Device for processing copper-based graphene using mold

Abstract

The present application provides a device for processing copper-based graphene using a mold. The device includes: a box, the inner cavity of the box is a processing area, and the processing area is set as an oxygen-free area; a heating mechanism, which is arranged in the processing area, and is used to heat the copper-based graphene laminate to 500℃~900℃; and a static mold and a dynamic mold, both of which are arranged in the processing area, the static mold is fixedly arranged in the processing area, the static mold includes a cavity, the copper-based graphene laminate is placed in the cavity, and the dynamic mold has a hot pressing stroke close to the static mold and then hot presses the copper-based graphene laminate in the cavity. It has been verified by experiments that the copper-based graphene composite material after hot pressing has high conductivity and high-quality mechanical properties.

Description

Technical Field

[0001] The present application relates to the technical field of copper-based graphene processing, and in particular, to a device for processing copper-based graphene using a mold. Background Art

[0002] Graphene is a carbon material with a single-layer two-dimensional honeycomb lattice structure formed by tightly stacked sp2 hybridized carbon atoms. Graphene has excellent comprehensive properties, with a tensile strength of 125Gpa, an elastic modulus of 1.0Tpa, a thermal conductivity of 5300W / (m·k), and an electron mobility of 2×105cm 2 (v·s), therefore, graphene is often used as an ideal filler to prepare composite materials.

[0003] In the prior art, a carbon source can be cracked and then deposited and grown on the surface of a copper foil to form graphene, thereby obtaining a copper-based graphene composite material. However, in practical applications, in order to make the copper-based graphene composite material have high electrical conductivity and better mechanical properties, the copper-based graphene composite material prepared by the above method needs to be further processed. Summary of the invention

[0004] In view of this, the present application provides a device for processing copper-based graphene using a mold, which can further process the copper-based graphene composite material to meet the requirements of high conductivity and better mechanical properties.

[0005] Specifically, the present application is implemented through the following technical solutions:

[0006] A device for processing copper-based graphene using a mold, comprising:

[0007] A box body, wherein the inner cavity of the box body is a processing area, and the processing area is an oxygen-free area;

[0008] A heating mechanism, disposed in the processing area, for heating the copper-based graphene laminate to 500° C. to 900° C.; and

[0009] The static mold and the dynamic mold are both arranged in the processing area. The static mold is fixedly arranged in the processing area. The static mold includes a cavity. The copper-based graphene stack is placed in the cavity. The dynamic mold has a hot pressing stroke that approaches the static mold and then hot presses the copper-based graphene stack in the cavity.

[0010] Optionally, the box body includes a feed port and a discharge port, and the device also includes a conveying mechanism for inputting the sheet-like copper-based-graphene laminate into the processing area, and the conveying mechanism is used to input the copper-based-graphene laminate from the feed port and output the hot-pressed material from the discharge port.

[0011] Optionally, the conveying mechanism includes a conveying carrier, which has a conveying stroke and includes multiple fixed positions for fixing the copper-based-graphene stack, the copper-based-graphene stack is fixed at the fixed positions, and during the conveying stroke, the copper-based-graphene stack fixed at the fixed positions is hot pressed into the cavity by a moving mold.

[0012] Optionally, the conveying mechanism further includes an unwinding mechanism and a rewinding mechanism, the unwinding mechanism and the rewinding mechanism respectively have a rotation stroke, and the unwinding mechanism and the rewinding mechanism jointly drive the conveying carrier to generate the conveying stroke during the rotation stroke.

[0013] Optionally, the device further comprises guide drive wheels, which are arranged in groups, and each group of guide drive wheels are arranged opposite to each other on the upper and lower sides of the conveying carrier and rotate in opposite directions to guide and drive the conveying carrier.

[0014] Optionally, the device further comprises a first packaging box, which is arranged at the feed side of the box and is used to package the conveying mechanism located at the feed side, the first packaging box is connected to the box, the joint portion surrounds the feed port, and the interior of the first packaging box is set as an oxygen-free area, and / or

[0015] The device also includes a second packaging box, which is arranged on the discharge side of the box and is used to package the conveying mechanism located on the discharge side. The second packaging box is connected to the box, and the joint part surrounds the discharge port. The interior of the second packaging box is set as an oxygen-free area.

