Mounting structure for thin film temperature sensor and temperature sensing device

Abstract

Disclosed are a mounting structure of a thin film temperature sensor and a temperature sensing device. The thin film temperature sensor is provided with a thermistor and a lead wire. The mounting structure comprises: a pressing structure made of a heat-insulating and insulating material, comprising a close-pressing structure and a fixing structure for a temperature sensing surface of the thin film temperature sensor, the close-pressing structure being a planar close-pressing structure or a curved close-pressing structure and having a recess, and the fixing structure being used for fixing the mounting structure of the thin film temperature sensor. The buckle structure comprises a metal sheet and a metal buckle extending from the metal sheet or coupled with the metal sheet, the metal sheet having a temperature sensing surface in contact with a measured object, the temperature sensing surface having an opening, wherein the buckle is fastened to the pressing structure, the head of the thermistor of the thin film temperature sensor is pressed into the position of the recess of the pressing structure, and the head of the thermistor of the thin film temperature sensor is exposed from the opening of the temperature sensing surface and is flush with or higher than the temperature sensing surface.

Description

TECHNICAL FIELD

[0001] The present application relates to a temperature sensor, in particular, a mounting structure of a thin film temperature sensor and a temperature sensing device. BACKGROUND

[0002] The prior art uses glue to fix the thin film temperature sensor on the mounting structure, and then installs it on the measured object. However, since the glue is a chemical substance, it is easy to pollute the environment, and there is no way to bond firmly. In addition, in high temperature or humid use environment, the adhesive force of the glue is greatly discounted, resulting in the falling off of the thin film temperature sensor. At the same time, the ingenuity of the thin film temperature sensor mounting structure is related to whether the reaction speed of the thin film temperature sensor is accelerated. SUMMARY

[0003] In view of one or more problems in the prior art, a mounting structure of a thin film temperature sensor and a temperature sensing device are proposed.

[0004] In one aspect of the present application, a mounting structure of a thin film temperature sensor is provided, the thin film temperature sensor having a thermistor and a lead, comprising: a pressing structure made of a heat-insulating and insulating material, including a close-to-touch structure and a fixing structure for the temperature sensing surface of the thin film temperature sensor, the close-to-touch structure being a planar close-to-touch or a curved close-to-touch, and having a recess, and the fixing structure being used to fix the mounting structure of the thin film temperature sensor; a buckle structure including a metal sheet and a metal buckle extending from or coupled to the metal sheet, the metal sheet having a temperature sensing surface in contact with the measured object, and the temperature sensing surface of the metal buckle having an opening, wherein the metal buckle is fastened to the pressing structure, the head of the thermistor of the thin film temperature sensor is pressed into the recess of the pressing structure, and the head of the thermistor of the thin film temperature sensor is exposed from the opening of the temperature sensing surface of the metal buckle, flush with or higher than the temperature sensing surface of the metal buckle.

[0005] According to some embodiments of the present application, the thickness of the metal sheet of the buckle structure is less than 4 mm, and the temperature sensing surface is specifically a planar or curved surface in contact with the surface of the measured object.

[0006] According to some embodiments of the present application, the heat-insulating and insulating material includes at least one of bakelite, plastic, glass fiber, ceramic, and silicone rubber.

[0007] According to some embodiments of the present application, the recess of the pressing structure is a closed hole, and the mounting structure further includes a heat-insulating and insulating gasket arranged in the hole.

[0008] According to some embodiments of the present application, the pressing structure has a slit, and the metal buckle passes through the slit to be fastened to the pressing structure.

[0009] According to some embodiments of the present application, the pressing structure is a housing of a thermal fuse.

[0010] According to some embodiments of the present application, the thermistor is composed of a bare chip thermistor and a glass-sealed thermistor.

[0011] In another aspect of the present application, a temperature sensing device is provided, comprising: a thin film temperature sensor having a thermistor and a lead; a pressing structure made of a heat-insulating and insulating material, comprising a pressing structure for a temperature sensing surface of the thin film temperature sensor and a fixing structure, the pressing structure being planar or curved and having a recess, the fixing structure being used to fix a mounting structure of the thin film temperature sensor; and a clamping structure comprising a metal sheet and a metal clamp extending from or coupled to the metal sheet, the metal sheet having a temperature sensing surface in contact with a measured object, the metal clamp having an opening in the temperature sensing surface, wherein the metal clamp is used to clamp the pressing structure, the head of the thermistor of the thin film temperature sensor is pressed into the recess of the pressing structure, and the head of the thermistor of the thin film temperature sensor is exposed from the opening of the temperature sensing surface of the metal clamp and is flush with or higher than the temperature sensing surface of the metal clamp.

[0012] According to some embodiments of the present application, the pressing structure has grooves on both sides, and the metal clamp passes through the grooves to be clamped to the pressing structure.

[0013] In another aspect of the present application, a temperature sensing device is provided, comprising: a thin film temperature sensor having a thermistor and a lead, wherein a temperature sensing surface of the thin film temperature sensor is in contact with a measured object; a thermal fuse structure comprising a thermal fuse wrapped by an insulating structure and a terminal connected to the thermal fuse, wherein the insulating structure of the thermal fuse has a hole, and when the thermal fuse structure is pressed on the thin film temperature sensor, the head of the thermistor is exposed from the hole; and a clamping structure pressed on the insulating structure of the thermal fuse, and coupled to the measured object, so as to press the thermal fuse structure and the thin film temperature sensor on the measured object.

