Solid State Relay Automatic Test Device

Abstract

An embodiment of the present application provides an automatic testing device for solid-state relays, which relates to the field of device detection technology. A controller drives the various parts of the actuator to realize the transportation of the solid-state relay during the test process, so that the solid-state relay automatically completes the transfer and transportation during loading, testing, and unloading. At the same time, the test equipment is electrically connected to the test mechanism in the actuator to complete the detection of the solid-state relay loaded on the test mechanism, thereby improving the detection efficiency of the solid-state relay.

Description

Technical Field

[0001] The present application belongs to the field of device detection technology, and specifically relates to an automatic testing device for solid-state relays. Background Art

[0002] Solid-state relays are common components in the electronics industry and are widely used. Their quality directly determines the lifespan and stability of electronic products. Therefore, manufacturers must conduct full or random inspections of solid-state relays for performance and safety testing during production and incoming materials. Conventional manual testing using equipment is not suitable for full factory inspections or for inspections in the event of an anomaly, requiring significant labor. Summary of the Invention

[0003] In order to at least to some extent solve the problem of low detection efficiency when manually inspecting all solid-state relays, the present application provides an automatic testing device for solid-state relays, which can improve the detection efficiency of solid-state relays.

[0004] To achieve the above objectives, the present application provides an automatic testing device for solid-state relays, comprising: a controller, a testing device, and an actuator; the controller is used to drive the actuator to transport the solid-state relay; the actuator comprises: a vibration feeding mechanism, a vibration discharging mechanism, a testing mechanism, and a testing and transporting mechanism;

[0005] The vibration feeding mechanism is used to guide the solid-state relay loaded in its feeding tube to the first component grabbing slot thereon by vibration;

[0006] The vibration discharging mechanism is used to guide the solid-state relay in the second device grabbing slot to the feeding tube via vibration;

[0007] The test transport mechanism is used to transport solid-state relays from the first component grabbing slot to the test mechanism, transport qualified solid-state relays from the test mechanism to the second component grabbing slot, and transport unqualified solid-state relays from the test mechanism to an NG product recycling box;

[0008] The testing device is electrically connected to the testing mechanism and is used to test the solid-state relay loaded on the testing mechanism.

[0009] In the solid-state relay automatic testing device as described above, the actuator further comprises: a material tube transport mechanism, a loading mechanism, a unloading mechanism and a transition chamber;

[0010] The material pipe conveying mechanism is used to convey the material pipe loaded with solid-state relays from the loading mechanism to the vibrating feeding mechanism, to convey the material pipe loaded with solid-state relays from the vibrating discharging mechanism to the unloading mechanism, to convey the empty material pipe from the vibrating feeding mechanism to the transition bin, and to convey the empty material pipe from the transition bin to the vibrating discharging mechanism.

[0011] In the solid-state relay automatic test device described above, the vibration feeding mechanism includes: a first oscillator, a first material tube placement slot, and a first component guide slot; the feeding port located in the first component guide slot is provided with a first feeding photoelectric switch; the discharging port located in the first component guide slot is provided with a first discharging photoelectric switch and the first component grabbing slot;

[0012] The first oscillator is used to guide the solid-state relay on the first material tube placement slot out of the material tube through the first device guide slot to the first device grabbing slot by its own vibration;

[0013] The first feeding photoelectric switch is used to control the tube conveying mechanism to convey the empty tube from the vibrating feeding mechanism to the transition bin when the tube placed in the first tube placement trough is empty;

[0014] The first discharge photoelectric switch is used to control the test transport mechanism to transport the solid-state relay from the first device grabbing slot to the test mechanism.

[0015] In the solid-state relay automatic testing device described above, a heating device is provided on the first component guiding groove for heating the solid-state relay on the first component guiding groove.

[0016] In the solid-state relay automatic test device described above, the vibration discharge mechanism includes: a second oscillator, a second material tube placement slot, and a second device guide slot; the discharge port located in the second device guide slot is provided with a second discharge photoelectric switch; the feed port located in the second device guide slot is provided with a second feed photoelectric switch and a second device grabbing slot;

[0017] The second oscillator is used to guide the solid-state relay on the second component grabbing slot through the second component guiding slot into the material tube on the second material tube placement slot by its own vibration;

[0018] The second discharging photoelectric switch is used to control the material tube conveying mechanism to convey the material tube loaded with the solid-state relay from the vibrating discharging mechanism to the unloading mechanism when the material tubes on the second material tube placement trough are full;

[0019] The second feeding photoelectric switch is used to control the test transport mechanism to transport the solid-state relays that have passed the test from the test mechanism to the second device grabbing slot.

[0020] In the solid-state relay automatic testing device described above, a cooling device is provided on the second device guiding groove for dissipating heat from the solid-state relay on the second device guiding groove.

[0021] In the automatic testing device for solid-state relays as described above, the testing mechanism comprises: a first supporting frame, a first clamping cylinder provided on the first supporting frame, a positioning slot and a testing probe;

[0022] The first clamping cylinder is used to clamp the test probe so that the test probe contacts the pin of the solid-state relay placed in the positioning groove through the positioning groove; the test probe is electrically connected to the test equipment.