[0016] Optionally, the device further includes a first sealing mechanism, which seals the feed port, and / or the device further includes a second sealing mechanism, which seals the discharge port.

[0017] Optionally, at least one of the first sealing mechanism and the second sealing mechanism includes a sealing baffle and a connecting piece, the sealing baffle is movably arranged on the box body through the connecting piece, and the sealing baffle has a movable stroke for sealing the feed port and releasing the seal of the feed port.

[0018] Optionally, the transport carrier includes a hollow portion, and the copper-based-graphene laminate is fixed to the hollow portion.

[0019] Optionally, the heating mechanism includes a power supply, the static mold and the dynamic mold are both made of conductive materials, one end of the power supply is connected to the static mold, and the other end is connected to the dynamic mold, the dynamic mold and the static mold are connected through the copper-based-graphene stack, and the current flowing through the copper-based-graphene stack is used to heat the copper-based-graphene stack.

[0020] Optionally, the movable mold includes a pressing head part for hot pressing the copper-based graphene stack and a connecting part connected to the pressing head part, wherein the connecting part is used to be connected to a press, and the pressing head part and the connecting part are detachably connected.

[0021] Optionally, the movable mold further includes a heat insulating member, and the heat insulating member is arranged between the pressure head part and the connecting part.

[0022] Optionally, the device further includes a temperature sensor and a temperature controller, wherein the temperature controller controls the heating power of the heating mechanism according to temperature data obtained by the temperature sensor, and the temperature sensor is disposed in the static mold and / or the dynamic mold.

[0023] Optionally, at the end position of the hot pressing stroke, a hot pressing gap is reserved between the static mold and the dynamic mold, and the hot pressing gap is 80% to 99% of the total thickness of the copper-based-graphene laminate.

[0024] Optionally, the device further comprises a gas introduction mechanism, wherein the gas introduction mechanism is used to introduce a protective gas into the processing area to prevent oxidation of the copper substrate in the copper-graphene stack.

[0025] The technical solution provided by this application can achieve the following beneficial effects:

[0026] The present application provides a device for processing copper-based graphene using a mold, the device comprising a static mold, a dynamic mold and a heating mechanism arranged in an oxygen-free processing area, and the heating mechanism is used to heat the copper-based graphene laminate to 500°C to 900°C. The static mold is fixedly arranged in the processing area and includes a cavity, and the dynamic mold has a hot pressing stroke close to the static mold to hot press the copper-based graphene laminate in the cavity into an integrated structure. After hot pressing, the copper-based graphene laminate forms an integrated stacked structure. It has been verified by experiments that the copper-based graphene after hot pressing has high conductivity and excellent mechanical properties. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a cross-sectional view of a partial structure of a device for processing copper-based graphene using a mold according to an exemplary embodiment of the present application;

[0028] Figure 2 is another cross-sectional view of a partial structure of a device for processing copper-based graphene using a mold according to an exemplary embodiment of the present application;

[0029] Figure 3 yes Figure 1 DD view in . DETAILED DESCRIPTION

[0030] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0031] The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit this application. Unless otherwise defined, the technical terms or scientific terms used in this application should be understood by people with ordinary skills in the field to which this application belongs. The "first", "second" and similar words used in the specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one" or "one" do not indicate quantitative restrictions, but indicate that there is at least one. "Multiple" or "several" means two and more than two. Unless otherwise specified, similar words such as "front", "rear", "lower" and / or "upper", "top", "bottom" are only for the convenience of explanation, and are not limited to one position or one spatial orientation. Similar words such as "include" or "comprise" mean that the elements or objects appearing in front of "include" or "comprise" cover the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. The words "connected" or "connected" and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0032] Please refer to Figures 1 to 3 The present application provides a device for processing copper-based graphene using a mold, wherein the device is used to hot-press the copper-based graphene laminate into an integrated structure, wherein the copper-based graphene laminate includes multiple layers of stacked copper-based graphene film layers.

[0033] The copper-based graphene film layer can be prepared by chemical vapor deposition. The thickness of the copper-based graphene film layer prepared is different depending on the thickness of the copper substrate. The thickness of the copper substrate is usually selected between 7μm and 50μm. The thickness of the graphene layer grown on the copper substrate is about 1nm.

