Memory-assisted heat transfer structure

Abstract

The present invention provides a memory auxiliary heat transfer structure, which is assembled corresponding to at least one memory unit and a water cooling component. The memory auxiliary heat transfer structure comprises: a body having a first end, a second end and a middle section, the middle section having a heat receiving side and a contact side, the heat receiving side being arranged corresponding to at least one chip arranged on the memory unit, and the contact side being assembled in contact with the water cooling component. The structure of the present invention can reduce the friction between the memory unit and the water cooling component, fill the gap and reduce the occurrence of thermal resistance.

Description

Technical Field

[0001] The present invention relates to a memory auxiliary heat transfer structure, and in particular to a memory auxiliary heat transfer structure which is wear-resistant and has a high heat transfer coefficient and can reduce thermal impedance. Background Art

[0002] Current electronic devices have many electronic chips for data calculation. These electronic chips are the heat generating elements in electronic devices. Conventionally, the heat transfer elements (heat pipes, temperature spreaders, radiators, etc.) are directly in contact with the heat source and a cooling fan is provided to force the heat transfer elements to dissipate the heat. However, as the computing power of electronic chips increases, the heat generated also increases. Therefore, the conventional heat dissipation method is no longer sufficient and water cooling is required.

[0003] Water cooling is mainly achieved by installing water cooling pipes and a cold water head for absorbing heat in the electronic device for heat exchange. However, one of the heat sources (memory unit) in the electronic device has multiple chips on its surface. These chips must be directly attached with a water cooling head component or a water cooling kit for absorbing the heat source for cooling. Once the water cooling kit is assembled, it is difficult to rework it. Generally, users cannot replace damaged electronic components such as memory units by themselves. Therefore, the entire set of electronic equipment must be sent back to the original manufacturer, and the original manufacturer will replace the memory unit and other electronic components, which is quite inconvenient.

[0004] In addition, when the outer shell (i.e., metal or ceramic material) of the memory chip package contacts the outer surface of the water cooling kit, friction often occurs due to plugging and unplugging, which can easily cause scratches on the surface of the outer shell of the memory chip package, forming a thermal resistance phenomenon or damaging the outer shell, exposing the memory chip and causing contamination.

[0005] In addition, when the surface of the water cooling kit pipe rubs against the external shell of the memory chip package, the water cooling kit pipe is easily damaged, causing water leakage and short-circuiting the memory. Whether during assembly or rework, the above-mentioned problems will arise due to friction and need to be improved.

[0006] Therefore, how to solve the problem of heat dissipation of electronic equipment and troubleshooting electronic component failures has become the primary goal for current industry players. Summary of the invention

[0007] Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a memory auxiliary heat transfer structure that improves the wear resistance of the memory chip surface and the water cooling component surface, improves the heat transfer coefficient and reduces the thermal impedance.

[0008] To achieve the above-mentioned purpose, the present invention provides a memory auxiliary heat transfer structure, which is assembled with at least one memory unit and a water cooling component. The memory auxiliary heat transfer structure comprises:

[0009] A body has a first end, a second end and a middle section, wherein the two ends of the middle section extend to connect the first end and the second end, and the middle section has a heat receiving side and a contact side, wherein the heat receiving side is arranged corresponding to at least one chip arranged on the memory unit, and the contact side is arranged with the water cooling component.

[0010] The memory-assisted heat transfer structure, wherein: the contact side has a wear-resistant layer, and the wear-resistant layer is formed on the contact side by surface treatment or plating.

[0011] The memory-assisted heat transfer structure, wherein: the contact side has a wear-resistant layer, and the wear-resistant layer is formed on the contact side by electroplating.

[0012] The memory auxiliary heat transfer structure, wherein: the body is elastic, the middle section applies external force to tightly fit the chip surface on the memory unit, and returns to its original state away from the chip surface on the memory unit when the external force is removed.

[0013] The memory auxiliary heat transfer structure, wherein: the material of the body is any one of gold, silver, copper, iron, aluminum, titanium, copper alloy, aluminum alloy, titanium alloy, graphite, and ceramic.

[0014] The memory auxiliary heat transfer structure, wherein: the heat receiving side has a heat conducting medium, and the heat conducting medium is any one of silver heat dissipation paste, foamed copper, foamed aluminum, heat conducting glue, and gappad.

[0015] The memory auxiliary heat transfer structure, wherein: the water cooling component is a water cooling pipe, and the contact side is in contact and combined with the water cooling component by friction.

