Device for processing copper-based graphene using a pressure roller

Abstract

The present application provides a device for processing copper-based graphene using a pressure roller. The device comprises: a substrate, including a processing area and a processing platform arranged in the processing area, wherein the processing area is arranged as an oxygen-free area; a heating mechanism for heating the copper-based graphene laminate to 500°C to 900°C, and a pressure roller, which is rotatably arranged in the processing area, and a hot pressing gap for hot pressing the copper-based graphene laminate is preset between the pressure roller and the processing platform. Experimental verification shows that the copper-based graphene composite material processed by this scheme has better conductivity and mechanical properties.

Description

Technical Field

[0001] The present application relates to the technical field of copper-based graphene processing, and in particular, to a device for processing copper-based graphene using a pressure roller. Background Art

[0002] Graphene is a carbon material with a single-layer two-dimensional honeycomb lattice structure formed by tightly stacked sp2 hybridized carbon atoms. Graphene has excellent comprehensive properties, with a tensile strength of 125Gpa, an elastic modulus of 1.0Tpa, a thermal conductivity of 5300W / (m·k), and an electron mobility of 2×105cm 2 (v·s), therefore, graphene is often used as an ideal filler to prepare composite materials.

[0003] In the prior art, a carbon source can be cracked by chemical vapor deposition to form graphene on the surface of copper foil to prepare a copper-based graphene composite material. However, in practical applications, in order to make the copper-based graphene composite material have high conductivity and better mechanical properties, the copper-based graphene composite material prepared by the above method needs to be further processed. Summary of the invention

[0004] In view of this, the present application provides a device for processing copper-based graphene using a pressure roller, which can further process the copper-based graphene composite material with graphene grown on a copper substrate to meet the requirements of high conductivity and better mechanical properties.

[0005] Specifically, the present application is implemented through the following technical solutions:

[0006] A device for processing copper-based graphene using a pressure roller, comprising:

[0007] The substrate comprises a processing area and a processing platform arranged in the processing area, wherein the processing area is arranged as an oxygen-free area;

[0008] A heating mechanism for heating the copper-graphene laminate to 500° C. to 900° C.; and

[0009] The pressing roller is rotatably arranged in the processing area, and a hot pressing gap for hot pressing the copper-based graphene laminate is preset between the pressing roller and the processing platform.

[0010] Optionally, the device further includes an inner box and an outer box, the inner box is arranged inside the outer box, the area surrounded by the inner box is the processing area, the area surrounded by the outer box is the anaerobic sealed area, and the processing area is connected to the anaerobic sealed area.

[0011] Optionally, the device further comprises a preheating mechanism for preheating the copper-based graphene laminate before hot pressing, and the preheating mechanism is disposed in the outer box.

[0012] Optionally, the preheating mechanism includes an electromagnetic induction heater.

[0013] Optionally, the device also includes a pressure maintaining mechanism for increasing the hot pressing time of the copper-based-graphene laminate, the pressure maintaining mechanism includes a chain-type pressing plate and a power mechanism, the power mechanism drives the chain-type pressing plate to cyclically input and output the processing area, and within the processing area, the pressure roller hot presses the copper-based-graphene laminate through the chain-type pressing plate.

[0014] Optionally, the chain-type pressure plate is formed by splicing a plurality of sub-plates which are connected end to end and movable relative to each other, and each sub-plate is cyclically input and output from the processing area. In the processing area, the pressure roller presses the copper-based graphene laminate through the sub-plates.

[0015] Optionally, a plurality of the pressing rollers are provided in the processing area and arranged side by side.

[0016] Optionally, the inner box body and the outer box body are provided with an interface for the shaft of the pressure roller to extend out, and the device further comprises a multi-pass sealing mechanism arranged at the interface.

[0017] Optionally, the multi-stage sealing mechanism includes a first stage sealing mechanism, the first stage sealing mechanism includes a sealing material, and the sealing material is filled in a gap between the inner box body and the shaft portion.

[0018] Optionally, the first sealing mechanism further comprises a first O-ring and a second O-ring spaced apart on the shaft portion, wherein the first O-ring, the second O-ring, the shaft portion and the inner box together form an annular sealing space, and the powdered sealing material is filled in the annular sealing space.

[0019] Optionally, the multi-stage sealing mechanism further includes a second stage sealing mechanism, wherein the second stage sealing mechanism includes a sealing cavity surrounding the shaft portion and grease filled in the sealing cavity, wherein the grease serves as a sealing medium.

[0020] Optionally, the device includes a first fixing member and a second fixing member, which are respectively sleeved on the shaft portion and sealed with the shaft portion, wherein the first fixing member and the second fixing member are both fixedly connected to the outer box body, and a gap is left between the first fixing member and the second fixing member, and the gap forms the sealed cavity.