[0023] In the solid-state relay automatic test device as described above, the test handling mechanism includes: a second support frame, a first stepper motor located on the second support frame, a first lead screw, a first guide rod, a first moving platform, and a first limit photoelectric switch;

[0024] The first stepper motor is configured to be driven by the controller to drive the first movable platform to move along the first guide rod by controlling the rotation of the first lead screw;

[0025] The first limit photoelectric switch is located on the first guide rod and is correspondingly arranged above the first component guide groove, the second component guide groove station, and the positioning groove station, and is used to limit the first movable machine to move to the corresponding grasping station;

[0026] The first movable machine is provided with a first descending cylinder, a telescopic cylinder and a rubber suction nozzle. The rubber suction nozzle is controlled to move by the first descending cylinder and the telescopic cylinder to transport the solid-state relay from the first component grabbing slot to the positioning slot of the testing mechanism, and to transport the solid-state relay that has passed the inspection from the positioning slot of the testing mechanism to the second component grabbing slot, and to transport the solid-state relay that has failed the inspection from the positioning slot of the testing mechanism to the NG product recycling box.

[0027] In the solid-state relay automatic testing device described above, the material tube transport mechanism includes: a third support frame, a second stepping motor located on the third support frame, a second lead screw, a second guide rod, a second moving platform, and a second limit photoelectric switch;

[0028] The second stepping motor is configured to be driven by the controller and drive the second movable platform to move along the second guide rod by controlling the rotation of the second lead screw;

[0029] The second limit photoelectric switch is located on the second guide rod and is correspondingly arranged above the material pipe station of the loading mechanism, the vibrating feeding mechanism, the vibrating discharging mechanism, the unloading mechanism and the transition bin, and is used to limit the second movable machine to move to the corresponding grasping station;

[0030] The second movable machine is provided with a second descending cylinder and a second clamping cylinder for clamping the material tube on the work station and controlling its up and down movement.

[0031] In the solid-state relay automatic testing device as described above, the feeding mechanism includes: two oppositely arranged first height limiting slots, a fourth support frame, a third stepping motor arranged on the fourth support frame, a third lead screw, a first push rod and a first height limiting photoelectric switch;

[0032] The third stepper motor is driven by the controller to drive the first push rod to move up and down by controlling the rotation of the third lead screw, so that the material tube loaded with the solid-state relay on the first push rod moves upward along the first height limit groove; the first height limit photoelectric switch is used to limit the first push rod to the material tube grabbing position of the feeding mechanism;

[0033] The blanking mechanism includes: two second height limiting grooves arranged opposite to each other, a fifth support frame, a fourth stepping motor arranged on the fifth support frame, a fourth lead screw, a second push rod and a second height limiting photoelectric switch;

[0034] The fourth stepper motor is driven by the controller to drive the second push rod to move up and down by controlling the rotation of the fourth lead screw, so that the material tube loaded with the solid-state relay on the second push rod moves downward along the second height limit groove; the second height limit photoelectric switch is used to limit the second push rod to the material tube grabbing position of the unloading mechanism;

[0035] The transition chamber includes: two third height limiting slots arranged opposite to each other, a sixth support frame, a fifth stepping motor arranged on the sixth support frame, a fifth lead screw, a third push rod and a third height limiting photoelectric switch;

[0036] The fifth stepper motor is used to be driven by the controller to drive the third push rod to move up and down by controlling the rotation of the fifth screw, so that the empty material tube on the third push rod moves up and down along the third height limit groove; the third height limit photoelectric switch is used to limit the third push rod to the material tube grabbing position of the transition bin.

[0037] An automatic testing device for solid-state relays provided in an embodiment of the present invention includes a controller, a test device, and an actuator. The controller drives the various parts of the actuator to realize the transportation of the solid-state relay during the test process, so that the solid-state relay automatically completes the transfer and transportation during loading, testing, and unloading. At the same time, the test device is electrically connected to the test mechanism in the actuator to complete the detection of the solid-state relay loaded on the test mechanism, thereby improving the detection efficiency of the solid-state relay.

[0038] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0040] Figure 1 This is a schematic diagram of the execution mechanism in the embodiment of the present application;

[0041] Figure 2 This is a schematic diagram of a vibrating feeding mechanism in an embodiment of the present application;

[0042] Figure 3 This is a schematic diagram of the vibration discharging mechanism in the embodiment of the present application;

[0043] Figure 4 This is a schematic diagram of the test mechanism in the embodiment of the present application;

[0044] Figure 5 This is a schematic diagram of the test transport mechanism in the embodiment of the present application;

[0045] Figure 6 This is a schematic diagram of the material tube handling mechanism in the embodiment of the present application;

[0046] Figure 7 This is a schematic diagram of the feeding mechanism in the embodiment of the present application;

[0047] Figure 8 This is a schematic diagram of the blanking mechanism in the embodiment of the present application;

[0048] Figure 9 This is a schematic diagram of the transition chamber in the embodiment of this application.

