Automatic assembly equipment for magnetic circuit components of magnetic cover vibration plate and bone conduction earphones

Abstract

The present application discloses an automatic assembly device for a magnetic circuit assembly of a magnetic cover vibration plate and a bone conduction earphone, wherein the magnetic cover vibration plate is used to arrange and transport the magnetic covers, a receiving cavity is provided on one side of the magnetic cover, and a screening mechanism is provided on the magnetic cover vibration plate, and the screening mechanism is used to screen the magnetic covers transported by the magnetic cover vibration plate to obtain magnetic covers with the receiving cavity facing the same direction. Through the above method, the present application can automatically screen out magnetic covers with the receiving cavity facing the same direction according to demand, saving labor costs and improving assembly efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of mechanical assembly, and in particular to an automatic assembly device for a magnetic circuit component of a magnetic cover vibration plate and a bone conduction earphone. Background Art

[0002] The magnetic circuit assembly of the bone conduction earphone includes a magnetic shield with a receiving cavity disposed on one side. When assembling the magnetic circuit assembly, the magnetic shield usually needs to be assembled in a certain direction.

[0003] In the prior art, during the assembly of the magnetic circuit assembly of the bone conduction earphone, the operator often manually assembles the magnetic shield in a certain direction, or uses a vibration plate to arrange and transfer the magnetic shield, and further manually adjusts the receiving cavity of the magnetic shield to be in the same direction for assembly.

[0004] Obviously, adopting the methods in the prior art will consume a lot of manpower and reduce assembly efficiency. Summary of the invention

[0005] The main technical problem solved by the present application is to provide an automatic assembly device for a magnetic shield vibration plate and a magnetic circuit component of a bone conduction earphone, which can automatically select magnetic shields with consistent accommodating cavity orientations according to demand, thereby saving labor costs and improving assembly efficiency.

[0006] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a magnetic cover vibration plate, the magnetic cover vibration plate is used to arrange and transport the magnetic covers, a receiving cavity is provided on one side of the magnetic cover, and a screening mechanism is provided on the magnetic cover vibration plate, and the screening mechanism is used to screen the magnetic covers transported by the magnetic cover vibration plate to obtain the magnetic covers with the receiving cavity facing in the same direction.

[0007] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide an automatic assembly device for the magnetic circuit component of a bone conduction earphone, the automatic assembly device comprising: a first carrier conveying device for conveying the carrier; an assembly station, including a magnetic cover assembly station, wherein the magnetic cover assembly station comprises the magnetic cover vibration plate and the magnetic cover picking and placing device as described above, the magnetic cover picking and placing device picks up the magnetic cover screened by the screening mechanism, and releases the magnetic cover onto the carrier.

[0008] The beneficial effect of the present application is that, different from the prior art, a screening mechanism is provided on the magnetic cover vibration plate of the present application, which can automatically screen out the magnetic covers with the same orientation of the accommodating cavities as required and arrange and transport them, thereby facilitating the further assembly of the magnetic covers without the need for the operator to manually adjust the orientation of the accommodating cavities of the magnetic covers during the assembly process, thereby saving labor costs and improving assembly efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0010] Figure 1 It is a schematic diagram of the structure of the magnetic circuit assembly of the bone conduction earphone of the present application;

[0011] Figure 2 It is a structural schematic diagram of an embodiment of an automatic assembly device for a magnetic circuit component of a bone conduction headset of the present application;

[0012] Figure 3 It is a structural schematic diagram of an embodiment of a carrier for carrying a magnetic circuit assembly of a bone conduction headset of the present application;

[0013] Figure 4 is an exploded view of the carrier carrying the magnetic circuit assembly in this application;

[0014] Figure 5 It is a partial structural schematic diagram of an embodiment of an automatic assembly device for a magnetic circuit component of a bone conduction headset of the present application;

[0015] Figure 6 This is a structural schematic diagram of an embodiment of a magnetic cover vibration plate of the present application;

[0016] Figure 7 It is a structural schematic diagram of an embodiment of an automatic assembly device for a magnetic circuit component of a bone conduction headset of the present application;

[0017] Figure 8 It is a structural schematic diagram of a gluing station in one embodiment of an automatic assembly device for a magnetic circuit assembly of a bone conduction headset of the present application;

[0018] Fig. 9 It is a structural schematic diagram of a glue application needle at a glue application station in one embodiment of an automatic assembly device for a magnetic circuit assembly of a bone conduction earphone of the present application;

[0019] Fig.10 It is a partial structural schematic diagram of an embodiment of an automatic assembly device for a magnetic circuit component of a bone conduction headset of the present application;

[0020] Fig.11 It is a partial structural schematic diagram of an embodiment of an automatic assembly device for a magnetic circuit component of a bone conduction headset of the present application;

[0021] Fig.12 It is a partial structural schematic diagram of an embodiment of an automatic assembly device for a magnetic circuit component of a bone conduction headset of the present application;

[0022] Fig.13 It is a structural schematic diagram of a magnetic circuit component taking and placing device in an embodiment of an automatic assembly device for a magnetic circuit component of a bone conduction headset in the present application;

[0023] Fig.14 It is a structural schematic diagram of a magnetic circuit component conveying device of an embodiment of an automatic assembly device for a magnetic circuit component of a bone conduction headset of the present application;

[0024] Fig.15 It is a partial structural schematic diagram of an automatic assembly device for a magnetic circuit component of a bone conduction headset of the present application in one embodiment;

[0025] Fig.16 It is a schematic framework diagram of the no-load detection mechanism in one embodiment of the automatic assembly equipment of the magnetic circuit component of the bone conduction earphone of the present application. DETAILED DESCRIPTION

[0026] Please also read Figures 1 to 3 , Figure 1 It is a schematic diagram of the structure of the magnetic circuit component of the bone conduction earphone of the present application. Figure 2 It is a structural schematic diagram of an embodiment of an automatic assembly device for a magnetic circuit component of a bone conduction headset of the present application, Figure 3 It is a structural schematic diagram of an embodiment of a carrier for carrying a magnetic circuit component of a bone conduction headset according to the present application.

[0027] Among them, the magnetic circuit assembly is a component of the bone conduction earphone to realize the electric-force transduction, and is an indispensable part of the whole process of the bone conduction earphone to complete the electric-force-sound transduction. In the present application, the magnetic circuit assembly of the bone conduction earphone includes a magnetic conductive plate 11, a magnetizing plate 12 and a magnetic conductive cover 13, and a receiving cavity 131 is provided on one side of the magnetic conductive cover 13. In the assembled magnetic circuit assembly, the magnetic conductive plate 11, the magnetizing plate 12 and the magnetic conductive cover 13 are stacked, and the magnetic conductive plate 11 and the magnetizing plate 12 are both received in the receiving cavity 131 of the magnetic conductive cover 13.

[0028] In this embodiment, the automatic assembly equipment of the magnetic circuit assembly of the bone conduction earphone includes: a first carrier conveying device 21 , an assembly station 22 and a gluing station 23 .

[0029] The first carrier conveying device 21 is used to convey the carrier 30 to allow the assembly station 22 to assemble the magnetic circuit assembly on the carrier 30. Specifically, the carrier 30 is used to carry the magnetic plate 11, the magnetizing plate 12, and the magnetic cover 13 during the automatic assembly of the magnetic circuit assembly to assist in the assembly using its own structure. Specifically, the first carrier conveying device 21 can be a conveyor belt extending in a straight direction to convey the carrier 30 in a straight direction, or a turntable extending in a curved direction to convey the carrier 30 according to actual needs.

[0030] The assembly station 22 is used to stack the magnetic conductive plate 11, the magnetizing plate 12 and the magnetic conductive cover 13 on the carrier 30 conveyed by the first carrier conveying device 21 in sequence, and to accommodate the stacked structure of the magnetic conductive plate 11 and the magnetizing plate 12 in the accommodating cavity 131, such as Figure 4 As shown. Specifically, the assembly station 22 can provide the magnetic conductive plate 11, the magnetizing plate 12 and the magnetic conductive cover 13 according to the demand, and assemble the magnetic conductive plate 11, the magnetizing plate 12 and the magnetic conductive cover 12 in sequence; or directly pick up the provided magnetic conductive plate 11, the magnetizing plate 12 and the magnetic conductive cover 13 and assemble them in a preset manner. In an application scenario, the assembly station 22 can first stack the magnetic conductive plate 11 and the magnetizing plate 12 in sequence on the carrier 30, and then, with the transmission of the first carrier conveying device 21, cover the magnetic conductive cover 13 on the periphery of the laminated structure of the magnetic conductive plate 11 and the magnetizing plate 12 through the accommodating cavity 131.

