A non-welding device test assembly board

Abstract

The invention discloses a non-welding device test assembly board, including a test circuit board and a test fixture, a fuse test circuit is horizontally arranged on the test circuit board, the end of the fuse test circuit is an external wiring lead-out terminal, holes are provided at the two ends of the fuse test circuit, the inside of the hole is connected to the fuse test circuit, a pad is connected to the middle of the fuse test circuit, an electrostatic protector test circuit is vertically arranged on the test circuit board, the lower end of the electrostatic protector test circuit has an electrostatic gun striking area, and the upper end is a radio frequency terminal welding area, the test fixture includes a copper sheet body, a spring is connected inside the copper sheet body, a copper contact sheet is suspended on the spring, a device is placed between the copper contact sheet and the copper sheet body, and the test fixture is welded on the pad. When the present invention evaluates and tests the device, welding is not required, and the test is performed by a crimping contact method, so as to avoid the device from being scrapped, and the device can be reused, saving costs.

Description

Technical Field

[0001] The invention relates to the field of electronic component testing, in particular to a non-welding component testing assembly board. Background Art

[0002] Passive protection components such as ESD suppressors and FUSE are manufactured using thick film printing technology. During the manufacturing process, the products cannot be soldered, so the products cannot be evaluated. If any defects are found after the finished products are manufactured, the entire batch must be scrapped, wasting a lot of time and cost.

[0003] When using the existing test board to test passive protection components, the device needs to be soldered on the test board; if the device needs to be analyzed after the test, it needs to be blown off from the test board with a heat sealing gun, which causes certain damage to the pads and the device, and the device is basically scrapped, while the test board can only be used up to 3 times; the pad surface of this welding test board needs to be gold-plated, which is relatively expensive, and the test board cannot be reused, resulting in a lot of waste in production costs. Summary of the invention

[0004] In order to solve the above technical problems, the purpose of the present invention is to provide a non-welding device test combination board. When evaluating and testing the device, no welding is required and the test can be performed directly by crimping contact, thus avoiding the scrapping of the device and the device can be reused to save costs.

[0005] In order to achieve the above technical objectives and the above technical effects, the present invention is implemented through the following technical solutions: a non-welding device test combination board, comprising a test circuit board and a test fixture, a fuse test circuit is horizontally arranged on the test circuit board, the end of the fuse test circuit is an external wiring lead-out terminal, holes are provided at the two ends of the fuse test circuit, and the holes are through holes, the inside of the holes is connected to the fuse test circuit, and the middle of the fuse test circuit is connected to a pad through a conductive circuit, and an electrostatic protector test circuit is also longitudinally arranged on the test circuit board, the lower end of the electrostatic protector test circuit has an electrostatic gun striking area, and the upper end of the electrostatic protector test circuit is a radio frequency terminal welding area, and the radio frequency terminal welding area is welded to a terminal for connecting an oscilloscope, the test fixture comprises a copper sheet body, a spring is connected inside the copper sheet body, a copper contact sheet is suspended on the spring, and the copper contact sheet and the copper sheet body are used to place the device to be tested, and the test fixture is welded on the pad.

[0006] In the above technical solution, the test circuit board is a PCB board, and the surface of the PCB board is covered with copper foil and then etched to form a fuse test circuit and an electrostatic protector test circuit.

[0007] As a further improvement of the above technical solution, the surfaces of the fuse test circuit and the electrostatic protector test circuit are gold-plated.

[0008] As a further improvement of the above technical solution, a tin layer is sprayed inside the hole, and the tin layer is further gold-plated.

[0009] In the above technical solution, the copper sheet body has a top, a bottom and a vertical portion, the spring is welded on the top of the copper sheet body, and the device to be tested is placed between the copper contact sheet and the bottom of the copper sheet body.

[0010] In the above technical solution, a plurality of test fixtures are welded on the pad.

[0011] As a further improvement of the above technical solution, the copper sheet body is plated with a silver layer.

[0012] The beneficial effects of the present invention are:

[0013] (1) When the test assembly board is used, the device to be tested is placed between the copper contact sheet of the test fixture and the bottom of the copper sheet body. With the cooperation of the spring, the device is connected to the test circuit board through the test fixture by means of crimping contact, thereby achieving evaluation and testing of the device without the need for welding, thereby avoiding the scrapping of the device. The test board can be reused, saving costs.

[0014] (2) A spring is provided in the test fixture so that the size of the device placed in the test fixture can be adjusted, which is suitable for devices of different sizes. There is no need to remake the test board due to changes in device size;

[0015] (3) The device to be tested can be a finished product or a semi-finished product. As long as the surface electrodes of the semi-finished device are printed, the test combination board can be used for evaluation, without the need for electroplating the terminal electrodes during production;

[0016] (4) The process of evaluating and testing the device using the test assembly board of the present invention is simple, and defective products can be found in time, thus avoiding waste of materials and time;

[0017] (5) After the device evaluation and testing is completed, the device can be directly removed from the test assembly board without damaging the pads and device appearance;

[0018] (6) The test combination board can be applied to the evaluation of different types of devices and has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of a test circuit board in a non-welding device test assembly board of the present invention.

