A dynamic monitoring and fault warning system for equipment

Abstract

The present invention discloses a dynamic monitoring and fault warning system for equipment, including an equipment working state acquisition system, an equipment state information processing system and an equipment state information transmission system. The equipment working state acquisition system includes a working current signal acquisition module, a vibration speed signal acquisition module and a working temperature signal acquisition module. The equipment state information processing system is used to process the working current signal, the vibration speed signal and the working temperature signal collected by the equipment working state acquisition system and transmit them to other equipment or a control center through the equipment state information transmission system. The present invention can monitor the equipment state in real time and warn of faults, and has the advantages of low cost, high integration, small size, support for data communication and support for secondary intelligent development.

Description

Technical Field

[0001] The present invention relates to the field of equipment monitoring, and in particular to an equipment dynamic monitoring and fault early warning system. Background Art

[0002] The equipment status monitoring systems currently available on the market often only monitor specific functions, cannot perform secondary development, and cannot further process and analyze the collected signals. In addition, the systems on the market do not support data communication functions and cannot share data with other devices or control centers. In order to ensure the normal operation of the equipment, it is often necessary to measure multiple working indicators at the same time. For example, to monitor the working status of the fan, it is necessary to collect its working current, vibration speed, and working temperature. At present, there is no system on the market that can monitor these three indicators at the same time. That is, if you want to complete the monitoring of these three indicators, you need to purchase the corresponding monitoring and early warning systems separately, which is very inconvenient to use. If the relevant status monitoring systems already available on the market are used, especially if the three systems are assembled into a set of equipment working status monitoring systems, the volume is large and inconvenient to install, which exceeds the factory's acceptance range.

[0003] In summary, the existing solutions on the market have the disadvantages of high production cost, large size, low integration, no support for secondary development and no support for data communication, which is not conducive to the promotion, sales, installation and intelligent development of the system. Summary of the invention

[0004] The purpose of the present invention is to provide a dynamic monitoring and fault warning system for equipment to solve the above problems in view of the deficiencies in the prior art.

[0005] The technical problem solved by the present invention can be achieved by adopting the following technical solutions:

[0006] A dynamic monitoring and fault warning system for equipment includes an equipment working status acquisition system, an equipment status information processing system and an equipment status information transmission system. The equipment working status acquisition system includes a working current signal acquisition module, a vibration speed signal acquisition module and a working temperature signal acquisition module. The equipment status information processing system is used to process the working current signal, vibration speed signal and working temperature signal collected by the equipment working status acquisition system and transmit them to other equipment or a control center through the equipment status information transmission system.

[0007] Furthermore, the working current signal acquisition module includes a current-voltage conversion circuit, a voltage shift circuit, a voltage follower and a clamping circuit connected in sequence. The current-voltage conversion circuit is used to convert the current signal into an AC voltage signal, and the voltage shift circuit is used to convert the AC voltage signal into a DC voltage signal. The clamping circuit is connected to the device status signal processing module, and the clamping circuit is used to prevent damage to the device status signal processing module.

[0008] Further, the current-to-voltage conversion circuit includes an op amp U6, a capacitor C60 and a resistor R62, the voltage shift circuit includes an op amp U7, a resistor R61, a resistor R63, a resistor R64, a resistor R65 and a resistor R66, the clamping circuit includes a capacitor C54, a diode D10 and a diode D11, the capacitor C60 and the resistor R62 are connected in parallel and the two ends of the parallel connection are respectively connected to the 2nd pin and the 6th pin of the op amp U6, the 6th pin of the op amp U6 is connected to the 2nd pin of the op amp U7 through the resistor R63, the 3rd pin of the op amp U7 is grounded through the resistor R64, and the two ends of the resistor R61 are respectively connected to the 2nd pin and the 6th pin of the op amp U7. 6 pins; one end of the resistor R65 is connected to the 6 pins of the operational amplifier U7, the other end of the resistor R65 is respectively connected to one end of the resistor R66, the other end of the resistor R66 is connected to the +5V voltage, the other end of the resistor R65 is also connected to one end of the resistor R67 through the voltage follower U8, the other end of the resistor R67 is respectively connected to one end of the capacitor C54, the cathode of the diode D10 and the anode of the diode D11, the cathode of the diode D11 is connected to the +5V voltage, the anode of the diode D10 and the other end of the capacitor C54 are both grounded; the cathode of the diode D10 is also connected to the device status information processing system.

