Film sealing mechanism and packaging equipment

Abstract

The utility model provides a film sealing mechanism, which is used for packaging a packaging film of a silicon wafer, and is characterized in that the film sealing mechanism is at least provided with a film cutting part, and the film cutting part comprises a film cutting frame, a cutter frame, a molybdenum plate frame and a monitoring assembly for monitoring the position of the silicon wafer; the cutter frame and the molybdenum plate frame are both movably connected with the film cutting frame; the monitoring assembly is arranged on the film cutting frame and located on the outer side of the cutter and can monitor the thickness and the width of the silicon wafer. According to the film sealing mechanism, an existing film sealing structure is optimized, the condition of silicon wafer transmission displacement can be automatically monitored, meanwhile, the fool-proof assembly is arranged, and the silicon wafer is prevented from being cut by mistake; meanwhile, a plastic film supporting structure is improved, and dislocation or dislocation is prevented; the whole film sealing mechanism is simple in structure, easy to control, good in film sealing effect, stable in quality and high in film sealing efficiency. The utility model further provides packaging equipment provided with the film sealing mechanism.

Description

Technical Field

[0001] The present application belongs to the technical field of silicon wafer packaging, and in particular, relates to a film sealing mechanism and a packaging device provided with the film sealing mechanism. Background Art

[0002] When packaging silicon wafers, film sealing is the final step of the entire packaging process, and the quality of the film sealing directly affects the overall packaging effect. When the existing film sealing is thermoformed, the existing technical problems are prone to occur:

[0003] (1) When cutting the film:

[0004] Since the cutter and the molybdenum plate are in a film cutting mode with the upper part moving and the lower part not moving, the incision space is small, which makes the silicon wafer easily scratched and broken by the cutter;

[0005] In addition, when the silicon wafer is out of position or tilted on the conveyor belt, it cannot be monitored, and the cutter will cut the silicon wafer into pieces if it cuts the film directly, affecting the quality of the entire stack of silicon wafers;

[0006] No fool-proof structure is designed. Once an abnormal accident occurs, the cutter cannot be controlled to fall in time, resulting in the silicon wafer being damaged by the cutter.

[0007] The cutter drive controlled by a transmission belt or gear is prone to tooth jumping or shaking, as well as fatigue problems, which directly lead to the cutter and molybdenum plate being unable to align and cut the film.

[0008] (2) When plasticizing:

[0009] In a thermoplastic furnace, chains are generally used to drive rollers to transport silicon wafers. During the transmission process, the rollers will vibrate, which will produce an up and down fluctuating force on the stacked silicon wafers, causing the stacked silicon wafers to become loose. As the transmission moves, they may even become misaligned or out of place. Summary of the invention

[0010] The present application provides a film sealing mechanism and packaging equipment provided with the film sealing mechanism, which solves the quality problem of silicon wafers caused by easy displacement or misalignment of silicon wafers in the prior art.

[0011] In order to solve at least one of the above technical problems, the technical solution adopted in this application is:

[0012] A film sealing mechanism, used for packaging film of silicon wafers, is at least equipped with a film cutting part, which includes a film cutting frame, a cutting knife frame, a molybdenum plate frame, and a monitoring component for monitoring the position of the silicon wafer;

[0013] The cutting knife frame and the molybdenum plate frame are both movably connected to the film cutting frame;

[0014] The monitoring component is constructed on the film cutting frame and is located outside the cutting knife, and can monitor the thickness and width of the silicon wafer.

[0015] Furthermore, the monitoring assembly includes a plurality of groups of top monitors arranged along the height direction of the film cutting frame, and side monitors arranged along the width direction of the film cutting frame; wherein the top monitors are arranged along the width direction of the silicon wafer.

[0016] Furthermore, at least two groups of top monitors are provided along the height direction of the film cutting frame and are symmetrically arranged;

[0017] Preferably, a group of top monitors are also arranged on the width midline of the silicon wafer;

[0018] Preferably, the height of the side monitor is the same as the height of the silicon wafer.