[0020] Figure 2It is a schematic diagram of the structure of the test fixture in the non-welding device test assembly board of the present invention. DETAILED DESCRIPTION

[0021] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0022] like Figure 1 and Figure 2 As shown, a non-welding device test assembly board includes a test circuit board 1 and a test fixture 2. A fuse test circuit 11 is horizontally arranged on the test circuit board 1. The ends of the fuse test circuit 11 are external wiring lead-out terminals. Holes 111 are provided at both ends of the fuse test circuit 11. The holes 111 are through holes. The inside of the holes 111 is connected to the fuse test circuit 11. The middle of the fuse test circuit 11 is connected to a solder pad 113 through a conducting circuit 112. The test circuit board 1 is also vertically arranged There is an electrostatic protector test circuit 12, the lower end of which has an electrostatic gun hitting area 121, the upper end of which is an RF terminal welding area, and the RF terminal welding area is welded for connecting the terminal of the oscilloscope. The test fixture 2 includes a copper sheet body 21, a spring 22 is connected to the copper sheet body 21, a copper contact sheet 23 is suspended on the spring 22, and the device to be tested is placed between the copper contact sheet 23 and the copper sheet body 21, and the test fixture 2 is welded on the pad 113.

[0023] The test circuit board 1 is a PCB board, the surface of which is covered with copper foil and then etched to form a fuse test circuit 11 and an electrostatic protector test circuit 12, and then the surfaces of the fuse test circuit 11 and the electrostatic protector test circuit 12 are gold plated.

[0024] In order to achieve conduction between the inside of the hole 111 and the fuse test circuit 11, a tin layer is sprayed inside the hole 111, and the tin layer is gold-plated. The external wiring lead-out end of the fuse test circuit 11 is connected to an external power supply, and the external power supply is connected to the test circuit board 1 through the fuse test circuit 11 and the hole 111.

[0025] The copper sheet body 21 has a top, a bottom and a vertical portion, the spring 22 is welded on the top of the copper sheet body 21 , and the device to be tested is placed between the copper contact sheet 23 and the bottom of the copper sheet body 21 .

[0026] A plurality of test fixtures 2 can be welded on the welding pad 113. When welding the test fixtures 2, the distance between the test fixtures can be adjusted by moving the welding points, so that it can be suitable for devices of different sizes.

[0027] In addition, the test fixture 2 is made of copper-plated silver material, which has relatively small resistance and does not affect the conductive performance, and can fully meet the needs of device testing.

[0028] When in use, the chip fuse is placed between the copper contact piece 23 of the test fixture 2 and the bottom of the copper sheet body 21. Under the action of the spring 22, the copper contact piece 23 is crimped to the chip fuse, and the iron sheet fuse is in contact with the bottom of the copper sheet body 21; the external wiring lead-out terminal of the fuse test circuit 11 is connected to the external power supply, so that the external power supply is connected to the test circuit board 1, and the test circuit board 1 is connected to the chip fuse through the solder pad 113 and the test fixture 2, so as to test and evaluate the chip fuse. After the test and evaluation are completed, the chip fuse can be directly removed from the test fixture 2. When testing the ESD protector, place the ESD protector in the test fixture 2, connect the ground wire to the hole 111 on the fuse test circuit 11, use an ESD gun to hit the ESD gun hitting area 121 of the ESD protector test circuit 12, weld the terminals in the RF terminal welding area, connect the terminals to the oscilloscope, test the ESD protector, and capture the test image on the oscilloscope to evaluate the performance of the ESD protector.

[0029] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A non-welding device test assembly board, characterized in that: It comprises a test circuit board and a test fixture, wherein a fuse test circuit is horizontally arranged on the test circuit board, the end of the fuse test circuit is an external wiring lead-out terminal, holes are provided at two ends of the fuse test circuit, and the holes are through holes, the inside of the holes is connected to the fuse test circuit, and the middle of the fuse test circuit is connected to a pad through a conducting circuit, and an electrostatic protector test circuit is also longitudinally arranged on the test circuit board, the lower end of the electrostatic protector test circuit has an electrostatic gun striking area, the upper end of the electrostatic protector test circuit is a radio frequency terminal welding area, and the radio frequency terminal welding area is welded to a terminal for connecting an oscilloscope, and the test fixture comprises a copper sheet main body, a spring is connected inside the copper sheet main body, a copper contact sheet is suspended on the spring, and a device to be tested is placed between the copper contact sheet and the copper sheet main body, and the test fixture is welded on the pad; The test circuit board is a PCB board, the surface of which is covered with copper foil and then etched to form a fuse test circuit and an electrostatic protector test circuit; the surfaces of the fuse test circuit and the electrostatic protector test circuit are gold-plated.

2. A non-welding device test assembly board according to claim 1, characterized in that: A tin layer is sprayed inside the hole, and the tin layer is further gold-plated.

3. The non-welding device test assembly board according to claim 1, characterized in that: The copper sheet body has a top, a bottom and a vertical portion, the spring is welded on the top of the copper sheet body, and the device to be tested is placed between the copper contact sheet and the bottom of the copper sheet body.

4. The non-welding device test assembly board according to claim 1, characterized in that: A plurality of test fixtures are welded on the welding pad.

5. The non-welding device test assembly board according to claim 1, characterized in that: The copper sheet body is plated with a silver layer.

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