[0031] The gluing station 23 is used to apply glue on the components carried by the carrier 30 during the process of stacking the magnetic conductive plate 11, the magnetizing plate 12 and the magnetic conductive cover 13 at the assembly station 22, so as to bond the magnetic conductive plate 11, the magnetizing plate 12 and the magnetic conductive cover 13 together to form a magnetic circuit assembly. Among them, the gluing station 23 can automatically apply glue on the magnetic conductive plate 11 after the assembly station 22 places the magnetic conductive plate 11 on the carrier 30 conveyed by the first carrier conveying device 21, and then the assembly station 22 further stacks the magnetizing plate 12 on the magnetic conductive plate 11 after gluing, so that the magnetic conductive plate 11 and the magnetizing plate 12 are bonded together; the gluing station 23 can further apply glue on the magnetizing plate 12, and the assembly station 22 further places the magnetic conductive cover 13 on the magnetizing plate 12 after gluing at the gluing station 23, so that the magnetic conductive cover 13 and the magnetizing plate 12 are bonded together, thereby forming a complete magnetic circuit assembly.

[0032] In this embodiment, the automatic assembly device of the magnetic circuit assembly of the bone conduction earphone sequentially stacks the magnetic conductive plate 11, the magnetizing plate 12 and the magnetic conductive cover 13 on the carrier 30 during the process of the first carrier conveying device 21 conveying the carrier 30, so that the laminated structure of the magnetic conductive plate 11 and the magnetizing plate 12 is contained in the accommodating cavity 131. At the same time, the gluing station 23 applies glue on the components carried by the carrier 30 during the process of the assembly station 22 stacking the magnetic conductive plate 11, the magnetizing plate 12 and the magnetic conductive cover 13, so as to bond the magnetic conductive plate 11, the magnetizing plate 12 and the magnetic conductive cover 13 together to form a magnetic circuit assembly. In the above manner, the present application realizes the automatic assembly of the bone conduction earphone assembly under the joint cooperation of the first carrier conveying device 21, the assembly station 22 and the gluing station 23 without manual participation, thereby saving labor costs and greatly improving the assembly efficiency of the magnetic circuit assembly of the bone conduction earphone.

[0033] Please read further Figure 4 The carrier 30 used for carrying the magnetic circuit assembly of the bone conduction earphone in the present application can be transported by all carrier conveying devices in the automatic assembly equipment, such as the first carrier conveying device 21.

[0034] Among them, a groove 31 is provided at the upper end of the carrier 30, and the shape of the groove 31 matches the magnetic conductive plate 11 and the magnetizing plate 12, so as to allow the assembly station 22 to sequentially stack the magnetic conductive plate 11 and the magnetizing plate 12 into the groove 31 of the carrier 30 during the process of the first carrier conveying device 21 conveying the carrier 30. For example, in the present embodiment, the magnetic conductive plate 11 and the magnetizing plate 12 are both cylinders. At this time, the shape of the groove 31 at the upper end of the carrier 30 is a cylinder that can accommodate or partially accommodate the laminated structure of the magnetic conductive plate 11 and the magnetizing plate 12, and the diameter of the groove 31 is greater than the diameter of any one of the magnetic conductive plate 11 and the magnetizing plate 12.

[0035] In addition, the outer shape of the upper end of the carrier 30 matches the accommodating cavity 131 of the magnetic cover 13, so that during the assembly process, the assembly station 22 is allowed to further cover the magnetic cover 13 on the outer periphery of the upper end of the carrier 30. In the present application, the cross-sectional shape of the accommodating cavity 131 of the magnetic cover 13 is circular. At this time, the outer shape of the upper end of the carrier 30 can also be circular, and the diameter of the circle is smaller than the cross-sectional shape of the accommodating cavity 131 of the magnetic cover 13 to meet the assembly requirements.

[0036] In the above manner, the structure of the carrier 30 allows the assembly station 22 to stack the magnetic conductive plate 11 and the magnetizing plate 12 in the groove 31 in turn, and further cover the magnetic conductive cover 13 on the periphery of the upper end of the carrier 30 through the accommodating cavity 131, so as to cover the magnetic conductive cover 13 on the periphery of the laminated structure of the magnetic conductive plate 11 and the magnetizing plate 12, thereby forming a magnetic circuit assembly. That is to say, the structure of the carrier 30 in this embodiment can meet the requirements of assembling the magnetic circuit assembly in an inverted assembly manner, instead of placing the magnetizing plate 12 and the magnetic conductive plate 11 in the accommodating cavity 131 of the magnetic conductive cover 13 in turn. In this way, the relative position between the magnetic conductive plate 11 and the magnetizing plate 12, as well as the position of the two in the accommodating cavity 131 of the magnetic conductive cover 13 can be limited by the structure of the carrier 30 to meet the assembly requirements, thereby reducing the assembly errors between the magnetic conductive plate 11, the magnetizing plate 12, and the magnetic conductive cover 13, and improving the assembly quality.

[0037] In one embodiment, the depth of the groove 31 is less than the thickness of the laminated structure of the magnetic conductive plate 11 and the magnetizing plate 12, so that when the magnetic conductive cover 13 is covered on the periphery of the upper end of the carrier 30, the side of the magnetizing plate 12 away from the magnetic conductive plate 11 contacts the bottom of the accommodating cavity 131.

[0038] It is easy to understand that the magnetic conductive plate 11, the magnetizing plate 12 and the magnetic conductive cover 13 in the magnetic circuit assembly need to be stacked together, and the adjacent magnetic conductive plates 11 and magnetizing plates 12 are in contact with each other, and the side of the magnetizing plate 12 away from the magnetic conductive plate 11 is in contact with the bottom of the accommodating cavity 131 of the magnetic conductive cover 13, so that the three are bonded together to form a magnetic circuit assembly after the glue is applied at the glue application station 23. If the thickness of the laminated structure of the magnetic conductive plate 11 and the magnetizing plate 12 is less than the depth of the groove 31, the laminated structure will not be able to be exposed from the groove 31, so that the side of the magnetizing plate 12 away from the magnetic conductive plate 11 will be difficult to contact with the accommodating cavity 131, making it difficult to assemble the magnetic circuit assembly.

[0039] Of course, the depth of the groove 31 can also be equal to the thickness of the laminated structure of the magnetic conductive plate 11 and the magnetizing plate 12, so that the side of the magnetizing plate 12 away from the magnetic conductive plate 11 is in contact with the accommodating cavity 131, which is not specifically limited here.

[0040] In one embodiment, the cross-sectional size of the groove 31 of the carrier 30 is set so that the maximum offset distance between the magnetic conductive plate 11 and the magnetizing plate 12 in the groove 31 is smaller than the assembly error between the magnetic conductive plate 11 and the magnetizing plate 12 .

[0041] It is easy to understand that the magnetic conductive plate 11 and the magnetizing plate 12 need to be stacked as required, for example, the distance between the central axes of the magnetic conductive plate 11 and the magnetizing plate 12 is within a preset range. At the same time, the cross-sectional size of the groove 31 of the carrier 30 should be large enough to allow the magnetic conductive plate 11 and the magnetizing plate 12 to be stacked therein. When the cross-sectional size of the groove 31 of the carrier 30 is large enough, the magnetic conductive plate 11 and the magnetizing plate 12 may be staggered by a certain distance when assembling at the assembly station 22.

[0042] In the present application, by setting the cross-sectional dimensions of the groove 31 of the carrier 30, the placement of the magnetic conductive plate 11 and the magnetizing plate 12 is limited, so that the maximum offset distance between the two in the groove 31 is smaller than the assembly error between the two, thereby meeting the assembly requirements.

[0043] In one embodiment, the cross-sectional size of the upper end of the carrier 30 is set so that when the magnetic cover 13 is covered on the periphery of the upper end of the carrier 30, the maximum offset distance between the magnetic cover 13 and the magnetic conductive plate 11 and the magnetizing plate 12 in the groove 31 is less than the assembly error between the magnetic cover 13 and the magnetic conductive plate 11 and the magnetizing plate 12.

[0044] Similar to the above-mentioned embodiment, when assembling the magnetic circuit assembly, while the bottom of the receiving cavity 131 of the magnetic shield 13 is in contact with the magnetizing plate 12, the magnetizing plate 12 needs to be set at a preset position of the receiving cavity 131 as required, for example, the distance between the magnetizing plate 12 and the central axis of the receiving cavity 131 of the magnetic shield 13 is within a preset range, which requires that the distance between the central axis of the receiving cavity 131 of the magnetic shield 13 and the central axis of the upper end of the carrier 30 meets certain requirements. At the same time, the size of the receiving cavity 131 of the magnetic shield 13 should be large enough to cover the receiving cavity 131 on the periphery of the upper end of the carrier 30, and then cover the periphery of the laminated structure of the magnetic plate 11 and the magnetizing plate 12. In this case, when assembling at the assembly station 22, the bottom of the receiving cavity 131 of the magnetic shield 13 and the side of the magnetizing plate 12 away from the magnetic plate 11 may be offset.

