A laser

By setting the step components and reflectors on the laser substrate to combine the beams emitted by different step components, the problem of upper limit of single chip power is solved, and a significant increase in the laser power is achieved while keeping the volume unchanged.

CN110707531BActive Publication Date: 2025-02-07SHENZHEN XINGHAN LASER TECH CO LTD
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Patent Information

Application Number
CN201910883384.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2019-09-18
Publication Date
2025-02-07
Estimated Expiration
2039-09-18

AI Technical Summary

Technical Problem

Existing fiber-coupled semiconductor lasers have limitations in increasing power, especially the upper limit problem of single chip power, which makes it difficult to achieve higher laser power while keeping the volume unchanged.

Method used

By providing step members on the substrate, a plurality of first and second optical cores are placed respectively, and beam-combining the beams emitted by different step members are performed using a mirror and a beam-combining device to increase the overall power of the laser.

Benefits of technology

It is realized that the laser power is significantly increased under the premise that the laser volume changes little, and a higher beam density and power are obtained by superimposing and combining multiple optical cores.

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Abstract

The embodiments of the present invention relate to the field of optical fiber technology, and in particular to a laser. The laser includes: a substrate, provided with a first step portion and a second step portion, and respectively provided with a plurality of first steps and a plurality of second steps; a plurality of first optical cores, provided on the first step; a plurality of first reflectors, provided on the first step, for receiving and reflecting the light beam output by the first optical core located on the same first step; a plurality of second optical cores, provided on the second step; a plurality of second reflectors, provided on the second step, for receiving and reflecting the light beam output by the second optical core located on the same second step; a third reflector, located between the first step portion and the second step portion, for receiving and reflecting the light beam output by the plurality of first reflectors; a beam combiner, located between the first step portion and the second step portion, for beam combining the light beams. In the above manner, the embodiments of the present invention can achieve an increase in the power of the laser.
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Description

Technical Field

[0001] The embodiments of the present invention relate to the field of optical fiber technology, and in particular to a laser. Background Art

[0002] With the development of optical fiber lasers, people have higher and higher requirements for the power of fiber-coupled semiconductor lasers. To obtain higher-power semiconductor lasers, one is to increase the power of a single chip; the other is to increase the number of chips in the fiber laser. Before the chip is updated, there is a power ceiling for the power of a single chip, so increasing the number of chips is an effective way to increase the power of optically coupled semiconductor lasers. Summary of the invention

[0003] The main technical problem solved by the embodiments of the present invention is to provide a laser capable of increasing the laser power.

[0004] In order to solve the above technical problems, a technical solution adopted by the present invention is: to provide a laser, characterized in that it includes: a substrate, provided with a first step portion and a second step portion, the first step portion is provided with a plurality of first steps, and the second step portion is provided with a plurality of second steps; a plurality of first optical cores, one of the first optical cores is provided on one of the first steps; a plurality of first reflectors, one of the first reflectors is provided on one of the first steps, and one of the first reflectors is used to receive and reflect the light beam output by the first optical core located on the same first step as the first optical core, and a plurality of second optical cores, one of the second optical cores is provided on one of the first steps; The invention relates to a substrate comprising a plurality of second reflectors, wherein the second reflectors are arranged on the second step, and the second reflectors are used to receive and reflect the light beam output by the second optical core located on the same second step as the second reflectors; a third reflector is arranged on the substrate and located between the first step portion and the second step portion, and the third reflector is used to receive and reflect the light beam output by the plurality of first reflectors; and a beam combiner is arranged on the substrate and located between the first step portion and the second step portion, and the beam combiner is used to combine the light beams output by the third reflector and the plurality of first reflectors.

[0005] Optionally, the laser further includes an optical fiber, one end of which is fixed on the substrate, and an end portion of one end of the optical fiber corresponds to the beam combiner for receiving the light beam output by the beam combiner.

[0006] Optionally, the laser further includes a plurality of first collimation units;

[0007] A first collimating unit is disposed on a first step, and is used for collimating the light outputted by the first optical core on the same first step and then inputting the light into the first reflector on the same first step.

[0008] Optionally, the first collimating unit includes a first fast-axis collimating lens and a first slow-axis collimating lens; the first fast-axis collimating lens is arranged close to the first optical core, and the first slow-axis collimating lens is arranged close to the first reflector.

[0009] Optionally, the laser further includes a plurality of second collimation units; a second collimation unit is disposed on a second step, and a second collimation unit is used to collimate the light output by the second optical core on the same second step and then input the light into a second reflector on the same second step.

