A robotic liquid cooling circulation system based on semiconductor refrigeration

Abstract

This utility model discloses a robot liquid cooling circulation system based on semiconductor refrigeration, comprising: a heat generation device with a liquid cooling channel for coolant flow; a semiconductor refrigeration module, comprising: a cooling channel for coolant flow, the cooling channel having an inlet pipe and an outlet pipe, the liquid cooling channel being connected to the inlet pipe and the outlet pipe; a semiconductor heat sink, the cold end of the semiconductor heat sink being fitted against the outer wall of the cooling channel; heat dissipation fins, the heat dissipation fins being disposed at the hot end of the semiconductor heat sink; and a fan, the fan being disposed at the air inlet and air outlet of the heat dissipation fins. This utility model can realize the circulation of coolant and efficient cooling to ensure the heat dissipation effect of the coolant, thereby meeting the heat dissipation requirements of the robot and ensuring its working performance.

Description

Technical Field

[0001] This utility model relates to the field of robot refrigeration technology, specifically to a robot liquid cooling circulation system based on semiconductor refrigeration. Background Technology

[0002] With the development and maturation of automation and intelligent technologies, robots, as an important development direction of artificial intelligence and robotics, are gradually moving from the laboratory to practical applications. Compared with ordinary robots, robots are characterized by more compact structures and more interconnected joints. In the use and operation of robots, efficient heat dissipation of robot joints is an important condition for ensuring the normal and efficient operation of robots.

[0003] Robots commonly use natural cooling or air cooling for heat dissipation. Natural cooling is slow and inefficient. Air cooling is limited by the available space, and its cooling capacity depends on the heat flux through the contact surface and the power of the fan. Therefore, it cannot significantly reduce thermal resistance and temperature rise, thus hindering performance improvement. Furthermore, even increasing the heat flux through the contact surface and the power of the fan would result in a significant increase in the robot's weight.

[0004] Of course, in related technologies, robot heat dissipation methods also include internally encapsulated coolant for cooling. However, due to the limited amount of internally encapsulated coolant, the heat absorbed by the coolant is difficult to dissipate during long-term operation, resulting in a significant decrease in heat dissipation effect and thus greatly affecting working performance. Utility Model Content

[0005] The purpose of this invention is to disclose a robot liquid cooling circulation system based on semiconductor refrigeration, which can realize the circulation of coolant and efficient cooling to ensure the heat dissipation effect of coolant, thereby meeting the heat dissipation requirements of the robot and ensuring its working performance.

[0006] To achieve the above objectives, this utility model discloses a robot liquid cooling circulation system based on semiconductor refrigeration, comprising:

[0007] The heat-generating device is equipped with a liquid-cooled cavity for the flow of coolant.

[0008] Semiconductor cooling module, comprising:

[0009] A cooling chamber for coolant flow, the cooling chamber is provided with an inlet pipe and an outlet pipe, and the liquid cooling chamber is connected to the inlet pipe and the outlet pipe.

[0010] A semiconductor heat sink, wherein the cold end of the semiconductor heat sink is fitted to the outer wall of the cooling cavity;

[0011] Heat dissipation fins are located at the hot end of the semiconductor heat sink.

[0012] The fan is located at both the air inlet and air outlet of the heat sink fins.

[0013] As an optional implementation, the inlet pipe and the outlet pipe are respectively located at opposite ends of the cooling cavity.

[0014] As an optional implementation, the cooling channel includes at least two cooling channels, and / or a spirally extending cooling channel, and / or a cooling channel that bends multiple times along its extension direction to form a wave shape, and / or a cooling channel that bends multiple times and closes at both ends to form a star shape. The liquid inlet end of the cooling channel is connected to a liquid inlet pipe, and the liquid outlet end of the cooling channel is connected to a liquid outlet pipe.

[0015] As an optional implementation, the cooling channel has at least two levels, and the at least two levels of cooling channels are connected in sequence. The outer wall of each cooling channel is attached to the cold end of the semiconductor heat sink. The hot end of each semiconductor heat sink is provided with heat dissipation fins, and the air inlet and outlet ends of the heat dissipation fins are provided with fans.

