Imaging modules and electronic terminals

Abstract

The present invention discloses an imaging module and an electronic terminal. The imaging module includes a circuit board, a lens base arranged on the circuit board, a lens barrel accommodated in the lens base, a lens structure arranged in the lens barrel, and an electrical connection structure. The electrical connection structure includes a wire. The wire is at least partially installed on the outer side of the lens base, the upper end of the wire is electrically connected to the lens structure, and the wire includes a connecting portion located at the lower end of the wire and connected to the circuit board. The imaging module and the electronic terminal of the embodiment of the present invention use the connecting portion to connect with the circuit board to achieve electrical conduction of the lens structure, reduce or avoid adverse effects on the lens base caused by welding, such as poor electrical properties and poor appearance, and improve the reliability of the imaging module.

Description

Technical Field

[0001] The present invention relates to the field of imaging technology, and in particular to an imaging module and an electronic terminal. Background Art

[0002] The imaging module of the related art uses a variable focus lens structure to change the focal length of the lens to achieve focusing and uses Laser Direct Structuring (LDS) technology on the lens barrel or lens mount to electrically connect the lens structure. However, since the lens barrel or lens mount is mostly made of materials that cannot withstand high temperatures, such as liquid crystal polymer (LCP), welding can easily cause problems such as poor electrical properties and poor appearance of the lens barrel or lens mount. Summary of the invention

[0003] Embodiments of the present invention provide an imaging module and an electronic terminal.

[0004] The imaging module of the embodiment of the present invention comprises a circuit board, a lens holder arranged on the circuit board, a lens barrel at least partially accommodated in the lens holder, a lens structure arranged in the lens barrel, and an electrical connection structure. The electrical connection structure comprises a wire, the wire is at least partially mounted on the outer side surface of the lens holder, the upper end of the wire is electrically connected to the lens structure, and the wire comprises a connecting portion located at the lower end of the wire and connected to the circuit board.

[0005] In the imaging module of the embodiment of the present invention, since a wire is provided on the outer surface of the lens base and is connected to the circuit board by means of the connecting portion, the wire on the outer surface of the lens base can protect the lens base during welding, thereby reducing or avoiding adverse effects on the lens base or the lens barrel during welding, such as poor electrical properties and poor appearance, and improving the reliability of the imaging module.

[0006] In some embodiments, the imaging module includes a circuit board pad formed on the circuit board, and the connecting portion is connected to the circuit board pad, so that the connection between the wire and the circuit board is achieved, thereby making the lens structure electrically conductive.

[0007] In some embodiments, the connecting portion is a protruding structure, which increases the welding area and the three-dimensional welding space, and is conducive to improving the strength and efficiency of welding.

[0008] In some embodiments, the connecting portion protrudes from the outer side of the mirror base toward the outer side of the mirror base, thereby realizing a protruding structure of the connecting portion.

[0009] In some embodiments, the connecting portion is a widened structure, which increases the welding area and helps to improve the strength and efficiency of welding.

[0010] In some embodiments, the connecting portion gradually widens from top to bottom, thereby achieving a widened structure of the connecting portion.

[0011] In some embodiments, the width of the connecting portion is in the range of 0.2-3.5 mm. In this way, the cost can be reduced while the welding strength and efficiency are improved.

[0012] In some embodiments, a wiring groove is formed on the outer side of the mirror base, and the portion of the wire installed on the outer side of the mirror base is accommodated in the wiring groove. In this way, the friction between the wire and the outside is reduced, which is conducive to extending the life of the wire.

[0013] In some embodiments, the wires include at least one positive wire and one negative wire, and the positive wire and the negative wire are spaced apart, so that electrical conduction of the lens structure is achieved.

[0014] An embodiment of the present invention provides an electronic terminal, comprising the imaging module of any of the above embodiments and a housing, wherein the housing is provided with a positioning through hole, and the imaging module is disposed in the housing and exposed from the positioning through hole.

[0015] The electronic terminal of the embodiment of the present invention uses the imaging module of the embodiment of the present invention and utilizes the connecting portion to connect with the circuit board, thereby reducing or avoiding adverse effects on the lens holder or the lens barrel during welding, such as poor electrical properties and poor appearance, and improving the reliability of the imaging module.

