Positioning device, loading and / or unloading system and method for operating a positioning device

Abstract

The present invention relates to a positioning device, in particular a wafer transport container positioning device, for positioning a wafer transport container (10a-d) at a loading and / or unloading position of a loading and / or unloading station (14a-d) at least provided for loading and unloading wafers (12a-d) from the wafer transport container (10a-d). It is proposed that the positioning device, in particular the wafer transport container positioning device, has a positioning mechanism (16a-d), which is provided for contactless positioning of the wafer transport container (10a-d) during the connection process between the wafer transport container (10a-d) and the loading and / or unloading station (14a-d).

Description

Technical Field

[0001] The invention relates to a positioning device, in particular a wafer transport container positioning device, according to the preamble of claim 1, a loading and / or unloading system according to claim 19, and a method for operating a positioning device according to the preamble of claim 20. Background Art

[0002] A positioning device has been proposed for positioning a wafer transport container at a loading and / or unloading position of at least a loading and / or unloading station provided for loading and / or unloading wafers from the wafer transport container. Summary of the invention

[0003] In particular, the object of the invention is to provide a device of the generic type having advantageous properties with regard to positioning a wafer transport container at a loading and / or unloading station for wafers from the wafer transport container. This object is achieved according to the invention by the features of claims 1, 19 and 20, while advantageous embodiments and improvements of the invention can be derived from the dependent claims.

[0004] The present invention relates to a positioning device, in particular a wafer transport container positioning device, for positioning a wafer transport container at a loading and / or unloading position of at least a loading and / or unloading station provided for loading and / or unloading wafers from the wafer transport container.

[0005] It is proposed that the positioning device, in particular the wafer transport container positioning device, has a positioning mechanism, which is arranged for contactless positioning of the wafer transport container during the connection process of the wafer transport container with the loading and / or unloading station. As a result, advantageous characteristics can be achieved in relation to positioning the wafer transport container on the loading and / or unloading station for wafers from the wafer transport container. In particular, the generation of particles during the connection process can be advantageously reduced and / or avoided by means of the positioning mechanism, in particular in the following manner, that is, external friction between solids, in particular between the wafer transport container and the loading and / or unloading station, which leads to the generation of particles, can be avoided. Particle avoidance is particularly advantageous under clean room conditions, because even the smallest particles can damage the wafer, under which conditions, in particular, wafer manufacturing and / or wafer processing are usually carried out in wafer manufacturing equipment. In addition, particles can impair the normal function of the vacuum seal and in particular can lead to a reduction in the tightness of the vacuum seal, for example when particles are deposited between vacuum sealing elements. Therefore, by avoiding the generation of particles in the environment of the vacuum seal to reduce the number of particles accordingly, a high tightness of the vacuum seal can be advantageously achieved, in particular even in the case of frequent opening and / or closing of the vacuum seal. Furthermore, by avoiding surface contact by means of contactless positioning, material wear can be reduced, whereby a long service life can be advantageously achieved, in particular with a high positioning accuracy that lasts during the service life. The contact guide elements of a contact positioning mechanism can wear, for example, over time, whereby the play during positioning can increase. Such effects can be advantageously avoided by means of contactless positioning. Furthermore, particularly uniform and / or vibration-free positioning can be advantageously achieved by means of contactless positioning mechanisms, in particular in contrast to contact positioning, where sudden accelerations can occur, for example due to static friction and / or unevenness of at least one of the contacting surfaces, which can lead to slippage of the wafers stored in the wafer transport container. Damage to the wafers due to slippage can thus advantageously be avoided.

[0006] The “positioning device”, in particular the “wafer transport container positioning device” is in particular designed to influence and preferably guide and / or control, in particular during the coupling process, an at least two-dimensional, preferably three-dimensional movement of the wafer transport container such that the wafer transport container assumes a predetermined spatial orientation when approaching the loading and / or unloading position and / or when settling at the loading and / or unloading position. In particular, the positioning device, in particular the wafer transport container positioning device, can be designed to perform at least one pre-positioning of the wafer transport container when the wafer transport container approaches the loading and / or unloading station such that the orientation of the wafer transport container deviates as little as possible from an ideal orientation relative to the loading and / or unloading position and / or from an ideal positioning of the wafer transport container at the loading and / or unloading position. "Deviations as small as possible" should be understood in particular as a rotation of the wafer transport container relative to the ideal loading and / or unloading position of at most 2°, preferably at most 1°, advantageously at most 0.6°, more preferably at most 0.3° and particularly preferably at most 0.1°, and / or a staggered displacement of the wafer transport container relative to the ideal loading and / or unloading position of at most 3 mm, preferably at most 2 mm, advantageously at most 1 mm, particularly advantageously at most 0.6 mm, more preferably at most 0.3 mm and particularly preferably at most 0.1 mm in any direction. "Positioning" should be understood in particular as rotational and / or translational positioning relative to the ideal loading and / or unloading position. In the ideal orientation and / or ideal positioning, the predetermined contact areas of the wafer transport container and the loading and / or unloading station completely overlap for connection. Preferably, positioning is configured as pre-positioning, which is particularly performed after rough positioning, wherein, for example, rough positioning is achieved by means of conveying through the wafer transport container transport system of the wafer manufacturing device. In addition, positioning, in particular pre-positioning, is performed before final positioning. The final positioning can be achieved, for example, by means of positioning pins and / or guide pins, wherein the positioning pins and / or guide pins are preferably arranged to provide a form fit between the wafer transport container and the loading and / or unloading at the loading and / or unloading position. In particular, the wafer transport container is in an ideal loading and / or unloading position following the final positioning. "Setting" is to be understood in particular as specifically programming, laying out and / or designing. Setting an object for a certain function is to be understood in particular as: the object satisfies and / or implements the certain function in at least one application state and / or operating state.

[0007] A "wafer transport container" is to be understood in particular as a transport container having a closable interior space, wherein the interior space is configured to accommodate wafers. In particular, the wafer transport container is at least configured to transport wafers having a diameter of at least 200 mm, preferably at least 300 mm and more preferably at least 450 mm. In particular, the wafer transport container is at least configured to transport at least one wafer, preferably at least three wafers, advantageously at least five wafers, particularly advantageously at least ten wafers, more preferably at least 25 wafers and particularly preferably at most one hundred wafers. Alternatively or additionally, the wafer transport container is configured to accommodate at least one object having a different configuration from the wafer, such as an exposure mask. In particular, the wafer transport container is configured to be portable. In particular, the wafer transport container is configured to be closable in a vacuum-tight manner. Preferably, the wafer transport container is configured as a vacuum wafer transport container, which is particularly configured to provide and / or maintain a vacuum atmosphere in its interior. In particular, the wafer transport container is configured to store wafers in a vacuum atmosphere. "Vacuum atmosphere" is to be understood in particular as a pressure below 300 hPa, preferably below 1 hPa, more preferably below 10 -3 hPa and particularly preferably below 10 -6 In particular, the wafer transport container has a high leak tightness in a vacuum atmosphere, wherein in particular the leakage rate of the wafer transport container is less than 10 -4 mbar*l / s, preferably less than 10 -5 mbar*l / s, advantageously less than 10 -6 mbar*l / s, particularly advantageously less than 10 -7 mbar*l / s, more preferably less than 10 -8 mbar*l / s and particularly preferably less than 10 -9 mbar*l / s. Alternatively, the wafer transport container can be configured to store and / or hold the wafers in a standard atmosphere and / or a special combination of atmospheres, such as a nitrogen atmosphere. The wafer transport container has in particular an outer shell, which at least partially consists of a material, in particular a diamagnetic, paramagnetic or ferromagnetic material, which is preferably repelled and / or attracted by an external magnetic field.

