Thermosyphon cooling device

Abstract

The present invention provides a thermosiphon heat dissipation device, including an evaporator, wherein the inner cavity of the evaporator is divided into a plurality of mutually unconnected sub-cavities from top to bottom in the vertical direction, forming a plurality of sub-evaporators, wherein the sub-cavities of each sub-evaporator are connected to at least one condenser located above it through a steam pipe and a liquid pipe, and when the mutually connected sub-evaporators, condensers, steam pipes, and liquid pipes are evacuated and filled with working fluid, each sub-evaporator absorbs heat from a heat source and vaporizes the working fluid therein, and the vaporized working fluid reaches the condenser connected thereto through the steam pipe and is condensed by releasing heat, and then flows back to the sub-evaporator through the liquid pipe, forming a plurality of sub-thermosiphon heat dissipation circuits. The thermosiphon heat dissipation device greatly reduces the height space occupied by the condenser above the evaporator, and expands the application scope and advantages of the thermosiphon heat dissipation system.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and in particular to a thermal siphon heat dissipation device. Background Art

[0002] like Figure 1 As shown, the existing thermosiphon heat dissipation device generally includes: an evaporator 1a, a condenser 2a, and a steam pipe 3a and a liquid pipe 4a connecting the evaporator 1a and the condenser 2a. The inner air loop formed by the connection of these components is filled with a working medium. After the evaporator 1a absorbs the heat from the heat source, the working medium inside it boils and vaporizes, and enters the condenser 2a through the steam pipe 3a. After the condenser 2a releases heat to other media (such as air or refrigerant), the vaporized working medium inside it condenses into liquid; the liquid working medium flows back to the evaporator 1a through the liquid pipe 4a, and the cycle continues, realizing the continuous transmission and dissipation of the heat flow of the heat source.

[0003] Because the condenser of the thermal siphon heat dissipation device relies on gravity reflux, the working fluid flow must be unidirectional and flow from high to low, and the flow cannot be turned back in the opposite direction of gravity. These characteristics determine that the condenser of the thermal siphon heat dissipation device occupies a relatively significant height space.

[0004] The structure of the thermosiphon heat dissipation device that works based on the thermosiphon principle needs to meet the following conditions: the condenser 2a must be higher than the evaporator 1a, that is, the condenser 2a needs to be set above the evaporator 1a. Therefore, in the thermosiphon heat dissipation device, the condenser 2a needs to occupy the space above the evaporator 1a. This leads to the problem that the height of the entire thermosiphon heat dissipation device is too large, and the space above the evaporator 1a is not fully utilized. This problem is more prominent when the heat consumption of the heat source of the evaporator 1a is relatively large, because the greater the heat consumption of the heat source, the larger the size of the condenser 2a, and the greater the height required to be occupied. Summary of the invention

[0005] The purpose of the present invention is to solve the problem in the prior art of thermal siphon heat dissipation devices that the condenser occupies too much height space above the evaporator, resulting in the overall height of the thermal siphon heat dissipation device being too large and the space above it not being fully utilized.

[0006] In order to solve the above technical problems, the present invention provides a thermosiphon heat dissipation device, comprising an evaporator, wherein the inner cavity of the evaporator is divided into a plurality of mutually unconnected sub-cavities in sequence from top to bottom in the vertical direction, forming a plurality of sub-evaporators, each sub-cavity of the sub-evaporator is connected to at least one condenser located above it through a steam pipe and a liquid pipe, and the mutually connected sub-evaporators, condensers, steam pipes and liquid pipes are evacuated and filled with working fluid;

[0007] During operation, each sub-evaporator absorbs heat from the heat source and vaporizes the working fluid therein. The vaporized working fluid reaches the condenser connected to it through the steam pipe, releases heat and condenses, and then flows back to the sub-evaporator through the liquid pipe, forming multiple sub-thermal siphon heat dissipation loops.

