High-precision tape forming device

Abstract

The present invention discloses a high-precision carrier tape forming device, comprising a forming slide rail arranged on a frame and an upper forming drive source and a lower forming drive source opposite thereto, wherein the moving ends of the upper forming drive source and the lower forming drive source are respectively provided with an upper forming block and a lower forming block, which are respectively provided with a forming heating hole capable of placing a heating wire and a forming cooling hole capable of circulating a coolant, and an upper forming boss and a lower forming hole arrayed along the direction of the forming heating hole, wherein each of the upper forming bosses corresponds to a lower forming hole. The device can automatically form the holes of the carrier tape, with fast forming speed and high precision.

Description

Technical Field

[0001] The invention relates to the field of molding, and in particular to a high-precision carrier tape molding device. Background Art

[0002] Carrier Tape refers to a strip product used in the field of electronic packaging. It has a specific thickness and has holes (also called pockets) for holding electronic components and positioning holes for indexing and positioning evenly distributed along its length. The holes of the carrier tape need to be embossed or punched during molding. Because the holes need to fit perfectly with the electronic components, high precision is required during embossing or punching. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a high-precision carrier tape forming device, which can automatically form holes in the carrier tape with fast forming speed and high precision.

[0004] In order to solve the above technical problems, the present invention provides a high-precision carrier forming device, including a forming slide rail arranged on a frame and a relative upper forming drive source and a lower forming drive source, the moving ends of the upper forming drive source and the lower forming drive source are respectively provided with an upper forming block and a lower forming block, which are respectively provided with a forming heating hole for placing a heating wire and a forming cooling hole for circulating a coolant, as well as an upper forming boss and a lower forming hole arrayed along the direction of the forming heating hole, each of the upper forming bosses corresponds to a lower forming hole.

[0005] Preferably, the shape and size of the upper molding boss are consistent with the shape and size of the inside of the cavity, and the shape and size of the lower molding hole are consistent with the shape and size of the outside of the cavity.

[0006] Preferably, the minimum distance between the upper molding boss and the lower molding hole is substantially consistent with the thickness of the carrier tape.

[0007] Preferably, the forming heating holes are arranged along the conveying direction of the carrier tape, and the forming cooling holes are perpendicular to the forming heating holes.

[0008] Preferably, a plurality of formed cooling holes are arranged in an array along the conveying direction of the carrier tape.

[0009] Preferably, the forming slide rails include two pairs of four mutually parallel slide rails in total, the upper forming bracket is arranged on the two upper slide rails, and the lower forming bracket is arranged on the two lower slide rails.

[0010] Preferably, it comprises a forming limit block arranged on the frame, the upper forming drive source is arranged on the forming limit block, and the upper forming block is connected to the forming limit block.

[0011] Preferably, it includes a heating slide rail arranged on the frame and a relative upper heating drive source and a lower heating drive source, the moving ends of the upper heating drive source and the lower heating drive source are respectively provided with an upper heating block and a lower heating block, on which upper heating wires and lower heating wires are respectively provided, as well as upper heating bosses and lower heating bosses arrayed along the direction of the upper heating wires and the lower heating wires, each of the upper heating bosses corresponds to a lower heating boss.

[0012] Preferably, the upper heating block and the lower heating block are respectively provided with an upper pressing plate and a lower pressing plate that can be clamped with each other, and the upper pressing plate and the lower pressing plate are both provided with pressing plate slots, and the upper heating boss, the lower heating boss, the upper molding boss and the lower molding hole are all located in the slots.

[0013] Preferably, one end of the lower pressing plate is provided with a hole discharge notch for discharging the carrier tape after forming, and the hole discharge notch is connected to the pressing plate slot.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. The present invention can automatically form the carrier tape by setting an upper forming drive source and a lower forming drive source, with fast forming speed and high forming precision; in addition, after forming, it can separate the upper forming boss and the lower forming hole from each other, so that the carrier tape only needs to move along the conveying direction, and does not need to move along other directions in order to leave the mold, thereby improving the position accuracy of different holes.

[0016] 2. The present invention provides a molding heating hole in which a heating wire can be placed, so that the carrier tape can be heated during molding, and the temperature of the carrier tape can be maintained or further increased, making the carrier tape easier to mold and improving the molding accuracy of the carrier tape.

