Cooling fin type organic film capacitor

Abstract

The utility model discloses a radiating fin type organic film capacitor, which belongs to the technical field of capacitors, and comprises a packaging metal shell, a core group arranged on the bottom surface of the packaging metal shell, and packaging epoxy resin arranged on the bottom surface of the packaging metal shell. A plurality of cooling fins are arranged on the top face of the packaging metal shell in an extending mode, and two outgoing lines are arranged on the outer wall of the packaging metal shell. According to the cooling fin type organic thin-film capacitor, the contact area with air is increased through the cooling fins to transmit heat, so that the temperature of the capacitor is reduced, the heat of the device is dissipated more quickly, the working temperature is effectively reduced, the applicability is improved, premature failure caused by high temperature is avoided, and the use is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitors, and more specifically to a heat sink type organic film capacitor. Background Art

[0002] A capacitor is a component that stores charge. It consists of two conductors placed close to each other with a non-conductive insulating medium in between. When a voltage is applied between the two plates of a capacitor, the capacitor will store charge. The basic working principle of a capacitor is charging and discharging, which involves applying a voltage to the two plates of the capacitor, causing the charge to move from one plate to the other under the action of the electric field force, thereby storing electrical energy.

[0003] When existing capacitors work in a circuit, they generate heat. This heat is difficult to dissipate, which can cause the capacitor to work unstably, shorten its life cycle, and fail prematurely, affecting the use of the capacitor and making it difficult to use it for a long time. Utility Model Content

[0004] 1. Technical problems to be solved

[0005] In view of the problems existing in the prior art, the purpose of the utility model is to provide a heat sink type organic film capacitor, which transfers heat by increasing the contact area with the air through the heat sink to reduce the temperature of the capacitor, so that the heat of the device can be dissipated faster, the working temperature can be effectively reduced, the applicability can be improved, premature failure due to high temperature can be avoided, and it is convenient to use.

[0006] 2. Technical solution

[0007] In order to solve the above problems, the utility model adopts the following technical solutions:

[0008] A heat sink type organic film capacitor comprises: a packaging metal shell, a core group is installed on the bottom surface of the packaging metal shell, a packaging epoxy resin is arranged on the bottom surface of the packaging metal shell, a plurality of heat sinks are extended on the top surface of the packaging metal shell, and two lead wires are arranged on the outer wall of the packaging metal shell.

[0009] As a preferred solution of the utility model, the core group is composed of a plurality of capacitor cores.

[0010] As a preferred solution of the utility model, the core is wound with an organic film, and the end of the core is sprayed with an alloy material.

[0011] As a preferred solution of the utility model, four concave grooves are formed on the top surface of the packaging metal shell.

[0012] As a preferred solution of the utility model, four bolt holes are provided on the top surface of the packaging metal shell.

[0013] 3. Beneficial effects

[0014] Compared with the prior art, the utility model provides a heat sink type organic film capacitor, which has the following beneficial effects:

[0015] The heat sink type organic film capacitor transfers heat by increasing the contact area with the air through the heat sink to reduce the temperature of the capacitor, so that the heat of the device dissipates faster, the working temperature is effectively reduced, the applicability is improved, and premature failure due to high temperature is avoided, which is conducive to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a front view of the utility model;

[0017] Figure 2 It is a top view of the utility model;

[0018] Figure 3 It is a side view of the utility model.

[0019] Description of the numbers in the figure:

[0020] 1. Core group; 2. Package metal shell; 3. Package epoxy resin; 4. Heat sink; 5. Lead wire. DETAILED DESCRIPTION

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the utility model in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Example:

[0023] See also Figure 1-3 A heat sink type organic film capacitor comprises: a packaging metal shell 2, a core group 1 is installed on the bottom surface of the packaging metal shell 2, a packaging epoxy resin 3 is arranged on the bottom surface of the packaging metal shell 2, a plurality of heat sinks 4 are extended from the top surface of the packaging metal shell 2, and two lead wires 5 are arranged on the outer wall of the packaging metal shell 2.

[0024] In a specific embodiment of the utility model, a main body is formed by an encapsulated metal shell 2, a core group 1, an encapsulated epoxy resin 3, a heat sink 4 and a lead wire 5. The core group 1 is composed of a plurality of capacitor cores, and the core group 1 is connected by series or parallel welding welding pieces or wires. The heat sink 4 increases the contact area with the air to transfer heat to reduce the temperature of the capacitor, so that the heat dissipation of the device is faster, the working temperature is effectively reduced, the applicability is improved, premature failure due to high temperature is avoided, and it is convenient for use.

[0025] Specifically, the core group 1 is composed of a plurality of capacitor cores.

[0026] In this embodiment, a core group 1 is formed by a plurality of capacitor cores to achieve the basic effect of a capacitor, and the core group 1 is connected by welding welding pieces or wires in series or in parallel.

[0027] Specifically, the core is wound with an organic film, and the end of the core is sprayed with an alloy material.

[0028] In this embodiment, the core is wound by a machine film, and the alloy material facilitates welding of the core.

[0029] Specifically, four concave grooves are formed on the top surface of the packaging metal shell 2 .

[0030] In this embodiment, the recessed groove reduces the space occupied by the package metal housing 2 and facilitates the installation of the bolts.

[0031] Specifically, four bolt holes are formed on the top surface of the packaging metal shell 2 .

[0032] In this embodiment, bolts are arranged through the bolt holes to install and fix the packaging metal shell 2.

[0033] Working principle: The main body is composed of a packaged metal shell 2, a core group 1, a packaged epoxy resin 3, a heat sink 4 and a lead wire 5. The core group 1 is composed of multiple capacitor cores, and the core group 1 is connected by series or parallel welding welding pieces or wires. The heat sink 4 increases the contact area with the air to transfer heat to reduce the temperature of the capacitor, so that the heat dissipation of the device is faster, the working temperature is effectively reduced, the applicability is improved, and premature failure due to high temperature is avoided, which is conducive to use.

[0034] The control method of the present invention is to control by manually starting and closing the switch. The wiring diagram of the power element and the provision of power supply are common knowledge in the field, and the present invention is mainly used to protect mechanical devices, so the present invention will not explain the control method and wiring arrangement in detail.

[0035] The above is only a preferred specific implementation method of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can make equivalent substitutions or changes within the technical scope disclosed by the utility model according to the technical solution and improved ideas of the utility model, which should be included in the protection scope of the utility model.

Claims

1. A heat sink type organic film capacitor, characterized in that: include: A packaged metal shell (2), wherein a core group (1) is mounted on the bottom surface of the packaged metal shell (2), a packaged epoxy resin (3) is provided on the bottom surface of the packaged metal shell (2), a plurality of heat sinks (4) are extended from the top surface of the packaged metal shell (2), and two lead wires (5) are provided on the outer wall of the packaged metal shell (2).

2. The heat sink type organic film capacitor according to claim 1, characterized in that: The core group (1) consists of a plurality of capacitor cores.

3. The heat sink type organic film capacitor according to claim 2, characterized in that: The core is wound with an organic film, and the end of the core is sprayed with alloy material.

4. The heat sink type organic film capacitor according to claim 1, characterized in that: The top surface of the packaging metal shell (2) is provided with four recessed grooves.

5. The heat sink type organic film capacitor according to claim 1, characterized in that: Four bolt holes are provided on the top surface of the packaging metal shell (2).

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