Display motherboard, display substrate and display device

Abstract

The present invention provides a display motherboard and a preparation method thereof, and a display device, which belong to the field of display technology. The display motherboard of the present invention is used to cut along a cutting line to form a display substrate, and the display motherboard has a display area and a non-display area; the display motherboard includes: a substrate, an OLED device arranged at a position on the substrate and corresponding to the display area, and an encapsulation layer covering the layer where the OLED device is located; it is characterized in that the display motherboard also includes: a partition component arranged in the non-display area and corresponding to the cutting line; wherein the partition component is located between the substrate and the encapsulation layer, so that the encapsulation layer breaks between the display area and the cutting line. Therefore, when the display panel is cut along the cutting area later, the cracks generated in the encapsulation layer will not be transmitted to the display area, thereby effectively improving the reliability of the display motherboard.

Description

Technical Field

[0001] The present invention belongs to the field of display technology, and in particular relates to a display motherboard, a display substrate and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) devices have become the next generation display technology with great competitiveness and development prospects due to their advantages such as all-solid-state structure, high brightness, full viewing angle, fast response speed, wide operating temperature range, and flexible display.

[0003] An OLED device is arranged on the display motherboard (the OLED device includes a first electrode, an organic functional layer, and a second electrode). The organic light-emitting material and cathode material in the OLED device are particularly sensitive to water and oxygen. Excessive moisture or high oxygen content will affect the service life of the OLED device. In order to achieve a longer service life, the permeability of water and oxygen is usually required to be less than 5×10 -6 g / m 2 .day and 10 -3 m 3 / m 2 .day, which puts higher requirements on the encapsulation of OLED devices. Therefore, when OLED devices are used in display panels, it is necessary to form at least an encapsulation layer on the layer where the OLED devices are located to encapsulate the OLED devices to prevent water and oxygen from penetrating into the OLED devices and affecting the service life of the OLED devices. However, when the display panel is cut, the encapsulation layer is easily shredded, and the cracks generated on the encapsulation layer are easily spread to the display area of ​​the display panel, causing the OLED devices to be unable to be well encapsulated, resulting in poor reliability of the display panel. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art and provides a display motherboard, a display substrate and a display device, which are used to at least partially reduce the problem of the packaging layer being broken and the cracks being transmitted to the display area when the display motherboard is cut.

[0005] The technical solution adopted to solve the technical problem of the present invention is a display motherboard, which is used to form a display substrate by cutting along a cutting line, wherein the display motherboard has a display area and a non-display area; the display motherboard comprises: a substrate, an OLED device arranged at a position corresponding to the display area on the substrate, and an encapsulation layer covering the layer where the OLED device is located; the display motherboard further comprises: a separation component arranged in the non-display area and corresponding to the cutting line; wherein,

[0006] The partition component is located between the substrate and the encapsulation layer to cause the encapsulation layer to break between the display area and the cutting line.

[0007] Preferably, the partition component is arranged between the cutting line and the display area.

[0008] Preferably, the partition assembly has a bottom edge close to the base and a top edge away from the base along a first cross section perpendicular to its extension direction;

[0009] The orthographic projection of the top edge on the base is a first projection, and the first projection includes a first endpoint and a second endpoint;

[0010] The orthographic projection of the bottom edge on the base is a second projection, and the second projection includes a third endpoint and a fourth endpoint;

[0011] The third endpoint and / or the fourth endpoint is / are within the range of the first projection.

[0012] It is further preferred that the first cross section further comprises a first side edge and a second side edge which are arranged opposite to each other and connected between the top edge and the bottom edge; wherein,

[0013] The top edge is parallel to the base;

[0014] The included angle between the top edge and the first side edge in the first cross section is less than 90°, and / or,

[0015] An included angle between the top edge and the second side edge in the first cross section is less than 90°.

[0016] Preferably, the orthographic projection of the bottom surface of the partition component close to the substrate on the substrate covers the cutting line.

[0017] Preferably, the display motherboard has a plurality of display areas; the partition component has a bottom edge close to the substrate and a top edge away from the substrate along a first cross section perpendicular to its extension direction;

[0018] The orthographic projection of the top edge on the base is a first projection, and the first projection includes a first endpoint and a second endpoint;

[0019] The orthographic projection of the bottom edge on the base is a second projection, and the second projection includes a third endpoint and a fourth endpoint;

[0020] in,

[0021] The third endpoint is between the orthographic projection of the cutting line on the substrate and the orthographic projection of one of the two adjacent display areas on the substrate, and the third endpoint is within the first projection range;

[0022] And / or, the fourth endpoint is between the orthographic projection of the cutting line on the substrate and the orthographic projection of the other of the two adjacent display areas on the substrate, and the fourth endpoint is within the range of the first projection.

[0023] It is further preferred that the first cross section further comprises a first side edge and a second side edge which are arranged opposite to each other and connected between the top edge and the bottom edge; wherein,

[0024] The top edge is parallel to the base;

[0025] The included angle between the top edge and the first side edge in the first cross section is less than 90°, and / or,

[0026] An included angle between the top edge and the second side edge in the first cross section is less than 90°.

