Semiconductor cleaning device and method

Abstract

The present invention provides a semiconductor cleaning device and method that can improve cleaning effect and efficiency, reduce cleaning consumables and shorten cleaning time. Its technical means: In terms of device, it includes a carrying platform and a cleaning component. The carrying platform can be used to carry semiconductor chips, and the cleaning component can be used for high-pressure washing and air drying of semiconductor chips. The carrying platform includes a carrying table and a main driving device; and the cleaning component includes a driving device, a high-pressure nozzle group and an imaging device. In terms of method, it includes: positioning step, imaging step, cleaning step and drying step.

Description

Technical Field

[0001] The present invention relates to a cleaning device structure and an application method in a semiconductor manufacturing process, and in particular to a semiconductor cleaning device and method. Background Art

[0002] Currently, due to the prevalence of consumer electronic products, there is a great demand for portability and multi-function, so that microelectronic packaging is gradually developing towards small size, high performance, and low cost.

[0003] Wafer Level Package (WLP) has the advantage of reducing the package size. When combined with Panel Level Package (PLP), it can significantly reduce costs, which just meets the market trend of mobile electronic products.

[0004] In various processes of wafer-level assembly, there is generally a cleaning gap process. Currently, conventional cleaning machines generally use assembly line cleaning machines and rotary cleaning machines.

[0005] The assembly line cleaning machine consumes a large amount of liquid, has limited nozzle height and angle, is large in size, takes a long time to clean, and the cleaning gap distance needs to be greater than 120μm. The continuous streamline movement will cause most of the liquid or medicine to be sprayed in the ineffective area, and the entire machine must be shut down for maintenance, which has a great impact on production efficiency.

[0006] The rotary cleaning machine uses centrifugal force to carry the liquid medicine or the potion away from the objects to be washed, but the centrifugal force has no effect at the center of the circle, resulting in different cleaning effects from the center to the periphery; the centrifugal force can only play a greater role under high-speed rotation. Under high-speed rotation, a large amount of liquid medicine or the potion needs to be replenished, and most of the liquid medicine or the potion will be sprayed in the ineffective area under high-speed rotation, resulting in the liquid medicine or the potion not entering the gap of the washed area. It will be thrown out, increasing the use of consumables and cleaning time, and the rotary cleaning machine is equipped with one or more sets of movable swing arms, the swing arm movement path is arc-shaped, the stroke is limited, and it cannot move to every position of the washed object.

[0007] The most important problem is that the gaps currently being cleaned are mostly smaller than 120um, and the capillary force is large, making it difficult for the liquid or solution in the gap to be discharged, resulting in difficult cleaning. The cleaning effects of both cannot effectively meet the current application needs of the industry, and have little help in improving the yield rate.

[0008] In view of this, how to provide a semiconductor cleaning device and method that can solve the above-mentioned problems, shorten the cleaning time, reduce the consumption of cleaning consumables, and ensure the cleaning effect and efficiency has become a subject to be improved by the present invention. Summary of the invention

[0009] The object of the present invention is to provide a semiconductor cleaning device and method which can improve cleaning effect and efficiency, reduce cleaning consumables and shorten cleaning time.

[0010] The present invention is developed to solve the above-mentioned problems. To achieve the purpose of the present invention, the first technical means of the device of the present invention is realized as follows: it is a semiconductor cleaning device, which includes a carrying platform and a cleaning component arranged on the top of the carrying platform. The carrying platform can be used to carry semiconductor chips, and the cleaning component can be used for high-pressure washing and air-drying of the semiconductor chips. It is characterized in that: the carrying platform includes a carrying table and a main driving device; the carrying table can be used to carry and position the semiconductor chips; the main driving device includes a main longitudinal driving device located at the bottom, and a main transverse driving device arranged between the main longitudinal driving device and the carrying table; the main longitudinal driving device can drive the main longitudinal driving device to make the carrying table thereon move longitudinally on a horizontal plane; the main transverse driving device can drive the carrying table to move transversely on a horizontal plane.

[0011] Preferably, the supporting platform also includes a secondary driving device, which includes a rotating motor and a bracket arranged between the supporting platform and the main driving device, wherein the rotating motor can drive the supporting platform to rotate, and the bracket is located outside the rotating motor; the bracket also includes three movable telescopic units arranged in a tripod form between the supporting platform and the main driving device, and the movable telescopic units can cooperate to drive the supporting platform to make a surface deflection in at least one direction with a horizontal plane as a reference.