[0045] The setting of the upper cross-sectional dimensions of the carrier 30 in the present application can limit the placement of the magnetic cover 13, so that the maximum offset distance between the magnetic plate 11 and the magnetizing plate 12 is smaller than the assembly error between the magnetic cover 13 and the magnetic plate 11 and the magnetizing plate 12, so as to meet the assembly requirements.

[0046] In one embodiment, the lower end of the carrier 30 is used to support the conveying device of the carrier 30, and the cross-sectional dimension of the upper end of the carrier 30 is smaller than the cross-sectional dimension of the lower end of the carrier 30, so that the carrier 30 can be stably placed during the conveying process.

[0047] Please read further Figure 2 In one embodiment, the assembly station 22 includes a magnetic conductive plate assembly station 221, a magnetizing plate assembly station 222 and a magnetic conductive cover assembly station 223 which are spaced apart from each other; the gluing station 23 includes a magnetic conductive plate gluing station 231 and a magnetizing plate gluing station 232, wherein the magnetic conductive plate gluing station 231 is located between the magnetic conductive plate assembly station 221 and the magnetizing plate assembly station 222, and the magnetizing plate gluing station 232 is located between the magnetizing plate assembly station 222 and the magnetic conductive cover assembly station 223.

[0048] The first carrier conveying device 21 conveys the carrier through the magnetic plate assembly station 221, the magnetic plate gluing station 231, the magnetizing plate assembly station 222, the magnetizing plate gluing station 232 and the magnetic cover assembly station 223 in sequence, so that the magnetic plate 11, the magnetizing plate 12 and the magnetic cover 13 are stacked on the carrier in sequence by the magnetic plate assembly station 221, the magnetizing plate assembly station 222 and the magnetic cover assembly station 223, and the stacked structure of the magnetic plate 11 and the magnetizing plate 12 is accommodated in the accommodating cavity 131 of the magnetic cover 13, the magnetic plate gluing station 231 applies glue on the magnetic plate 11 carried by the carrier 30, and the magnetizing plate gluing station 232 applies glue on the magnetizing plate 12 carried by the carrier, so that a magnetic circuit component is formed on the carrier 30 in the process of the first carrier conveying device 21 conveying the carrier 30 according to the preset conveying direction.

[0049] Please refer to Figure 5 , Figure 5 It is a partial structural schematic diagram of an embodiment of an automatic assembly device for a magnetic circuit component of a bone conduction earphone of the present application.

[0050] In this embodiment, the first carrier conveying device 21 includes a dividing plate 211, and a magnetic plate assembly station 221, a magnetic plate gluing station 231, a magnetizing plate assembly station 222, a magnetizing plate gluing station 232 and a magnetic cover assembly station 223 are evenly spaced around the dividing plate 211.

[0051] The first carrier conveying device 21 further includes a driving mechanism connected to the indexing plate 211 to drive the indexing plate 211 to rotate at a preset speed, so as to further convey the carrier 30 to pass through the above-mentioned assembly station 22 and gluing station 23 in sequence during the rotation process.

[0052] In one embodiment, a plurality of equally spaced limit grooves 2111 are provided on the dividing plate 211, and the shape of the limit grooves 2111 matches the shape of the lower end of the carrier 30. When the first carrier conveying device 21 is in the process of conveying the carrier 30, the lower end of the carrier 30 is accommodated in the limit grooves 2111 and can rotate with the dividing plate 211 under the limiting action of the limit grooves 2111.

[0053] In one embodiment, the first carrier conveying device 21 further includes a limiting ring 212 sleeved on the periphery of the indexing plate 211 . Driven by the driving mechanism, the indexing plate 211 rotates relative to the limiting ring 212 in the limiting ring 212 .

[0054] It should be pointed out that the space jointly defined by the limiting ring 212 and the limiting groove 2111 matches the shape of the lower end of the carrier 30, so that when the dividing plate 211 rotates, the carrier 30 in the limiting groove 2111 is maintained in the limiting groove 2111 under the joint limiting action of the limiting groove 2111 and the limiting ring 212 and rotates with the dividing plate 211.

[0055] In addition, the limiting ring 212 can be completely mounted on the periphery of the indexing plate 211 , or can be partially mounted on the periphery of the indexing plate 211 according to actual use requirements, so as to release the limiting effect on the carrier 30 transported on the indexing plate 211 under certain circumstances.

[0056] In one embodiment, the limiting groove 2111 has an opening 21111 connected to the outer edge of the indexing plate 211. Figure 2 The automatic assembly equipment further includes a carrier loading station 24 and a carrier unloading station 25, wherein the carrier loading station 24 is used to feed the carrier 30 into the limiting groove 2111 through the opening 21111, and the carrier unloading station 25 is used to push the carrier 30 out of the limiting groove 2111 through the opening.

[0057] For details, please continue to see Figure 5 The carrier unloading station 25 includes a transmission mechanism 251 and a push rod 252 that is synchronously driven with the transmission mechanism 251. The push rod 252 is used to push the carrier 30 out of the limiting groove 2111 of the dividing plate 211 through the opening 21111 when the dividing plate 211 transfers the carrier 30 to the position corresponding to the carrier unloading station 25.

[0058] Among them, the transmission mechanism 251 of the carrier unloading station 25 can drive the push rod 252 to transmit in a straight line direction, so that the push rod 252 transmits the carrier 30 in the limiting groove 2111 toward the opening direction of the limiting groove 2111.

[0059] It should be pointed out that, at this time, the limiting ring 212 is only partially mounted on the periphery of the dividing plate 211 , and the limiting ring 212 is not provided at the positions of the dividing plate 211 corresponding to the carrier loading station 24 and the carrier unloading station 25 .

[0060] Of course, the carrier can also be removed from the limiting groove 2111 of the dividing plate 211 by other means. For example, the carrier unloading station 25 may include a pick-up and placement mechanism. When the carrier 30 is transferred to the carrier unloading station 25, the carrier 30 is removed from the limiting groove 2111 by the pick-up and placement mechanism. It should be pointed out that at this time, there is no need to additionally set an opening 21111 on the limiting groove 2111. At the same time, in this case, the limiting ring 212 can also be completely mounted on the periphery of the dividing plate 211.

[0061] Please read further Figure 6 , Figure 7 , Figure 6 This is a schematic diagram of the structure of an embodiment of a magnetic cover vibration plate of the present application. Figure 7 It is a structural schematic diagram of an embodiment of an automatic assembly device for a magnetic circuit component of a bone conduction headset of the present application.

[0062] In this embodiment, the magnetic cover assembly station 223 includes a magnetic cover vibration plate 2231. The magnetic cover vibration plate 2231 is used to arrange and transport the magnetic covers 13, so that when the first carrier conveying device 21 conveys the carrier 30 to the magnetic cover assembly station 223, the arranged magnetic covers 13 are covered on the periphery of the upper end of the carrier 30.

[0063] The magnetic cover vibration disk 2231 is provided with a screening mechanism 22311 for screening the magnetic covers 13 transmitted by the magnetic cover vibration disk 2231 to obtain magnetic covers 13 with the accommodating cavities 131 facing in the same direction.

[0064] It is easy to understand that when the magnetic cover assembly station 223 assembles the magnetic cover 13, it is necessary to place the receiving cavity 131 of the magnetic cover 13 on the carrier 30 on the first carrier conveying device 21 in a certain orientation, and the screening mechanism 22311 of the magnetic cover vibration disk 2231 can automatically screen out the magnetic covers 13 with the receiving cavity 131 in the same orientation as required and arrange and convey them, thereby facilitating the magnetic cover assembly station 223 to further assemble the magnetic covers 13 without manually adjusting the orientation of the receiving cavity 131 of the magnetic cover 13 during the assembly process, thereby saving labor costs and improving assembly efficiency.

[0065] In addition, in the present embodiment, the specific form of the screening mechanism 22311 is not limited, as long as it can screen out the magnetic conductive covers 13 with the accommodating cavities 131 facing in the same direction according to the requirements.

[0066] Specifically, the magnetic cover vibration plate 2231 includes a feeding track 22312, and the magnetic covers 13 are arranged on the feeding track 22312 and conveyed along the feeding track 22312. The feeding track 22312 is suspended, and the screening mechanism 22311 is a sawtooth portion 223121 provided on the feeding track 22312. The gap between the sawtooths of the sawtooth portion 223121 enables the magnetic cover 13 with the accommodating cavity 131 facing downward to fall from the sawtooth portion 223121 under the action of its own gravity when the magnetic cover 13 is conveyed to and passes through the sawtooth portion 223121, and the magnetic cover 13 with the accommodating cavity 131 facing upward passes through the sawtooth portion 223121 and continues to be conveyed on the feeding track 22312.