[0049] Explanation of Figure Numbers

[0050] 1-vibration feeding mechanism, 2-vibration discharging mechanism, 3-testing mechanism, 4-test handling mechanism, 5-material tube handling mechanism, 6-loading mechanism, 7-unloading mechanism, 8-transition bin, 11-first device grabbing slot, 12-first vibrator, 13-first material tube placement slot, 14-first device guide slot, 15-first feeding photoelectric switch, 16-first discharging photoelectric switch, 21-second device grabbing slot, 22-second vibrator, 23-second material tube placement slot, 24-second device guide slot, 25-second discharging photoelectric switch, 26-second feeding photoelectric switch, 31-first supporting frame, 32-first clamping cylinder, 33-positioning slot, 34-test probe, 41-second supporting frame, 42- First stepper motor, 43-first lead screw, 44-first guide rod, 45-first mobile platform, 46-first limit photoelectric switch, 47-first descending cylinder, 48-telescopic cylinder, 49-rubber nozzle, 491-positioning slot, 51-third support frame, 52-second stepper motor, 53-second lead screw, 54-second guide rod, 55-second mobile platform, 56-second limit photoelectric switch, 57-second descending cylinder, 58-second clamping cylinder, 61-first height limit slot, 62-fourth support frame, 63-third stepper motor, 64-third lead screw, 65-first push rod, 66-first height limit photoelectric switch, 71-second height limit slot, 72-fifth support frame, 73-fourth stepper motor, 74-fourth lead screw, 75-second push rod, 76-second height limit photoelectric switch, 81-third height limit slot, 82- Sixth support frame, 83-fifth stepping motor, 84-fifth lead screw, 85-third push rod, 86-third height-limiting photoelectric switch. DETAILED DESCRIPTION

[0051] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions of this application will be described in detail below. Obviously, the embodiments described are only some of the embodiments of this application, rather than all of them. Based on the embodiments in this application, all other implementation methods obtained by ordinary technicians in this field without making any creative work are within the scope of protection of this application.

[0052] This embodiment provides a solid-state relay automatic testing device, including: a controller, a testing device and an actuator; the controller is used to drive the actuator to carry the solid-state relay; Figure 1 As shown, the actuator specifically includes: a vibration feeding mechanism 1, a vibration discharging mechanism 2, a testing mechanism 3, and a testing and transporting mechanism 4; wherein:

[0053] A vibration feeding mechanism 1, used for guiding the solid-state relay loaded in its feeding tube to the first component grabbing slot 11 thereof by vibration;

[0054] A vibration discharge mechanism 2 is used to guide the solid-state relay in the second device grabbing slot 21 thereof to its feeding tube via vibration;

[0055] The test transport mechanism 4 is used to transport the solid-state relays from the first device grabbing slot 11 to the test mechanism 3, transport the solid-state relays that have passed the test from the test mechanism 3 to the second device grabbing slot 21, and transport the solid-state relays that have failed the test from the test mechanism 3 to the NG product recycling box;

[0056] The testing device is electrically connected to the testing mechanism 3 and is used to test the solid-state relay loaded on the testing mechanism 3 .

[0057] Specifically, if Figure 1 As shown in the figure, the vibrating feeding mechanism 1 and the vibrating discharging mechanism 2 are placed in parallel and facing each other. A material tube for loading solid-state relays is placed on the left side of each mechanism; the slot for solid-state relays is placed on the right side. The difference is that the vibrating feeding mechanism 1 vibrates and guides the solid-state relays loaded in its feeding tube to the first device grabbing slot 11 (located at the rightmost end of the slot for solid-state relays); the vibrating discharging mechanism 2 vibrates and guides the solid-state relays in the second device grabbing slot 21 (located at the rightmost end of the slot for solid-state relays) into its feeding tube. The testing mechanism 3 is located between the first device grabbing slot 11 and the second device grabbing slot 21. The testing equipment is electrically connected to the testing mechanism 3 and is used to detect the solid-state relays loaded on the testing mechanism 3. During the test process, the test transport mechanism 4 can transport the solid-state relay from the first device grabbing slot 11 to the test mechanism 3 to complete the loading process; after the test equipment completes the inspection of the solid-state relay loaded on the test mechanism 3, the test transport mechanism 4 will transport the solid-state relay that has passed the inspection from the test mechanism 3 to the second device grabbing slot 21 to complete the unloading process, and transport the solid-state relay that has failed the inspection from the test mechanism 3 to the NG product recycling box (such as the recycling box with the "NG product" mark next to the test mechanism 3 in Figure 1), thereby realizing the automated transportation of solid-state relays during the inspection process. The inspector only needs to place the material tube containing the solid-state relay to be inspected into the vibrating feeding mechanism 1 and remove the material tube of the solid-state relay that has passed the inspection from the vibrating discharging mechanism 2 to complete the test, which greatly saves labor costs.