[0012] Preferably, the cleaning component includes a driving device, a high-pressure nozzle group, and an imaging device; the driving device can be used to carry and drive the high-pressure nozzle group; the high-pressure nozzle group is arranged on the driving device, can be driven by the driving device to make three-dimensional movement in at least one direction, and can perform one of high-pressure flushing and air blowing drying on the semiconductor chip, and includes at least one nozzle with adjustable angle; the imaging device is arranged above the carrying platform, can take an image of the semiconductor chip carried on the carrying platform, and set a flushing operation path after calculating the flow path, so that the high-pressure nozzle group can flush according to the aforementioned flushing operation path.

[0013] Preferably, the driving device also includes a longitudinal driving device, a transverse driving device arranged at the bottom end of the longitudinal driving device, and a vertical driving device arranged on the transverse driving device, and the vertical driving device can be used to carry and drive the high-pressure nozzle group.

[0014] The second technical means of the device of the present invention is realized as follows: it is a semiconductor cleaning device, which includes a carrying platform and a cleaning component arranged on the top of the carrying platform, the carrying platform can be used to carry semiconductor chips, and the cleaning component can be used for high-pressure washing and air-blowing drying of the semiconductor chips, characterized in that: the cleaning component includes a driving device, a high-pressure nozzle group, and an imaging device; the driving device can be used to carry and drive the high-pressure nozzle group; the high-pressure nozzle group is arranged on the driving device, can be driven by the driving device to make three-dimensional movement in at least one direction, and can perform one of the actions of high-pressure washing and air-blowing drying on the semiconductor chips, and includes at least one nozzle with adjustable angle; the imaging device is arranged above the carrying platform, can take an image of the semiconductor chip carried on the carrying platform, and set a washing operation path after calculating the flow channel, so that the high-pressure nozzle group can wash according to the aforementioned washing operation path.

[0015] Preferably, the driving device also includes a longitudinal driving device, a transverse driving device arranged at the bottom end of the longitudinal driving device, and a vertical driving device arranged on the transverse driving device, and the vertical driving device can be used to carry and drive the high-pressure nozzle group.

[0016] Preferably, the carrying platform includes a carrying table and a main driving device; the carrying table can be used for carrying and positioning the semiconductor chip; the main driving device includes a main longitudinal driving device located at the bottom, and a main transverse driving device arranged between the main longitudinal driving device and the carrying table; the main longitudinal driving device can drive the main longitudinal driving device to make the carrying table thereon move longitudinally on a horizontal plane; the main transverse driving device can drive the carrying table to move transversely on a horizontal plane.

[0017] Preferably, the supporting platform also includes a secondary driving device, which includes a rotating motor and a bracket arranged between the supporting platform and the main driving device, wherein the rotating motor can drive the supporting platform to rotate, and the bracket is located outside the rotating motor; the bracket also includes three movable telescopic units arranged in a tripod form between the supporting platform and the main driving device, and the movable telescopic units can cooperate to drive the supporting platform to make a surface deflection in at least one direction with a horizontal plane as a reference.

[0018] The third technical means of the device of the present invention is realized as follows: it is a semiconductor cleaning device, which includes a carrying platform and a cleaning component arranged on the top of the carrying platform, the carrying platform can be used to carry semiconductor chips, and the cleaning component can be used for high-pressure washing and air-drying of the semiconductor chips, characterized in that: the carrying platform includes a carrying table and a main driving device; the carrying table can be used to carry and position the semiconductor chips; the main driving device includes a main longitudinal driving device located at the bottom, and a main transverse driving device arranged between the main longitudinal driving device and the carrying platform; the main longitudinal driving device can drive the main longitudinal driving device The main lateral drive device can drive the carrier to move horizontally on the horizontal plane; the drive device can be used to carry and drive the high-pressure nozzle group; the high-pressure nozzle group is arranged on the drive device, can be driven by the drive device to make three-dimensional movement in at least one direction, and can perform one of high-pressure flushing and air blowing drying on the semiconductor chip, and includes at least one nozzle with adjustable angle; the imaging device is arranged above the carrier platform, can capture the image of the semiconductor chip carried on the carrier platform, and set the flushing operation path after calculating the flow channel, so that the high-pressure nozzle group can flush according to the aforementioned flushing operation path.