[0016] As an optional implementation, adjacent cooling cavities are spaced apart and connected by pipes.

[0017] As an optional implementation, at least two cooling channels are U-shaped structures, and at least two cooling channels are arranged in a series of intervals from the inside out and connected by pipes.

[0018] As an optional implementation, an insulating space for filling with insulating material is provided between two adjacent cooling channels.

[0019] As an optional implementation, each stage of the loop-shaped cooling channel has two opposite long channels and two opposite short channels. The coolant inlet and coolant outlet of the cooling channel are respectively provided with two opposite short channels and are arranged opposite to each other. The inlet pipe is located in the short channel of the outermost stage of the cooling channel, and the outlet pipe is located in the short channel of the innermost stage of the cooling channel.

[0020] As an optional implementation, the cooling channel includes a first-level cooling channel, a second-level cooling channel, and a third-level cooling channel arranged in a ring from the inside out. The outer cavity wall of the first-level cooling channel away from the second-level cooling channel, the outer cavity wall of the second-level cooling channel away from the third-level cooling channel, and the outer cavity wall of the third-level cooling channel are all attached to the cold end of the semiconductor heat sink. Each semiconductor heat sink has heat dissipation fins at its hot end, and both the air inlet and air outlet ends of the heat dissipation fins are equipped with fans.

[0021] As an optional implementation, the heat-generating device is provided with at least one semiconductor refrigeration module that is one-to-one adapted to the heat-generating device, or at least two liquid cooling cavities of the heat-generating devices are connected in parallel and / or in series and connected to the semiconductor refrigeration module. The heat-generating device and the semiconductor refrigeration module are directly connected or connected through a magnetic refrigeration module, and the power for the flow of coolant between the semiconductor refrigeration module and the heat-generating device is provided by a liquid pump.

[0022] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0023] (1) When the coolant flows in the cooling cavity of the semiconductor refrigeration module, the cold end of the semiconductor heat sink can absorb the heat of the coolant to cool it down and transfer the heat to the hot end of the semiconductor heat sink. Then, with the help of heat sink fins and fan, the heat of the hot end of the semiconductor heat sink can be quickly carried away by the air blowing over the heat sink fins to improve the heat dissipation effect of the semiconductor refrigeration module, thereby ensuring that the coolant can be cooled down efficiently.

[0024] (2) The heat-generating device and the semiconductor refrigeration module inside the robot constitute a liquid cooling circulation system, which enables the circulation of coolant. The low-temperature coolant is delivered to the heat-generating device to absorb heat and dissipate it, and the high-temperature coolant after absorbing heat is delivered to the semiconductor refrigeration module for rapid cooling. In this way, during the long-term operation of the heat-generating device, the coolant can absorb the heat from the heat-generating device in a timely manner and dissipate it through the semiconductor refrigeration module, thereby ensuring the heat dissipation efficiency of the heat-generating device and improving the working performance and lifespan of the robot. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the semiconductor cooling module of this utility model;

[0027] Figure 2 This is a first-view cross-sectional view of the semiconductor cooling module of this utility model;

[0028] Figure 3 This is a cross-sectional view of the semiconductor cooling module of this utility model from a second perspective;

[0029] Figure 4 This is an exploded view of the semiconductor refrigeration module with three-stage cooling channels of this utility model;

[0030] Figure 5This is an exploded view of the first-stage cooling cavity and its heat dissipation structure of this utility model;

[0031] Figure 6 This is an exploded view of the second-stage cooling cavity and its heat dissipation structure of this utility model;

[0032] Figure 7 This is an exploded view of the third-stage cooling cavity and its heat dissipation structure of this utility model;

[0033] Figure 8 This is a connection structure diagram of the three-stage cooling channel of this utility model;

[0034] Figure 9 This is a schematic diagram of the structure of the robot liquid cooling circulation system based on semiconductor refrigeration according to this utility model;

[0035] Figure 10 This is a schematic diagram of the parallel liquid cooling circulation system of the robot of this utility model;

[0036] Figure 11 This is a schematic diagram of the liquid cooling circulation system of the robot of this utility model, in which the heat-generating devices are connected in series.