[0067] Among them, the magnetic cover 13 that has fallen from the sawtooth portion 223121 can continue to enter the feeding track 22312 under the action of the magnetic cover vibration disk 2231 to be further screened by the screening mechanism 22311.

[0068] The specific tooth shape of the sawtooth portion 223121 is not specifically limited here, and can be, for example, square teeth, arc teeth, triangular teeth, etc. In addition, the screening mechanism 22311 is not limited to the sawtooth portion 223121, and can be other shapes, as long as the magnetic conductive cover 13 with the accommodating cavity 131 facing the same direction can be screened out according to the needs.

[0069] In one application scenario, the magnetic cover vibration disk 2231 also includes a push-out portion 22313 protruding from the feeding track 22312. The push-out portion 22313 is specifically arranged corresponding to the sawtooth portion 223121, or the push-out portion 22313 is arranged at a position close to the upstream of the sawtooth portion 223121. When the magnetic cover 13 is conveyed to the push-out portion 22313 along the feeding track 22312, it continues to be conveyed along the push-out direction of the push-out portion 22313, so that when the magnetic cover 13 is conveyed on the sawtooth portion 223121, it is pushed out a certain distance in the conveying direction perpendicular to the feeding track 22312, so that the accommodating cavity 131 of the magnetic cover 13 with the accommodating cavity 131 facing downward is inverted on the outer edge of the sawtooth portion 223121, and further the magnetic cover 13 is flipped off the sawtooth portion 223121 due to the unstable center of gravity.

[0070] The setting of the pushing portion 22313 in the above application scenario can further assist the serrated portion 223121 in screening when the teeth of the serrated portion 223121 are long enough so that the magnetic cover 13 with a partial accommodating cavity 131 facing downward can still pass through the screening mechanism 22311, thereby improving the screening accuracy of the screening mechanism 22311.

[0071] It should be pointed out that the present application does not limit the number of feeding tracks 22312 of the magnetic cover vibration disk 2231, and the number of corresponding screening mechanisms 22311. For example, the number of feeding tracks 22312 can be two, and the two feeding tracks 22312 can screen the magnetic cover 13 at the same time, thereby obtaining the magnetic cover 13 with the accommodating cavity 131 facing the same direction, so as to improve the assembly efficiency of the automatic assembly equipment.

[0072] Please continue reading Figure 6 In one embodiment, the magnetic cover vibration disk 2231 includes a cover mechanism 22314, and the cover mechanism 22314 covers the feeding track 22312 downstream of the screening mechanism 22311, so that the magnetic cover 13 screened by the screening mechanism 22311 can be transferred between the cover mechanism 22314 and the feeding track 22312, and the feeding track 22312 and the cover mechanism 22314 are gradually turned over. The magnetic cover 13 with the accommodating cavity 131 facing upwards screened by the screening mechanism 22311 is gradually turned over to have the accommodating cavity 131 facing downwards under the action of the cover mechanism 22314 and the feeding track 22312.

[0073] It should be noted that in the present application, when assembling the magnetic cover 13, the magnetic cover 13 is covered on the periphery of the upper end of the carrier 30 conveyed by the first carrier conveying device 21 in an inverted manner with the receiving cavity 131 facing downward. Therefore, the magnetic cover 13 conveyed by the magnetic cover vibration plate 2231 needs to have the receiving cavity 131 facing downward to facilitate the assembly of the magnetic cover 13.

[0074] The distance between the cover mechanism 22314 and the feeding track 22312 enables the magnetic cover 13 to flip along with the flipping of the cover mechanism 22314 without the magnetic cover 13 sliding in other directions.

[0075] In addition, the cover mechanism 22314 can be specifically in the shape of a plate, or can also be in the shape of a mesh having mesh holes so that the magnetic cover 13 will not fall out of it, etc. It can be specifically configured according to actual needs and is not specifically limited here.

[0076] The flipping angle of the feeding track 22312 and the cover mechanism 22314 can be 180°, and the flipping length is long enough and slow enough so that the magnetic cover 13 can be flipped smoothly during the conveying process.

[0077] In one embodiment, the cover mechanism 22314 and the feeding track 22312 are configured so that the magnetic cover 13 is pre-flipped at a certain angle on the feeding track 22312 before entering between the cover mechanism 22314 and the feeding track 22312, so as to allow the magnetic cover 13 to fall from the feeding track 22312 when the pushing force borne by the magnetic cover 13 is greater than a certain threshold.

[0078] It should be pointed out that the speed of arranging and conveying the magnetic covers 13 by the magnetic cover vibrating plate 2231 is relatively fast, while the speed of assembling the magnetic covers 13 by the magnetic cover assembly station 223 is certain, which is often less than the conveying speed of the magnetic cover vibrating plate 2231. Therefore, when the number of magnetic covers 13 conveyed by the magnetic cover vibrating plate 2231 is too large, it is necessary to use certain means to flip the conveyed magnetic covers 13 off the track to adapt to the assembly speed of the magnetic covers 13 by the magnetic cover assembly station 223.

[0079] Among them, the pre-flipping of the feeding track 22312 means that the feeding track 22312 is pre-flipped at the upstream part where the cover mechanism 22314 covers the feeding track 22312. It should be pointed out that the pre-flipping angle of the feeding track 22312 can enable the magnetic cover 13 to be smoothly transported along the pre-flipped feeding track 22312 without falling under normal force conditions, and when the number of magnetic covers 13 transported by the magnetic cover vibrating disk 2231 is too large, the downstream of the feeding track 22312 will form a driving force between the transported magnetic covers 13 due to the excessive number of magnetic covers 13 gathered, and when the driving force exceeds a certain threshold, the magnetic covers 13 that have been pre-flipped to a certain extent will be flipped and dropped due to the further effect of the inclined supporting force.

[0080] Of course, in other embodiments, other methods can be used to adapt to the assembly speed of the magnetic cover 13. For example, a sensing device can be set to sense the driving force between the magnetic covers 13 on the feeding track 22312. When the sensed driving force is greater than a preset value, the transmission speed of the magnetic cover vibration plate 2231 can be controlled to be reduced. When the driving force is less than a preset value, the transmission speed of the magnetic cover vibration plate 2231 can be controlled to be increased.

[0081] In one embodiment, the magnetic cover assembly station 223 further includes a magnetic cover taking and placing device 2232 .

[0082] The magnetic cover picking and placing device 2232 can be set at the end of the feeding track 22312 of the magnetic cover vibration disk 2231 to pick up the magnetic cover 13 that has been screened by the screening mechanism 22311 and / or flipped over by the feeding track 22312 and the cover mechanism 22314 from the other side of the magnetic cover 13 away from the accommodating cavity 131, and release the magnetic cover 13 onto the carrier 30.

[0083] The magnetic cover picking and placing device 2232 may be a gripper capable of picking up and releasing the magnetic cover 13, so as to grab the magnetic cover 13 at the end of the feeding track 22312 of the magnetic cover vibrating disk 2231 through the gripper, and further release the magnetic cover 13 on the carrier 30 by opening the gripper. It should be pointed out that in this embodiment, the magnetic cover picking and placing device 2232 may also be a pneumatic picking and placing device, which specifically sucks the magnetic cover 13 away from one side of the accommodating cavity 131 by vacuuming, and releases the magnetic cover 13 on the carrier 30 by deflation. The use of a pneumatic picking and placing device can avoid scratching and damaging the surface structure of the magnetic cover 13 in the process of picking up the magnetic cover 13.

[0084] It should be pointed out that in an application scenario, the magnetic cover picking and placing device 2232 can automatically flip the magnetic cover 13 after picking up the magnetic cover 13, for example, the magnetic cover 13 can be flipped from the receiving cavity 131 facing upward to the receiving cavity 131 facing downward, and then after the receiving cavity 131 faces downward, the magnetic cover 13 is covered on the periphery of the upper end of the carrier 30 conveyed by the first carrier conveying device 21 through the receiving cavity 131. At this time, the cover mechanism 22314 is not necessary, and the inverted assembly of the magnetic cover 13 can be achieved without passing the magnetic cover 13 between the cover mechanism 22314 and the feeding track 22312 and flipping the magnetic cover 13 with the receiving cavity 131 facing upward after being screened by the screening mechanism 22311 to the receiving cavity 131 facing downward.

[0085] In one embodiment, the magnetic conductive plate assembly station 221 includes a magnetic conductive plate vibration plate 2211 and a magnetic conductive plate taking and placing device 2212 .

[0086] Among them, the magnetic plate vibration disk 2211 is used to arrange and transport the magnetic plates 11. The magnetic plate 11 picking and placing device picks up the magnetic plates 11 transported by the magnetic plate vibration disk 2211 and releases the magnetic plates 11 onto the empty carrier 30 transported by the first carrier conveying device 21.

