiment of the utility model, such as Figure 4 As shown, a plurality of MEMS cantilever needles 11 are arranged at intervals on the first surface of the substrate 1 , and the plurality of MEMS cantilever needles 11 are arranged to protrude from the substrate 1 in a first direction.

[0039] Figure 5 Schematic diagram of the structure of the fixing member provided by the embodiment of the utility model. Figure 5 As shown, the fixing member 2 includes a connecting plate 21 and a boss 22. The second surface of the substrate 1 is fixed on the boss 22. The boss 22 is inserted into the connecting plate 21 and elastically connected to the connecting plate 21 to provide deflection for multiple MEMS cantilever needles 11. The connecting plate 21 is fixed in parallel to the first surface of the PCB board 3.

[0040] Figure 6 Schematic diagram of the structure of the PCB board provided by the embodiment of the utility model, such as Figure 6 As shown, the PCB board 3 has a avoidance hole 31 for accommodating the boss 22, and the PCB board 3 and the plurality of MEMS cantilever needles 11 are connected via an FPC 4 (connector).

[0041] For a probe card provided by an embodiment of the utility model, during testing, multiple test pins of a product (e.g., a chip) are crimped and contacted with the needle tips of multiple MEMS cantilever needles 11, and a signal generator transmits an electrical signal to a PCB board 3, and the electrical signal is transmitted to the product through an FPC 4 and multiple MEMS cantilever needles 11, thereby achieving testing of the product. Among them, the substrate 1 serves as a carrier of multiple MEMS cantilever needles 11 (multiple MEMS cantilever needles 11 are formed on the surface of the substrate 1 through MEMS technology), and the fixing member 2 serves to support the substrate 1.

[0042] Furthermore, the PCB board 3 has a avoidance hole 31 for accommodating the boss 22, the second surface of the substrate 1 is fixed on the boss 22, the boss 22 is inserted into the connecting plate 21, and is elastically connected to the connecting plate 21. At this time, the boss 22 is elastically connected to the connecting plate 21, and can be accommodated and avoided by the avoidance hole 31 when crimping contact in the first direction, so as to realize the displacement of the boss 22 in the first direction, and can also drive the displacement of the substrate 1 and multiple MEMS cantilever needles 11, thereby increasing the deflection of the MEMS cantilever needles 11, and then adapting to the requirements of product surface unevenness.

[0043] That is to say, the probe card provided by the embodiment of the utility model can not only test the product through the MEMS cantilever needle 11, but also increase the deflection of the MEMS cantilever needle 11, so as to adapt to the requirements of the unevenness of the product surface during crimping contact.

[0044] Exemplarily, the MEMS cantilever needle 11 is a Z-shaped structure, which is more stable and can further improve the deflection of the MEMS cantilever needle 11 .

[0045] Exemplarily, the spacing between the MEMS cantilever needles 11 is 10 um-20 um, which is much smaller than the cantilever needles formed by insertion.

[0046] Continue to see Figure 5 The fixing member 2 further includes a connecting frame 23, the inner edge and the outer edge of the connecting frame 23 are respectively connected to the outer edge of the boss 22 and the inner edge of the connecting plate 21, and the connecting frame 23 has a plurality of staggered strip holes 231.

[0047] In the above embodiment, the deformation amount of the connection frame 23 when subjected to force can be increased by a plurality of bar holes 231 , so that the connection frame 23 can be deformed along the first direction, thereby achieving reliable displacement of the boss 22 and meeting the deflection requirements of the MEMS cantilever needle 11 .

[0048] It should be noted that the connecting plate 21 and the boss 22 may also be connected via other elastic members, and the present invention does not impose any limitation on this.

[0049] Exemplarily, the boss 22, the connection frame 23 and the connection plate 21 are arranged in a T-shape. The connection frame 23 and the connection plate 21 are coplanar.

[0050] In addition, in this embodiment, the PCB board 3 and the connecting board 21 both have a plurality of positioning holes arranged at intervals to insert corresponding positioning pins (the two ends of the same positioning pin are respectively inserted into the corresponding positioning holes on the PCB board 3 and the connecting board 21). The positioning between the PCB board 3 and the connecting board 21 can be achieved by inserting the positioning pins in the positioning holes, which facilitates the alignment of the boss 22 with the avoidance hole 31 and facilitates the subsequent connection and assembly between the two.

[0051] Exemplarily, the boss 22 has a convex block 221, and the substrate 1 is arranged on the convex block 221. The outer edge of the connecting plate 21 has a plurality of spaced support plates 211, and the positioning holes are located on the support plates 211. The support plates 211 are parallel to the connecting plate 21, and the number of the support plates 211 can be 4, which are arranged at four right angles of the connecting plate 21 respectively.

[0052] Figure 7 Schematic diagram of the structure of the fixing plate provided in the embodiment of the utility model. Figure 7 As shown, the probe card further includes a fixing plate 5 , which is fixed parallel to the second surface of the PCB board 3 . The fixing plate 5 has a positioning platform 51 , which is inserted into the avoiding hole 31 .