[0019] Preferably, the supporting platform also includes a secondary driving device, which includes a rotating motor and a bracket arranged between the supporting platform and the main driving device, wherein the rotating motor can drive the supporting platform to rotate, and the bracket is located outside the rotating motor; the bracket also includes three movable telescopic units arranged in a tripod form between the supporting platform and the main driving device, and the movable telescopic units can cooperate to drive the supporting platform to make a surface deflection in at least one direction with a horizontal plane as a reference.

[0020] Preferably, the driving device also includes a longitudinal driving device, a transverse driving device arranged at the bottom end of the longitudinal driving device, and a vertical driving device arranged on the transverse driving device, and the vertical driving device can be used to carry and drive the high-pressure nozzle group.

[0021] The technical means of the method aspect of the present invention is realized as follows: it is a semiconductor cleaning method that can be used in conjunction with a semiconductor cleaning device, which includes: a positioning step, which is to move to a positioning position after loading the semiconductor chip; a phase-taking step, which is to calculate the flow channel after phase-taking and set a flushing operation path; a cleaning step, which is to adjust the cleaning component so that one or both of the carrier and the cleaning component make relative linear movements in at least one direction on a horizontal plane to perform a high-pressure flushing; and a drying step, which is to adjust the cleaning component for air-blowing drying.

[0022] Preferably, the cleaning step also includes a deflected cleaning step of allowing the support platform and the cleaning component to deflect in at least one direction with the horizontal plane as a reference, and then allowing one or both of the support platform and the cleaning component to move linearly in at least one direction on the horizontal plane relative to perform a high-pressure flushing again.

[0023] Preferably, the cleaning step also includes allowing the carrier platform and the cleaning component, or one of the carrier platform and the cleaning component or both of them, to make relative linear movement in at least one direction on the horizontal plane, but different from the direction of the first high-pressure washing, to perform an anisotropic cleaning step of performing a second high-pressure washing.

[0024] According to the above implementation, the following results can be obtained:

[0025] In summary, according to the semiconductor cleaning device of the present invention, the cooperation of the carrying platform and the cleaning component is utilized, which is different from the traditional semiconductor cleaning device, and can ensure the cleaning effect and efficiency, while reducing the consumption of cleaning consumables and shortening the cleaning time; and in terms of the method, the positioning step, the phase-taking step, the cleaning step and the drying step are utilized, which is different from the traditional semiconductor cleaning device, and in the cleaning step, the mobile high-pressure flushing is applied, which can cooperate with various semiconductor processes, so that the semiconductor chip can be cleaned reliably, but without wasting consumables and shortening the working hours. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a three-dimensional schematic diagram of the present invention.

[0027] Figure 2 It is a schematic diagram of the decomposition of the present invention.

[0028] Figure 3 for Figure 2 Schematic diagram of the exploded cleaning components.

[0029] Figure 4 for Figure 2 Exploded view of the middle stage and secondary drives.

[0030] Figure 5 for Figure 2 Schematic diagram of the main drive unit in the figure.

[0031] Figure 6 It is a three-dimensional implementation schematic diagram of the main driving device of the present invention when it is in operation.

[0032] Figure 7 It is a three-dimensional implementation schematic diagram of the main driving device of the present invention when it moves in another direction.

[0033] Figure 8 It is a three-dimensional schematic diagram of the secondary driving device in the present invention when it is in operation.

[0034] Fig. 9 It is a three-dimensional schematic diagram of the cleaning component of the present invention when it moves longitudinally.

[0035] Fig.10 It is a three-dimensional schematic diagram of the cleaning component of the present invention when it moves horizontally.

[0036] Fig.11 It is a three-dimensional schematic diagram of the vertical movement of the cleaning component and the adjustment of the nozzle in the present invention.

[0037] Fig.12 Schematic diagram of the cleaning process of the present invention.

[0038] Fig.13 It is a schematic diagram for implementing the positioning step and the phase-taking step of the present invention.

[0039] Fig.14 It is a schematic diagram of a first embodiment of the cleaning step of the present invention.

[0040] Fig.15 It is a schematic diagram of a second embodiment of the cleaning step of the present invention.

[0041] Fig.16 It is a schematic diagram of a third embodiment of the cleaning step of the present invention.

[0042] Fig.17 It is a schematic diagram of a first embodiment of the deflection cleaning step of the present invention.

[0043] Fig.18 It is a schematic diagram of a second embodiment of the deflection cleaning step of the present invention.

[0044] Fig.19 It is a schematic diagram of the implementation of the anisotropic cleaning step of the present invention.

