Injection molding device and injection molding equipment for mobile phone shell production

Abstract

The utility model provides an injection molding device and injection molding equipment for mobile phone shell production. The injection molding device for mobile phone shell production comprises a movable mold, a fixed mold and a mold foot, the movable mold and the fixed mold are oppositely arranged, the mold foot is fixedly connected to the lower portion of the movable mold, the fixed mold is provided with a feeding channel, the injection molding device further comprises a first mold core, a second mold core, a first ejection mechanism and a second ejection mechanism, the first mold core and the second mold core are both arranged between the movable mold and the fixed mold, the first mold core is provided with a first injection molding cavity, the second mold core is provided with a second injection molding cavity, the first ejection mechanism is used for ejecting a product in the first injection molding cavity, and the second ejection mechanism is used for ejecting a product in the second injection molding cavity. The corresponding products can be ejected by controlling the first ejector pin and the second ejector pin to move, so that the ejection accuracy of the products is higher, and the product yield is higher when the products are demoulded.

Description

Technical Field

[0001] The present invention relates to the field of injection molding technology, and in particular to an injection molding device and injection molding equipment for producing mobile phone shells. Background Art

[0002] In-mold injection molding is a method of industrial product production and molding, which is to inject molten plastic into a plastic product mold under pressure, and then cool and mold it to obtain the desired plastic parts. The outer shell or middle frame of mobile phones are all produced by in-mold injection molding. However, in the prior art, the mold generally has a mold core in the mold, that is, only one product can be molded at a time, which has the problem of low production efficiency.

[0003] In order to solve the above problems, a Chinese patent with application number CN201921091390.2 discloses a novel dual-cavity die-casting mold, including a fixed mold, a movable mold and a mold foot; a feed port is provided at the upper end of the fixed mold, a mold core is provided at the upper end of the movable mold, and two mold cavities are provided in the mold core; inclined top mechanisms are respectively provided at the lower ends of the two mold cavities, and an ejection mechanism is provided below the inclined top structure, and the ejection mechanism includes a top plate and a mounting plate; the inclined top structure includes two ejector columns, two guide blocks and two ejector blocks, the ejector columns are inclined columns and the two ejector columns are mirror-imaged, the ejector columns and the guide blocks are fixedly arranged at the lower end of the movable mold, the middle part of the guide block has a first inclined hole adapted to the shape of the ejector column, and the two ejector blocks are arranged on the left and right sides of the product to be die-cast in the mold cavity; the mold is also provided with a reset mechanism, and the reset mechanism includes an insert plate and a limit plate.

[0004] However, the structural design of the above-mentioned die-casting mold has the following problems during use:

[0005] The above mold has two mold cavities in the mold core, so that the mold can mold two products at a time, thereby improving production efficiency. However, there is an ejection mechanism under the mold core, and the ejection mechanism ejects two products at a time when moving. There are slight differences in the molding of the products in the two mold cavities, so the ejection accuracy of the ejection mechanism for the two products is poor when moving, which leads to a low product yield when the products are demolded.

[0006] Therefore, there is an urgent need for an injection molding device with high production efficiency and good yield when the product is demolded. Utility Model Content

[0007] The purpose of the present invention is to overcome the deficiencies in the prior art and to provide an injection molding device and injection molding equipment for producing mobile phone shells with high production efficiency and good yield rate during product demolding.

[0008] The purpose of this disclosure is achieved through the following technical solutions:

[0009] An injection molding device for producing a mobile phone housing, comprising:

[0010] A movable mold, a fixed mold and a mold foot, wherein the movable mold and the fixed mold are arranged opposite to each other, the mold foot is fixedly connected to the side of the movable mold away from the fixed mold, and the fixed mold is provided with a feed channel.