[0008] In the thermosiphon heat dissipation device, the condensers on the evaporator are arranged in layers in sequence in the height direction.

[0009] In the thermosiphon heat dissipation device, two adjacent condensers are arranged in a V shape, forming an angle that is open in a direction other than the up and down direction.

[0010] In the thermosiphon heat dissipation device, the condensers of each layer except the top layer are all located on the side of the evaporator.

[0011] In the thermosiphon heat dissipation device, the condensers on the evaporator are arranged in sequence along the horizontal direction, and the other condensers except the condenser corresponding to the top sub-evaporator are wholly or partially located on the side of the evaporator.

[0012] In the thermosiphon heat dissipation device, two adjacent condensers are spaced apart from each other, and a baffle is provided between the two adjacent condensers.

[0013] The thermosiphon heat dissipation device, the condenser is a parallel flow heat exchanger, and the parallel flow heat exchanger includes: an upper header, a lower header and a plurality of flat tubes arranged in parallel and at intervals between the upper and lower headers, each flat tube is connected to the header connected thereto, the liquid pipe is connected to the lower header, and the steam pipe is connected to the upper header.

[0014] In the thermosiphon heat dissipation device, the evaporator has a heat absorbing surface in contact with the object to be dissipated, and the heat absorbing surface is vertical.

[0015] In the thermosiphon heat dissipation device, the liquid pipe and the steam pipe are both welded to the opening of the evaporator or the condenser of the thermosiphon heat dissipation device through an adapter. The adapter is a metal part, and interconnected through holes are provided on its two opposite first main surfaces and second main surfaces. The shape of the first main surface is adapted to the welding fitting surface of the thermosiphon heat dissipation device. The liquid pipe or the steam pipe is inserted into the through hole from the second main surface and welded. The aperture of the through hole on the second main surface is larger than the aperture of the first main surface.

[0016] The thermosiphon heat dissipation device, the liquid pipe and the steam pipe are both welded to the opening of the evaporator or condenser of the thermosiphon heat dissipation device through an adapter, the adapter is a metal part, the holes opened on the first main surface and the second main surface perpendicular to each other are internally intersected and interconnected, the shape of the first main surface is adapted to the welding fitting surface of the thermosiphon heat dissipation device, the liquid pipe or the steam pipe is inserted into the through hole from the second main surface and welded, the hole opened on the second main surface adopts a variable diameter design, and the hole diameter becomes smaller inside the part.

[0017] It can be seen from the above technical solution that the beneficial effects of the present invention are:

[0018] The present invention divides a single evaporator into multiple independent sub-evaporators. The heat source heat consumption distributed on a single sub-evaporator is only a divided part of the entire evaporator, and the size requirement of the corresponding condenser will be greatly reduced. Therefore, in general, under the premise that the heat source distribution and heat consumption on the entire evaporator remain unchanged, the upper height space occupied by the condenser is significantly reduced.

[0019] Since the present invention only requires that the sub-thermal siphon heat dissipation circuit satisfies the thermal siphon principle, that is, the condenser is located above the sub-evaporator connected to it, it can work, so it can break through the restriction that the condenser must be higher than a single evaporator as a whole, that is, a condenser can be partially or completely not higher than the evaporator and be located on the side of the evaporator, thereby significantly reducing the height space occupied by the condenser above the single evaporator. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of a thermosiphon heat dissipation device in the prior art.

[0021] Figure 2 It is a structural schematic diagram of Example 1 of the thermal siphon heat dissipation device of the present invention.

[0022] Figure 3 yes Figure 2 Stereoscopic diagram.

[0023] Figure 4 The figure is a schematic diagram of the structure of one of the adapters.

[0024] Figure 5 A schematic diagram of the structure of another adapter.

[0025] Figure 6 Schematic diagram of the structure of the third adapter.

[0026] Figure 7 It is a schematic structural diagram of Example 2 of the thermal siphon heat dissipation device of the present invention.