[0008] The "loading and / or unloading position" is to be understood in particular as a position of a wafer transport container relative to a loading and / or unloading station, which is arranged to reload at least one wafer from a wafer transport container into a loading and / or unloading station and / or to reload at least one wafer from a loading and / or unloading station into a wafer transport container. In the loading and / or unloading position, the wafer transport container, in particular the interior of the wafer transport container, which is preferably vacuum-tight, can be connected to the loading and / or unloading station, in particular the interior of the loading and / or unloading station. In particular, in the loading and / or unloading position, the wafer transport container opening element can be detached from the body of the wafer transport container and can be lowered, in particular at least partially, into the interior of the loading and / or unloading station. In particular, the wafer transport container in the loading and / or unloading position can be firmly fixed to the surface of the loading and / or unloading station, for example by means of vacuum clamping by a vacuum clamping device. In particular, the wafer transport container and the loading and / or unloading station are arranged to form a common microenvironment, in particular in a coupled state, in which the wafer transport container is fixed to the surface of the loading and / or unloading station at the loading and / or unloading position. A "microenvironment" is to be understood in particular as an enclosure having an atmosphere, for example a vacuum, which is isolated from the ambient atmosphere. In this context, a "connection process" is to be understood in particular as a process of approaching and / or removing a wafer transport container to a loading and / or unloading station for subsequently fixing the wafer transport container to a loading and / or unloading position on the loading and / or unloading station. A "wafer" is to be understood in particular as a substrate for an electronic component. Furthermore, the loading and / or unloading station is in particular configured to guide the wafer from the wafer transport container onwards to a wafer processing module, and / or to guide the processed wafer from the wafer processing module to the wafer transport container for, for example, onward transport to another wafer processing module, which is in particular configured to perform at least one processing and / or manufacturing step on the wafer.

[0009] The "positioning mechanism" is particularly configured to generate, control and / or regulate forces and / or accelerations, which are used for orientation and / or position setting of the wafer transport container. The positioning mechanism should be understood as "non-contact positioning" of the wafer transport container, in particular, that the force transmission between the wafer transport container and the positioning force of the positioning mechanism acting on the loading and / or unloading station is at least partially contactless, wherein in particular the wafer transport container and the loading and / or unloading station do not have any mutual contact points. In particular, the non-contact positioning does not rely on ropes and / or cables, or on the forces and / or accelerators generated by the ropes and / or cables, on the positioning of the wafer transport container transport system, which is particularly configured for the logistics of the wafer transport container in the wafer manufacturing equipment, and / or on the guide elements and / or shape-fitting elements of the wafer transport container and / or the loading and / or unloading station, such as guide pins. The non-contact positioning can be performed, for example, by means of magnetic forces, electrostatic forces and / or pulse forces of a flowing fluid, in particular a gas.

[0010] In particular, positioning is performed by the positioning mechanism in a plane at least approximately perpendicular to the coupling direction. The "coupling direction" is particularly constituted as a main movement direction, along which the wafer transport container moves during the coupling process. In particular, the coupling direction extends at least approximately perpendicular to the main extension plane of the wafer transport container opening element. Preferably, the coupling direction is constituted at least approximately parallel to the direction of gravity. The "main extension plane" of the structural unit should be understood in particular as a plane parallel to the largest side surface of the smallest imaginary cuboid, which just completely surrounds the structural unit and extends in particular through the center of the cuboid. Here, "approximately parallel" should be understood in particular as an orientation in particular in a plane relative to a reference direction, wherein the direction relative to the reference direction has a deviation of in particular less than 8°, advantageously less than 5° and particularly advantageously less than 2°. Here, the term "approximately perpendicular" should in particular define an orientation in particular relative to a reference direction, wherein the direction and the reference direction, in particular when viewed in a plane, enclose an angle of 90°, and the angle has a maximum deviation of in particular less than 8°, advantageously less than 5° and particularly advantageously less than 2°. Alternatively or additionally, positioning can be carried out by means of a positioning mechanism in a direction extending parallel to the coupling direction.

[0011] It is further proposed that the positioning mechanism is provided for positioning the wafer transport container in the vicinity of the loading and / or unloading position. Thus, it is advantageously possible to achieve accurate positioning, in particular pre-positioning, of the wafer transport container in the loading and / or unloading position. In addition, by positioning the wafer transport container in the vicinity of the loading and / or unloading station, it is advantageously possible to prevent the already set positioning, in particular pre-positioning, from being adjusted again when subsequently approaching the loading and / or unloading position further. Thus, it is advantageously possible to achieve high positioning effectiveness. In particular, a rapid rough positioning is performed outside the vicinity before positioning. "Proximity positioning" should be understood in particular as positioning the wafer transport container in the vicinity of the loading and / or unloading position of the loading and / or unloading station. In particular, the positioning mechanism is arranged in the vicinity of the loading and / or unloading station. In particular, the positioning mechanism is arranged to generate a force, which preferably acts in the vicinity of the loading and / or unloading station and / or its maximum effect is exerted in the vicinity of the loading and / or unloading station. A "proximity region" of an object is to be understood in particular as a region of spatial points, wherein each spatial point is at most 1 m, preferably at most 20 cm, advantageously at most 10 cm, particularly advantageously at most 5 cm, more preferably at most 2 cm and particularly preferably at most 0.5 cm away from the object, in particular a contact surface of the loading and / or unloading station, which is preferably arranged to contact the wafer transport container in a contacting manner in the loading and / or unloading position. In particular, the wafer transport container and the loading and / or unloading station are not in contact with each other in the proximity region. In particular, the proximity region is designed to be different from the contact region, in which the wafer transport container and the loading and / or unloading station are in contact with each other.

[0012] It is further proposed that the positioning mechanism is arranged to position the wafer transport container in such a way that the deviation from the ideal loading and / or unloading position, in particular in a plane perpendicular to the coupling direction, is at most 3 mm, preferably at most 2.5 mm, advantageously at most 2 mm, more preferably at most 1.5 mm and particularly preferably at most 1 mm. As a result, a particularly precise positioning of the wafer transport container at the loading and / or unloading position can be advantageously achieved. In particular, a very precise coordination of the pre-positioning by the positioning mechanism on the final positioning mechanism, which includes, for example, positioning pins, can be achieved thereby, whereby the particle generation, in particular caused by the friction caused by the final positioning mechanism, can be advantageously kept low. As a result, advantageous properties can be provided in particular with regard to the clean room suitability and / or vacuum adaptability of the positioning mechanism. In particular, the positioning mechanism is arranged to generate a force, the force of which and / or its force gradient, in particular by means of a control and / or regulating unit of the positioning device, can be set in the millimeter range. A "control and / or regulating unit" should be understood in particular as an electronic unit, which is preferably arranged to at least control and / or regulate the positioning mechanism, in particular at least one positioning element of the positioning mechanism. Preferably, the control unit comprises a computing unit and, in particular, in addition to the computing unit, a memory unit having a control and / or regulation program stored therein, which is arranged to be executed by the computing unit. The "ideal loading and / or unloading position" is particularly constituted as a position of the wafer transport container, at which the contact area of ​​the wafer transport container, in particular the contact area of ​​the wafer transport container opening element, and the contact area of ​​the opening element of the loading and / or unloading station overlap in such an ideal manner that the maximum airtightness of the connection between the wafer transport container and the loading and / or unloading station is achieved. In particular, the entire overlapping area formed by the contact area of ​​the wafer transport container opening element and by the contact area of ​​the opening element of the loading and / or unloading station, in particular as viewed in the connection direction, is minimized in the case of an ideal overlap. The "deviation from the ideal final position" should be understood in particular as a deviation, in particular in space and / or rotation, of the positioning set by the positioning mechanism from the final positioning set by the final positioning mechanism connected to the positioning mechanism.