[0037] Explanation of key figure labels:

[0038] 1. Cooling chamber; 11. Liquid inlet pipe; 12. Liquid outlet pipe; 13. Cooling flow channel; 2. Semiconductor heat sink; 3. Heat dissipation fins; 4. Fan; 5. Pipe; 6. Insulated space; 7. Liquid pump; 10. First-stage cooling chamber; 20. Second-stage cooling chamber; 30. Third-stage cooling chamber; 100. Semiconductor refrigeration module; 200. Heat generation device; 201. Robot arm joint motor; 202. Robot head motor; 203. Robot battery; 204. Robot leg joint motor. Detailed Implementation

[0039] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0040] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0041] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0042] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.

[0043] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0044] The technical solution of this utility model will be further described below with reference to the embodiments and accompanying drawings.

[0045] See Figure 1-2 and Figure 9-11 This application provides a robot liquid cooling circulation system based on semiconductor refrigeration, including: a semiconductor refrigeration module 100 and a heat generation device 200. The heat generation device 200 is provided with a liquid cooling channel for coolant flow. The semiconductor refrigeration module 100 includes a cooling channel 1, a semiconductor heat sink 2, heat dissipation fins 3 and a fan 4.

[0046] Cooling cavity 1 is used for the flow of coolant. Cooling cavity 1 is provided with inlet pipe 11 and outlet pipe 12. The liquid cooling cavity is connected to inlet pipe 11 and outlet pipe 12. The cold end of semiconductor heat sink 2 is attached to the outer wall of cooling cavity 1. Heat dissipation fins 3 are provided at the hot end of semiconductor heat sink 2. Fan 4 is provided at the air inlet and air outlet of heat dissipation fins 3.

[0047] The heat-generating device 200 is primarily used in areas of the robot that experience frequent movement and friction during operation. These areas generate significant heat and require timely cooling to prevent overheating from affecting structural function. The heat-generating device 200 includes, but is not limited to, robot arm joint motors 201, robot head motors 202, robot battery 203, robot leg joint motors 204, dexterous hand motors, robot actuators, robot controllers, and robot cameras. The robot arm joint motors 201, robot head motors 202, and robot leg joint motors 204 are the motors that drive the robot's arm, head, and legs. The robot battery 30 provides power for the robot's operation. The robot dexterous hand motors drive the robot's operation and are in a state of continuous discharge during operation, resulting in prolonged operation and significant heat generation. To facilitate rotation, swinging, and walking movements, various types of motors are used in robots, including internal rotor motors, external rotor motors, and linear motors, all of which generate heat during operation.

[0048] In this embodiment, the aforementioned heat-generating device 200 can be equipped with a liquid-cooled cavity for coolant flow, connecting to the semiconductor refrigeration module 100, thereby utilizing the semiconductor refrigeration module 100 to dissipate heat and cool the robot's heat-generating device 200. The inlet pipe 11 is used for high-temperature coolant to flow into the cooling cavity 1, and the outlet pipe 12 is used for low-temperature coolant to flow out of the cooling cavity 1. After the high-temperature coolant enters the cooling cavity 1, its heat is absorbed by the cold end of the semiconductor heat sink 2 during its flow, thus cooling the coolant and resulting in low-temperature coolant flowing out of the outlet pipe 12. The heat absorbed by the cold end of the semiconductor heat sink 2 is transferred to the hot end. During the long-term cooling process of the coolant in the cooling cavity 1 by the semiconductor heat sink 2, due to the large amount of heat absorbed, the heat dissipation from the hot end of the semiconductor heat sink 2 gradually slows down, which affects the cooling effect of the cold end of the semiconductor heat sink 2 on the coolant. In this embodiment, heat dissipation fins 3 are attached to the hot end of the semiconductor heat sink 2, and fans 4 are provided at both the air inlet and air outlet of the heat dissipation fins 3. This allows the air to blow over the heat dissipation fins 3 to remove the heat from the hot end of the semiconductor heat sink 2, accelerate the transfer of heat absorbed by the cold end of the semiconductor heat sink 2 to the hot end and the heat dissipation of the hot end, thereby achieving efficient heat dissipation when the coolant flows in the cooling channel 1.