[0027] Preferably, the partition assembly is continuously arranged around the display area.

[0028] Preferably, the display motherboard further comprises a spacer arranged in the display area; the partition component is made of the same material as the spacer.

[0029] Preferably, the display motherboard further comprises a planarization layer disposed in the display area, and a spacer located on the side of the planarization layer away from the substrate; the partition assembly comprises a first layer structure and a second layer structure stacked along the side away from the substrate; wherein,

[0030] The first layer structure is arranged in the same layer as the planarization layer and is made of the same material;

[0031] The second layer structure is arranged in the same layer as the spacer and is made of the same material.

[0032] The technical solution adopted to solve the technical problem of the present invention is a display substrate obtained by cutting the above-mentioned display motherboard, wherein the display substrate comprises: a base, an OLED device arranged on the base and at a position corresponding to the display area, an encapsulation layer covering the layer where the OLED device is located, and a partition component arranged in the non-display area; wherein:

[0033] The partition component is located between the substrate and the packaging layer, and is used to cause the packaging layer to be broken between the display area and the cutting line.

[0034] The technical solution adopted to solve the technical problem of the present invention is a display device, which includes the above-mentioned display substrate.

[0035] The present invention has the following beneficial effects:

[0036] Since a partition component is provided in the non-display area of ​​the display motherboard of the present invention, and the partition component is located between the substrate and the encapsulation layer, and can cause the encapsulation layer to break between the display area and the cutting line; therefore, before the display panel is cut, the encapsulation layer of the display motherboard has naturally broken between the display area and the cutting line. Therefore, when the display panel is subsequently cut along the cutting line, the cracks generated in the encapsulation layer will not be transmitted to the display area, thereby effectively improving the reliability of the display panel after cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is a top view of a display motherboard according to Embodiment 1 of the present invention;

[0038] Figure 2 The edge of the display motherboard of embodiment 1 of the present invention Figure 1 A cross-sectional view in the AA' direction shown in FIG.

[0039] Figure 3-5 The edge of the display motherboard of embodiment 1 of the present invention Figure 1 A cross-sectional view of the partition assembly in the AA' direction shown in FIG.

[0040] Figure 6 is a top view of the display motherboard according to Embodiment 1 of the present invention;

[0041] Figure 7 The edge of the display motherboard of embodiment 1 of the present invention Figure 6 A cross-sectional view of the partition assembly in the AA' direction shown in FIG.

[0042] Figure 8 is a cross-sectional view of another display motherboard according to Embodiment 1 of the present invention;

[0043] Fig. 9 The flowchart is a method for preparing a display motherboard according to Embodiment 2 of the present invention.

[0044] The figures are marked as follows: Q1, display area; Q11, first display area; Q12, second display area; Q2, non-display area; S, cutting line; b1, top edge of partition component; b2, bottom edge; b2, top edge of partition component; b3, first side edge of partition component; b4, second side edge of partition component; b1', first projection; b2', second projection; a1, d first endpoint; a2, second endpoint; a3, third endpoint; a4, fourth endpoint; 10, substrate; 1, driving transistor; 2, gate insulating layer; 3, interlayer insulating layer; 4, planarizing layer; 5, pixel defining layer; 61, first electrode; 62, organic functional layer; 63, second electrode; 6, OLED device; 7, spacer; 8, encapsulation layer; 9, partition component; 91, first layer structure; 92, second layer structure. DETAILED DESCRIPTION

[0045] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0046] The words "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. The words "include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, but do not exclude other elements or objects. "Up", "down" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0047] Embodiment 1:

[0048] Combination Figure 1-8 As shown, the present embodiment provides a display motherboard, which has a display area Q1 and a non-display area Q2; a cutting line S is marked in the non-display area Q2, and the display motherboard is used to be cut along the cutting line S to form a display substrate, which specifically includes: a substrate 10, an OLED device 6 arranged on the substrate 10 and at a position corresponding to the display area Q1, an encapsulation layer 8 covering the layer where the OLED device 6 is located, and a partition component 9 located in the non-display area Q2; wherein the partition component 9 is located between the substrate 10 and the encapsulation layer 8, so as to cause the encapsulation layer 8 to be broken between the display area Q1 and the cutting line S.

[0049] Since, in the present embodiment, a partition component 9 is provided in the non-display area Q2 of the display motherboard, and the partition component 9 is located between the substrate 10 and the encapsulation layer 8, and can cause the encapsulation layer 8 to break between the display area Q1 and the cutting line S; therefore, before the display panel is cut, the encapsulation layer 8 of the display motherboard has naturally broken between the display area Q1 and the cutting line S. Therefore, when the display panel is subsequently cut along the cutting line S, the cracks generated in the encapsulation layer 8 will not be transmitted to the display area Q1, thereby effectively improving the reliability of the display panel after cutting.

[0050] It should be noted that the encapsulation layer 8 is formed on the layer where the partition component 9 is located, so that the encapsulation layer 8 breaks naturally between the display area Q1 and the cutting line S. At this time, the stress on the encapsulation layer 8 at the edge of the partition component 9 is much smaller than the stress generated by the cutting knife on the encapsulation layer 8 when the display panel is cut. In other words, the use of the partition component 9 makes it possible for the encapsulation to basically not generate cracks at the location where the encapsulation layer 8 breaks when the encapsulation breaks naturally between the display area Q1 and the cutting line S, and even if cracks are generated, the cracks will not be transmitted to the display area Q1.