[0009] Furthermore, the vibration velocity signal acquisition module includes a slot P3, a capacitor C80, a capacitor C81, a resistor R80, a resistor R81 and a Zener diode D4, one end of the resistor R80, one end of the resistor R81 and one end of the capacitor C80 are all connected to the slot, the other end of the capacitor C80 and the other end of the resistor R81 are both grounded, the other end of the resistor R80 is respectively connected to one end of the capacitor C81 and the negative electrode of the Zener diode D4, the other end of the capacitor C81 and the positive electrode of the Zener diode D4 are both grounded, and the other end of the resistor R80 is also connected to the equipment status information processing system.

[0010] Furthermore, the working temperature signal acquisition module includes a slot P2, a capacitor C85, a capacitor C51, a resistor R56, a resistor R85 and a Zener diode D3, one end of the resistor R85, one end of the resistor R56 and one end of the capacitor C85 are all connected to the slot, the other end of the capacitor C85 and the other end of the resistor R56 are both grounded, the other end of the resistor R85 is respectively connected to one end of the capacitor C51 and the negative electrode of the Zener diode D3, the other end of the capacitor C51 and the positive electrode of the Zener diode D3 are both grounded, and the other end of the resistor R85 is also connected to the equipment status information processing system.

[0011] Further, the device status information processing system includes a single-chip microcomputer ZU4, a USB-to-serial port chip U3, a resistor R6, a resistor R11, a resistor R12, a resistor R13, a resistor R14, a resistor R15, a diode D2, a capacitor C6, and two light-emitting diodes. Pin 31 of the single-chip microcomputer ZU4 is connected to the device status information transmission system, and pins 24, 25, and 26 of the single-chip microcomputer ZU4 are respectively connected to a working current signal acquisition module, a vibration speed signal acquisition module, and a working temperature signal acquisition module; pin 29 of the single-chip microcomputer ZU4 is respectively connected to a +5V voltage through a diode D2 and a resistor R6, and pin 29 of the single-chip microcomputer ZU4 is also grounded through a patch button. One end of capacitor C6 is connected to pin 29 of microcontroller ZU4, and the other end of capacitor C6 is respectively connected to one end of resistor R11 and pin 13 of USB-to-serial port chip U3, the other end of resistor R11 is grounded, pin 3 of USB-to-serial port chip U3 is connected to one end of resistor R14, the other end of resistor R14 is connected to pin 31 of microcontroller ZU4, and the other end of resistor R14 is also connected to +5V voltage via a light emitting diode and resistor R13; pin 2 of USB-to-serial port chip U3 is connected to +5V voltage via another light emitting diode and resistor R12, and pin 2 of USB-to-serial port chip U3 is also connected to pin 30 of microcontroller ZU4 via resistor R15.

[0012] Furthermore, the device status information transmission system includes an interface chip U4, a slot P50, a resistor R51, a resistor R52, a resistor R53, a resistor R54, a resistor R55, a resistor R57, a resistor R76 and a transistor Q50, the base of the transistor Q50 is connected to the device status information processing system through the resistor R52, the emitter of the transistor Q50 is grounded, the collector of the transistor Q50 is respectively connected to one end of the resistor R76 and the 2nd pin and the 3rd pin of the interface chip U4, the other end of the resistor R76 is respectively connected to one end of the resistor R51 and one end of the resistor R53, and the other end of the resistor R53 is connected to the device status information processing system. The other end of the resistor R51 is connected to the pin 1 of the interface chip U4, and the pin 1 of the interface chip U4 is also connected to the device status information processing system; the pin 1 of the slot P50 and the pin 8 of the interface chip U4 are both connected to the +5V voltage, the pin 6 of the interface chip U4 is connected to the +5V voltage through the resistor R54, the pin 7 of the interface chip U4 is respectively connected to one end of the resistor R55, one end of the resistor R57 and the pin 3 of the slot P50, the other end of the resistor R55 and the pin 2 of the slot P50 are both grounded, and the pin 4 of the slot P50 is respectively connected to the other end of the resistor R57 and the pin 6 of the interface chip U4.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] The present invention can realize real-time monitoring and fault warning of the working current, working temperature and vibration state of the equipment, and realize real-time information sharing between the current equipment and other equipment or controllers. Other functions (such as more accurate warning) can be realized by designing algorithms and programming according to specific needs, that is, the scalability is strong. The present invention integrates a data communication module, and the working status information of the current equipment can be sent to other equipment or a control center through the RS485 communication protocol, so that the control center can more effectively take measures to deal with the faults of the equipment.