[0021] Optionally, the device further comprises a cooling mechanism, and the cooling mechanism is used for performing heat exchange with the shaft portion of the pressure roller.

[0022] Optionally, the inner box and the outer box form a cavity, the cavity is filled with a cooling medium, and a side wall of the cavity is in contact with the heat absorbing material.

[0023] Optionally, the inner contour surface of the cavity close to the shaft portion is a curved inner contour surface.

[0024] Optionally, the device also includes a temperature sensor and a temperature controller, the temperature sensor is electrically connected to the temperature controller, the temperature controller controls the temperature of the processing area according to temperature data of the temperature sensor, and the temperature sensor is arranged in the processing platform.

[0025] Optionally, the processing platform is configured as a split structure, and the portion close to the pressure roller is made of mold steel.

[0026] Optionally, the device also includes a feed conveying roller, which is arranged on the feed side of the processing platform and is used to convey the copper-based-graphene stack to the processing platform. The upper surface of the processing platform extends toward the feed conveying roller and connects with the feed conveying roller at the vertex.

[0027] Optionally, a heating mechanism is provided in the processing area, and the heating mechanism is provided on the inner wall of the inner box body and / or in the pressing roller.

[0028] Optionally, the device further comprises a limiting mechanism, which is used to limit the extension of the copper-based-graphene laminate along the width direction after being pressed.

[0029] Optionally, the device further comprises a protective gas introduction mechanism, wherein the protective gas introduction mechanism is used to introduce protective gas into the processing area to prevent oxidation of the copper-based-graphene laminate.

[0030] Optionally, the hot pressing gap is set to 80% to 99% of the total thickness of the copper-based-graphene laminate.

[0031] Optionally, the pressing roller has a plurality of installation positions, and at different installation positions, the hot pressing gap between the pressing roller and the processing platform is different.

[0032] Optionally, the device also includes a rotatable unloading roller and a receiving roller, wherein the unloading roller is arranged on the feeding side of the substrate to provide a strip-shaped copper-based-graphene laminate to the processing area, and the receiving roller is arranged on the discharging side of the substrate to wind up the strip after hot pressing.

[0033] The technical solution provided by this application can achieve the following beneficial effects:

[0034] The present application provides a device for processing copper-based graphene using a pressing roller, the device comprising a pressing roller and an oxygen-free processing area at 500°C to 900°C. In the processing area, a hot pressing gap is set between the pressing roller and the processing platform, and the copper-based graphene stack (multi-layered copper-based graphene composite material) is pressed into an integrated structure by the pressure of the pressing roller, thereby forming a copper-based graphene composite material in which copper-based graphene is alternately stacked in sequence. Experimental verification shows that the copper-based graphene composite material has high electrical conductivity and excellent mechanical properties. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 is a schematic diagram of a partial structure of a device for processing copper-based graphene using a pressure roller according to an exemplary embodiment of the present application;

[0036] Figure 2 yes Figure 1 DD view in;

[0037] Figure 3 yes Figure 2 A magnified view of the structure in the middle;

[0038] Figure 4 It is a top view of a partial structure of an apparatus for processing copper-based graphene using a pressure roller, shown in an exemplary embodiment of the present application. DETAILED DESCRIPTION

[0039] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0040] The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit this application. Unless otherwise defined, the technical terms or scientific terms used in this application should be understood by people with ordinary skills in the field to which the present invention belongs. The words "first", "second" and similar words used in the specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not indicate a quantity limit, but indicate that there is at least one. "Multiple" or "several" means two and more than two. Unless otherwise specified, words such as "front", "rear", "lower" and / or "upper", "top", "bottom" and the like are only for the convenience of explanation and are not limited to one position or one spatial orientation. Words such as "include" or "comprise" and the like mean that the elements or objects appearing in front of "include" or "comprise" include the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. Words such as "connect" or "connected" and the like are not limited to physical or mechanical connections, and can include electrical connections, whether direct or indirect.

[0041] Please refer to Figure 1 , Figure 1 A schematic diagram of a partial structure of an apparatus for processing copper-based graphene using a pressure roller is shown in an exemplary embodiment of the present application.

[0042] The present application provides a device 10 for processing copper-based graphene using a pressure roller, and the device 10 is used to hot-press a copper-based graphene laminate 80 into an integrated structure. The copper-based graphene laminate includes multiple layers of overlapping copper-based graphene film layers. The copper-based graphene film layer can be prepared by a chemical vapor deposition method. The thickness of the copper substrate used is different, and the thickness of the prepared copper-based graphene film layer is different. The thickness of the copper substrate is usually between 7μm and 50μm, and the thickness of the graphene layer grown on the copper substrate is about 1nm.

[0043] The number of layers of the copper-based graphene stack 80 is not limited and can be selected according to actual needs. For example, 20 layers, 60 layers, 80 layers or 100 layers of the copper-based graphene stack 80 can be pressed together.