[0017] 3. The present invention provides molding cooling holes through which coolant can flow, so that the carrier tape can be cooled after molding, so that the carrier tape can be quickly shaped, the molding accuracy is ensured, and the molding efficiency is improved.

[0018] 4. The present invention can form multiple holes at the same time by arranging corresponding upper forming bosses and lower forming holes in an array, and the forming efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the technical description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 is a structural schematic diagram of a preheating unit;

[0021] Figure 2 is a front view schematic diagram of a preheating unit;

[0022] Figure 3 It is an enlarged schematic diagram of part A;

[0023] Figure 4 It is a cross-sectional schematic diagram along the BB direction;

[0024] Figure 5 It is a structural schematic diagram of the molding unit;

[0025] Figure 6 is a schematic side view of a molding unit;

[0026] Figure 7 It is a cross-sectional schematic diagram along CC direction;

[0027] Figure 8 It is a cross-sectional schematic diagram along the DD direction.

[0028] Among them, 200-heating slide rail, 210-upper heating drive source, 211-upper heating bracket, 212-upper heating buffer block, 213-upper heating block, 2130-upper heating convex strip, 2131-upper heating boss, 214-upper heating wire, 215-upper pressing plate, 2150-pressing plate slot, 220-lower heating drive source, 221-lower heating bracket, 222-lower heating buffer block, 223-lower heating block, 2230-lower heating convex strip, 2231-lower heating boss, 224-lower heating wire, 225- Lower pressing plate, 2251-hole discharge notch, 300-forming slide rail, 301-forming limit block, 310-upper forming drive source, 311-upper forming bracket, 312-forming heating buffer block, 313-upper forming block, 3130-upper forming convex strip, 3131-upper forming boss, 314-forming heating hole, 320-lower forming drive source, 321-lower forming bracket, 323-lower forming block, 3230-lower forming convex strip, 3231-lower forming hole, 324-forming cooling hole. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in this utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Example

[0031] The invention discloses a high-precision carrier tape forming device, which comprises a preheating unit arranged on a frame and a forming unit adjacent to the preheating unit.

[0032] Reference Figure 1 to Figure 4 As shown, the preheating unit comprises a heating rail 200, an upper heating drive source 210 and a lower heating drive source 220 arranged on a frame, and the upper heating drive source 210 and the lower heating drive source 220 are arranged opposite to each other. There are two heating rails 200, which are arranged parallel to each other to improve the stability of movement, keep the height of both sides consistent, and improve the heating uniformity.

[0033] The heating rail 200 is provided with an upper heating support 211 and a lower heating support 221 , and the upper heating support 211 and the lower heating support 221 are connected to the moving ends of the upper heating driving source 210 and the lower heating driving source 220 respectively.

[0034] An upper heating buffer block 212 is provided at the bottom of the upper heating bracket 211 , which can block the transfer of heat and ensure the stability of the operation of the upper heating driving source 210 and the heating slide rail 200 .

[0035] The upper heating block 213 is provided at the bottom of the upper heating buffer block 212, and an upper heating wire 214 is inserted into the interior thereof along the conveying direction of the carrier tape so that the upper heating block 213 is heated evenly. An upper heating convex strip 2130 and an upper pressing plate 315 are provided at the bottom of the upper heating block 213. The upper heating convex strip 2130 is provided along the direction of the upper heating wire 214, and an upper heating boss 2131 is provided at the bottom thereof. The upper heating boss 2131 is arranged in an array along the direction of the upper heating convex strip 2130, and its shape and size are consistent with the opening shape and size of the hole. The upper pressing plate 215 is provided along the conveying direction of the carrier tape, and a pressing plate slot 2150 is provided on it in the same direction. The width of the pressing plate slot 2150 is smaller than the width of the carrier tape. The upper heating boss 2131 can pass through the upper pressing plate 215 through the pressing plate slot 2150.

[0036] A lower heating buffer block 222 is provided on the top of the lower heating bracket 221 , which can block the transfer of heat and ensure the stability of the operation of the lower heating driving source 220 and the heating slide rail 200 .