[0015] The present invention is a real-time monitoring and fault prediction system for equipment status with low cost, high integration, small size, complete functions and support for secondary intelligent development. The system is integrated on a circuit board with a small size, and integrates data processing modules of multiple status signals, which reduces the system cost while ensuring existing functions and adding new functions. The present invention can monitor three indicators at the same time, and is not limited to these three indicators. As long as the status sensor returns a current signal, it can be monitored by the current system, with high integration and wide applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the equipment dynamic monitoring and fault warning system described in the present invention.

[0017] Figure 2 The circuit diagram of the current-to-voltage conversion circuit of the present invention is shown in FIG.

[0018] Figure 3 This is a circuit diagram of the vibration velocity signal acquisition module described in the present invention.

[0019] Figure 4 This is a circuit diagram of the operating temperature signal acquisition module described in the present invention.

[0020] Figure 5 The circuit diagram of the device status information processing system of the present invention is shown in FIG.

[0021] Figure 6 The circuit diagram of the device status information transmission system of the present invention is shown in FIG.

[0022] Figure 7 The circuit diagram of the single chip computer system power supply of the present invention is shown in FIG. DETAILED DESCRIPTION

[0023] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0024] See also Figure 1 to Figure 7, the equipment dynamic monitoring and fault warning system described in the present invention includes an equipment working status acquisition system, an equipment status information processing system and an equipment status information transmission system. In the specific implementation process of each task, it is necessary to design the corresponding hardware system and software system according to the task requirements, and finally adopt the integration technology to form a set of equipment dynamic monitoring and fault warning systems with relatively complete functions, high integration and stable operation. The equipment working status acquisition system includes a working current signal acquisition module, a vibration velocity signal acquisition module and a working temperature signal acquisition module. The equipment status information processing system is used to process the working current signal, vibration velocity signal and working temperature signal collected by the equipment working status acquisition system, and then transmit them to other equipment or the control center through the equipment status information transmission system.

[0025] The present invention needs to realize the dynamic monitoring and fault warning functions of the working current, vibration speed and working temperature of the equipment, so the accurate real-time collection of the working status signal of the equipment is the premise of the stable operation of the system. The sensor of the working current signal acquisition module uses CTF-200A mutual inductor. Since the output of the mutual inductor is an AC current signal, in order to facilitate the central processing system to process the collected equipment working current signal, it is necessary to design a signal conditioning scheme to convert the AC current signal into a DC voltage signal. The working current signal acquisition module includes a current-voltage conversion circuit, a voltage shift circuit, a voltage follower and a diode clamping circuit connected in sequence. The current-voltage conversion circuit is used to convert the AC current signal into an AC voltage signal that is convenient for the central processing system to monitor, and the voltage shift circuit is used to convert the AC voltage signal into a DC voltage signal. U8 constitutes a voltage follower, which plays an isolation role, can isolate the single-chip microcomputer system and the signal conditioning circuit, and is convenient for impedance matching before the A / D input. The clamping circuit is connected to the equipment status signal processing module, and the clamping circuit can control the voltage to be within the range, which is used to prevent damage to the equipment status signal processing module and prevent the A / D input voltage from crossing the boundary.

[0026] The output of the current transformer is an AC current signal, which is more difficult to process than the acquisition and processing of DC current signals. This system converts the AC current signal into a DC voltage signal by designing corresponding modules, namely, building a current-voltage conversion circuit, a voltage shift circuit, a voltage follower, and a diode clamp circuit through an operational amplifier, so that the single-chip microcomputer system can directly acquire and output the working current to be monitored.