[0034] The number of layers of the copper-based graphene laminate is not limited and can be selected according to actual needs. For example, 20 layers, 60 layers, 80 layers or 100 layers of copper-based graphene laminates can be hot pressed together. After hot pressing, the multi-layer copper-based graphene laminate forms a copper-based graphene composite material with an integrated structure, wherein the copper layer and the graphene layer are alternately stacked in sequence.

[0035] Specifically, Figure 1 As shown, the device comprises a box 10, a static mold 11, a dynamic mold 12 and a heating mechanism (not shown in the figure). The inner cavity of the box 10 is a processing area 100, and the processing area 100 is set as an oxygen-free area.

[0036] The static mold 11, the dynamic mold 12 and the heating mechanism are all arranged in the processing area 100, wherein the heating mechanism is used to heat the copper-based graphene laminate 80 to 500°C to 900°C. At a temperature of 500°C to 900°C, the copper-based graphene laminate can be hot-pressed into an integrated structure through the static mold 11 and the dynamic mold 12. During actual processing, the copper-based graphene laminate 80 can be heated to 800°C to 900°C.

[0037] The static mold 11 is fixedly arranged in the processing area 100. The static mold 11 includes a cavity 11a. During hot pressing, the copper-based graphene laminate 80 is placed in the cavity 11a. The movable mold 12 has a hot pressing stroke that moves toward the side close to the static mold 11 and then hot presses the copper-based graphene laminate 80 in the cavity 11a into an integrated structure. During the hot pressing process, the pressure applied by the movable mold 12 to the copper-based graphene laminate 80 can be maintained for 5 minutes to 20 minutes, and the pressure is 20Mpa to 50Mpa to ensure that the copper-based graphene laminate 80 is reliably hot-bonded into an integrated structure. After the hot pressing is completed, the movable mold 12 moves to the side away from the static mold 11 and resets, completing a hot pressing work cycle.

[0038] It is easy to understand that at the end position of the hot pressing stroke, a hot pressing gap for accommodating the copper-based graphene laminate 80 should be reserved between the movable mold 12 and the static mold 11. In one example, the hot pressing gap can be set to 80% to 99% of the total thickness of the copper-based graphene laminate 80. Further, the hot pressing gap can be set to 95% to 99% of the total thickness of the copper-based graphene laminate 80. By setting the hot pressing gap, the reliability of the copper-based graphene laminate 80 after hot pressing can be increased.

[0039] The following is an experimental verification of the conductivity and mechanical properties of the copper-based graphene after hot pressing. Please refer to Tables 1 to 5 for specific experimental data. Tables 1 to 4 are parameter lists of the test samples.

[0040] Table 1

[0041]

[0042] Table 2

[0043]

[0044] Table 3

[0045]

[0046]

[0047] Table 4

[0048]

[0049] The electrical conductivity and mechanical properties of the 20 samples in Tables 1 to 4 were tested, and the test results are shown in Table 5.

[0050] Table 5

[0051]

[0052]

[0053] From the analysis in Table 5, it can be seen that the conductivity of the copper-based graphene composite material after hot pressing is 109.4% to 119.8%, and the tensile strength R m The plastic elongation strength R is 205MPa~212MPa. p0.2 The actual compression force F is 9864N~11090N, and the Vickers hardness is HV 0.2 It is 54.3 to 55.5. It can be seen that the copper-based graphene composite material after hot pressing has high conductivity and excellent mechanical properties.

[0054] Please continue to refer to Figure 1 For a device that uses a mold to process copper-based graphene, the device is more suitable for processing sheet-like copper-based graphene laminates, and the outer dimensions of the sheet-like copper-based graphene laminates are related to the dimensions of the cavity 11a.

[0055] In the present application, in order to improve the processing efficiency of the sheet copper-graphene laminate, the device also includes a conveying mechanism 13, which can sequentially input multiple sheet copper-graphene laminates 80 into the processing area 100. Specifically, the box 10 includes a feed port 10a and a discharge port 10b, and the conveying mechanism 13 inputs the copper-graphene laminate 80 from the feed port 10a and outputs the hot-pressed material from the discharge port 10b. This solution can improve the hot pressing efficiency and effectively maintain an oxygen-free environment in the processing area 100.

[0056] In one example, the conveying mechanism 13 includes a conveying carrier 130 , which has a conveying stroke and is used to convey the copper-graphene laminate. The conveying carrier 130 can be set to a high temperature resistant material, which can be specifically selected according to the temperature in the processing area 100 .