[0011] The injection molding device further includes a first mold core, a second mold core, a first ejection mechanism, and a second ejection mechanism, the first mold core includes a first upper mold core and a first lower mold core, the first upper mold core is embedded in the fixed mold, the first lower mold core is embedded in the movable mold, and the first upper mold core and the first lower mold core jointly form a first injection cavity when the molds are closed, the second mold core includes a second upper mold core and a second lower mold core, the second upper mold core is embedded in the fixed mold, the second lower mold core is embedded in the movable mold, and the second upper mold core and the second lower mold core jointly form a second injection cavity when the molds are closed, and the feed channel is communicated with the first injection cavity and the second injection cavity respectively;

[0012] The first ejection mechanism comprises a first moving component, a first connecting column and a first ejector pin, the two ends of the first connecting column are respectively connected to the movable mold and the mold foot, the first moving component is slidably arranged on the first connecting column, the first ejector pin is installed on the first moving component, the movable mold is provided with a first avoidance hole connected to the first injection cavity, and the first ejector pin is used to pass through the first avoidance hole and abut against the product when moving;

[0013] The second ejection mechanism includes a second moving component, a second connecting column and a second ejector pin, the two ends of the second connecting column are respectively connected to the movable mold and the mold foot, the second moving component is slidably arranged on the second connecting column, the second ejector pin is installed on the second moving component, the movable mold is provided with a second avoidance hole connected to the second injection cavity, and the second ejector pin is used to pass through the second avoidance hole and abut against another product when moving.

[0014] In one embodiment, the mold foot includes a first fixed pile, a second fixed pile, a third fixed pile and a connecting plate, the first fixed pile, the second fixed pile and the third fixed pile are all clamped and connected between the movable mold and the connecting plate, the first fixed pile, the second fixed pile and the third fixed pile are arranged in sequence at intervals, the first movable component is located between the first fixed pile and the second fixed pile, the two ends of the first connecting column are respectively connected to the movable mold and the connecting plate, the second movable component is located between the second fixed pile and the third fixed pile, the two ends of the second connecting column are respectively connected to the movable mold and the connecting plate, the connecting plate is respectively provided with a first through hole and a second through hole, the first through hole is used for an external ejector rod to pass through to drive the first movable component to move, and the second through hole is used for an external ejector rod to pass through to drive the second movable component to move.

[0015] In one embodiment, the first movable component includes a first mounting plate and a first top plate, the first top plate is provided with a first sleeve hole, the first mounting plate is provided with a second sleeve hole, the first connecting column passes through the first sleeve hole and the second sleeve hole in sequence and is connected to the connecting plate, and the first ejector pin is installed on the first top plate.

[0016] In one embodiment, the second movable component includes a second mounting plate and a second top plate, the second top plate is provided with a third sleeve hole, the second mounting plate is provided with a fourth sleeve hole, the second connecting column passes through the third sleeve hole and the fourth sleeve hole in sequence and is connected to the connecting plate, and the second ejector pin is installed on the second top plate.

[0017] In one embodiment, the first upper mold core and the second upper mold core are located on the same horizontal plane; and,

[0018] The first lower mold core and the second lower mold core are located on the same horizontal plane.

[0019] In one of the embodiments, a guide column is provided at one end of the movable mold adjacent to the fixed mold, a guide hole is opened in the fixed mold, and the guide column is arranged corresponding to the guide hole.

[0020] In one embodiment, there are a plurality of first ejector pins, a plurality of first avoidance holes, and the first ejector pins and the first avoidance holes are arranged in a one-to-one correspondence.

[0021] In one embodiment, there are a plurality of second ejector pins, a plurality of second avoidance holes, and the second ejector pins and the second avoidance holes are arranged in a one-to-one correspondence.

[0022] In one embodiment, the fixed mold includes a first upper mold, a second upper mold, a third upper mold and a fourth upper mold. The first upper mold, the second upper mold, the third upper mold and the fourth upper mold are connected in sequence. The fourth upper mold is arranged adjacent to the fixed mold, and the first upper mold core and the second upper mold core are respectively embedded in the fourth upper mold.

[0023] An injection molding device comprises the injection molding device for producing a mobile phone shell as described in any of the above embodiments.