[0027] The current-to-voltage conversion circuit includes an operational amplifier U6, a capacitor C60, and a resistor R62. The voltage translation circuit includes an operational amplifier U7, a resistor R61, a resistor R63, a resistor R64, a resistor R65, and a resistor R66. The clamping circuit includes a capacitor C54, a diode D10, and a diode D11. The capacitor C60 and the resistor R62 are connected in parallel, and the two ends after the parallel connection are respectively connected to the 2-pin and 6-pin of the operational amplifier U6. The 6-pin of the operational amplifier U6 is connected to the 2-pin of the operational amplifier U7 through the resistor R63, and the 3-pin of the operational amplifier U7 is grounded through the resistor R64. The two ends of the resistor R61 are respectively connected to the 2-pin and 6-pin of the operational amplifier U7. One end of the resistor R65 is connected to the 6-pin of the operational amplifier U7, and the other end of the resistor R65 is respectively connected to one end of the resistor R66. The other end of the resistor R66 is connected to the +5V voltage, and the other end of the resistor R65 is also connected to one end of the resistor R67 through the voltage follower U8. Resistor R67 is a current limiting resistor to prevent damage to the single chip microcomputer system. The other end of resistor R67 is connected to one end of capacitor C54, the cathode of diode D10 and the anode of diode D11 respectively. The cathode of diode D11 is connected to +5V voltage, and the anode of diode D10 and the other end of capacitor C54 are grounded. The cathode of diode D10 is also connected to the device status information processing system.

[0028] The sensor model used for the vibration velocity signal acquisition module is SE830. The sensor outputs a DC current signal that is proportional to the working vibration velocity of the monitored equipment. In order to facilitate the central processing system to process the collected equipment working current signal, a signal conditioning solution needs to be designed to convert the DC current signal into a DC voltage signal, such as Figure 3 As shown in the figure. The vibration sensor returns a DC current signal, which cannot be directly collected by the microcontroller and needs to be converted into a voltage signal that can be processed by the microcontroller. This part of the circuit plus the microcontroller system can realize the functions of the data processing module (controller) currently on the market.

[0029] The vibration velocity signal acquisition module includes a slot P3, a capacitor C80, a capacitor C81, a resistor R80, a resistor R81 and a voltage stabilizing diode D4. One end of the resistor R80, one end of the resistor R81 and one end of the capacitor C80 are all connected to the slot. The other end of the capacitor C80 and the other end of the resistor R81 are grounded, and the other end of the resistor R80 is respectively connected to one end of the capacitor C81 and the negative electrode of the voltage stabilizing diode D4. The other end of the capacitor C81 and the positive electrode of the voltage stabilizing diode D4 are both grounded, and the other end of the resistor R80 is also connected to the device status information processing system.

[0030] Capacitors C80 and C81 play a role in filtering and noise reduction. Resistor R81 is a current point voltage conversion resistor with a resistance of 250 ohms. It can convert 4-20mA current (the current range of the sensor output) into 1-5V voltage, which meets the requirements of the single-chip microcomputer detection range. Resistor R80 is a current limiting resistor that protects the single-chip microcomputer system. The voltage regulator diode D4 prevents abnormal point voltage from exceeding the detection range of the single-chip microcomputer and damaging the single-chip microcomputer.

[0031] The sensor model of the working temperature signal acquisition module is PT100+ temperature transmitter module, which outputs 4-20mA DC current. The temperature sensor and temperature transmitter output a DC current signal that is proportional to the working temperature signal of the monitored equipment. In order to facilitate the central processing system to process the collected equipment working current signal, a signal conditioning solution needs to be designed to convert the DC current signal into a DC voltage signal, such as Figure 4 As shown in the figure. The temperature sensor returns a DC current signal, which cannot be directly collected by the microcontroller and needs to be converted into a voltage signal that can be processed by the microcontroller. This part of the circuit plus the microcontroller system can realize the functions of the data processing module (controller) currently on the market. Figure 4 The capacitors C51 and C85 in the middle and lower figures play a role in filtering and noise reduction. The resistor R56 is a current point voltage conversion resistor with a resistance of 250 ohms. It can convert 4-20mA current (the current range of the sensor output) into 1-5V voltage, which meets the requirements of the microcontroller detection range. The resistor R85 is a current limiting resistor that protects the microcontroller system. The voltage regulator diode D3 prevents abnormal point voltage from exceeding the detection range of the microcontroller and damaging the microcontroller.