[0010] Optionally, the second collimating unit includes a second fast-axis collimating lens and a second slow-axis collimating lens; the second fast-axis collimating lens is arranged close to the second optical core, and the second slow-axis collimating lens is arranged close to the second reflector.

[0011] Optionally, the laser further includes a focusing lens; the focusing lens is disposed on a substrate and located between the beam combiner and the optical fiber, and the focusing lens is used to focus the light beam output by the beam combiner and then input the light beam into the optical fiber.

[0012] Optionally, the focusing lens and the first stepped portion are located on one side of the beam combiner, and the second stepped portion is located on the other side of the beam combiner.

[0013] Optionally, the first step portion and the second step portion have the same height.

[0014] Optionally, the first optical core and the second optical core are both semiconductor laser chips.

[0015] The beneficial effect of the embodiment of the present invention is: different from the prior art, in the embodiment of the present invention, since multiple first optical cores are located on multiple first steps of the first step portion, and second optical cores are located on multiple second steps of the second step portion, when the light emitted by the multiple first optical cores on the multiple first steps of the first step portion passes through the first reflector and the second reflector and is reflected by the second reflector on the second step portion and emitted by the multiple second optical cores on the multiple second steps, they are combined at the beam combiner, and a larger number of light beams will be obtained. Since the number of chips is increased by adopting the method of symmetrical stepped arrangement of chips to improve the overall power of the laser, the laser can be made to have a higher power without much change in the volume of the laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a top view of an embodiment of a laser of the present invention;

[0017] Figure 2 is a front view of a laser implementation of the present invention;

[0018] Figure 3 Schematic diagram of light comparison of a laser embodiment of the present invention. DETAILED DESCRIPTION

[0019] In order to facilitate the understanding of the present invention, the present invention is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are for illustrative purposes only.

[0020] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in this specification and in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0021] See also Figure 1 and Figure 2 A laser 1 includes a substrate 10, a plurality of first optical cores 20, a plurality of first reflectors 40, a plurality of second optical cores 30, a plurality of second reflectors 50, a third reflector 60 and a beam combiner 70. The light beams output by the plurality of first optical cores 20 are reflected by the plurality of first reflectors 40 and then enter the beam combiner 70, and the light beams output by the plurality of second optical cores 30 are reflected by the plurality of second reflectors 50 and then reflected by the third reflector 60 and then enter the beam combiner 70, and are combined by the beam combiner 70.

[0022] For the above substrate 10, Figure 1 As shown, the substrate 10 is provided with a first stepped portion 101 and a second stepped portion 102, the first stepped portion 101 is provided with a plurality of first steps 1011, the plurality of first steps 1011 protrude from the substrate 10, and are arranged step by step in sequence. The second stepped portion 102 is provided with a plurality of second steps 1021, the plurality of second steps 1021 protrude from the substrate 10, and are arranged step by step in sequence.

[0023] For the above-mentioned multiple first optical cores 20, the multiple first optical cores 20 are respectively arranged on the multiple first steps 1011, and one first optical core 20 is located on one first step 1011. In some embodiments, the first optical core 20 can be a semiconductor laser chip, and the light generated by the semiconductor laser chip has higher energy and relatively higher light quality.

[0024] For the above-mentioned multiple first reflectors 40, the multiple first reflectors 40 are arranged on the first step 1011, one first step 1011 is provided with one first reflector 40, and the multiple first optical cores 20 correspond one to one with the multiple first reflectors 40. The light beam output by one first optical core 20 is reflected by the corresponding first reflector 40 to enter the combined beam, and since the first optical cores 20 are arranged in a stepped manner, the multiple first optical cores 20 are superimposed to form a combined beam.

[0025] For the above-mentioned plurality of second optical cores 30, the plurality of second optical cores 30 are arranged on the second step 1021, and one second optical core 30 is located on one second step 1021. In some embodiments, the second optical core 30 may be a semiconductor laser chip, and the light generated by the semiconductor laser chip has higher energy and relatively higher light quality.

[0026] For the above-mentioned multiple second reflectors 50, the multiple second reflectors 50 are arranged on the second step 1021, and the multiple second optical cores 30 correspond one to one to the multiple second reflectors 50. The light beam output by one second optical core 30 is reflected by the second reflector 50 corresponding thereto, and since the second optical cores 30 are arranged in a stepped manner, the multiple second optical cores 30 are superimposed to form a combined beam.