[0051] Among them, in this embodiment, the partition component 9 can be designed to be wall-shaped or belt-shaped. Furthermore, the partition component 9 is arranged around the display area Q1, so that the formed encapsulation layer 8 can be completely broken between the display area Q1 and the cutting line S, thereby ensuring to the greatest extent that the cracks generated in the encapsulation layer 8 during cutting will not be transmitted to the display area Q1.

[0052] The partition component 9 includes a bottom surface close to the substrate 10 and a top surface away from the substrate 10. In this embodiment, the partition component 9 can be arranged between the cutting line S and the display area Q1, or on the cutting line S, that is, the orthographic projection of the bottom surface of the partition component 9 on the substrate 10 covers the cutting line S. Of course, the position of the partition component 9 can also be designed according to the specific shape and size of the partition component 9.

[0053] The specific structure of the partition component 9 in this embodiment is described below by taking two positions where the partition component 9 is arranged on the substrate 10 as examples.

[0054] As the first case, Figure 1 As shown, the partition component 9 is located between the display area Q1 of the display motherboard and the cutting line S. The partition component 9 can specifically adopt the following three structures.

[0055] As a first structure of the partition assembly 9, Figure 3 As shown, the partition assembly 9 is arranged perpendicular to its extension direction ( Figure 1 The first cross section in the AA') direction has a bottom side b2 close to the substrate 10 and a top side b1 away from the substrate 10, and a first side b3 and a second side b4 arranged opposite to each other and connected between the top side b1 and the bottom side b2; wherein the orthographic projections of the top side b1 and the bottom side b2 on the substrate 10 are respectively a first projection b1' and a second projection b2'; the first projection b1' has a first endpoint a1 and a second endpoint a2; the second projection b2' has a third endpoint a3 and a fourth endpoint a4; in particular, the third end point a3 of the second projection b2' End point a3 is within the range of the first projection b1', while the fourth end point a4 is not within the range of the first projection b1'. In this way, the angle between the side surface and the top surface of the partition component 9 close to the display area Q1 is less than or equal to 90°. At this time, the angle can cause the encapsulation layer 8 deposited on the partition component 9 to naturally break at this position. Therefore, when the display panel is cut along the cutting line S later, the cracks generated in the encapsulation layer 8 will not be transmitted to the display area Q1, thereby effectively improving the reliability of the display panel after cutting.

[0056] It should be noted here that Figure 3The first projection b1' and the second projection b2' shown in the figure should actually be superimposed on each other. The reason why they are shown separately is to more clearly show the size of the first projection b1' and the second projection b2', as well as the relationship between the first endpoint a1, the second endpoint a2, the third endpoint a3, and the fourth endpoint a4. Figure 4 , Figure 5 ,as well as Figure 7 The same is true for the illustration of the first projection b1' and the second projection b2'. For this embodiment, the shape of the partition component 9 can be a straight line, or it can be a folded line, an arc or other special shape; when the shape of the partition component 9 is a straight line, the extension direction of the partition component 9 is its length direction; when the shape of the partition component 9 is a folded line, the extension direction of the partition component 9 is the extension direction of each folded line segment; when the partition component 9 is an arc, the extension direction of the partition component 9 is the tangent direction of each point on the line; that is, in this embodiment, the extension direction of partition components 9 of different shapes can be one or more. In the embodiments, the shape of the partition component 9 is a straight line as an example for explanation, and the direction perpendicular to the extension direction of the partition component 9, that is Figure 1 , 6 AA' direction in.

[0057] Among them, preferably, in the present embodiment, the top edge b1 of the partition component 9 is parallel to the substrate 10, the first side edge b3 and the second side edge b4 of the above-mentioned first cross-section are straight side edges, and the angle between the top edge b1 and the first side edge b3 is less than 90°. Therefore, the angle between the side surface and the top surface of the partition component 9 close to the display area Q1 can be made sharper to ensure that the encapsulation layer 8 deposited on the partition component 9 is completely naturally broken at this position, and the partition component 9 with this structure is easy to prepare.

[0058] Furthermore, the included angle between the top edge b1 and the first side edge b3 of the first cross section of the partition component 9 in this embodiment is 70°. The reason for this setting is that when the angle is 70°, the encapsulation layer 8 deposited on the partition component 9 can be completely naturally broken, and the partition component 9 with this structure is also easy to prepare.

[0059] As a second structure of the partition assembly 9, Figure 4As shown, the partition component 9 is similar to the first structure, except that the fourth endpoint a4 of the second projection b2' is within the range of the first projection b1', while the third endpoint a3 is not within the range of the first projection b1'. In this way, the angle between the side surface and the top surface of the partition component 9 close to the cutting line S is less than or equal to 90°. At this time, the angle can cause the encapsulation layer 8 deposited on the partition component 9 to naturally break at this position. Therefore, when the display panel is cut along the cutting line S later, the cracks generated in the encapsulation layer 8 will not be transmitted to the display area Q1, thereby effectively improving the reliability of the display panel after cutting.