[0024] Compared with the prior art, the present invention has at least the following advantages:

[0025] The above-mentioned injection molding device for producing mobile phone shells, when the first upper mold core and the first lower mold core are molded together, a first injection cavity is formed together, and when the second upper mold core and the second lower mold core are molded together, a second injection cavity is formed together, that is, the device can simultaneously mold two products through the first injection cavity and the second injection cavity, thereby improving production efficiency; further, the first movable component is slidably arranged on the first connecting column, and the first ejector is installed on the first movable component. When the first movable component moves, it drives the first ejector to pass through the first avoidance hole so that the first ejector ejects the product. Similarly, when the second movable component moves, it drives the second ejector to pass through the second avoidance hole so that the second ejector ejects another product. That is, by controlling the movement of the first ejector and the second ejector, the corresponding products can be ejected respectively, thereby making the product ejection accuracy higher, and thus making the product yield higher when the product is demolded. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 This is a schematic structural diagram of an injection molding device for producing a mobile phone housing according to an embodiment;

[0028] Figure 2 for Figure 1 Another structural schematic diagram of an injection molding device for producing a mobile phone housing is shown;

[0029] Figure 3 for Figure 1 A schematic structural diagram of a first mold core of an injection molding device shown;

[0030] Figure 4 for Figure 1 A schematic structural diagram of a first ejection mechanism of an injection molding device shown;

[0031] Figure 5 for Figure 1 A schematic structural diagram of a second ejection mechanism of the injection molding device shown;

[0032] Figure 6 for Figure 1 Another structural schematic diagram of an injection molding device for producing a mobile phone housing is shown. DETAILED DESCRIPTION

[0033] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0034] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0036] The present invention provides an injection molding device for producing a mobile phone shell, comprising a movable mold, a fixed mold and a mold foot, wherein the movable mold is arranged opposite to the fixed mold, the mold foot is fixedly connected to a side of the movable mold away from the fixed mold, the fixed mold is provided with a feed channel, the injection molding device further comprises a first mold core, a second mold core, a first ejection mechanism and a second ejection mechanism, the first mold core comprises a first upper mold core and a first lower mold core, the first upper mold core is embedded in the fixed mold, the first lower mold core is embedded in the movable mold, the first upper mold core and the first lower mold core jointly form a first injection molding cavity when the mold is closed, the second mold core comprises a second upper mold core and a second lower mold core, the second upper mold core is embedded in the fixed mold, the second lower mold core is embedded in the movable mold, the second upper mold core and the second lower mold core jointly form a second injection molding cavity when the mold is closed, and the feed channel is respectively connected to the first injection molding cavity and the second The first ejection mechanism comprises a first moving component, a first connecting column and a first ejector pin, the two ends of the first connecting column are respectively connected to the movable mold and the mold foot, the first moving component is slidably arranged on the first connecting column, the first ejector pin is installed on the first moving component, the movable mold is provided with a first avoidance hole connected to the first injection cavity, and the first ejector pin is used to pass through the first avoidance hole and abut against the product when moving; the second ejection mechanism comprises a second moving component, a second connecting column and a second ejector pin, the two ends of the second connecting column are respectively connected to the movable mold and the mold foot, the second moving component is slidably arranged on the second connecting column, the second ejector pin is installed on the second moving component, the movable mold is provided with a second avoidance hole connected to the second injection cavity, and the second ejector pin is used to pass through the second avoidance hole and abut against another product when moving.

[0037] The above-mentioned injection molding device for producing mobile phone shells, when the first upper mold core and the first lower mold core are molded together, a first injection cavity is formed together, and when the second upper mold core and the second lower mold core are molded together, a second injection cavity is formed together, that is, the device can simultaneously mold two products through the first injection cavity and the second injection cavity, thereby improving production efficiency; further, the first movable component is slidably arranged on the first connecting column, and the first ejector is installed on the first movable component. When the first movable component moves, it drives the first ejector to pass through the first avoidance hole so that the first ejector ejects the product. Similarly, when the second movable component moves, it drives the second ejector to pass through the second avoidance hole so that the second ejector ejects another product. That is, by controlling the movement of the first ejector and the second ejector, the corresponding products can be ejected respectively, thereby making the product ejection accuracy higher, and thus making the product yield higher when the product is demolded.