[0044] Specifically, Figure 1 As shown, the device 10 includes a substrate 11 and a pressing roller 12. The substrate 11 includes a processing area 110 and a processing platform 112 disposed in the processing area 110, and the processing area 110 is an oxygen-free area.

[0045] The pressing roller 12 and the heating mechanism 20 are both disposed in the processing area 110, wherein the pressing roller 12 is rotatably disposed, and a hot pressing gap for pressing the copper-based graphene laminate 80 is preset between the pressing roller 12 and the processing platform 112. The pressing roller 12 can be made of a high temperature resistant carbon material, and the hot pressing gap should be smaller than the total thickness of the copper-based graphene laminate 80.

[0046] In one example, the hot pressing gap can be set to 80% to 99% of the total thickness of the copper-based graphene laminate 80. Further, the hot pressing gap can be set to 95% to 99% of the total thickness of the copper-based graphene laminate 80. The hot pressing gap can control the reliability of the hot pressing bonding of the copper-based graphene laminate 80.

[0047] The hot pressing gap between the pressing roller 12 and the processing platform 112 is adjustable to meet the hot pressing requirements of different layers of copper-based graphene laminates 80. The pressing roller 12 has multiple installation positions, and the hot pressing gap between the pressing roller 12 and the processing platform 112 is different at different installation positions. It can be seen that according to the number of layers of the copper-based graphene laminate 80, the hot pressing gap between the processing platform 112 and the pressing roller 12 can be adjusted by adjusting the position of the pressing roller 12. Of course, in other examples, the hot pressing gap can also be adjusted by adjusting the height of the processing platform 112.

[0048] The heating mechanism 20 is used to heat the copper-based graphene laminate 80 to 500°C to 900°C. Further, the heating mechanism 20 can be set to heat the copper-based graphene laminate 80 to 800°C to 900°C. The pressing roller 12 hot presses the copper-based graphene laminate 80 into an integrated structure at this temperature. During the hot pressing process, the hot pressing time can be maintained at 5min to 20min and the pressure can be maintained at 20Mpa to 50Mpa. It has been verified by experiments that the copper-based graphene composite material has high electrical conductivity and excellent mechanical properties.

[0049] The electrical conductivity and mechanical properties of the hot-pressed copper-based graphene composite material are experimentally verified below. Tables 1 to 4 are parameter lists of the test samples.

[0050] Table 1

[0051]

[0052] Table 2

[0053]

[0054]

[0055] Table 3

[0056]

[0057] Table 4

[0058]

[0059] Table 5

[0060]

[0061] From the analysis in Table 5, it can be seen that the conductivity of the copper-based graphene composite material after hot pressing is 108.4% to 117.7%, and the tensile strength R m 201Mpa~211Mpa, the plastic extension strength R is specified p0.2 The actual compression force F is 9850N~10060N, and the Vickers hardness is HV 0.2 It is about 55. It can be seen that the copper-based graphene composite material after hot pressing has high conductivity and excellent mechanical properties.

[0062] Please continue to refer to Figure 1 The device 10 further includes an inner box 13 and an outer box 14, wherein the inner box 13 is disposed inside the outer box 14. The area surrounded by the inner box 13 is a processing area 110, and the area surrounded by the outer box 14 is an oxygen-free area, and the processing area 110 is connected to the oxygen-free area. In one example, the outer box 14 can be vacuumed to form an oxygen-free area in the inner box 13 and the outer box 14.

[0063] It is easy to understand that setting the area in the inner box 13 as the processing area allows the heating mechanism 20 to heat only in a relatively small space, which is conducive to improving the heating rate, so that the ambient temperature of the processing area 110 and the copper-based graphene laminate 80 can be quickly heated to 500°C to 900°C, reducing heat loss and improving heating efficiency, and at the same time helping to keep the temperature constant during the hot pressing process. During actual processing, the copper-based graphene laminate 80 can be heated to 800°C to 900°C.

[0064] In one example, the outer box 14 includes an upper box 140 and a lower box 142, which together enclose an oxygen-free area. The device 10 also includes a seal 144, which is used to seal the outer box 14, so that the oxygen-free area is further sealed to keep the area in an oxygen-free state.

[0065] Specifically, the seal 144 includes a first sealing portion 144a and a second sealing portion 144b, wherein the first sealing portion 144a is disposed on the upper box 140 and extends along the joint portion between the upper box 140 and the lower box 142 to form an annular structure, and the second sealing portion 144b is disposed on the lower box 142 and extends along the joint portion between the upper box 140 and the lower box 142 to form an annular structure, and the first sealing portion 144a and the second sealing portion 144b are sealed and joined to achieve sealing of the outer box 14. The material of the seal 144 is not limited, and can be made of flexible and high temperature resistant materials such as rubber, asbestos, MgO-Cr2O3, and MgO-ZrO2.

