A new type of communication antenna radiator

Abstract

A new type of communication antenna radiator belongs to the field of antennas. It includes a main body, a MIMO chip and a heat sink; the top surface of the main body is equipped with a MIMO chip, the side surface of the main body includes a symmetrically arranged end face A and a symmetrically arranged end face B, an end face C is arranged between adjacent end faces A and B, end face A is plugged with multiple heat sinks in a vertical direction, end face B and end face C are both provided with multiple grooves A, and between adjacent grooves A is a sheet-like boss A in a horizontal direction, the bottom surface of the main body is also provided with multiple grooves B, between grooves B is a sheet-like boss B in a horizontal direction, a support frame is also installed on the side surface of the main body, and the main body and the heat sink are covered with a heat dissipation film. The present invention has simple materials, long replacement cycle, small volume, high heat dissipation efficiency, and adopts a multi-layer three-dimensional ply design to dissipate heat, which greatly improves the heat dissipation efficiency.

Description

Technical Field

[0001] The invention relates to the field of antennas, and in particular to a novel communication antenna radiator. Background Art

[0002] Against the backdrop of rapid development in the fields of big data, artificial intelligence, the Internet of Things, and driverless cars, communication systems are gradually transitioning to the fifth generation of mobile communication technology. With the growing demand for mobile data and the development of mobile Internet, more and more devices need to access mobile networks, and new services and applications are emerging in an endless stream. As a result, 5G mobile communication technology has emerged. The performance goals of 5G are high data rate, reduced latency, energy saving, reduced costs, increased system capacity, and large-scale device connections. In order to achieve the above functions, the core technology of 5G is MIMO technology. MIMO (Multiple-Input Multiple-Output) technology refers to the use of multiplexing at the transmitting and receiving ends. Using multiple transmitting antennas and receiving antennas, the signal is transmitted and received through multiple antennas at the transmitting end and the receiving end, thereby improving the communication quality. It can make full use of spatial resources and achieve multiple transmission and multiple reception through multiple antennas. Without increasing spectrum resources and antenna transmission power, the system channel capacity can be doubled, showing obvious advantages. Generally speaking, ordinary base stations need to be equipped with 3 antennas, and 4G base stations need to be configured with 2×2 antennas (that is, 2 receiving antennas and 2 transmitting antennas). In the future, as 4G continues to evolve to 4.5G and 5G is implemented, the large-scale application of massive MIMO base stations (128, 256 or even more antennas) will lead to an explosive growth in the number of base station antennas, so 5G One of the severe challenges that Massive MIMO antenna engineering applications will face is heat dissipation. At the same time, communication base station equipment is increasingly developing towards large capacity, high power, and high integration. The heat consumption density of the system is getting higher and higher, and the environmental adaptability requirements are getting higher and higher, while the volume is getting smaller and smaller. Thermal reliability has gradually become a bottleneck in reliability design. Therefore, while solving the waterproof and dustproof problems of outdoor base stations, the ventilation and heat dissipation problems of equipment have become an important topic in the design of outdoor base station structure systems. The heat dissipation problem not only involves the design of the heat sink, but also a more important issue is the selection of heat sink materials. The radiator mainly conducts heat energy. It must not only have good heat dissipation capabilities to keep the machine running smoothly, but also diffuse the excess heat energy. Therefore, the material of the radiator is particularly important. Summary of the invention

[0003] In order to solve the problem that the existing radiator cannot meet the heat dissipation demand of the communication antenna, the present invention provides a novel communication antenna radiator.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a new type of communication antenna radiator, including a main body, a MIMO chip and a heat sink; a MIMO chip is installed on the top surface of the main body, and the side surface of the main body includes a symmetrically arranged end face A and a symmetrically arranged end face B, and an end face C is arranged between the adjacent end faces A and B, and the end face A is plugged with a plurality of vertical heat sinks, and the end faces B and the end faces C are both provided with a plurality of grooves A, and the adjacent grooves A are provided with a horizontal sheet-like boss A, and the bottom surface of the main body is also provided with a plurality of grooves B, and the grooves B are provided with a horizontal sheet-like boss B, and a support frame is also installed on the side surface of the main body, and the main body and the heat sink are covered with a heat dissipation film.

[0005] Furthermore, the MIMO chips are arranged in a 4X8 dot matrix, and the MIMO chips are connected to the main body by soldering.

[0006] Furthermore, the end surface A is provided with a placement groove for placing the heat sink, and the end surface of the placement groove is provided with a semicircular slot for plugging the heat sink, and the gap after the heat sink is inserted into the slot is filled with silicone thermal conductive gel, and the outer end surface of the heat sink and the end surface A are located in the same plane.

[0007] Furthermore, the end surface C is a curved surface structure.

[0008] Furthermore, the support frame is a copper tube, and is provided with a plurality of grooves C connected to the sheet-like bosses A. The support frame is connected to the main body by screws.