[0013] It is further proposed that the positioning device has a control and / or regulating unit, which is arranged to control and / or regulate the positioning of the wafer transport container by means of a positioning mechanism, in particular at least in a plane parallel to the loading and / or unloading position. As a result, a high-precision positioning that can be achieved by means of a positioning device can be advantageously achieved. In addition, the positioning can be advantageously flexibly adapted to the initial positioning or rough positioning. In addition, the positioning can advantageously be flexibly adapted to different, in particular differently shaped wafer transport containers. In particular, the control and / or regulating unit is at least arranged to control the magnetic field of the positioning mechanism. In particular, the control and / or regulating unit is at least arranged to control the electrostatic field of the positioning mechanism. In particular, the control and / or regulating unit is at least arranged to control the flow field of the flowing fluid of the positioning mechanism. In particular, the control and / or regulating unit is at least arranged to control and / or regulate the intensity, orientation, position and / or position of the magnetic field, electrostatic field and / or flow field.

[0014] It is further proposed that the positioning mechanism comprises at least one positioning element, which is arranged to generate at least one, in particular contactless transferable positioning force field. Thus, advantageous characteristics can be achieved with respect to positioning the wafer transport container on a loading and / or unloading station for wafers from the wafer transport container. In particular, the generation of particles during the connection process can be advantageously reduced and / or avoided by means of the positioning mechanism, in particular in the following manner, that is, external friction between solids, in particular between the wafer transport container and the loading and / or unloading station, which leads to the generation of particles, can be avoided. The positioning element is particularly arranged to generate a magnetic field, an electric field, in particular an electrostatic field and / or a flow field. The positioning element particularly comprises at least one magnetic coil, at least one chargeable, preferably electrically insulated conductor surface and / or at least one nozzle for a fluid. The positioning element is particularly at least partially formed integrally with the loading and / or unloading station, in particular the opening element of the loading and / or unloading station, and / or integrally with the wafer transport container. The positioning force field is particularly formed as a magnetic field, an electric field, an electrostatic field and / or a fluid flow field, in particular a gas flow field. It is conceivable that a plurality of similar and / or different positioning force fields of a single positioning element and / or a plurality of positioning elements overlap. In particular, it is conceivable that at least one positioning force field of a positioning element is configured to be controllable and / or adjustable. In addition, it is conceivable that at least one positioning force field of a positioning element is statically configured. "Integrally" should be particularly understood to be connected at least in material matching, for example, by a welding process, a bonding process, a splashing process and / or other processes considered reasonable by those skilled in the art, and / or advantageously formed in one piece, for example, by being produced by casting and / or by being produced in the manner of a single component or multi-component injection method and advantageously from a separate blank.

[0015] It is further proposed that the positioning mechanism comprises at least one additional positioning element, preferably at least two additional, more preferably at least three additional and particularly preferably more than three additional positioning elements, which are arranged to generate at least one additional positioning force field, preferably at least two additional, more preferably at least three additional and particularly preferably more than three additional, especially contactless transferable positioning force fields. Particularly precise positioning can be advantageously achieved thereby. In particular, particularly high-precision positioning control and / or regulation can be achieved thereby. Advantageously, different and / or similar force fields can be overlapped thereby, in particular for improving control accuracy. In particular, the additional positioning elements can be configured as positioning elements corresponding to the positioning elements. For example, it is conceivable that the positioning elements arranged at the loading and / or unloading station generate a controllable and / or adjustable magnetic field by means of a magnetic coil, which is arranged to interact with the static magnetic field of the corresponding positioning element configured as a permanent magnet, which is arranged on the wafer transport container.

[0016] If the positioning mechanism, in particular the positioning element, is arranged to generate at least one repulsive force for positioning, which acts in particular repulsively on the wafer transport container, the risk of unintentional particle-generating contact of the object to be positioned by the positioning mechanism with the positioning element and / or another object, for example due to excessive control of the attractive force, can advantageously be avoided, whereby the number of particles generated by the positioning mechanism can advantageously be kept low. A "repulsive force" is to be understood in particular as a force which is arranged to deflect and / or press the wafer transport container in a direction away from the alignment of the positioning element generating the repulsive force.

[0017] It is further proposed that at least one positioning element is at least configured to generate at least one positioning force field in the form of a magnetic field. This advantageously enables an effective contactless force transmission, thereby in particular reducing and / or avoiding particle generation. Furthermore, in particular, the magnetic field and / or the combination of magnetic fields is simple and / or precisely controllable and / or adjustable, and in particular variable in a particularly small space.

[0018] If at least one, in particular the respective positioning element, is at least partially designed as a permanent magnet, a positioning force field can advantageously be generated without current. The positioning element designed as a permanent magnet advantageously intensifies the reaction to changes in the positioning force field caused by the controllable positioning element, which overlaps with the positioning force field of the positioning element designed as a permanent magnet, thereby advantageously keeping the power required for driving the positioning low. The positioning element designed as a permanent magnet is arranged in particular on a wafer transport container.

[0019] A simple construction of the positioning mechanism can advantageously be achieved when at least one positioning element is at least partially integrally formed with the wafer transport container. In particular, the positioning element integrally formed with the wafer transport container is formed as a permanent magnet and / or a diamagnetic element, a paramagnetic element and / or a ferromagnetic element. The positioning element is particularly at least partially composed of a diamagnetic material, a paramagnetic material and / or a ferromagnetic material. In particular, the positioning element integrally formed with the wafer transport container is integrally formed with the wafer transport container opening element and / or the body of the wafer transport container. Preferably, the wafer transport container comprises a plurality of positioning elements, preferably at least a portion of which is at least partially integrally formed with the wafer transport container. It is further conceivable that the outer shell of the wafer transport container constitutes in particular a corresponding positioning element.

[0020] It is further proposed that at least one positioning element is captively connected to the loading and / or unloading station. As a result, positioning relative to the loading and / or unloading station, in particular to the surface of the loading and / or unloading station, can be advantageously achieved. The term "captively connected" is to be understood in particular as meaning that the positioning element and the loading and / or unloading station are connected to one another in each predefined operating state. Advantageously, the positioning element and the loading and / or unloading station are separable from one another only with the aid of a tool, only by destruction and / or only in the event of a loss of function. Preferably, the positioning element is captively connected to an immovable component of the loading and / or unloading station. Alternatively, the positioning element can also be captively connected to a movably supported component of the loading and / or unloading station, for example an opening element of the loading and / or unloading station.

[0021] When the positioning element is movably supported relative to the loading and / or unloading station, a particularly large variability of the positioning force field can advantageously be achieved, thereby making it possible in particular to achieve a particularly precise positioning of the wafer transport container. In particular, it is conceivable that the positioning element is at least partially arranged to follow the vertical movement of the wafer transport container in the direction of the loading and / or unloading position or in the direction of the surface of the opening element of the loading and / or unloading unit, for example during coupling and / or decoupling. The term "movably supported" is to be understood in particular as being at least translationally supported, at least pivotably supported and / or at least rotatably supported. Preferably, the positioning element is movably supported at least relative to the surface of the loading and / or unloading station and / or the opening element of the loading and / or unloading station. In particular, the positioning element is pivotably supported about at least one, preferably at least two axes, wherein preferably at least one axis is aligned vertically or horizontally relative to the surface of the loading and / or unloading station. In particular, the positioning element is supported so as to be translationally movable in at least one, preferably at least two, more preferably at least three and particularly preferably at least four spatial directions, wherein the spatial directions include: at least one, preferably at least two directions extending parallel to the surface of the loading and / or unloading station, at least one direction extending perpendicularly to the surface of the loading and / or unloading station and / or at least one direction extending in the circumferential direction of the cylinder liner of the cylinder toward an imaginary surface perpendicularly facing away from the loading and / or unloading station.