[0045] Fig. 20 It is a schematic diagram of the implementation of the drying step of the present invention.

[0046] Description of reference numerals:

[0047] 1 Carrying platform 42 Horizontal driving device

[0048] 2 Main drive unit 43 Vertical drive unit

[0049] 21 Main longitudinal drive device 5 High pressure nozzle group

[0050] 22 Main lateral drive device 51 Nozzle

[0051] 3 Secondary drive 6 Image acquisition device

[0052] 31 Rotating motor 10 Semiconductor chip

[0053] 32 Bracket 100 Loading platform

[0054] 321 movable telescopic unit 200 cleaning component

[0055] 4 Drive unit A Horizontal plane

[0056] 41 Longitudinal drive R Flushing path

[0057] Ⅰ After loading the semiconductor chip, move to the positioning

[0058] Ⅱ Calculate the flow path after taking the phase and set the flushing operation path

[0059] Ⅲ Adjust the cleaning assembly so that one or both of the carrier and the cleaning assembly move in at least one direction relative to each other on the horizontal plane to perform a high-pressure wash.

[0060] Ⅲ-Ⅰ After the support platform and the cleaning component are deflected in at least one direction based on the horizontal plane, one or both of the support platform and the cleaning component are moved in a relative straight line in at least one direction on the horizontal plane to perform high-pressure washing again

[0061] III-II: Allow the carrier and the cleaning component to make one or both of them move in a relative straight line in at least one direction on the horizontal plane, but different from the direction of the first high-pressure washing, to perform a second high-pressure washing.

[0062] IV Adjust the cleaning components for air drying DETAILED DESCRIPTION

[0063] The following is a detailed description of the embodiments shown in the drawings. First, it should be noted that in the drawings, the same components or parts are represented by the same reference numerals as much as possible. In describing the present invention, in order not to confuse the gist of the present invention, the specific description of the related known functions or structures is omitted.

[0064] See also Figures 1 to 11Regarding the cleaning device, the first technical solution of the present invention is a semiconductor cleaning device, which includes a carrying platform 100 and a cleaning component 200 arranged on the top of the carrying platform 100, the carrying platform 100 can be used to carry semiconductor chips 10, and the cleaning component 200 can be used for high-pressure washing and air drying of the semiconductor chips 10, the carrying platform 100, which includes a carrying platform 1 and a main driving device 2; the carrying platform 1 can be used to carry and position the semiconductor chip 10; the main driving device 2 includes a main longitudinal driving device 21 located at the bottom, and a main transverse driving device 22 arranged between the main longitudinal driving device 21 and the carrying platform 1; the main longitudinal driving device 21 can drive the main longitudinal driving device 21 to make the carrying platform 1 thereon move longitudinally on the horizontal plane A; the main transverse driving device 22 can drive the carrying platform 1 to move transversely on the horizontal plane A.

[0065] Among them, through the application of this type of carrying platform 100, the carrying platform 1 is used to carry and position the semiconductor chip 10, and the main driving device 2 is used to drive the carrying platform 1. Through the application of the main longitudinal driving device 21 and the main transverse driving device 22, the carrying platform 1 and the secondary driving device 3 can be driven to perform longitudinal and transverse movements, so that the cleaning action can be diversified to meet different cleaning needs and avoid limiting the scope of application. The semiconductor chip 10 on the carrying platform 1 can be smoothly high-pressure rinsed and blow-dried by the cleaning component 200, and the semiconductor chip 10 can be smoothly and completely blow-dried.

[0066] Secondly, the semiconductor cleaning device of the present invention is different from the traditional semiconductor cleaning device and has no problems in application. It can reduce the consumption of cleaning consumables and shorten the cleaning time while ensuring the cleaning effect and efficiency. There is no need to shut down the entire machine for maintenance, and the impact on production efficiency is very small.

[0067] See also Figures 1 to 11Regarding the cleaning device, the second technical solution of the present invention is a semiconductor cleaning device, which includes a carrier platform 100 and a cleaning component 200 arranged on the top of the carrier platform 100. The carrier platform 100 can be used to carry semiconductor chips 10, and the cleaning component 200 can be used for high-pressure washing and air-blowing drying of the semiconductor chips 10. The cleaning component 200 includes a driving device 4, a high-pressure nozzle group 5, and an imaging device 6; the driving device 4 can be used to carry and drive the high-pressure nozzle group 5; The high-pressure nozzle group 5 is arranged on the driving device 4, can be driven by the driving device 4 to make three-dimensional movement in at least one direction, and can perform one of high-pressure flushing and air blowing drying on the semiconductor chip 10, and includes at least one nozzle 51 with adjustable angle; the imaging device 6 is arranged above the carrying platform 100, can image the semiconductor chip 10 carried on the carrying platform 100, and set the flushing operation path R after calculating the flow channel, so that the high-pressure nozzle group 5 can flush according to the aforementioned flushing operation path R.