[0019] Furthermore, chains for connecting the cutter frame and the molybdenum plate frame are provided on both sides of the film cutting frame width, and the chains drive the cutter frame and the molybdenum plate frame to move upward and downward toward or away from each other.

[0020] Furthermore, the chain is constructed as a ring structure arranged along the height direction of the film cutting frame, and cooperates with the gear fixed on the inner side of the film cutting frame.

[0021] Furthermore, a film cutting cylinder for driving the chain to rotate is arranged below the film cutting frame, and its output end is connected to the molybdenum plate frame.

[0022] Furthermore, it also includes a locking member arranged on the outside of the cutter frame, which includes a mounting plate arranged on the side of the film cutting frame, and a locking cylinder arranged on the mounting plate, the locking cylinder controls the locking pin arranged at its output end to cooperate with the locking hole on the cutter frame plate surface to lock the cutter position and fix it;

[0023] Preferably, the locking member is at a height at the highest position when the cutter frame and the molybdenum plate frame are opened, and is arranged perpendicular to the plate surface of the cutter frame.

[0024] Furthermore, a thermoplastic part is provided after the film cutting part, which includes a furnace body and a thermoplastic belt placed in the furnace body, wherein the thermoplastic belt is a flat mesh belt, and its width is greater than the width of the silicon wafer conveyor belt and is laid flat in the furnace body;

[0025] Preferably, it also includes a thermoplastic motor for driving the thermoplastic belt to move, which is arranged on the side of the outer wall of the furnace body.

[0026] Furthermore, a transmission assembly for driving the thermoplastic belt to rotate is also provided in the furnace body, including an active roller, a driven roller and an adjustable roller, wherein the active roller is connected to the thermoplastic motor; the axes of the active roller, the driven roller and the adjustable roller are connected to form an inverted trapezoidal structure or a triangle to drive the thermoplastic belt to rotate continuously in one direction.

[0027] A packaging device is provided with the film sealing mechanism as described above.

[0028] A film sealing mechanism designed by the present application optimizes the existing film sealing structure, can automatically monitor the status of silicon wafers when they are transported out of position, and set up a foolproof component to avoid miscutting silicon wafers; at the same time, the plastic film support structure is improved to prevent out of position or misalignment; the entire film sealing mechanism has a simple structure and is easy to control, with good film sealing effect and stable quality, and high film sealing efficiency. The present application also proposes a packaging device equipped with the film sealing mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a three-dimensional diagram of a film sealing mechanism according to an embodiment of the present application;

[0030] Figure 2 is a three-dimensional diagram of a film cutting portion according to an embodiment of the present application;

[0031] Figure 3 is a front view of a film cutting portion according to an embodiment of the present application;

[0032] Figure 4 is a top view of the monitoring assembly arrangement when the silicon wafer position is abnormal in one embodiment of the present application;

[0033] Figure 5 is a top view of a monitoring assembly arrangement when a silicon wafer position is abnormal in another embodiment of the present application;

[0034] Figure 6 is a three-dimensional diagram of a locking member according to an embodiment of the present application;

[0035] Figure 7 is a three-dimensional diagram of a thermoplastic portion of an embodiment of the present application;

[0036] Figure 8 is a side cross-sectional view of a thermoplastic portion of an embodiment of the present application;

[0037] Fig. 9 It is a side view of a transmission component according to another embodiment of the present application.

[0038] In the figure:

[0039] 100, film cutting unit 200, film molding unit 10, film cutting frame

[0040] 11. Cutter rack 12. Molybdenum plate rack 13. Chain

[0041] 14. Film cutting cylinder 20. Monitoring component 21. Top monitor

[0042] 22, side monitor 30, locking member 31, mounting plate

[0043] 32. Locking cylinder 33. Locking pin

[0044] 40. Furnace body 50. Thermoplastic belt 60. Thermoplastic motor

[0045] 70, transmission assembly 71, active roller shaft 72, driven roller shaft

[0046] 73. Adjustable roller 80. Silicon wafer DETAILED DESCRIPTION

[0047] The present application is described in detail below with reference to the accompanying drawings and specific embodiments.