[0066] An inlet for inputting the copper-based-graphene stack 80 is reserved between the first sealing portion 144a and the second sealing portion 144b. At the inlet, the first sealing portion 144a and the second sealing portion 144b are sealed and joined to the upper and lower surfaces of the copper-based-graphene stack 80 respectively, and at the remaining positions, the first sealing portion 144a and the second sealing portion 144b are sealed and joined.

[0067] In the processing area 110, the heating mechanism 20 can be arranged on the inner wall of the inner box 13, or can be arranged in the pressure roller 12. The heating mechanism 20 can be heated by electric heating or other methods, which is not limited in this application. When the heating mechanism 20 is arranged inside the pressure roller 12, the copper-based-graphene laminate 80 can be heated simultaneously through the contact between the pressure roller 12 and the copper-based-graphene laminate 80.

[0068] In addition, in the processing area 110, the oxygen-free environment can prevent oxidation of the copper substrate in the copper-graphene stack 80. Furthermore, a protective gas, such as helium, nitrogen, argon, and carbon dioxide, can be introduced into the processing area 110. The pressure of the protective gas can be set to 20Mpa to 100Mpa.

[0069] In one example, the device 10 may include a protective gas introduction mechanism 15 , which is connected to the area surrounded by the outer box 14 , and the protective gas can enter the processing area 110 through a channel between the outer box 14 and the inner box 13 .

[0070] The "oxygen-free" mentioned here does not mean oxygen-free in an absolute sense, but that the oxygen content is far lower than the normal level, and the oxidation caused to the copper substrate is negligible.

[0071] Please continue to refer to Figure 1 The device 10 further includes a preheating mechanism 16, which can preheat the copper-based graphene laminate 80 before hot pressing, so that the temperature of the copper-based graphene laminate 80 gradually rises from room temperature. The preheated temperature can be set to 50% to 80% of the temperature during pressing.

[0072] The preheating mechanism 16 may include an electromagnetic induction heater, which generates an electric current inside the copper-based graphene stack 80 by electromagnetic induction, and achieves the purpose of heating by relying on the energy of eddy current. The electromagnetic induction heater does not need to use air as a heat transfer medium, so the copper-based graphene stack 80 can be heated even in a vacuum environment. In the device 10, the electromagnetic induction heater can be arranged on the inner wall of the outer box 14, extending toward a side close to the copper-based graphene stack 80.

[0073] During the pressing process, in order to ensure that the copper-graphene stack 80 is reliably hot-pressed into one body, a proper hot-pressing time should be maintained while the pressing force is applied. For example, the hot-pressing time can be set to 5 minutes to 20 minutes.

[0074] Based on the above factors, the device 10 also includes a pressure maintaining mechanism 17 for increasing the hot pressing time of the copper-based graphene laminate 80. The pressure maintaining mechanism 17 includes a chain-type pressing plate and a power mechanism. The power mechanism drives the chain-type pressing plate to cyclically input and output the processing area 110. In the processing area 110, the pressing roller 12 presses the copper-based graphene laminate 80 through the chain-type pressing plate. It is easy to understand that by providing the chain-type pressing plate, the area of ​​the copper-based graphene laminate 80 that is simultaneously subjected to pressure under the pressure of the pressing roller 12 can be increased, so that during the hot pressing process, the hot pressing time at the same position of the copper-based graphene laminate 80 is increased.

[0075] For the copper-based-graphene laminate 80 of the strip, the chain-type pressing plate can be formed by splicing a plurality of sub-plates connected end to end and relatively movable to each other, each sub-plate splicing forms a ring-shaped closed chain structure, and the chain-type pressing plate is driven by a power mechanism and is cyclically input and output from the processing area 110, and in the processing area 110, the pressing roller 12 presses the copper-based-graphene laminate 80 through each sub-plate. In this scheme, the chain-type pressing plate can enter the processing area 110 together with the copper-based-graphene laminate 80, and the pressing roller 12 applies a pressing force to the copper-based-graphene laminate 80 through the sub-plates that enter the processing area 110 in sequence. Under the action of the pressing roller 12, the copper-based-graphene laminate 80 in contact with the sub-plate is always kept in a hot-pressed state during the process of the roller 12 rolling over the sub-plate, thereby increasing the hot-pressing time of the copper-based-graphene laminate 80.

[0076] The power mechanism that drives the chain-type pressing plate to cyclically move can be a combination of a motor and a chain transmission mechanism. For example, chains can be arranged on both sides of the sub-plate, the motor drives the sprocket to rotate, and the sprocket drives the chain to move, thereby realizing the reciprocating motion of the chain-type pressing plate. Of course, the power mechanism is not limited to this, and the driving wheel can also be directly used to drive the pressing plate to cyclically reciprocate.