[0027] Figure 8 It is a structural schematic diagram of Example 3 of the thermal siphon heat dissipation device of the present invention.

[0028] The reference numerals in the accompanying drawings are as follows: 1a, evaporator; 2a, condenser; 3a, steam pipe; 4a, liquid pipe; 1, thermal siphon heat dissipation device; 11, evaporator; 12, sub-thermal siphon heat dissipation circuit; 111, sub-evaporator; 121, condenser; 1211, collecting pipe; 1212, flat pipe; 122, liquid pipe; 123, steam pipe; 13, liquid filling pipe; 15, adapter; 14, mounting hole; 16, baffle. DETAILED DESCRIPTION

[0029] Typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different embodiments without departing from the scope of the present invention, and the descriptions and illustrations therein are essentially used for illustration purposes rather than for limiting the present invention.

[0030] In order to further illustrate the principle and structure of the present invention, preferred embodiments of the present invention are now described in detail with reference to the accompanying drawings.

[0031] Example 1.

[0032] See also Figure 2 and Figure 3 The present embodiment provides a thermosiphon heat dissipation device 1, which can be used to achieve heat transfer and heat dissipation. The thermosiphon heat dissipation device 1 includes an evaporator 11, and a horizontal partition is provided in the inner cavity of the evaporator 11. Figure 2 The middle dotted line indicates the location of the partition, which divides the inner cavity of the evaporator into two sub-cavities that are not connected to each other and are distributed up and down, forming multiple sub-evaporators 111. The cavity of each sub-evaporator 111 is connected to at least one condenser 121 through a steam pipe 123 and a liquid pipe 122, wherein one end of the condenser 121 is connected to the liquid inlet of the sub-evaporator 111 matched with it through the liquid pipe 122, and the other end is connected to the gas outlet of the sub-evaporator through the steam pipe 123. The interconnected sub-evaporators 111, condensers 121, steam pipes 123 and liquid pipes 122 are evacuated and filled with working fluid.

[0033] During operation, the working fluid in each sub-evaporator 111 vaporizes after absorbing heat from the heat source, and the vaporized working fluid reaches the condenser 121 connected to the sub-evaporator 111 through the steam pipe 123 to release heat and condense, and the condensed working fluid then flows back to the sub-evaporator 111 of the evaporator 11 through the liquid pipe 122, forming multiple independent sub-thermal siphon heat dissipation circuits 12.

[0034] Under the premise of keeping the heat absorption surface area or heat dissipation capacity of the evaporator 11 unchanged, the heat consumption of the heat source borne by each sub-evaporator 111 is only a part of the entire evaporator 11, and the corresponding size requirements of the condenser 121, especially the length dimension, will be greatly reduced. Therefore, in general, under the premise of keeping the heat source distribution and heat consumption on the entire evaporator 11 unchanged, the height space occupied by the condenser 121 on the upper part is greatly reduced. In this embodiment, the condensers 121 of each layer except the top layer are all located on the side of the evaporator 11, so except for the top condenser 121, the lower condenser 121 does not occupy the height space above the evaporator 11. At the same time, since the size of each condenser 121 is reduced, the height occupied by the top condenser 121 above the evaporator 11 will also be reduced, so that the height space above the evaporator 11 is not occupied too much, and the overall height of the thermosiphon heat dissipation device 1 is avoided to be too large.

[0035] Based on the working principle of heat dissipation by thermosiphon, in this embodiment, the condenser 121 is higher than the height of the sub-evaporator 111 connected thereto, and the gas outlet on the same sub-evaporator 111 is higher than the height of the liquid inlet. At the same time, in order to ensure the pressure balance in the thermosiphon circuit, gravity is required to offset the resistance of the working fluid flowing in the condenser 121, so the connection position of the same condenser 121 with the liquid pipe 122 is lower than the connection position of the same condenser 121 with the steam pipe 123.