[0009] Furthermore, the main body is made of carbon fibers stacked layer by layer.

[0010] Furthermore, the heat sink is made of copper alloy.

[0011] Furthermore, the heat dissipation film is a nano-carbon heat dissipation film, and the heat dissipation film is coated with a sun-proof, rust-proof and temperature-reducing paint; the thickness of the nano-carbon heat dissipation film is 0.03mm-0.1mm.

[0012] Furthermore, the main body is provided with threaded holes for installation and fixation.

[0013] The invention has the following beneficial effects: simple material, long replacement cycle, small volume, high heat dissipation efficiency, and adopts a multi-layer three-dimensional ply design to dissipate heat, thereby greatly improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A is a structural schematic diagram of the present invention;

[0015] Figure 2 It is a structural schematic diagram B of the present invention;

[0016] Figure 3 It is a structural schematic diagram C of the present invention;

[0017] Figure 4 is a side view of the present invention;

[0018] Figure 5 A top view of the present invention;

[0019] Figure 6 It is a schematic structural diagram of the connection end of the heat sink and the slot of the present invention;

[0020] Figure 7 It is a structural schematic diagram of the threaded hole of the present invention;

[0021] Figure 8 A is a thermal analysis schematic diagram of the present invention;

[0022] Fig. 9 This is a thermal analysis schematic diagram B of the present invention.

[0023] In the figure, 1. bottom surface, 2. end surface A, 3. end surface B, 4. end surface C, 5. MIMO chip, 6. support frame, 7. threaded hole, 8. heat sink. DETAILED DESCRIPTION

[0024] A novel communication antenna radiator comprises a main body, a MIMO chip 5 and a heat sink 8; the MIMO chip 5 is mounted on the top surface of the main body, the side surface of the main body comprises a symmetrically arranged end surface A2 and a symmetrically arranged end surface B3, an end surface C4 is arranged between adjacent end surfaces A2 and B3, a plurality of heat sinks 8 in a vertical direction are plugged into the end surface A2, the end surface B3 and the end surface C4 are both provided with a plurality of grooves A, a sheet-like boss A in a horizontal direction is arranged between adjacent grooves A, a plurality of grooves B are also arranged on the bottom surface 1 of the main body, a sheet-like boss B in a horizontal direction is arranged between the grooves B, a support frame 6 is further mounted on the side surface of the main body, and the main body and the heat sink 8 are covered with a heat dissipation film; the main body and the heat sink 8 are mainly used for heat dissipation, the heat sink 8 is arranged in a vertical direction, and the sheet-like boss A is arranged in a horizontal direction, which can increase the air flow area and enhance the heat dissipation effect.

[0025] The end surface A2 is provided with a placement groove for placing the heat sink 8, and the end surface of the placement groove is provided with a semicircular slot for inserting the heat sink 8. The gap after the heat sink 8 is inserted into the slot is filled with organic silicone thermal conductive gel for bonding and fixing. The outer end surface of the heat sink 8 is located in the same plane as the end surface A2. The end of the heat sink 8 inserted into the slot is as shown in FIG. Figure 6 As shown; silicone thermally conductive gel can achieve efficient heat dissipation of the chipset and also has excellent wettability to ensure low contact resistance for thermal management. It can be processed in a variety of ways and has low viscosity and good wettability.

[0026] The MIMO chip 5 is arranged in a 4X8 dot matrix, so as to perform range heat dissipation on 32 array elements, thereby achieving the effect of rapidly reducing the temperature. The MIMO chip 5 is connected to the main body by soldering.

[0027] The end surface C4 is a curved surface structure.

[0028] The support frame 6 is a copper tube, and is provided with a plurality of grooves C connected to the sheet-like bosses A. The support frame 6 is connected to the main body by screws, and the support frame 6 plays a role in fixing the carbon fiber main body.

[0029] The main body is made of carbon fiber stacked layer by layer. The carbon fiber is formed by closed die forging process. The specific forming steps are: laying-film closing-film injection-film stripping. Compared with ABS, fiberglass and other materials, carbon fiber has many excellent properties such as high strength, high modulus, high temperature resistance, wear resistance, fatigue resistance, corrosion resistance, creep resistance, electrical conductivity and thermal conductivity, which can reduce the weight of components. It also has many excellent properties that cannot be matched by metal, PTC and other electric heating bodies: rapid heating, high electric heat conversion efficiency, energy saving, stable chemical properties, corrosion resistance, not easy to be oxidized, and its mechanical properties do not change when heated to 3000 degrees in the absence of oxygen. In the electric heating state, it overcomes the shortcomings of low strength and easy oxidation and burning of metal wire, PTC and silicon carbide electric heating bodies, and has a long service life.