[0014] According to some embodiments of the present application, the extension direction of the thin film temperature sensor is the same as or different from the extension direction of the thermal fuse structure.

[0015] According to some embodiments of the present application, the insulating structure of the thermal fuse structure is composed of ceramic.

[0016] In still another aspect of the present application, a temperature sensing device is provided, comprising: a thin film temperature sensor having a thermistor and a lead; a mounting structure having a surface in contact with a measured object and a notch on a side surface, the surface having an opening, when the thin film temperature sensor is inserted into the notch, a head of the thin film temperature sensor is exposed from the opening, and a wedge is inserted into the notch to hold a front half of a film of the head of the thin film temperature sensor; and a fastening structure coupled to the mounting structure and coupled to the measured object, thereby pressing the mounting structure having the thin film temperature sensor inserted thereinto against the measured object.

[0017] According to some embodiments of the present application, a bottom surface of the opening has a protrusion to push the thin film temperature sensor against the measured object.

[0018] According to some embodiments of the present application, the mounting structure is made of an insulating material, including bakelite, plastic or ceramic.

[0019] The above-mentioned embodiments replace glue with a new mounting structure, protecting the environment, and maintaining temperature measurement stability in high temperature and humid environments. In addition, the above-mentioned embodiments solve the problem of temperature measurement on curved surfaces. Since the thermistor in the thin film temperature sensor is disposed in a recess of the pressing structure insulating and heat insulating material, heat is returned due to the opening on the metal buckle temperature measurement surface, greatly improving the reaction speed of the thin film temperature sensor. BRIEF DESCRIPTION OF DRAWINGS

[0020] For a better understanding of the present application, the present application will be described in detail with reference to the following drawings:

[0021] Figure 1A is a perspective view of a buckle structure of a mounting structure of a thin film temperature sensor in an embodiment of the present application;

[0022] Figure 1B is a top view of the buckle structure as shown in Figure 1A

[0023] Figure 1C Figure 1A

[0024] Figure 1D Figure 1A

[0025] Figure 2A is a perspective view of a pressing structure of a mounting structure of a thin film temperature sensor in an embodiment of the present application;

[0026] Figure 2B is a top view of the buckle structure as shown in Figure 2A ​​​​​Top view of the installation structure shown;

[0027] Figure 2C Is it like this? Figure 2A The bottom view of the installation structure shown;

[0028] Figure 2D It is along Figure 2B A cross-sectional view of line A-A' in the diagram;

[0029] Figure 3A This is a schematic diagram of a thin-film temperature sensor disposed in a pressing structure in one embodiment of the present invention;

[0030] Figure 3B This is a schematic diagram of a snap-fit ​​structure used to fasten a thin-film temperature sensor to a pressing structure in one embodiment of the present invention;

[0031] Figure 3C This is another schematic diagram of a snap-fit ​​structure used to fasten a thin-film temperature sensor to a pressing structure in one embodiment of the present invention;

[0032] Figure 3D It is along Figure 3B A cross-sectional view of B-B' in the middle;

[0033] Figure 4A This is a three-dimensional schematic diagram of the snap-fit ​​structure of the mounting structure of the thin-film temperature sensor in another embodiment of the present invention;

[0034] Figure 4B Is it like this? Figure 4A A top view of the buckle structure shown;

[0035] Figure 4C Is it like this? Figure 4A A side view of the buckle structure shown;

[0036] Figure 4D Is it like this? Figure 4A Another side view of the snap-fit ​​structure shown;

[0037] Figure 5A This is a three-dimensional schematic diagram of the pressing structure of the mounting structure of the thin-film temperature sensor in one embodiment of the present invention;

[0038] Figure 5B Is it like this? Figure 5A The diagram shown illustrates the mounting structure along the AA direction;

[0039] Figure 5C Is it like this? Figure 5A The diagram shown illustrates the mounting structure along the BB direction;

[0040] Figure 5D It is along Figure 5C A cross-sectional view of C-C' in the middle;

[0041] Figure 6A is a schematic view of the film temperature sensor disposed in a press-on structure in another embodiment of the present application;

[0042] Figure 6B is a schematic view of the film temperature sensor secured to a press-on structure using a snap-on structure in another embodiment of the present application;

[0043] Figure 6C is another schematic view of the film temperature sensor secured to a press-on structure using a snap-on structure in another embodiment of the present application;

[0044] Figure 6D is a cross-sectional view along D-D' in Figure 6B ;

[0045] Figure 7A is a schematic view of a temperature fuse structure pressed on the film temperature sensor in yet another embodiment of the present application;

[0046] Figure 7B is a schematic view of a securing structure pressed on the temperature fuse structure in yet another embodiment of the present application;

[0047] Figure 7C is a cross-sectional view along E-E' in Figure 7B ;

[0048] Figure 8A is a perspective view of a temperature sensing device in another embodiment of the present application;

[0049] Figure 8B is a top view of the temperature sensing device shown in Figure 8A ;

[0050] Figure 8C is a side view of the temperature sensing device shown in Figure 8A ;

[0051] Figure 8D is a cross-sectional view along the dashed line E-E' in Figure 8B ;