[0016] Additional aspects and advantages of embodiments of the present invention will be given in part in the following description and in part will be obvious from the following description or learned through practice of embodiments of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 is a schematic structural diagram of an imaging module according to an embodiment of the present invention;

[0019] Figure 2 is a schematic structural diagram of a lens portion of a lens structure according to an embodiment of the present invention;

[0020] Figure 3 is a schematic structural diagram of an imaging module according to another embodiment of the present invention;

[0021] Figure 4 yes Figure 3 An enlarged schematic diagram of part IV of the imaging module;

[0022] Figure 5 It is a schematic plan view of an electronic terminal according to an embodiment of the present invention.

[0023] Description of main component symbols:

[0024] Imaging module 10, circuit board 12, first connector 122, second connector 124, flexible connection part 126, lens holder 14, outer side surface 142, wiring groove 144, top wall 146, opening 148, main body 141, protrusion 143, lens barrel 16, top surface 162, mounting structure 164, positioning block 1642, positioning groove 1644, lens structure 18, lead 182, adjustable lens 184, lens part 1842, packaging part 1844, spacer 1846, glass substrate 1841, polymer 1843, glass film 1845, piezoelectric ceramic film 1847, electrical connection structure 19, wire 192, connection part 1922, main body 1924, wire 194, connection part 1942, main body 1944, bottom edge 1946, circuit board pad 11, electronic terminal 100, shell 20, positioning through hole 22. DETAILED DESCRIPTION

[0025] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0026] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0027] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0029] The imaging module 10 of the present invention can be divided into two specific embodiments, which are described below. It should be pointed out that the modifications or replacements made by those skilled in the art based on the two embodiments of the present invention are also within the protection scope of the present invention.

[0030] Embodiment 1:

[0031] See also Figure 1 The imaging module 10 of the embodiment of the present invention includes a circuit board 12, a lens holder 14 disposed on the circuit board 12, a lens barrel 16 at least partially accommodated in the lens holder 14, a lens structure 18 disposed in the lens barrel 16, and an electrical connection structure 19. The electrical connection structure 19 includes a wire 192, the wire 192 is at least partially mounted on the outer side surface 142 of the lens holder 14, the upper end of the wire 192 is electrically connected to the lens structure 18, and the wire 192 includes a connecting portion 1922 located at the lower end of the wire 192 and connected to the circuit board 12.

[0032] In the imaging module 10 of the embodiment of the present invention, since a wire 192 is provided on the outer side surface 142 of the lens base 14 and is connected to the circuit board 12 by means of a connecting portion 1922, during welding, the wire 192 on the outer side surface 142 of the lens base 14 can protect the lens base 14, thereby reducing or avoiding adverse effects on the lens base 14 or the lens barrel 16 during welding, such as poor electrical properties and poor appearance, and improving the reliability of the imaging module 10.

[0033] For the present invention, the lens barrel 16 at least partially received in the lens holder 14 is Figure 1 In the example, the lens barrel 16 is partially accommodated in the lens base 14, which can be understood as the lens barrel 16 including a portion located in the lens base 14 and a portion located outside the lens base 14. Figure 1 A receiving space (not shown) is defined in the lens base 14 , and an opening 148 communicating with the receiving space is defined in the top wall 146 of the lens base 14 . A portion of the lens barrel 16 is located in the receiving space, and another portion of the lens barrel 16 extends out of the lens base 14 from the opening 148 .

[0034] exist Figure 1 In the example shown in FIG. 1 , the mirror holder 14 is substantially in the shape of a rectangular parallelepiped.

[0035] In other embodiments, the lens barrel 16 at least partially accommodated in the lens holder 14 may also mean that the lens barrel 16 is completely accommodated in the lens holder 14, for example, the entire lens barrel 16 is located in the accommodation space or in the empty space and the opening 148, that is, when viewed horizontally, there is no portion of the lens barrel 16 protruding from the lens holder 14. Light can be incident on the lens barrel 16 from the opening 148 of the top wall 146 of the lens holder 14.

[0036] In this embodiment, the circuit board 12 includes a flexible circuit board. The flexible circuit board has high wiring density, light weight, and thin thickness, and can be freely rolled and folded, which helps to reduce assembly processes and enhance reliability. In addition, the flexible circuit board can provide excellent electrical performance and can meet the design requirements of miniaturization of the imaging module 10.