[0053] It is easy to understand that the PCB board 3 is expensive and easily damaged when subjected to force. Therefore, a fixing plate 5 is provided on the PCB board 3 to support the PCB board 3 and prevent the PCB board 3 from being damaged when subjected to force during crimping.

[0054] Furthermore, a plurality of spaced connection bolts 52 are inserted on the fixing plate 5, and the connection bolts 52 penetrate the fixing plate 5 and the PCB board 3 and are connected to the connection plate 21, so that the fixing plate 5, the PCB board 3 and the connection plate 21 can be conveniently connected to form a whole through the plurality of connection bolts 52.

[0055] In one implementation of the utility model, the probe card also includes an adjustment plate 6, which is parallel to the second surface of the PCB board 3 and has multiple spacing adjustment bolts 61 inserted on the adjustment plate 6. The multiple adjustment bolts 61 are arranged relative to the avoidance holes 31 to push the boss 22.

[0056] In the above embodiment, by screwing multiple adjustment bolts 61 on the adjustment plate 6, the screws of the multiple adjustment bolts 61 will drive the boss 22 to swing, thereby adjusting the plane of the boss 22 and the substrate 1, and then adjusting the plane corresponding to the MEMS cantilever needle 11 to ensure that it is parallel to the plane of the product.

[0057] Exemplarily, the adjustment plate 6 has a measuring hole 62 , which is arranged opposite to the avoidance hole 31 , so that the flatness of the boss 22 can be conveniently measured by placing a measuring tool in the measuring hole 62 and the avoidance hole 31 .

[0058] Exemplarily, the fixing plate 5 is clamped between the adjusting plate 6 and the PCB board 3, and the connecting bolts 52 are also connected to the adjusting plate 6. In addition, the fixing plate 5 and the positioning platform 51 are provided with through holes, which are directly connected to the measuring hole 62 and the avoidance hole 31.

[0059] In this embodiment, the probe card further includes a temperature-resistant plate 7 (see Figure 8 ), the substrate 1, the temperature-resistant plate 7 and the boss 22 are bonded together in sequence. The temperature-resistant plate 7 can not only connect the substrate 1 and the boss 22, but also resist high temperatures.

[0060] Exemplarily, both the substrate 1 and the temperature-resistant plate 7 can be silicon wafers. The size of the temperature-resistant plate 7 is substantially consistent with the size of the bump 221 , and the temperature-resistant plate 7 is directly bonded to the bump 221 .

[0061] An embodiment of the utility model further provides a testing device, which includes a probe card as described above.

[0062] It is easy for those skilled in the art to understand that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A probe card, characterized in that: The probe card comprises a substrate, a fixing member and a PCB board arranged in sequence along a first direction; A plurality of MEMS cantilever needles are arranged at intervals on the first surface of the substrate, and the plurality of MEMS cantilever needles are arranged protruding from the substrate in a first direction. The fixing member includes a connecting plate and a boss. The second surface of the substrate is fixed on the boss. The boss is inserted into the connecting plate and elastically connected to the connecting plate to provide flexibility for the plurality of MEMS cantilever needles. The connecting plate is fixed parallel to the first surface of the PCB board. The PCB board has a avoidance hole for accommodating the boss. The PCB board and the plurality of MEMS cantilever needles are connected via an FPC.

2. A probe card according to claim 1, characterized in that: The fixing member further comprises a connecting frame, the inner edge and the outer edge of the connecting frame are respectively connected to the outer edge of the boss and the inner edge of the connecting plate, and the connecting frame is provided with a plurality of staggered strip holes.

3. The probe card according to claim 1, characterized in that: The probe card further comprises a fixing plate, wherein the fixing plate is fixed parallel to the second surface of the PCB board, and the fixing plate is provided with a positioning platform, and the positioning platform is inserted into the avoiding hole.

4. A probe card according to claim 3, characterized in that: The fixing plate is provided with a plurality of connection bolts arranged at intervals, and the connection bolts penetrate through the fixing plate and the PCB board and are connected to the connection plate.

5. The probe card according to claim 1, characterized in that: The probe card also includes an adjustment plate, which is parallel to and attached to the second surface of the PCB board, and a plurality of interval adjustment bolts are inserted on the adjustment plate, and the plurality of adjustment bolts are arranged relative to the avoidance holes to push up the boss.

6. A probe card according to claim 5, characterized in that: The adjustment plate is provided with a measuring hole, and the measuring hole is arranged opposite to the avoidance hole.

7. A probe card according to any one of claims 1 to 6, characterized in that: The probe card further comprises a temperature-resistant plate, and the substrate, the temperature-resistant plate and the boss are sequentially bonded together.

8. A probe card according to any one of claims 1 to 6, characterized in that: The MEMS cantilever needle is a Z-shaped structure.

9. A probe card according to any one of claims 1 to 6, characterized in that: The PCB board and the connecting board both have a plurality of positioning holes arranged at intervals to insert corresponding positioning pins.

10. A testing device, characterized in that: The testing device comprises a probe card as described in any one of claims 1-9.

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