[0087] Specifically, in this embodiment, the magnetic plate pick-up and placement device 2212 can be a pneumatic pick-up and placement device, which sucks the magnetic plate 11 by suction and releases the magnetic plate 11 on the carrier 30 by exhausting air. On the one hand, the use of a pneumatic pick-up and placement device to pick up the magnetic plate 11 will not damage the surface structure of the magnetic plate 11 and avoid scratches; on the other hand, only one side of the magnetic plate 11 needs to be sucked to place it in the groove 31 of the carrier, thereby avoiding the assembly inconvenience caused by clamping the side of the magnetic plate 11.

[0088] In one embodiment, the magnetizing plate assembly station 222 includes a magnetizing plate vibration plate 2221 and a magnetizing plate taking and placing device 2222 .

[0089] Among them, the magnetizing plate vibration disk 2221 is used to arrange and transport the magnetizing plates 12, the magnetizing plate picking and placing device 2222 picks up the magnetizing plates 12 screened by the screening mechanism 22311, and releases the magnetizing plates 12 onto the carrier 30 carrying the magnetic plates 11 that have been glued by the magnetic plate gluing station 231 and transported by the first carrier conveying device 21.

[0090] Specifically, in this embodiment, the magnetizing plate picking and placing device 2222 may be a pneumatic picking and placing device, which specifically sucks the magnetizing plate 12 by pumping air, and releases the magnetizing plate 12 on the carrier 30 by releasing air. Using the pneumatic picking and placing device to pick up the magnetizing plate 12 will not damage the surface structure of the magnetizing plate 12, and avoid scratches; on the other hand, only one side of the magnetizing plate 12 needs to be sucked to place it in the groove 31 of the carrier 30, thereby avoiding the assembly inconvenience caused by clamping the side of the magnetizing plate 12.

[0091] Please read further Figure 8 , Figure 8 It is a structural schematic diagram of a gluing station in one embodiment of the automatic assembly equipment of the magnetic circuit component of the bone conduction earphone of the present application.

[0092] It should be pointed out that the magnetic conductive plate gluing station 231 and the magnetizing plate gluing station 232 are identical in structure.

[0093] Specifically, the magnetic conductive plate gluing station 231 and the magnetizing plate gluing station 232 respectively include a transmission mechanism 2301, a first gluing component 2302 and a second gluing component 2303 synchronously driven by the transmission mechanism 2301, and the glue outlet 23021 of the first gluing component and the glue outlet 23031 of the second gluing component are arranged adjacent to each other so that the glue applied by the first gluing component 2302 and the curing agent applied by the second gluing component 2303 are mixed together during gluing.

[0094] Among them, when applying glue in the gluing station 23, the transmission mechanism 2301 is transmitted in the direction close to the first carrier conveying device 21, so that the first gluing component 2302 and the second gluing component 2303 are close to the upper end of the carrier 30 to apply glue, and after the gluing is completed, it is further transmitted in the direction away from the first carrier conveying device 21 to leave the upper end of the carrier 30.

[0095] In this embodiment, the glue liquid applied by the glue application station 23 is divided into two parts and applied separately, the first glue application component 2302 is used to apply the glue, and the second glue application component 2303 is used to apply the glue curing agent. It should be noted that this is not limited to this. In other embodiments, the first glue application component 2302 and the second glue application component 2303 can both apply the glue and the curing agent.

[0096] Specifically, when the first carrier conveying device 21 conveys the carrier 30 carrying the magnetic conductive plate 11 to the magnetic conductive plate gluing station 231, the transmission mechanism 2301 of the magnetic conductive plate gluing station 231 drives the first gluing component 2302 and the second gluing component 2303 to approach the magnetic conductive plate 11 in the carrier 30 conveyed by the first carrier conveying device 21, and apply the glue and the curing agent to the surface of the magnetic conductive plate 11 respectively. After the gluing, the transmission mechanism 2301 further drives the first gluing component 2302 and the second gluing component 2303 to apply the glue and the curing agent to the surface of the magnetic conductive plate 11. The glue component 2302 and the second glue application component 2303 are away from the carrier 30 conveyed by the first carrier conveying device 21; after the magnetic plate glue application station 231 applies glue, the first carrier conveying device 21 further conveys the carrier 30 to the magnetizing plate assembly station 222 to stack the magnetizing plate 12 on the magnetic plate 11 carried in the carrier 30, and the magnetic plate 11 and the magnetizing plate 12 are bonded together by the glue applied by the magnetic plate glue application station 231; then the first carrier conveying device 21 is further conveyed to the magnetizing plate assembly station 222. In one step, the carrier 30 carrying the laminated structure of the magnetic conductive plate 11 and the magnetizing plate 12 is transferred to the magnetizing plate gluing station 232. The transmission mechanism 2301 of the magnetizing plate gluing station 232 drives the corresponding first gluing component 2302 and the second gluing component 2303 to approach the magnetizing plate 12 in the carrier 30 transferred by the first carrier conveying device 21, and apply the glue and the curing agent to the surface of the magnetizing plate 12. After the gluing, the transmission mechanism 2301 further drives the first gluing component 2302 and the second gluing component 2303 to apply the glue and the curing agent to the surface of the magnetizing plate 12. The glue component 2302 and the second glue applying component 2303 are away from the carrier 30 conveyed by the first carrier conveying device 21, thereby completing the gluing; further, after the magnetizing plate gluing station 232 applies glue, the first carrier conveying device 21 conveys the carrier 30 to the magnetic cover assembly station 223 to set the magnetic cover 13 on the outer periphery of the upper end of the carrier 30, and makes the bottom of the accommodating cavity 131 of the magnetic cover 13 bonded to the magnetizing plate 12 through the glue applied by the magnetizing plate gluing station 232.

[0097] Through the above method, when applying glue to the carrier 30 conveyed on the first carrier conveying device 21, the glue and the curing agent can be automatically applied by the first glue applying component 2302 and the second glue applying component 2303 of the magnetic plate glue applying station 231 and the magnetizing plate glue applying station 232, and the glue outlet 23021 of the first glue applying component and the glue outlet 23031 of the second glue applying component are adjacently arranged, so that the applied glue and curing agent can be fully mixed together during automatic gluing, without manual gluing, thereby improving assembly efficiency.

[0098] Specifically, in one embodiment, the first glue applying component 2302 includes a first glue storage tube 23022 and a first glue applying needle 23023 connected to the first glue storage tube 23022, the glue outlet 23021 of the first glue applying component is located at the free end of the first glue applying needle 23023, the second glue applying component 2303 includes a second glue storage tube 23032 and a second glue applying needle 23033 connected to the second glue storage tube 23032, the glue outlet 23031 of the second glue applying component is located at the free end of the second glue applying needle 23033, at least one of the first glue applying needle 23023 and the second glue applying needle 23033 is bent so that the free end of the first glue applying needle 23023 and the free end of the second glue applying needle 23033 are arranged adjacent to each other, as shown in FIG. Fig. 9 shown.

[0099] Among them, the first glue storage tube 23022 and the second glue storage tube 23032 can be connected to the corresponding glue source, and the glue source provides the glue and curing agent to the corresponding glue storage tube according to demand.

[0100] It should be noted that the arrangement of the first glue needle 23023 and the second glue needle 23033 makes the glue outlet 23021 of the first glue dispensing component and the glue outlet 23031 of the second glue dispensing component relatively small, so that the applied glue and glue liquid can be mixed more evenly.

[0101] In addition, in an application scenario, the first glue needle 23023 or the second glue needle 23033 is bent at 45 degrees, and the free ends of the two glue needles are arranged adjacent to each other after bending, so as to facilitate the full mixing of the glue and curing agent provided by the two glue outlets. Of course, the bending angle of the glue needle is not specifically limited, as long as the free ends of the glue needles can be arranged adjacent to each other.

[0102] In one embodiment, the transmission mechanism 2301 includes a mounting seat 23011 and a first clamping member 23012 and a second clamping member 23013 rotatably mounted on the mounting seat 23011 , wherein the first clamping member 23012 clamps the first rubber storage tube 23022 , and the second clamping member 23013 clamps the second rubber storage tube 23032 .

[0103] During use, the operator can manually adjust the installation angle of the first clamping member 23012 and the second clamping member 23013 relative to the mounting base 23011 to adjust the angle between the first glue storage tube 23022 and the second glue storage tube 23032; of course, it can also be automatically adjusted through the control system so that the free ends of the first glue needle 23023 and the second glue needle 23033 respectively connected to the first glue storage tube 23022 and the second glue storage tube 23032 are arranged adjacent to each other.

[0104] Please read further Fig.10 , Fig.10 It is a partial structural schematic diagram of an embodiment of an automatic assembly device for a magnetic circuit component of a bone conduction earphone of the present application.

[0105] In one embodiment, the automatic assembly equipment further includes a carrier unloading station 25 , a second carrier conveying device 26 , a carrier pushing device 27 and a heating station 28 .