[0052] Figure 8E is a cross-sectional view along the dashed line F-F' in Figure 8B ;

[0053] Figure 9A shows a perspective view of the film temperature sensor inserted into a mounting structure in accordance with another embodiment of the present application;

[0054] Figure 9B is a top view of the temperature sensing device shown in Figure 9A ;

[0055] Figure 9C is a cross-sectional view taken along the dotted line G-G' shown in Figure 9B

[0056] Figure 9D is a partial enlarged view of Figure 9C DETAILED DESCRIPTION

[0057] Specific embodiments of the present application will now be described in detail with reference to the following figures. Like numbers in different figures represent the same or similar elements. The implementation of the application in its various aspects, however, can vary as

[0058] Throughout this specification, "one embodiment," "an embodiment," "one example," or "an example" means that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in at least one embodiment of the application. The appearances of the phrases "in one embodiment," "in an embodiment," "one example," or "an example" in various places in the specification are not necessarily all referring to the same embodiment or example. Furthermore, the particular features, structures, or characteristics can be combined in any suitable

[0059] ​​In view of the problems caused by the use of glue to bond the thin film temperature sensor to the mounting structure in the prior art, the embodiments of the present application propose a mounting structure for a thin film temperature sensor, which comprises a pressing structure for the thin film temperature sensor, and a metal buckle structure for fixing the pressing structure and closely attaching to the temperature sensing surface of the thin film temperature sensor. The pressing structure comprises a close-attaching structure and a fixing structure, and the close-attaching structure has a recess, such as a closed hole, with a diameter greater than that of the thermistor in the thin film temperature sensor. The outer edge of the recess is on a plane or a curved surface, so as to achieve plane close-attaching or curved surface close-attaching. Since the thermistor in the thin film temperature sensor protrudes from the surface of the film, when the pressing structure fixes the thin film temperature sensor, the thermistor in the thin film temperature sensor is forced to be pressed to the position of the recess of the pressing structure, and at the same time, the reaction force causes the head of the thermistor protruding from the surface of the film to closely attach to the temperature measuring surface of the object to be measured. The close-attaching structure of the pressing structure is composed of insulating material, which isolates the influence of the surrounding environment on temperature measurement, and at the same time, it is the key to ensure that the thermistor in the thin film temperature sensor is not crushed by strong pressing during the entire fixing process. The metal buckle structure completely covers the thermistor in the thin film temperature sensor, and only the thermistor in the thin film temperature sensor is exposed to sense temperature. When the pressing structure is fixed, the metal buckle structure closely attaches to the surface of the object to be measured, and at this time, since the heat transfer speed of metal is faster than that of the pressing structure composed of insulating material, heat conduction and heat reflux are immediately formed around the thermistor in the thin film temperature sensor, thereby greatly accelerating the response speed of the thin film temperature sensor.

[0060] According to some embodiments, the pressing structure is composed of bakelite, plastic, glass fiber, etc. The pressing structure is divided into a close-attaching structure for the temperature sensing surface of the thin film temperature sensor and a fixing structure, and the close-attaching structure is further divided into a plane or a curved surface, and the fixing structure can be a hole position fixed by a nut, or a pressing piece and other similar modes. The fixing structure and the close-attaching structure can be on the same plane or different planes.

[0061] According to some embodiments, the metal clasp structure material is composed of metal or alloy sheet with thickness < 4 mm, and its surface is flat or curved. The metal clasp structure is a metal inner circle outer square structure (i.e. opening) which wraps the temperature sensing surface of the thin film temperature sensor and exposes the thermistor, and also has the function of fixing the pressing structure, with one or more clasp to prevent the thin film temperature sensor from sliding out. After the metal clasp structure clamps the thin film and the pressing structure, its plane is lower than the height of the thermistor in the thin film temperature sensor. In this way, when there is an external force pulling the thin film temperature sensor outward, the thermistor protruding above the plane of the metal clasp structure becomes another obstacle to prevent the thin film temperature sensor from being pulled out. Thus, the thin film temperature sensor is firmly fixed on the pressing structure. When the pressing structure is fixed, the thermistor protruding from the surface of the thin film is forced to be squeezed towards the closed hole of the pressing structure, and the reaction force promotes the thermistor protruding from the surface of the thin film to be in close contact with the temperature measuring surface of the object to be measured. The metal inner circle outer square structure in the metal clasp structure immediately forms heat conduction around the thermistor in the thin film temperature sensor, and heat backflow, thereby greatly accelerating the response speed of the thin film temperature sensor.

[0062] According to some embodiments, the thin film temperature sensor is composed of a thermistor and a thin film covering the thermistor and its lead wire, which can be composed of a soft flat cable or lead wire welded on the thermistor, or a thermistor and its own lead wire. The thermistor can be composed of a bare chip type thermistor and a glass sealed type thermistor. The pressing structure can be a housing of a temperature fuse, composed of ceramic or other heat-insulating and insulating materials.

[0063] According to some embodiments, the fixing piece (fixing structure) of the pressing structure can be composed of iron-plated zinc, stainless steel and other metal materials.

[0064] Figure 1A is a perspective view of the clasp structure of the mounting structure of the thin film temperature sensor in one embodiment of the present application. Figure 1B is a top view of the clasp structure as shown in Figure 1A . Figure 1C is a bottom view of the clasp structure as shown in Figure 1A . Figure 1D is a side view of the clasp structure as shown in Figure 1A .