[0060] Among them, in this embodiment, the top edge b1 of the partition component 9 is parallel to the base 10, the first side edge b3 and the second side edge b4 of the above-mentioned first cross-section are straight side edges, and the angle between the top edge b1 and the second side edge b4 is less than 90°. Therefore, the angle between the side surface and the top surface of the partition component 9 close to the cutting line S can be made sharper to ensure that the encapsulation layer 8 deposited on the partition component 9 is completely naturally broken at this position, and the partition component 9 with this structure is easy to prepare.

[0061] Furthermore, the angle between the top edge b1 and the second side edge b4 of the first cross section of the partition component 9 in this embodiment is 70°. This is because when the angle is 70°, the encapsulation layer 8 deposited on the partition component 9 can be completely broken naturally, and the partition component 9 of this structure is also easy to prepare. As a third structure of the partition component 9, Figure 5 As shown, the partition component 9 is similar to the first and second structures, with the difference that the third endpoint a3 and the fourth endpoint a4 of the second projection b2' are both within the range of the first projection b1', so that the angle between the side and top surface of the partition component 9 close to the display area Q1 is less than or equal to 90°, and the angle between the side and top surface of the partition component 9 close to the cutting line S is less than or equal to 90°. At this time, under the action of these two angles, the encapsulation layer 8 deposited on the partition component 9 can be naturally broken at this position. Therefore, when the display panel is cut along the cutting line S later, the cracks generated in the encapsulation layer 8 will not be transmitted to the display area Q1, thereby effectively improving the reliability of the display panel after cutting.

[0062] Among them, in this embodiment, the top edge b1 of the partition component 9 is parallel to the substrate 10, the first side edge b3 and the second side edge b4 of the above-mentioned first cross-section are straight side edges, and the angle between the top edge b1 and the first side edge b3 is less than 90°, and the angle between the top edge b1 and the second side edge b4 is also less than 90°. Therefore, the angle between the side surface and the top surface of the partition component 9 close to the cutting line S, and the angle between the side surface and the top surface of the display area Q1 close to the partition component 9 can be made sharper to ensure that the encapsulation layer 8 deposited on the partition component 9 is completely naturally broken at this position, and the partition component 9 with this structure is easy to prepare.

[0063] Furthermore, the angle between the top edge b1 and the first side edge b3 of the first cross section of the partition component 9 in this embodiment is 70°, and the angle between the top edge b1 and the second side edge b4 is also 70°. The reason for this setting is that when the angle is 70°, the encapsulation layer 8 deposited on the partition component 9 can be completely naturally broken, and the partition component 9 of this structure is also convenient to prepare. It should be noted here that when the first side edge b3 and the second side edge b4 of the first cross section are straight side edges, and the angle between the top edge b1 and the first side edge b3 is less than 90°, and the angle between the top edge b1 and the second side edge b4 is also less than 90°, the first cross section of the partition component 9 is an inverted trapezoid, and in this embodiment, the first cross section is not limited to an inverted trapezoid, and can also be a parallelogram or a rectangle, etc., which can satisfy the requirement that the encapsulation layer 8 deposited on the partition component 9 is naturally broken.

[0064] As the second case, Figure 6 As shown, the orthographic projection of the bottom surface of the partition component 9 on the substrate 10 covers the cutting line S, that is, the partition component 9 is located on the cutting line S of the display motherboard. The arrangement of the partition component 9 on the cutting line S is particularly suitable for the case where there are multiple display areas Q1 in the display panel, so that the adjacent display areas Q1 share the same partition component 9, and the display motherboard of such a structure is easy to prepare. Since the adjacent display areas Q1 share the same partition component 9, in order to meet the requirement that the encapsulation layer 8 is broken between the cutting line S and the display area Q1 before cutting, the partition component 9 selected at this time is the partition component 9 of the third structure mentioned above.

[0065] Specifically, Figure 7 As shown, the partition component 9 disposed between two display areas Q1 on the cutting line S is taken as an example for description. The two display areas Q1 are respectively the first display area Q11 and the second display area Q12; Figure 6The first cross section in the AA' direction shown in the figure has a bottom side b2 close to the substrate 10 and a top side b1 away from the substrate 10, and a first side b3 and a second side b4 arranged opposite to each other and connected between the top side b1 and the bottom side b2; wherein the orthographic projections of the top side b1 and the bottom side b2 on the substrate 10 are the first projection b1' and the second projection b2' respectively; the first projection b1' has a first endpoint a1 and a second endpoint a2; the second projection b2' has a third endpoint a3 and a fourth endpoint a4; in particular, the third endpoint a3 and the fourth endpoint a4 of the second projection b2' are both within the range of the first projection b1', so that the separation The angle between the side surface and the top surface of the component 9 close to the first display area Q11 is less than or equal to 90°, and the angle between the side surface and the top surface of the partition component 9 close to the second display area Q12 is less than or equal to 90°. At this time, under the action of these two angles, the encapsulation layer 8 deposited on the partition component 9 can naturally break between the first display area Q11 and the cutting line S, and between the second display area Q12 and the cutting line S. Therefore, when the display panel is cut along the cutting line S later, the cracks generated in the encapsulation layer 8 will not be transmitted to the display area Q1, thereby effectively improving the reliability of the display panel after cutting.