[0106] Among them, the structure of the carrier unloading station 25 in this embodiment is the same as that in the above embodiment. Please refer to the above embodiment for relevant details, which will not be repeated here.

[0107] The second carrier conveying device 26 can be specifically used to convey the carrier 30 transferred by the first carrier conveying device 21 through the carrier unloading station 25 .

[0108] The heating station 28 is used to heat the carrier 30 carrying the magnetic circuit assembly transferred from the first carrier conveying device 21 to the second carrier conveying device 26 , so as to heat and cure the glue applied by the glue applying station 23 .

[0109] Specifically, the carrier unloading station 25 is used to transfer the carrier 30 carrying the magnetic circuit assembly from the first carrier conveying device 21 to the second carrier conveying device 26 after the magnetic circuit assembly is assembled. Specifically, the carrier 30 can be pushed from the limiting groove 2111 of the first carrier conveying device 21 to the second carrier conveying device 26 through the opening of the limiting groove 2111 by the push rod 252. Alternatively, a conveying track is further provided between the first carrier conveying device 21 and the second carrier conveying device 26, and the carrier unloading station 25 first pushes the carrier 30 on the first conveying device to the conveying track, and the carrier 30 on the conveying track is further transferred to the second carrier conveying device 26 by the pushing action between each other.

[0110] Among them, the carrier pushing device 27 can be set on one side of the second carrier conveying device 26 and correspond to the heating station 28. After the carrier 30 is transferred to the second carrier conveying device 26, the carrier 30 is pushed from the second carrier conveying device 26 to the heating station 28 for heating treatment under the action of the carrier pushing device 27, so that the glue applied by the gluing station 23 in the magnetic circuit component carried by the carrier 30 is solidified, thereby accelerating the solidification of the glue.

[0111] In one embodiment, the second carrier conveying device 26 includes a limit block 261 arranged at one end of the second carrier conveying device 26, wherein the limit block 261 is specifically arranged at one end of the second carrier conveying device 26 along the conveying direction, and when the carrier 30 carrying the magnetic circuit component is conveyed to the limit block 261 through the second carrier conveying device 26, it temporarily stays at the limit block 261 without continuing to be conveyed.

[0112] In addition, the automatic assembly equipment further includes a third carrier conveying device 29 , which is used to convey the carrier 30 carrying the magnetic circuit component and output after being heated by the heating station 28 .

[0113] The heating station 28 includes a plurality of heating channels 281 arranged side by side, and the carrier pushing device 27 includes pushing parts 271 whose number corresponds to the heating channels 281 . The pushing parts 271 are arranged on both sides of the second carrier conveying device 26 with intervals from the corresponding heating channels 281 .

[0114] For more details, please refer to Fig.11 , Fig.11 The figure is a partial structural diagram of the automatic assembly equipment of the magnetic circuit assembly of the bone conduction earphone of the present application. A heating tube 282 is arranged in the heating station 28 to heat the magnetic circuit assembly carried by the carrier 30 in the heating channel 281 .

[0115] Specifically, under the action of the limit block 261, the carrier 30 carrying the magnetic circuit assembly transported on the second carrier conveying device 26 is confined between the corresponding heating channel 281 and the pushing portion 271, and further under the pushing of the carrier pushing device 27, the carrier 30 enters the corresponding heating channel 281 from the second carrier conveying device 26 for heating treatment.

[0116] Among them, in one application scenario, the carrier pushing device 27 further includes a cylinder connected to the pushing portion 271. Specifically, the number of cylinders can be one, in which case multiple pushing portions 271 are connected to one cylinder, and when the cylinder is working, it can simultaneously drive multiple pushing portions 271 to move the carrier 30 from the second carrier conveying device 26 into the corresponding heating channel 281, and further drive multiple pushing portions 271 to return to the initial position; of course, the number of cylinders can also be consistent with the number of pushing portions 271, and each cylinder drives one pushing portion 271, in which case, when a carrier 30 is placed at the position of the second carrier conveying device 26 corresponding to the pushing portion 271, the cylinder can be controlled to drive the corresponding pushing portion 271 to push the corresponding carrier 30 to the heating channel 281, and when no carrier 30 is placed at the position of the second carrier conveying device 26 corresponding to the pushing portion 271, the cylinder is controlled not to perform the driving operation.

[0117] Furthermore, when the carrier 30 carrying the magnetic circuit assembly enters the heating channel 281 for heating treatment, it is pushed by the carrier 30 entering the heating channel 281 later. After the heating channel 281 is filled with carriers 30, under the action of the pushing force, the carrier 30 located in the heating channel 281 and close to the third carrier conveying device 29 is transferred from the heating channel 281 to the third carrier conveying device 29, thereby completing the heating treatment.

[0118] See also Fig.12 , Fig.12 It is a partial structural schematic diagram of an embodiment of an automatic assembly device for a magnetic circuit component of a bone conduction earphone of the present application.

[0119] The automatic assembly equipment further includes a magnetic circuit component taking and placing device 2X, a magnetizing station 2Y and a magnetic circuit component conveying device 2Z.

[0120] The magnetic circuit component picking and placing device 2X is used to pick up the magnetic circuit component on the carrier 30 output from the heating station 28 by the third carrier conveying device 29 and place it in the magnetizing station 2Y for magnetization, and take the magnetized magnetic circuit component out of the magnetizing station 2Y and place it into the magnetic circuit component conveying device 2Z.

[0121] The magnetizing station 2Y is used to magnetize the magnetic circuit component to enhance the magnetism of the magnetizing plate 12. Specifically, the magnetizing station 2Y may include a constant current magnetizing machine or a pulse magnetizing machine.

[0122] The magnetic circuit component conveying device 2Z is ​​used to convey the magnetic circuit components magnetized by the magnetizing station 2Y. For example, after the magnetization is completed, the components can be conveyed to the receiving area through the magnetic circuit component conveying device 2Z, and further automatic or manual receiving can be performed in the receiving area.

[0123] The magnetic circuit assembly pick-up and placement device 2X can be the same as the magnetic cover pick-up and placement device 2232 in the above embodiment, and adopts a pneumatic pick-up and placement device. Of course, other methods can also be used to pick up and place the magnetic circuit assembly, which is not specifically limited here.

[0124] It should be pointed out that the magnetic circuit component picking and placing device 2X in the present application is arranged on one side of the third carrier conveying device 29, the magnetizing station 2Y and the magnetic circuit component conveying device 2Z. When the carrier 30 carrying the magnetic circuit component that has been heated at the heating station 28 and conveyed on the third carrier conveying device 29 reaches the preset position, the magnetic circuit component picking and placing device 2X picks up the magnetic circuit component in the corresponding carrier 30 and places it in the magnetizing station 2Y for magnetization; and when the magnetization treatment is completed in the magnetizing station 2Y, for example, when the preset magnetization time is reached, the magnetic circuit component picking and placing device 2X further picks up the magnetic circuit component in the magnetizing station 2Y and places it on the magnetic circuit component conveying device 2Z for conveyance.

[0125] The automatic assembly equipment of the magnetic circuit assembly of the bone conduction earphone of the present application includes a magnetic circuit assembly pick-up and placement device 2X, which can pick up the assembled magnetic circuit assembly and place it in the magnetization station 2Y for magnetization, and take the magnetized magnetic circuit assembly out of the magnetization station 2Y and place it in the magnetic circuit assembly conveying device 2Z. Through the above method, the present application can realize the automatic pick-up and placement of the magnetic circuit assembly when the magnetic circuit assembly is magnetized, without the need for manual operation by the operator, thereby saving labor costs and improving assembly efficiency.

[0126] Please read further Fig.13 , Fig.13 It is a structural schematic diagram of a magnetic circuit component picking and placing device in one embodiment of an automatic assembly device for a magnetic circuit component of a bone conduction headset in the present application.

[0127] In one embodiment, the magnetic circuit assembly pick-up and placement device 2X includes a transmission mechanism 2X1 and a first pickup assembly 2X2 and a second pickup assembly 2X3 synchronously driven by the transmission mechanism 2X1.

[0128] Among them, while the first picking component 2X2 picks up the magnetic circuit component from the second carrier conveying device 26, the second picking component 2X3 picks up the magnetized magnetic circuit component from the magnetizing station 2Y, and while the first picking component 2X2 puts the picked up magnetic circuit component into the magnetizing station 2Y, the second picking component 2X3 puts the picked up magnetic circuit component into the magnetic circuit component conveying device 2Z.