[0058] In a specific implementation, Figure 1 As shown, the above-mentioned actuator may further include: a material pipe transport mechanism 5, a loading mechanism 6, a unloading mechanism 7 and a transition bin 8; wherein:

[0059] The material tube conveying mechanism 5 is used to convey the material tube loaded with solid-state relays from the loading mechanism 6 to the vibrating feeding mechanism 1, to convey the material tube loaded with solid-state relays from the vibrating discharging mechanism 2 to the unloading mechanism 7, to convey the empty material tube from the vibrating feeding mechanism 1 to the transition bin 8, and to convey the empty material tube from the transition bin 8 to the vibrating discharging mechanism 2.

[0060] Specifically, if Figure 1 As shown in FIG, the loading mechanism 6, the unloading mechanism 7, and the transition bin 8 are used to buffer and store the material tubes, and the material tube handling mechanism 5 is used to transport the material tubes between these mechanisms and the vibrating feed mechanism 1 and the vibrating discharge mechanism 2. For example, the inspection personnel can pre-place the material tubes carrying the solid-state relays to be inspected in batches on the loading mechanism 6 for buffering, and then use the material tube handling mechanism 5 to transport these material tubes to the vibrating feed mechanism 1 in sequence for loading. After loading is completed, the remaining empty material tubes on the vibrating feed mechanism 1 can be transported to the transition bin 8 through the material tube handling mechanism 5 for use when unloading, while also freeing up storage space for the next batch of material tubes to be loaded. When the material tubes on the vibrating discharge mechanism 2 are full of inspected solid-state relays, the material tube handling mechanism 5 can transport these material tubes to the unloading mechanism 7. Afterwards, the material tube handling mechanism 5 can transport the empty material tubes on the transition bin 8 to the vibrating discharge mechanism 2 for loading with the solid-state relays that have been inspected. During this process, the inspectors only need to place the material tubes containing the solid-state relays to be inspected in batches on the loading mechanism 6, and remove the material tubes of the solid-state relays that have completed inspection from the unloading mechanism 7, thereby greatly reducing the complexity of manual operations.

[0061] In a specific implementation, Figure 2 As shown, the vibration feeding mechanism 1 may specifically include: a first vibrator 12, a first material tube placement slot 13, and a first device guide slot 14. A first feeding photoelectric switch 15 is provided at the feeding port of the first device guide slot 14, and a first discharging photoelectric switch 16 and a first device grabbing slot 11 are provided at the discharging port of the first device guide slot 14; wherein:

[0062] The first oscillator 12 is used to guide the solid-state relay on the first material tube placement slot 13 out of the material tube through the first device guide slot 14 to the first device grabbing slot 11 through its own vibration;

[0063] The first feeding photoelectric switch 15 is used to control the tube transport mechanism 5 to transport the empty tube from the vibrating feeding mechanism 1 to the transition bin 8 when the tube in the first tube placement slot 13 is empty;

[0064] The first discharge photoelectric switch 16 is used to control the test transport mechanism 4 to transport the solid-state relay from the first device grabbing slot 11 to the test mechanism 3 .

[0065] Specifically, if Figure 2 As shown in FIG, the first vibrator 12 uses its own vibration to guide the solid-state relay in the first material tube placement slot 13 out of the material tube, through the first component guide slot 14 to the first component grabbing slot 11. During this process, the first feed photoelectric switch 15 counts the solid-state relays entering the first component guide slot 14 to determine whether the material tube has been guided empty. When the material tube is guided empty, the controller is triggered to control the material tube transport mechanism 5 to transport the empty material tube from the vibrating feed mechanism 1 to the transition bin 8. Furthermore, during the solid-state relay guidance process, the first discharge photoelectric switch 16 detects whether there is a solid-state relay in the first component grabbing slot 11. If so, the controller is triggered to control the test transport mechanism 4 to transport the solid-state relay from the first component grabbing slot 11 to the test mechanism 3 for testing.

[0066] In one embodiment, a heating device is further provided on the first device guide slot 14 to heat the solid-state relay in the first device guide slot 14 to perform thermal aging testing on the solid-state relay. For example, a heating rod can be provided at the bottom of the first device guide slot 14 to heat the solid-state relay by increasing its temperature through an external power source.

[0067] In a specific implementation, Figure 3 As shown, the vibration discharge mechanism 2 may specifically include: a second vibrator 22, a second material tube placement slot 23, and a second device guide slot 24. A second discharge photoelectric switch 25 is provided at the discharge port of the second device guide slot 24, and a second feed photoelectric switch 26 and a second device grabbing slot 21 are provided at the feed port of the second device guide slot 24.