[0077] In order to ensure the smooth movement of the chain-link pressure plate, the chain-link pressure plate can also be guided by a guide mechanism to cyclically reciprocate along a preset route. In one example, the guide mechanism can be set as a guide wheel 170. For example, a plurality of guide wheels 170 can be respectively set on the feed side and the discharge side of the device 10 to ensure that the chain-link pressure plate can be smoothly input and output from the processing area 110.

[0078] It should be noted that in the example of setting a chain-type pressing plate, the thickness of each sub-plate needs to be considered when setting the hot pressing gap. The sub-plate can be made of high-temperature alloy material or high-temperature resistant steel, and the temperature range of the sub-plate is 500℃~900℃.

[0079] Furthermore, a plurality of pressing rollers 12 may be provided in the processing area 110, and the plurality of pressing rollers 12 may be arranged side by side in the processing area 110. After such arrangement, the plurality of pressing rollers 12 may contact each sub-plate in turn, and during the hot pressing process, different sub-plates may repeatedly apply pressure to the same area of ​​the copper-based graphene laminate 80 under the pressure of the plurality of pressing rollers 12, thereby increasing the hot pressing time of the copper-based graphene laminate 80.

[0080] It is easy to understand that the hot pressing time of the copper-based graphene laminate 80 can also be adjusted by setting the diameter, rotation speed and size of the pressing roller 12. For example, in one example, the diameter of the pressing roller d = 10 cm; the rotation speed of the pressing roller w = 0.8 r / min; the number of pressing rollers n = 8; the conveying speed of the copper-based graphene laminate v = 4 cm / min, the above parameters can meet the process requirement of hot pressing the processed material for 20 minutes.

[0081] In order to effectively control the temperature of the processing area 110, the device 10 also includes a temperature sensor 116 and a temperature controller. The temperature sensor 116 is electrically connected to the temperature controller. The temperature controller controls the heating power of the heating mechanism 20 in the processing area 110 according to the temperature data obtained by the temperature sensor 116 to keep the temperature in the processing area 110 constant.

[0082] In one example, the temperature sensor 116 may be disposed in the processing platform 112. A plurality of temperature sensors 116 may be disposed and may be evenly distributed in the processing platform 112 along a straight line, thereby enabling the temperature sensor 116 to sense temperature in multiple directions, thereby improving the accuracy of temperature sensing.

[0083] The processing platform 112 can be configured as an integrated structure or a split structure. When the split structure is adopted, the portion of the processing platform 112 close to the pressure roller 12 can be separately configured, and the portion can be made of die steel, alloy steel or graphite material to increase the hardness and wear resistance of the material.

[0084] Please continue to refer to Figure 1 The device 10 further includes a feed conveying roller 18, which is disposed on the feed side of the processing platform 112 and is used to convey the copper-based graphene laminate 80 to the processing platform 112. In addition, in order to prevent the copper-based graphene laminate 80 from collapsing at the junction of the feed conveying roller 18 and the processing platform 112, the upper surface of the processing platform 112 extends toward the feed conveying roller 18, extends out of the processing area 110, and connects with the vertex of the feed conveying roller 18. This setting can reduce the gap between the feed conveying roller 18 and the processing platform 112, and prevent the copper-based graphene laminate 80 from falling into the gap to form wrinkles.

[0085] The feed side of the processing platform 112 includes a concave arc surface 1120 to leave space for accommodating the feed conveying rollers 18, so that the feed conveying rollers 18 can be closer to the feed side of the processing platform 112. The feed conveying rollers 18 can be arranged in groups, two by two, and are respectively arranged on both sides of the copper-based graphene stack 80, so that the conveying force is applied to the copper-based graphene stack 80 together.

[0086] The device 10 may further include a discharge conveying roller 19, which is disposed on the discharge side of the processing platform 112, and the pressed copper-graphene composite material may be conveyed out through the discharge conveying roller 19. The upper surface of the processing platform 112 may also be configured to engage with the top of the discharge conveying roller 19, thereby reducing the gap between the discharge conveying roller 19 and the processing platform 112.

[0087] The discharge side of the processing platform 112 includes a concave arc surface to leave space for accommodating the discharge conveying roller 19, so that the discharge conveying roller 19 can be closer to the discharge side of the processing platform 112 to avoid the copper-based-graphene composite material being stuck in the gap and scratched during discharge.

[0088] It should be noted that the feed conveying roller 18 and the discharge conveying roller 19 can be arranged inside the outer box body 14 or outside the outer box body 14. The former is adopted in this example.

[0089] Please refer to Figures 2 to 4 The inner box body 13 and the outer box body 14 are provided with an interface for the shaft 120 of the pressure roller 12 to extend out, and the interface is used to connect the shaft 120 with a power source such as a motor. A bearing 201 is provided at the interface, and the bearing 201 is used to support the shaft 120. The left side of the bearing 201 abuts against the annular retaining ring 21 of the device 10, and the right side abuts against the fixing assembly 22, so that the bearing 201 is axially fixed.