[0129] It should be pointed out that the first pickup component 2X2 and the second pickup component 2X3 in the present embodiment are both synchronously driven by the transmission mechanism 2X1. In an application scenario, the first pickup component 2X2 and the second pickup component 2X3 are initially located directly above the preset position of the third carrier conveyor 29 and directly above the magnetization entrance of the magnetization station 2Y, respectively. After the carrier 30 conveyed on the third carrier conveyor 29 reaches the preset position, the transmission mechanism 2X1 further drives the first pickup component 2X2 and the second pickup component 2X3, so that the first pickup component 2X2 moves downward and picks up the magnetic circuit component carried by the carrier 30 at the preset position, and at the same time, the second pickup component 2X3 synchronously moves downward and picks up the magnetic circuit component that has been magnetized in the magnetization station 2Y; after the picking is completed, the first pickup component 2X2 and the second pickup component 2X3 are further synchronously driven with the transmission mechanism 2X1, so that the first pickup component 2X2 moves upward away from the third carrier conveyor 29 and returns to the corresponding position of the picked magnetic circuit component. The first pickup component 2X2 is directly above the carrier 30, and at the same time, the second pickup component 2X3 also moves away from the magnetization station 2Y and returns to the top of the magnetization entrance; further, the first pickup component 2X2 is further translated to the top of the magnetization entrance of the magnetization station 2Y, and at the same time, the second pickup component 2X3 is also translated to the top of the corresponding position of the magnetic circuit component conveying device 2Z, and then with the transmission of the transmission mechanism 2X1, the first pickup component 2X2 moves downward into the magnetization entrance of the magnetization station 2Y and releases the magnetic circuit component to be magnetized, and at the same time, the second pickup component 2X3 moves downward to the magnetic circuit component conveying device 2Z, and places the magnetized magnetic circuit component on the magnetic circuit component conveying device 2Z for transmission, and after completing the picking, the first pickup component 2X2 and the second pickup component 2X3 are transmitted upward to the top of the corresponding position, and further translated to the initial position with the transmission mechanism 2X1 to wait for the next operation.

[0130] The magnetic circuit component picking and placing device 2X in the automatic assembly equipment in this embodiment includes a transmission mechanism 2X1, and a first picking component 2X2 and a second picking component 2X3 synchronously driven by the transmission mechanism 2X1. Through the above method, the magnetic circuit component can be magnetized and the magnetic circuit component can be removed automatically at the same time.

[0131] Among them, the first pickup component 2X2 and the second pickup component 2X3 can pick up one or more magnetic circuit components each time. In an application scenario, the first pickup component 2X2 and the second pickup component 2X3 respectively include at least two pickup heads 2X01 spaced apart along the transmission direction to simultaneously pick up and place at least two magnetic circuit components. It should be pointed out that in this application scenario, when the first pickup component 2X2 and the second pickup component 2X3 are located at the initial position, after the at least two carriers 30 carrying the magnetic circuit components transported on the third carrier conveying device 29 reach the position corresponding to the at least two pickup heads 2X01, they are further transmitted downward to simultaneously pick up the at least two magnetic circuit components carried by the corresponding at least two carriers 30.

[0132] In another application scenario, the transmission direction of the carrier 30 output from the heating station 28 by the second carrier conveying device 26 is parallel to the transmission direction of the magnetic circuit component conveying device 2Z. At this time, the arrangement direction of at least two picking heads 2X01 of the first picking component 2X2 and at least two picking heads 2X01 of the second picking component 2X3 is also parallel to the above-mentioned transmission direction, so that the first picking component 2X2 and the second picking component 2X3 can pick up at least two magnetic circuit components at the same time.

[0133] Please read further Fig.14 , Fig.14 It is a structural schematic diagram of a magnetic circuit component conveying device in one embodiment of the automatic assembly equipment of the magnetic circuit component of the bone conduction earphone of the present application.

[0134] As in the above embodiment, the magnetic circuit component conveying device 2Z is ​​used to convey the magnetized magnetic circuit components. It is easy to understand that after the magnetic circuit components are magnetized by the magnetizing station 2Y, they have the same magnetic properties, and after being taken out from the magnetizing station 2Y by the magnetic circuit component taking and placing device 2X and placed on the magnetic circuit component conveying device 2Z, the same magnets will repel each other.

[0135] In this embodiment, two non-magnetizable limit bars 2Z1 extending along the conveying direction of the magnetic circuit component conveying device 2Z and arranged side by side with each other are provided on the magnetic circuit component conveying device 2Z. The magnetic circuit component conveying device 2Z places at least two picked up magnetic circuit components between the two non-magnetizable limit bars 2Z1, so that at least two magnetic circuit components are separated from each other between the two non-magnetizable limit bars 2Z1 along the transmission direction of the magnetic circuit component conveying device 2Z under the action of their own magnetic repulsion force.

[0136] In an application scenario, a magnetic circuit component picking device picks up two magnetic circuit components magnetized by a magnetizing station 2Y and places them on a magnetic circuit component conveying device 2Z. Due to the repulsive force, the two magnetic circuit components will separate in opposite directions within the magnetic distance range. At this time, the setting of two non-magnetizable limit strips 2Z1 can prevent the magnetic circuit components from leaving the track of the magnetic circuit component conveying device 2Z when receiving the repulsive force, so that the magnetic circuit components can be smoothly conveyed.

[0137] See also Fig.15 , Fig.15 It is a partial structural schematic diagram of an embodiment of an automatic assembly device for a magnetic circuit component of a bone conduction earphone of the present application.

[0138] In this embodiment, the automatic assembly equipment further includes a carrier loading station 24 and an empty load detection mechanism 2M. As mentioned in the above embodiment, the carrier loading station 24 is arranged on one side of the first carrier conveying device 21 for conveying the carrier 30 to the first carrier conveying device 21.

[0139] It is easy to understand that the carrier 30 conveyed by the first carrier conveying device 21 needs to be further equipped with a magnetic conductive plate 11, a magnetizing plate 12 and a magnetic conductive cover 13. Therefore, the carrier loading station 24 needs to convey the empty carrier 30 to the first carrier conveying device 21. When the carrier 30 carries a magnetic circuit component or other objects, the objects carried therein need to be taken out before they can be conveyed to the first carrier conveying device 21.

[0140] In this embodiment, the automatic assembly equipment further includes an empty-load detection mechanism 2M, which is arranged on one side of the carrier loading station 24. Before the carrier 30 is transferred to the first carrier conveying device 21, the empty-load detection mechanism 2M detects whether the carrier 30 is in an empty-load state in which the magnetic circuit component has been removed, and generates a first alarm signal when the detection result is a non-empty-load state.

[0141] Specifically, the empty-load detection mechanism 2M can detect whether the carrier 30 is in an empty-load state by sensing, scanning, etc.

[0142] When the detection result is a non-empty state, the first alarm signal generated may be a warning sound, or may be used to control the carrier loading station 24 to stop working, or to control the entire automatic assembly equipment to stop working, etc., which may be specifically set according to needs.

[0143] In one application scenario, as in the above-mentioned embodiment, when the magnetic circuit component pick-up and placement device 2X is in operation, it picks up the magnetic circuit component in the carrier 30 conveyed on the third carrier conveying device 29 and puts it into the magnetization station 2Y for magnetization. At this time, the carrier 30 conveyed on the third carrier conveying device 29 is in an empty state with the magnetic circuit component removed. In this application scenario, the third carrier conveying device 29 is connected to the first carrier conveying device 21 and serves as the carrier loading station 24. After the magnetic circuit component in the carrier 30 is removed, the empty carrier 30 is directly conveyed to the first carrier conveying device 21 to realize the automatic cycle operation of the automatic assembly equipment. It is easy to understand that some special situations may occur in the actual assembly process. For example, the glue applied by the gluing station 23 sticks to the groove 31 on the carrier 30, causing the magnetic circuit component to stick to the carrier 30, or other situations cause the magnetic circuit component to be unable to be normally removed through the magnetic circuit component picking and placing device 2X. At this time, there will still be carriers 30 in a non-empty state on the third carrier conveying device 29 after passing through the magnetic circuit component picking and placing device 2X. These carriers 30 cannot be conveyed to the first carrier conveying device 21, and the setting of the empty load detection mechanism 2M will provide timely reminders when the above situation occurs.

[0144] In the above manner, before the carrier loading station 24 transfers the carrier 30 to the first carrier conveying device 21, the empty-load detection mechanism 2M is used to detect the carrier 30, so as to issue a reminder in time when a non-empty state occurs, so as to reduce the situation where the carrier loading station 24 transfers the carrier 30 in a non-empty state to the first carrier conveying device 21, thereby improving the assembly yield.

[0145] In one embodiment, a through hole 32 is provided on the carrier 30. When a magnetic circuit component is carried on the carrier 30, the through hole 32 can be blocked by the magnetic circuit component; and when the carrier 30 is in an unloaded state with the magnetic circuit component removed, the through hole 32 will be exposed.

[0146] In this embodiment, the empty-load detection mechanism 2M can determine whether the carrier 30 is empty by detecting whether the through hole 32 is blocked.

[0147] Specifically, in an application scenario, please refer to Fig.16 , Fig.16 It is a schematic framework diagram of the no-load detection mechanism in one embodiment of the automatic assembly equipment of the magnetic circuit component of the bone conduction earphone of the present application.