[0037] The top of the lower heating buffer block 222 is provided with a lower heating block 223, and a lower heating wire 224 is penetrated inside the lower heating block 223 along the conveying direction of the carrier tape. The top of the lower heating block 223 is provided with a lower heating convex strip 2230 and a lower pressing plate 325. The lower heating convex strip 2230 is arranged along the direction of the lower heating wire 224, and a lower heating boss 2231 is arranged on the top. The lower heating boss 2231 is arranged in an array along the direction of the lower heating convex strip 2230, and its shape and size are consistent with the opening shape and size of the hole. The lower pressing plate 225 is arranged along the conveying direction of the carrier tape, and a pressing plate slot 2150 is opened on it in the same direction. The lower heating boss 2231 can pass through the lower pressing plate 225 through the pressing plate slot 2250. Each lower heating boss 2231 corresponds to an upper heating boss 2131, which can approach and move away from each other under the drive of the lower heating drive source 220 and the upper heating drive source 210, respectively. The minimum distance between the upper heating boss 2131 and the lower heating boss 2231 is substantially consistent with the thickness of the carrier tape to ensure sufficient heat transfer without damaging the structure of the carrier tape.

[0038] Reference Figures 5 to 8 As shown, the molding unit includes a molding slide rail 300, a molding limit block 301 and a lower molding drive source 320 arranged on a frame.

[0039] The molding slide rail 300 comprises two pairs of four mutually parallel slide rails, the upper two slide rails are provided with upper molding brackets 311, and the lower two slide rails are provided with lower molding brackets 321. The two pairs of slide rails are independent of each other so that the upper molding bracket 311 and the lower molding bracket 321 do not affect each other during movement, thereby improving molding accuracy.

[0040] The above-mentioned forming limit block 301 is provided with an upper forming drive source 310, which is arranged opposite to the lower forming drive source 320. The moving end of the upper forming drive source 310 is provided with a forming heating buffer block 312. The above-mentioned upper forming bracket 311 is connected to the forming limit block 301 and the forming heating buffer block 312 respectively. The upper forming bracket 311 can move up and down along the forming slide rail 300 driven by the upper forming drive source 310, and its maximum descending height is limited by the forming limit block 301 to prevent the upper forming bracket 311 from damaging the carrier after exceeding the limit, and at the same time, it can ensure the thickness of the side wall of the hole and improve the forming accuracy. The forming heating buffer block 312 can block heat transfer and ensure the stability of the operation of each mechanism.

[0041] The upper forming block 313 is provided at the bottom of the upper forming bracket 311, and a forming heating hole 314 is provided inside the upper forming bracket 311 along the conveying direction of the carrier tape. A heating wire can be provided in the forming heating hole 314 to increase the temperature of the carrier tape for better forming. An upper forming convex strip 3130 is provided at the bottom of the upper forming block 313 along the direction of the forming heating hole 314. An upper forming boss 3131 is provided on the upper forming convex strip 3130. The upper forming boss 3131 is arranged in an array along the direction of the upper forming convex strip 3130 and is located in the pressing plate slot 2150, and its shape and size are consistent with the shape and size inside the hole.

[0042] The lower molding bracket 321 is connected to the moving end of the lower molding driving source 320. The upper molding bracket 311 can move up and down along the molding slide rail 300 driven by the upper molding driving source 310.

[0043] A lower molding block 323 is provided at the top of the lower molding bracket 321, and a molding cooling hole 324 is provided inside the lower molding block 323 perpendicular to the conveying direction of the carrier. A plurality of molding cooling holes 324 are arranged in an array along the conveying direction of the carrier. Cooling liquid can flow through the molding cooling holes 324 to increase the molding speed of the carrier; at the same time, because it is arranged perpendicular to the conveying direction of the carrier, the heat transfer length between the coolant and the molding cooling holes 324 can be reduced, so that the cooling is more uniform and the molding quality is improved. A lower molding ridge 3230 is provided at the top of the lower molding block 323 along the conveying direction of the carrier. A lower molding hole 3231 is provided on the lower molding ridge 3230. The lower molding hole 3231 is arranged in an array along the direction of the lower molding ridge 3230 and is located in the pressure plate slot 2150, and its shape and size are consistent with the shape and size of the outside of the hole. Each upper molding boss 3131 corresponds to a lower molding hole 3231, which can be moved closer to or farther from each other under the drive of the upper molding drive source 310 and the lower heating drive source 320. The minimum distance between the upper molding boss 3131 and the lower molding hole 3231 is substantially consistent with the thickness of the carrier tape to improve molding quality.

[0044] Reference Figure 1 As shown, one end of the lower pressing plate 225 is provided with a hole discharge notch 2251 which is connected to the pressing plate slot 2150 and is used to allow the protruding holes to pass smoothly when the carrier is discharged after forming.