[0068] The second oscillator 22 is used to guide the solid-state relay on the second device grabbing slot 21 through the second device guiding slot 24 to the material tube on the second material tube placement slot 23 through its own vibration;

[0069] The second discharge photoelectric switch 25 is used to control the tube transport mechanism 5 to transport the tube loaded with the solid-state relay from the vibration discharge mechanism 2 to the unloading mechanism 7 when the tubes on the second tube placement slot 23 are full;

[0070] The second feeding photoelectric switch 26 is used to control the test transport mechanism 4 to transport the solid-state relays that have passed the test from the test mechanism 3 to the second device grabbing slot 21 .

[0071] Specifically, if Figure 3As shown in FIG, the second oscillator 22 uses its own vibration to guide the solid-state relays in the second component grabbing slot 21 through the second component guide slot 24 into the material tube in the second material tube placement slot 23. During this process, the second discharge photoelectric switch 25 counts the solid-state relays entering the material tube to determine whether the material tube is full. When the material tube is full, the controller is triggered to control the material tube transport mechanism 5 to transport the material tube loaded with solid-state relays from the vibrating discharge mechanism 2 to the unloading mechanism 7. In addition, during the process of guiding the solid-state relays, the second feed photoelectric switch 26 detects whether there are solid-state relays in the second component grabbing slot 21. If not, the controller is triggered to control the test transport mechanism 4 to transport the qualified solid-state relays from the test mechanism 3 to the second component grabbing slot 21.

[0072] In one embodiment, a cooling device is provided on the second device guide slot 24 to dissipate heat from the solid-state relays in the second device guide slot 24. For example, a cold air duct and cold air outlet holes can be provided at the bottom of the second device guide slot 24 to cool the solid-state relays that have just completed the thermal aging test by connecting an external cold air source.

[0073] In a specific implementation, Figure 4 As shown, the above-mentioned testing mechanism 3 may include: a first supporting frame 31, a first clamping cylinder 32 provided on the first supporting frame 31, a positioning groove 33 and a testing probe 34;

[0074] The first clamping cylinder 32 is used to clamp the test probe 34 so that the test probe 34 passes through the positioning groove 33 and contacts the pin of the solid-state relay placed in the positioning groove 33; the test probe 34 is electrically connected to the test equipment.

[0075] Specifically, if Figure 4 As shown in FIG, after the solid-state relay is placed into the positioning groove 33 by the rubber suction nozzle 49 on the test handling mechanism 4, the first clamping cylinder 32 pushes the test probe 34 to operate and connect with the solid-state relay pin, so that the test equipment can test the solid-state relay through the test probe 34.

[0076] In a specific implementation, Figure 5 As shown, the test transport mechanism 4 may include: a second support frame 41, a first stepper motor 42 located on the second support frame 41, a first lead screw 43, a first guide rod 44, a first moving platform 45 and a first limit photoelectric switch 46;

[0077] a first stepper motor 42 driven by a controller to drive the first movable platform to move along a first guide rod 44 by controlling the rotation of a first lead screw 43;

[0078] The first limit photoelectric switch 46 is located on the first guide rod 44 and is correspondingly arranged above the first device guide groove 14, the second device guide groove 24, and the positioning groove 33, and is used to limit the movement of the first movable machine 45 to the corresponding grasping position;

[0079] The first mobile machine 45 is provided with a first descending cylinder 47, a telescopic cylinder 48 and a rubber suction nozzle 49. The rubber suction nozzle 49 is controlled to move by the first descending cylinder 47 and the telescopic cylinder 48 to transport the solid-state relay from the first device grabbing slot 11 to the positioning slot 33 of the test mechanism 3, and transport the solid-state relay that has passed the inspection from the positioning slot 33 of the test mechanism 3 to the second device grabbing slot 21, and transport the solid-state relay that has failed the inspection from the positioning slot 33 of the test mechanism 3 to the NG product recycling box.

[0080] Specifically, if Figure 4 、 Figure 5 As shown in , the first downward cylinder 47 can control the up and down movement of the rubber suction nozzle 49 and the solid-state relay, and the telescopic cylinder 48 can control the forward and backward movement of the rubber suction nozzle 49 and the solid-state relay;

[0081] Three first limit photoelectric switches 46 control the first movable platform 45, which in turn controls the movement of the rubber suction nozzle 49 between three workstations: the first component grabbing slot 11 in the vibrating feed mechanism 1, the positioning slot 33 in the testing mechanism 3, and the second component grabbing slot 21 in the vibrating discharge mechanism 2. The specific movement positions are controlled by the first limit photoelectric switches 46. To ensure that the rubber suction nozzle 49 accurately picks up the solid-state relay and places it precisely in the positioning slot 33, a positioning slot 491 is provided on the rubber suction nozzle 49 to precisely define the position of the solid-state relay.