[0066] Among them, in this embodiment, the top edge b1 of the partition component 9 is parallel to the substrate 10, the first side edge b3 and the second side edge b4 of the above-mentioned first cross-section are straight side edges, and the angle between the top edge b1 and the first side edge b3 is less than 90°, and the angle between the top edge b1 and the second side edge b4 is also less than 90°. Therefore, the angle between the side surface and the top surface of the first display area Q11 close to the partition component 9, and the angle between the side surface and the top surface of the second display area Q12 close to the partition component 9 can be made sharper to ensure that the encapsulation layer 8 deposited on the partition component 9 is completely naturally broken at this position, and the partition component 9 with this structure is easy to prepare.

[0067] Furthermore, the angle between the top edge b1 and the first side edge b3 of the first cross-section of the partition component 9 in this embodiment is 70°, and the angle between the top edge b1 and the second side edge b4 is also 70°. The reason for this arrangement is that when the angle is 70°, the encapsulation layer 8 deposited on the partition component 9 can be completely naturally broken, and the partition component 9 of this structure is also easy to prepare.

[0068] In this embodiment, it can also be the positive projection of the bottom edge of the first cross-section of the partition component 9 on the substrate, that is, the third endpoint a3 of the second projection b2' is within the range of the first projection b1', and the fourth endpoint a4 is not within the range of the first projection b1'. In this way, the angle between the side and top surfaces of the partition component 9 close to the display area Q1 is less than or equal to 90°. At this time, the angle can cause the encapsulation layer 8 deposited on the partition component 9 to naturally break at this position. Therefore, when the display panel is cut along the cutting line S later, the cracks generated in the encapsulation layer 8 will not be transmitted to the second display area Q12, thereby effectively improving the reliability of the display panel corresponding to the second display area Q12 after cutting.

[0069] Alternatively, in this embodiment, it can also be the positive projection of the bottom edge of the first cross-section of the partition component 9 on the substrate, that is, the fourth endpoint a4 of the second projection b2' is within the range of the first projection b1', and the third endpoint a3 is not within the range of the first projection b1'. In this way, the angle between the side surface and the top surface of the partition component 9 close to the cutting line S is less than or equal to 90°. At this time, the angle can cause the encapsulation layer 8 deposited on the partition component 9 to naturally break at this position. Therefore, when the display panel is cut along the cutting line S later, the cracks generated in the encapsulation layer 8 will not be transmitted to the first display area Q11, thereby effectively improving the reliability of the display panel corresponding to the first display area Q11 after cutting.

[0070] Of course, if there is only one display area in the display motherboard and the distance between the cutting line and the display area is small, then the partition component can be set on the cutting line in the same manner as above. However, at this time, the partition component only needs to satisfy the second projection that the third end point close to the display area is within the range of the first projection, that is, the partition component is Figure 3 Of course, you can also separate components and set them up as Figure 7 The structure in the above example is that the third endpoint and the fourth endpoint of the second projection are both within the range of the first projection. Figure 3-7 For the sake of simplicity in the manufacturing process, the packaging components can be formed by using the material of the spacer 7 when forming the spacer 7 of the display motherboard. Specifically, the position of the packaging components is specifically described in combination with the specific structure of the OLED device 6 below.

[0071] As a specific display motherboard structure in this embodiment, it includes a substrate 10 and a pixel driving circuit located on the substrate 10; wherein the pixel driving circuit generally includes components such as a switching transistor, a driving transistor 1, and a storage capacitor; wherein the switching transistor and the driving transistor 1 both include an active layer, a gate insulating layer 2, a gate, an interlayer insulating layer 3, a source electrode, and a drain electrode sequentially arranged on the substrate 10, and the source electrode and the drain electrode are connected to the active layer through vias penetrating the interlayer insulating layer 3 and the gate insulating layer 2, respectively; the two pole pieces of the storage capacitor can be arranged in the same layer as the gate electrode, the source electrode, and the drain electrode; a planarization layer 4 is formed above the layer where the source electrode and the drain electrode of the switching transistor and the driving transistor 1 are located, and the planarization layer 4 is different from the planarization layer 4 in the prior art, and it not only covers the display area Q1, but also extends to the cutting area; a via hole is formed in the planarization layer 4 at a position corresponding to the drain electrode of the driving transistor 1; a first electrode 61 of the OLED device 6 is formed on the planarization layer 4, and the first electrode 61 is connected to the drain electrode of the driving transistor 1 through a via hole penetrating the planarization layer 4; A pixel defining layer 5 is formed above the layer where the first electrode 61 is located, and a receiving portion is formed at a position where the pixel defining layer 5 corresponds to the first electrode 61 of the OLED device 6; an organic functional layer 62 of the OLED device 6 is formed in the receiving portion; wherein the organic functional layer 62 of the OLED device 6 may include a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer arranged in sequence along a direction away from the substrate 10; a spacer 7 material layer is formed on the organic functional layer 62 of the OLED device 6, and a pattern of the spacer 7 is formed at a position corresponding to the pixel circuit and located in the display area Q1 through a first photolithography process; a pattern of the partition component 9 located in the non-display area Q2 is formed through a second photolithography process; a second electrode 63 of the OLED device 6 is formed on the layer where the spacer 7 and the partition component 9 are located; an encapsulation layer 8 is formed above the second electrode 63 of the OLED device 6, and the encapsulation layer 8 is broken between the display area Q1 and the cutting line S; wherein the encapsulation layer 8 may include inorganic layers such as a SiNx layer, a SiCN layer, a SiON layer, and a SiOx layer arranged in sequence on the substrate 10.