[0148] In this application scenario, the no-load detection mechanism 2M may include a light emitter 2M1 and a light receiver 2M2. The detection light generated by the light emitter 2M1 is directed to the through hole 32 of the carrier 30 passing through the light emitter 2M1, and is detected by the light receiver 2M2 when the through hole 32 is not blocked by the magnetic circuit component.

[0149] When the no-load detection mechanism 2M is working, the light transmitter 2M1 generates detection light and emits it to the position of the through hole 32 of the carrier 30. When the through hole 32 is blocked or not blocked, the receiving conditions of the light receiver 2M2 are different, so that it is possible to detect whether the carrier 30 is in an unloaded state based on the receiving light conditions of the light receiver 2M2.

[0150] In one embodiment, please refer to Figure 4 The through hole 32 on the carrier 30 connects the bottom of the groove 31 of the carrier 30 with the lower end of the carrier 30 , and the cross-sectional dimension of the through hole 32 is smaller than the cross-sectional dimension of the groove 31 .

[0151] Specifically, in one application scenario, the cross-sectional size of the through hole 32 can be set to allow an ejection tool to enter the groove 31 through the through hole 32 from the lower end of the carrier 30 , thereby ejecting the magnetic circuit assembly held at the upper end of the carrier 30 .

[0152] As described in the above embodiment, in some special cases, the magnetic circuit component may be stuck in the groove 31 of the carrier 30, making it difficult for the magnetic circuit component pick-up and placement device 2X to remove it from the groove 31 of the carrier 30, and a first alarm signal will be issued after passing through the empty load detection mechanism 2M. At this time, an ejection tool can be used to enter the groove 31 from the lower end of the carrier 30 through the through hole 32 to eject the magnetic circuit component, so that the carrier 30 can continue to be used normally, improve the utilization rate of the carrier 30, and save assembly costs.

[0153] Please continue reading Fig.15 In one embodiment, the automatic assembly equipment also includes an in-place detection mechanism 2N, which is arranged between the carrier loading station 24 and the assembly station, and is used to detect whether the carrier 30 is in place at the predetermined position of the first carrier conveying device 21, and generate a second alarm signal when the detection result is a non-in-place state.

[0154] Specifically, as described in the above embodiment, when the first carrier conveying device 21 includes a dividing plate 211, a limiting groove 2111 is provided on the dividing plate 211, and the limiting groove 2111 has an opening 21111 connected to the outer edge of the dividing plate 211, and the carrier loading station 24 feeds the carrier 30 into the limiting groove 2111 through the opening 21111, so that the carrier 30 rotates together with the dividing plate 211. At this time, the in-position detection mechanism 2N can be set at a position corresponding to the limiting groove 2111, detect whether there is an object on the limiting groove 2111, and judge whether the carrier 30 is in a non-in-position state according to the detection situation.

[0155] The detection principle of the in-position detection mechanism 2N may be the same as that of the above-mentioned no-load detection mechanism 2M, or other methods may be used for detection. In addition, the second alarm signal may be the same as or different from the first alarm signal.

[0156] The setting of the in-position detection mechanism 2N can detect whether the carrier 30 delivered by the carrier loading station 24 has reached the predetermined position, and issue a reminder in time to take corresponding measures when it is not in place, so as to avoid the assembly station 22 continuing to assemble when the carrier 30 is not in place.

[0157] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An automatic assembly device for a magnetic circuit component of a bone conduction headset, characterized in that: The automatic assembly equipment comprises: A first carrier conveying device, used for conveying a carrier; the carrier is provided with a groove, and the groove is used for accommodating a magnetic conductive plate and a magnetizing plate; An assembly station includes a magnetic cover assembly station, wherein the magnetic cover assembly station includes a magnetic cover vibration plate and a magnetic cover pick-up and placement device, the magnetic cover pick-up and placement device picks up the magnetic cover screened by a screening mechanism and releases the magnetic cover on the carrier; the magnetic cover vibration plate is used to arrange and transport the magnetic covers, and a receiving cavity is provided on one side of the magnetic cover; a screening mechanism is provided on the magnetic cover vibration plate, and the screening mechanism is used to screen the magnetic covers transported by the magnetic cover vibration plate to obtain the magnetic covers with the receiving cavity facing in the same direction; The assembly station further includes a magnetic conductive plate assembly station and a magnetizing plate assembly station, and the magnetic conductive plate assembly station, the magnetizing plate assembly station and the magnetic conductive cover assembly station are arranged at intervals from each other; The automatic assembly equipment further comprises a gluing station, wherein the gluing station comprises a magnetic plate gluing station and a magnetizing plate gluing station, wherein the magnetic plate gluing station is located between the magnetic plate assembly station and the magnetizing plate assembly station, and the magnetizing plate gluing station is located between the magnetizing plate assembly station and the magnetic cover assembly station. The first carrier conveying device conveys the carrier through the magnetic conductive plate assembly station, the magnetic conductive plate gluing station, the magnetizing plate assembly station, the magnetizing plate gluing station and the magnetic conductive cover assembly station in sequence, so that the magnetic conductive plate, the magnetizing plate and the magnetic conductive cover assembly station are stacked on the carrier in sequence, and the stacked structure of the magnetic conductive plate and the magnetizing plate is accommodated in the accommodating cavity, the magnetic conductive plate gluing station applies glue on the magnetic conductive plate carried by the carrier, and the magnetizing plate gluing station applies glue on the magnetizing plate carried by the carrier.

2. The automatic assembly equipment according to claim 1, characterized in that: The automatic assembly equipment also includes a carrier unloading station, a second carrier conveying device, a carrier pushing device and a heating station. The carrier unloading station is used to transfer the carrier carrying the magnetic circuit component from the first carrier conveying device to the second carrier conveying device after the magnetic circuit component is assembled, and further, under the action of the carrier pushing device, the carrier is pushed by the second carrier conveying device to the heating station for heating treatment, so that the glue applied by the gluing station is solidified.

3. The automatic assembly equipment according to claim 2, characterized in that: The automatic assembly equipment also includes a third carrier conveying device, a magnetic circuit component picking and placing device, a magnetizing station and a magnetic circuit component conveying device. The third carrier conveying device is used to convey the carrier carrying the magnetic circuit component output from the heating station. The magnetic circuit component picking and placing device picks up the magnetic circuit component conveyed by the third carrier conveying device and places it in the magnetizing station for magnetization, and takes the magnetized magnetic circuit component out of the magnetizing station and places it in the magnetic circuit component conveying device.

4. The automatic assembly equipment according to claim 3, characterized in that: The magnetic circuit component conveying device is provided with two non-magnetizable limit bars extending along the transmission direction of the magnetic circuit component conveying device and arranged side by side with each other. The magnetic circuit component conveying device places at least two picked-up magnetic circuit components between the two non-magnetizable limit bars, so that the at least two magnetic circuit components are separated from each other between the two non-magnetizable limit bars along the transmission direction of the magnetic circuit component conveying device under the action of their own magnetic repulsion force.

5. The automatic assembly equipment according to claim 1, characterized in that: The automatic assembly equipment also includes a carrier loading station and an empty-load detection mechanism. The carrier loading station is used to transfer the carrier to the first carrier conveying device. The empty-load detection mechanism is used to detect whether the carrier is in an empty-load state in which the magnetic circuit component has been removed before the carrier is transferred to the first carrier conveying device, and generate a first alarm signal when the detection result is a non-empty-load state.

6. The automatic assembly equipment according to any one of claims 1 to 5, characterized in that: The magnetic cover vibration plate includes a feeding track, and the magnetic cover is transported along the feeding track. The screening mechanism is a sawtooth portion arranged on the feeding track, so that when the magnetic cover passes through the sawtooth portion, the magnetic cover with the accommodating cavity facing downward falls from the sawtooth portion under the action of its own gravity, and the magnetic cover with the accommodating cavity facing upward passes through the sawtooth portion.

7. The automatic assembly equipment according to claim 6, characterized in that: The magnetic cover vibration plate includes a cover mechanism, which covers the feeding track downstream of the screening mechanism so that the magnetic cover screened by the screening mechanism can be transferred between the cover mechanism and the feeding track. The feeding track and the cover mechanism are gradually turned over. The magnetic cover with the accommodating cavity facing upwards screened by the screening mechanism is gradually turned over to have the accommodating cavity facing downwards under the action of the cover mechanism and the feeding track.

8. The automatic assembly equipment according to claim 7, characterized in that: The cover mechanism and the feeding track are arranged so that the magnetic cover is pre-flipped at a certain angle on the feeding track before entering between the cover mechanism and the feeding track, so as to allow the magnetic cover to fall from the feeding track when the pushing force borne by the magnetic cover is greater than a certain threshold.

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