[0049] Thus, when the coolant flows within the cooling channel 1 of the semiconductor cooling module 100, the cold end of the semiconductor heat sink 2 absorbs heat from the coolant to cool it down, and transfers the heat to the hot end of the semiconductor heat sink 2. Then, with the assistance of the heat dissipation fins 3 and the fan 4, the airflow over the heat dissipation fins 3 quickly removes the heat from the hot end of the semiconductor heat sink 2, improving the heat dissipation effect of the semiconductor cooling module 100 and ensuring efficient cooling of the coolant. Based on this, the robot's heat generation device 200 and the semiconductor cooling module 100 constitute a liquid cooling circulation system, enabling the circulation of the coolant. Low-temperature coolant is delivered to the heat generation device 200 to absorb heat and dissipate it, while the high-temperature coolant after heat absorption is delivered to the semiconductor cooling module 100 for rapid cooling. Thus, during the long-term operation of the heat generation device 200, the coolant can promptly absorb heat from the heat generation device 200 and dissipate it through the semiconductor cooling module 100, ensuring the heat dissipation efficiency of the heat generation device 200 and improving the robot's working performance and lifespan.

[0050] It is worth noting that the embodiments of this application and Figure 10-11 Taking humanoid robots as an example, in practical applications, ordinary industrial robots, robotic arms, and robots of other shapes or uses, such as robotic dogs, home robots, medical robots, agricultural robots, aerospace robots, and educational and scientific research robots, can all use this liquid cooling circulation system as long as they have heat dissipation requirements.

[0051] The cooling cavity 1 can be a tubular structure, a prismatic structure, or a closed annular structure, etc. The cold end of the semiconductor heat sink 2 is fitted to the cooling cavity 1, meaning the shape of the semiconductor heat sink 2 is adapted to the outer wall of the cooling cavity 1, thereby improving the efficiency of the cold end of the semiconductor heat sink 2 in absorbing heat from the coolant in the cooling cavity 1. The heat dissipation fins 3 can be fitted to the hot end of the semiconductor heat sink 2 to improve the heat dissipation effect of the hot end of the semiconductor heat sink 2, thus ensuring efficient heat dissipation and cooling of the coolant during its flow. (See also...) Figure 3 In this embodiment, the cooling cavity 1 is described using a square tubular structure as an example. Its outer cavity wall is rectangular, which facilitates the placement of the semiconductor heat sink 2 and the heat dissipation fins 3 and simplifies the manufacturing process. To ensure heat dissipation, the semiconductor heat sink 2 can be placed at any position on the outer cavity wall of the cooling cavity 1, and each semiconductor heat sink 2 is equipped with heat dissipation fins 3 and a fan 4.

[0052] In one or more embodiments, see Figure 3The inlet pipe 11 and the outlet pipe 12 are respectively located at opposite ends of the cooling cavity 1. Regardless of whether the cooling cavity 1 is a long strip structure, a closed structure or other irregular structure, the inlet pipe 11 and the outlet pipe 12 being located at opposite ends can ensure a sufficiently long flow path for the coolant to guarantee the cooling effect of the coolant.

[0053] In one or more embodiments, see Figure 3 The cooling channel 1 includes at least two cooling channels 13, and / or a spirally extending cooling channel 13, and / or a cooling channel 13 that is bent multiple times along its extension direction to form a wave shape, and / or a cooling channel 13 that is bent multiple times and closed at both ends to form a star shape. The liquid inlet end of the cooling channel 13 is connected to the liquid inlet pipe 11, and the liquid outlet end of the cooling channel 13 is connected to the liquid outlet pipe 12.