[0027] As for the third reflector 60 and the beam combiner 70, the third reflector 60 and the beam combiner 70 are both disposed on the substrate 10, and the third reflector 60 is also located between the first step portion 101 and the second step portion 102. When the light is emitted from the plurality of first optical cores 20 and the plurality of second optical cores 30, it passes through the corresponding plurality of first reflectors 40 and the plurality of second reflectors 50, and then is reflected by the third reflector 60 to the beam combiner 70 for light beam combining processing.

[0028] By providing the first step portion 101 and the second step portion 102, and then providing the first chip 20 and the second chip 30 on the first step portion 101 and the second step portion 102 respectively, and then reflecting through the first reflector 50 and the second reflector 60, and finally combining through the beam combiner 70, the overall height of the laser is reduced under the condition of having the same number of optical cores. In addition, the vertical dimension h2 of the light is only half of the vertical dimension h1 of the single-row structure, thereby reducing the NA value of the light and improving the quality of the light.

[0029] In some embodiments, the first stepped portion 101 and the second stepped portion 102 have the same height. The heights of the multiple first steps 1011 of the first stepped portion 101 and the multiple second steps 1021 of the second stepped portion correspond one to one, when the light emitted by the first optical core 20 located on the multiple first steps 1011 of the first stepped portion 101 corresponds to the light emitted by the second optical core 30 located on the multiple second steps 1021 of the second stepped portion 102, the light can correspond one to one, and after the beams are combined by the beam combiner 70, a beam with greater optical power can be obtained.

[0030] In some embodiments, the beam combiner 70 further includes a half-wave plate 701, which is disposed at one end of the beam combiner 70 near the third reflector 60. The half-wave plate 701 performs polarization screening on the light beam reflected by the third reflector 60, thereby changing the polarization direction of the light beam. Thus, the light beam emitted from the first optical core 20 reaches the beam combiner 70 after passing through the first reflector 40, the third reflector 60 and the half-wave plate 701, and the light beam emitted from the second optical core 30 reaches the beam combiner after passing through the second reflector 50. At this point, the light beams emitted by the first optical core 20 and the second optical core 30 are respectively combined in the beam combiner 70. Due to the polarization processing of the light beam by the half-wave plate 701, the quality of the light beam after being combined by the beam combiner 70 is better.

[0031] In some embodiments, the laser 1 also includes an optical fiber 80, one end of which is fixed on the substrate 10, and an end of one end of the optical fiber 80 corresponds to the beam combiner 70, and the optical fiber 80 is used to receive the light beam coming out of the beam combiner 70.

[0032] In some embodiments, the laser 1 further includes a plurality of first collimating units 201, which are respectively arranged on each step of the first step 1011 and correspond to the first optical core 20 located on the step. The light output by the first optical core 20 becomes parallel light after passing through the first collimating unit 201, and enters the beam combiner 70 after being reflected by the first reflector 40. Since the first optical core 20 and the second optical core 30 are arranged in rows, the height of the light beam emitted from the first optical core 20 entering the beam combiner 70 after passing through the first reflector 40 and the third reflector is reduced, thereby reducing the NA value of the light beam and improving the quality of the light beam.

[0033] Specifically, the first collimating unit 201 further includes a first fast-axis collimating lens 2011 and a first slow-axis collimating lens 2012. The first fast-axis collimating lens 2011 is disposed on a side close to the first optical core 20, and the first slow-axis collimating lens 2012 is disposed on a side close to the second reflector 40. When light is emitted from the first optical core 20, it is preliminarily collimated by the first fast-axis collimating lens 2011, so that as much light as possible reaches the first slow-axis collimating lens 2012. The first slow-axis collimating lens 2012 collimates the light into mutually parallel light, thereby making more parallel light exiting the first slow-axis collimating lens 2012, thereby making the quality of the light beam after passing through the first reflector 40 and the third reflector 60 and then being combined by the beam combiner 70 higher.

[0034] In some embodiments, the laser 1 further includes a plurality of second collimating units 202, which are respectively arranged on each step of the second step 1021 and correspond to the second optical core 30 located on the step. Thus, the light output by the second optical core 30 becomes parallel light after passing through the second collimating unit 202, and passes through the second reflector 50 and the beam combiner 70. Since the first optical core 20 and the second optical core 30 are arranged in rows, the height of the light beam emitted from the second optical core entering the beam combiner 70 through the second reflector 40 is reduced, thereby reducing the NA value of the light beam and improving the quality of the light beam.