[0037] It is understandable that in other embodiments, the circuit board 12 includes a hard-soft board. The hard-soft board has both a certain flexible area and a certain rigid area, which is conducive to saving the internal space of the product and reducing the volume of the imaging module 10. In some other embodiments, the circuit board 12 includes a ceramic substrate. The ceramic substrate has excellent thermal conductivity, which makes the chip packaging very compact, thereby greatly improving the power density and improving the reliability of the imaging module 10. In some other embodiments, the circuit board 12 includes a printed circuit board. The use of a printed circuit board can reduce wiring and assembly errors, thereby saving equipment maintenance, debugging and inspection time. In addition, the printed circuit board is mechanized and automated production, with a low cost, which is conducive to cost saving.

[0038] In this embodiment, the circuit board 12 includes a first connector 122, a second connector 124 and a flexible connection portion 126. The flexible connection portion 126 connects the first connector 122 and the second connector 124. The second connector 124 is used to be connected to an external circuit. The external circuit supplies power and transmits data to the imaging module 10 through the circuit board 12. The external circuit can send control signals or other communication signals to the imaging module 10 and receive image signals or other communication signals generated by the imaging module 10, so that the imaging module 10 can work normally.

[0039] In addition, the imaging module 10 includes an image sensor (not shown) disposed on the first connector 122, and the image sensor is located on the image side of the lens structure 18. The image sensor performs image acquisition and converts the optical image into an electronic signal.

[0040] In one example, the image sensor is a CMOS image sensor. CMOS image sensors are not only very power-saving and can reduce the cost of use, but also can greatly simplify the hardware structure of the system. In other examples, the image sensor can also be a CCD image sensor.

[0041] In one example, the lens holder 14 and the lens barrel 16 are made of insulating material. The resistivity of the insulating material is very high. The use of insulating material to separate the internal components from the outside world can avoid adverse effects such as short circuits. The insulating material can be plastic. Plastic is a good insulator, light and strong, easy to process, cheap and light, which is conducive to reducing costs, reducing the weight of the imaging module 10, and facilitating production.

[0042] In this embodiment, the lens structure 18 includes a lead 182 electrically connected to the wire 192. A shadowless adhesive (not shown) is disposed outside the lead 182. Applying the shadowless adhesive outside the lead 182 can increase the strength of the lead 182 and delay the aging of the lead 182.

[0043] In the present embodiment, the top surface 162 of the lens barrel 16 is formed with a mounting structure 164. The mounting structure 164 can be a receiving groove sunken from the top surface 162, the receiving groove is connected to the through hole (not shown) of the lens barrel 16 for receiving the lens (not shown) and the center of the lens structure 18 corresponds to the center of the lens. The lens structure 18 is at least partially arranged in the mounting structure 164. In other words, the lens structure 18 can include a part located in the mounting structure 164 and a part located outside the mounting structure 164. It can be understood that the lens structure 18 can be flush with the top surface 162, below the top surface 162 or slightly protruding from the top surface 162. When the lens structure 18 is flush with the top surface 162, the overall volume of the imaging module 10 can be reduced as much as possible while the lens structure 18 is fully protected. When the lens structure is below the top surface 162, the protection of the lens structure by the mounting structure 18 can be more fully provided. When the lens structure 18 slightly protrudes from the top surface 162, it can adapt to the specific structure of some electronic terminals that need to install the imaging module 10. In this way, the above structure can be selected and adjusted according to specific needs and production conditions.

[0044] In this embodiment, the lens structure 18 is a variable focus lens structure, which includes an adjustable lens 184 and a light shielding sheet (not shown in the figure), and the adjustable lens 184 includes a lens portion 1842 and a packaging portion 1844, and the lens portion 1842 is arranged in the packaging portion 1844. The light shielding sheet is provided with a through hole (not shown in the figure), and the light shielding sheet is arranged on the lens portion 1842 and the lens portion 1842 is partially exposed from the through hole. The light shielding sheet covers the interval 1846 between the lens portion 1842 and the packaging portion 1844. By providing a light shielding sheet to cover the interval 1846 between the lens portion 1842 and the packaging portion 1844, foreign matter such as dust is not easy to enter the lens structure 18, reducing or avoiding the risk of the adjustable lens 184 being scratched.

