A glass substrate fully automatic cutting device and method

Abstract

Disclosed is a fully automatic glass substrate cutting device, comprising: a cutting platform, a lifting device, a cutting device and an adsorption and transfer device, wherein the cutting platform is used to carry a glass substrate to be cut; the lifting device is used to transport the glass substrate, which can dock with the cutting platform, thereby moving the glass substrate to fall onto the cutting platform and the cutting platform receives the glass; the cutting device is used to cut the glass substrate located on the cutting platform; the adsorption and transfer device is used to adsorb the cut glass substrate, and then move the cut glass substrate out of the cutting platform in a predetermined order. Also disclosed is a fully automatic glass substrate cutting method, comprising: placing the glass substrate to be cut on the cutting platform by using the lifting device, moving the cutting device along a cutting track to cut the glass substrate in accordance with the cutting track, adsorbing the cut glass substrate by the adsorption and transfer device, and then moving the cut glass substrate out of the cutting platform in a predetermined order.

Description

Technical Field

[0001] The present invention relates to the field of liquid crystal display panel manufacturing, and more specifically, to a glass substrate fully automatic cutting device and method. Background Art

[0002] At present, for the glass substrates of OLED, Array, TSP&BP segments, they need to be cut, sampled, and scrapped. During the cutting process, due to the difference in thickness between each glass substrate to be cut, the cutting effect will be poor. In addition, the cutting process is accompanied by debris. If the foreign matter on the cutting platform is not cleaned up, when the flat plate on the cutting platform is cut, the part of the glass substrate corresponding to the foreign matter will be lifted up, making the substrate uneven, resulting in inaccurate positioning of the substrate during the cutting process or even broken pieces, which is inconvenient for sampling after cutting. Therefore, for the current cutting platform, the debris on the platform needs to be removed after the cutting process. Although the current stage structure is provided with a device for removing debris, its ability to remove debris on the stage is limited, making it difficult to improve the product cutting yield, and the complex design structure of the current stage leads to its limited automation capability, affecting production capacity. Furthermore, the manual transportation of the glass substrate to be cut to the cutting platform and the manual sampling after cutting greatly reduce the work efficiency, resulting in the process section processing the relevant glass substrate for too long, which cannot meet the production needs. Summary of the invention

[0003] The present invention aims to solve the problems of poor cutting effect, incomplete removal of debris from the cutting platform, reduced work efficiency caused by non-automatic glass receiving and sampling in the prior art due to the difference in thickness between glass substrates, and provides a fully automatic cutting device that automatically receives glass substrates, automatically removes and discards them, and automatically cleans up debris. At the same time, the present invention also provides a fully automatic cutting method that automatically receives glass substrates, automatically removes and discards cracks, and automatically cleans up debris.

[0004] 1. A fully automatic glass substrate cutting device, comprising: a cutting platform, a lifting device, a cutting device and an adsorption and transplanting device, wherein:

[0005] The cutting platform is used to carry the glass substrate to be cut;

[0006] The lifting device is used to transport the glass substrate, and can dock with the cutting platform, so as to move the glass substrate to fall onto the cutting platform and the cutting platform receives the glass;

[0007] The cutting device is used for cutting the glass substrate located on the cutting platform;

[0008] The adsorption and transfer device is used to adsorb the cut glass substrates, and then move the cut glass substrates out from the cutting platform according to a predetermined sequence.

[0009] 2. The fully automatic glass substrate cutting device according to item 1, wherein:

[0010] The top surface of the cutting platform is rectangular, and the cutting platform has several areas corresponding to the cutting track of the cutting device, and each area can independently control the adsorption force it gives to the received glass substrate, so that when the adsorption transfer device absorbs the glass, the adsorption force difference between each glass substrate crack after cutting along the cutting track and the cutting platform is controlled, so that the cut glass is further cracked along the cutting track.

[0011] 3. The fully automatic glass substrate cutting device according to item 1 or 2, wherein:

[0012] The lifting device is a servo lifting device located below the cutting platform, which includes:

[0013] A load workbench, a ball screw, a linear bearing and a servo motor. The servo motor drives the ball screw and cooperates with the linear bearing to drive the load workbench to move up and down.

[0014] 4. The fully automatic glass substrate cutting device according to item 2 or 3, wherein:

[0015] The cutting platform and the lifting device are connected by means of pins located on the load workbench of the lifting device and pin holes of the cutting platform.

[0016] Preferably, the pins are evenly distributed on the load table,

[0017] The pins are preferably made of an antistatic material, more preferably PEEK.

[0018] 5. The fully automatic glass substrate cutting device according to item 4, wherein:

[0019] Each area can independently control the adsorption force it applies to the received glass substrate, thereby changing the pressure difference between the cracks of each glass substrate after cutting along the cutting track, so that the cut glass is further cracked along the cutting track by controlling the vacuum degree between the cutting platform on each area and the adsorbed glass cracks.

[0020] 6. The fully automatic glass substrate cutting device according to item 5, wherein:

[0021] Each area has an independent gas path control system and each area has at least one adsorption hole set away from the pin hole.

[0022] By performing suction or exhaust operation on the adsorption holes of each area through each gas path control system, a difference in vacuum degree between the cutting platform and the adsorbed glass fragments in each area is achieved, so that different forces are applied to the fragments.

[0023] 7. The fully automatic glass substrate cutting device according to any one of items 1 to 6, wherein the cutting device comprises a cutting assembly and a module for sliding the cutting assembly, and the module for sliding the cutting assembly can control the cutting assembly to move along a cutting track to achieve cutting of the glass to be cut;

[0024] Preferably, the module is a two-axis gantry type module.

[0025] 8. The fully automatic glass substrate cutting device according to item 7, wherein the cutting assembly comprises:

[0026] Cylinder, air system and cutter head,

[0027] The gas circuit system includes a positive pressure gas circuit system, a negative pressure gas circuit system and a pneumatic pressure control unit.

[0028] The positive pressure air circuit system is connected to the pneumatic pressure control unit.

[0029] The positive pressure air circuit system is connected to the cylinder, and the cutter head is connected to the lower part of the cylinder;

[0030] Preferably, the cylinder is a low friction cylinder,

[0031] Preferably, the pneumatic pressure control unit comprises a proportional valve.

[0032] 9. The fully automatic glass substrate cutting device according to item 8, wherein the cutting assembly further comprises:

[0033] Servo control system, reducer, synchronous belt and synchronous pulley combination;

[0034] The synchronous belt and synchronous pulley combination comprises: a driving pulley, a driven pulley and a synchronous belt connecting the driving pulley and the driven pulley;

[0035] The lower part of the servo control system is connected to a reducer, the lower part of the reducer is connected to a driving wheel, the driven wheel is connected to the upper part of the cylinder, the cutter head is located on the axis of the driven wheel, the rotation of the driving wheel is controlled by the servo control system, the driving wheel drives the driven wheel to rotate, and then drives the cylinder and the cutter head to rotate synchronously.