[0068] Among them, through the application of this cleaning component 200, the driving device 4 is used to drive the high-pressure nozzle group 5 to move to completely clean the semiconductor chip 10, and the high-pressure nozzle group 5 is used to perform high-pressure flushing and jet drying on the semiconductor chip 10. The imaging device 6 is used to capture the semiconductor chip 10 carried on the carrier platform 100, and the flushing operation path R is set after calculating the flow channel. Flushing is performed according to the flushing operation path R to ensure that each cleaning operation is normal. Compared with traditional semiconductor cleaning devices, it can meet current application requirements and has higher cleaning efficiency.

[0069] See also Figures 1 to 11Regarding the cleaning device, the third technical solution of the present invention is a semiconductor cleaning device, which includes a carrier platform 100 and a cleaning component 200 arranged on the top of the carrier platform 100, the carrier platform 100 can be used to carry semiconductor chips 10, and the cleaning component 200 can be used for high-pressure washing and air drying of the semiconductor chips 10, the carrier platform 100, which includes a carrier platform 1 and a main driving device 2; the carrier platform 1 can be used for carrying and positioning the semiconductor chip 10; the main driving device 2 includes a main longitudinal driving device 21 located at the bottom, and a main transverse driving device 22 arranged between the main longitudinal driving device 21 and the carrier platform 1; the main longitudinal driving device 21 can drive the main longitudinal driving device The main lateral drive device 22 can drive the carrier 1 to move horizontally on the horizontal plane A; the drive device 4 can be used to carry and drive the high-pressure nozzle group 5; the high-pressure nozzle group 5 is arranged on the drive device 4, can be driven by the drive device 4 to make three-dimensional movement in at least one direction, and can perform one of high-pressure flushing and air blowing drying on the semiconductor chip 10, and includes at least one nozzle 51 with adjustable angle; the imaging device 6 is arranged above the carrier platform 100, can image the semiconductor chip 10 carried on the carrier platform 100, and set the flushing operation path R after calculating the flow channel, so that the high-pressure nozzle group 5 can flush according to the aforementioned flushing operation path R.

[0070] Among them, the first and second technical solutions of the present invention are integrated to become the third technical solution of the present invention, and the supporting platform 100 in the first technical solution is more effectively combined with the cleaning component 200 in the second technical solution, so that the semiconductor cleaning device of the present invention can be used in a wider range of applications and can be used in conjunction with different cleaning methods to increase the overall applicability.

[0071] See also Figures 5 to 7 The supporting platform 100 further includes a secondary driving device 3, which includes a rotating motor 31 and a bracket 32 ​​arranged between the supporting platform 1 and the main driving device 2. The rotating motor 31 can drive the supporting platform 1 to rotate, and the bracket 32 ​​is located outside the rotating motor 31; the bracket 32 ​​also includes three movable telescopic units 321 arranged in a tripod form between the supporting platform 1 and the main driving device 2, and the movable telescopic units 321 can cooperate to drive the supporting platform 1 to deflect in at least one direction with the horizontal plane A as a reference.

[0072] The secondary driving device 3 uses a rotary motor 31 and a bracket 32 ​​to allow the support platform 1 to rotate, thereby achieving more effective drying and avoiding the problem of poor drying.

[0073] Secondly, the use of the movable telescopic unit 321 in the form of a tripod can not only provide stable support, but also facilitate the control of the surface deflection of the support platform 1, so that the operation can meet various application needs without worrying about the problem of being unable to be applied.

[0074] See also Figure 3 , Figures 9 to 11 The driving device 4 also includes a longitudinal driving device 41, a transverse driving device 42 arranged at the bottom of the longitudinal driving device 41, and a vertical driving device 43 arranged on the transverse driving device 42, and the vertical driving device 43 can be used to carry and drive the high-pressure nozzle group 5.