[0072] It should be noted that the above description is based on the example that the switch transistor and the driving transistor 1 are bottom-gate thin-film transistors. In fact, these two transistors can also be bottom-gate thin-film transistors; and, one of the first electrode 61 and the second electrode 63 of the OLED device 6 is the anode, and the other is the cathode.

[0073] The above method of achieving the natural rupture of the encapsulation layer 8 in the display motherboard between the display area Q1 and the cutting line S before the cutting process is achieved by the special shape of the separation component 9. Hereinafter, the present embodiment further provides a structure of the separation component 9 capable of achieving the natural rupture of the encapsulation layer 8 in the display motherboard between the display area Q1 and the cutting line S.

[0074] This type of partition component 9 mainly utilizes its own certain height in a direction perpendicular to the substrate 10, namely a first height, which satisfies that the encapsulation layer 8 formed on the partition component 9 can be naturally broken between the display area Q1 and the cutting line S.

[0075] Specifically, Figure 8 As shown, the structure is basically the same as that of the above-mentioned display motherboard, and the only difference is that the specific structure of the partition component 9 is different. The partition component 9 includes a first layer structure 91 and a second layer structure 92 arranged in sequence along the direction away from the substrate 10; wherein the first layer structure 91 is arranged in the same layer as the planarization layer 4 and is made of the same material; the second layer structure 92 is arranged in the same layer as the spacer 7 and is made of the same material. That is to say, while forming the planarization layer 4 located in the display area Q1, the first layer structure 91 of the partition component 9 located in the non-display area Q2 is formed, and while forming the spacer 7 located in the display area Q1, the second layer structure 92 of the partition component 9 located in the non-display area Q2 is formed; the formation of the partition component 9 of this structure does not increase the process steps and production costs. Of course, this only provides a structure in which the partition component 9 is formed through its own height so that the encapsulation layer 8 formed on the partition component 9 can be naturally broken at the first and second edges of the top surface of the partition component 9. The specific structure of the partition component 9 is also limited thereto. A partition component 9 with a certain height may be separately prepared before forming the encapsulation layer 8 so that the encapsulation layer 8 formed later can be naturally broken between the display area Q1 and the cutting line S.

[0076] Embodiment 2:

[0077] The present embodiment provides a method for preparing a display motherboard, which can be used to prepare the display motherboard in Example 1, and includes: forming an OLED device 6 on the substrate 10; forming an encapsulation layer 88 on the OLED device 6; and forming a partition component 9 between the substrate 10 and the encapsulation layer 8; wherein the partition component 9 is located in the non-display area Q2 of the display motherboard, so as to break the formed encapsulation layer 8 between the display area Q1 and the cutting line S.

[0078] In this embodiment, the partition component 9 can be designed to be wall-shaped or belt-shaped, and the partition component 9 is further arranged around the display area Q1, so that the formed encapsulation layer 8 can be completely broken between the display area Q1 and the cutting line S, thereby ensuring to the greatest extent that the cracks in the encapsulation layer 8 will not be transmitted to the display area Q1 during cutting.

[0079] In order to make the preparation method of the display motherboard in this embodiment clearer, the preparation method is specifically described below by taking the first cross section of the partition component 9 in this embodiment as an example of an inverted trapezoidal structure. Fig. 9 shown.

[0080] Step 1: Form the various layers of the pixel driving circuit on the substrate 10; wherein the pixel driving circuit generally includes a switch transistor, a driving transistor 1, and a storage capacitor. The manufacturing methods of the switch transistor and the driving transistor 1 are the same, so only the step of forming the driving transistor 11 is used to illustrate the manufacturing method of the pixel driving circuit.

[0081] This step specifically includes, on the substrate 10, forming a pattern of an active layer including a driving transistor 1 by a composition process; after forming the active layer, forming a gate insulating layer 2; after forming the gate insulating layer 2, forming a pattern including a gate and a first electrode 61 of a storage capacitor by a composition process; after forming the gate, forming an interlayer insulating layer 3, and etching a via penetrating the interlayer insulating layer 3 and the gate insulating layer 2 for connecting the source and the drain to the active layer; finally, forming a pattern including a source, a drain, and a second electrode 63 of a storage capacitor by a composition process, and the source and the drain are respectively connected to the active layer through vias penetrating the interlayer insulating layer 3 and the gate insulating layer 2.

