Method for manufacturing touch screen, touch screen and intelligent terminal

Abstract

The present invention relates to a method for manufacturing a touch screen and a touch screen, the method for manufacturing the touch screen comprising the following steps: providing a substrate, the substrate comprising a touch area and a non-touch area connected to the touch area; forming conductive pattern layers on two opposite sides of the substrate, the conductive pattern layers comprising a touch pattern located in the touch area and a lead pattern located in the non-touch area, the lead pattern being a non-transparent conductive pattern, the lead pattern comprising a routing portion electrically connected to the touch pattern and a shielding portion electrically connected to the routing portion and located at the edge of the substrate, the shielding portion being used to block the penetration of light, and the projections of the shielding portions on both sides of the substrate on the same horizontal plane being spaced from each other; forming protective film layers covering the touch pattern and the lead pattern on both sides of the substrate; exposing and developing the protective film layer to form notch grooves exposing adjacent shielding portions on the protective film layer. The present invention eliminates the influence of the stress of the opposite notch grooves on the connection between the flexible circuit board and the binding portion.

Description

Technical Field

[0001] The present invention relates to the technical field of touch screens, and in particular to a method for manufacturing a touch screen, a touch screen and an intelligent terminal. Background Art

[0002] As a new input device, touch screen is widely used in various fields such as mobile phones, tablet computers, media players, navigation systems, digital cameras, electrical appliance controls, medical equipment, etc.

[0003] like Figure 1 and Figure 2 As shown, currently, for a touch screen 20 having a double-layer transparent conductive layer (English name is Double ITO, English abbreviation is DITO), the conductive layers 22 are respectively formed on both sides of a substrate 21, and peripheral circuits 23 electrically connected to the conductive layers 22 are respectively formed on the conductive layers 22 on both sides of the substrate 21, and the binding parts 23a (the binding parts 23a have gold fingers) of the peripheral circuits 23 on both sides extend to the edges of the substrate respectively. At the same time, a protective film 24 (the protective film 24 is a dry film) is also formed on both sides of the substrate 21 to cover the conductive layer 22 and the peripheral circuits 23 on both sides of the substrate 21. The protective film 24 is used to expose the binding parts 23a of the peripheral circuits 23 on both sides by exposure and development, so that the binding parts 23a can be electrically connected to the flexible circuit board. Among them, during the exposure process of the protective film 24, the local areas of the protective film 24 on both sides of each binding part 23a facing the binding part 23a need to be shielded from light at the same time to ensure that the local areas of the protective film 24 facing the binding part 23a do not react with the light source, thereby facilitating the subsequent development of the local areas of the protective film facing the binding part 23a.

[0004] During the exposure process of the above-mentioned protective film 24, due to the need for double-sided shading, the local areas of the protective film 24 on both sides of the substrate 21 that are opposite to the binding part 23a are detached through development and form notch grooves 24a. Due to the large stress between the opposite notch grooves 24a, the gold fingers of the flexible circuit board 25 are easily broken when connected to the binding part 23a. Summary of the invention

[0005] Based on this, the technical problem to be solved by the present invention is to provide a method for manufacturing a touch screen, a touch screen and a smart terminal that can increase the connection reliability between a binding portion and a flexible circuit board.

[0006] A method for manufacturing a touch screen comprises the following steps:

[0007] Providing a substrate, the substrate comprising a touch area and a non-touch area connected to the touch area;

[0008] Conductive pattern layers are formed on two opposite sides of the substrate, the conductive pattern layers include a touch pattern located in the touch area and a lead pattern located in the non-touch area, the lead pattern is a non-transparent conductive pattern, the lead pattern includes a routing portion electrically connected to the touch pattern and a shielding portion electrically connected to the routing portion and located at an edge of the substrate, the shielding portion is used to block the penetration of light, and the projections of the shielding portions on the same horizontal plane on both sides of the substrate are spaced apart from each other;

[0009] forming protective film layers covering the touch pattern and the lead pattern on both sides of the substrate respectively;

[0010] Exposing and developing the protective film layer to form a notch groove exposing the adjacent shielding portion on the protective film layer;

[0011] Performing patterning on the shielding portion to form a binding portion having a gold finger; and

[0012] A flexible circuit board is provided, and the flexible circuit board is electrically connected to the binding part having the gold finger.