[0038] In order to better understand the technical solutions and beneficial effects of the present invention, the present invention is further described in detail below in conjunction with specific embodiments:

[0039] like Figures 1 to 5As shown, an injection molding device 10 for producing mobile phone shells in one embodiment includes a movable mold 100, a fixed mold 200 and a mold foot 300. The movable mold 100 is arranged opposite to the fixed mold 200, that is, when the fixed mold 200 moves, it approaches the movable mold 100. The mold foot 300 is fixedly connected to the side of the movable mold 100 away from the fixed mold 200, and the fixed mold 200 is provided with a feeding channel 200a. The injection molding device further includes a first mold core 400, a second mold core 500, a first ejection mechanism 600 and a second ejection mechanism 700. The first mold core 400 includes a first upper mold core 410 and a first lower mold core 420. The first upper mold core 410 is embedded in the fixed mold 200, and the first lower mold core 420 is embedded in the movable mold 100. When the first upper mold core 410 and the first lower mold core 420 are molded together, a first injection cavity is formed. The second mold core 500 includes a second upper mold core 510 and a second lower mold core 520. The second upper mold core 510 is embedded in the fixed mold 200, and the second lower mold core 520 is embedded in the movable mold 100. When the second upper mold core 510 and the second lower mold core 520 are molded together, a second injection cavity is formed. The feed channel 200a is respectively connected to the first injection cavity and the second injection cavity, so that the slurry passes through the feed channel 200a and then enters the first injection cavity and the second injection cavity respectively.

[0040] Furthermore, the first ejection mechanism 600 includes a first moving component 610, a first connecting column 620 and a first ejector pin 630, the two ends of the first connecting column 620 are respectively connected to the movable mold 100 and the mold foot 300, the first moving component 610 is slidably set on the first connecting column 620, the first ejector pin 630 is installed on the first moving component 610, the movable mold 100 is provided with a first avoidance hole connected to the first injection cavity, and the first ejector pin 630 is used to pass through the first avoidance hole and abut against the product when moving, that is, the first moving component 610 can move when driven by an external device, thereby driving the first ejector pin 630 to pass through the first avoidance hole to eject the product.

[0041] Furthermore, the second ejection mechanism 700 includes a second movable component 710, a second connecting column 720 and a second ejector pin 730, the two ends of the second connecting column 720 are respectively connected to the movable mold 100 and the mold foot 300, the second movable component 710 is slidably set on the second connecting column 720, the second ejector pin 730 is installed on the second movable component 710, the movable mold 100 is provided with a second avoidance hole connected to the second injection cavity, and the second ejector pin 730 is used to pass through the second avoidance hole and abut against another product when moving, that is, the second movable component 710 can move when driven by an external device, thereby driving the second ejector pin 730 to pass through the second avoidance hole to eject another product.

[0042] In this embodiment, when the movable mold 100 moves toward and abuts against the fixed mold 200, that is, when the movable mold 100 and the fixed mold 200 are closed, the first upper mold core 410 and the first lower mold core 420 jointly form a first injection cavity, and the second upper mold core 510 and the second lower mold core 520 jointly form a second injection cavity, so that the device can mold two products at the same time, thereby improving production efficiency. The first moving component 610 is slidably arranged on the first connecting column 620, so that the first moving component 610 can move up and down along the first connecting column 620 under the drive of an external device. When the first moving component 610 moves, it drives the first ejector pin 630 to move, so that the first ejector pin 630 ejects the product. Similarly, the second ejector pin 730 ejects another product. The external device can control the first moving component 610 and the second moving component 710 to move respectively, so that the ejection accuracy of the two products is higher, and thus the yield rate of the two products is higher when demolding.

[0043] In the above-mentioned injection molding device 10 for producing mobile phone shells, the first upper mold core 410 and the first lower mold core 420 form a first injection cavity when the mold is closed, and the second upper mold core 510 and the second lower mold core 520 form a second injection cavity when the mold is closed, that is, the device can simultaneously mold two products through the first injection cavity and the second injection cavity, thereby improving production efficiency; further, the first moving component 610 is slidably arranged on the first connecting column 620, and the first ejector pin 630 is installed on the first moving component 610. When the first moving component 610 moves, it drives the first ejector pin 630 to pass through the first avoidance hole so that the first ejector pin 630 ejects the product. Similarly, when the second moving component 710 moves, it drives the second ejector pin 730 to pass through the second avoidance hole so that the second ejector pin 730 ejects another product. That is, by controlling the movement of the first ejector pin 630 and the second ejector pin 730, the corresponding products can be ejected respectively, thereby making the product ejection accuracy higher, and thus making the product yield higher when the product is demolded.