[0036] 10. The fully automatic glass substrate cutting device according to item 9, wherein the cutting assembly is further equipped with a synchronous belt tensioning mechanism acting on the synchronous belt;

[0037] Preferably, the gas circuit system is connected to a manual lifting platform, and the manual lifting platform is provided with a locking hand wheel;

[0038] More preferably, a sensor is also installed on the upper part of the gas circuit system to confirm the rotation of the cutter head;

[0039] Most preferably, the cutting assembly is also equipped with a filter connected to the negative pressure air circuit system, and a straw connected to the lower end of the filter, and the lower end of the straw is arranged adjacent to the cutter head.

[0040] 11. The fully automatic glass substrate cutting device according to any one of items 1 to 10, wherein the cutting device further comprises:

[0041] Cleaning components,

[0042] The cleaning assembly includes a brush, a brush lifting mechanism and a debris collection box.

[0043] 12. The fully automatic glass substrate cutting device according to any one of items 6 to 11, wherein the adsorption and transplanting device comprises:

[0044] Adsorption assembly, lifting assembly connected to the upper part of the adsorption assembly, and transplanting assembly,

[0045] The adsorption component includes at least one suction cup,

[0046] The distribution of the suction cups is consistent with the distribution of the adsorption holes on the cutting platform.

[0047] 13. The fully automatic glass substrate cutting device according to any one of items 1 to 12, wherein the device further comprises:

[0048] A waste cart is located underneath the end of the transplanting assembly.

[0049] 14. The fully automatic glass substrate cutting device according to any one of items 1 to 13, wherein the device further comprises:

[0050] The glass substrate to be cut is transported to the robotic arm above the cutting platform.

[0051] 15. The fully automatic glass substrate cutting device according to any one of items 1 to 14, wherein the glass substrate to be cut is a scrapped glass substrate.

[0052] 16. A method for cutting a glass substrate, comprising:

[0053] Use the lifting device to place the glass substrate to be cut on the cutting platform.

[0054] moving the cutting device along the cutting track to cut the glass substrate according to the cutting track,

[0055] The adsorption and transfer device adsorbs the cut glass substrates, and then removes the cut glass substrates from the cutting platform in a predetermined order.

[0056] Among them, the cutting platform is used to carry the glass substrate to be cut; the lifting device is used to transport the glass substrate, which can be docked with the cutting platform, so as to move the glass substrate to fall onto the cutting platform and the cutting platform receives the glass; the cutting device is used to cut the glass substrate located on the cutting platform; the adsorption and transfer device is used to adsorb the cut glass substrate, and then move the cut glass substrate out of the cutting platform according to a predetermined order.

[0057] 17. The method according to claim 16, wherein the method further comprises:

[0058] After the cutting device is moved along the cutting track to cut the glass substrate according to the cutting track,

[0059] Each of the plurality of regions of the cutting platform independently controls the adsorption force it gives to the received glass substrate, so that when the adsorption transfer device absorbs the glass, the adsorption force difference between each glass substrate crack after being cut along the cutting track and the cutting platform is controlled, so that the cut glass is further cracked along the cutting track.

[0060] Then the adsorption and transfer device is used to adsorb the further cracked cut glass substrate, and then the cut glass substrate is removed from the cutting platform according to a predetermined order, wherein:

[0061] The top surface of the cutting platform is rectangular, and the cutting platform has a plurality of areas corresponding to the cutting track of the cutting device.

[0062] 18. The method according to item 16 or 17, further comprising:

[0063] The cut glass fragments are removed from the cutting platform and transferred to a scrap car.

[0064] 19. The method according to any one of items 16 to 18, further comprising:

[0065] While the glass substrate is being cut, the cutting platform is cleaned by using a cleaning assembly including a brush, a brush lifting mechanism and a debris collection box.

[0066] 20. The method according to any one of items 16 to 19, wherein the glass is cut using the apparatus according to any one of items 1 to 15.

[0067] Preferably, the fully automatic glass substrate cutting device of the present invention further comprises a PLC controller, and all operations are completed according to a program pre-set by the PLC controller, thus ensuring the accuracy and effectiveness of the operations.

[0068] PLC controller, Programmable Logic Controller (PLC for short), is a digital electronic device with a microprocessor. It is a digital logic controller used for automatic control. It can load control instructions into memory at any time for storage and execution. It is a modular combination of programmable CPU, instruction and data memory, input and output units, power supply modules, digital simulation and other units.

[0069] Effects of the Invention

[0070] Using the device and method of the present invention, the cutting platform is provided with pin holes, and the lifting device below is provided with corresponding pins, so that the cutting device and the lifting device are docked, so that the glass substrate to be cut can be automatically received, and the glass substrate can be smoothly placed on the cutting platform, saving the cost of manual handling. In addition, the material of the pin is antistatic material, which can effectively prevent static electricity from being generated between the glass substrate and the pin.

[0071] Preferably, the glass substrate automatic method of the present invention further comprises, after the cutting platform receives the glass substrate to be cut, adsorbing the glass substrate, and then the cutting device cuts the glass. While cutting the glass, the glass is kept adsorbed on the cutting platform, so that the glass substrate is fixed during cutting, and the cutting track deviation caused by the movement of the glass substrate driven by the cutting assembly is avoided.

[0072] In the present invention, each area divided by the cutting track can independently control the adsorption force it gives to the received glass substrate, thereby changing the pressure difference between the glass substrate fragments after cutting along the cutting track, and achieving the purpose of further fragmentation along the cutting track while the adsorption and transfer device absorbs the glass substrate fragments. Finally, the glass substrate fragments after cutting are removed by the adsorption and transfer device, which saves manpower input and greatly improves work efficiency. It is also possible to control the speed of each operation to ensure the time for processing the glass substrate in the entire process section and meet production needs.

[0073] In the present invention, the arrangement of the adsorption holes on the cutting platform is consistent with the position of the suction cup of the adsorption and transplanting device. If there is a notch at any position of the glass substrate before the glass substrate is cut, when the adsorption and transplanting device adsorbs and cuts the scrapped glass substrate, the suction cup may coincide with the notch. If the adsorption holes are not in the same position as the suction cup, the suction cup will adsorb the cutting platform, which may easily damage the suction cup or fail to successfully adsorb and transplant the glass substrate. If the adsorption holes are in the same position as the suction cup, the adsorption holes are vacuum-broken, so that the suction cup at this position cannot play an adsorption role, and will not cause damage to the cutting platform, and the glass substrate can be adsorbed and transplanted normally.