[0013] In the above-mentioned touch screen manufacturing method, since a shielding portion for blocking light penetration is reserved in advance in the formation of the lead pattern, and the projections of the shielding portions on both sides of the substrate on the same horizontal plane are spaced from each other, that is, the shielding portions on both sides are staggered with each other, so that when the protective film layer is exposed and developed, there is no need to shield both sides of the protective film layer, that is, there is no need to shield both sides of the substrate, and only one side of the protective film layer adjacent to the shielding portion needs to be shielded, thereby avoiding the formation of opposing notches on the protective film layers on both sides of the substrate that are directly opposite to the shielding portions. After the one-sided notch is formed in the present invention, the shielding portion is further patterned to form a binding portion with a gold finger, and the binding portion is electrically connected to the flexible circuit board, thereby eliminating the influence of the stress of the opposing notch on the connection between the flexible circuit board and the binding portion, and increasing the reliability of the electrical connection between the flexible circuit board and the binding portion.

[0014] In one embodiment, the conductive pattern layers are formed on the two opposite sides of the substrate, specifically including: providing a first conductive material and a second conductive material, and sequentially stacking the first conductive material and the second conductive material on the two opposite sides of the substrate to form a first conductive layer and a second conductive layer on the two opposite sides of the substrate; performing window processing on the second conductive layer to remove the second conductive layer located in the touch area; and performing pattern processing on the second conductive layer after the window processing and the first conductive layer to form the touch pattern and the lead pattern. In this way, a touch pattern and a lead pattern with good stability can be obtained.

[0015] In one embodiment, the first conductive material and the second conductive material are sequentially stacked on the two opposite sides of the substrate to form the first conductive layer and the second conductive layer on the two opposite sides of the substrate, respectively, specifically including: the first conductive material is indium tin oxide, the second conductive material is metal silver or metal copper, the indium tin oxide is coated on the substrate by magnetron sputtering to form the first conductive layer, and the metal silver or metal copper is coated on the first conductive layer by a vacuum coater to form the second conductive layer; or the first conductive material is graphene, the second conductive material is metal silver or metal copper, the graphene is transferred to the substrate by chemical vapor deposition to form the first conductive layer, and the metal silver or metal copper is coated on the first conductive layer by a vacuum coater to form the second conductive layer. In this way, the touch pattern in the touch area is a transparent conductive pattern, which will not affect the imaging display and aesthetics of the touch area, and the lead pattern in the non-touch area is a non-transparent conductive pattern, which can enable the shielding part in the lead pattern to block the light on the other side of the protective film layer when the protective film layer is exposed and developed, thereby achieving one-sided shading and avoiding the formation of opposite notch grooves on the protective film layer.

[0016] In one embodiment, the second conductive layer is subjected to window opening treatment to remove the second conductive layer located in the touch area, specifically, the second conductive layer is subjected to yellow light treatment to remove the second conductive layer located in the touch area. In this way, the first conductive layer in the touch area can be exposed, so as to form a touch pattern in the touch area later.

[0017] In one of the embodiments, the second conductive layer and the first conductive layer after the window opening treatment are patterned to form the touch pattern and the lead pattern, specifically: the first conductive layer and the second conductive layer after the window opening treatment are subjected to yellow light process treatment; or the first conductive layer and the second conductive layer after the window opening treatment are subjected to fully automatic printing process.

[0018] In one embodiment, the exposure and development of the protective film layer to form a notch groove on the protective film layer that exposes the adjacent shielding part specifically includes: performing a unilateral light shielding treatment on the protective film layer, wherein the protective film layer includes a main body and a developing part connected to the main body, wherein the developing part is directly opposite to the adjacent shielding part, and a light shielding treatment is performed on the side of the developing part away from the adjacent shielding part; exposing the main body of the protective film layer to make the exposed main body react to the light source; and removing the unexposed developing part with a developer to form the notch groove on the protective film layer. In this way, the formation of opposite notches is avoided while ensuring that the shielding part (or binding part) can be exposed.