[0090] The device 10 also includes a multi-channel sealing mechanism disposed at the interface. The multi-channel sealing mechanism can simultaneously play the role of sealing and heat insulation, on the one hand, preventing the heat loss in the processing area 110, and on the other hand, preventing debris from entering the processing area 110 and affecting the processing quality.

[0091] Specifically, among the multiple sealing mechanisms, one of them is a first sealing mechanism. The first sealing mechanism includes a sealing material 50 . The sealing material 50 is filled in the gap between the shaft portion and the inner box body 13 and the shaft portion 120 .

[0092] The sealing material 50 is made of a high temperature resistant material. According to the temperature in the processing area 110, the sealing material 50 can be selected to have a temperature resistance in the range of 500° C. to 900° C. In this example, the sealing material 50 is made of a powdered material, such as ATO (antimony tin oxide) heat absorbing powder, nano-scale titanium silicate composite inorganic powder, gas phase SiO2, zircon composite material, etc.

[0093] Correspondingly, the first sealing mechanism further includes a first O-ring 40 and a second O-ring 42, which are arranged at intervals on the shaft 120, and the first O-ring 40, the second O-ring 42, the inner box 13 and the shaft 120 together form an annular sealed space, and the powdered sealing material 50 is filled in the annular sealed space. The sealing material 50 is a powdered material, which can reduce the rotation resistance of the shaft 120 while achieving the sealing of the shaft 120.

[0094] Among the multiple sealing mechanisms, one of them is a second sealing mechanism. The second sealing mechanism includes a sealing cavity surrounding the shaft portion 120 and grease filled in the sealing cavity. The grease is used as a sealing medium.

[0095] Specifically, the fixing assembly 22 includes a first fixing member 220 and a second fixing member 221, which are respectively sleeved on the shaft portion 120 and sealed with the shaft portion 120, wherein the first fixing member 220 and the second fixing member 221 are both fixedly connected to the outer box body 14, and a gap is left between the first fixing member 220 and the second fixing member 221, and the gap forms a sealing cavity 30, and the sealing cavity 30 is filled with grease, and the grease is used as a sealing medium. The grease can fill the sealing cavity 30 under the action of centrifugal force.

[0096] The second fixing member 221 includes a first portion 2210 and a second portion 2211, wherein the first portion 2210 and the first fixing member 220 form the main body of the sealing cavity 30, and the second portion 2211 is used to block the mouth of the sealing cavity 30. In other words, by removing the second portion 2211, grease can be injected into the sealing cavity 30 from the mouth.

[0097] The lubricating grease may be a high-temperature lubricating grease, and the temperature tolerance range of the high-temperature lubricating grease is 500° C. to 900° C. For example, molybdenum dioxide-based lubricating grease or tungsten dioxide-based high-temperature lubricating grease may be used.

[0098] The multi-sealing mechanism may further include a third sealing mechanism. For example, the third sealing mechanism includes an O-ring 2212 disposed between the second portion 2211 and the shaft portion 120 . The O-ring 2212 achieves sealing between the second fixing member 221 and the shaft portion 120 .

[0099] Of course, more sealing mechanisms may be included, for example, a sealing mechanism between the first portion 2210 and the shaft portion 120, etc. Moreover, it should be understood that the specific structure of each sealing mechanism is not limited to that shown above, and a labyrinth sealing mechanism may also be used.

[0100] The device 10 further includes a cooling mechanism 60, which is used to perform heat exchange with the shaft 120. The cooling mechanism 60 can take away part of the heat of the shaft 120 through heat exchange, thereby achieving the purpose of dissipating the heat of the shaft 120. The cooling mechanism 60 is connected to an external circulation system through a joint to achieve heat exchange. The cooling medium can be water, liquid nitrogen, etc., which is not limited in this application.

[0101] In one example, the inner box body 13 and the outer box body 14 together form a cavity, the cavity is filled with a cooling medium, and the first O-ring on the side wall of the cavity is in contact with the sealing material 50 to achieve heat exchange.

[0102] The inner contour surface 600 of the cavity is a curved contour surface, which can increase the contact area between the cavity and the cooling medium, thereby accelerating heat dissipation and improving heat dissipation efficiency. In this example, the inner contour surface 600 of the cavity is a wavy inner contour surface, but is not limited thereto.

[0103] Please continue to refer to Figure 2 The device 10 further includes a limiting mechanism 70, which is used to limit the extension of the copper-based-graphene laminate 80 in the width direction after being pressed. The limiting mechanism 70 includes two stoppers arranged in the width direction of the copper-based-graphene laminate 80, and the two stoppers are arranged in the processing area 110, and are respectively in contact with two opposite sides of the copper-based-graphene laminate 80 in the width direction.