[0036] The height difference between the two connecting positions of the condenser 121 and the liquid pipe 122 and the steam pipe 123 is related to the heat consumption of the heat source of the corresponding sub-evaporator 111. When the heat consumption of the heat source of the sub-evaporator 111 is small to a certain extent, the connecting position of the condenser 121 matched with the sub-evaporator 111 and the liquid pipe 122 can be equal to or higher than the connecting position of the condenser 121 and the steam pipe 123. Preferably, when the heat consumption of the heat source of the uppermost sub-evaporator 111 in the evaporator 11 is small to a certain extent, for the condenser 121 connected with the sub-evaporator 111, its connecting position with the liquid pipe 122 can be equal to or higher than its connecting position with the steam pipe 123. At this time, the condenser 121 connected with the uppermost sub-evaporator 111 basically does not occupy or seldom occupies the height space above the evaporator 11.

[0037] In this embodiment, the evaporator 11 uses a horizontal partition to divide the evaporator 11 into two upper and lower sub-evaporators 111. In practical applications, the orientation and shape of the partition are not limited to this. The partition can also be inclined, and even the partition can be a non-flat plate, a non-regular plate, or a partition of any shape. The number of partitions is not limited to one, and can be multiple, as long as the partition can divide the evaporator 11 into multiple independent sub-evaporators 111. For other forms of evaporators, such as a tube fin evaporator that absorbs air heat, a tube partition or the like will be used to separate the evaporator cavity.

[0038] In this embodiment, the condenser 121 is a parallel flow heat exchanger, which includes a pair of parallel headers 1211 and a plurality of flat tubes 1212 connected between the two headers 1211, and the plurality of flat tubes 1212 are arranged in parallel and spaced apart from each other. Each flat tube 1212 is connected to the header 1211 connected thereto, the liquid pipe 122 is connected to one of the headers 1211, and the steam pipe 123 is connected to the other header 1211. The parallel flow heat exchanger of the present invention may have a secondary heat dissipation fin between two adjacent flat tubes 1212 for increasing the heat exchange area between the condenser 121 and the air, or may not have a secondary heat dissipation fin.

[0039] The heat absorption surface of the evaporator 11 in this embodiment is provided with mounting holes 14 for mounting heat components. The evaporator 11 is divided into multiple sub-evaporators 111 from the inside without affecting the layout convenience of the heat-generating components mounted on the heat absorption surface. Even the same heat-generating component can be mounted on the upper and lower sub-evaporators 111 at the same time, and its heat loss is absorbed by the two sub-evaporators 111 at the same time. When the heat component is mounted on the evaporator 11, it is fastened through the mounting holes 14, which can compress the thermal interface material placed between the heat absorption surface of the evaporator 11 and the bottom surface of the heat component.

[0040] like Figure 2 and Figure 3 As shown, in this embodiment, the condensers 121 on the evaporator 11 are arranged in layers in the height direction. This arrangement is conducive to saving space in the height direction and making the condensers 121 more compact. Two adjacent condensers 121 are arranged in a V shape, forming an angle that is open in a non-up and down direction. An air drive device can be arranged at the open position, and two adjacent condensers 121 can be forced to cool at the same time. This air duct structure is simple, efficient and economical.

[0041] In this embodiment, each sub-thermosyphon loop 12 is filled with working fluid through a filling pipe 13. The filling pipe 13 is connected to the corresponding sub-thermosyphon loop, and the corresponding sub-thermosyphon loop is evacuated through the filling pipe 13 before filling with working fluid. The filling pipe 13 of this embodiment is arranged on the manifold 1211 of the condenser 121 of each sub-thermosyphon loop 12, and the end of the filling pipe 13 is sealed to the outside after the working fluid is filled. In practical applications, the filling pipe 13 can be arranged at any position of the sub-thermosyphon heat dissipation loop.

[0042] In this embodiment, the liquid pipe 122 and the steam pipe 123 are both connected to the sub-evaporator 111 and the condenser 121 through the adapter 15 .