[0082] The test handling process is as follows: after completing the previous action (handling the solid-state relay to the second device grabbing slot 21), when the first discharge photoelectric switch 16 detects that a solid-state relay has entered the first device grabbing slot 11, the test handling mechanism 4 controls the first mobile machine 45 to move to the first device grabbing slot 11 station to grab the solid-state relay to be tested, and then moves to the positioning groove 33 station of the test mechanism 3 to place the solid-state relay to be tested in the positioning groove 33; the controller drives the test probe 34 of the test mechanism 3 to contact the solid-state relay, and synchronously drives the test equipment to perform the test; if the test result is NG (failed the test), the telescopic cylinder 48 is controlled to move and the NG product is placed in the NG product recycling box. If the test result is OK (passed the test), the rubber suction nozzle 49 of the test handling mechanism 4 sucks the solid-state relay and moves to the second device guide groove 24 station, and places the solid-state relay into the second device grabbing slot 21.

[0083] In a specific implementation, Figure 6As shown, the material tube transport mechanism 5 includes: a third support frame 51, a second stepping motor 52 located on the third support frame 51, a second lead screw 53, a second guide rod 54, a second moving platform 55 and a second limit photoelectric switch 56;

[0084] The second stepping motor 52 is driven by the controller and drives the second lead screw 53 by rotating

[0085] The second movable platform 55 moves along the second guide rod 54;

[0086] The second limit photoelectric switch 56 is located on the second guide rod 54 and is correspondingly arranged above the material pipe station of the loading mechanism 6, the vibrating feeding mechanism 1, the vibrating discharging mechanism 2, the unloading mechanism 7 and the transition bin 8, and is used to limit the second movable machine 55 to move to the corresponding grasping station;

[0087] The second moving platform 55 is provided with a second descending cylinder 57 and a second clamping cylinder 58 for clamping the material pipe on the work station and controlling its up and down movement.

[0088] Specifically, if Figure 6 As shown, the overall operation of the material tube transport mechanism 5 is to control the specific position of the second moving machine 55 through the second limit photoelectric switch 56; and the clamping and upward movement of the material tube are achieved through the second descending cylinder 57 and the second clamping cylinder 58.

[0089] In a specific implementation, Figure 7 As shown, the feeding mechanism 6 may include: two oppositely arranged first height limiting grooves 61, a fourth support frame 62, a third stepping motor 63 arranged on the fourth support frame 62, a third lead screw 64, a first push rod 65 and a first height limiting photoelectric switch 66;

[0090] The third stepper motor 63 is driven by the controller to drive the first push rod 65 to move up and down by controlling the rotation of the third screw 64, so that the material tube loaded with the solid-state relay on the first push rod 65 moves upward along the first height limit groove 61; the first height limit photoelectric switch 66 is used to limit the first push rod 65 to the material tube grabbing position of the loading mechanism 6.

[0091] Specifically, the first height-limiting photoelectric switch 66 limits the upward movement of the first push rod 65, restricting it to the position to be grasped. When the first height-limiting photoelectric switch 66 detects that there is no material tube, the controller is triggered to drive the third stepper motor 63, which drives the third lead screw 64 to move the first push rod 65 upward to the grasping position.

[0092] In a specific implementation, Figure 8As shown, the above-mentioned unloading mechanism 7 may include: two oppositely arranged second height limiting grooves 71, a fifth support frame 72, a fourth stepping motor 73 arranged on the fifth support frame 72, a fourth lead screw 74, a second push rod 75 and a second height limiting photoelectric switch 76;

[0093] The fourth stepper motor 73 is driven by the controller to drive the second push rod 75 to move up and down by controlling the rotation of the fourth screw 74, so that the material tube loaded with the solid-state relay on the second push rod 75 moves downward along the second height limit groove 71; the second height limit photoelectric switch 76 is used to limit the second push rod 75 to the material tube grabbing position of the unloading mechanism 7.

[0094] Specifically, the second height-limiting photoelectric switch 76 limits the downward movement of the second push rod 75, restricting it to the position to be grasped. When the second height-limiting photoelectric switch 76 detects the presence of a material tube, the controller is triggered to drive the fourth stepper motor 73, which drives the fourth lead screw 74, causing the second push rod 75 to descend to the grasping position.

[0095] In a specific implementation, Figure 9 As shown, the transition chamber 8 may include: two third height limiting slots 81 arranged opposite to each other, a sixth support frame 82, a fifth stepping motor 83 arranged on the sixth support frame 82, a fifth lead screw 84, a third push rod 85 and a third height limiting photoelectric switch 86;

[0096] The fifth stepper motor 83 is driven by the controller to drive the third push rod 85 to move up and down by controlling the rotation of the fifth screw 84, so that the empty material tube on the third push rod 85 moves up and down along the third height limit groove 81; the third height limit photoelectric switch 86 is used to limit the third push rod 85 to the material tube grabbing position of the transition bin 8.

[0097] Specifically, the second height-limiting photoelectric switch 76 limits the downward movement of the second push rod 75, restricting it to the position to be grasped. When the second height-limiting photoelectric switch 76 detects the presence of a material tube, the controller is triggered to drive the fourth stepper motor 73, which drives the fourth lead screw 74, causing the second push rod 75 to descend to the grasping position.

[0098] The working principle of the above solid-state relay automatic test device is as follows:

[0099] 1. Complete power-on, connection, resetting, and loading (after manually loading the material tube of the solid-state relay to be tested into the loading mechanism 6, the equipment starts).