[0065] as shown in Figure 1A , Figure 1B , Figure 1C and Figure 1DAs shown, the buckle structure 100 can include a metal sheet-shaped buckle body 101, metal buckles 103 and 104 extending from or coupled to the buckle body 101 for fastening the thin-film temperature sensor to the pressure structure. As shown, the buckle body 101 has an opening 102 on its planar temperature measuring surface, and when the thin-film temperature sensor is fastened to the pressure structure, the thermistor of the thin-film temperature sensor is exposed from the opening 102 to contact the measured object.

[0066] According to the above embodiment, the buckle structure 100 is composed of a metal or alloy sheet with a thickness < 4 mm, and its temperature measuring surface is planar. The buckle structure 100 is specifically a metal inner circle and outer square structure that wraps the temperature sensing surface of the thin-film temperature sensor and exposes the thermistor, and also has the function of fixing the pressure structure, with one or more metal buckles that prevent the thin-film temperature sensor from sliding out. After the buckle structure clamps the thin-film temperature sensor and the pressure structure, its temperature measuring plane is lower than the height of the thermistor in the thin-film temperature sensor.

[0067] Although in the above embodiment the buckle body 101 is formed in a square shape, those skilled in the art can conceive that in other embodiments the buckle body can be formed in other shapes, such as a rectangular shape, a circular shape, or an oval shape, etc. Although in the above embodiment the opening 102 is formed in a circular shape, those skilled in the art can conceive that in other embodiments the opening can be formed in other shapes, such as an oval shape, a square shape, or a rectangular shape, etc. Although in the above embodiment the buckle structure 100 has two metal buckles 103 and 104, those skilled in the art can conceive that in other embodiments more metal buckles can be provided, or only one metal buckle, as long as the thin-film temperature sensor can be fastened to the pressure structure.

[0068] Figure 2A is a perspective view of a pressure structure of a mounting structure of a thin-film temperature sensor in an embodiment of the present application. Figure 2B is a top view of the mounting structure as shown in Figure 2A . Figure 2C is a bottom view of the mounting structure as shown in Figure 2A . Figure 2D is a sectional view along A-A' in Figure 2B .

[0069] The pressure structure according to the present embodiment includes a close-fitting structure (such as the pressure plate 201) and a fixing structure (such as the fixing structure 205), and the close-fitting structure has a recess, such as a closed hole, with a diameter greater than the diameter of the thermistor in the thin-film temperature sensor. The outer edge of the recess is in a plane, thereby achieving planar close-fitting. As shown in Figure 2A , Figure 2B , Figure 2C and Figure 2DAs shown, the pressing structure 200 according to the present embodiment is made of heat-insulating and insulating material, and is formed with a recess 202. According to the present embodiment, the pressing structure 200 is made of insulating material such as bakelite, plastic, glass fiber, ceramic, silicone rubber, etc. The pressing structure 200 includes a pressing plate 201 and a fixing structure 205 extending from the pressing plate. The recess 202 is formed on the pressing plate 201, and has an outer edge shape such as a circle, but can also be an ellipse, a square or a rectangle, for accommodating the thermistor of the thin-film temperature sensor. As shown, a protrusion 207 is formed on the outer side of the recess 202 of the pressing plate 201, and a slit 203 and a slit 204 are formed between the recess 202 and the protrusion 207, for facilitating the metal clasp of the clasp structure to pass through, so as to fasten the thin-film temperature sensor to the pressing structure 200. In addition, as shown, a fixing hole is formed on the fixing structure 205, for facilitating the pressing structure to be fixed to the measured object by means of a screw or a rivet.

[0070] Although in the above embodiment, the protrusion 207 is formed on three sides of the pressing plate 201, it is conceivable for those skilled in the art to form the protrusion 207 on only one or two sides, or not to form the protrusion. Although two slits 203 and 204 are formed in the above embodiment, it is conceivable for those skilled in the art to form other shapes in other embodiments, such as a through hole or a groove formed on the side of the pressing plate, etc., and three or more slits can also be formed, as long as the metal clasp of the clasp structure can fasten the thin-film temperature sensor to the pressing structure.

[0071] According to other embodiments, a heat-insulating and insulating gasket can be arranged at the bottom of the recess 202, for buffering the pressure on the thermistor. In addition, in the case where at least one protrusion 207 is arranged on the outer side of the recess 202, the temperature measuring surface of the clasp structure is flush with or slightly exceeds the top end of the protrusion 207.

[0072] Figure 3A is a schematic view of the thin-film temperature sensor arranged in the pressing structure in one embodiment of the present application. Figure 3B is a schematic view of the thin-film temperature sensor fastened to the pressing structure by means of the clasp structure in one embodiment of the present application. Figure 3C is another schematic view of the thin-film temperature sensor fastened to the pressing structure by means of the clasp structure in one embodiment of the present application. Figure 3D is a sectional view along B-B' in Figure 3B .