[0035] Specifically, the second collimating unit 202 includes a second fast-axis collimating lens 2021 and a second slow-axis collimating lens 2022. The second fast-axis collimating lens 2021 is arranged near the second optical core 30, and the second slow-axis collimating lens 2022 is arranged near the second reflector 50. After the light is emitted from the second optical core 30, it is preliminarily collimated by the second fast-axis collimating lens 2021, so that as much light as possible reaches the second slow-axis collimating lens 2022. The second slow-axis collimating lens 2022 collimates the light into mutually parallel light, thereby making more parallel light coming out of the second slow-axis collimating lens 2022, so that the quality of the light beam after passing through the second reflector 50 and the third reflector 60 and then being combined by the beam combiner 70 is higher.

[0036] In some embodiments, the laser 1 further includes a focusing lens 90, which is disposed on the substrate 10 and located between the beam combiner and the optical fiber 80. The focusing lens 90 focuses the light beam from the beam combiner 70 and then inputs the light beam into the optical fiber 80.

[0037] In some embodiments, the focusing lens 90 is located on one side of the first stepped portion 101 , and the focusing lens 90 and the first stepped portion 101 are both located on the same side of the combiner 70 .

[0038] In some embodiments, the laser further includes a first heat dissipation component (not shown), a second heat dissipation component (not shown), a first heat sink (not shown), and a second heat sink (not shown).

[0039] The first heat dissipation assembly includes a first heat sink disposed on the side wall of the first stepped portion and a plurality of first heat conducting portions extending from the first heat sink, a first heat conducting portion extending to a first step, and a first chip disposed on a first heat conducting portion. When the first chip is working, the heat of the first chip is transferred to the first heat sink through the first heat conducting portion, and the first heat sink dissipates heat. In some embodiments, the first heat sink is disposed in a manner that fits the side wall of the first stepped portion, and the shape and size of the first heat sink match the side wall of the first stepped portion.

[0040] The second heat dissipation assembly includes a second heat sink disposed on the side wall of the second stepped portion and a plurality of second heat conducting portions extending from the first heat sink, a second heat conducting portion extending to a first step, and a second chip disposed on a second heat conducting portion. When the second chip is in operation, the heat of the second chip is transferred to the second heat sink through the second heat conducting portion, and the heat is dissipated by the second heat sink. In some embodiments, the second heat sink is disposed in a manner that fits the side wall of the second stepped portion, and the shape and size of the second heat sink match the side wall of the second stepped portion.

[0041] In some embodiments, the laser further includes a housing (not shown) and a fan. The substrate, the first chip, the second chip, the focusing lens, the beam combiner, the first collimation unit and the second collimation unit are all located in the housing. The housing is provided with an air inlet (not shown) and an air outlet (not shown), and the fan is arranged at the air inlet or the air outlet. Under the action of the fan, the wind from the outside can enter the housing from the air inlet and then leave the housing from the air outlet, so as to realize the exchange of the wind from the outside and the wind inside the housing, and the housing forms an air duct for transmitting the wind between the air inlet or the air outlet. The first heat dissipation component also includes a plurality of first fins extending from the first heat sink, the plurality of first fins are stacked, and a first gap is reserved between two adjacent first fins, and the plurality of first fins are located on the above-mentioned air duct, and the heat of the first chip is transmitted to the plurality of first fins through the first heat conducting part and the first heat dissipating part, and the heat on the first fins can be taken away by the wind on the air duct and transmitted to the external space, which is conducive to improving the heat dissipation effect of the first chip. Similarly, the second heat dissipation component also includes a plurality of second fins extending from the second heat sink. The plurality of second fins are stacked and a second gap is reserved between two adjacent second fins. The plurality of second fins are located on the above-mentioned air duct. The heat of the second chip is transferred to the plurality of second fins through the second heat conduction part and the second heat dissipation part. The heat on the second fins can be carried away by the wind on the air duct and transmitted to the external space, which is beneficial to improving the heat dissipation effect of the second chip.

[0042] In the embodiment of the present invention, since the multiple first optical cores are located on the multiple first steps of the first step portion, and the second optical cores are located on the multiple second steps of the second step portion, when the light emitted by the multiple first optical cores on the multiple first steps of the first step portion passes through the first reflector and the second reflector and is reflected by the second reflector on the second step portion and emitted by the multiple second optical cores on the multiple second steps, they are combined at the beam combiner, and a larger number of light beams will be obtained. Since the number of chips is increased by adopting the method of symmetrical stepped arrangement of chips to improve the overall power of the laser, it is possible to make the laser have a higher power without much change in the volume of the laser.