[0054] At least two cooling channels 13 are arranged in parallel. After the coolant enters the cooling chamber 1 through the inlet pipe 11, it flows separately within the at least two cooling channels 13 and is cooled by the semiconductor heat sink 2 and its auxiliary structure, the heat dissipation fins 3, and the fan 4. Then, it converges and flows out through the outlet pipe 12. By splitting the coolant flow, the heat dissipation efficiency of the coolant is improved. Of course, the cooling channel 13 can also be configured as a single spiral, wave, or star shape. The flow path of the coolant is extended by the spiral or bending structure to improve the cooling effect of the coolant without significantly increasing the volume of the cooling chamber 1, thus ensuring a smaller footprint. It should be noted that when there is only one cooling channel 13, it can be a long strip, spiral, wave, or star shape, or a combination of two or more shapes. When there are two or more cooling channels 13, they can also be one of the long strip, spiral, wave, or star shapes, or a combination of two or more shapes. The shape of the cooling channel 13 is determined by the cooling requirements of the coolant and the space available for the cooling cavity 1, and its shape can be changed arbitrarily.

[0055] For example, in this embodiment, the cooling cavity 1 can be a square tubular U-shaped structure, with an inlet pipe 11 and an outlet pipe 12 at both ends of the long side of the U-shaped structure, thereby dividing the cooling cavity 1 into two cooling channels 13 so that the coolant flows in two parts to ensure the cooling effect. Of course, in practical applications, the shape of the cooling cavity 1 and the number of cooling channels 13 can be reasonably adjusted as needed, but the principle is basically the same.

[0056] Generally, the cooling channel 1 has one stage, that is, one section of the cooling channel 1 for coolant flow. This is sufficient for situations where the coolant volume is small or the temperature is low. However, its cooling effect is poor when the coolant temperature is high or the coolant volume is large. Based on this, in one or more embodiments, see [reference needed]. Figure 4-8The cooling cavity 1 is provided with at least two levels, and the at least two levels of cooling cavity 1 are connected in sequence. The outer cavity wall of each cooling cavity 1 is attached to the cold end of the semiconductor heat sink 2. The hot end of each semiconductor heat sink 2 is provided with heat dissipation fins 3, and the air inlet and outlet ends of the heat dissipation fins 3 are both provided with fans 4.

[0057] The cooling channel 1 has at least two stages, meaning it has at least two sections, which increases the total length of the cooling channel 1 and thus extends the flow path of the coolant. Since each stage of the cooling channel 1 is equipped with a semiconductor heat sink 2 and its auxiliary structures, heat dissipation fins 3 and a fan 4, it ensures that the coolant is continuously cooled and dissipated during its flow, thereby guaranteeing the cooling effect of the coolant.

[0058] The cooling cavities 1 at each level can be directly connected or arranged side by side. In one or more embodiments, adjacent cooling cavities 1 are spaced apart and connected by pipes 5. The spaced-apart arrangement of adjacent cooling cavities 1 can avoid heat exchange between adjacent cooling cavities 1, especially for cooling cavities 1 arranged side by side, thereby ensuring that the coolant is always in a state of cooling and heat dissipation during the flow process.

[0059] Based on this, at least two stages of cooling channels 1 are of a U-shape structure, and at least two stages of cooling channels 1 are arranged in a series of intervals from the inside out and connected by pipes 5. The U-shape structure of the cooling channels 1, with each stage arranged in a series, can appropriately increase the number of stages of the cooling channels 1 and reduce the space occupied. At the same time, the U-shape structure can also be used to extend the length of the cooling channels 1 or increase the number of cooling channels 13 to improve the cooling effect of the coolant.

[0060] In one or more embodiments, each stage of the U-shaped cooling channel 1 has two opposing long channels and two opposing short channels. The coolant inlet and coolant outlet of the cooling channel 1 are respectively provided with two opposing short channels and are arranged opposite each other. The inlet pipe 11 is located in the short channel of the outermost stage of the cooling channel 1, and the outlet pipe 12 is located in the short channel of the innermost stage of the cooling channel 1. The U-shaped structure, combined with the opposing arrangement of the coolant inlet and coolant outlet with the two short channels, can divide each stage of the cooling channel 1 into two cooling flow channels 13, and appropriately extend the length of each cooling flow channel 13, thereby realizing the long-distance flow and cooling of the coolant, which is beneficial to improving the heat dissipation effect of the coolant. Furthermore, the inlet pipe 11 is located at the outermost perimeter, and the outlet pipe 12 is located at the innermost perimeter. The outermost cooling cavity 1 is relatively long, which can provide sufficient cooling space for the initially high-temperature coolant. As the coolant flows inward, the cooling cavity 1 gradually becomes shorter, and the temperature of the coolant also gradually decreases. This reduces the heat dissipation pressure on the innermost cooling cavity 1 and its configured semiconductor heat sink 2, heat dissipation fins 3, and fan 4 until the low-temperature coolant flows out from the innermost outlet pipe 12. This helps to reduce the heat dissipation pressure on the semiconductor cooling module 100 and ensure the cooling effect of the coolant.