[0073] As shown in Figure 3AAs shown, the thin film temperature sensor according to the embodiment of the present disclosure comprises a thermistor 301, a lead wire 304 connected to the thermistor, a thin film 303 covering the thermistor, and a thin film 302 covering the lead wire 304, where the thin film 203 and the thin film 303 can be integrally formed. The thin film temperature sensor is placed on the pressing plate 201 so that the head of the thermistor 301 is embedded in the recess 202 of the pressing plate 201, for example, a hole. In order to facilitate the user, the recess 202 of the pressing plate 201 is filled with a slope in Figure 3A and Figure 3B and Figure 3C the various parts of the pressing structure are filled with a slope.

[0074] Then, as shown in Figure 3B , the metal buckles of the buckle structure are passed through the slits of the pressing structure, and the thin film temperature sensor is fastened to the pressing structure so that the thermistor 301 is exposed from the opening 102 on the buckle body 101 of the buckle structure. As shown in Figure 3C , the metal buckles 103 and 104 are passed through the slits to fasten the thin film temperature sensor to the pressing structure. In addition, in the cross-sectional view of Figure 3D , the situation of fixing the pressing structure to the measured object by inserting a screw into the hole position 206 is also shown.

[0075] As described above, the reverse side of the temperature sensing surface of the thin film temperature sensor is attached to the pressing structure 200, and the reverse side of the temperature sensing surface of the thermistor 301 in the thin film temperature sensor is opposite to the recess 202, such as a circular hole, in the pressing structure 200. The thin film temperature sensor, the buckle structure 100 and the pressing structure 200 are combined together by a jig, and the temperature sensing surface of the thermistor 301 in the thin film temperature sensor is exposed in the opening 102 of the temperature measuring plane of the buckle structure 100. In use, the pressing structure 200 can be pressed tightly to the temperature measuring plane of the object to be measured by screws, and the reverse side of the temperature sensing surface of the thermistor 301 in the thin film temperature sensor is forced to be pressed to the recess 202 of the pressing structure 200, and the reaction force forces the thermistor 301 to be tightly attached to the temperature measuring surface of the object to be measured. The recess 202 can ensure that the pressing structure composed of heat insulation and insulation materials can isolate the influence of the surrounding environment on temperature measurement, and at the same time, it can ensure that the thermistor in the thin film temperature sensor is not crushed during the whole pressing process, which is the key to make the thermistor 301 measure temperature more accurately. At this time, the buckle structure 100 buckles the thin film temperature sensor and the pressing structure 200, and the plane is lower than the height of the thermistor 301 in the thin film temperature sensor. In this way, when the thin film temperature sensor is pulled outward by an external force, the thermistor 301 protruding from the temperature measuring plane of the buckle structure 100 becomes an obstacle to prevent the thin film temperature sensor from being pulled out. Therefore, the thin film temperature sensor is fixed on the pressing structure 200. When the pressing structure fixes the thin film temperature sensor 303 and tightly attaches to the temperature measuring surface of the object to be measured, the thermistor 301 protruding from the thin film surface is forced to be pressed to the position of the recess 202 of the pressing structure 200, and the reaction force forces the thermistor 301 protruding from the thin film surface to be tightly attached to the temperature measuring surface of the object to be measured. The opening structure of the metal inner circle and the outer square in the buckle structure 100 immediately forms heat conduction and heat reflux around the thermistor 301 in the thin film temperature sensor, thereby greatly accelerating the response speed of the thin film temperature sensor. The pressing structure has a slit, and the metal sheet of the metal buckle structure passes through the slit, is bent and fastened to the pressing structure.

[0076] Although the above describes the case that the temperature measuring surface is flat, those skilled in the art can think that the present application is not limited to this, but can be applied to other temperature measuring surfaces, such as curved surfaces.

[0077] Figure 4A is a perspective view of the buckle structure of the mounting structure of the thin film temperature sensor in another embodiment of the present application. Figure 4B is a top view of the buckle structure in the AA direction as shown in Figure 4A . Figure 4C is a side view of the buckle structure in the BB direction as shown in Figure 4A . Figure 4D is a side view of the buckle structure in the CC direction as shown in Figure 4AThe shown buckle structure in a side view in CC direction.

[0078] As shown in Figure 4A , Figure 4B , Figure 4C and Figure 4D , the buckle structure 400 can include a metal sheet-shaped buckle body 401, metal buckles 403 and 404 extending from or coupled to the buckle body 401 for fastening the thin film temperature sensor to the pressure structure. As shown, the buckle body 401 has an opening 402 on its curved (e.g. arc-shaped) temperature measuring surface, and when the thin film temperature sensor is fastened to the pressure structure, the thermistor of the thin film temperature sensor is exposed from the opening 402 to contact the measured object. As shown, the buckle structure 400 can also include anti-slip members 405 and 406 extending from or coupled to the buckle body 401 for preventing the thin film temperature sensor from slipping out from between the pressure structure and the buckle structure.

[0079] According to the above embodiment, the buckle structure 400 is composed of a metal or alloy sheet with a thickness < 4 mm, and its temperature measuring surface is curved (e.g. arc-shaped). The buckle structure 400 specifically has a metal inner circle and outer square structure that wraps the temperature sensing surface of the thin film temperature sensor and exposes the thermistor, and also has the function of fixing the pressure structure, with one or more buckles that prevent the thin film temperature sensor from slipping out. After the buckle structure clamps the thin film temperature sensor and the pressure structure, its temperature measuring surface is lower than the height of the thermistor of the thin film temperature sensor.