[0048] This embodiment provides a film sealing mechanism, such as Figure 1 As shown, it includes a film cutting part 100 and a film plastic part 200. The packaging film carrying the silicon wafer 80 is sealed and cut by the film cutting part 100, and then enters the film plastic part 200 for heat plastic sealing, thereby completing the film sealing work of the silicon wafer packaging.

[0049] like Figure 2-3 As shown, the film cutting part 100 includes a film cutting frame 10, a cutting knife frame 11 and a molybdenum plate frame 12 which are arranged in an aligned manner up and down, an alignment chain 13 for connecting the cutting knife frame 11 and the molybdenum plate frame 12, a film cutting cylinder 14 for driving the cutting knife frame 11 and the molybdenum plate frame 12 to move up and down toward / away from each other, and a monitoring component 20 for monitoring the position of the silicon wafer. Among them, the cutting knife frame 11 is provided with a cutting knife, which is located at the top; the molybdenum plate frame 12 is provided with a molybdenum plate with a cut corresponding to the cutting knife, which is located at the bottom; the cutting knife frame 11 and the molybdenum plate frame 12 are both movably connected to the film cutting frame 10, that is, they can both move up and down along the height direction of the film cutting frame 10, and can move synchronously toward or away from each other, thereby expanding the height of the film cutting opening, facilitating the smooth flow and feeding of the packaging film, and avoiding damage to the flow of the packaging film caused by the small film cutting opening. The monitoring component 20 is constructed on the film cutting frame 10 and is located on the outside of the cutter away from the film molding part 200. It can monitor the thickness and width of the silicon wafer 80 and is used to monitor whether there is a silicon wafer in the film cutting part 100 to control whether the cutter descends to avoid blind spots.

[0050] In this embodiment, the chain 13 can drive the cutter frame 11 and the molybdenum plate frame 12 to move up and down, while the existing cutter frame 11 and the molybdenum plate frame 12 are both movable upward and stationary downward, that is, the cutter at the top can move up and down while the molybdenum plate at the bottom is fixed. For this film cutting method that moves upward and does not move downward, the film cutting opening is small, which can easily damage the loose packaging film flowing from the sleeve film part, especially if the packaging film only needs to be opened on one side in the width direction and the other positions are sealed, the high temperature of the molybdenum plate below will cause deformation and shrinkage of the open end, directly affecting the subsequent thermoplastic packaging. The cutter frame 11 and the molybdenum plate frame 12 are arranged in an opposite manner, so that the film cutting opening is large, which can improve the safety and reliability of the packaging film transportation. Moreover, the film is cut by synchronously moving upward and downward in opposite directions, which not only has high sealing and cutting efficiency and accurate alignment, but also has good sealing and cutting quality, and does not damage the silicon wafer or the packaging film.

[0051] Two ring chains 13 are arranged along the height direction of the film cutting frame 10 on both sides of the cutting knife frame 11 and the molybdenum plate frame 12. The chain 13 can drive the cutting knife frame 11 and the molybdenum plate frame 12 to move up and down smoothly toward or away from each other, and can also improve the heat resistance of the transmission of the cutting knife frame 11 and the molybdenum plate frame 12. Since the cutting knife needs to be heated, this causes the cutting knife frame 11 body to have heat resistance, and its temperature will be indirectly transmitted to the transmission chain 13. Based on the structure and performance of the chain 13 body, it has high temperature resistance and high fatigue resistance, and its heat dissipation efficiency is high, which can better connect the cutting knife frame 11, improve its transmission stability, ensure the accuracy of the fit between the cutting knife and the molybdenum plate, and achieve better sealing effect. In addition, the chain transmission can also avoid the tooth jump problem of the existing gear transmission and the fatigue problem of the existing belt transmission.