[0100] 2. The third stepper motor 63 in the feeding mechanism 6 controls the third lead screw 64 to rotate and drive the first push rod 65 to move up and down, so that the material tube loaded with the solid-state relay on the first push rod 65 moves upward along the first height limit groove to the position to be grasped.

[0101] 3. The material tube transporting mechanism 5 transports the material tube to be tested from the loading mechanism 6 to the vibrating feeding mechanism 1.

[0102] 4. The first vibrator 12 in the vibrating feeding mechanism 1 guides the solid-state relay on the first material tube placement slot 13 out of the material tube through its own vibration, and then passes through the first component guiding slot 14 to the first component grabbing slot 11.

[0103] 5. The test transport mechanism 4 picks up a single heated solid-state relay from the first component grabbing slot in the vibration feeding mechanism 1 and moves it to the test mechanism 3 .

[0104] 6. Testing mechanism 3, in conjunction with testing equipment, tests the solid-state relays and determines whether the components are qualified. If they are defective, they are placed in the defective component collection bin by test handling mechanism 4. If they are acceptable, they are placed in the second component grabbing slot 21 of the vibrating discharge mechanism 2.

[0105] 7. The second vibrator 22 in the vibration discharging mechanism 2 guides the solid-state relay on the second device grabbing slot 21 into the material tube in the second material tube placement slot 23 through the second device guiding slot 24 by its own vibration.

[0106] 8. During the execution of the above steps 1-7, the first discharge photoelectric switch 16 and the second feed photoelectric switch 26 perform real-time detection to determine whether the test transport mechanism 4 performs transport.

[0107] 9. During the execution of steps 1-7 above, the first feed photoelectric switch 15 and the second discharge photoelectric switch 25 are used to detect the number of solid-state relays in the material tube in real time, and the material tube handling mechanism 5 is used to determine whether to load the material tube to be tested or unload the full material tube.

[0108] 10. Testing completed.

[0109] An automatic testing device for solid-state relays provided in an embodiment of the present invention includes a controller, a test device, and an actuator. The controller drives the various parts of the actuator to realize the transportation of the solid-state relay during the test process, so that the solid-state relay automatically completes the transfer and transportation during loading, testing, and unloading. At the same time, the test device is electrically connected to the test mechanism in the actuator to complete the detection of the solid-state relay loaded on the test mechanism, thereby improving the detection efficiency of the solid-state relay.

[0110] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application.

[0111] It can be understood that the same or similar parts of the above embodiments can be referenced to each other, and the contents not described in detail in some embodiments can refer to the same or similar contents in other embodiments.

[0112] It should be noted that, in the description of this application, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance. In addition, in the description of this application, unless otherwise specified, the meaning of "plurality" refers to at least two.

[0113] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0114] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A solid-state relay automatic testing device, characterized in that: include: controllers, test equipment, and actuators; The controller is used to drive the actuator to transport the solid-state relay; the actuator includes: a vibration feeding mechanism, a vibration discharging mechanism, a testing mechanism, and a testing and transporting mechanism; The vibration feeding mechanism is used to guide the solid-state relay loaded in its feeding tube to the first component grabbing slot thereon by vibration; The vibration discharging mechanism is used to guide the solid-state relay in the second device grabbing slot to the feeding tube via vibration; The test transport mechanism is used to transport solid-state relays from the first component grabbing slot to the test mechanism, transport qualified solid-state relays from the test mechanism to the second component grabbing slot, and transport unqualified solid-state relays from the test mechanism to an NG product recycling box; The testing device is electrically connected to the testing mechanism and is used to test the solid-state relay loaded on the testing mechanism; The said actuator also includes: a material pipe transport mechanism, a material loading mechanism, a material unloading mechanism and a transition bin; The material tube transport mechanism is used to transport the material tube loaded with solid-state relays from the loading mechanism to the vibrating feeding mechanism, transport the material tube loaded with solid-state relays from the vibrating discharging mechanism to the unloading mechanism, transport the empty material tube from the vibrating feeding mechanism to the transition bin, and transport the empty material tube from the transition bin to the vibrating discharging mechanism; The vibration feeding mechanism includes: a first vibrator, a first material tube placement groove and a first component guide groove; the feeding port located in the first component guide groove is provided with a first feeding photoelectric switch; the discharging port located in the first component guide groove is provided with a first discharging photoelectric switch and the first component grabbing slot; The first oscillator is used to guide the solid-state relay on the first material tube placement slot out of the material tube through the first device guide slot to the first device grabbing slot by its own vibration; The first feeding photoelectric switch is used to control the tube conveying mechanism to convey the empty tube from the vibrating feeding mechanism to the transition bin when the tube placed in the first tube placement trough is empty; The first discharge photoelectric switch is used to control the test transport mechanism to transport the solid-state relay from the first device grabbing slot to the test mechanism.

2. The solid-state relay automatic testing device according to claim 1, characterized in that: A heating device is provided on the first component guiding groove, for heating the solid-state relay on the first component guiding groove.