[0057] The conveying carrier 130 includes a plurality of fixed positions for fixing the copper-based graphene laminate, and the fixed positions can be arranged in sequence along the conveying direction of the conveying carrier 130, and each copper-based graphene laminate 80 is fixed to each fixed position. During the conveying stroke of the conveying carrier 130, the copper-based graphene laminate 80 fixed in the fixed position is hot-pressed in the cavity 11a through the movable mold 12 to form an integrated structure.

[0058] There is no limit to the fixing method of the copper-based-graphene laminate 80 to the conveying carrier 130. In one example, the four corners of the stacked sheet copper-based-graphene laminate 80 can be fixed by a pressure claw to ensure that the multi-layer copper-based-graphene laminate 80 will not fall off during the hot pressing process. In another example, the conveying carrier 130 can also be set to include a recessed portion, and the copper-based-graphene laminate 80 is placed in the recessed portion. The copper-based-graphene laminate 80 is limited by the side wall of the recessed portion to ensure the uniformity after stacking. In this case, during hot pressing, the recessed portion and the copper-based-graphene laminate 80 need to be pressed into the cavity 11a by the passive mold 12 together.

[0059] In another example, the delivery carrier 130 may be provided with a hollow portion, and the copper-based graphene stack 80 may be fixed to the delivery carrier 130 at the hollow portion, so that during hot pressing, only the copper-based graphene stack 80 may be hot pressed, while the delivery carrier 130 will not be hot pressed.

[0060] Of course, there are other options available. For example, two parallel conveying carriers 130 can be set up, and the two conveying carriers 130 are conveyed together. The copper-based graphene stack 80 is fixed in the gap between the two conveying carriers 130, and the gap is hollow. In this way, the movable mold 12 can only be hot-pressed to the copper-based graphene stack 80.

[0061] There are many examples of ways to realize the conveying stroke of the conveying carrier 130. In this example, the device further includes an unwinding mechanism 132 and a rewinding mechanism 134. On the feeding side of the box 10, the conveying carrier 130 is unwound by the unwinding mechanism 132, and on the discharging side of the box 10, the conveying carrier 130 is rewound by the rewinding mechanism 134. This enables the conveying carrier 130 to be retracted on both sides of the box 10 through the unwinding mechanism 132 and the rewinding mechanism 134, which is conducive to improving the simplicity and compactness of the device and can ensure the smoothness of the conveying carrier 130 in the conveying stroke.

[0062] Specifically, the unwinding mechanism 132 and the rewinding mechanism 134 have a rotation stroke respectively, and the unwinding mechanism 132 rotates to release the conveying carrier 130, and the rewinding mechanism 134 rotates to rewind the conveying carrier 130. In the actual processing process, the unwinding mechanism 132 and the rewinding mechanism 134 jointly drive the conveying carrier 130 to generate a conveying stroke during the rotation stroke.

[0063] Please refer to Figure 2 The unwinding mechanism 132 includes a transmission assembly 1320 and an unwinding roller 1322 , wherein the transmission assembly 1320 includes a power source and a transmission part connected to the power source, and the transmission part drives the unwinding roller 1322 to rotate and release the conveying carrier 130 .

[0064] Similarly, the winding mechanism 134 includes a transmission assembly 1340 and a winding roller 1342 , wherein the transmission assembly includes a power source and a transmission part connected to the power source, and the transmission part drives the winding roller 1342 to rotate to wind up the conveying carrier 130 .

[0065] In this example, the transmission part in the unwinding mechanism 132 and the transmission part in the winding mechanism 134 are both chain transmission mechanisms, so that the unwinding roller 1322 and the winding roller 1342 can be driven by the sprocket to rotate. Of course, the specific implementation of the transmission part is not limited to this.

[0066] It should be noted that the conveying direction of the conveying carrier 130 is not limited and can be along Figure 1 It can be transported from left to right in the Figure 1 The copper-based graphene laminate is transported from right to left in the middle, and the roles of the unwinding roller 1322 and the winding roller 1342 can be interchanged in different transport directions. In addition, the copper-based graphene laminate can be pre-pressed together by cold rolling before hot pressing to avoid scattering and dislocation of the copper-based graphene laminate during transportation.