[0052] On the inner wall of the film cutting frame 10, there is a gear that cooperates with the chain 13. At the same time, a vertically arranged film cutting cylinder 14 directly connected to the molybdenum plate frame 12 is also provided below the film cutting frame 10. The output end of the film cutting cylinder 14 is directly connected to the molybdenum plate frame 12, and drives the molybdenum plate frame 12 to rise and fall along the height direction of the chain 13, so that the chain 13 drives the cutting frame 11 up and down while driving along the gear.

[0053] The existing film cutting cylinder 14 is arranged on the top of the film cutting frame 10. Such an arrangement causes a height gap between the cylinder and the power mounting frame when the cylinder is extended, which may cause a hand injury. However, the structure of the film cutting cylinder 14 placed below the film cutting frame 10 as described in this embodiment does not cause the above-mentioned safety hazards, that is, there is no height gap between the film cutting frame 10 and the safety problem of hand injury.

[0054] like Figure 3-4 As shown in the figure, the arrow in the figure indicates the transmission direction of the silicon wafer 80. In order to monitor whether the position of the silicon wafer 80 when the silicon wafer 80 moves to the film cutting part 100 is correct and to avoid the occurrence of the sharp corner of the silicon wafer 80 being cut when the cutter descends, a monitoring component 20 is provided on the inner frame surface of the film cutting frame 10. The monitoring component 20 includes a plurality of groups of top monitors 21 arranged along the height direction of the film cutting frame and side monitors 22 arranged along the width direction of the film cutting frame 10. Among them, the top monitor 21 is arranged along the width direction of the silicon wafer 80, and the side monitor 22 is arranged along the thickness direction of the silicon wafer 80, and the height of the side monitor 22 is the same as the height of the position of the silicon wafer 80.

[0055] like Figure 3As shown, at least two groups of top monitors 21 are provided along the height direction of the film cutting frame 10 and the two groups of top monitors 21 are symmetrically arranged along the center line of the conveyor belt, so as to monitor the width position of the silicon wafer 80 along the conveying direction. It is mainly used to open the top monitor 21 to monitor whether there is a silicon wafer under the cutter when the packaging film enters the film cutting part 100 and is ready for sealing and film cutting, so as to inform the system whether to control the cutter to descend and cut the film.

[0056] At the same time, in order to place the cutter at a position that cannot be monitored from the top, a side monitor 22 for lateral monitoring is provided on the side wall of the film cutting frame 10, and the height of the side monitor 22 is the same as the height of the position of the silicon wafer 80 on the conveyor belt. The side monitor 22 is also used to detect the side of the silicon wafer, that is, to monitor whether there is a silicon wafer 80 in the height direction of the silicon wafer position, so as to control whether the cutter can be lowered.

[0057] With this arrangement of the monitoring assembly 20, the top monitor 21 symmetrically arranged at the top cannot monitor the situation when the sharp corner of the silicon wafer 80 is at the center, such as the silicon wafer 80 at the dotted line position in the figure. That is, the top monitor 21 at this position is prone to a monitoring blind spot, so a top monitor 21 that can illuminate the center line of the conveyor belt must also be arranged on the top of the film cutting frame 10.

[0058] like Figure 4 As shown, three groups of top monitors 21 are provided along the height direction of the film cutting frame 10, the top monitor 21 in the middle position is located on the center line of the width direction of the silicon wafer 80, that is, located at the midline position of the conveyor belt, and the top monitors 21 on the other two sides are symmetrically arranged along the center line of the conveyor belt.