[0019] In one embodiment, the shielding portion is subjected to pattern etching to form a binding portion with a gold finger, specifically: the shielding portion is subjected to yellow light processing; or the shielding portion is subjected to full-automatic printing. In this way, a binding portion with a line interface pattern is obtained to achieve electrical connection between the binding portion and the flexible circuit board.

[0020] At the same time, the present invention also provides a touch screen, including:

[0021] A substrate, comprising a touch area and a non-touch area connected to the touch area;

[0022] A touch pattern formed in the touch area;

[0023] A lead pattern is formed in the non-touch area, the lead pattern includes a routing portion electrically connected to the touch pattern and a binding portion electrically connected to the routing portion and located at an edge of the substrate, the binding portion has a gold finger, and projections of the binding portions on the same horizontal plane on both sides of the substrate are spaced apart from each other;

[0024] a protective film layer, formed on two opposite sides of the substrate and covering the touch pattern and the lead pattern, the protective film layer being provided with a notch groove exposing the adjacent binding portion; and

[0025] A flexible circuit board is electrically connected to the binding portion.

[0026] The touch screen eliminates the influence of the stress of the notch groove when the flexible circuit board is connected to the binding part, thereby increasing the reliability of the electrical connection between the flexible circuit board and the binding part.

[0027] In one embodiment, the material of the touch pattern is indium tin oxide or graphene, and the material of the lead pattern is metal silver or metal copper. In this way, the touch pattern in the touch area is a transparent conductive pattern, which will not affect the imaging display and aesthetics of the touch area, and the lead pattern in the non-touch area is a non-transparent conductive pattern, which can make the shielding part in the lead pattern shield the light on the other side of the protective film layer when the protective film layer is exposed and developed, so as to achieve unilateral shading and avoid the formation of opposite notches on the protective film layer.

[0028] At the same time, the present invention also provides an intelligent terminal, including:

[0029] case;

[0030] The above touch screen is arranged in the housing.

[0031] The touch screen in the above-mentioned smart terminal eliminates the influence of the stress of the notch groove when the flexible circuit board is connected to the binding part, thereby increasing the reliability of the electrical connection between the flexible circuit board and the binding part. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is an exploded schematic diagram of a touch screen in the prior art;

[0033] Figure 2 for Figure 1 Structural cross-section of the touch screen;

[0034] Figure 3 is an exploded schematic diagram of a touch screen according to an embodiment of the present invention;

[0035] Figure 4 for Figure 3 Structural cross-section of the touch screen;

[0036] Figure 5 A schematic diagram of a manufacturing process of a touch screen according to an embodiment of the present invention;

[0037] Figure 6 for Figure 3 A schematic diagram of a structure in which a lead pattern has a routing portion and a shielding portion;

[0038] Figure 7 for Figure 6 Schematic diagram of the structure of the binding part formed after the shielding part in the figure is patterned. DETAILED DESCRIPTION

[0039] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific implementation disclosed below.

[0040] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0042] like Figure 3 and Figure 4As shown, a touch screen 10 according to an embodiment of the present invention is applied to a smart terminal. Specifically, in this embodiment, the smart terminal includes a housing and a touch screen 10 disposed in the housing. More specifically, in this embodiment, the smart terminal is a smart terminal such as a smart phone, a laptop computer, a tablet computer, a portable phone, a video phone, a digital still camera, an electronic book reader, a portable multimedia player (PMP), a mobile medical device, a wearable device, etc.

[0043] In this embodiment, the touch screen 10 includes a substrate 100 , a conductive pattern layer 200 , a protective film layer 300 and a flexible circuit board 400 .

[0044] The substrate 100 is a carrier of the conductive pattern layer 200, the protective film layer 300, and the flexible circuit board 400. The substrate 100 includes a touch area 110 and a non-touch area 120 connected to the touch area 110. Specifically, in this embodiment, the touch area 110 is located in the middle of the substrate 100, and the non-touch area 120 is arranged around the touch area 110. The substrate 100 may be, but is not limited to, any one of a polycarbonate (PC) panel, a polyethylene terephthalate (PET) panel, and a glass (GLASS) panel.