[0080] Although in the above embodiment the buckle body 401 is formed as a square with an arc-shaped surface, those skilled in the art can conceive that in other embodiments the buckle body can be formed in other shapes, such as an arc-shaped rectangle, circle or ellipse, etc. Although in the above embodiment the opening 402 is formed as a circle, those skilled in the art can conceive that in other embodiments the opening can be formed in other shapes, such as an ellipse, square or rectangle, etc. Although in the above embodiment the buckle structure 400 has two metal buckles 403 and 404, those skilled in the art can conceive that in other embodiments more metal buckles can be provided, or only one metal buckle, as long as the thin film temperature sensor can be fastened to the pressure structure. Although in the above embodiment the buckle structure 400 has two anti-slip members 405 and 406, those skilled in the art can conceive that in other embodiments more anti-slip members can be provided, or only one anti-slip member, as long as the thin film temperature sensor can be prevented from slipping out from between the pressure structure and the buckle structure.

[0081] Figure 5A is a perspective view of a pressure structure of a mounting structure of a thin film temperature sensor in an embodiment of the present application. Figure 5B is a perspective view of a buckle structure of a mounting structure of a thin film temperature sensor in an embodiment of the present application.Figure 5A A schematic view of the mounting structure along AA direction. Figure 5C is as shown in Figure 5A A schematic view of the mounting structure along BB direction. Figure 5D is along Figure 5C A sectional view along C-C' in

[0082] The pressing structure according to the present embodiment comprises a pressing structure (e.g. pressing plate 501) having a recess, e.g. a closed hole, with a diameter larger than the diameter of the thermistor in the thin film temperature sensor, and a fixing structure (e.g. fixing structure 505). The outer edge of the recess is on a curved surface, so as to achieve curved surface pressing. As shown in Figure 5A , Figure 5B , Figure 5C and Figure 5D The pressing structure 500 according to the present embodiment is made of heat insulation material and formed with a recess 502. According to the present embodiment, the pressing structure 500 is made of bakelite, plastic, glass fiber, ceramic, silicone rubber or other insulation material. The pressing structure 500 comprises a pressing plate 501 and a fixing structure 505 extending from the pressing plate. The recess 502 is formed on the pressing plate 501, and the outer edge of the recess 502 is, for example, circular on a curved surface, but can also be elliptical, square or rectangular on a curved surface, for accommodating the thermistor of the thin film temperature sensor. As shown, a plurality of protrusions 506, 507 and 508 are formed on the outer side of the recess 502 of the pressing plate 502, and grooves 503 and 504 are respectively formed on the two sides, for facilitating the fastening of the buckle of the buckle structure, so as to fasten the thin film temperature sensor to the pressing structure 500.

[0083] Although in the above embodiment, the protrusions 506, 507 and 508 are formed on three sides of the pressing plate 501, those skilled in the art can conceive that the protrusions can be formed on only one or two sides, or no protrusion is provided. Although two grooves 503 and 504 are formed in the above embodiment, those skilled in the art can conceive that other shapes, such as through holes or slits, can be formed in other embodiments, and three or more grooves can be formed, as long as the buckle of the buckle structure can be facilitated to fasten the thin film temperature sensor to the pressing structure.

[0084] According to other embodiments, a heat insulation gasket can be provided on the bottom of the recess 502, for buffering the pressure on the thermistor. In addition, in the case where at least one protrusion 507 is provided on the outer side of the recess 502, the temperature measuring surface of the buckle structure is flush with or slightly protrudes from the top end of the protrusion 507.

[0085] Figure 6Ais a schematic view of the film temperature sensor being set in the pressing structure in another embodiment of the present application. Figure 6B is a schematic view of the film temperature sensor being fastened to the pressing structure by the buckle structure in another embodiment of the present application. Figure 6C is another schematic view of the film temperature sensor being fastened to the pressing structure by the buckle structure in another embodiment of the present application. Figure 6D is a sectional view along Figure 6B D-D' in the figure.

[0086] As shown in Figure 6A , the film temperature sensor according to the embodiment of the present application comprises a thermistor 601, a lead wire 604 connected with the thermistor, a film 603 covering the thermistor and a film 602 covering the lead wire 604, where the films can be integrally formed or segmented. The film temperature sensor is placed on the pressing plate 501 so that the head of the thermistor 601 is embedded in the position of the recess, such as a hole, of the pressing plate 501.

[0087] Then, as shown in Figure 6B , the metal buckle of the buckle structure is passed through the slot of the side of the pressing structure to fasten the film temperature sensor to the pressing structure so that the thermistor 601 is exposed from the opening 402 on the buckle body 401 of the buckle structure. As shown in Figure 6C , the metal buckle 403 and 404 fasten the film temperature sensor to the pressing structure after being passed through the slot. In addition, the anti-skid members 405 and 406 are also shown in the figure of Figure 6B and the sectional view of Figure 6D , which prevent the film temperature sensor from sliding out.