[0059] This is because, when the sharp corner of the silicon wafer 80 is set on the center line of the conveyor belt, such as when the silicon wafer 80 is tilted in the figure, the silicon wafers 80 on both sides of the center line cannot be monitored, but the top monitor 21 at the center position can better monitor the silicon wafer 80 at this position. Therefore, three groups of top monitors 21 are set up, which can monitor not only the position of the silicon wafer placed forward, but also the position of the silicon wafer placed tilted. At this time, the side monitor 21 can still monitor the side of the silicon wafer 80 synchronously, so that when the above three groups of top monitors 21 cannot monitor the silicon wafer and a monitoring blind area occurs, the side monitor 21 can be supplemented to prevent missed judgments.

[0060] Regardless of the arrangement of the structure, all monitors in the monitoring component 20 are through-beam sensors, which are arranged on the outside of the cutter frame 11 and the molybdenum plate frame 12 and away from the side of the plastic film part 200. When any monitor cannot be through-beam, it means that the position of the silicon wafer 80 blocks the light of the through-beam sensor, which means that the position of the stack of silicon wafers is out of position or misaligned. The monitoring component 20 will notify the system of the monitored information. After the system has received the abnormal information, it will directly control the film cutting cylinder 14 to control the cutter frame 11 and the molybdenum plate frame 12 to be located at the initial open position, so that it stops driving, that is, the cutter frame 11 cannot be controlled to move downward. If the position of the silicon wafer 80 is not monitored in time, once the cutter frame 11 and the molybdenum plate frame 12 move toward each other to cut the film, the silicon wafer 80 will be cut and the silicon wafer 80 will be directly scrapped.

[0061] like Figure 1-2 As shown in Figures 6 and 7, an anti-foolproof structure is also provided on the fixed frame 10, that is, a locking member 30 perpendicular to the plate surface is provided on the plate surface where the upper cutting frame 11 is located, so as to timely control the position of the cutting frame 11 and lock the position of the cutting frame 11 to prevent it from falling quickly in case of an abnormal accident.

[0062] Furthermore, the locking member 30 includes a mounting plate 31 fixed to the side of the film cutting frame 10 and a locking cylinder 32 arranged on the mounting plate 31. The locking cylinder 32 is arranged on the side of the mounting plate 31 away from the cutter frame 11 and perpendicular to the plate surface of the cutter frame 11; a locking pin 33 is arranged at the output end of the locking cylinder 31, which cooperates with the locking hole arranged on the plate surface of the cutter frame 11 to fix the position of the cutter and prevent it from falling. The height of the locking member 30 is located at the highest position when the cutter frame 11 and the molybdenum plate frame 12 are opened, and is arranged perpendicular to the plate surface of the cutter frame 11.

[0063] When locking is required, the locking cylinder 32 is notified to drive the locking pin 33 to extend toward the position close to the locking hole, and the locking pin 33 is embedded in the locking hole, so that the cutter frame 11 is completely fixed at the height of its position and will not fall due to the drive of the film cutting cylinder 14. It can also prevent the hand from being pinched or other safety accidents when the position of the silicon wafer 80 is manually adjusted; at the same time, the locking member 30 can also prevent the film cutting cylinder 14 from suddenly working when replacing or adjusting the film, or maintaining and servicing the cutter frame 11 and the molybdenum plate frame 12; it can also prevent the film cutting cylinder 14 from losing control due to human error in operating the film cutting part 100 or system program confusion, and the risk of the cutter frame 11 and the molybdenum plate frame 12 facing each other, resulting in pinching or scalding of the staff, thereby improving the safety and controllability of the operation.

[0064] When the monitoring component 20 does not sound an alarm, it means that the position transmission of the silicon wafer 80 is correct, and the film cutting cylinder 14 drives the cutting knife frame 11 and the molybdenum plate frame 12 to dock with each other, so that the packaging film 83 is cut off, so as to seal and cut the packaging film to obtain good silicon wafers 80; then the conveyor belt is driven to send the packaging film independently carrying the silicon wafer 80 into the furnace body 40 in the thermoplastic part 200.