[0061] In one or more embodiments, a heat-insulating space 6 for filling with heat-insulating material is provided between two adjacent cooling channels 1. The heat-insulating space 6 may be filled with heat-insulating materials such as heat-insulating cotton to prevent heat exchange between the cooling channels 1 during the flow of coolant, so as to ensure the heat dissipation effect of the coolant.

[0062] In this embodiment, the cooling cavity 1 includes a first-level cooling cavity 10, a second-level cooling cavity 20, and a third-level cooling cavity 30 arranged from the inside out. The outer cavity wall of the first-level cooling cavity 10 away from the second-level cooling cavity 20, the outer cavity wall of the second-level cooling cavity 20 away from the third-level cooling cavity 30, and the outer cavity wall of the third-level cooling cavity 30 are all attached to the cold end of the semiconductor heat sink 2. The hot end of each semiconductor heat sink 2 is provided with heat dissipation fins 3, and the air inlet and outlet ends of the heat dissipation fins 3 are provided with fans 4.

[0063] The cooling chamber 1 has three stages, which ensures effective cooling of the coolant while minimizing space requirements. Since the third-stage cooling chamber 30 is located on the outermost perimeter, it is larger and has the highest coolant temperature. Therefore, semiconductor heat sinks 2, auxiliary cooling fins 3, and fans 4 can be installed on both the outer walls and the front walls of the third-stage cooling chamber 30. The second-stage cooling chamber 20 and the first-stage cooling chamber 10 are located on the inner perimeter, are smaller in size, have less space for the insulation space 6, and their coolant temperature has already decreased. Therefore, semiconductor heat sinks 2, auxiliary cooling fins 3, and fans 4 can be installed only on the outer walls (front walls) of the second-stage cooling chamber 20 and the first-stage cooling chamber 10. In this way, the semiconductor cooling module 100 achieves efficient coolant cooling while occupying less space.

[0064] Based on this, combined Figure 1-8 The cooling principle of the semiconductor cooling module 100 in this application embodiment is as follows:

[0065] Coolant enters the third-stage cooling chamber 30 through the inlet pipe 11. During its flow through the two cooling channels 13, the semiconductor heat sinks 2 on the outer wall of the third-stage cooling chamber 30, along with their auxiliary structures (heat sinks 3 and fans 4), rapidly cool the coolant. Then, it flows into the second-stage cooling chamber 20 through the pipe 5. During its flow through the two cooling channels 13, the semiconductor heat sinks 2 on the outer wall of the second-stage cooling chamber 20, along with their auxiliary structures (heat sinks 3 and fans 4), cool the coolant relatively quickly. Next, it flows into the first-stage cooling chamber 10 through the pipe 5. During its flow through the two cooling channels 13, the semiconductor heat sinks 2 on the outer wall of the first-stage cooling chamber 10, along with their auxiliary structures (heat sinks 3 and fans 4), cool the coolant, resulting in low-temperature coolant that flows out through the outlet pipe 12. This process achieves efficient cooling of the coolant.

[0066] Based on the above structure, see [link / reference] Figure 10 and Figure 11 In this embodiment of the application, the heat-generating device 200 is provided with at least one semiconductor cooling module 100 that is adapted to the heat-generating device 200 one-to-one, or the liquid cooling channels of at least two heat-generating devices 200 are connected in parallel and / or in series and connected to the semiconductor cooling module 100. The heat-generating device 200 and the semiconductor cooling module 100 are directly connected or connected through a magnetic cooling module, and the power for the flow of coolant between the semiconductor cooling module 100 and the heat-generating device 200 is provided by the liquid pump 7.