[0016] The memory auxiliary heat transfer structure, wherein: the middle section and the first end and the second end have a first angle and a second angle respectively, and the first angle and the second angle are both greater than or equal to 90 degrees.

[0017] The memory auxiliary heat transfer structure, wherein: the first end and the second end of the body are inclined.

[0018] The memory auxiliary heat transfer structure of the present invention can be provided between the water cooling element and the memory unit when the memory is cooled by water, so as to increase the surface wear resistance of the chip of the memory unit and the water cooling component, further fill the gap, and provide the characteristics of good wear resistance and thermal conductivity, so as to help users replace the memory unit by themselves, and multiple replacements will not damage the water cooling component and the chip of the memory unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a three-dimensional exploded view of the first embodiment of the memory auxiliary heat transfer structure of the present invention;

[0020] Figure 1a is a cross-sectional view of the first embodiment of the memory auxiliary heat transfer structure of the present invention;

[0021] Figure 2 It is a combination diagram of the first embodiment of the memory auxiliary heat transfer structure of the present invention;

[0022] Figure 3 is a perspective exploded view of the second embodiment of the memory auxiliary heat transfer structure of the present invention;

[0023] Figure 4 is a schematic diagram of the operation of the memory-assisted heat transfer structure of the present invention;

[0024] Figure 5 FIG. 4 is a cross-sectional view of the memory auxiliary heat transfer structure of the present invention.

[0025] Description of the reference numerals: body 1; first end 11; first angle 111; second end 12; second angle 121; middle section 13; heated side 131; heat-conducting medium 1311; contact side 132; wear-resistant layer 1321; memory unit 2; chip 21; water cooling assembly 3. DETAILED DESCRIPTION

[0026] The above-mentioned objects and the structural and functional characteristics of the present invention will be described based on the preferred embodiments shown in the accompanying drawings.

[0027] See also Figure 1 , Figure 1a , Figure 2 , is a three-dimensional exploded, cross-sectional and assembled diagram of the first embodiment of the memory auxiliary heat transfer structure of the present invention. As shown in the figure, the memory auxiliary heat transfer structure of the present invention is assembled with at least one memory unit and a water cooling component. The memory auxiliary heat transfer structure comprises: a body 1;

[0028] The body 1 has a first end 11, a second end 12 and a middle section 13, and the two ends of the middle section 13 extend to connect the first and second ends 11, 12. The middle section 13 and the first and second ends 11, 12 may have an angle, a curved surface, or an arc surface, etc., wherein the angle includes a first angle 111 and a second angle 121, and the first and second angles 111, 121 are greater than or equal to 90 degrees. The first and second ends 11, 12 are arranged corresponding to the memory unit 2.

[0029] The middle section 13 has a heat receiving side 131 and a contact side 132 which are respectively arranged on both sides of the middle section 13 . The heat receiving side 131 is arranged corresponding to at least one chip 21 arranged on the memory unit 2 , and the contact side 132 is assembled with the water cooling assembly 3 .

[0030] The contact side 132 of the middle section 13 has a wear-resistant layer 1321, and the wear-resistant layer 1321 is formed on the contact side 132 by any of electroplating, surface treatment or coating, and its function is to increase the wear resistance of the contact side 132. The main body 1 is elastic and fits tightly with the surface of the chip 21 on the memory unit 2 when an external force is applied to the middle section 13. When the external force is removed, it returns to its original state and moves away from the surface of the chip 21 on the memory unit 2. The heated side 131 has a heat-conducting medium 1311, and the heat-conducting medium 1311 is any of silver heat dissipation paste, foamed copper, foamed aluminum, thermal conductive glue (paste), and gap pad.

[0031] The body 1 is made of a material with good thermal conductivity, such as gold, silver, copper, iron, aluminum, titanium, copper alloy, aluminum alloy, titanium alloy, graphite, and ceramic.

[0032] The first end 11 and the second end 12 of the body 1 are inclined, the water cooling component 3 is a water cooling pipe, and the contact side 132 is in contact with the water cooling component 3 by means of friction of plug-in (card) connection (see Figure 3 As shown in the figure, the first end 11 or the second end 12 and the main body 1 generate an inclined surface or a curved surface, which can improve the convenience of combining the main body 1 and the water cooling component 3 and facilitate introduction and combination.