[0075] Among them, through the application of the longitudinal drive device 41, the high-pressure nozzle group 5 can be driven to move longitudinally, and the application of the transverse drive device 42 can drive the high-pressure nozzle group 5 to move transversely, and the application of the vertical drive device 43 can drive the high-pressure nozzle group 5 to move vertically to adjust the pressure when cleaning the semiconductor chip 10. In this way, the position of the high-pressure nozzle group 5 can be adjusted quickly and freely, and high-pressure flushing can be achieved throughout the cleaning process, as well as clearer and more accurate imaging.

[0076] See also Figures 12 to 16 and Fig.19 The cleaning method of the present invention is a semiconductor cleaning method that can be used in conjunction with a semiconductor cleaning device, and includes: a positioning step I, which is to move to a positioning position after loading the semiconductor chip; a phase-taking step II, which is to calculate the flow channel after phase-taking and set a flushing operation path; a cleaning step III, which is to adjust the cleaning component so that one or both of the carrier and the cleaning component move in a relative straight line in at least one direction on a horizontal plane to perform a high-pressure flushing; and a drying step IV, which is to adjust the cleaning component to perform air-blowing drying.

[0077] Among them, through the application of this cleaning method, the positioning step I can ensure that the positioning is correct each time; the phase-taking step II can cooperate with the loading of semiconductor chips to ensure that each cleaning is sufficient and more efficient; the cleaning step III is different from the traditional semiconductor cleaning device because it is equipped with a semiconductor cleaning device, so it can perform real high-pressure flushing during cleaning and can clean more accurately; the investment of the drying step IV can increase the overall processing speed and shorten the working hours to facilitate the next stage of processing.

[0078] Secondly, the key point of the cleaning method of the present invention is the preparation of the cleaning step III, through different cleaning methods to meet the application needs.

[0079] Application example 1: Fig.13 The positioning steps and phase-taking steps are combined with Fig.14 In the first embodiment of the cleaning step, the high pressure nozzle group 5 can be actuated according to the flushing operation path R, and cooperate with the stationary carrier 1 to perform flushing, and finally add the following Fig. 20 The drying step completes the cleaning of the semiconductor chip.

[0080] Application Example 2: Fig.13 The positioning steps and phase-taking steps are combined with Fig.15 In the second embodiment of the cleaning step, the carrier 1 can be actuated according to the flushing operation path R, and cooperate with the stationary high-pressure nozzle group 5 to perform flushing, and finally add the following Fig. 20 The drying step completes the cleaning of the semiconductor chip.

[0081] Application Example 3: Fig.13 The positioning steps and phase-taking steps are combined with Fig.16 In the third embodiment of the cleaning step, the carrier 1 and the carrier 1 can be actuated according to the flushing operation path R to perform flushing, and finally, the following steps are added: Fig. 20 The drying step completes the cleaning of the semiconductor chip.

[0082] See also Fig.12 and Fig.17 , Fig.18 The cleaning step III also includes allowing the support platform and the cleaning component to deflect in at least one direction with the horizontal plane as a reference, and then allowing one or both of the support platform and the cleaning component to move linearly in at least one direction on the horizontal plane to perform a high-pressure washing again in the deflected cleaning step III-I.

[0083] Among them, in the cleaning step III, adding the deployment of the skew cleaning step III-I can improve the cleaning effect to meet the need for more careful cleaning of semiconductor chips.

[0084] Application example 1: Fig.13 The positioning steps and phase-taking steps are combined with Fig.14 In the first embodiment of the cleaning step, the high pressure nozzle group 5 can be actuated according to the flushing operation path R, and cooperate with the stationary carrier 1 to perform flushing, and then add the following Fig.17 The first embodiment of the deflection cleaning step is finally added as follows Fig. 20 The drying step completes the cleaning of the semiconductor chip.

[0085] Application Example 2: Fig.13 The positioning step and the phase-taking step are combined with Fig.15In the second embodiment of the cleaning step, the carrier 1 can be actuated according to the flushing operation path R, and cooperate with the stationary high-pressure nozzle group 5 to perform flushing, and then add the following Fig.18 The second embodiment of the deflection cleaning step is finally added as follows Fig. 20 The drying step completes the cleaning of the semiconductor chip.

[0086] See also Fig.12 and Fig.19 The cleaning step III also includes allowing the carrier platform and the cleaning component, or one of the carrier platform and the cleaning component or both of them, to make a relative linear movement in at least one direction on the horizontal plane, but different from the direction of the first high-pressure washing, to perform an anisotropic cleaning step III-II for a second high-pressure washing.