[0067] Please refer to Figure 1 and Figure 2 The device also includes guide drive wheels 14, which are arranged in groups. Each group of guide drive wheels 14 is relatively arranged on the upper and lower sides of the conveying carrier 130 and rotates in opposite directions to guide and drive the conveying carrier 130 to ensure the consistency and smoothness of the direction during the conveying process.

[0068] In this example, eight groups of guide drive wheels 14 are provided, of which two guide drive wheels 14 form one group and are arranged at intervals along the length direction of the conveying carrier 130. Among the eight groups of guide drive wheels 14, two groups are arranged at the feed port 10a, two groups are arranged at the discharge port 10b, two groups are arranged at the unwinding side of the unwinding mechanism 132, and two groups are arranged at the rewinding side of the rewinding mechanism 134.

[0069] Please continue to refer to Figure 1The device further includes a first packaging box 15, which is arranged on the feed side of the box 10 and is used to package the conveying mechanism 13 located on the feed side. The first packaging box 15 is connected to the box 10, and the joint portion surrounds the feed port 10a. The interior of the first packaging box 15 is set as an oxygen-free area. After such a setting, the first packaging box 15 can make the copper-graphene stack 80 in an oxygen-free environment before entering the processing area 100, thereby reducing the risk of external air entering the processing area 100.

[0070] In this example, the first packaging box 15 includes a first part 150 and a second part 152 which are separately arranged, wherein the first part 150 is used to package the conveying carrier 130 that has been unrolled by the unwinding mechanism 132, and the second part 152 is used to package the unwinding mechanism 132, and the first part 150 is connected to the second part 152. Of course, in other examples, the first packaging box 15 can also be set as an integrated structure.

[0071] For reference, the device further includes a second packaging box 16, which is arranged at the discharge side of the box 10, and is used to package the conveying mechanism 13 located at the discharge side. The second packaging box 16 is connected to the box 10, and the joint portion surrounds the discharge port 10b. The interior of the second packaging box 16 is set as an oxygen-free area. After such a setting, the second packaging box 16 can make the copper-based graphene laminate 80 still in an oxygen-free environment after being output from the processing area 100, thereby reducing the risk of oxidation of the copper-based graphene laminate 80 after hot pressing.

[0072] In this example, the second packaging box 16 includes a first part 160 and a second part 162 which are separately arranged, wherein the first part 160 is used to package the conveying carrier 130 output from the processing area 100, and the second part 160 is used to package the winding mechanism 134, and the first part 160 is connected to the second part 162. Of course, in other examples, the second packaging box 16 can also be set as an integrated structure.

[0073] Furthermore, sealing mechanisms may be provided at the feed port 10a and the discharge port 10b of the box body 10 to isolate the box body 10 from the first packaging box body 15 and the box body 10 from the second packaging box body 16. With this arrangement, any operation within the first packaging box body 15 and the second packaging box body 16 will not affect the oxygen-free state within the processing area 100, thereby preventing outside air from escaping into the processing area 100 from the feed port 10a and the discharge port 10b.

[0074] Specifically, the device may further include a first sealing mechanism 17, which is used to seal the feed port 10a. Since the first packaging box 15 is an oxygen-free area, the structure of the first sealing mechanism 17 can be simplified. In one example, the first sealing mechanism 17 may include a sealing baffle 170 and a connector 172. The sealing baffle 170 is mounted on the box 10 through the connector 172 and is movably arranged relative to the box 10. The sealing baffle 170 is configured to have a movable stroke for sealing the feed port 10a and releasing the seal of the feed port 10a. In this solution, the sealing baffle 170 can be moved to seal or release the seal of the feed port 10a.

[0075] The device may further include a second sealing mechanism 18, and the second sealing mechanism 18 is used to seal the discharge port 10b. The second sealing mechanism 18 may refer to the structural arrangement of the first sealing mechanism 17, and will not be described in detail here.

[0076] exist Figure 1 In the embodiment shown, the device includes a first sealing mechanism 17 disposed at the feed port 10a and a second sealing mechanism 18 disposed at the discharge port 10b, and a sealing mechanism 20 may be disposed between the first portion 150 and the second portion 152 of the first packaging box 15, and a sealing mechanism 30 may be disposed between the first portion 160 and the second portion 162 of the first packaging box 16, so that independent sealing areas are formed in each box. In this way, the heat loss in the processing area 100 can be reduced, and the sealing degree 1pa requirement in the continuous processing area 100 can be met.