[0043] See also Figure 2 , Figure 3 , Figure 4 and Figure 5The adapter 15 is a metal part, and through holes are provided on its first main surface 152 and second main surface 151. The shape of the first main surface 152 is adapted to the welding and fitting surface of the thermosyphon heat dissipation device. The liquid pipe 122 or the steam pipe 123 is inserted into the through hole 1511 from the second main surface 151 and welded. The aperture of the through hole 1511 on the second main surface 151 is larger than that on the first main surface 152, so that the through hole 1511 forms a step at the position of the diameter change, and the step is for the automatic limit of the insertion of the pipe. When the adapter 15 is fixed on the heat absorption surface of the evaporator 11 of the thermosyphon heat dissipation device, the first main surface 152 of the adapter 15 adapted thereto is a plane. When the adapter 15 is fixed on the upper and lower manifolds 1211 of the condenser 121 of the thermosyphon heat dissipation device, the first main surface 152 of the adapter 15 adapted thereto is an arc surface matching the manifold.

[0044] exist Figure 4 and Figure 5 In the adapter shown in FIG. 1 , the first main surface 152 and the second main surface 151 are arranged opposite to each other. In other embodiments, the first main surface 152 and the second main surface 151 may also be perpendicular to each other. Figure 6 As shown, the adapter seat has a hole 1521 and a hole 1511 respectively on its two mutually perpendicular first main surfaces 152 and second main surfaces 151. The two holes 1521 and 1511 are cross-connected and interconnected inside the adapter seat. The shape of the first main surface 152 is adapted to the welding bonding surface of the thermal siphon heat dissipation device. The liquid pipe 122 or the steam pipe 123 is inserted into the through hole from the second main surface 151 and welded. The hole opened on the second main surface 151 adopts a variable diameter design, and the hole diameter becomes smaller inside the part.

[0045] This access method facilitates the positioning of the steam pipe 123 and the liquid pipe 122, and the sealing welding after positioning will not cause solder blockage. The adapter 15 is pre-welded to the liquid inlet and gas outlet of the evaporator 11 and the opening on the manifold 1211 of the condenser 121.

[0046] In this embodiment, the evaporator 11, the condenser 121, the steam pipe 123, the liquid pipe 122 and the adapter 15 are all made of aluminum alloy.

[0047] Example 2.

[0048] See also Figure 7 The thermosiphon heat dissipation device 1 in this embodiment is substantially the same as that in Embodiment 1, except that the condensers 121 in this embodiment are arranged in sequence in the horizontal direction. The arrangement of the condensers 121 in sequence in the horizontal direction is suitable for the external air flow to flow through the condensers 121 in the vertical direction, and is suitable for the air flow to dissipate heat naturally from bottom to top.

[0049] Under the premise of keeping the heat absorption surface area or heat dissipation capacity of the evaporator 11 unchanged, the heat consumption of the heat source borne by each sub-evaporator 111 is only a part of the entire evaporator 11. Therefore, the size of the condenser 121 connected to each sub-evaporator 111 will be greatly reduced. At the same time, most of the left condenser 121 is not higher than the evaporator but is located on the side of the evaporator, so that the height space above the evaporator 11 is not too occupied and the overall height of the thermal siphon heat dissipation device 1 is avoided to be too large.

[0050] Example 3.

[0051] See also Figure 8 In another preferred embodiment, Figure 7 The difference is that adjacent condensers 121 are spaced apart from each other, and baffles 16 are provided between adjacent condensers 121. The baffles 16 can prevent the hot air discharged from the condensers 121 from affecting each other, further ensuring the heat dissipation effect of the thermosiphon heat dissipation device 1.

