Low temperature curing silicone ink, preparation method and application

A silicone ink, low temperature technology, applied in the direction of ink, application, household utensils, etc., can solve the problems of narrow application materials, high curing temperature, etc., and achieve the effect of increasing adhesion, low curing temperature and excellent wrapping property

CN107760098BActive Publication Date: 2020-12-22HUNAN SOKAN NEW MATERIAL
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2020-12-22

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Abstract

The invention discloses low temperature curing silicone printing ink. The low temperature curing silicone printing ink comprises, by weight, 40-60 parts of methylvinyl organosilicon resin, 3-10 partsof methylphenyl organosilicon resin, 5-10 parts of hydrogen-containing silicone oil, 0.2-2 parts of an inhibitor, 0.2-2 parts of a siloxane coupling agent, 5-10 parts of white carbon black, 5-15 partsof an organic pigment, 10-30 parts of an organic solvent and 1-5 parts of a metal catalyst, wherein molecular weight of the methylvinyl organosilicon resin is 30-50 thousands, and molecular weight ofthe methylphenyl organosilicon resin is 50-100 thousands.
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Description

technical field

[0001] The invention relates to the field of silicone ink printing, in particular to a low-temperature curing silicone ink. In addition, the present invention also relates to a preparation method and application of the above-mentioned low-temperature curing silicone ink. Background technique

[0002] Soft materials such as LSR, TPU, TPE, TPEE, TPSiV are more and more popular due to their excellent insulation, weather resistance, water repellency, moisture resistance and environmental protection. It is widely used in aerospace, electrical, electronic, electrical appliances, chemical industry, construction, automobile, instrumentation, machinery, medical and health care, and daily life. The silicone coatings on the market are all used for large-area spraying, and are not suitable for small-area decoration. Most of the silicone inks used for small-area decoration on the market are cured at 150-200°C. At the same time, with the development of lamination technolo...

Examples

preparation example Construction

[0046] Another aspect of the present invention provides a method for preparing the above-mentioned low-temperature curing silicone ink, comprising the following steps:

[0047] Add methyl vinyl silicone resin, methyl phenyl silicone resin, and hydrogen-containing silicone oil into the dispersion container, stir at 600-1000 rpm for 5-10 minutes, then add white carbon black and organic pigments, and stir at 1200 Stir at ~2000 rpm for 20-30 minutes, then add the inhibitor and siloxane coupling agent, and stir at 400-800 rpm for 5-10 minutes to obtain a mixture.

[0048] The mixture was ground to a fineness <10um.

[0049] The metal catalyst is added to the ground mixture, and the low-temperature curing silicone ink is obtained after stirring at 600-800 rpm for 5-6 minutes.

[0050] White carbon black and organic pigments are slowly added while stirring. A disperser can be used to stir and disperse. Under the above conditions, the white carbon black, organic pigments, and organi...

Embodiment 1~5

[0063] The preparation method of embodiment 1~5 silica gel ink is as follows:

[0064] (1) Add methyl vinyl silicone resin, methyl phenyl silicone resin, and hydrogen-containing silicone oil into the dispersion container, stir at 600-1000 rpm for 5-10 minutes, then slowly add white carbon black while dispersing , and organic dyes, stirring at 1200-2000 rpm for 20-30 minutes, finally adding inhibitor and siloxane coupling agent, stirring at 400-800 rpm for 5-10 minutes.

[0065] (2) Grind the mixture 3 to 4 times with a three-roll machine to ensure that the fineness of the ink is less than 10um.

[0066] (3) Pre-mixing: add a metal catalyst to the above mixture, and stir at 600-800 rpm for 5-6 minutes to obtain the ink product.

[0067] Coating and curing method of the silicone coating in Examples 1-5: screen-print the silicone ink prepared in Examples 1-5 on the LSR substrate, the coating film thickness is 8 microns, and bake in an oven at 90°C for 20 minutes.

[0068] The f...