[0077] The device also includes a plurality of vacuum pumping mechanisms 19 , which are respectively arranged in the box 10 , the first packaging box 15 and the second packaging box 16 . The vacuum pumping mechanisms 19 can form oxygen-free areas inside the box 10 , the first packaging box 15 and the second packaging box 16 .

[0078] The "oxygen-free" mentioned here does not mean oxygen-free in the strict sense, but the oxygen content is far below the normal level, and the oxidation caused to the copper substrate is negligible.

[0079] Furthermore, the device may also include a gas introduction mechanism, which is disposed in the box 10 and is used to introduce protective gas, such as helium, nitrogen, argon, and carbon dioxide, into the processing area 100 to further reduce the risk of oxidation of the copper-based graphene stack 80. The pressure of the protective gas introduction may be 20 MPa to 100 MPa.

[0080] In the device, a preheating mechanism may be provided in the first packaging box 15, and the preheating mechanism is used to preheat the copper-based graphene laminate 80. The preheating mechanism may preheat the copper-based graphene laminate 80 before hot pressing, so that the temperature of the copper-based graphene laminate 80 gradually rises from room temperature. The temperature after preheating may be about 50% to 80% of the temperature during hot pressing.

[0081] The preheating mechanism may include an electromagnetic induction heater, which generates current inside the copper-based graphene stack 80 by electromagnetic induction, and achieves the purpose of heating by relying on the energy of eddy current. The electromagnetic induction heater does not need to use air as a heat transfer medium, so the copper-based graphene stack 80 can be heated even in a vacuum environment. In the device, the electromagnetic induction heater can be arranged on the inner wall of the outer box, extending to the side close to the copper-based graphene stack 80.

[0082] In addition, a cooling mechanism may be provided in the second packaging box 16 to cool the material after hot pressing.

[0083] Please refer again Figure 1 As mentioned above, the heating mechanism is used to heat the copper-based graphene laminate 80. There are many ways to set the heating mechanism. In one example, the heating mechanism can be set on the inner wall of the box 10 to transfer heat to the copper-based graphene laminate 80 through thermal radiation. In another example, the heating mechanism can also be set in the static mold 11 or the dynamic mold 12 to heat the copper-based graphene laminate 80 through heat transfer when in contact with the copper-based graphene laminate.

[0084] In this example, the heating mechanism includes a power supply, and the static mold 11 and the dynamic mold 12 are both configured as conductive materials, such as graphite electrodes. One end of the power supply is connected to the static mold 11, and the other end is connected to the dynamic mold 12. When the dynamic mold 12 contacts the copper-based graphene laminate 80 in the cavity 11a, the electrical connection loop including the static mold 11, the dynamic mold 12 and the copper-based graphene laminate 80 is turned on. At this time, the copper-based graphene laminate 80 can be heated by the current flowing through itself.

[0085] During the hot pressing process, in order to effectively control the temperature of the processing area 100, the device also includes a temperature sensor 23 and a temperature controller (not shown in the figure). The temperature controller adjusts the heating power of the heating mechanism according to the temperature data obtained by the temperature sensor 23 to maintain a constant temperature during hot pressing.

[0086] In one example, the temperature sensor 23 can be disposed in the static mold 11 or in the dynamic mold 12, or the temperature sensor 23 can be disposed in the static mold 11 and the dynamic mold 12 respectively. A plurality of temperature sensors 23 can be disposed and arranged at intervals from each other to improve the accuracy of temperature sensing (refer to Figure 2 ).

[0087] On the other hand, in order to avoid heat loss and improve heating efficiency, the box body 10 also includes a heat-insulating layer 101. The heat-insulating layer 101 can play a heat-insulating effect, which is beneficial to maintaining a constant temperature in the processing area 100 and reducing heat loss.

[0088] Please refer to Figure 3 The movable mold 12 includes a pressing head portion 120 for hot pressing the copper-graphene laminate 80 and a connecting portion 122 connected to the pressing head portion 120, the connecting portion 122 is used to be connected to the press, and the pressing head portion 120 and the connecting portion 122 are detachably connected. In an optional example, the pressing head portion 120 and the connecting portion 122 can be connected by threads, and the threaded connection structure has high reliability, but is not limited thereto.