[0052] Although the present invention has been described with reference to several typical embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the present invention can be embodied in a variety of forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims, so all changes and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A thermosyphon heat dissipation device, characterized in that: The invention comprises an evaporator, wherein a partition is provided in the inner cavity of the evaporator so as to divide the inner cavity of the evaporator into a plurality of mutually unconnected sub-cavities in a vertical direction from top to bottom, thereby forming a plurality of sub-evaporators, wherein each sub-cavity of the sub-evaporator is connected to at least one condenser located above it through a steam pipe and a liquid pipe, and the mutually connected sub-evaporators, the condenser, the steam pipe and the liquid pipe are evacuated and filled with a working medium; When working, each sub-evaporator absorbs the heat from the heat source and vaporizes the working fluid therein. The vaporized working fluid reaches the condenser connected thereto through the steam pipe and releases heat to be condensed. Then, the working fluid flows back to the sub-evaporator through the liquid pipe, forming multiple sub-thermal siphon heat dissipation loops. The plurality of sub-evaporators at least include a lower sub-evaporator located at the bottom and an upper sub-evaporator located above the lower sub-evaporator, an upper condenser is correspondingly arranged on the side of the upper sub-evaporator, and a lower condenser is correspondingly arranged on the side of the lower sub-evaporator; Among them, at least part of the lower condenser is arranged in the space below the air outlet on the side of the upper sub-evaporator, and is arranged in the space above the air outlet on the side of the corresponding sub-evaporator, so that part or all of the lower condenser can be arranged below the top surface of the evaporator.

2. The thermosyphon heat dissipation device according to claim 1, characterized in that: The condensers on the evaporator are arranged in layers in sequence in the height direction.

3. The thermosyphon heat dissipation device according to claim 2, characterized in that: The two adjacent condensers are arranged in a V shape, forming an angle that is open in a non-up and down direction.

4. The thermosyphon heat dissipation device according to claim 2, characterized in that: All layers of condensers except the top layer are located on the side of the evaporator.

5. The thermosyphon heat dissipation device according to claim 1, characterized in that: The condensers on the evaporator are arranged in sequence along the horizontal direction, and all or part of the condensers except the condenser corresponding to the top sub-evaporator are located on the side of the evaporator.

6. The thermosyphon heat dissipation device according to claim 5, characterized in that: Two adjacent condensers are spaced apart from each other, and a baffle is provided between the two adjacent condensers.

7. The thermosyphon heat dissipation device according to any one of claims 2, 3, 4, 5 and 6, characterized in that: The condenser is a parallel flow heat exchanger, which includes: an upper header, a lower header and a plurality of flat tubes arranged in parallel between the upper and lower headers, each flat tube is connected to the header connected thereto, the liquid pipe is connected to the lower header, and the steam pipe is connected to the upper header.

8. The thermosyphon heat dissipation device according to any one of claims 2, 3, 4, 5 and 6, characterized in that: The evaporator has a heat absorbing surface in contact with the heat dissipated object, and the heat absorbing surface is vertical.

9. The thermosyphon heat dissipation device according to claim 1, characterized in that: The liquid pipe and the steam pipe are both welded to the opening of the evaporator or the condenser of the thermosiphon heat dissipation device through an adapter. The adapter is a metal part, and interconnected through holes are provided on its two opposite first main surfaces and second main surfaces. The shape of the first main surface is adapted to the welding bonding surface of the thermosiphon heat dissipation device. The liquid pipe or the steam pipe is inserted into the through hole from the second main surface and welded. The aperture of the through hole on the second main surface is larger than the aperture of the first main surface.

10. The thermosyphon heat dissipation device according to claim 1, characterized in that: The liquid pipe and the steam pipe are both welded to the opening of the evaporator or condenser of the thermosiphon heat dissipation device through an adapter. The adapter is a metal part. The holes opened on the first main surface and the second main surface perpendicular to each other are internally intertwined. The shape of the first main surface is adapted to the welding bonding surface of the thermosiphon heat dissipation device. The liquid pipe or the steam pipe is inserted into the through hole from the second main surface and welded. The hole opened on the second main surface adopts a variable diameter design, and the hole diameter becomes smaller inside the part.

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