[0087] Among them, in the cleaning step III, adding the preparation of the anisotropic cleaning step III-II can improve the cleaning effect, so as to cooperate with the cleaning of semiconductor chips that are not suitable for skew cleaning and increase the application range.

[0088] Application example: Fig.13 The positioning steps and phase-taking steps are combined with Fig.15 In the second embodiment of the cleaning step, the carrier 1 can be actuated according to the flushing operation path R, and cooperate with the stationary high-pressure nozzle group 5 to perform flushing, and then add the following Fig.19 The anisotropic cleaning step is then followed by Fig. 20 The drying step completes the cleaning of the semiconductor chip.

[0089] Finally, it should be noted that the above Fig. 20 In the drying step, although not shown in the figure, the carrier 1 can also be dried by the high-pressure nozzle group 5 without rotating.

[0090] The above describes in detail the structure, features and effects of the present invention based on the embodiments shown in the drawings. The above is only a preferred embodiment of the present invention, but the present invention is not limited to the scope of implementation shown in the drawings. Any changes made in accordance with the concept of the present invention, or modifications to equivalent embodiments with equivalent changes, which still do not exceed the spirit covered by the description and drawings, should be within the protection scope of the present invention.

Claims

1. A semiconductor cleaning device, comprising a carrying platform (100) and a cleaning assembly (200) arranged on the top of the carrying platform (100), wherein the carrying platform (100) can be used to carry a semiconductor chip (10), and the cleaning assembly (200) can be used to perform high-pressure washing and air-blowing drying on the semiconductor chip (10), characterized in that: The carrying platform (100) comprises a carrying platform (1) and a main driving device (2); The carrier platform (1) can be used for carrying and positioning the semiconductor chip (10); The main driving device (2) comprises a main longitudinal driving device (21) located at the bottom, and a main transverse driving device (22) arranged between the main longitudinal driving device (21) and the supporting platform (1); The main longitudinal driving device (21) can drive the main longitudinal driving device (21) to make the supporting platform (1) thereon move longitudinally on the horizontal plane (A); The main transverse driving device (22) can drive the support platform (1) to move transversely on the horizontal plane (A); The carrying platform (100) further comprises a secondary driving device (3), which comprises a rotating motor (31) disposed between the carrying platform (1) and the primary driving device (2), and a bracket (32), wherein the rotating motor (31) can drive the carrying platform (1) to rotate, and the bracket (32) is located outside the rotating motor (31); The support (32) further comprises three movable telescopic units (321) arranged in a tripod-like manner between the support platform (1) and the main driving device (2); the movable telescopic units (321) can cooperate to drive the support platform (1) to perform surface deflection in at least one direction with the horizontal plane (A) as a reference.

2. The semiconductor cleaning device according to claim 1, characterized in that: The cleaning assembly (200) comprises a driving device (4), a high-pressure nozzle group (5), and an imaging device (6); The driving device (4) is capable of carrying and driving the high-pressure nozzle group (5); The high-pressure nozzle group (5) is arranged on the driving device (4), can be driven by the driving device (4) to move in at least one direction, and can perform one of high-pressure washing and air-blowing drying on the semiconductor chip (10), and includes at least one nozzle (51) with an adjustable angle; The imaging device (6) is disposed above the carrier platform (100) and is capable of capturing an image of the semiconductor chip (10) carried on the carrier platform (100) so as to calculate a flow path and set a flushing operation path (R), so that the high-pressure nozzle group (5) can perform flushing according to the aforementioned flushing operation path (R).

3. The semiconductor cleaning device according to claim 2, characterized in that: The driving device (4) further comprises a longitudinal driving device (41), a transverse driving device (42) arranged at the bottom end of the longitudinal driving device (41), and a vertical driving device (43) arranged on the transverse driving device (42), wherein the vertical driving device (43) can be used to carry and drive the high-pressure nozzle group (5).