[0022] It is also proposed that at least one, in particular another, positioning element is arranged to generate at least one positioning force field configured as an electric field, in particular an electrostatic field. Thus, effective contactless force transmission can be advantageously achieved, thereby in particular particle generation can be reduced and / or avoided.

[0023] Furthermore, it is proposed that at least one, in particular additional, further positioning element is arranged to generate at least one positioning force field formed as a flow field of the flowing gas. Thus, effective contactless force transmission can be advantageously achieved, thereby in particular particle generation can be reduced and / or avoided.

[0024] It is further proposed that the positioning device has at least one nozzle for generating an at least partially directed air flow, wherein the air flow, in particular the average total air flow of the flow field generated by the nozzle, is oriented at least approximately parallel to the connection direction of the positioning device. As a result, the guidance of the wafer transport container in the connection direction can be advantageously achieved. In particular, the nozzle is arranged in the surface of the loading and / or unloading station. In particular, the nozzle is arranged in a circular shape around the opening element of the loading and / or unloading station in the circumferential direction. Preferably, the nozzle is arranged to generate an air curtain in a circular shape around the opening element of the loading and / or unloading station. By such an orientation of the air flow perpendicular to the surface of the loading and / or unloading station, particles can be advantageously kept away from the surface of the loading and / or unloading station. The nozzle is particularly arranged for a suction function. Alternatively, the nozzle can also be arranged for a blowing function.

[0025] When at least one of the positioning elements, in particular another air flow, in particular the average total air flow of the flow field, is oriented at least approximately perpendicular to the connection direction of the positioning device, it is advantageously possible to achieve contactless positioning of the wafer transport container in a plane parallel to the surface of the loading and / or unloading station. In particular, the positioning element has at least one nozzle, which is particularly arranged to provide an outlet and / or inlet for a flowing gas, in particular flowing air. The nozzle is particularly configured to be movable. In particular, the direction of the air flow ejected from the nozzle can be set by means of a control and / or regulating unit. The nozzle of the positioning element is particularly arranged for a blowing function. In the blowing function, the air flow squeezes the wafer transport container, in particular in the direction away from the positioning element, in particular the nozzle. Alternatively, the nozzle can also be arranged for a suction function. In the suction function, the air flow particularly pulls the wafer transport container in the direction toward the positioning element, in particular the nozzle.

[0026] It is further proposed that the positioning device has a checking unit for a position check, in particular a three-dimensional position check, in particular a real-time position check, and / or for a preferably controlled position adjustment of the actual position of the wafer transport container during the connection process. As a result, in particular by actively controlling and / or adjusting the positioning, a high-precision positioning can be advantageously achieved. In addition, in particular by being able to check the positioning of the wafer transport container, in particular before opening the wafer transport container, the operating safety can be advantageously increased. In particular, the checking unit is configured to detect the current position of the wafer transport container and, if necessary, to control at least one positioning element for position correction, in particular by means of a change in the positioning force field of the positioning element and / or by means of a change in the spatial position and / or spatial orientation of the positioning element. "Three-dimensional position check" should be understood in particular as at least one position check of the spatial position of the wafer transport container in a plane parallel to the surface of the loading and / or unloading station and / or a position check of the rotational position of the wafer transport container. A "real-time position check" is to be understood in particular as at least one position check, by means of which the spatial and / or rotational actual position of the wafer transport container detected by the checking unit is directly read out by the control and / or regulating unit, followed by the determination of the spatial and / or rotational nominal position of the wafer transport container by the control and / or regulating unit, and followed by the output of at least one control and / or regulating command, in particular for position correction of the actual position of the wafer transport container, by the control and / or regulating unit to at least one positioning element. A "position adjustment" is to be understood in particular as a process in which the actual position of the wafer transport container detected by the checking unit is brought close to a predetermined nominal position of the wafer transport container by controlling and / or regulating at least one positioning force field. In particular, the nominal position of the wafer transport container, in particular in the coupled state of the wafer transport container with the loading and / or unloading station, constitutes an ideal loading and / or unloading position and / or a position in which the wafer transport container and the loading and / or unloading station overlap ideally, in particular in the coupling direction.

[0027] It is further proposed that the inspection unit has at least one sensor unit, wherein the sensor unit is at least partially integrally formed with the positioning mechanism, in particular the positioning element. Thus, in particular by being able to advantageously assign multiple tasks to a single component, the complexity can be advantageously reduced. The "partially integral" formation of the two units should be understood in particular as meaning that these units have at least one, in particular at least two, advantageously at least three common elements, which are components of the two units, in particular functionally important components. The sensor unit has in particular at least one sensor element. The sensor element is in particular at least configured to sense parameters of the positioning device, the wafer transport container and / or the loading and / or unloading station. The parameters of the positioning device may in particular include: the rotational position and / or movement of the wafer transport container, the spatial position and / or movement of the wafer transport container and / or the distance and / or distance change between the wafer transport container and the sensor element. Preferably, the sensor element is at least configured to sense the spatial position and / or movement of the wafer transport container relative to the surface of the loading and / or unloading station. In particular, the sensor element is configured as at least one magnetic coil, which is preferably configured to generate a positioning force field configured as a magnetic field. In particular, the sensor element is arranged to sense a parameter of the locating device based on a measurement of a reverse current induced by a magnetic field, in particular by an overlapping locating force field, in particular in the conductor of the magnetic coil, preferably while generating the locating force field. Alternatively or additionally, the sensor unit can have at least one sensor element, which is designed separately from the locating mechanism, in particular the locating element. In particular, the sensor unit can include at least one sensor element designed as an optical sensor, for example a camera and / or a light barrier.

[0028] When the positioning device has a final positioning mechanism, wherein the positioning mechanism is at least partially configured separately from the final positioning mechanism, advantageous properties can be achieved with respect to positioning the wafer transport container at a loading and / or unloading station for wafers from the wafer transport container. In particular, the particle generation during the connection process can be advantageously reduced by means of the positioning mechanism, in particular in the following way, that is, external friction between solids, in particular between the wafer transport container and the loading and / or unloading station, which leads to particle generation, can be avoided by means of the positioning mechanism during positioning, in particular during pre-positioning, and preferably can be limited to the final positioning mechanism. In particular, the friction during the final positioning can be advantageously minimized by precise positioning in the preparatory phase of the final positioning. The final positioning mechanism in particular comprises a guide unit, which is in particular configured to determine the final positioning of the wafer transport container at the desired loading and / or unloading position by guiding a guide element of the guide unit in a guide rail of the guide unit. Preferably, the guide unit comprises a plurality of guide elements and guide rails. In particular, the guide elements and / or guide rails are arranged on a surface of the wafer transport container opening element, in particular on the outer side of the wafer transport container, on a surface of the loading and / or unloading station and / or an opening element of the loading and / or unloading station, in particular on the outer side of the loading and / or unloading station. In addition, the positioning device has a rough positioning mechanism, which is at least partially separate from the positioning mechanism and / or the final positioning mechanism. In particular, the rough positioning mechanism includes positioning by means of a wafer transport container transport system of a wafer manufacturing device, which wafer manufacturing device holds the wafer transport container, in particular by means of ropes and / or cables, and roughly positions it relative to the loading and / or unloading station.