[0032] The working temperature signal acquisition module includes a slot P2, a capacitor C85, a capacitor C51, a resistor R56, a resistor R85 and a voltage stabilizing diode D3. One end of the resistor R85, one end of the resistor R56 and one end of the capacitor C85 are all connected to the slot, and the other end of the capacitor C85 and the other end of the resistor R56 are all grounded. The other end of the resistor R85 is respectively connected to one end of the capacitor C51 and the cathode of the voltage stabilizing diode D3. The other end of the capacitor C51 and the anode of the voltage stabilizing diode D3 are both grounded, and the other end of the resistor R85 is also connected to the device status information processing system.

[0033] The device status information processing system includes a single-chip microcomputer ZU4, a USB to serial port chip U3, a resistor R6, a resistor R11, a resistor R12, a resistor R13, a resistor R14, a resistor R15, a diode D2, a capacitor C6, and two light-emitting diodes. Pin 31 of the single-chip microcomputer ZU4 is connected to the device status information transmission system, and pins 24, 25, and 26 of the single-chip microcomputer ZU4 are respectively connected to the working current signal acquisition module, the vibration speed signal acquisition module, and the working temperature signal acquisition module. Pin 29 of the single-chip microcomputer ZU4 is connected to the +5V voltage through diode D2 and resistor R6, and pin 29 of the single-chip microcomputer ZU4 is also grounded through a patch button. One end of capacitor C6 is connected to pin 29 of the single-chip microcomputer ZU4, and the other end of capacitor C6 is respectively connected to one end of resistor R11 and pin 13 of the USB to serial port chip U3. The other end of resistor R11 is grounded, and pin 3 of the USB to serial port chip U3 is connected to one end of resistor R14. The other end of the resistor R14 is connected to the 31st pin of the microcontroller ZU4, and the other end of the resistor R14 is also connected to the +5V voltage through a light-emitting diode and a resistor R13. The 2nd pin of the USB-to-serial port chip U3 is connected to the +5V voltage through another light-emitting diode and a resistor R12, and the 2nd pin of the USB-to-serial port chip U3 is also connected to the 30th pin of the microcontroller ZU4 through a resistor R15.

[0034] The central processing system is composed of a single-chip microcomputer ATmega328P and its peripheral circuits. Its functions include: converting the analog voltage signal output by the signal conditioning circuit into a digital signal for the single-chip microcomputer to read and process; analyzing and processing the input sensor signal according to the equipment working requirements; transmitting the collected and processed information to other equipment or the control center through the RS485 bus for fault warning and troubleshooting control.

[0035] After collection and conditioning, the working status signals of the equipment are converted into 0-5V analog voltage signals for central processing system monitoring. The central microprocessor model selected in the present invention is ATmega328P, which contains 6 analog-to-digital converters. The accuracy of the analog-to-digital converter is 10bit, so 1024 states can be read. Since the analog input pin of the processor allows the input voltage range to be 0-5V, the minimum voltage change that the processor can perceive is 4.8mv. Further, based on this, we can deduce the monitoring accuracy of the system. The single-chip microcomputer integrated with the analog-to-digital conversion module is selected to make the system more integrated and the operation more stable.

[0036] According to the requirements of each device for working current, working temperature and vibration status, design and write programs to achieve the purpose of early warning. The collected and processed information is shared with other devices or control centers through the 485 bus to meet the system early warning needs.