[0089] The above structure can select the material of the pressure head part 120 separately. For example, the material of the pressure head part 120 can be selected from high-performance materials such as die steel, alloy steel and graphite, and other parts can be made of ordinary steel materials to save material costs. On the other hand, when the pressure head part 120 is repaired and replaced, the connection part 122 does not need to be replaced, which can reduce the maintenance cost.

[0090] A heat insulating member may be provided at the connection between the ram portion 120 and the connection portion 122. On the one hand, the heat insulating member can greatly reduce the heat transfer from the ram portion 120 to the connection portion 122, thereby reducing heat loss; on the other hand, the heat insulating member can also improve the working condition of the press.

[0091] The following describes the process of processing a sheet-like copper-based-graphene composite material using the device provided by the present application.

[0092] The rolled conveying carrier 130 fixed with the copper-based graphene stack 80 is installed on the unwinding roller 1322, and the starting end of the conveying carrier 130 passes through the processing area 100 and is fixed on the winding roller 1342. After being fixed, the first packaging box 15, the box 10 and the second packaging box 16 are evacuated and then introduced with protective gas;

[0093] The unwinding mechanism 132 and the rewinding mechanism 134 are operated so that the conveying carrier 130 delivers the copper-based graphene laminate 80 into the processing area 100. When the conveying carrier 130 conveys the copper-based graphene laminate 80 to the top of the cavity 11a, it is paused, and the movable mold 12 presses down the copper-based graphene laminate 80. At this time, the electrical connection circuit connecting the power supply, the movable mold 12, the copper-based graphene laminate 80 and the static mold 11 is turned on, and the copper-based graphene laminate 80 is heated to 500°C to 900°C.

[0094] Under the hot pressing conditions of 20 MPa to 50 MPa and 500° C. to 900° C., the moving mold 12 is kept hot pressed on the copper-based graphene laminate 80 for 5 to 20 minutes to hot press the copper-based graphene laminate 80 into an integrated structure;

[0095] When the hot pressing time is up, the movable mold 12 is lifted, and the next copper-based graphene laminate 80 is continuously hot pressed, until all the copper-based graphene laminates 80 fixed on the conveying carrier 130 are hot pressed;

[0096] The second portion 162 of the second packaging box 16 is sealed by the sealing mechanism 30, the copper-based graphene composite material after heat pressing is removed from the winding roller 1342, and the winding roller 1342 is removed from the second portion 162;

[0097] The second part 152 of the first packaging box 15 is sealed by the sealing mechanism 20, the rolled conveying carrier 130 fixed with the copper-based graphene laminate 80 is installed on the unwinding roller 1322, and the second part 150 of the first packaging box 15 and the second part 162 of the second packaging box 16 are evacuated and then a protective gas is introduced;

[0098] The sealing of the sealing mechanism 20 and the sealing mechanism 30 is released, and the starting end of the conveying carrier 130 passes through the processing area 100 and is fixed to the winding roller 1342, preparing to start the next hot pressing work cycle.

[0099] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A device for processing copper-based graphene using a mold, characterized in that: include: A box body (10), wherein the inner cavity of the box body (10) is a processing area (100), and the processing area (100) is an oxygen-free area; A heating mechanism is arranged in the processing area (100) and is used to heat the copper-based graphene laminate to 500° C. to 900° C.; and The static mold (11) and the dynamic mold (12) are both arranged in the processing area (100); the static mold (11) is fixedly arranged in the processing area (100); the static mold (11) comprises a cavity (11a); the copper-based graphene laminate (80) is placed in the cavity (11a); the dynamic mold (12) has a hot pressing stroke for approaching the static mold (11) and hot pressing the copper-based graphene laminate in the cavity (11a); The heating mechanism comprises a power supply, the static mold (11) and the dynamic mold (12) are both made of conductive materials, one end of the power supply is connected to the static mold (11), and the other end is connected to the dynamic mold (12), the dynamic mold (12) and the static mold (11) are connected through the copper-based graphene laminate, and the current flowing through the copper-based graphene laminate is used to heat the copper-based graphene laminate. The movable mold (12) comprises a pressing head portion (120) for hot pressing on the copper-based graphene laminate and a connecting portion (122) connected to the pressing head portion (120), wherein the connecting portion (122) is used to be connected to a press machine, and the pressing head portion (120) and the connecting portion (122) are detachably connected. The device also includes a gas introduction mechanism, which is used to introduce a protective gas into the processing area to prevent the copper substrate in the copper-graphene stack from being oxidized.