[0029] Furthermore, a loading and / or unloading system for loading and / or unloading wafers from a wafer transport container is proposed, which has a wafer transport container, a loading and / or unloading station and a positioning device, in particular a wafer transport container positioning device. By means of the loading and / or unloading system according to the invention, advantageous properties can be achieved with respect to positioning of a wafer transport container at a loading and / or unloading station for wafers from a wafer transport container. In particular, particle generation when positioning a wafer transport container at a loading and / or unloading station can be advantageously reduced.

[0030] Furthermore, a method for operating a positioning device, in particular a wafer transport container positioning device and / or a loading and / or unloading system is proposed, wherein during the coupling process between the wafer transport container and the loading and / or unloading station, the wafer transport container is positioned contactlessly relative to the loading and / or unloading station, thereby advantageously being able to keep particle generation during positioning low.

[0031] It is further proposed that the wafer transport container is positioned, in particular by means of a positioning device, following external rough positioning, thereby advantageously achieving a high degree of positioning effectiveness.

[0032] The positioning device according to the invention, in particular the wafer transport container positioning device, the loading and / or unloading system according to the invention and / or the method according to the invention are not to be restricted to the above-described applications and embodiments. In particular, the positioning device according to the invention, in particular the wafer transport container positioning device, the loading and / or unloading system according to the invention and / or the method according to the invention may have a number of individual elements, components, units and method steps different from the number mentioned in this article for realizing the functional mode described in this article. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Further advantages can be derived from the following description of the drawings. Four embodiments of the invention are shown in the drawings. The drawings, the description and the claims contain many combined features. A person skilled in the art can also appropriately consider these features individually and combine them into meaningful other combinations. In the drawings:

[0034] Figure 1 A schematic diagram of a loading and / or unloading system is shown, the loading and / or unloading system having a wafer transport container, a loading and / or unloading station, and a positioning device;

[0035] Figure 2 A flow chart showing a method for operating a positioning device;

[0036] Figure 3 A schematic diagram showing an alternative loading and / or unloading system having an alternative positioning device;

[0037] Figure 4 A schematic diagram showing an alternative positioning element of an alternative positioning device;

[0038] Figure 5 a schematic diagram showing a further alternative positioning element of a further alternative positioning device; and

[0039] Figure 6 A schematic top view of an additional alternative loading and / or unloading station is shown, which has an additional alternative positioning element of an additional further alternative positioning device. DETAILED DESCRIPTION

[0040] Figure 1A loading and / or unloading system 38a is shown. The loading and / or unloading system 38a includes a wafer transport container 10a. The wafer transport container 10a is configured to transport and / or support a wafer 12a. The loading and / or unloading system 38a is configured to load and / or unload wafers 12a from the wafer transport container 10a. The wafer transport container 10a has a wafer transport container opening element 62a. The wafer transport container 10a has a body 64a. The wafer transport container opening element 62a is configured to close an opening of the body 64a of the wafer transport container 10a. The wafer transport container opening element 62a is configured to be detachable from the body 64a of the wafer transport container 10a.

[0041] The loading and / or unloading system 38a has a loading and / or unloading station 14a. The loading and / or unloading station 14a is provided for loading and / or unloading wafers 12a from a wafer transport container 10a. In order to load and / or unload the wafers 12a, the loading and / or unloading station 14a opens the wafer transport container 10a by releasing the wafer transport container opening element 62a from the body 64a of the wafer transport container 10a. The loading and / or unloading station 14a moves the wafer transport container opening element 62a in a loading and / or unloading direction 66a to open the wafer transport container 10a. The loading and / or unloading direction 66a extends at least approximately perpendicular to the main extension plane of the wafer transport container opening element 62a. When opening, the wafer transport container opening element 62a is lowered into the interior space of the loading and / or unloading station 14a by means of the loading and / or unloading station 14a. When loading and / or unloading the wafer transport container 10a, the interior space of the body 64a of the wafer transport container 10a is connected to the interior space of the loading and / or unloading station 14a in a vacuum-tight manner. The loading and / or unloading station 14a is configured to further transport the wafers 12a unloaded from the wafer transport container 10a to at least one wafer processing module (not shown).

[0042] The loading and / or unloading station 14a has a surface 40a, which is configured for contact placement of the wafer transport container 10a. The loading and / or unloading station 14a has a loading and / or unloading position. The loading and / or unloading position is configured so that the wafer transport container 10a is lowered onto the loading and / or unloading station 14a, and the wafer transport container 10a can be loaded and / or unloaded when a vacuum-tight connection is formed between the interior space of the loading and / or unloading station 14a and the interior space of the wafer transport container 10a. The loading and / or unloading position is arranged on the surface 40a of the loading and / or unloading station 14a. Figure 1 In the illustrated illustration, the loading and / or unloading system 38a is in an uncoupled state. The wafer transport container 10a is not in contact with the loading and / or unloading station 14a. The wafer transport container 10a is located in the vicinity of the loading and / or unloading station 14a.

[0043] The loading and / or unloading system 38a has a wafer transport container transport system 50a. The wafer transport container transport system 50a is configured to transport the wafer transport container 10a between different loading and / or unloading systems 38a and / or other devices of the wafer manufacturing facility. The wafer transport container transport system 50a is configured as an overhead hoist transport (OHT) system with clean room capabilities. Alternatively, the wafer transport container transport system 50a can also be configured as another type of transport system for the wafer transport container 10a. For example, a self-propelled drone system can be configured to transport the wafer transport container 10a toward or away from the loading and / or unloading station 14a. The wafer transport container transport system 50a has a track system 56a. The track system 56a includes at least one track that is configured to predetermine a transport path.

[0044] The wafer transport container transport system 50a has a transport trolley 54a. The transport trolley 54a is configured to move or be moved along the track of the track system 56a. The transport trolley 54a has a body 70a. The transport trolley 54a has a holder 58a. The holder 58a is configured to receive the wafer transport container 10a. The holder 58a is configured to hold the wafer transport container 10a during transportation by means of the transport trolley, during rough positioning, during positioning, during pre-positioning and / or during final positioning. The holder 58a is configured to releasably hold the wafer transport container 10a. The transport trolley 54a has a plurality of holding elements 52a. The holding elements 52a are configured to be elongated. The holding elements 52a are configured to be flexible. The holding elements 52a are configured to be cables and / or ropes. The holding elements 52a constitute a connection between the holder 58a and the body 70a of the transport trolley 54. The distance between the main body 70a of the transport trolley 54a and the holder 58a is variable. In order to change the distance between the main body 70a of the transport trolley 54a and the holder 58a, the holding element 52a can be rolled up. The transport trolley 54a constitutes a rough positioning mechanism 60a for the wafer transport container 10a. The rough positioning mechanism 60a is provided for roughly positioning the wafer transport container 10a relative to the loading and / or unloading station 14a.

[0045] The transport trolley 54a has a control unit 68a. The control unit 68a of the transport trolley 54a is configured to control and / or adjust the holder 58a, the holding element 52a, in particular the length of the holding element 52a. The control unit 68a of the transport trolley 54a is configured to control and / or adjust the coarse positioning mechanism 60a. The control unit 68a of the transport trolley 54a is configured to control and / or adjust the movement of the transport trolley 54a along the rail system 56a. The control unit 68a of the transport trolley 54a has a communication module 74a. The communication module 74a of the control unit 68a of the transport trolley 54a is configured to receive control and / or adjustment commands for controlling and / or adjusting the transport trolley 54a, the holder 58a and / or the holding element 52a. The communication module 74a of the control unit 68a of the transport trolley 54a is provided for sending control and / or regulating commands of the control unit 68a of the transport trolley 54a to further control units, for example further transport trolleys and / or the loading and / or unloading station 14a.