[0082] Step 2: forming a planarization layer 4 . This planarization layer 4 is different from the planarization layer 4 in the prior art. It not only covers the display area Q1 , but also extends to the non-display area Q2 . A via is etched in the planarization layer 4 at a position corresponding to the drain of the driving transistor 1 .

[0083] Step three: forming a pattern including the first electrode 61 of the OLED device 6 through a patterning process; wherein the first electrode 61 of the OLED device 6 is connected to the drain electrode of the driving transistor 1 through a via hole penetrating the planarization layer 4 .

[0084] Step 4: forming a pixel defining layer 5 , and etching to form a receiving portion at a position of the pixel defining layer 5 corresponding to the first electrode 61 of the OLED device 6 .

[0085] Step 5, forming an organic functional layer 62 of the OLED device 6 in the receiving portion; this step can specifically adopt an evaporation process to sequentially form a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer along a direction away from the substrate 10.

[0086] Step six: a spacer 7 is provided on the pixel defining layer 5 and at a position corresponding to the pixel driving circuit; a partition component 99 is formed between the non-display area Q2. Specifically, the partition component 9 can be located between the display area Q1 and the cutting line S, or on the cutting line S.

[0087] This step specifically includes: forming a spacer 7 material layer on the pixel defining layer 5;

[0088] Through the first photolithography process, the pattern of the spacer 7 located in the display area Q1 is formed;

[0089] Through the second photolithography process, the pattern of the partition component 99 located in the non-display area Q2 is formed; wherein, the partition component 9 is cut along its perpendicular extension direction, and the obtained cross-section is also an inverted trapezoidal structure. The reason why the partition component 99 is set to this structure is to simplify the preparation process of the partition component 9.

[0090] It should be noted here that the following methods can be used to form the partition component 9 in the present embodiment: 1. By forming a positive photoresist on the material layer of the spacer 7 located in the display area Q1, and forming a negative photoresist on the material layer of the spacer 7 in the non-display area Q2 (of course, the photoresists of the two areas can also be interchanged), and then forming the spacer 7 and the partition component 9 respectively through a photolithography process; wherein, the exposure of the partition component 9 can be performed by exposing the side away from the photoresist, so that during etching, a partition component 9 with a first side panel and a second side being an inverted trapezoid can be formed. 2. The partition component 9 with a first side panel and a second side being an inverted trapezoid can also be formed by controlling process conditions, such as temperature, etching time and rate.

[0091] Of course, the partition component 9 and the spacer 7 can also be prepared separately using two composition processes instead of one composition process. In this case, the material of the partition component 9 can be selected so that the first cross-section of the partition component 9 perpendicular to its extension direction is an inverted trapezoidal structure.

[0092] Step seven: forming the second electrode 63 of the OLED device 6.

[0093] Step eight: forming a packaging layer 8 , and the packaging layer 88 is naturally broken between the display area Q1 and the cutting line S under the action of the separation component 9 .

[0094] This step specifically includes forming at least one material selected from the group consisting of SiNx, SiCN, SiON, and SiOx on the substrate 10 on which the OLED device 6 is formed by low-temperature chemical vapor deposition to form the encapsulation layer 8.

[0095] The preparation of the display motherboard is now completed.

[0096] Since, in the method for preparing the display motherboard of the present embodiment, a partition component 9 is formed in the non-display area Q2, and the partition component 9 is located between the substrate 10 and the encapsulation layer 8, the encapsulation layer 8 can be broken between the display area Q1 and the cutting line S; that is, before the display panel is cut, the encapsulation layer 8 of the display motherboard has naturally broken between the display area Q1 and the cutting line S. Therefore, when the display panel is cut along the cutting line S later, the cracks generated in the encapsulation layer 8 will not be transmitted to the display area Q1, thereby effectively improving the reliability of the display motherboard.

[0097] The above method of achieving the natural rupture of the encapsulation layer 8 in the display motherboard between the display area Q1 and the cutting line S before the cutting process is achieved by the special shape of the separation component 9. Hereinafter, the present embodiment further provides a structure of the separation component 9 capable of achieving the natural rupture of the encapsulation 8 in the display motherboard between the display area Q1 and the cutting line S.

[0098] This type of partition component 9 mainly utilizes its own certain height along the direction perpendicular to the substrate 10 , and the height is sufficient for the encapsulation layer 8 formed on the partition component 9 to be naturally broken between the display area Q1 and the cutting line S.

[0099] Specifically, the structure is basically the same as the above-mentioned display motherboard, and the only difference is that the specific structure of the partition component 9 is different. The partition component 9 includes a first layer structure 91 and a second layer structure 92 arranged in sequence along the direction away from the substrate 1010; wherein the first layer structure 91 is arranged in the same layer as the planarization layer 4 and is made of the same material; the second layer structure 92 is arranged in the same layer as the spacer 7 and is made of the same material. In other words, in the preparation method of this display motherboard, the first layer structure 91 of the partition component 9 located in the non-display area Q2 is formed while the planarization layer 4 is formed in the display area Q1, and the second layer structure 92 of the partition component 9 located in the non-display area Q2 is formed while the spacer 7 is formed in the display area Q1; the formation of the partition component 9 of this structure does not increase the process steps and production costs. Of course, this only provides a structure in which the partition component 9 is formed by its own height so that the encapsulation layer 8 formed on the partition component 9 can be naturally broken between the display area Q1 and the cutting line S. The specific structure of the partition component 9 is also limited thereto. A partition component 9 with a certain height may be separately prepared before forming the encapsulation layer 8 so that the encapsulation layer 8 formed later can be naturally broken between the display area Q1 and the cutting bottom.