[0045] Working process:

[0046] Heating: The carrier moves along the direction of the pressing plate slot 2150 and finally arrives between the upper heating protrusion 2131 and the lower heating protrusion 2231; the upper heating driving source 210 and the lower heating driving source 220 drive the upper pressing plate 215 and the lower pressing plate 225 to approach each other and finally clamp the carrier to improve the accuracy of the heating position; at the same time, the upper heating protrusion 2131 and the lower heating protrusion 2231 are respectively pressed against the upper and lower surfaces of the carrier to locally heat the carrier.

[0047] Molding: The carrier tape continues to move along the direction of the pressing plate slot 2150, and finally arrives between the upper molding boss 313 and the lower molding hole 3231; the upper heating drive source 210 and the lower heating drive source 220 drive the upper pressing plate 215 and the lower pressing plate 225 to approach each other, and finally clamp the carrier tape to improve the accuracy of the molding position; the lower molding drive source 320 drives the lower molding hole 3231 to move upward, and finally supports it on the carrier tape; then the upper molding drive source 310 drives the upper molding boss 313 to move downward, and finally extends into the lower molding hole 3231 to complete the molding of the hole; then the upper molding boss 313 and the lower molding hole 3231 move away from each other, and the carrier tape is discharged to continue the next cycle.

[0048] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novelties disclosed herein.

Claims

1. A high-precision carrier tape forming device, characterized in that: It includes a forming slide rail arranged on a frame and an upper forming drive source and a lower forming drive source opposite to each other, wherein the moving ends of the upper forming drive source and the lower forming drive source are respectively provided with an upper forming block and a lower forming block, which are respectively provided with a forming heating hole capable of placing a heating wire and a forming cooling hole capable of circulating a coolant, as well as an upper forming boss and a lower forming hole arrayed along the direction of the forming heating hole, wherein each of the upper forming bosses corresponds to a lower forming hole; It comprises a heating slide rail arranged on a frame and an upper heating drive source and a lower heating drive source opposite to each other, wherein the moving ends of the upper heating drive source and the lower heating drive source are respectively provided with an upper heating block and a lower heating block, on which an upper heating wire and a lower heating wire are respectively provided, and an upper heating boss and a lower heating boss arrayed along the direction of the upper heating wire and the lower heating wire, and each of the upper heating bosses corresponds to a lower heating boss; The upper heating block and the lower heating block are respectively provided with an upper pressing plate and a lower pressing plate that can be clamped to each other, and the upper pressing plate and the lower pressing plate are both provided with pressing plate slots, and the upper heating boss, the lower heating boss, the upper forming boss and the lower forming hole are all located in the slots; The upper heating boss and the lower heating boss are respectively pressed against the upper and lower surfaces of the carrier tape to locally heat the carrier tape; the upper heating driving source and the lower heating driving source drive the upper pressing plate and the lower pressing plate to approach each other and clamp the carrier tape, and then the upper forming driving source drives the upper forming boss to move downward, and finally extends into the lower forming hole to complete the forming of the hole; The molding heating hole is arranged along the conveying direction of the carrier tape, and the molding cooling hole is perpendicular to the molding heating hole; A plurality of formed cooling holes are arranged in an array along the conveying direction of the carrier tape.

2. The high-precision carrier tape forming device according to claim 1, characterized in that: The shape and size of the upper forming boss are consistent with the shape and size of the inside of the cavity, and the shape and size of the lower forming hole are consistent with the shape and size of the outside of the cavity.

3. The high-precision carrier tape forming device according to claim 2, characterized in that: The minimum distance between the upper forming boss and the lower forming hole is substantially consistent with the thickness of the carrier tape.

4. The high-precision carrier tape forming device according to claim 1, characterized in that: The forming slide rails include two pairs of four mutually parallel slide rails in total. The upper forming bracket is arranged on the two upper slide rails, and the lower forming bracket is arranged on the two lower slide rails.

5. The high-precision carrier tape forming device according to claim 1, characterized in that: It comprises a forming limit block arranged on the frame, and the upper forming drive source is arranged on the forming limit block.

6. The high-precision carrier tape forming device according to claim 1, characterized in that: One end of the lower pressing plate is provided with a hole discharge notch for discharging the carrier tape after forming, and the hole discharge notch is communicated with the pressing plate slot.

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