[0046] The loading and / or unloading system 38a has a positioning device. The positioning device constitutes a wafer transport container positioning device. The positioning device is configured to position the wafer transport container 10a at a loading and / or unloading position. The positioning device is configured to pre-position the wafer transport container 10a at a loading and / or unloading position. The loading and / or unloading system 38a has a positioning mechanism 16a. The positioning mechanism 16a is configured to contactlessly position the wafer transport container 10a during the connection process between the wafer transport container 10a and the loading and / or unloading station 14a. The positioning mechanism 16a is configured to generate a repulsive force and / or an attractive force for positioning. The positioning mechanism 16a is configured separately from the rough positioning mechanism 60a. The positioning mechanism 16a is independent of the wafer transport container transport system 50a, in particular, independent of the movement of the wafer transport container transport system 50a. The positioning mechanism 16a is independent of the holding element 52a.

[0047] The positioning mechanism 16a is provided for positioning the wafer transport container 10a at a loading and / or unloading position in a short distance. The positioning mechanism 16a is provided for positioning the wafer transport container in a horizontal plane. The horizontal plane is perpendicular to the coupling direction 30a. The positioning mechanism 16a is provided for positioning the wafer transport container 10a in such a way that the deviation from the ideal loading and / or unloading position is at most 3 mm. The positioning device has a control and / or regulating unit 18a. The control and / or regulating unit 18a is provided for controlling and / or regulating the positioning of the wafer transport container 10a by means of the positioning mechanism 16a. The control and / or regulating unit 18a is associated with the loading and / or unloading station 14a. The control and / or regulating unit 18a of the positioning mechanism 16a has a communication module 72a. The communication module 72a of the control and / or regulating unit 18a of the positioning mechanism 16a is provided for receiving control and / or regulating instructions for controlling the positioning process of the wafer transport container 10a. The communication module 72a of the control and / or regulating unit 18a of the positioning mechanism 16a is provided for sending control and / or regulating commands of the control and / or regulating unit 18a of the positioning mechanism 16a to a further control unit, for example of the transport trolley 54a.

[0048] The positioning device has a final positioning mechanism 36a. The final positioning mechanism 36a is configured separately from the positioning mechanism 16a. The final positioning mechanism 36a is configured as a contact type. The loading and / or unloading system 38a has a guide unit 42a. The guide unit 42a is the main functional component of the final positioning mechanism 36a. The guide unit 42a has a guide element 44a. The guide element 44a is configured as a bolt-shaped projection. The guide element 44a is configured as a pin. The guide element 44a is configured to taper toward its end. The guide element 44a is arranged on the surface 40a of the loading and / or unloading station 14a. The guide unit 42a has a guide rail 46a. The guide rail 46a is configured as a recessed portion. The guide rail 46a is arranged on the outer surface of the wafer transport container opening element 62a. The guide element 44a is arranged to engage in the guide rail 46a during the final positioning. The guide rail 46a has a shape complementary to the guide element 44a. The final positioning mechanism 36a orients the wafer transport container 10a relative to the loading and / or unloading station 14a by means of the guide unit 42a by sliding the surface of the guide element 44a along the surface of the guide rail 46a.

[0049] Positioning mechanism 16a comprises positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a. Positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a are arranged to produce positioning force fields respectively. Positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a are arranged to produce positioning force fields that are constituted as magnetic fields. Alternatively or additionally, positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a can be arranged to produce positioning force fields that are constituted as electric fields, especially electrostatic fields. Three positioning elements 20a, 22a, 24a are arranged at loading and / or unloading station 14a. The three positioning elements 20a, 22a, 24a arranged at loading and / or unloading station 14a are connected to loading and / or unloading station 14a inseparably. The three positioning elements 20a, 22a, 24a arranged at the loading and / or unloading station 14a are actively controllable and / or adjustable. The three positioning elements 20a, 22a, 24a arranged at the loading and / or unloading station 14a are effectively connected with the control and / or adjustment unit 18a. The control and / or adjustment unit 18a is configured to control and / or adjust the positioning force field of the positioning elements 20a, 22a, 24a that can be actively controlled and / or adjusted. The control and / or adjustment unit 18a is configured to control and / or adjust the intensity and / or direction of the positioning force field. Each positioning element 20a, 22a, 24a is individually controllable. The positioning force field of the positioning elements 20a, 22a, 24a is individually controllable and / or adjustable respectively. The control of the positioning elements 20a, 22a, 24a can be coordinated with the control of the wafer transport container transport system 50a by the communication module 72a of the control and / or adjustment unit 18a.

[0050] Three other positioning elements 20'a, 22'a, 24'a are configured as corresponding positioning elements 20'a, 22'a, 24'a. Other positioning elements 20'a, 22'a, 24'a are configured as passive positioning elements 20'a, 22'a, 24'a. Other positioning elements 20'a, 22'a, 24'a are configured as permanent magnets 26a. Alternatively or additionally, other positioning elements 20'a, 22'a, 24'a are composed of ferromagnetic materials. Other positioning elements 20'a, 22'a, 24'a have static positioning force fields. The static positioning force fields of other positioning elements 20'a, 22'a, 24'a are configured to interact with the positioning force fields that can be actively adjusted and / or controlled by positioning elements 20a, 22a, 24a. Other positioning elements 20'a, 22'a, 24'a are arranged on the wafer transport container 10a. The further positioning elements 20'a, 22'a, 24'a are arranged on the wafer transport container opening element 62a. The further positioning elements 20'a, 22'a, 24'a are integrally formed with the wafer transport container 10a. The further positioning elements 20'a, 22'a, 24'a are integrally formed with the wafer transport container opening element 62a. The positioning force field of the further positioning elements 20'a, 22'a, 24'a is independent of the power supply. Alternatively or additionally, it is conceivable that the active positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a are associated with the wafer transport container 10a and / or the passive positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a are associated with the loading and / or unloading station 14a.

[0051] The positioning device has a checking unit 32a. The checking unit 32a is provided for position control and / or position regulation of the actual position of the wafer transport container 10a during the coupling process. The checking unit 32a has a sensor unit 34a. The sensor unit 34a is integrally formed with the positioning mechanism 16a. The sensor unit 34a has a sensor element 48a. The sensor element 48a is integrally formed with the positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a. Alternatively or additionally, the sensor unit 34a may have a sensor element 48a that is separately formed from the positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a. The sensor unit 34a transmits the sensor data of the sensor element 48a to the control and / or regulation unit 18a. The control and / or regulating unit 18a is configured to perform a control and / or regulation of the positioning force fields of the positioning elements 20a, 20'a, 22a, 22'a, 24a, 24'a as a function of the data of the sensor unit 34a. The control and / or regulating unit 18a is configured to perform a calibration of the actual position of the wafer transport container 10a with respect to the nominal position of the wafer transport container 10a and / or to perform a controlled and / or regulated positioning of the wafer transport container 10a at a loading and / or unloading position as a function of the position data of the sensor unit 34a.