[0104] The device 10 in the present application can be adapted to hot pressing of sheets and strips. In order to meet the processing requirements of strips, the device 10 can also include a rotatably arranged unwinding roller and a receiving roller (not shown in the figure), wherein the unwinding roller is arranged on the feeding side of the substrate 11 to provide the strip-shaped copper-based-graphene laminate 80 to the processing area, and the receiving roller is arranged on the discharging side of the substrate 11 to roll up the hot-pressed strip.

[0105] In actual application scenarios, multiple unloading rollers can be set, and the multiple unloading rollers are arranged in space. The strip-shaped copper-based graphene laminate 80 is wound on each unloading roller, and each unloading roller is wound with at least one layer of copper-based graphene laminate 80. When the device 10 is working, multiple unloading rollers rotate simultaneously to discharge materials into the processing area 110. After the hot pressing is completed, the take-up roller reels up the hot-pressed strip. The number of unloading rollers is not limited, and can be selected according to the number of layers of the copper-based graphene laminate 80 and the size of the space.

[0106] The device may further include a guide roller, which may guide the multi-layer copper-based graphene stack 80 to overlap each other before entering the outer box 14 .

[0107] Since the hot-pressed product is in a high temperature state of 500° C. to 900° C., the device 10 may further include a cooling mechanism, which is used to cool the hot-pressed product to room temperature. The cooled product is rolled up by a receiving roller.

[0108] The hot pressing process of the copper-based graphene laminate is explained below using a strip as an example.

[0109] After the outer box 14 is evacuated, a protective gas is introduced;

[0110] The copper-based graphene laminate 80 is preheated by discharging the material through the discharging roller, and the copper-based graphene laminate 80 is preheated to 300° C. to 400° C.;

[0111] The preheated copper-based graphene laminate 80 is continuously fed into the processing area 110, and the copper-based graphene laminate 80 is further heated to 500° C. to 900° C. in the processing area 110, and at the same time, the pressing roller 12 rotates to hot-press the copper-based graphene laminate 80;

[0112] Under the hot pressing conditions of 20 MPa to 50 MPa and 500° C. to 900° C., the hot pressing time of the pressing roller 12 on the copper-based graphene laminate 80 is 5 to 20 minutes, so that the copper-based graphene laminate 80 is hot pressed into an integrated structure;

[0113] After the hot pressing is completed, the hot pressed material is cooled and then rolled up on the receiving roller.

[0114] Of course, during the transportation of the copper-based graphene laminate 80, the deviation correction mechanism and the tension control mechanism can also be used to correct the offset and material tension of the copper-based graphene laminate 80 when overlapping, so as to ensure the quality of the product after hot pressing.

[0115] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A device for processing copper-based graphene using a pressure roller, characterized in that: include: The substrate (11) comprises a processing area (110) and a processing platform (112) arranged in the processing area (110), wherein the processing area (110) is set as an oxygen-free area; A heating mechanism (20) is used to heat the copper-based graphene laminate to 500° C. to 900° C.; and A pressing roller (12) is rotatably disposed in the processing area (110), and a hot pressing gap for hot pressing the copper-based graphene laminate (80) is preset between the pressing roller and the processing platform (112). The device (10) further comprises an inner box (13) and an outer box (14); the inner box (13) is arranged inside the outer box (14); the area surrounded by the inner box (13) is the processing area (110); the area surrounded by the outer box (14) is the oxygen-free sealed area; the processing area (110) is in communication with the oxygen-free sealed area; The device (10) further comprises a pressure maintaining mechanism (17) for increasing the hot pressing time of the copper-based graphene laminate (80), the pressure maintaining mechanism (17) comprising a chain-type pressing plate and a power mechanism, the power mechanism driving the chain-type pressing plate to cyclically enter and exit the processing area (110), within the processing area (110), the pressing roller (12) hot presses the copper-based graphene laminate (80) through the chain-type pressing plate, The chain-type pressing plate is formed by splicing a plurality of sub-plates connected end to end and movable relative to each other, each of the sub-plates being cyclically input and output from the processing area (110), and within the processing area (110), the pressing roller (12) hot presses the copper-based graphene laminate (80) through the sub-plates, The device (10) further comprises a protective gas introduction mechanism (15), wherein the protective gas introduction mechanism (15) is used to introduce protective gas into the processing area (110) to prevent oxidation of the copper-based graphene laminate (80).

2. The device for processing copper-based graphene using a pressure roller according to claim 1, characterized in that: The device (10) further comprises a preheating mechanism (16) for preheating the copper-based graphene laminate before hot pressing, wherein the preheating mechanism (16) is arranged in the outer box (14).

3. The device for processing copper-based graphene using a pressure roller according to claim 2, characterized in that: The preheating mechanism (16) comprises an electromagnetic induction heater.

4. The device for processing copper-based graphene using a pressure roller according to claim 1, characterized in that: A plurality of pressing rollers (12) are provided in the processing area (110), and the pressing rollers (12) are arranged side by side.