[0088] As mentioned above, the back side of the temperature sensing surface of the thin film temperature sensor is pressed against the pressing structure 500, and the back side of the temperature sensing surface of the thermistor 601 in the thin film temperature sensor is directly opposite the concave part, such as a circular hole, in the pressing structure 500. The thin film temperature sensor, the buckle structure 400 and the pressing structure 500 are combined together by a jig, and the temperature sensing surface of the thermistor 301 in the thin film temperature sensor is exposed in the opening 402 of the temperature measuring plane of the buckle structure 400. In use, the pressing structure 500 is pressed against the temperature measuring plane of the object to be measured, the back side of the temperature sensing surface of the thermistor 601 in the thin film temperature sensor is forced to be pressed against the concave part of the pressing structure 500, and the reaction force causes the temperature sensing surface of the thermistor 501 to be tightly pressed against the curved temperature measuring surface of the object to be measured. The concave part can ensure that the pressing structure composed of the heat insulation and insulation material can isolate the influence of the surrounding environment on the temperature measurement, and can also ensure that the thermistor in the thin film temperature sensor is not crushed during the whole pressing process, so that the temperature measurement of the thermistor 601 is more accurate. At this time, the buckle structure 400 clamps the thin film temperature sensor and the pressing structure 500, and the height of the temperature measuring plane of the buckle structure 400 is lower than the height of the thermistor 601 in the thin film temperature sensor. In this way, when the thin film temperature sensor is pulled outward by an external force, the thermistor 601 protruding from the temperature measuring plane of the buckle structure 400 becomes an obstacle to prevent the thin film temperature sensor from being pulled outward. Therefore, the thin film temperature sensor is fixed on the pressing structure 500. When the pressing structure 500 is fixed on the thin film temperature sensor 303 and tightly pressed against the temperature measuring surface of the object to be measured, the thermistor 601 protruding from the thin film surface is forced to be pressed into the concave part of the pressing structure 500, and the reaction force causes the thermistor 601 protruding from the thin film surface to be tightly pressed against the temperature measuring surface of the object to be measured. The opening structure of the metal in the buckle structure 400 immediately forms heat conduction and heat reflux around the thermistor 601 in the thin film temperature sensor, thereby greatly accelerating the response speed of the thin film temperature sensor.

[0089] Figure 7A is a schematic view of another embodiment of the application, which shows a temperature protection structure pressing on a thin film temperature sensor. Figure 7B is a schematic view of another embodiment of the application, which shows a fastening structure pressing on the temperature protection structure. Figure 7C is a sectional view along E-E' in Figure 7B .

[0090] The temperature sensor shown in the figure can include a thin film temperature sensor, which has a thermistor 702 and a covering thin film 701, a lead wire connected to the thermistor and a covering thin film 703. The thin film 701 and the thin film 703 can be integrally formed or formed in segments.

[0091] The temperature sensor shown in the figure also includes a temperature fuse structure, comprising a temperature fuse wrapped in an insulating structure 711 and leads 712 and 713 connected to the temperature fuse. The insulating structure 711 of the temperature fuse has a hole, and when the temperature fuse structure is pressed on the thin-film temperature sensor, the thermistor 702 is exposed through the hole 714.

[0092] The temperature sensor in this embodiment also includes a fastening structure 721 that presses against the temperature fuse structure and is coupled to the object being measured, thereby pressing the temperature fuse structure and the thin-film temperature sensor onto the object being measured.

[0093] According to other embodiments, the extending direction of the thin-film temperature sensor may be the same as or different from the extending direction of the temperature fuse structure. Here, the insulating structure 714 of the temperature fuse structure is made of ceramic.

[0094] In the embodiment shown in the figure, the mounting structure of the thin-film temperature sensor includes a thin-film temperature sensor 701, a temperature fuse 711 that is attached to the thin-film temperature sensor 701, and a pressing structure 721 that fixes the fuse. The temperature fuse 711 has a closed hole 714. When the pressing structure 721 fixes the thin-film temperature sensor, the temperature fuse will provide overheat protection if the temperature exceeds a specified temperature. The pressing structure 721 can press the temperature fuse 711, and then the temperature fuse 711 can press the thin-film temperature sensor 702. The thin-film temperature sensor 702 and the temperature fuse 711 are fixed at various angles, such as overlapping, 90-degree angle, 180-degree angle, or other angles.

[0095] Figure 8A This is a perspective view of a temperature sensing device according to another embodiment of the present invention. Figure 8B yes Figure 8A A top view of the temperature sensing device shown. Figure 8C yes Figure 8A The temperature sensing device shown is a side view. Figure 8D It is along Figure 8B The cross-sectional view shown by the dashed line E-E'. Figure 8E It is along Figure 8B The cross-sectional view shown by the dashed line F-F'.

[0096] The temperature sensing device shown in the figure includes a mounting structure 801 and a fastening structure 805 for mounting a thin-film temperature sensor onto an object being inspected. The thin-film temperature sensor includes a thermistor and leads. The mounting structure 801 has a surface that contacts the object being measured and a slot 802 on its side. An opening is present on the surface, allowing the head of the thin-film temperature sensor to protrude from the slot 802 and engage the front half of the thin-film temperature sensor head. A wedge 830 can be inserted into the slot 802 to engage the rear half of the thin-film temperature sensor head. The fastening structure 805 is coupled to the mounting structure 810 and to the object being measured, thereby pressing the mounting structure with the inserted thin-film temperature sensor onto the object. One or more protrusions 803 are present in the opening of the mounting structure for pushing the thin-film temperature sensor toward the object being measured. The fastening structure 805 has holes 810 for easy mounting onto the object. For example, the fastening structure 805 can be secured by screws or by inserting a ring underneath.