[0067] Since the robot's heat generation device 200 includes, but is not limited to, robot arm joint motor 201, robot head motor 202, robot battery 203, robot leg joint motor 204, dexterous hand motor, robot driver, robot controller, robot camera, internal rotor motor, external rotor motor and linear motor, etc., these heat generation devices 200 can all be equipped with liquid cooling channels. Each liquid cooling channel can be equipped with a semiconductor cooling module 100 for independent circulation and cooling of the coolant. Two or more liquid cooling channels can also be connected in series and / or in parallel to share a semiconductor cooling module 100 for independent circulation and cooling of the coolant. Of course, whether the semiconductor cooling module 100 and the heat generating device 200 are configured independently on a one-to-one basis, or whether two or more heat generating devices 200 are connected in series and / or in parallel and then configured with a semiconductor cooling module 100, the semiconductor cooling module 100 and the heat generating device 200 can be directly connected to each other so that the semiconductor cooling module 100 can directly dissipate heat and cool down the coolant flowing out of the heat generating device 200; or a magnetic cooling module can be set between the semiconductor cooling module 100 and the heat generating device 200, so that the magnetic cooling module can dissipate heat and cool down the coolant flowing out of the heat generating device 200, and the semiconductor cooling module 100 is used to dissipate heat from the magnetic cooling module.

[0068] Regardless of the connection structure used between the heat-generating device 200 and the semiconductor refrigeration module 100, the flow of coolant can be powered by the liquid pump 7. The liquid pump 7 can be configured independently, in parallel, or in series, depending on the connection structure. A one-to-one connection between the semiconductor refrigeration module 100 and the heat-generating device 200 provides highly efficient heat dissipation and cooling. Connecting the liquid cooling channels of at least two heat-generating devices 200 in parallel and directly or via a magnetic refrigeration module simplifies the structure of the liquid cooling circulation system and ensures that the liquid pumps 7 can be independently controlled, enabling on-demand heat dissipation and cooling of each heat-generating device 200 on the robot. Connecting the liquid cooling channels of at least two heat-generating devices 200 in series and directly or via a magnetic refrigeration module allows for timely cooling of each heat-generating device 200, simplifies the liquid cooling network, and reduces the control requirements of the liquid cooling circulation. Of course, in practical applications, two or three of the one-to-one, series, and parallel connection structures can be combined, depending on the cooling requirements.

[0069] In this embodiment, the example of a semiconductor cooling module 100 being directly connected to a heat-generating device 200 is used for illustration.

[0070] Its working principle is as follows:

[0071] Low-temperature coolant enters the liquid-cooled cavity of the heat-generating device 200, absorbing heat to cool the device. The heated coolant, driven by the liquid pump 7, then flows from the inlet pipe 11 into the third-stage cooling cavity 30. During the flow through the two cooling channels 13, the outer walls of the third-stage cooling cavity 30, including the sidewalls and facewalls, are adorned with semiconductor heat sinks 2 and their auxiliary structures, heat dissipation fins 3 and a fan 4, which rapidly cool the coolant. Then, the coolant flows through the pipe 5 into the second-stage cooling cavity 20. During the flow through the two cooling channels 13, the... The semiconductor heat sink 2 on the outer wall of the secondary cooling chamber 20, along with its auxiliary cooling fins 3 and fan 4, rapidly cools the coolant. Then, the coolant flows into the first-stage cooling chamber 10 via pipe 5. During the flow through the two cooling channels 13, the semiconductor heat sink 2 on the outer wall of the first-stage cooling chamber 10, along with its auxiliary cooling fins 3 and fan 4, further cools the coolant, resulting in a low-temperature coolant that flows out from the outlet pipe 12 and then into the liquid-cooled chamber of the heat-generating device 200 to continue cooling the device. In this way, the circulating liquid cooling of the heat-generating device 200 is completed.