[0074] When using the device and method of the present invention, before cutting a glass substrate with a large thickness variation, the manual translation stage is first adjusted, the handle of the locking wheel is quickly turned to fix the cutting device in the vertical direction, and then the proportional valve is controlled by the PLC controller to drive the cylinder to descend to complete the trial cutting of the glass substrate. This step is mainly to find the best cutting pressure to achieve the best cutting effect, and it can also protect the cutting head and increase its life.

[0075] During the cutting process, dust may be generated. By using the equipment and method of the present invention, a suction pipe and a filter are added to the cutting mechanism, and the dust suction function is completed by the air path system. In addition, a cleaning component is added under the cutting mechanism, and the cleaning of debris is completed by these two operations, and ultimately a cleaning efficiency of 95% can be achieved.

[0076] By using the device and method of the present invention, the cutter head can be rotated during the cutting process, thereby flexibly changing the cutting trajectory to achieve different cutting purposes. A sensor is also provided to monitor the rotation angle of the cutter head, and preferably an alarm is installed on the sensor. If the actual rotation angle of the cutter head does not reach the angle preset by the PLC controller due to the loosening of the synchronous belt during the actual processing, the alarm device installed on the sensor will alarm, strictly monitoring the cutting process so that the cutting trajectory will not deviate. BRIEF DESCRIPTION OF THE DRAWINGS

[0077] Figure 1a A three-dimensional diagram of a cutting platform, a lifting device, and a two-axis module assembly according to a specific embodiment of the present invention (without a glass substrate)

[0078] Figure 1b A three-dimensional diagram of a cutting platform, a lifting device, and a two-axis module assembly according to a specific embodiment of the present invention (with a glass substrate placed thereon)

[0079] Figure 2 Front view of a lifting device in a working state according to a specific embodiment of the present invention

[0080] Figure 3a Front view of a cutting assembly according to a specific embodiment of the present invention

[0081] Figure 3b A perspective view of a cutting assembly according to a specific embodiment of the present invention

[0082] Figure 4 A top view of a cutting platform according to a specific embodiment of the present invention

[0083] Figure 5 Front view of an adsorption transplanting device according to a specific embodiment of the present invention

[0084] Figure 6 Rear view of a cutting device according to a specific embodiment of the present invention

[0085] Figure 7 Front view of a cleaning assembly according to a specific embodiment of the present invention

[0086] Figure 8 Schematic diagram of the position of a debris collection box according to a specific embodiment of the present invention

[0087] Fig. 9 A waste material vehicle according to a specific embodiment of the present invention

[0088] Fig.10a Front view of a fully automatic glass substrate cutting device according to a specific embodiment of the present invention

[0089] Fig.10b A top view of a fully automatic glass substrate cutting device according to a specific embodiment of the present invention

[0090] Explanation of symbols

[0091] 1 pin 2 cutting platform 3 robotic arm

[0092] 4Glass substrate5Linear bearing6Ball screw

[0093] 7 servo motor 8 cutter head 9 straw

[0094] 10 filter 11 servo control system 12 gas system

[0095] 13 Pneumatic pressure control unit 14 Synchronous belt and synchronous pulley combination 15 Cylinder

[0096] 16 reducer 17 synchronous belt tensioning mechanism 18 manual displacement table

[0097] 19 proportional valve 20 sensor 21 adsorption component

[0098] 22 lifting assembly 23 transplanting assembly 24 cleaning assembly

[0099] 25 module 26 load table 27 pin hole

[0100] 28 adsorption hole 29 cutting component 30 brush

[0101] 31 brush lifting assembly 32 adsorption and transplanting device 33 cutting device

[0102] 34 lifting device 35 waste material car 36 positive pressure air system

[0103] 37 Negative pressure air system 38 Debris collection box DETAILED DESCRIPTION

[0104] The following is a further detailed description of a glass substrate fully automatic cutting device and method of the present invention in conjunction with the embodiments described in the accompanying drawings, wherein the same numbers in all the drawings represent the same features. Although specific embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0105] It should be noted that certain words are used in the specification and claims to refer to specific components. Those skilled in the art should understand that technicians may use different nouns to refer to the same component. This specification and claims do not use the difference in nouns as a way to distinguish components, but use the difference in the functions of the components as the criterion for distinction. As mentioned throughout the specification and claims, "including" or "comprising" is an open term, so it should be interpreted as "including but not limited to". The subsequent description of the specification is a preferred embodiment of the present invention, but the description is based on the general principles of the specification and is not intended to limit the scope of the present invention. The scope of protection of the present invention shall be determined by the attached claims.

[0106] The present invention provides a fully automatic glass substrate cutting device. In a specific embodiment, the device comprises: a cutting platform 2, a lifting device 34, a cutting device 33 and an adsorption transfer device 32 (such as Fig.10a and Fig.10b shown), where

[0107] like Figure 1a and Figure 1b As shown, the cutting platform 2 is used to carry the glass substrate 4 to be cut. The material with high hardness, strong wear resistance and not easy to deform is selected. The cutting platform 2 can be of any shape, and the size depends on the size of the glass substrate 4. The cutting platform 2 has a pin hole 27 for docking with the cutting device 33;

[0108] The lifting device 34 is used to transport the glass substrate 4, and it can dock with the cutting platform 2, so as to move the glass substrate 4 to fall on the cutting platform 2 and receive the glass by the cutting platform 2. In the present invention, docking can be achieved by any method known to those skilled in the art. In a specific embodiment of the present invention, docking is that the cutting platform 2 docks with the lifting device 34, and is achieved by the pins 1 located on the load workbench 26 of the lifting device 34 and the pin holes 27 of the cutting platform 2.

[0109] For example, Figure 2As shown, in the working state, the lifting device 34 is driven to rise by the servo motor 7, and the pin 1 on the load workbench 26 of the lifting device 34 is lifted onto the cutting platform 2 through the pin hole 27 of the cutting platform 2, and the glass substrate 4 first falls on the pin 1, and then the lifting device 34 drives the glass substrate 4 to fall, until the glass substrate 4 falls on the cutting platform 2. The pin 1 is a connecting rod fixed on the load workbench 26, and is in point contact with the glass substrate 4 to be cut. The distribution of the pin hole 27 on the cutting platform 2 corresponds to that of the pin 1, and the size of the pin hole 27 is set according to the cross-sectional area of ​​the connecting rod of the pin 1.