[0097] Figure 9A A perspective view of a thin-film temperature sensor being inserted into a mounting structure according to another embodiment of the present invention is shown. Figure 9B yes Figure 9A A top view of the temperature sensing device shown. Figure 9C It is along Figure 9B The cross-sectional view shown by the dashed line G-G'. Figure 9D yes Figure 9C A magnified view of a portion of the image.

[0098] exist Figure 9A In this integrated, pressed and adhered structure, the thin film 820 in front of the thermistor of the thin-film temperature sensor is deeply embedded in the groove. An arc-shaped structure 803 in the middle holds the thin-film thermistor 821 above the entire temperature-sensing surface. There is a cavity beneath the thermistor 821. When the thermistor 821 is compressed, the reverse side of its temperature-sensing surface is forced into the cavity. Simultaneously, the reaction force ensures that the temperature-sensing surface of the thermistor 821 is tightly pressed against the curved temperature-sensing surface of the object being measured. The cavity ensures that the pressing structure composed of thermal insulation material isolates the surrounding environment from the temperature measurement. It is also crucial to prevent the thermistor from being crushed during the entire fixing process, thus ensuring more accurate temperature measurement. The thin film behind the thermistor in the thin-film temperature sensor is also in the groove. When a wedge 830 is inserted into the groove below the end 815 of the thin film, the thin-film temperature sensor in the groove is completely fixed to the integrated pressed and adhered structure. The structure is made of insulating materials, including bakelite, plastic, or ceramic, and is tightly pressed together as a whole.

[0099] The above technical scheme replaces glue with a new structure, protects the environment, can maintain temperature measurement stability in high temperature and humid environment, lays a foundation for further full-automatic production, solves the problem of curved surface temperature measurement, and greatly improves the reaction speed of the thin film temperature sensor.

[0100] While the application has been described with reference to several exemplary embodiments, it is to be understood that the use of other words or terms such as "preferably," "according to an embodiment," "in an embodiment," or the like is intended to convey that particular embodiments include, or do not exclude, the listed steps or components. However, these terms and expressions are not intended to limit the scope of the application or to exclude the inclusion of other steps or components well-known to those of ordinary skill in the art. Furthermore, the described features, advantages, and characteristics can be combined in any suitable manner to form variant embodiments, and not all features or benefits necessarily need to be included in all such embodiments of the application. It will be apparent to those of ordinary skill in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application cover the modifications and variations of this application provided they come within the scope of the appended claims and their equivalents.

Claims

1. A mounting structure of a thin film temperature sensor having a thermistor and a lead, comprising: a pressing structure made of a heat-insulating and insulating material, including a close contact structure and a fixing structure for a temperature sensing surface of the thin film temperature sensor, the close contact structure being a planar close contact or a curved close contact and having a recess, the fixing structure being used to fix the mounting structure of the thin film temperature sensor; and a buckle structure including a metal sheet having a temperature sensing surface in contact with a measured object and a metal buckle extended from or coupled to the metal sheet, the temperature sensing surface of the metal buckle having an opening, wherein the metal buckle is fastened to the pressing structure, the head of the thermistor of the thin film temperature sensor is pressed into the recess of the pressing structure, and the head of the thermistor of the thin film temperature sensor is exposed from the opening of the temperature sensing surface of the metal buckle, being flush with or higher than the temperature sensing surface of the metal buckle.

2. The mounting structure of claim 1, wherein the thickness of the metal sheet of the buckle structure is less than 4 mm, and the temperature sensing surface is specifically a planar surface or a curved surface in contact with the surface of the measured object.

3. The mounting structure of claim 1, wherein the heat-insulating and insulating material includes at least one of bakelite, plastic, glass fiber, ceramic, and silicone rubber.

4. The mounting structure of claim 1, wherein the recess of the pressing structure is a closed hole, and the mounting structure further includes a heat-insulating and insulating gasket arranged in the hole.

5. The mounting structure of claim 1, wherein both sides of the pressing structure have slots respectively, and the metal buckle passes through the slots to be fastened to the pressing structure.

6. The mounting structure of claim 1, wherein the pressing structure is a housing of a temperature fuse.

7. The mounting structure of claim 1, wherein the thermistor is composed of a bare chip type thermistor and a glass-sealed type thermistor.

8. A temperature sensing device, comprising: a thin film temperature sensor having a thermistor and a lead; a pressing structure made of a heat-insulating and insulating material, including a close contact structure and a fixing structure for a temperature sensing surface of the thin film temperature sensor, the close contact structure being a planar close contact or a curved close contact and having a recess, the fixing structure being used to fix the mounting structure of the thin film temperature sensor; and a buckle structure including a metal sheet having a temperature sensing surface in contact with a measured object and a metal buckle extended from or coupled to the metal sheet, the temperature sensing surface of the metal buckle having an opening, wherein the metal buckle is fastened to the pressing structure, the head of the thermistor of the thin film temperature sensor is pressed into the recess of the pressing structure, and the head of the thermistor of the thin film temperature sensor is exposed from the opening of the temperature sensing surface of the metal buckle, being flush with or higher than the temperature sensing surface of the metal buckle.

9. The temperature sensing device of claim 8, wherein both sides of the pressing structure have slots respectively, and the metal buckle passes through the slots to be fastened to the pressing structure. ​ ​ ​ ​ ​

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