[0100] Embodiment 3:

[0101] This embodiment provides a display substrate and a display device. The display substrate can be obtained by cutting the display substrate in Example 1. The display substrate includes: a substrate 10, an OLED device 6 located on the substrate 10, and an encapsulation layer 8 located on the OLED device 6 and used to encapsulate the OLED device 6; a partition component 9 is arranged in the peripheral area of ​​the display substrate; wherein the partition component 9 is located between the substrate 10 and the encapsulation layer 8; the encapsulation layer 8 is broken in the peripheral area of ​​the display substrate.

[0102] The display device includes the display substrate in Embodiment 1, which is not described in detail here.

[0103] Of course, in this embodiment, the display device may include: an OLED panel, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, or any other product or component with a display function.

[0104] Due to the above-mentioned display motherboard, the display device of this embodiment has better reliability.

[0105] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A display motherboard, used for cutting along a cutting line to form a display substrate, the display motherboard having a display area and a non-display area; the display motherboard comprises: A substrate, an OLED device arranged on the substrate and at a position corresponding to the display area, and an encapsulation layer covering the layer where the OLED device is located; characterized in that the display motherboard further comprises: a separation component arranged in the non-display area and corresponding to the cutting line; wherein, The partition component is located between the substrate and the encapsulation layer, and is used to cause the encapsulation layer to be broken between the display area and the cutting line; The partition component is arranged between the cutting line and the display area; The orthographic projection of the bottom surface of the partition component close to the substrate on the substrate covers the cutting line.

2. The display motherboard according to claim 1, characterized in that: The partition component has a first cross section perpendicular to its extension direction, having a bottom edge close to the base and a top edge away from the base; The orthographic projection of the top edge on the base is a first projection, and the first projection includes a first endpoint and a second endpoint; The orthographic projection of the bottom edge on the base is a second projection, and the second projection includes a third endpoint and a fourth endpoint; The third endpoint and / or the fourth endpoint is / are within the range of the first projection.

3. The display motherboard according to claim 2, characterized in that: The first cross section also has a first side edge and a second side edge which are arranged opposite to each other and connected between the top edge and the bottom edge; wherein, The top edge is parallel to the base; The included angle between the top edge and the first side edge in the first cross section is less than 90°, and / or, An included angle between the top edge and the second side edge in the first cross section is less than 90°.

4. The display motherboard according to claim 1, characterized in that: The display motherboard has a plurality of display areas; the partition component has a bottom edge close to the substrate and a top edge away from the substrate along a first cross section perpendicular to its extension direction; The orthographic projection of the top edge on the base is a first projection, and the first projection includes a first endpoint and a second endpoint; The orthographic projection of the bottom edge on the base is a second projection, and the second projection includes a third endpoint and a fourth endpoint; wherein, The third endpoint is between the orthographic projection of the cutting line on the substrate and the orthographic projection of one of the two adjacent display areas on the substrate, and the third endpoint is within the first projection range; And / or, the fourth endpoint is between an orthographic projection of the cutting line on the substrate and an orthographic projection of the other of the two adjacent display areas on the substrate, and the fourth endpoint is within the range of the first projection.

5. The display motherboard according to claim 4, characterized in that: The first cross section also has a first side edge and a second side edge which are arranged opposite to each other and connected between the top edge and the bottom edge; wherein, The top edge is parallel to the base; The included angle between the top edge and the first side edge in the first cross section is less than 90°, and / or, An included angle between the top edge and the second side edge in the first cross section is less than 90°.

6. The display motherboard according to claim 1, characterized in that: The partition components are continuously arranged around the display area.

7. The display motherboard according to claim 1, characterized in that: It also includes a spacer arranged in the display area; the partition component is made of the same material as the spacer.

8. The display motherboard according to claim 1 or 6, characterized in that: It also includes a planarization layer disposed in the display area, and a spacer located on the side of the planarization layer away from the substrate; the separation component includes a first layer structure and a second layer structure stacked along the side away from the substrate; wherein, The first layer structure is arranged in the same layer as the planarization layer and is made of the same material; The second layer structure is arranged in the same layer as the spacer and is made of the same material.

9. A display substrate formed by cutting the display motherboard according to any one of claims 1 to 8, characterized in that: The display substrate comprises: a base, an OLED device disposed on the base and at a position corresponding to the display area, an encapsulation layer covering the layer where the OLED device is located, and a partition component disposed in the non-display area; wherein: The partition component is located between the substrate and the packaging layer, and is used to cause the packaging layer to be broken between the display area and the cutting line.

10. A display device, characterized in that: Comprising the display substrate as claimed in claim 9.

Images