3. The solid-state relay automatic testing device according to claim 2, characterized in that: The vibration discharging mechanism includes: a second vibrator, a second material tube placement groove and a second device guide groove, the discharging port of the second device guide groove is provided with a second discharging photoelectric switch, and the feeding port of the second device guide groove is provided with a second feeding photoelectric switch and a second device grabbing slot; The second oscillator is used to guide the solid-state relay on the second component grabbing slot through the second component guiding slot into the material tube on the second material tube placement slot by its own vibration; The second discharging photoelectric switch is used to control the material tube conveying mechanism to convey the material tube loaded with the solid-state relay from the vibrating discharging mechanism to the unloading mechanism when the material tubes on the second material tube placement trough are full; The second feeding photoelectric switch is used to control the test transport mechanism to transport the solid-state relays that have passed the test from the test mechanism to the second device grabbing slot.

4. The solid-state relay automatic testing device according to claim 3, characterized in that: A cooling device is provided on the second device guiding groove for dissipating heat from the solid-state relay on the second device guiding groove.

5. The solid-state relay automatic testing device according to claim 4, characterized in that: The testing mechanism comprises: a first supporting frame, a first clamping cylinder provided on the first supporting frame, a positioning slot and a testing probe; The first clamping cylinder is used to clamp the test probe so that the test probe contacts the pin of the solid-state relay placed in the positioning groove through the positioning groove; the test probe is electrically connected to the test equipment.

6. The solid-state relay automatic testing device according to claim 5, characterized in that: The test handling mechanism includes: a second support frame, a first stepper motor located on the second support frame, a first lead screw, a first guide rod, a first moving platform and a first limit photoelectric switch; The first stepper motor is configured to be driven by the controller to drive the first movable platform to move along the first guide rod by controlling the rotation of the first lead screw; The first limit photoelectric switch is located on the first guide rod and is correspondingly arranged above the first component guide groove, the second component guide groove station, and the positioning groove station, and is used to limit the first movable machine to move to the corresponding grasping station; The first movable machine is provided with a first descending cylinder, a telescopic cylinder and a rubber suction nozzle. The rubber suction nozzle is controlled to move by the first descending cylinder and the telescopic cylinder to transport the solid-state relay from the first component grabbing slot to the positioning slot of the testing mechanism, and to transport the solid-state relay that has passed the inspection from the positioning slot of the testing mechanism to the second component grabbing slot, and to transport the solid-state relay that has failed the inspection from the positioning slot of the testing mechanism to the NG product recycling box.

7. The solid-state relay automatic testing device according to claim 1, characterized in that: The material tube transport mechanism includes: a third support frame, a second stepping motor located on the third support frame, a second lead screw, a second guide rod, a second moving platform and a second limit photoelectric switch; The second stepping motor is configured to be driven by the controller and drive the second movable platform to move along the second guide rod by controlling the rotation of the second lead screw; The second limit photoelectric switch is located on the second guide rod and is correspondingly arranged above the material pipe station of the loading mechanism, the vibrating feeding mechanism, the vibrating discharging mechanism, the unloading mechanism and the transition bin, and is used to limit the second movable machine to move to the corresponding grasping station; The second movable machine is provided with a second descending cylinder and a second clamping cylinder for clamping the material tube on the work station and controlling its up and down movement.

8. The solid-state relay automatic testing device according to claim 7, characterized in that: The feeding mechanism includes: two oppositely arranged first height limiting grooves, a fourth support frame, a third stepping motor arranged on the fourth support frame, a third lead screw, a first push rod and a first height limiting photoelectric switch; The third stepper motor is driven by the controller to drive the first push rod to move up and down by controlling the rotation of the third lead screw, so that the material tube loaded with the solid-state relay on the first push rod moves upward along the first height limit groove; the first height limit photoelectric switch is used to limit the first push rod to the material tube grabbing position of the feeding mechanism; The blanking mechanism includes: two second height limiting grooves arranged opposite to each other, a fifth support frame, a fourth stepping motor arranged on the fifth support frame, a fourth lead screw, a second push rod and a second height limiting photoelectric switch; The fourth stepper motor is driven by the controller to drive the second push rod to move up and down by controlling the rotation of the fourth lead screw, so that the material tube loaded with the solid-state relay on the second push rod moves downward along the second height limit groove; the second height limit photoelectric switch is used to limit the second push rod to the material tube grabbing position of the unloading mechanism; The transition chamber includes: two third height limiting slots arranged opposite to each other, a sixth support frame, a fifth stepping motor arranged on the sixth support frame, a fifth lead screw, a third push rod and a third height limiting photoelectric switch; The fifth stepper motor is used to be driven by the controller to drive the third push rod to move up and down by controlling the rotation of the fifth screw, so that the empty material tube on the third push rod moves up and down along the third height limit groove; the third height limit photoelectric switch is used to limit the third push rod to the material tube grabbing position of the transition bin.

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