[0110] In a specific embodiment, Figure 6 As shown, the cutting device 33 is composed of a cutting assembly 29 and a module 25 for the cutting assembly 29 to slide, so as to cut the glass substrate 4 located on the cutting platform 2 according to a preset cutting track;

[0111] The adsorption and transfer device 32 is used to adsorb the cut glass substrate 4, and includes: an adsorption component 21, a lifting component 22 connected to the upper part of the adsorption component 21, and a transfer component 23 (such as Figure 5 As shown). The adsorption component 21 includes a plurality of suction cups; the lifting component 22 is driven by a servo motor 7; the transfer component 23 includes a transfer machine and a guide rail, the transfer machine is used to control the horizontal movement of the lifting component 22, and the guide rail is used to receive and transport the glass substrate 4 cracks adsorbed by the adsorption component 21. In the working state, for each glass substrate 4 crack, the adsorption transfer device 32 first drives the adsorption component 21 to descend to the glass substrate 4 crack to be adsorbed according to a preset sequence, and after adsorbing the glass substrate 4 crack, the lifting component 22 drives the glass substrate 4 crack to move vertically upward first, and then the transfer component 23 controls the glass substrate 4 crack to be placed on the guide rail and moved away.

[0112] In a specific embodiment, Figure 4 As shown, there is an adsorption hole 28 set on the cutting platform 2 to avoid the pin hole 27. The adsorption hole 28 can be connected to the air circuit control system to control the solenoid valve to perform vacuum and vacuum breaking operations to control the adsorption force between the cutting platform 2 and the glass substrate 4.

[0113] In a specific embodiment, the top surface of the cutting platform 2 is rectangular, and the cutting platform 2 has several areas corresponding to the cutting track of the cutting device 33, and the areas do not have to be equally divided. Each area can independently control the adsorption force between it and the received glass substrate 4, that is, when one of the glass substrate 4 cracks is absorbed, the adsorption force between the crack and the cutting platform 2 is smaller than the adsorption force between the other glass substrate 4 cracks and the cutting platform 2, so that while the glass substrate 4 cracks are absorbed, the cut glass substrate 4 is further split along the cutting track. For example, the glass substrate 4 to be cut can be equally divided into 2, 4, or 6 pieces by such a cutting device 33.

[0114] In a specific embodiment, each area has an independent air path control system and each area has at least one adsorption hole 28 set away from the pin hole 27. Each area is connected to the air path control system of the area through the adsorption hole 28 to control the adsorption force between the cutting platform 2 and the glass substrate 4.

[0115] In a specific embodiment, Figure 2 As shown, the lifting device 34 is a servo lifting device located below the cutting platform 2, which includes: a load table 26, a ball screw 6, a linear bearing 5 and a servo motor 7. The servo motor 7 drives the ball screw 6 and cooperates with the linear bearing 5 to drive the load table 26 to move up and down. Among them, the servo lifting device is a lifting device driven by the servo motor 7; the load table 26 is a platform with a certain bearing function; the ball screw 6 is a transmission element that converts rotary motion into linear motion, or converts linear motion into rotary motion; the linear bearing 5 is a linear motion system; the servo motor 7 refers to the engine that controls the operation of mechanical elements in the servo system, and is an auxiliary motor indirect speed change device. The servo motor 7 can control the speed and position accuracy very accurately, and can convert the voltage signal into torque and speed to drive the control object.

[0116] In a specific embodiment, Figure 3a and 3bAs shown, the cutting assembly 29 includes: a cylinder 15, an air circuit system 12, a cutter head 8, a servo control system 11, a reducer 16 and a synchronous belt and synchronous pulley combination 14. The air circuit system 12 includes a positive pressure air circuit system 36, a negative pressure air circuit system 37 and a pneumatic pressure control unit 13. The synchronous belt and synchronous pulley combination 14 includes: a driving wheel, a driven wheel and a synchronous belt connecting the driving wheel and the driven wheel. The servo control system 11 is connected to the reducer 16 at the bottom, the reducer 16 is connected to the driving wheel at the bottom, and the driven wheel is connected to the top of the cylinder 15. The cutter head 8 is located on the axis of the driven wheel. The rotation of the driving wheel is controlled by the servo control system 11. The driving wheel drives the driven wheel to rotate, thereby driving the cylinder 15 and the cutter head 8 to rotate synchronously. The pneumatic pressure control element is connected to the positive pressure air circuit system 36, the positive pressure air circuit system 36 is connected to the cylinder 15, and the cutter head 8 is connected to the bottom of the cylinder 15. The pneumatic pressure control unit 13 controls and adjusts the gas pressure so that the cylinder 15 or the air motor works according to the set program. The pneumatic pressure control unit 13 generally controls the pressure through a boost valve, a pressure reducing valve, a safety valve, a sequence valve or a proportional valve 19. In an optional embodiment, the cylinder 15 is a low-friction cylinder, which is a cylindrical metal part that guides the piston to perform linear reciprocating motion in the cylinder. The low-friction cylinder refers to a cylinder 15 with very small piston sliding resistance. In another optional embodiment, the pneumatic pressure control unit 13 includes a proportional valve 19, which can continuously control the input quantity, and its characteristic is that the output quantity changes with the input quantity (current value or voltage value), and there is a certain proportional relationship between the output quantity and the input quantity.

[0117] In a specific embodiment, Figure 3a and 3b As shown, a synchronous belt tensioning mechanism 17 is also installed to act on the synchronous belt, which plays a role in tensioning the synchronous belt and preventing the synchronous belt from loosening. The synchronous belt tensioning mechanism 17 includes a tensioning wheel, which is installed close to the smaller wheel of the driving wheel and the driven wheel.

[0118] In a specific embodiment, Figure 3a and 3b As shown, the air circuit system 12 is connected to a manual displacement platform 18 for adjusting the cutting assembly 29 in the vertical direction. The manual displacement platform 18 is provided with a locking hand wheel. When the cutting assembly 29 is adjusted to a suitable position, the locking hand wheel is tightened to fix the cutting assembly 29. A sensor 20 is also installed on the upper part of the air circuit system 12 for confirming the rotation of the cutter head 8. The cutting assembly 29 is also equipped with a filter 10 connected to the negative pressure air circuit system 37, and a suction pipe 9 connected to the lower end of the filter 10, and the lower end of the suction pipe 9 is arranged adjacent to the cutter head 8.

[0119] In a specific embodiment, Figure 1a and Figure 1bAs shown, the module 25 for the cutting assembly 29 to slide is a two-axis gantry module. In an optional embodiment, the module 25 can also be a two-axis cantilever module, a three-axis gantry module, or a three-axis cantilever module. The module 25 is a manipulator module, which is divided into a single-axis module and a multi-axis module realized by a plurality of single-axis modules in different combination styles. The multi-axis module can perform plane or space coordinate displacement. The X and Y axis directions are as follows: Figure 1b As shown, the two-axis module can realize the displacement of the XY axis. The two-axis module is divided into a two-axis gantry module and a two-axis cantilever module. The X axis of the two-axis gantry module is mounted on two parallel Y axes (or auxiliary guide rails), and the X axis of the two-axis cantilever module is cantilevered out, and the X axis is installed on the Y axis slider. The three-axis module can realize the displacement of the XYZ axis. The three-axis module is divided into a three-axis gantry module and a three-axis cantilever module. The X axis of the three-axis gantry module is mounted on two parallel Y axes (or auxiliary guide rails), and the Z axis is mounted on the X axis. The X axis of the three-axis cantilever module is cantilevered out, and the X axis is installed on the Y axis slider, and the Z axis is mounted on the X axis.