[0045] See also Figure 2 In this embodiment, the lens portion 1842 includes a glass substrate 1841, a polymer 1843, a glass film 1845 and a piezoelectric ceramic film 1847. The piezoelectric ceramic film 1847 is deformed under the control of voltage, so that the glass film 1845 and the polymer 1843 are deformed, thereby producing different refractive indices, changing the focusing point of the light, and realizing the zoom function of the lens structure 18. Optical zoom is realized by using the principle that the piezoelectric ceramic film 1847 is deformed under the control of voltage. Compared with the use of a voice coil motor to achieve focusing, the manufacturing process of the imaging module 10 is simpler. In addition, the imaging module 10 has no magnetic components and will not generate magnetic interference.

[0046] In some examples, the glass substrate 1841 is blue glass. Advantageously, the glass substrate 1841 is blue flat glass, and the main component of the blue glass is phosphate or phosphoric acid. The glass substrate 1841 may be treated with an infrared isolation coating.

[0047] The blue glass whose main component is phosphate or phosphoric acid and the glass substrate 1841 treated with infrared isolation coating can filter infrared light. Since the image sensor can sense infrared light, and the human eye only reacts to visible light, selecting blue glass as the material of the glass substrate 1841, or coating the glass substrate 1841 with infrared isolation coating, can make the scene effect seen by the image sensor and the human eye basically the same.

[0048] In this embodiment, the imaging module 10 includes a circuit board pad 11 formed on the circuit board 12, and the connecting portion 1922 connects the circuit board pad 11. In this way, the circuit board pad 11 facilitates the connection between the wire 192 and the circuit board 12, so that the lens structure 18 is electrically conductive.

[0049] exist Figure 1In the example of , the connection part 1922 is a raised structure. In this way, the welding area and the three-dimensional welding space are increased, which is conducive to improving the strength and efficiency of welding and solving the problem of poor electrical properties. At the same time, the raised connection part 1922 increases the distance from the outer side surface 142 of the lens holder 14 during welding, which can reduce or avoid the poor appearance of the lens holder 14 due to the influence of welding.

[0050] Specifically, the connection portion 1922 protrudes from the outer side surface 142 of the lens base 14 to the outside of the lens base 14. In this way, when the connection portion 1922 protrudes to the outside of the lens base 14, the connection portion 1922 can be pre-positioned according to the position of the circuit board pad 11 when connected to the circuit board 12, so as to facilitate the connection between the connection portion 1922 and the circuit board pad 11. At the same time, the welding point can be far away from the lens base 14, reducing or avoiding the problem of poor appearance of the lens base 14.

[0051] It can be understood that the wire 192 can be L-shaped, the connecting portion 1922 can be regarded as the short side of L, and the body 1924 of the wire 192 can be regarded as the long side of L. The body 1924 of the wire 192 is at least partially attached to the outer side surface 142 of the lens holder 14, and the connecting portion 1922 protrudes from the body 1924 of the wire 192 to the outside of the lens holder 14. The protrusion can refer to a sheet-like extension or a block-like protrusion, and the shape can be regular or irregular, and the specific shape of the protrusion structure of the connecting portion 1922 is not limited here.

[0052] The outer side surface 142 of the lens base 14 is formed with a wiring groove 144, and the portion of the wire 192 installed on the outer side surface 142 of the lens base 14 is accommodated in the wiring groove. In this way, the friction between the wire 192 and the outside is reduced, which is conducive to extending the life of the wire 192. In the illustrated embodiment, the portion of the wire 192 installed on the outer side surface 142 of the lens base 14 can be a part or the entire body 1924.

[0053] The wire 192 includes at least one positive wire and one negative wire, and the positive wire and the negative wire are spaced apart. The spacing here means that the positive wire and the negative wire are insulated. In this way, the electrical conduction of the lens structure 18 is achieved. Of course, the wire 192 can also include a set of spare wires to facilitate the maintenance and fault detection of the imaging module 100.

[0054] It can be understood that the specific structure of the wire 192 is not limited to the above-mentioned protruding structure and widening structure, and the specific structure of each wire can be the same or different.