[0037] The device status information transmission system includes an interface chip U4, a slot P50, a resistor R51, a resistor R52, a resistor R53, a resistor R54, a resistor R55, a resistor R57, a resistor R76 and a transistor Q50. The base of the transistor Q50 is connected to the device status information processing system through the resistor R52, and the emitter of the transistor Q50 is grounded. The collector of the transistor Q50 is respectively connected to one end of the resistor R76 and the 2nd and 3rd pins of the interface chip U4, and the other end of the resistor R76 is respectively connected to one end of the resistor R51 and one end of the resistor R53. The other end of the resistor R53 is connected to the device status information processing system, and the other end of the resistor R51 is connected to the 1st pin of the interface chip U4. The 1st pin of the interface chip U4 is also connected to the device status information processing system. The 1st pin of the slot P50 and the 8th pin of the interface chip U4 are both connected to the +5V voltage, and the 6th pin of the interface chip U4 is connected to the +5V voltage through the resistor R54. Pin 7 of the interface chip U4 is connected to one end of the resistor R55, one end of the resistor R57 and pin 3 of the slot P50. The other end of the resistor R55 and pin 2 of the slot P50 are both grounded. Pin 4 of the slot P50 is connected to the other end of the resistor R57 and pin 6 of the interface chip U4.

[0038] This system uses RS485 bus to transmit information between different devices and control center, and uses max485 chip to convert TTL level to RS485 level. Generally, a GPIO of microcontroller is needed to control the sending and receiving mode. This project uses transistor to control, such as Figure 6 As shown. In order to reduce the volume and improve the integration, this project integrates these three parts, designs and produces a complete set of equipment status monitoring and fault warning system. The figure below is the hardware circuit design of the system. In the process of implementing the integrated technology, this project reduces the mutual interference between the three signals as much as possible by reasonably laying out the power lines and signal lines. The power lines of the present invention each form a closed return, which can effectively reduce the interference caused by power supply noise on the normal operation of the sensor and data transmission.

[0039] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A dynamic monitoring and fault warning system for equipment, characterized in that: It includes an equipment working status acquisition system, an equipment status information processing system and an equipment status information transmission system. The equipment working status acquisition system includes a working current signal acquisition module, a vibration speed signal acquisition module and a working temperature signal acquisition module. The equipment status information processing system is used to process the working current signal, vibration speed signal and working temperature signal collected by the equipment working status acquisition system and transmit them to other equipment or a control center through the equipment status information transmission system. The working current signal acquisition module includes a current-voltage conversion circuit, a voltage shift circuit, a voltage follower and a clamping circuit which are connected in sequence. The current-voltage conversion circuit is used to convert the current signal into an AC voltage signal. The voltage shift circuit is used to convert the AC voltage signal into a DC voltage signal. The clamping circuit is connected to the device status signal processing module, and the clamping circuit is used to prevent damage to the device status signal processing module. The vibration velocity signal acquisition module includes a slot P3, a capacitor C80, a capacitor C81, a resistor R80, a resistor R81 and a zener diode D4, one end of the resistor R80, one end of the resistor R81 and one end of the capacitor C80 are all connected to the slot, the other end of the capacitor C80 and the other end of the resistor R81 are both grounded, the other end of the resistor R80 is respectively connected to one end of the capacitor C81 and the negative electrode of the zener diode D4, the other end of the capacitor C81 and the positive electrode of the zener diode D4 are both grounded, and the other end of the resistor R80 is also connected to the equipment status information processing system.

2. The equipment dynamic monitoring and fault early warning system according to claim 1 is characterized in that: The current-to-voltage conversion circuit includes an operational amplifier U6, a capacitor C60, and a resistor R62; the voltage translation circuit includes an operational amplifier U7, a resistor R61, a resistor R63, a resistor R64, a resistor R65, and a resistor R66; the clamping circuit includes a capacitor C54, a diode D10, and a diode D11; the capacitor C60 and the resistor R62 are connected in parallel, and the two ends of the parallel connection are respectively connected to the 2nd pin and the 6th pin of the operational amplifier U6; the 6th pin of the operational amplifier U6 is connected to the 2nd pin of the operational amplifier U7 through the resistor R63; the 3rd pin of the operational amplifier U7 is grounded through the resistor R64; the two ends of the resistor R61 are respectively connected to the 2nd pin and the 6th pin of the operational amplifier U7; pin; one end of the resistor R65 is connected to the 6-pin of the operational amplifier U7, the other end of the resistor R65 is respectively connected to one end of the resistor R66, the other end of the resistor R66 is connected to the +5V voltage, the other end of the resistor R65 is also connected to one end of the resistor R67 through the voltage follower U8, the other end of the resistor R67 is respectively connected to one end of the capacitor C54, the cathode of the diode D10 and the anode of the diode D11, the cathode of the diode D11 is connected to the +5V voltage, the anode of the diode D10 and the other end of the capacitor C54 are both grounded; the cathode of the diode D10 is also connected to the device status information processing system.