[0120] In a specific embodiment, the suction cup is a vacuum suction cup, and the distribution of the suction cup is consistent with the distribution of the adsorption holes 28 on the cutting platform 2. The vacuum suction cup is connected to a vacuum device, such as a vacuum generator. When the suction cup contacts the object to be lifted, such as glass, the vacuum device is started to suck, so that negative air pressure is generated in the suction cup, so that the object to be lifted is firmly adsorbed, and the object to be lifted can be transported. When the object to be lifted is transported to the destination, air is steadily inflated into the vacuum suction cup, so that the negative air pressure in the vacuum suction cup changes to zero air pressure or slightly positive air pressure, and the vacuum suction cup is separated from the object to be lifted, thereby completing the task of lifting and transporting heavy objects.

[0121] In a specific embodiment, Figure 7 As shown, the cutting device 33 also includes: a cleaning component 24. The cleaning component 24 includes a cleaning unit and a collecting unit. The cleaning unit is used to clean the dust generated during the cutting process, and the collecting unit is used to collect the cleaned dust debris. The cleaning unit can be a brush 30, specifically, a roller brush, a single-sided brush, a double-sided brush, a plate brush, etc. The collecting unit can be a debris collection box 38, and the debris collection box 38 is located at one edge of the cutting platform 2. The top edge of the debris collection box 38 is not higher than the top surface of the cutting platform 2, and its position can be adjusted according to the position of the cutting device 33 (such as Figure 8 In an optional embodiment, the cleaning component 24 may further include a lifting unit, specifically a brush lifting component 31. The lifting unit controls the lifting of the cleaning unit.

[0122] In a specific embodiment, there is a glass fragment collection unit for collecting the broken pieces of the glass substrate 4 below the end of the track of the transplanting assembly 23. There is no limitation on such a glass fragment collection unit. For example, it can be a container or a collection pool located below the end of the track. In a specific embodiment, the glass fragment collection unit is preferably movable, so that after the collection is completed, the glass fragment collection unit can be moved to transport out the collected glass fragments. Specifically, it can be a waste material truck 35.

[0123] In a specific embodiment, the glass substrate 4 to be cut is transported to the top of the cutting platform 2 by a robot arm 3, and the robot arm 3 can be a robot fork, and the glass substrate 4 is placed on the robot fork for transportation. The robot fork is formed by connecting a connecting plate and two or more rectangular tube columns, and the extension direction from the fixed end to the free end of each rectangular tube column is the same.

[0124] In a specific embodiment, the glass substrate 4 to be cut is a glass substrate 4 scrapped during the production process.

[0125] The present invention also provides a method for fully automatic cutting of a glass substrate, wherein the equipment involved can refer to the description of the above-mentioned fully automatic cutting equipment for a glass substrate.

[0126] In a specific embodiment, the glass substrate fully automatic cutting method of the present invention comprises:

[0127] The glass substrate 4 to be cut is driven and finally falls on the cutting platform 2 by using the lifting device 34 docked with the cutting platform 2. The docking in the present invention can be achieved by any method known to those skilled in the art. In a specific embodiment of the present invention, the docking is achieved by the pins 1 located on the lifting device load workbench 26 and the pin holes 27 of the cutting platform 2.

[0128] The cutting device 33 is moved along a preset cutting track, so as to cut the glass substrate 4 according to the cutting track.

[0129] The adsorption and transfer device 32 adsorbs the cut glass substrate 4. Each of the several areas divided by the cutting track of the cutting platform 2 can independently control the adsorption force given to the received glass substrate 4. When the adsorption and transfer device 32 absorbs the glass, the adsorption force difference between each glass substrate 4 cut along the cutting track and the cutting platform 2 is controlled, so that the cut glass substrate 4 is further split along the cutting track.

[0130] Then, the cut glass substrate 4 is moved out from the cutting platform 2 via the guide rails of the transfer assembly 23 in a predetermined order.

[0131] In a specific embodiment, the method further includes: after the glass substrate 4 to be cut falls on the cutting platform 2 , the cutting platform 2 absorbs the glass substrate 4 .

[0132] In a specific embodiment, several areas divided by the cutting track on the cutting platform 2 are respectively provided with adsorption holes 28 arranged to avoid the pin holes 27. Each area can be connected to an independent air circuit control system through the adsorption holes 28 of the area, and the solenoid valve can be controlled to perform vacuum and vacuum breaking operations to control the adsorption force between each area of ​​the cutting platform 2 and the glass substrate 4.

[0133] In a specific embodiment, the method further comprises: transferring the cut glass fragments removed from the cutting platform 2 to a glass fragment collection unit.

[0134] In a specific embodiment, the method further comprises: while cutting the glass substrate 4, using a cleaning assembly 24 including a cleaning unit and a collecting unit to clean the cutting platform 2. In an optional embodiment, the cleaning assembly 24 may further include a lifting unit for controlling the lifting of the cleaning assembly 24.

[0135] The fully automatic glass substrate cutting device and method according to the present invention will be further described below with reference to the accompanying drawings.

[0136] Reference Figure 1a and Figure 1b , which is a schematic diagram of the combination of the cutting platform 2, the lifting device 34, and the module 25 for the cutting component 29 to slide. The lifting device 34 is in a working state, and the pin 1 rises through the pin hole 27 of the cutting platform 2 to be exposed on the cutting platform 2. The glass substrate 4 to be cut is transported by the robot arm 3 to the pin 1 raised above the cutting platform 2. After the glass substrate 4 is placed stably, the robot arm 3 is removed, and then the lifting device 34 is lowered to below the cutting platform 2, and the glass substrate 4 falls onto the cutting platform 2.

[0137] Figure 2 Schematic diagram of the lifting device 34, which is a servo lifting device located below the cutting platform 2, including: a load table 26, a ball screw 6, a linear bearing 5 and a servo motor 7, wherein the servo motor 7 is connected to the ball screw 6, and the top of the ball screw 6 is fixed to the bottom of the load table 26 by a nut; a plurality of linear bearings 5 ​​are also fixed around the ball screw 6 at the bottom edge of the load table 26, and the servo motor 7 drives the ball screw 6 and cooperates with the linear bearing 5 to drive the load table 26 to move up and down. The pins 1 are evenly distributed on the load table 26.