[0065] like Figure 7 As shown, the thermoplastic part 200 includes a furnace body 40, a thermoplastic belt 50 placed in the furnace body 40, and a thermoplastic motor 60 for driving the thermoplastic belt 50. The thermoplastic belt 50 is a flat mesh belt, and its width is greater than the width of the conveyor belt and is laid flat in the furnace body 40, and is driven to rotate by the thermoplastic motor 60.

[0066] The thermoplastic belt 50 is a mesh conveyor belt made of high-temperature resistant Teflon material. This mesh structure of the thermoplastic belt 50 can not only ensure the stability and consistency of the transmission of the silicon wafer 80, but also will not cause vibrations such as those occurring in chain-type or multi-roller parallel transmission processes. It can ensure that the silicon wafer 80 is smoothly transported during the entire thermoplastic process, and will not cause an up and down fluctuating force on the bubbles to make the silicon wafer loose, nor will it be misaligned or out of place.

[0067] The thermoplastic motor 60 is arranged on the side of the outer wall of the furnace body 40, and can be used to drive the active roller 71 to roll, thereby driving the thermoplastic belt 50 to roll continuously in one direction, so as to drive the packaging film to be closely attached to the surface of the silicon wafer 80 after thermoplasticization, so as to form a packaging film closely attached to the silicon wafer. The thermoplastic motor 60 arranged on the side of the furnace body 40 is not only convenient for maintenance, but also can save the overall space of the mechanism.

[0068] like Figure 8-9 As shown, a transmission assembly 70 for driving the thermoplastic belt 50 to rotate is also provided in the furnace body 40, and includes an active roller 71, a driven roller 72 and an adjustable roller 73. The active roller 71 is connected to the thermoplastic motor 60; the driven roller 72 is arranged at the same height as the active roller 71, so that the side of the thermoplastic belt 50 that drives the silicon wafer to be transmitted is flat and stable; the adjustable roller 73 is located below the active roller 72, and is mainly used to adjust the tension of the thermoplastic belt 50.

[0069] like Figure 8 As shown, there are two adjustable rollers 73, and the thermoplastic belt 50 is fixed by the active roller 71 and the driven roller 72 respectively arranged along the transmission direction of the silicon wafer 80, and the thermoplastic belt 50 is supported by the two adjustable rollers 73 arranged below, forming an inverted trapezoidal transmission structure. Accordingly, the axis of the active roller 71, the driven roller 72 and the adjustable roller 73 can form an inverted trapezoidal structure.

[0070] like Fig. 9As described above, the number of the adjustable roller shaft 73 is one, and the axes of the active roller shaft 71, the driven roller shaft 72 and the adjustable roller shaft 73 are connected to form an isosceles triangle structure.

[0071] Regardless of the connection shape of the structure, the thermoplastic motor 60 always drives the transmission assembly 70 to drive the thermoplastic belt 50 to continuously rotate in one direction along the transmission direction.

[0072] A heater and an exhaust fan are provided in the furnace body 40 . When the sealed packaging film enters the heat preservation furnace cavity, the sealed packaging film expands first and then contracts due to the heat, and is closely attached to the surface of the silicon wafer 80 .

[0073] After the thermoplastic packaging film is removed from the thermoplastic part 200 with the silicon wafer 80, it is moved to the finished product unloading area via a conveyor belt, and then the packaged finished silicon wafer is lifted up by a lifting mechanism, grabbed by a six-axis robot, unloaded and inserted into an EPE box for overall packaging.

[0074] A packaging device is provided with the film sealing mechanism as described above.

[0075] A film sealing mechanism designed by the present application is used to regularize silicon wafers of different shapes and sizes, and can regularize based on the shape requirements of different silicon wafers, identify silicon wafers and automatically adjust, can regularize on one side or on both sides, has a simple structure and is easy to control, has a good and stable regularization effect, and can also ensure the quality of silicon wafers. The present application also proposes a production line equipped with the regularization mechanism.