[0055] In this embodiment, the wire 192 is disposed on the outer side surface 142 of the lens holder 14 by evaporation. The evaporation process is fast and efficient. The evaporation process is used to dispose the wire 192 on the outer side surface 142 of the lens holder 14, which can improve the production efficiency of the imaging module 10.

[0056] In other embodiments, the wire 192 is disposed on the outer side 142 of the lens holder 14 by electroplating. The electroplating process is widely used, and the wire 192 is disposed on the outer side 142 of the lens holder 14 by the electroplating process, which can reduce the cost and improve the production efficiency of the imaging module 10.

[0057] Embodiment 2:

[0058] In the description of the second embodiment, the main differences between the second embodiment and the first embodiment are described, and the parts of the second embodiment that are the same or similar to the first embodiment are omitted in the description of this embodiment.

[0059] See also Figure 3 and Figure 4 In this embodiment, the connecting portion 1942 is a widened structure. In this way, the welding area is increased, which is conducive to improving the strength and efficiency of welding, thereby solving the problem of poor electrical properties.

[0060] In the example shown in the figure, the connecting portion 1942 is gradually widened from top to bottom. In this way, the widened structure of the connecting portion 1942 is achieved.

[0061] It can be understood that the gradual widening refers to the gradual increase in width from top to bottom, that is, from the body 1944 of the wire 194 to the bottom edge 1946 of the connecting portion 1942. Of course, the gradual widening is not limited to the strict gradual increase in width from the body 1944 to the bottom edge 1946. In other words, the gradual widening also includes the situation that the width of the portion from the body 1944 to the bottom edge 1946 gradually increases and maintains this width until it reaches the bottom edge 1946, or the width does not gradually increase uniformly.

[0062] Advantageously, the width P of the connection portion 1942 is in the range of 0.2-3.5 mm. In this way, the cost can be reduced while the welding strength and efficiency are improved.

[0063] It is worth noting that Figure 3 As shown in the mark in , the width range P of the connection portion 1942 refers to the width range of the bottom side 1946 of the connection portion 1942. Specifically, when the width P of the bottom side 1946 of the connection portion 1942 is 0.5 mm, the effect of ensuring welding strength and efficiency is best.

[0064] It can be understood that when the width P of the bottom edge 1946 is less than 0.2 mm, the welding strength and welding efficiency cannot be guaranteed because the welding area between the connection part 1942 and the circuit board pad 11 is too small. When the width P of the bottom edge 1946 is greater than 3.5 mm, the welding area of ​​the connection part 1942 is too large, and the part exceeding 3.5 mm cannot participate in welding or cannot participate in welding effectively. When the width P of the bottom edge 1946 is in the range of 0.2-3.5 mm, the strength and efficiency of welding can be guaranteed, and materials can be saved and costs can be reduced as much as possible.

[0065] In addition, in this embodiment, the horizontal appearance of the mirror base 14 is in the shape of a "convex" character, that is, the mirror base 14 includes a main body 141 and a protruding portion 143. The main body 141 is disposed on the first connector 122 of the circuit board 12, and the first connector 122 is connected to the second connector 124 through the flexible connecting portion 126. The details of the second connector 124 are shown in FIG. Figure 3 It is not shown in the figure, but it is easy to understand that Figure 3 The details of the second connector 124 can be related to Figure 1 The protrusion 143 is disposed on the main body 141, and the accommodation space passes through the main body 141 and the protrusion 143. The top of the protrusion 143 is provided with an opening (not shown), and the lower part of the lens barrel 16 extends into the lens holder 14 from the opening, and the upper part of the lens barrel 16 is protruded outside the lens holder 14.

[0066] In this embodiment, the imaging module 10 includes a mounting structure 164 formed on the top surface 162 of the lens barrel 16 and matched with the top surface 162. The lens structure 18 is disposed in the mounting structure 164. In this way, while accommodating and protecting the lens structure 18, the size of the imaging module 10 will not be enlarged by the mounting structure 164, which is conducive to the miniaturization of the imaging module 10.