4. A semiconductor cleaning device, comprising a carrying platform (100) and a cleaning assembly (200) arranged on the top of the carrying platform (100), wherein the carrying platform (100) can be used to carry a semiconductor chip (10), and the cleaning assembly (200) can be used to perform high-pressure washing and air-blowing drying on the semiconductor chip (10), characterized in that: The cleaning assembly (200) comprises a driving device (4), a high-pressure nozzle group (5), and an imaging device (6); The driving device (4) is capable of carrying and driving the high-pressure nozzle group (5); The high-pressure nozzle group (5) is arranged on the driving device (4), can be driven by the driving device (4) to move in at least one direction, and can perform one of high-pressure washing and air-blowing drying on the semiconductor chip (10), and includes at least one nozzle (51) with an adjustable angle; The imaging device (6) is disposed above the carrying platform (100) and is capable of imaging the semiconductor chip (10) carried on the carrying platform (100) to calculate the flow path and set a flushing operation path (R), so that the high-pressure nozzle group (5) can perform flushing according to the flushing operation path (R); The driving device (4) further comprises a longitudinal driving device (41), a transverse driving device (42) arranged at the bottom end of the longitudinal driving device (41), and a vertical driving device (43) arranged on the transverse driving device (42), wherein the vertical driving device (43) can be used to carry and drive the high-pressure nozzle group (5); The carrying platform (100) comprises a carrying platform (1) and a main driving device (2); The carrier platform (1) can be used for carrying and positioning the semiconductor chip (10); The main driving device (2) comprises a main longitudinal driving device (21) located at the bottom, and a main transverse driving device (22) arranged between the main longitudinal driving device (21) and the supporting platform (1); The main longitudinal driving device (21) can drive the main longitudinal driving device (21) to make the supporting platform (1) thereon move longitudinally on the horizontal plane (A); The main transverse driving device (22) can drive the support platform (1) to move transversely on the horizontal plane (A); The carrying platform (100) further comprises a secondary driving device (3), which comprises a rotating motor (31) disposed between the carrying platform (1) and the primary driving device (2), and a bracket (32), wherein the rotating motor (31) can drive the carrying platform (1) to rotate, and the bracket (32) is located outside the rotating motor (31); The support (32) further comprises three movable telescopic units (321) arranged in a tripod-like manner between the support platform (1) and the main driving device (2); the movable telescopic units (321) can cooperate to drive the support platform (1) to perform surface deflection in at least one direction with the horizontal plane (A) as a reference.

5. A semiconductor cleaning device, comprising a carrying platform (100) and a cleaning assembly (200) arranged on the top of the carrying platform (100), wherein the carrying platform (100) can be used to carry a semiconductor chip (10), and the cleaning assembly (200) can be used to perform high-pressure washing and air-blowing drying on the semiconductor chip (10), characterized in that: The carrying platform (100) comprises a carrying platform (1) and a main driving device (2); The cleaning assembly (200) comprises a driving device (4), a high-pressure nozzle group (5), and an imaging device (6); The carrier platform (1) can be used for carrying and positioning the semiconductor chip (10); The main driving device (2) comprises a main longitudinal driving device (21) located at the bottom, and a main transverse driving device (22) arranged between the main longitudinal driving device (21) and the supporting platform (1); The main longitudinal driving device (21) can drive the main longitudinal driving device (21) to make the supporting platform (1) thereon move longitudinally on the horizontal plane (A); The main transverse driving device (22) can drive the support platform (1) to move transversely on the horizontal plane (A); The driving device (4) is capable of carrying and driving the high-pressure nozzle group (5); The high-pressure nozzle group (5) is arranged on the driving device (4), can be driven by the driving device (4) to move in at least one direction, and can perform one of high-pressure washing and air-blowing drying on the semiconductor chip (10), and includes at least one nozzle (51) with an adjustable angle; The imaging device (6) is disposed above the carrying platform (100) and is capable of imaging the semiconductor chip (10) carried on the carrying platform (100) to calculate the flow path and set a flushing operation path (R), so that the high-pressure nozzle group (5) can perform flushing according to the flushing operation path (R); The carrying platform (100) further comprises a secondary driving device (3), which comprises a rotating motor (31) disposed between the carrying platform (1) and the primary driving device (2), and a bracket (32), wherein the rotating motor (31) can drive the carrying platform (1) to rotate, and the bracket (32) is located outside the rotating motor (31); The support (32) further comprises three movable telescopic units (321) arranged in a tripod-like manner between the support platform (1) and the main driving device (2); the movable telescopic units (321) can cooperate to drive the support platform (1) to perform surface deflection in at least one direction with the horizontal plane (A) as a reference.

6. The semiconductor cleaning device according to claim 5, characterized in that: The driving device (4) further comprises a longitudinal driving device (41), a transverse driving device (42) arranged at the bottom end of the longitudinal driving device (41), and a vertical driving device (43) arranged on the transverse driving device (42), wherein the vertical driving device (43) can be used to carry and drive the high-pressure nozzle group (5).

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