[0030] The heat sink 8 is made of copper alloy, preferably molybdenum-copper alloy, which is injection molded. The specific process steps are: determine the composition of the alloy and then weigh the W powder and Cu powder, and obtain the W-Cu alloy heat sink through mechanical mixing-ball milling-injection molding-sintering. It has excellent electrical conductivity, thermal conductivity, ductility and corrosion resistance, and the thermal conductivity coefficient reaches 524w / mk. It is simple to process and has universality.

[0031] The heat dissipation film adopts nano-carbon heat dissipation film for efficient heat dissipation, and the heat dissipation film is coated with a sunscreen, anti-rust and cooling coating to increase the heat dissipation efficiency; the thickness of the nano-carbon heat dissipation film is 0.03mm-0.1mm; the nano-carbon heat dissipation film is produced by molten salt electrodeposition, which does not require large equipment and precious materials, is low-cost, simple to operate, and does not require hazardous gases or produce harmful substances during the process, which is environmentally friendly. The prepared heat dissipation film is pure, single and evenly distributed on the surface of the substrate; the heat dissipation film has a unique grain orientation, uniform heat conduction in two directions, and the lamellar structure can adapt well to any surface, shielding heat sources and components while improving the performance of electronic products. In addition, the nano-carbon heat dissipation film has excellent thermal conductivity, light specific gravity, low thermal resistance, soft and easy to cut (can be bent repeatedly), and ultra-thin. The surface can be combined with other materials such as metal, plastic, and self-adhesive. More importantly, the cost of the nano-carbon heat dissipation film is not high, and the market price is much lower than that of artificial graphite, and even cheaper than the price of some natural graphite; the sunscreen, anti-rust and cooling coating adopts td2200 to play a protective role.

[0032] The main body is provided with threaded holes 7 for mounting and fixing the present embodiment with other components.

[0033] The dimensions of this embodiment are: less than 68 mm in length, less than about 40 mm in width, and less than about 30 mm in height; it has good electromagnetic compatibility, overvoltage protection, good signal coverage, relatively low technical requirements, relatively energy-saving for terminal equipment, cost saving, simple materials, and long equipment replacement cycle.

[0034] This embodiment also performed thermal analysis using Ansys. Figure 8 and Fig. 9 , establish the model of this embodiment and input the thermal conductivity of each material: carbon fiber: 700w / mk, copper tube: 377w / mk, silicone thermal conductive gel: 0.95w / mk, molybdenum-copper alloy heat sink: 218w / mk, nano-carbon heat dissipation film: 1000-6000w / mk. Under normal temperature, the highest temperature of this embodiment is 214.11 degrees Celsius and the lowest temperature is 148.58 degrees Celsius, which meets the heat dissipation requirements of the MIMO chip 5.

[0035] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A new communication antenna radiator, characterized in that: The device comprises a main body, a MIMO chip (5) and a heat sink (8); the top surface of the main body is provided with a MIMO chip (5); the side surface of the main body comprises a symmetrically arranged end surface A (2) and a symmetrically arranged end surface B (3); an end surface C (4) is arranged between adjacent end surfaces A (2) and B (3); a plurality of heat sinks (8) in a vertical direction are plugged into the end surface A (2); the end surfaces B (3) and C (4) are both provided with a plurality of grooves A; a sheet-like boss A in a horizontal direction is formed between adjacent grooves A; the bottom surface (1) of the main body is also provided with a plurality of grooves B; a sheet-like boss B in a horizontal direction is formed between the grooves B; a support frame (6) is also arranged on the side surface of the main body; and the main body and the heat sink (8) are covered with a heat dissipation film; The heat sink (8) is made of W-Cu alloy; The end surface A (2) is provided with a placement groove for placing the heat sink (8), the end surface of the placement groove is provided with a semicircular slot for inserting the heat sink (8), the gap after the heat sink (8) is inserted into the slot is filled with organic silicone thermal conductive gel, and the outer end surface of the heat sink (8) and the end surface A (2) are located in the same plane; The heat dissipation film adopts a nano-carbon heat dissipation film, and the heat dissipation film is coated with a sun-proof, rust-proof and cooling paint; the thickness of the nano-carbon heat dissipation film is 0.03mm-0.1mm; The MIMO chips (5) are arranged in a 4×8 dot matrix, and the MIMO chips (5) are connected to the main body by soldering; The support frame (6) is a copper tube, and is provided with a plurality of grooves C connected to the sheet-shaped boss A. The support frame (6) is connected to the main body by screws; The main body is made of carbon fibers stacked layer by layer, and the carbon fibers are formed by a closed die forging process, wherein the specific forming steps are: layering-film closing-film injection-film stripping.

2. A new communication antenna radiator according to claim 1, characterized in that: The end surface C (4) is a curved surface structure.

3. A new communication antenna radiator according to claim 1, characterized in that: The main body is provided with a threaded hole (7) for installation and fixing.

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