[0067] In this embodiment, the mounting structure 164 includes a plurality of positioning blocks 1642 extending upward from the top surface 162 of the lens barrel 16 and a positioning groove 1644 defined by the positioning blocks 1642, and the lens structure 18 is mounted in the positioning groove 1644. Each positioning block 1642 is in the shape of an arc block, and the outer arc edge of the positioning block 1642 is aligned with the outer periphery of the top surface 162 of the lens barrel 16. This makes the positioning block 1642 match the shape of the top surface 162 of the lens barrel 16, so that the structure of the imaging module 10 is smoother and the appearance is more beautiful.

[0068] In other embodiments, the mounting structure 164 includes a substrate (not shown) disposed on the top surface 162 of the lens barrel 16 and having a shape matching the top surface 162, and a plurality of positioning blocks 1642 extending upward from the substrate. In other words, the mounting structure 164 and the lens barrel 16 are formed separately, and the mounting structure 164 is combined with the lens barrel 16 by disposing the substrate on the top surface 162 of the lens barrel 16. Specifically, the substrate can be disposed on the lens barrel 16 by gluing.

[0069] See also Figure 5 The embodiment of the present invention provides an electronic terminal 100, which includes the imaging module 10 of any of the above embodiments and a housing 20, wherein the housing 20 is provided with a positioning through hole 22. The imaging module 10 is disposed in the housing 20 and exposed from the positioning through hole 22.

[0070] The electronic terminal 100 of the embodiment of the present invention uses the imaging module 10 of the embodiment of the present invention, which reduces or avoids the adverse effects of welding on the lens holder 14 or the lens barrel 16, such as poor electrical properties and poor appearance, and improves the reliability of the imaging module 10.

[0071] The electronic terminal 100 includes but is not limited to mobile phones, tablet computers, wearable devices, access control devices, vehicle-mounted terminals and other electronic terminals with shooting functions.

[0072] In the illustrated example, the electronic terminal 100 includes a rear camera or a front camera. The front camera generally has a relatively low pixel and uses a fixed focus module, so the size of the front camera was previously small. However, as the functional requirements increase, the size of the front camera increases. Based on the consideration of both functionality and full screen, in the illustrated embodiment, the imaging module 10 is applied to the front camera, which not only meets the functional requirements, but also conforms to the trend of full screen. It can be understood that the imaging module 10 can also be applied to the rear camera.

[0073] Specifically, the embodiments of the present invention may satisfy only one of the above embodiments or satisfy multiple of the above embodiments at the same time. That is to say, the embodiments formed by combining one or more of the above embodiments also belong to the protection scope of the embodiments of the present invention.

[0074] In the description of this specification, the description with reference to the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0075] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. An imaging module, characterized in that: include: Circuit boards; A mirror holder disposed on the circuit board; a lens barrel at least partially received in the lens holder; A lens structure disposed in the lens barrel; and An electrical connection structure, the electrical connection structure comprising a wire, the wire being at least partially mounted on an outer side surface of the lens base, the upper end of the wire being electrically connected to the lens structure, the wire comprising a connecting portion located at a lower end of the wire and connected to the circuit board, the connecting portion being a protruding structure, and the connecting portion protruding from an outer side surface of the lens base toward an outer side of the lens base; The connection between the connecting portion and the circuit board is welding; The lens structure comprises a lead wire, and the wire is connected to the lens structure via the lead wire.

2. The imaging module according to claim 1, wherein: The imaging module includes a circuit board pad formed on the circuit board, and the connecting portion is connected to the circuit board pad.

3. The imaging module according to claim 1, wherein: The connecting portion is a widened structure.

4. The imaging module according to claim 3, characterized in that: The connecting portion gradually widens from top to bottom.

5. The imaging module according to claim 3, characterized in that: The width of the connecting portion ranges from 0.2 to 3.5 mm.

6. The imaging module according to claim 1, wherein: A wiring groove is formed on the outer side surface of the mirror base, and the portion of the wire installed on the outer side surface of the mirror base is accommodated in the wiring groove.

7. The imaging module according to claim 1, wherein: The conductors include at least one positive conductor and one negative conductor, and the positive conductor is spaced apart from the negative conductor.

8. An electronic terminal, characterized in that: include: A housing, wherein the housing is provided with a positioning through hole; The imaging module described in any one of claims 1 to 7 is arranged in the shell and exposed from the positioning through hole.

Images