Nano silver touch screen and preparation method thereof

Abstract

The present invention belongs to the field of touch screen technology, and specifically relates to a nano silver touch screen and a preparation method thereof, comprising a flexible circuit board and a substrate, wherein the surface of the substrate is provided with a first nano silver conductive layer, a first conductive silver paste layer, a first transparent insulating ink layer, a second nano silver conductive layer, a second conductive silver paste layer, and a second transparent insulating ink layer in sequence. The nano silver touch screen and the preparation method thereof provided by the present invention have simple processing steps, thereby greatly reducing production costs and improving production efficiency, using multiple layers of barrier materials for protection, and the manufactured touch screen has stronger environmental tolerance and longer service life.

Description

Technical Field

[0001] The present invention belongs to the technical field of touch screens, and in particular relates to a nano silver touch screen and a preparation method thereof. Background Art

[0002] The touch film is an absolute positioning system that is very suitable for human-computer interaction. It can realize complex operations of the display interface with simple finger movements. The basic structure of the traditional capacitive screen is an emitting layer, an adhesive layer, a receiving layer, an adhesive layer and a cover glass. However, with the development of products such as mobile terminals, wearable devices, smart home appliances, and educational blackboards, the demand for touch screens is increasing, and at the same time, the requirements for touch screens are also getting higher and higher. The requirements and demands for large-size touch screens are also increasing. However, the structure of the capacitive screen made by the traditional method is complex and the production process is complicated. In view of this, it is necessary to improve the existing method for preparing the touch screen and the structure of the touch screen to solve the above problems. Summary of the invention

[0003] The specific technical solutions are:

[0004] The nano silver touch screen comprises a flexible circuit board and a substrate, wherein the surface of the substrate is provided with a first nano silver conductive layer, a first conductive silver paste layer, a first transparent insulating ink layer, a second nano silver conductive layer, a second conductive silver paste layer and a second transparent insulating ink layer in sequence.

[0005] The preparation method of the nano silver touch screen comprises the following steps:

[0006] (1) coating a transparent first layer of nanosilver conductive layer on the surface of a double-sided or single-sided hardened substrate;

[0007] The first layer of nano silver conductive layer is coated with a thickness of 0.5-20 μm. After coating, it is dried and cured in a tunnel furnace at a baking temperature of 50-150°C. The thickness of the conductive layer after baking and drying is 20-2000 nm.

[0008] (2) printing a first conductive silver paste layer on the surface of the nanosilver conductive layer by screen printing;

[0009] The wet film thickness of the first conductive silver paste layer is 5-20μm. After printing, it is dried and cured in an oven or tunnel oven at a temperature of 50-200°C. The dry film thickness of the first conductive silver paste layer after final baking and drying is 1-10μm.

[0010] (3) Using laser etching equipment to laser process the product produced in step (2) to produce the required touch-sensitive graphics elements;

[0011] The type of laser machine is far-infrared laser machine, the frequency of laser is 10-200Hz, the pulse width is 10-500ps, and the speed is 1000-100,000mm / s;

[0012] (4) forming a first layer of transparent insulating ink on the product prepared in step (3) by printing or coating;

[0013] The wet film thickness of the first layer of transparent insulating ink is 5-20μm. After printing or coating, it is dried and cured in an oven or tunnel oven at a baking temperature of 50-200℃;

[0014] If UV curing ink is used, a UV curing machine is used for curing. The light intensity of the UV curing machine is 10-8000mj and the temperature is 20-80℃;

[0015] The dry film thickness of the first layer of transparent insulating ink after final baking and drying is 1-10μm;

[0016] (5) coating the product prepared in step (4) with a second nanosilver conductive layer;

[0017] Use slot extrusion coating, roller coating, wire coating or other coating processes, the coating thickness of the product is 0.5-20μm, after coating, use a tunnel furnace to dry and solidify, the baking temperature is 50-150℃, and the thickness of the second layer of nano silver conductive layer after baking and drying is 20-2000nm;

[0018] (6) Printing a second conductive silver paste layer on the product prepared in step (5) by screen printing;

[0019] The wet film thickness of the second conductive silver paste layer is 5-20μm. After printing, it is dried and cured in an oven or tunnel oven at a temperature of 50-200°C. The dry film thickness of the second conductive silver paste layer after baking and drying is 1-10μm.

[0020] (7) Printing a second transparent insulating ink layer pattern on the product of step (6) by screen printing;

[0021] The wet film thickness of the second transparent insulating ink layer is 5-20μm. After printing, it is dried and cured in an oven or tunnel oven at a baking temperature of 50-200℃;

[0022] If UV curing ink is used, a UV curing machine is used for curing. The light intensity of the UV curing machine is 10-8000mj, the temperature is 20-80°C, and the dry film thickness of the second layer of transparent insulating ink after final baking and drying is 1-10μm.