[0033] See also Figure 3, is a perspective exploded view of the second embodiment of the memory auxiliary heat transfer structure of the present invention. As shown in the figure, the memory auxiliary heat transfer structure of the present invention is partially identical to the first embodiment, so it will not be described again. However, the difference between this embodiment and the first embodiment is that a plurality of chips 21 are disposed on the front and rear (or left and right) sides of the memory unit 2. In this embodiment, two bodies 1 are simultaneously used to attach to the front and rear sides of the memory unit 2. When the middle section 13 of the body 1 is subjected to external pressure, the heat receiving side 131 of the middle section 13 approaches the chips 21 and is directly attached (connected). In this way, heat is simultaneously transferred to both sides of the memory unit 2 through the body 1.

[0034] See also Figure 4 , Figure 5 , is an operation diagram and cross-sectional view of the memory auxiliary heat transfer structure of the present invention. As shown in the figure, the memory auxiliary heat transfer structure of the present invention is mainly used for the memory of electronic equipment. When the electronic equipment uses water cooling to dissipate heat, the memory unit 2 and the water cooling component 3 must be provided with a filling medium between the two for heat contact transfer. Therefore, the present invention uses the body 1 as a filler between the two, and when the memory unit 2 is assembled, the body 1 is embedded together, and the body 1 is provided between the memory unit 2 and the water cooling component 3 (water cooling pipe, water cooling head). When the body 1 is inserted into the gap, the middle section of the body 1 is squeezed and deformed, and the contact side 132 of the middle section 13 is in frictional contact with the water cooling component 3 and then fits together, while the heated side 131 on the other side is squeezed and in contact with the chip 21 on the memory unit 2 to conduct heat. Since the contact side 132 must be combined with the water cooling component 3 by friction, the contact side 132 is surface treated to enhance the wear resistance or reduce the friction coefficient, thereby preventing damage and excessive wear of the components of the water cooling unit.

[0035] In addition, a heat-conducting medium 1311 (as shown in FIG. 1a ) is further provided on the heated side 131 . The heat-conducting medium 1311 is any one of silver thermal paste, foamed copper, foamed aluminum, thermal conductive glue (paste), and gappad. This can increase the efficiency of heat conduction and avoid the occurrence of thermal resistance due to excess gaps.

[0036] This case mainly aims to improve electronic equipment that uses a water cooling system, and to improve the parts where the memory unit and the water cooling system are fitted. After the existing water cooling system is modularized, many electronic components are directly clamped and tightly fixed by the pipes in the water cooling system. The water cooling system cannot be removed, which makes it impossible for users to replace electronic components by themselves. This case mainly improves the defects such as the inability of users to replace parts by themselves in electronic equipment that uses the existing water cooling system, and improves the wear resistance between the memory chip and the water cooling component and facilitates plugging and unplugging, thereby greatly improving convenience.

Claims

1. A memory auxiliary heat transfer structure, assembled with at least one memory unit and a water cooling component, characterized in that: The memory auxiliary heat transfer structure comprises: A body, having a first end, a second end and a middle section, the two ends of the middle section extending to connect the first end and the second end, the middle section having a heat receiving side and a contact side, the heat receiving side being arranged corresponding to at least one chip arranged on the memory unit, and the contact side being arranged in combination with the water cooling component; the body is elastic, the middle section is tightly fitted to the surface of the chip on the memory unit when an external force is applied, and returns to its original state away from the surface of the chip on the memory unit when the external force is removed; The main body enables the user to replace the memory unit by himself when the water cooling component cannot be removed.

2. The memory-assisted heat transfer structure according to claim 1, wherein: The contact side has a wear-resistant layer, and the wear-resistant layer is formed on the contact side by surface treatment or plating.

3. The memory-assisted heat transfer structure according to claim 1, wherein: The contact side has a wear-resistant layer, and the wear-resistant layer is formed on the contact side by electroplating.

4. The memory-assisted heat transfer structure according to claim 1, wherein: The material of the body is any one of gold, silver, copper, iron, aluminum, titanium, copper alloy, aluminum alloy, titanium alloy, graphite, and ceramic.

5. The memory-assisted heat transfer structure according to claim 1, wherein: The heated side has a heat-conducting medium, and the heat-conducting medium is any one of silver heat-dissipating paste, foamed copper, foamed aluminum, heat-conducting glue, and gappad.

6. The memory-assisted heat transfer structure according to claim 1, wherein: The water cooling component is a water cooling pipe, and the contact side is in contact and combined with the water cooling component by friction.

7. The memory-assisted heat transfer structure according to claim 1, wherein: A first angle and a second angle are respectively formed between the middle section and the first end and the second end. The first angle and the second angle are both greater than or equal to 90 degrees.

8. The memory auxiliary heat transfer structure according to claim 1, characterized in that: The first end and the second end of the body are inclined.

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