[0076] The above detailed description of the embodiments of the present application is only a preferred embodiment of the present application and cannot be considered to limit the scope of implementation of the present application. All equivalent changes and improvements made within the scope of the present application should still fall within the scope of the patent coverage of the present application.

Claims

1. A film sealing mechanism, used for packaging films of silicon wafers, characterized in that: At least a film cutting part is configured, which includes a film cutting frame, a cutting knife frame, a molybdenum plate frame, and a monitoring component for monitoring the position of the silicon wafer; The cutting knife frame and the molybdenum plate frame are both movably connected to the film cutting frame; The monitoring component is constructed on the film cutting frame and is located outside the cutting knife, and can monitor the thickness and width of the silicon wafer.

2. A film sealing mechanism according to claim 1, characterized in that: The monitoring assembly includes a plurality of groups of top monitors arranged along the height direction of the film cutting frame, and side monitors arranged along the width direction of the film cutting frame; wherein the top monitors are arranged along the width direction of the silicon wafer.

3. A film sealing mechanism according to claim 2, characterized in that: At least two groups of top monitors are provided along the height direction of the film cutting frame and are symmetrically arranged.

4. A film sealing mechanism according to claim 3, characterized in that: A set of top monitors are also constructed on the width centerline of the silicon wafer.

5. A film sealing mechanism according to claim 2, characterized in that: The height of the side monitor is the same as the height of the silicon wafer.

6. A film sealing mechanism according to any one of claims 1 to 5, characterized in that: Chains for connecting the cutter frame and the molybdenum plate frame are arranged on both sides of the film cutting frame width, and the chains drive the cutter frame and the molybdenum plate frame to move upward and downward toward or away from each other.

7. A film sealing mechanism according to claim 6, characterized in that: The chain is constructed as a ring structure arranged along the height direction of the film cutting frame and cooperates with the gear fixed on the inner side of the film cutting frame.

8. A film sealing mechanism according to claim 7, characterized in that: A film cutting cylinder for driving the chain to rotate is arranged below the film cutting frame, and its output end is connected with the molybdenum plate frame.

9. A film sealing mechanism according to any one of claims 1-5, 7-8, characterized in that: It also includes a locking part constructed on the outside of the cutter frame, which includes a mounting plate arranged on the side of the film cutting frame, and a locking cylinder arranged on the mounting plate. The locking cylinder controls the locking pin arranged at its output end to cooperate with the locking hole on the cutter frame plate surface to lock the cutter position and fix it.

10. A film sealing mechanism according to claim 9, characterized in that: The height of the locking member is located at the highest position when the cutter frame and the molybdenum plate frame are opened, and is arranged perpendicular to the plate surface of the cutter frame.

11. A film sealing mechanism according to claim 1, characterized in that: A thermoplastic part is provided after the film cutting part, which includes a furnace body and a thermoplastic belt placed in the furnace body, wherein the thermoplastic belt is a flat mesh belt, and its width is greater than the width of the silicon wafer conveyor belt and is laid flat in the furnace body.

12. A film sealing mechanism according to claim 11, characterized in that: The invention also comprises a thermoplastic motor for driving the thermoplastic belt to move, and the thermoplastic motor is arranged on the side of the outer wall of the furnace body.

13. A film sealing mechanism according to claim 11 or 12, characterized in that: The furnace body is also provided with a transmission assembly for driving the thermoplastic belt to rotate, including an active roller, a driven roller and an adjustable roller, wherein the active roller is connected to the thermoplastic motor; the axes of the active roller, the driven roller and the adjustable roller are connected to form an inverted trapezoidal structure or a triangle to drive the thermoplastic belt to rotate continuously in one direction.

14. A packaging device, characterized in that: The invention is provided with a film sealing mechanism as described in any one of claims 1 to 13.

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