5. The device for processing copper-based graphene using a pressure roller according to claim 1, characterized in that: The inner box body (13) and the outer box body (14) are provided with an interface for the shaft portion (120) of the pressure roller (12) to extend out, and the device (10) also includes a multi-channel sealing mechanism arranged at the interface.

6. The device for processing copper-based graphene using a pressure roller according to claim 5, characterized in that: The multi-stage sealing mechanism comprises a first stage sealing mechanism, wherein the first stage sealing mechanism comprises a sealing material (50), and the sealing material (50) is filled in a gap between the inner box body (13) and the shaft portion (120).

7. The device for processing copper-based graphene using a pressure roller according to claim 6, characterized in that: The first sealing mechanism also includes a first O-ring (40) and a second O-ring (42) which are spaced apart on the shaft portion. The first O-ring (40), the second O-ring (42), the shaft portion (120) and the inner box body (13) together form an annular sealing space, and a powdered sealing material (50) is filled in the annular sealing space.

8. The device for processing copper-based graphene using a pressure roller according to claim 5, characterized in that: The multi-stage sealing mechanism also includes a second stage sealing mechanism, wherein the second stage sealing mechanism includes a sealing cavity (30) surrounding the shaft portion (120) and lubricating grease filled in the sealing cavity (30), wherein the lubricating grease is used as a sealing medium.

9. The device for processing copper-based graphene using a pressure roller according to claim 8, characterized in that: The device (10) further comprises a fixing assembly (22), wherein the fixing assembly (22) comprises a first fixing member (220) and a second fixing member (221), wherein the first fixing member (220) and the second fixing member (221) are respectively sleeved on the shaft portion (120) and sealedly engaged with the shaft portion (120), wherein the first fixing member (220) and the second fixing member (221) are both fixedly connected to the outer box body (14), and a gap is left between the first fixing member (220) and the second fixing member (221), and the gap forms the sealed cavity (30).

10. The device for processing copper-based graphene using a pressure roller according to claim 6, characterized in that: The device further comprises a cooling mechanism (60), wherein the cooling mechanism (60) is used for performing heat exchange with the shaft portion (120) of the pressing roller (12).

11. The device for processing copper-based graphene using a pressure roller according to claim 10, characterized in that: The inner box body (13) and the outer box body (14) form a cavity, the cavity is filled with a cooling medium, and the side wall of the cavity is in contact with the sealing material (50).

12. The device for processing copper-based graphene using a pressure roller according to claim 11, characterized in that: The inner contour surface (600) of the cavity close to the shaft portion (120) is a curved inner contour surface.

13. The device for processing copper-based graphene using a pressure roller according to any one of claims 1 to 12, characterized in that: The device (10) also includes a temperature sensor (116) and a temperature controller, wherein the temperature sensor (116) is electrically connected to the temperature controller, and the temperature controller controls the temperature of the processing area (110) according to the temperature data of the temperature sensor (116), and the temperature sensor (116) is arranged in the processing platform (112).

14. The device for processing copper-based graphene using a pressure roller according to any one of claims 1 to 12, characterized in that: The processing platform (112) is configured as a split structure, and the portion close to the pressure roller (12) is made of die steel, high-temperature alloy steel or graphite.

15. The device for processing copper-based graphene using a pressure roller according to any one of claims 1 to 12, characterized in that: The device (10) further comprises a feed conveying roller (18), which is arranged on the feed side of the processing platform (112) and is used to convey the copper-based graphene stack (80) to the processing platform (112); the upper surface of the processing platform (112) extends toward the feed conveying roller (18) and is connected to the feed conveying roller (18) at the vertex.

16. The device for processing copper-based graphene using a pressure roller according to any one of claims 1 to 12, characterized in that: The device (10) further comprises a limiting mechanism (70), wherein the limiting mechanism (70) is used to limit the extension amount of the copper-based graphene stack (80) along the width direction after being pressed.

17. The device for processing copper-based graphene using a pressure roller according to any one of claims 1 to 12, characterized in that: The hot pressing gap is set to 80% to 99% of the total thickness of the copper-based graphene stack (80).

18. The device for processing copper-based graphene using a pressure roller according to any one of claims 1 to 12, characterized in that: The pressing roller (12) has a plurality of installation positions, and at different installation positions, the hot pressing gap between the pressing roller (12) and the processing platform (112) is different.

19. The device for processing copper-based graphene using a pressure roller according to any one of claims 1 to 12, characterized in that: The device (10) also includes a rotatably arranged unwinding roller and a receiving roller, wherein the unwinding roller is arranged on the feeding side of the substrate (11) and is used to provide a strip-shaped copper-based-graphene laminate (80) to the processing area (110), and the receiving roller is arranged on the discharging side of the substrate (11) and is used to roll up the strip after hot pressing.

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