[0023] (8) The product in step (7) is placed in a cleaning line for cleaning, and a liquid with low oxidizing power is added to the cleaning liquid in the cleaning line;

[0024] (9) Using a hot pressing laminating machine, the flexible circuit board is pressed together with the product prepared in step (8) to form a nano silver touch screen.

[0025] The nano silver touch screen and the preparation method thereof provided by the present invention have the following technical advantages:

[0026] 1. The processing procedure is simple, which greatly reduces production costs and improves production efficiency;

[0027] 2. All materials used in the production process are environmentally friendly and will not cause damage to the environment;

[0028] 3. The use of multiple layers of barrier materials for protection makes the touch screen more environmentally resistant and has a longer service life;

[0029] 4. The product uses multiple layers of filter materials, which can block part of the blue light and protect the eyes. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the structure of the present invention. DETAILED DESCRIPTION

[0031] The technical solution of the present invention is explained in conjunction with the accompanying drawings.

[0032] like Figure 1 As shown, the nanosilver touch screen includes a flexible circuit board and a substrate 1, and the surface of the substrate 1 is provided with a first nanosilver conductive layer 2, a first conductive silver paste layer 3, a first transparent insulating ink layer 4, a second nanosilver conductive layer 5, a second conductive silver paste layer 6, and a second transparent insulating ink layer 7 in sequence.

[0033] The characteristic requirements of substrate 1 include a transmittance greater than 85% and a surface hardness ≥ 2H. Substrate 1 includes many transparent substrates such as PET, PMMA, PC, and glass. Two layers of patterns are made on the surface of a single substrate. Transparent insulating ink includes resin transparent materials and photoresist transparent materials.

[0034] The two layers of transparent insulating ink are printed with patterns consistent with the conductive pattern of the nano silver conductive layer, and the insulating ink layer is a full-surface printed layer.

[0035] The added components in the cleaning solution of step (8) include: water-soluble materials with low oxidizing ability such as hydrogen peroxide, sodium thiosulfate, sodium hydrosulfide, ferric chloride, and cupric chloride.

[0036] Conductive silver paste can be replaced by conductive copper wire, conductive copper paste, copper foil, aluminum foil and other materials

[0037] The nanosilver conductive layer can be replaced by other transparent conductive materials such as graphene, carbon nanotubes, ITO, IZO and polymer conductive adhesive.

[0038] The preparation method of the nano silver touch screen comprises the following steps:

[0039] (1) coating a transparent first nanosilver conductive layer 2 on the surface of a double-sided or single-sided hardened substrate 1;

[0040] The first nanosilver conductive layer 2 is coated with a thickness of 0.5-20 μm. After coating, it is dried and cured in a tunnel furnace at a baking temperature of 50-150° C. The thickness of the conductive layer after baking and drying is 20-2000 nm.

[0041] (2) printing a first conductive silver paste layer 3 on the surface of the nanosilver conductive layer by screen printing;

[0042] The wet film thickness of the first conductive silver paste layer 3 is 5-20 μm. After printing, it is dried and cured in an oven or a tunnel oven at a temperature of 50-200° C. The dry film thickness of the first conductive silver paste layer 3 after final baking is 1-10 μm.

[0043] (3) Using laser etching equipment to laser process the product produced in step (2) to produce the required touch-sensitive graphics elements;

[0044] The type of laser machine is far-infrared laser machine, the frequency of laser is 10-200Hz, the pulse width is 10-500ps, and the speed is 1000-100,000mm / s;

[0045] (4) forming a first layer of transparent insulating ink 4 on the product prepared in step (3) by printing or coating;

[0046] The wet film thickness of the first layer of transparent insulating ink 4 is 5-20 μm, and after printing or coating, it is dried and cured in an oven or tunnel oven at a baking temperature of 50-200° C.;

[0047] If UV curing ink is used, a UV curing machine is used for curing. The light intensity of the UV curing machine is 10-8000mj and the temperature is 20-80℃;

[0048] The dry film thickness of the first layer of transparent insulating ink 4 after final baking and drying is 1-10 μm;

[0049] (5) coating the product prepared in step (4) with a second nanosilver conductive layer 5;

[0050] The coating thickness of the product is 0.5-20 μm by using slit extrusion coating, roller coating, wire coating or other coating processes. After coating, the product is dried and cured in a tunnel furnace at a baking temperature of 50-150° C. The thickness of the second nanosilver conductive layer 5 after baking and drying is 20-2000 nm.