[0138] Figure 3a and Figure 3bIt is a schematic diagram of the cutting assembly in the cutting device, where the cutting assembly 29 includes: a cylinder 15, an air circuit system 12, a cutter head 8, a servo control system 11, a reducer 16 and a synchronous belt and synchronous pulley combination 14, a synchronous belt tensioning mechanism 17, a manual displacement table 18, a sensor 20 and a filter 10. The air circuit system 12 includes a positive pressure air circuit system 36, a negative pressure air circuit system 37 and a pneumatic pressure control unit 13.

[0139] The pneumatic pressure control unit 13 is connected to the positive pressure air circuit system 36, the positive pressure air circuit system 36 is connected to the cylinder 15, and the cutter head 8 is connected to the lower part of the cylinder 15. The synchronous belt and synchronous pulley combination 14 includes: a driving wheel, a driven wheel and a synchronous belt connecting the driving wheel and the driven wheel. The synchronous belt tensioning mechanism 17 acts on the synchronous belt to prevent the synchronous belt from loosening. The lower part of the servo control system 11 is connected to the reducer 16, the lower part of the reducer 16 is connected to the driving wheel, the driven wheel is connected to the upper part of the cylinder 15, and the cutter head 8 is located on the axis of the driven wheel. A manual displacement table 18 is installed on the air circuit system 12. The sensor 20 is installed on the upper part of the air circuit system 12. The suction pipe 9 is arranged near the cutter head 8, and the upper part is connected to the filter 10, and the upper part of the filter 10 is connected to the positive pressure air circuit system 36.

[0140] Figure 4 Schematic diagram of the area divided by the cutting track on the cutting platform 2. The cutting platform 2 is divided into four equal areas, each of which is arranged with a plurality of adsorption holes 28. Through the adsorption holes 28, each area can independently control the adsorption force it gives to the received glass substrate 4, thereby changing the pressure difference between the cracks of each glass substrate 4 cut along the cutting track, so that the cut glass substrate 4 is further cracked along the cutting track.

[0141] Figure 5 Schematic diagram of the suction and transplanting device, including: a suction cup assembly at the bottom, a lifting assembly 22 connected to the top of the suction cup assembly, and a transplanting assembly 23. The suction cup assembly includes a plurality of suction cups, which are distributed corresponding to the suction holes 28 on the cutting platform 2. After the suction cup assembly absorbs the cracks of the glass substrate 4, the lifting assembly 22 drives the suction cup assembly and the cracks of the glass substrate 4 to move upward to the transplanting assembly 23, and the cracks of the glass substrate 4 are placed on the transplanting assembly 23 and transported by the transplanting assembly 23.

[0142] Figure 6 It is a rear view of the cutting device with the cleaning assembly 24 installed. The cleaning assembly 24 is installed at a lower position behind the cutting device.

[0143] Figure 7 It is a schematic diagram of a cleaning component, including a brush 30 located below the edge of the cleaning component 24 , a brush lifting component 31 for controlling the lifting of the brush 30 , and a debris collection box 38 .

[0144] Figure 8Schematic diagram of the position of the debris collection box, which is connected to an edge of the cutting platform 2, with its top edge not higher than the top surface of the cutting platform 2, its length direction is parallel to the X-axis, and is located at the opposite end of the cleaning component 24 in the initial state.

[0145] Fig. 9 Schematic diagram of a waste material vehicle. When the glass substrate 4 to be cut is waste, the transfer assembly 23 transports the broken pieces of the glass substrate 4 to the waste material vehicle for waste collection.

[0146] Fig.10a and Fig.10b Schematic diagram of a fully automatic glass substrate cutting device, in this embodiment, it also includes an overall frame supporting each device. The glass substrate 4 is transported by the robot arm 3 to the pin 1 that rises above the cutting platform 2, and the servo motor 7 controls the lifting device 34 to descend below the cutting platform 2, and the glass substrate 4 falls onto the cutting platform 2, and then the glass substrate 4 is cut into several equal parts by the cutting device, and finally the broken pieces of the cut glass substrate 4 are sent to the waste material vehicle by the adsorption and transfer device.

[0147] Example

[0148] The glass substrate fully automatic cutting device shown in FIGS. 1-9 is used, and the glass substrate 4 to be cut is a scrapped rectangular glass substrate.

[0149] The cutting platform 2 is a rectangular marble platform. The size of the cutting platform 2 is slightly larger than the glass substrate 4 to be cut. The cutting track is a cross. The cutting platform 2 is divided into four equal parts ABCD according to the cutting track. The pin holes 27 are arranged in rows on the cutting platform 2 parallel to one side of the marble platform. The pin holes 27 on each two adjacent areas are symmetrically distributed relative to the cutting track between the two areas. The pins 1 of the lifting device 34 are arranged corresponding to the pin holes 27 on the cutting platform 2, so that the glass substrate 4 is uniformly stressed when it falls on the rising pins 1. The adsorption holes 28 are arranged to avoid the pin holes 27. The adsorption holes 28 on each area are evenly distributed at the edge of the area and scattered near the center of the area. There is an independent air path control system under each area, and all the adsorption holes 28 in the area are controlled by solenoid valves to break the vacuum and absorb the vacuum.

[0150] The lifting device 34 is located directly below the cutting platform 2, and the ball screw 6 is connected to the top of the servo motor 7. The ball screw 6 is fixed to the bottom center of the load workbench 26 through a nut. Four linear bearings 5 ​​are vertically installed on the bottom edge of the load workbench 26, and the vertical distance from the bottom center of the load workbench 26 to the four linear bearings 5 ​​is equal. The box structure formed by the four linear bearings 5 ​​enables the servo motor 7 to drive the ball screw 6 to cooperate with the linear bearings 5 ​​to drive the load workbench 26 to move steadily up and down. The pin 1 is made of anti-static polyetheretherketone resin.

[0151] The suction cups in the suction and transplanting device 32 are distributed in the same manner as the suction holes 28 in each area of ​​the cutting platform 2. The lifting assembly 22 is driven by a servo motor 7, and a waste material vehicle is connected to the lower end of the transplanting assembly 23.