[0072] The above provides a detailed description of a semiconductor-based liquid cooling circulation system for robots, as disclosed in the embodiments of this utility model. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The descriptions of the embodiments above are only for the purpose of helping to understand the semiconductor-based liquid cooling circulation system for robots and its core ideas. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A robotic liquid cooling circulation system based on semiconductor refrigeration, characterized in that, include: A heat-generating device, wherein the heat-generating device is provided with a liquid-cooled cavity for the flow of coolant; Semiconductor cooling module, comprising: A cooling chamber for coolant flow, the cooling chamber having an inlet pipe and an outlet pipe, the liquid cooling chamber being connected to the inlet pipe and the outlet pipe; A semiconductor heat sink, wherein the cold end of the semiconductor heat sink is attached to the outer wall of the cooling cavity; Heat dissipation fins, wherein the heat dissipation fins are disposed at the hot end of the semiconductor heat sink; A fan is provided at the air inlet and air outlet of the heat sink fins.

2. The robot liquid cooling circulation system based on semiconductor refrigeration according to claim 1, characterized in that: The inlet pipe and the outlet pipe are respectively located at opposite ends of the cooling cavity.

3. The robot liquid cooling circulation system based on semiconductor refrigeration according to claim 1, characterized in that: The cooling channel includes at least two cooling channels, and / or a spirally extending cooling channel, and / or a cooling channel that bends multiple times along its extension direction to form a wave shape, and / or a cooling channel that bends multiple times and closes at both ends to form a star shape. The liquid inlet end of the cooling channel is connected to the liquid inlet pipe, and the liquid outlet end of the cooling channel is connected to the liquid outlet pipe.

4. The robot liquid cooling circulation system based on semiconductor refrigeration according to any one of claims 1-3, characterized in that: The cooling channel has at least two levels, and the at least two levels of the cooling channel are connected in sequence. The outer wall of each level of the cooling channel is attached to the cold end of the semiconductor heat sink. The hot end of each semiconductor heat sink is provided with the heat dissipation fins, and the air inlet and outlet ends of the heat dissipation fins are both provided with the fan.

5. The robot liquid cooling circulation system based on semiconductor refrigeration according to claim 4, characterized in that: The cooling cavities of two adjacent stages are spaced apart and connected by pipes.

6. The robot liquid cooling circulation system based on semiconductor refrigeration according to claim 5, characterized in that: At least two of the cooling channels are U-shaped structures, and the at least two cooling channels are arranged in a series of intervals from the inside to the outside and are connected by the pipe.

7. The robot liquid cooling circulation system based on semiconductor refrigeration according to claim 6, characterized in that: A heat insulation space for filling with heat insulation material is provided between two adjacent cooling channels.

8. The robot liquid cooling circulation system based on semiconductor refrigeration according to claim 6, characterized in that: Each stage of the U-shaped structure has two opposite long channels and two opposite short channels in the cooling cavity. The coolant inlet and coolant outlet of the cooling cavity are respectively provided with two opposite short channels and are arranged opposite each other. The inlet pipe is located in the short channel of the outermost stage of the cooling cavity, and the outlet pipe is located in the short channel of the innermost stage of the cooling cavity.

9. The robot liquid cooling circulation system based on semiconductor refrigeration according to claim 6, characterized in that: The cooling channel includes a first-level cooling channel, a second-level cooling channel, and a third-level cooling channel arranged from the inside out. The outer wall of the first-level cooling channel away from the second-level cooling channel, the outer wall of the second-level cooling channel away from the third-level cooling channel, and the outer wall of the third-level cooling channel are all attached to the cold end of the semiconductor heat sink. The hot end of each semiconductor heat sink is provided with the heat dissipation fins, and the air inlet and outlet ends of the heat dissipation fins are both provided with the fan.

10. The robot liquid cooling circulation system based on semiconductor refrigeration according to any one of claims 1-3, characterized in that: The heat-generating device is provided with at least one of the semiconductor refrigeration modules that are adapted to the heat-generating device one-to-one, or at least two of the heat-generating devices are connected in parallel and / or in series with the semiconductor refrigeration module. The heat-generating device and the semiconductor refrigeration module are directly connected or connected through a magnetic refrigeration module, and a liquid pump provides the power for the flow of coolant between the semiconductor refrigeration module and the heat-generating device.

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