[0052] Figure 2A flow chart of a method for operating a positioning device and / or a loading and / or unloading system 38a is shown. In at least one method step 76a, a wafer transport container 10a is transported by means of a wafer transport container transport system 50a to a branch of a rail system 56a, which branch belongs to a loading and / or unloading station 14a. In at least one further method step 78a, a rough positioning of the wafer transport container 10a relative to a surface 40a of the loading and / or unloading station 14a is performed by means of a rough positioning mechanism 60a. Here, the wafer transport container 10a, which is connected to the transport trolley 54a via a holder 58a, is lowered vertically suspended along a coupling direction 30a onto the holding element 52a until it has approached the vicinity of the loading and / or unloading station 14a. In at least one further method step 80a, the wafer transport container 10a is positioned, in particular pre-positioned, following the external rough positioning. Here, during the connection process between the wafer transport container 10a and the loading and / or unloading station 14a, the wafer transport container 10a is positioned, in particular pre-positioned, by the positioning mechanism 16a without contacting relative to the loading and / or unloading station 14a. In at least one further method step 82a, the wafer transport container 10a is finally positioned by means of the final positioning mechanism 36a after positioning, in particular pre-positioning. Here, the guide rails 46a of the pre-positioned wafer transport container 10a engage with the guide elements 44a of the loading and / or unloading station 14a. If there are still small deviations from the ideal loading and / or unloading position after positioning by the positioning mechanism 16a, these small deviations are compensated by the mutual engagement of parts of the guide unit 42a. In at least one further method step 84a, the wafer transport container 10a is opened and the wafers 12a transported therein are reloaded into the wafer processing module by the loading and / or unloading station 14a. In at least one further method step 86a, the wafers 12a are loaded into the wafer transport container 10a by the loading and / or unloading station 14a. The opened wafer transport container 10a docked to the loading and / or unloading station 14a is closed again in method step 86a. In at least one further method step 88a, the closed wafer transport container 10a is lifted by the wafer transport container transport system 50a and removed from the loading and / or unloading station 14a. In at least one further method step 90a, the wafer transport container 10a is moved away from the branch of the rail system 56a belonging to the loading and / or unloading station 14a by means of the wafer transport container transport system 50a.

[0053] exist Figures 3 to 6 The following description and drawings are limited to the differences between the embodiments, wherein, with respect to components with the same names, in particular with respect to components with the same reference numerals, reference can in principle also be made to other embodiments, in particular Figure 1 and Figure 2In order to distinguish the embodiments, the letter a is placed after Figure 1 and Figure 2 In the embodiment of the figure mark. Figures 3 to 6 In the embodiment of the present invention, the letter a is replaced by letters b to d.

[0054] Figure 3 A schematic diagram of a loading and / or unloading system 38b is shown, which has a wafer transport container 10b, a loading and / or unloading station 14b and a positioning device. Figure 3 In the illustrated illustration, the loading and / or unloading system 38b is in a non-connected state. The wafer transport container 10b is not in contact with the loading and / or unloading station 14b. The wafer transport container 10b is located in the vicinity of the loading and / or unloading station 14b. The positioning device has a positioning mechanism 16b. The positioning mechanism 16b includes positioning elements 20b, 22b, 24b, 92b. The positioning elements 20b, 22b, 24b, 92b are configured to generate a positioning force field, respectively. The positioning elements 20b, 22b, 24b, 92b are configured to generate a positioning force field configured as a magnetic field. The positioning force field is configured to interact with the wafer transport container 10b. The wafer transport container 10b has a shell 96b. The shell 96b is at least partially composed of a material that is repelled and / or attracted by an external magnetic field. The positioning force field is configured to interact with the material of the shell 96b of the wafer transport container 10b. Alternatively or additionally, the positioning elements 20b, 22b, 24b, 92b are provided to generate a positioning force field which is designed as an electric field, in particular an electrostatic field.

[0055] The positioning device has a fastening unit 94b. The fastening unit 94b is provided for supporting the positioning element 20b, 22b, 24b, 92b relative to the loading and / or unloading station 14b. The fastening unit comprises two double rails, which connect the positioning element 20b, 22b, 24b, 92b to the loading and / or unloading station 14b in a non-detachable manner. The positioning element 20b, 22b, 24b, 92b is supported movably, in particular slidably and pivotably relative to the surface 40b of the loading and / or unloading station 14b. The positioning element 20b, 22b, 24b, 92b is arranged to at least partially follow the movement of the wafer transport container 10b during the movement of the wafer transport container 10b along the coupling direction 30b. As a result, a good stability of the position set by the positioning force field during the coupling process between the wafer transport container 10b and the loading and / or unloading station 14b can be advantageously achieved. Figure 3 The positioning device shown has four positioning elements 20b, 22b, 24b, 92b, which are each mounted in two pairs on a double rail.

[0056] Alternatively, the positioning device can have: one of four different numbers of positioning elements 20b, 22b, 24b, 92b, one of two different numbers of positioning elements 20b, 22b, 24b, 92b per double track and / or one of two different numbers of double tracks. In addition, the positioning elements 20b, 22b, 24b, 92b can be mounted movably and / or pivotably relative to the surface 40b of the loading and / or unloading station 14b in different ways, for example by means of a three-dimensionally pivotable and translationally slidable rotating, tilting and / or pivoting table and / or by means of a slidably mounted ball joint (see also Figure 4 ).

[0057] exist Figure 4 Schematic diagram of a positioning element 20b, 22b, 24b, 92b that can be pivoted and translated in many directions is shown in FIG. The positioning element 20b, 22b, 24b, 92b shown can be translated in the x, y and z directions along three translation axes 98b, for example. The positioning element 20b, 22b, 24b, 92b shown can be pivoted around four pivot axes 100b, for example, which are oriented horizontally, vertically and at an angle of ±45° to the horizontal plane. Alternatively, other pivot and / or translation axes can be envisaged. Advantageously, the greater the number of possible, especially controllable pivot and / or translation positions of the positioning element 20b, 22b, 24b, 92b, the more the accuracy of the contactless positioning can be improved.

[0058] exist Figure 5Schematic diagrams of other alternative positioning elements 20c, 22c, 24c, 92c of other alternative positioning devices are shown in FIG. Positioning elements 20c, 22c, 24c, 92c are arranged to generate a positioning force field that is constituted as a flow field of flowing gas. Positioning elements 20c, 22c, 24c, 92c have a nozzle 28c. Nozzle 28c is arranged to generate a partially directional airflow. Active positioning of the partially directional airflow occurs from nozzle 28c. The airflow of nozzle 28c of positioning elements 20c, 22c, 24c, 92c is oriented approximately perpendicular to the connection direction 30c of the positioning device. When the partially directional airflow is discharged from nozzle 28c, nozzle 28c is in a blowing operation. In the blowing operation, nozzle 28c is arranged to push an object, in particular a wafer transport container 10c, away from positioning elements 20c, 22c, 24c, 92c. Alternatively or additionally, nozzle 28c can be arranged for a suction operation. In the suction operation, the airflow is directed generally toward the nozzle 28c. The positioning elements 20c, 22c, 24c, 92c have five individual nozzles 28c. The nozzles 28c can be connected to a common pump system to generate the airflow and / or have an individual pump system for at least two of the nozzles 28c. Alternatively, the positioning elements 20c, 22c, 24c, 92c can have one of the nozzles 28c having a number different from five.

[0059] exist Figure 6 A schematic diagram of a top view of a further alternative loading and / or unloading station 14d of a loading and / or unloading system 38d is shown in FIG. The loading and / or unloading system 38d has a positioning device. The positioning device has a positioning mechanism 16d. The positioning mechanism 16d has a nozzle 28d. The nozzle 28d is configured to generate a partially directed air flow. The air flow is oriented approximately parallel to the coupling direction 30d of the positioning device. Figure 6, the connection direction 30d is perpendicular to the drawing. The nozzle 28d is configured in a ring shape. The nozzle 28d is configured in a closed ring shape. Alternatively, the nozzle 28d may have a closed shape different from the ring shape or may be a partially interrupted shape configured in a ring shape and / or different from the ring shape. The nozzle 28d is arranged in a ring shape around an area of ​​the loading and / or unloading station 14d, which is configured to receive a wafer transport container 10d. The nozzle 28d is arranged in a ring shape around an area of ​​the loading and / or unloading station 14d, which is configured to be lowered to the inside of the loading and / or unloading station 14d to open the wafer transport container 10d. The nozzle 28d is arranged in a ring shape around an opening element 102d of the loading and / or unloading station 14d. The nozzle 28d is configured to form an air curtain around the opening element 102d of the loading and / or unloading station 14d in active operation. The nozzle 28d is configured to form an air curtain around an area of ​​the loading and / or unloading station 14d in active operation, which is configured to receive a wafer transport container 10d. The nozzles 28d are arranged to form an air curtain in active operation around the area of ​​the loading and / or unloading station 14d which is lowered into the interior of the loading and / or unloading station 14d to open the wafer transport container 10d.