2. The device for processing copper-based graphene using a mold according to claim 1, characterized in that: The box body (10) comprises a feed port (10a) and a discharge port (10b), and the device further comprises a conveying mechanism (13) for inputting the copper-based graphene laminate into the processing area (100), and the conveying mechanism (13) is used to input the copper-based graphene laminate from the feed port (10a) and to output the hot-pressed material from the discharge port (10b).

3. The device for processing copper-based graphene using a mold according to claim 2, characterized in that: The conveying mechanism (13) comprises a conveying carrier (130), the conveying carrier (130) has a conveying stroke and comprises a plurality of fixed positions for fixing the copper-based graphene laminate, the copper-based graphene laminate is fixed at the fixed positions, and during the conveying stroke, the copper-based graphene laminate fixed at the fixed positions is hot-pressed into the cavity (11a) by the movable mold (12).

4. The device for processing copper-based graphene using a mold according to claim 3, characterized in that: The conveying mechanism (13) further comprises an unwinding mechanism (132) and a rewinding mechanism (134), wherein the unwinding mechanism (132) and the rewinding mechanism (134) respectively have a rotation stroke, and the unwinding mechanism (132) and the rewinding mechanism (134) jointly drive the conveying carrier (130) to generate the conveying stroke during the rotation stroke.

5. The device for processing copper-based graphene using a mold according to claim 3, characterized in that: The device further comprises guide drive wheels (14), which are arranged in groups. Each group of guide drive wheels (14) is arranged opposite to each other on the upper and lower sides of the conveying carrier (130) and rotates in opposite directions, so as to guide and drive the conveying carrier (130).

6. The device for processing copper-based graphene using a mold according to claim 2, characterized in that: The device further comprises a first packaging box (15), the first packaging box (15) being arranged on the feed side of the box (10) and being used to package the conveying mechanism (13) located on the feed side, the first packaging box (15) being connected to the box (10), the joint portion surrounding the feed port (10a), the interior of the first packaging box (15) being set as an oxygen-free area, and / or The device further comprises a second packaging box (16), which is arranged on the discharge side of the box (10) and is used to package the conveying mechanism (13) located on the discharge side. The second packaging box (16) is connected to the box (10), and the joint portion surrounds the discharge port (10b). The interior of the second packaging box (16) is set as an oxygen-free area.

7. The device for processing copper-based graphene using a mold according to claim 6, characterized in that: The device further comprises a first sealing mechanism (17), the first sealing mechanism (17) sealing the feed port (10a), and / or the device further comprises a second sealing mechanism (18), the second sealing mechanism (18) sealing the discharge port (10b).

8. The device for processing copper-based graphene using a mold according to claim 7, characterized in that: At least one of the first sealing mechanism (17) and the second sealing mechanism (18) comprises a sealing baffle (170) and a connecting piece (172); the sealing baffle (170) is movably arranged on the box body (10) via the connecting piece (172); and the sealing baffle (170) has a movable stroke for sealing the feed port (10a) and releasing the seal of the feed port (10a).

9. The device for processing copper-based graphene using a mold according to claim 3, characterized in that: The transport carrier (130) comprises a hollow portion, and the copper-based graphene stack is fixed to the hollow portion.

10. The device for processing copper-based graphene using a mold according to claim 1, characterized in that: The movable mold (12) further comprises a heat insulating member, and the heat insulating member is arranged between the pressing head portion (120) and the connecting portion (122).

11. The device for processing copper-based graphene using a mold according to any one of claims 1 to 9, characterized in that: The device also includes a temperature sensor (23) and a temperature controller, wherein the temperature controller controls the heating power of the heating mechanism according to temperature data obtained by the temperature sensor (23), and the temperature sensor (23) is arranged in the static mold (11) and / or the dynamic mold (12).

12. The device for processing copper-based graphene using a mold according to any one of claims 1 to 9, characterized in that: At the end position of the hot pressing stroke, a hot pressing gap is reserved between the static mold (11) and the dynamic mold (12), and the hot pressing gap is 80% to 99% of the total thickness of the copper-based graphene laminate.

Images