[0152] The cutting device 33 is composed of a cutting assembly 29, a module 25 for the cutting assembly 29 to slide, and a cleaning assembly 24, wherein the module 25 is a two-axis gantry module, which is composed of a slide rail parallel to the X-axis direction and two auxiliary slide rails parallel to the Y-axis. The two auxiliary slide rails parallel to the Y-axis are respectively installed on the two opposite sides of the cutting platform 2. The cutting assembly 29 is located on the slide rail in the X-axis direction and can move freely on the slide rail. The cutting assembly 29 is composed of a cylinder 15, an air circuit system 12, a cutter head 8, a servo control system 11, a reducer 16, a synchronous belt and synchronous pulley combination 14, a synchronous belt tensioning mechanism 17, a manual displacement table 18, a sensor 20 and a filter 10. In this embodiment, the air circuit system 12 includes a positive pressure air circuit system 36, a negative pressure air circuit system 37 and a pneumatic pressure control unit 13. The cylinder 15 is a low friction cylinder. The pneumatic pressure control unit 13 controls the pressure through a proportional valve 19. The proportional valve 19 is connected to the positive pressure air circuit system 36. The positive pressure air circuit system 36 is connected to the low friction cylinder. The cutter head 8 is connected to the lower part of the low friction cylinder. The synchronous belt and synchronous pulley combination 14 includes: a driving wheel, a driven wheel and a synchronous belt connecting the driving wheel and the driven wheel. The synchronous belt tensioning mechanism 17 acts on the synchronous belt to prevent the synchronous belt from loosening. The servo control system 11 is connected to the reducer 16 at the bottom, the reducer 16 is connected to the driving wheel at the bottom, and the driven wheel is connected to the upper part of the cylinder 15. The cutter head 8 is located on the axis of the driven wheel. The rotation of the driving wheel is controlled by the servo control system 11. The driving wheel drives the driven wheel to rotate, thereby driving the cylinder 15 and the cutter head 8 to rotate synchronously. The gas circuit system 12 is equipped with a manual displacement stage 18, and the manual displacement stage 18 is provided with a locking hand wheel. Before cutting the glass substrate 4 with a large thickness variation, the manual displacement stage 18 is adjusted first, and the handle of the locking hand wheel is quickly turned to fix the cutting device in the vertical direction, and then the pneumatic pressure control unit 13 is controlled by the PLC controller to drive the cylinder 15 to descend to complete the trial cutting of the glass substrate 4. This operation can find the best cutting pressure to achieve the best cutting effect, and can also protect the cutting head 8 and increase its life. The sensor 20 is a psd position sensor, which is installed on the upper part of the gas circuit system 12 to confirm whether the rotation angle of the cutter head 8 reaches 90 degrees. The sensor 20 is also equipped with an alarm system. If the rotation angle of the cutter head 8 does not reach 90 degrees, the alarm will sound an alarm. The suction pipe 9 is set near the cutter head 8, and the upper part is connected to the filter 10. The upper part of the filter 10 is then connected to the negative pressure gas circuit system 37 to complete the dust collection effect. The cleaning assembly 24 is installed at a position slightly below the rear of the cutting device, and includes a brush 30 located below the edge of the cleaning assembly 24, a brush lifting device 31 for controlling the lifting of the brush 30, and a debris collection box 38, wherein the debris collection box 38 is connected to an edge of the cutting platform 2, and its top edge is not higher than the top surface of the cutting platform 2, and its length direction is parallel to the X-axis, that is, parallel to the X-axis of the module 25, and is located at the opposite end of the cleaning assembly 24 in the initial state. Its position can be adjusted according to the position of the cutting device 33.

[0153] When the glass substrate automatic cutting device of this embodiment is used to automatically cut the scrapped glass substrate 4, first, the glass substrate 4 is transported by the robot to the pin 1 that rises above the cutting platform 2, and the servo motor 7 controls the lifting device 34 to descend below the cutting platform 2, and the glass substrate 4 falls on the cutting platform 2, and then the independent air path control system under each area of ​​the cutting platform 2 is used to evacuate, so that the glass substrate 4 to be cut is adsorbed on the cutting platform 2, and then the cutting device 33 cuts the glass substrate 4 into four equal parts, and the adsorption component 21 descends to the surface of the glass substrate 4. When the adsorption component 21 absorbs the glass substrate 4 in one area, the area is passed through positive pressure to break the vacuum, and the other areas are passed through negative pressure to achieve the purpose of evacuation, so that a pressure difference is generated between the cracks of the absorbed glass substrate 4 and the cracks of other scrapped glass substrates 4 that have not been taken away, and then the adsorption component 21 absorbs the cracks of the glass substrate 4 and produces a further cracking effect. The adsorption and transplanting device 32 delivers the cracks of the cut glass substrate 4 to the waste material vehicle 35 one by one according to the pre-set sequence ABCD. In other embodiments, the broken pieces of the glass substrate 4 may be removed in any order, which is preset by the PLC control system according to the number and positions of the broken pieces cut from the glass substrate 4 according to the cutting trajectory.

[0154] Although the embodiments of the present invention are described above in conjunction with the accompanying drawings, the present invention is not limited to the above specific embodiments and application fields, and the above specific embodiments are only illustrative and instructive, rather than restrictive. A person of ordinary skill in the art can also make many forms under the guidance of this specification and without departing from the scope of protection of the claims of the present invention, all of which belong to the protection of the present invention.

Claims

1. A fully automatic glass substrate cutting device, comprising: Cutting platform, lifting device, cutting device and adsorption transplanting device, wherein, The cutting platform is used to carry the glass substrate to be cut; The lifting device is used to transport the glass substrate, and can dock with the cutting platform, so as to move the glass substrate to fall onto the cutting platform and the cutting platform receives the glass; The cutting device is used for cutting the glass substrate located on the cutting platform; The adsorption and transfer device is used to adsorb the cut glass substrate, and then move the cut glass substrate out of the cutting platform according to a predetermined order, wherein: The top surface of the cutting platform is rectangular, and the cutting platform has a plurality of areas corresponding to the cutting track of the cutting device, and each area can independently control the adsorption force given to the received glass substrate, so that when the adsorption transfer device absorbs the glass, the adsorption force difference between each glass substrate crack after cutting along the cutting track and the cutting platform is controlled, so that the cut glass is further cracked along the cutting track; The adsorption and transplanting device includes an adsorption component, a lifting component connected to the upper part of the adsorption component, and a transplanting component. The adsorption component includes a plurality of suction cups; the lifting component is driven by a servo motor; the transplanting component includes a transplanter and a guide rail. The transplanter is used to control the horizontal movement of the lifting component, and the guide rail is used to receive and transport the glass substrate cracks adsorbed by the adsorption component.

2. The fully automatic glass substrate cutting device according to claim 1, wherein: The lifting device is a servo lifting device located below the cutting platform, which includes: A load workbench, a ball screw, a linear bearing and a servo motor. The servo motor drives the ball screw and cooperates with the linear bearing to drive the load workbench to move up and down.

3. The fully automatic glass substrate cutting device according to claim 1 or 2, wherein: The cutting platform and the lifting device are connected to each other through the pins located on the load workbench of the lifting device and the pin holes of the cutting platform.

4. The fully automatic glass substrate cutting device according to claim 3, wherein: The pins are evenly distributed on the load table.

5. The fully automatic glass substrate cutting device according to claim 3, wherein: The pins are made of antistatic material.