[0060] Description of reference numerals:

[0061] 10 Wafer Shipping Container

[0062] 12 chips

[0063] 14 Loading and / or unloading stations

[0064] 16 Positioning mechanism

[0065] 18 Control and / or regulation unit

[0066] 20 Positioning elements

[0067] 22 Positioning elements

[0068] 24 Positioning elements

[0069] 26 permanent magnet

[0070] 28 Nozzle

[0071] 30 Connection direction

[0072] 32 Inspection Unit

[0073] 34 Sensor units

[0074] 36 Final positioning mechanism

[0075] 38 Loading and / or unloading systems

[0076] 40 Surface

[0077] 42 Guide unit

[0078] 44 Guide element

[0079] 46 Rails

[0080] 48 sensor element

[0081] 50 Wafer Shipping Container Transport System

[0082] 52 Holding element

[0083] 54 Transport pulley

[0084] 56 Track System

[0085] 58 Retainer

[0086] 60 Rough positioning mechanism

[0087] 62 Wafer Shipping Container Opening Components

[0088] 64 Main Body

[0089] 66 Loading and / or unloading direction

[0090] 68 Control Unit

[0091] 70 Main Body

[0092] 72 Communication Module

[0093] 74 Communication Module

[0094] 76 Methods and Steps

[0095] 78 Methods and Steps

[0096] 80 Methods and Steps

[0097] 82 Methods and Steps

[0098] 84 Methods and Steps

[0099] 86 Methods and Steps

[0100] 88 Methods and Steps

[0101] 90 Methods and Steps

[0102] 92 Positioning elements

[0103] 94 Fastening unit

[0104] 96 Shell

[0105] 98 Translation axis

[0106] 100 Pivot axis

[0107] 102 Open component

Claims

1. A loading and / or unloading system (38a-d) for loading and / or unloading wafers (12a-d) from a wafer transport container (10a-d), comprising: a positioning device for positioning the wafer transport container (10a-d) at a loading and / or unloading position of a loading and / or unloading station (14a-d) by contactlessly controlling at least a two-dimensional movement of the wafer transport container (10a-d), so that the wafer transport container (10a-d) when approaching the loading and / or unloading position adopts a spatial orientation in a plane at least substantially perpendicular to a main movement direction, the wafer transport container (10a-d) moving along the main movement direction during the coupling process, wherein the wafer transport container (10a-d) can be connected to the loading and / or unloading station (14a-d) in a vacuum-tight manner, The positioning device comprises: The loading and / or unloading station (14a-d), the loading and / or unloading station (14a-d) is arranged at least for loading and / or unloading wafers from the wafer transport container (10a-d), The wafer transport container (10a-d), A final positioning mechanism (36a-d) configured as a contact type, comprising a guide rail (46a-d) of a guide unit (42a-d), wherein at least one guide protrusion is slidably engaged in the guide rail (46a-d), A pre-positioning mechanism (16a-d) suitable for clean rooms, which is arranged to perform contactless pre-positioning of a wafer transport container (10a-d) during the connection process between the wafer transport container (10a-d) and a loading and / or unloading station (14a-d), wherein the contactless pre-positioning mechanism (16a-d) suitable for clean rooms is independent of any wafer transport container (10a-d) transportation system, which is arranged for the logistics of the wafer transport container (10a-d), and a control unit (68a-d) comprising a processor and a memory having a control and / or regulation program stored therein, the control and / or regulation program being arranged to be executed by the processor, wherein the control unit (68a-d) is arranged to control and / or regulate the pre-positioning mechanism for contactless pre-positioning of the wafer transport container (10a-d) during coupling of the wafer transport container (10a-d) to the loading and / or unloading station (14a-d), The contactless pre-positioning mechanism (16a-d) suitable for clean rooms is constructed separately from the final positioning mechanism (36a-d). The contactless pre-positioning mechanism (16a-d) suitable for clean rooms comprises: at least one positioning element (20a-d, 20'ad, 22a-d, 22'ad, 24a-d, 24'ad, 92b-d) which is designed as a permanent magnet (26a-d), which is arranged in the wafer transport container (10a-d) and is configured to generate at least one positioning force field, and at least one further positioning element (20a-d, 20'ad, 22a-d, 22'ad, 24a-d, 24'ad, 92b-d), comprising at least one magnetic coil, which is arranged to generate at least one contactlessly transferable positioning force field and is arranged to generate a controllable and / or adjustable magnetic field by means of the magnetic coil for interacting with the static magnetic field of the at least one positioning element (20a-d, 20'ad, 22a-d, 22'ad, 24a-d, 24'ad, 92b-d), wherein a contactless pre-positioning mechanism suitable for clean rooms is arranged in the vicinity of the loading and / or unloading station (14a-d) and is configured to position the wafer transport container (10a-d) in the vicinity of the loading and / or unloading position, and The contactless pre-positioning mechanism suitable for clean rooms is arranged to generate a force which acts in the vicinity of the loading and / or unloading station (14a-d) and / or whose maximum effect is exerted in the vicinity of the loading and / or unloading station (14a-d).

2. A loading and / or unloading system according to claim 1, wherein the positioning mechanism (16a-d) is configured to pre-position the chip transport container in such a way that the deviation from the ideal loading and / or unloading position is at most 3 mm, wherein the ideal loading and / or unloading position is constituted such that, at this position of the chip transport container (10a-d), the contact area of ​​the chip transport container (10a-d) and the contact area of ​​the opening element (102a-d) of the loading and / or unloading station (14a-d) overlap in such a way that maximum airtightness of the connection between the chip transport container (10a-d) and the loading and / or unloading station (14a-d) is achieved.

3. The loading and / or unloading system according to claim 1, wherein the pre-positioning mechanism (16a-d) is arranged to generate at least one repulsive force for pre-positioning.

4. The positioning device according to claim 1, wherein: The at least one positioning element (20a-d, 20'ad, 22a-d, 22'ad, 24a-d, 24'ad, 92b-d) is realized at least partially integrally with the wafer transport container (10a-d).

5. The positioning device according to claim 1, wherein: The at least one further positioning element (20a-d, 20'ad, 22a-d, 22'ad, 24a-d, 24'ad, 92b-d) is non-detachably connected to the loading and / or unloading station (14a-d).

6. The positioning device according to claim 5, characterized in that: The at least one further positioning element (20a-d, 20'ad, 22a-d, 22'ad, 24a-d, 24'ad, 92b-d) is supported so as to be movably relative to the loading and / or unloading station (14a-d).

7. A method for operating a loading and / or unloading system for loading and / or unloading wafers from the wafer transport container (10a-d) according to claim 1, wherein: During the connection process, Used for contactlessly pre-positioning the wafer transport container (10a-d) relative to the loading and / or unloading station (14a-d) by contactlessly controlling at least two-dimensional movement of the wafer transport container (10a-d) so that the wafer transport container (10a-d) adopts a spatial orientation when approaching the loading and / or unloading position, wherein the contactless pre-positioning is independent of any wafer transport container (10a-d) transportation system, which is configured for the logistics of the wafer transport container (10a-d).

8. The method according to claim 7, wherein: The wafer transport container (10a-d) is positioned directly following external rough positioning.

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