[0044] like Figure 2 and Figure 6As shown, in one embodiment, the mold foot 300 includes a first fixed pile 310, a second fixed pile 320, a third fixed pile 330 and a connecting plate 340, the first fixed pile 310, the second fixed pile 320 and the third fixed pile 330 are all clamped and connected between the movable mold 100 and the connecting plate 340, the first fixed pile 310, the second fixed pile 320 and the third fixed pile 330 are arranged in sequence, the first moving component 610 is located between the first fixed pile 310 and the second fixed pile 320, and the first connecting pile The two ends of 620 are respectively connected to the movable mold 100 and the connecting plate 340, the second movable component 710 is located between the second fixed pile 320 and the third fixed pile 330, the two ends of the second connecting column 720 are respectively connected to the movable mold 100 and the connecting plate 340, the connecting plate 340 is respectively provided with a first through hole 341 and a second through hole 342, the first through hole 341 is used for an external push rod to pass through to drive the first movable component 610 to move, and the second through hole 342 is used for an external push rod to pass through to drive the second movable component 710 to move. In this embodiment, the connecting plate 340 is located at the bottom, the two ends of the first connecting column 620 are respectively connected to the movable mold 100 and the connecting plate 340, the first movable component 610 is slidably disposed on the first connecting column 620, and the first movable component 610 is located between the first fixed pile 310 and the second fixed pile 320. The external ejector rod passes through the first through hole 341 of the connecting plate 340 to drive the first movable component 610 to move up and down, thereby driving the first ejector pin 630 to move to eject the product. Similarly, the external ejector rod passes through the second through hole 342 of the connecting plate 340 to drive the second movable component 710 to move up and down, thereby driving the second ejector pin 730 to move to eject another product.

[0045] like Figure 4 As shown, in one embodiment, the first moving assembly 610 includes a first mounting plate 611 and a first top plate 612, the first top plate 612 is provided with a first sleeve hole, the first mounting plate 611 is provided with a second sleeve hole, the first connecting column 620 passes through the first sleeve hole and the second sleeve hole in sequence and is connected to the connecting plate 340, and the first ejector pin 630 is installed above the first top plate 612. In this embodiment, the external ejector pin passes through the first through hole 341 of the connecting plate 340 and abuts against the first mounting plate 611, so that the first mounting plate 611 and the first top plate 612 move up and down along the extension direction of the first connecting column 620, and the first ejector pin 630 is installed above the first top plate 612, so that when the first top plate 612 moves, the first ejector pin 630 is driven to pass through the first avoidance hole, thereby ejecting the product.

[0046] like Figure 5As shown, in one embodiment, the second moving assembly 710 includes a second mounting plate 711 and a second top plate 712, the second top plate 712 is provided with a third sleeve hole, the second mounting plate 711 is provided with a fourth sleeve hole, the second connecting column 720 passes through the third sleeve hole and the fourth sleeve hole in sequence and then is connected to the connecting plate 340, and the second ejector pin 730 is installed above the second top plate 712. In this embodiment, the external ejector pin passes through the second through hole 342 of the connecting plate 340 and then abuts against the second mounting plate 711, so that the second mounting plate 711 and the second top plate 712 move up and down along the extension direction of the second connecting column 720, and the second ejector pin 730 is installed above the second top plate 712, so that when the second top plate 712 moves, the second ejector pin 730 is driven to pass through the second avoidance hole, thereby ejecting another product.

[0047] like Figure 2 As shown, in one embodiment, the first upper mold core 410 and the second upper mold core 510 are located on the same horizontal plane; and the first lower mold core 420 and the second lower mold core 520 are located on the same horizontal plane. It can be understood that the first upper mold core 410 and the second upper mold core 510 are located on the same horizontal plane, that is, the first upper mold core 410 and the second upper mold core 510 are flush with each other, and similarly, the first lower mold core 420 and the second lower mold core 520 are flush with each other, so that when the movable mold 100 moves toward the fixed mold 200, the first upper mold core 410 and the first lower mold core 420 are molded together, and the second upper mold core 510 and the second lower mold core 520 are molded together synchronously, so that the accuracy of the entire injection molding device is higher.

[0048] like Figure 2 As shown, in one embodiment, a guide column 110 is provided at one end of the movable mold 100 adjacent to the fixed mold 200, and a guide hole is provided in the fixed mold 200, and the guide column 110 is arranged corresponding to the guide hole. It can be understood that when the external driving device drives the movable mold 100 to move along the direction of the fixed mold 200, the guide column 110 first passes through the guide hole, that is, the guide column 110 and the guide hole play a guiding role together, so that the precision of the mold closing between the fixed mold 200 and the movable mold 100 is higher.