6. The fully automatic glass substrate cutting device according to claim 5, wherein: The material constituting the pins is PEEK.

7. The fully automatic glass substrate cutting device according to claim 3, wherein: Each area can independently control the adsorption force it applies to the received glass substrate, thereby changing the pressure difference between the cracks of each glass substrate after cutting along the cutting track, so that the cut glass is further cracked along the cutting track by controlling the vacuum degree between the cutting platform on each area and the adsorbed glass cracks.

8. The fully automatic glass substrate cutting device according to claim 7, wherein: Each area has an independent gas path control system and each area has at least one adsorption hole set away from the pin hole. By means of each of the air path control systems sucking or exhausting air from the adsorption holes in each area, a difference in vacuum degree between the cutting platform and the adsorbed glass fragments is achieved in each area, so that different forces are applied to the fragments.

9. The fully automatic glass substrate cutting device according to claim 1, wherein: The cutting device comprises a cutting component and a module for the cutting component to slide, and the module for the cutting component to slide can control the cutting component to move along a cutting track so as to achieve cutting of the glass to be cut.

10. The fully automatic glass substrate cutting device according to claim 9, wherein: The module is a two-axis gantry type module.

11. The fully automatic glass substrate cutting device according to claim 9, wherein: The cutting assembly comprises: Cylinder, air system and cutter head, The gas circuit system includes a positive pressure gas circuit system, a negative pressure gas circuit system and a pneumatic pressure control unit. The positive pressure air circuit system is connected to the pneumatic pressure control unit. The positive pressure air circuit system is connected to the cylinder, and the cutter head is connected to the lower part of the cylinder.

12. The fully automatic glass substrate cutting device according to claim 11, wherein: The cylinder is a low-friction cylinder.

13. The fully automatic glass substrate cutting device according to claim 11, wherein: The pneumatic pressure control unit is equipped with a proportional valve.

14. The fully automatic glass substrate cutting device according to claim 11, wherein: The cutting assembly also includes: Servo control system, reducer, synchronous belt and synchronous pulley combination; The synchronous belt and synchronous pulley combination comprises: a driving pulley, a driven pulley and a synchronous belt connecting the driving pulley and the driven pulley; The lower part of the servo control system is connected to a reducer, the lower part of the reducer is connected to a driving wheel, the driven wheel is connected to the upper part of the cylinder, the cutter head is located on the axis of the driven wheel, the rotation of the driving wheel is controlled by the servo control system, the driving wheel drives the driven wheel to rotate, and then drives the cylinder and the cutter head to rotate synchronously.

15. The fully automatic glass substrate cutting device according to claim 14, wherein: The cutting assembly is also equipped with a synchronous belt tensioning mechanism acting on the synchronous belt.

16. The fully automatic glass substrate cutting device according to claim 15, wherein: The gas circuit system is connected to a manual lifting and displacement platform, and the manual lifting and displacement platform is provided with a locking hand wheel.

17. The fully automatic glass substrate cutting device according to claim 15, wherein: A sensor is also installed on the upper part of the gas circuit system to confirm the rotation of the cutter head.

18. The fully automatic glass substrate cutting device according to claim 15, wherein: The cutting assembly is also provided with a filter connected to the negative pressure air circuit system, and a suction pipe connected to the lower end of the filter, wherein the lower end of the suction pipe is arranged adjacent to the cutter head.

19. The fully automatic glass substrate cutting device according to claim 1, wherein: The cutting device also includes: Cleaning components, The cleaning assembly includes a brush, a brush lifting mechanism and a debris collection box.

20. The fully automatic glass substrate cutting device according to claim 8, wherein: The distribution of the suction cups is consistent with the distribution of the adsorption holes on the cutting platform.

21. The fully automatic glass substrate cutting device according to claim 1, wherein: The device also includes: A waste cart is located underneath the end of the transplanting assembly.

22. The fully automatic glass substrate cutting device according to claim 1, wherein: The device also includes: The glass substrate to be cut is transported to the robotic arm above the cutting platform.

23. The fully automatic glass substrate cutting device according to claim 1, wherein: The glass substrate to be cut is a scrapped glass substrate.

24. A method for cutting a glass substrate, comprising: Use the lifting device to place the glass substrate to be cut on the cutting platform. moving the cutting device along the cutting track to cut the glass substrate according to the cutting track, The adsorption and transfer device adsorbs the cut glass substrates, and then removes the cut glass substrates from the cutting platform in a predetermined order. The cutting platform is used to carry the glass substrate to be cut; the lifting device is used to transport the glass substrate, which can dock with the cutting platform, so as to move the glass substrate to fall onto the cutting platform and receive the glass by the cutting platform; the cutting device is used to cut the glass substrate on the cutting platform; the adsorption and transfer device is used to adsorb the cut glass substrate, and then move the cut glass substrate out of the cutting platform according to a predetermined order, wherein the method further includes: After the cutting device is moved along the cutting track to cut the glass substrate according to the cutting track, Each of the plurality of regions of the cutting platform independently controls the adsorption force it applies to the received glass substrate, thereby changing the pressure difference between the glass substrate fragments after being cut along the cutting track, so that the cut glass further cracks along the cutting track. Then, the adsorption and transfer device is used to adsorb the further cracked cut glass substrate, and then the cut glass substrate is moved out from the cutting platform according to a predetermined order. The adsorption and transfer device includes an adsorption component, a lifting component connected to the upper part of the adsorption component, and a transfer component. The adsorption component includes a plurality of suction cups; the lifting component is driven by a servo motor; the transfer component includes a transfer machine and a guide rail, the transfer machine is used to control the horizontal movement of the lifting component, and the guide rail is used to receive and transport the glass substrate cracks adsorbed by the adsorption component. In the working state, for each glass substrate crack, the adsorption and transfer device first drives the adsorption component to descend to the glass substrate crack to be adsorbed according to a predetermined order by the lifting component. After adsorbing the glass substrate crack, the lifting component drives the glass substrate crack to move vertically upward first, and then the transfer component controls the glass substrate crack to be placed on the guide rail and moved away, wherein, The top surface of the cutting platform is rectangular, and the cutting platform has several areas corresponding to the cutting track of the cutting device, and each area can independently control the adsorption force it gives to the received glass substrate, so as to change the pressure difference between the cracks of each glass substrate after cutting along the cutting track, so that the cut glass can be further cracked along the cutting track.

25. The method according to claim 24, further comprising: The cut glass fragments are removed from the cutting platform and transferred to a scrap car.

26. The method of claim 24, further comprising: While the glass substrate is being cut, the cutting platform is cleaned by using a cleaning assembly including a brush, a brush lifting mechanism and a debris collection box.

27. The method according to any one of claims 24 to 26, wherein the glass is cut using the device according to any one of claims 1 to 23.

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