3. The equipment dynamic monitoring and fault early warning system according to claim 1 is characterized in that: The working temperature signal acquisition module includes a slot P2, a capacitor C85, a capacitor C51, a resistor R56, a resistor R85 and a Zener diode D3. One end of the resistor R85, one end of the resistor R56 and one end of the capacitor C85 are all connected to the slot, the other end of the capacitor C85 and the other end of the resistor R56 are both grounded, the other end of the resistor R85 is respectively connected to one end of the capacitor C51 and the negative electrode of the Zener diode D3, the other end of the capacitor C51 and the positive electrode of the Zener diode D3 are both grounded, and the other end of the resistor R85 is also connected to the equipment status information processing system.

4. The equipment dynamic monitoring and fault early warning system according to claim 1 is characterized in that: The device status information processing system includes a single-chip microcomputer ZU4, a USB to serial port chip U3, a resistor R6, a resistor R11, a resistor R12, a resistor R13, a resistor R14, a resistor R15, a diode D2, a capacitor C6, and two light-emitting diodes. Pin 31 of the single-chip microcomputer ZU4 is connected to the device status information transmission system, and pins 24, 25 and 26 of the single-chip microcomputer ZU4 are respectively connected to a working current signal acquisition module, a vibration speed signal acquisition module and a working temperature signal acquisition module; pin 29 of the single-chip microcomputer ZU4 is respectively connected to a +5V voltage through a diode D2 and a resistor R6, and pin 29 of the single-chip microcomputer ZU4 is also grounded through a patch button. Capacitor C One end of capacitor C6 is connected to pin 29 of microcontroller ZU4, the other end of capacitor C6 is respectively connected to one end of resistor R11 and pin 13 of USB-to-serial port chip U3, the other end of resistor R11 is grounded, pin 3 of USB-to-serial port chip U3 is connected to one end of resistor R14, the other end of resistor R14 is connected to pin 31 of microcontroller ZU4, the other end of resistor R14 is also connected to +5V voltage through a light emitting diode and resistor R13; pin 2 of USB-to-serial port chip U3 is connected to +5V voltage through another light emitting diode and resistor R12, and pin 2 of USB-to-serial port chip U3 is also connected to pin 30 of microcontroller ZU4 through resistor R15.

5. The equipment dynamic monitoring and fault early warning system according to claim 1 is characterized in that: The device status information transmission system includes an interface chip U4, a slot P50, a resistor R51, a resistor R52, a resistor R53, a resistor R54, a resistor R55, a resistor R57, a resistor R76 and a transistor Q50. The base of the transistor Q50 is connected to the device status information processing system through the resistor R52, the emitter of the transistor Q50 is grounded, the collector of the transistor Q50 is respectively connected to one end of the resistor R76 and the 2nd pin and the 3rd pin of the interface chip U4, the other end of the resistor R76 is respectively connected to one end of the resistor R51 and one end of the resistor R53, and the other end of the resistor R53 is connected to the device status information processing system. system, the other end of the resistor R51 is connected to pin 1 of the interface chip U4, and pin 1 of the interface chip U4 is also connected to the device status information processing system; pin 1 of slot P50 and pin 8 of the interface chip U4 are both connected to the +5V voltage, pin 6 of the interface chip U4 is connected to the +5V voltage through resistor R54, pin 7 of the interface chip U4 is respectively connected to one end of resistor R55, one end of resistor R57 and pin 3 of slot P50, the other end of resistor R55 and pin 2 of slot P50 are both grounded, and pin 4 of slot P50 is respectively connected to the other end of resistor R57 and pin 6 of the interface chip U4.

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