[0051] (6) Printing a second conductive silver paste layer 6 on the product prepared in step (5) by screen printing;

[0052] The wet film thickness of the printed second conductive silver paste layer 6 is 5-20 μm. After printing, it is dried and cured in an oven or tunnel oven at a temperature of 50-200° C. The dry film thickness of the second conductive silver paste layer 6 after final baking is 1-10 μm.

[0053] (7) Printing the pattern of the second transparent insulating ink layer 7 on the product in step (6) by screen printing;

[0054] The wet film thickness of the second transparent insulating ink layer 7 is 5-20 μm, and after printing, it is dried and cured in an oven or tunnel oven at a baking temperature of 50-200° C.;

[0055] If UV curing ink is used, a UV curing machine is used for curing. The light intensity of the UV curing machine is 10-8000mj, the temperature is 20-80°C, and the dry film thickness of the second layer of transparent insulating ink after final baking and drying is 1-10μm.

[0056] (8) The product in step (7) is placed in a cleaning line for cleaning, and a liquid with low oxidizing power is added to the cleaning liquid in the cleaning line;

[0057] (9) Using a hot pressing laminating machine, the flexible circuit board is pressed together with the product prepared in step (8) to form a nano silver touch screen.

Claims

1. A nano silver touch screen, comprising a flexible circuit board and a substrate, characterized in that: The surface of the substrate is provided with a first nano silver conductive layer, a first conductive silver paste layer, a first transparent insulating ink layer, a second nano silver conductive layer, a second conductive silver paste layer, and a second transparent insulating ink layer in sequence; The preparation method of the nano silver touch screen comprises the following steps: (1) coating a transparent first layer of nanosilver conductive layer on the surface of a double-sided or single-sided hardened substrate; (2) printing a first conductive silver paste layer on the surface of the nanosilver conductive layer by screen printing; (3) Using laser etching equipment to laser process the product produced in step (2) to produce the required touch-sensitive graphics elements; (4) forming a first layer of transparent insulating ink on the product prepared in step (3) by printing or coating; (5) coating the product prepared in step (4) with a second nanosilver conductive layer; (6) Printing a second conductive silver paste layer on the product prepared in step (5) by screen printing; (7) Printing a second transparent insulating ink layer pattern on the product of step (6) by screen printing; (8) The product in step (7) is placed in a cleaning line for cleaning, and a liquid with low oxidizing power is added to the cleaning liquid in the cleaning line; (9) Using a hot pressing laminating machine, the flexible circuit board and the product prepared in step (8) are pressed together to form a nano silver touch screen; The first layer of nanosilver conductive layer in step (1) is coated with a thickness of 0.5-20 μm. After coating, it is dried and cured in a tunnel furnace at a baking temperature of 50-150° C. The thickness of the conductive layer after baking and drying is 20-2000 nm. The wet film thickness of the first conductive silver paste layer printed in step (2) is 5-20 μm. After printing, it is dried and cured in an oven or tunnel oven at a baking temperature of 50-200° C. The dry film thickness of the first conductive silver paste layer after final baking and drying is 1-10 μm. The laser etching equipment in step (3) is a laser machine, the type of the laser machine is a far-infrared laser machine, the frequency of the laser is 10-200 Hz, the pulse width is 10-500 ps, ​​and the speed is 1000-100000 mm / s; The wet film thickness of the first layer of transparent insulating ink in step (4) is 5-20 μm, and after printing or coating, it is dried and cured in an oven or tunnel oven at a baking temperature of 50-200° C.; If UV curing ink is used, a UV curing machine is used for curing. The light intensity of the UV curing machine is 10-8000mj and the temperature is 20-80℃; The dry film thickness of the first layer of transparent insulating ink after final baking and drying is 1-10μm; The coating thickness of the second nanosilver conductive layer in step (5) is 0.5-20 μm. After coating, the second nanosilver conductive layer is dried and cured in a tunnel furnace at a baking temperature of 50-150° C. The thickness of the second nanosilver conductive layer after baking and drying is 20-2000 nm. The wet film thickness of the second conductive silver paste layer printed in step (6) is 5-20 μm. After printing, it is dried and cured in an oven or tunnel oven at a baking temperature of 50-200° C. The dry film thickness of the second conductive silver paste layer after final baking and drying is 1-10 μm. The wet film thickness of the second transparent insulating ink layer in step (7) is 5-20 μm, and after printing, it is dried and cured in an oven or tunnel oven at a temperature of 50-200° C.; If UV curing ink is used, a UV curing machine is used for curing. The light intensity of the UV curing machine is 10-8000mj and the temperature is 20-80℃; The dry film thickness of the second layer of transparent insulating ink after final baking and drying is 1-10 μm.

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