[0049] like Figure 4 As shown, in one embodiment, the number of the first ejector pins 630 is multiple, the number of the first avoidance holes is multiple, and the first ejector pins 630 and the first avoidance holes are arranged one by one. It can be understood that the multiple first ejector pins 630 are evenly arranged above the first ejector plate 612, and the multiple first ejector pins 630 correspondingly pass through the first avoidance holes to eject the product, so that the force on the product when it is ejected is more uniform, thereby improving the yield rate of the product when it is demolded.

[0050] like Figure 5As shown, in one embodiment, the number of the second ejector pins 730 is multiple, the number of the second avoidance holes is multiple, and the second ejector pins 730 and the second avoidance holes are arranged one by one. It can be understood that the multiple second ejector pins 730 are evenly arranged above the second top plate 712, and the multiple second ejector pins 730 correspondingly pass through the second avoidance holes to eject the product, so that the force on the product when it is ejected is more uniform, thereby achieving a better yield when the product is demolded.

[0051] like Figure 1 As shown, in one embodiment, the fixed mold 200 includes a first upper mold 210, a second upper mold 220, a third upper mold 230 and a fourth upper mold 240, the first upper mold 210, the second upper mold 220, the third upper mold 230 and the fourth upper mold 240 are connected in sequence, the fourth upper mold 240 is arranged adjacent to the fixed mold 200, and the first upper mold core 410 and the second upper mold core 510 are respectively embedded in the fourth upper mold 240. In this embodiment, the fourth upper mold plate 240 is arranged adjacent to the movable mold 100, so that after the movable mold 100 abuts against the fourth upper mold plate 240, the first upper mold core 410 and the first lower mold core 420 jointly form a first injection cavity, the second upper mold core 510 and the second lower mold core 520 jointly form a second injection cavity, and the feed channel 200a extends from the first upper mold plate 210, the second upper mold plate 220, the third upper mold plate 230 and the fourth upper mold plate 240, so that the feed channel 200a is respectively connected to the first injection cavity and the second injection cavity, that is, the material passes through the feed channel 200a and enters the first injection cavity and the second injection cavity for molding.

[0052] The present application also provides an injection molding device, including the injection molding device 10 for producing a mobile phone housing as described in any of the above embodiments.

[0053] Compared with the prior art, the present invention has at least the following advantages:

[0054] In the above-mentioned injection molding device 10 for producing mobile phone shells, the first upper mold core 410 and the first lower mold core 420 form a first injection cavity when the mold is closed, and the second upper mold core 510 and the second lower mold core 520 form a second injection cavity when the mold is closed, that is, the device can simultaneously mold two products through the first injection cavity and the second injection cavity, thereby improving production efficiency; further, the first moving component 610 is slidably arranged on the first connecting column 620, and the first ejector pin 630 is installed on the first moving component 610. When the first moving component 610 moves, it drives the first ejector pin 630 to pass through the first avoidance hole so that the first ejector pin 630 ejects the product. Similarly, when the second moving component 710 moves, it drives the second ejector pin 730 to pass through the second avoidance hole so that the second ejector pin 730 ejects another product. That is, by controlling the movement of the first ejector pin 630 and the second ejector pin 730, the corresponding products can be ejected respectively, thereby making the product ejection accuracy higher, and thus making the product yield higher when the product is demolded.

[0055] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the patent of the present disclosure shall be based on the attached claims.