[0043] It should be noted that the preferred embodiments of the present invention are given in the specification and drawings of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. These embodiments are not used as additional limitations on the content of the present invention. The purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. In addition, the above-mentioned technical features continue to be combined with each other to form various embodiments not listed above, which are all regarded as the scope of the present invention; further, for ordinary technicians in this field, they can be improved or transformed according to the above description, and all these improvements and transformations should belong to the protection scope of the claims attached to the present invention.

Claims

1. A laser, characterized in that: include: A substrate is provided with a first stepped portion and a second stepped portion, wherein the first stepped portion is provided with a plurality of first steps, and the second stepped portion is provided with a plurality of second steps; A plurality of first optical cores, wherein one of the first optical cores is disposed on one of the first steps; A plurality of first reflectors, one of the first reflectors is disposed on one of the first steps, and one of the first reflectors is used to receive and reflect the light beam output by the first optical core located on the same first step as the first reflector, A plurality of second optical cores, wherein a second optical core is disposed on a second step; A plurality of second reflectors, wherein a second reflector is disposed on a second step, and a second reflector is used to receive and reflect a light beam outputted by a second optical core located on the same first step as the second reflector; A third reflector, disposed on the substrate and located between the first stepped portion and the second stepped portion, the third reflector being used to receive and reflect the light beams output by the plurality of first reflectors; A beam combiner is disposed on the substrate and located between the first step portion and the second step portion, and is used to combine the light beams output by the third reflector and the plurality of first reflectors; A first heat dissipation assembly, comprising a first heat sink disposed on a side wall of the first stepped portion and a plurality of first heat conducting portions extending from the first heat sink, wherein a first heat conducting portion extends to a first step, and a first optical core is disposed on a first heat conducting portion; The first heat dissipation assembly further includes a plurality of first fins extending from the first heat sink, the plurality of first fins are stacked, and a first gap is reserved between two adjacent first fins; A second heat dissipation assembly, comprising a second heat sink disposed on a side wall of the second stepped portion and a plurality of second heat conducting portions extending from the first heat sink, wherein a second heat conducting portion extends to a first step, and a second optical core is disposed on a second heat conducting portion; The second heat dissipation assembly further includes a plurality of second fins extending from the second heat sink, the plurality of second fins are stacked, and a second gap is reserved between two adjacent second fins; The housing is provided with an air inlet and an air outlet, and an air duct for transmitting wind is formed between the air inlet or the air outlet, a plurality of the first fins are located on the air duct, and a plurality of the second fins are located on the air duct 。 2. The laser according to claim 1, characterized in that It also includes an optical fiber, one end of which is fixed on the substrate, and an end of one end of the optical fiber corresponds to the beam combiner, for receiving the light beam output by the beam combiner.

3. The laser according to claim 1 or 2, characterized in that: Also includes a plurality of first collimation units; A first collimating unit is disposed on a first step, and is used for collimating the light outputted by the first optical core on the same first step and then inputting the light into the first reflector on the same first step.

4. The laser according to claim 3, characterized in that The first collimating unit includes a first fast-axis collimating lens and a first slow-axis collimating lens; The first fast-axis collimating lens is disposed close to the first optical core, and the first slow-axis collimating lens is disposed close to the first reflecting mirror.

5. The laser according to claim 1 or 2, characterized in that: Also comprising a plurality of second collimation units; A second collimating unit is disposed on a second step, and is used for collimating the light outputted from the second optical core on the same second step and then inputting the light into the second reflector on the same second step.

6. The laser according to claim 5, characterized in that The second collimating unit comprises a second fast-axis collimating lens and a second slow-axis collimating lens; The second fast-axis collimating lens is disposed close to the second optical core, and the second slow-axis collimating lens is disposed close to the second reflecting mirror.

7. The laser according to claim 2, characterized in that Also included is a focusing lens; The focusing lens is arranged on the substrate and is located between the beam combiner and the optical fiber. The focusing lens is used to focus the light beam output by the beam combiner and then input the light beam into the optical fiber.

8. The laser according to claim 7, characterized in that The focusing lens and the first stepped portion are located on one side of the beam combiner, and the second stepped portion is located on the other side of the beam combiner.

9. The laser according to claim 1, characterized in that The first step portion and the second step portion have the same height.

10. The laser according to claim 1, characterized in that The first optical core and the second optical core are both semiconductor laser chips.

Citation Information

Patent Citations

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