Claims

1. An injection molding device for producing mobile phone shells, comprising a movable mold, a fixed mold and a mold foot, wherein the movable mold and the fixed mold are arranged opposite to each other, the mold foot is fixedly connected to the side of the movable mold away from the fixed mold, and the fixed mold is provided with a feed channel, characterized in that: The injection molding device further includes a first mold core, a second mold core, a first ejection mechanism, and a second ejection mechanism, the first mold core includes a first upper mold core and a first lower mold core, the first upper mold core is embedded in the fixed mold, the first lower mold core is embedded in the movable mold, and the first upper mold core and the first lower mold core jointly form a first injection cavity when the molds are closed, the second mold core includes a second upper mold core and a second lower mold core, the second upper mold core is embedded in the fixed mold, the second lower mold core is embedded in the movable mold, and the second upper mold core and the second lower mold core jointly form a second injection cavity when the molds are closed, and the feed channel is communicated with the first injection cavity and the second injection cavity respectively; The first ejection mechanism comprises a first moving component, a first connecting column and a first ejector pin, the two ends of the first connecting column are respectively connected to the movable mold and the mold foot, the first moving component is slidably arranged on the first connecting column, the first ejector pin is installed on the first moving component, the movable mold is provided with a first avoidance hole connected to the first injection cavity, and the first ejector pin is used to pass through the first avoidance hole and abut against the product when moving; The second ejection mechanism includes a second moving component, a second connecting column and a second ejector pin, the two ends of the second connecting column are respectively connected to the movable mold and the mold foot, the second moving component is slidably arranged on the second connecting column, the second ejector pin is installed on the second moving component, the movable mold is provided with a second avoidance hole connected to the second injection cavity, and the second ejector pin is used to pass through the second avoidance hole and abut against another product when moving.

2. The injection molding device for producing mobile phone housing according to claim 1, characterized in that: The mold foot includes a first fixed pile, a second fixed pile, a third fixed pile and a connecting plate, the first fixed pile, the second fixed pile and the third fixed pile are all clamped and connected between the movable mold and the connecting plate, the first fixed pile, the second fixed pile and the third fixed pile are arranged in sequence at intervals, the first movable component is located between the first fixed pile and the second fixed pile, the two ends of the first connecting column are respectively connected to the movable mold and the connecting plate, the second movable component is located between the second fixed pile and the third fixed pile, the two ends of the second connecting column are respectively connected to the movable mold and the connecting plate, the connecting plate is respectively provided with a first through hole and a second through hole, the first through hole is used for an external ejector rod to pass through to drive the first movable component to move, and the second through hole is used for an external ejector rod to pass through to drive the second movable component to move.

3. The injection molding device for producing mobile phone housing according to claim 2, characterized in that: The first moving component includes a first mounting plate and a first top plate, the first top plate is provided with a first sleeve hole, the first mounting plate is provided with a second sleeve hole, the first connecting column passes through the first sleeve hole and the second sleeve hole in sequence and is connected to the connecting plate, and the first ejector pin is installed above the first top plate.

4. The injection molding device for producing a mobile phone housing according to claim 2, characterized in that: The second movable component includes a second mounting plate and a second top plate, the second top plate is provided with a third sleeve hole, the second mounting plate is provided with a fourth sleeve hole, the second connecting column passes through the third sleeve hole and the fourth sleeve hole in sequence and is connected to the connecting plate, and the second ejector pin is installed above the second top plate.

5. The injection molding device for producing mobile phone housing according to claim 1, characterized in that: The first upper mold core and the second upper mold core are located on the same horizontal plane; and, The first lower mold core and the second lower mold core are located on the same horizontal plane.

6. The injection molding device for producing mobile phone housing according to claim 1, characterized in that: A guide column is provided at one end of the movable mold adjacent to the fixed mold, a guide hole is opened in the fixed mold, and the guide column is arranged corresponding to the guide hole.

7. The injection molding device for producing mobile phone housing according to claim 1, characterized in that: There are a plurality of first ejector pins, a plurality of first avoidance holes, and the first ejector pins and the first avoidance holes are arranged in a one-to-one correspondence.

8. The injection molding device for producing mobile phone housing according to claim 1, characterized in that: There are a plurality of second ejector pins, a plurality of second avoidance holes, and the second ejector pins and the second avoidance holes are arranged in a one-to-one correspondence.

9. The injection molding device for producing mobile phone housing according to claim 1, characterized in that: The fixed mold includes a first upper mold, a second upper mold, a third upper mold and a fourth upper mold. The first upper mold, the second upper mold, the third upper mold and the fourth upper mold are connected in sequence. The fourth upper mold is arranged adjacent to the fixed mold, and the first upper mold core and the second upper mold core are respectively embedded in the fourth upper mold.

10. An injection molding device, characterized in that: The invention comprises the injection molding device for producing mobile phone shells as described in any one of claims 1 to 9.

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