[0045] The conductive pattern layer 200 has two layers and is formed on opposite sides of the substrate 100. The conductive pattern layer 200 is used to generate a touch signal in the touch area 110 and output the touch signal to the outside (such as the flexible circuit board 400 electrically connected to the conductive pattern layer 200) through the non-touch area 120. Specifically, in this embodiment, the conductive pattern layer 200 includes a touch pattern 210 formed in the touch area 110 and a lead pattern 220 formed in the non-touch area 120, the lead pattern 220 includes a routing portion 221 electrically connected to the touch pattern 210 and a binding portion 222 electrically connected to the routing portion 221 and located at the edge of the substrate 100, the binding portion 222 has a gold finger electrically connected to the flexible circuit board 400, the gold finger has a line interface pattern, the projections of the binding portions 222 on both sides of the substrate 100 on the same horizontal plane are spaced from each other, that is, the binding portions 222 on both sides of the substrate 100 are mutually staggered with respect to the substrate 100, and the mutually staggered binding portions 222 can reduce the heat conduction between the two during the hot pressing process when connected to the flexible circuit board 400. Among them, the material of the touch pattern 210 can be a transparent conductive material such as indium tin oxide or graphene, and the material of the lead pattern 220 can be a non-transparent conductive material such as metal silver or metal copper.

[0046] The protective film layer 300 is two layers, and is formed on opposite sides of the substrate 100 and covers the touch pattern 210 and the lead pattern 220. The material of the protective film layer 300 can be a UV-curable or heat-curable resin composition such as epoxy resin. Specifically, in the present embodiment, the material of the protective film layer 300 is a UV-curable resin such as epoxy resin. The protective film layer 300 can protect the touch pattern 210 and the lead pattern 220 to prevent the touch pattern 210 and the lead pattern 220 from being damaged by external forces in the post-process operation, and can prevent other conductive materials such as photosensitive silver powder from being deposited on the touch pattern 210 and the lead pattern 200 and causing conductive abnormalities. The protective film layers 300 on both sides of the substrate 100 are provided with notches 310 that expose adjacent binding portions 222, so that the flexible circuit board 400 can be electrically connected to the binding portion 222.

[0047] Combination Figure 1 and Figure 2 In the prior art, the protective film layers 24 on the opposite sides of the substrate 21 are provided with opposite notches 24a, that is, the notches 24a on the protective film layers 24 on the opposite sides of the substrate 21 are symmetrically arranged with respect to the substrate 21, and there is a large stress between the opposite notches 24a, so that the gold finger of the flexible circuit board 25 is easily broken when it is electrically connected to the binding part 23a at the notch 24a, which increases the production cost of the touch screen 20. In the present invention, combined with Figure 3 and Figure 4 The projections of the binding parts 222 on both sides of the substrate 100 on the same horizontal plane are spaced from each other, that is, the binding parts 222 on both sides of the substrate 100 are staggered with respect to the substrate 100, and the protective film layers 300 on both sides of the substrate 100 are provided with notches 310 exposing adjacent binding parts 222, thereby avoiding the formation of opposite notches 310 directly opposite to the binding parts 222, eliminating the influence of the stress of the opposite notches 310 on the connection between the flexible circuit board 400 and the binding parts 222, and increasing the reliability of the electrical connection between the flexible circuit board 400 and the binding parts 222.

[0048] Furthermore, in this embodiment, when the touch screen 10 has a display function, the touch screen 10 further includes a protective cover plate (not shown) and a display screen (not shown). The protective cover plate is bonded to one of the protective film layers 300, and the display screen is bonded to the other of the protective film layers 300. Specifically, in this embodiment, the protective cover plate and the display screen can be respectively bonded to the protective film layers 300 on opposite sides of the substrate 100 using transparent optical adhesive. The protective cover plate can be made of glass, polycarbonate or polymethyl methacrylate.

[0049] The following combined Figures 3 to 7 The manufacturing method of the touch screen of the present invention is described.

[0050] Step S510, providing a substrate 100. In this embodiment, Figure 3 As shown, the substrate 100 includes a touch area 110 and a non-touch area 120 connected to the touch area 110. Specifically, in this embodiment, the touch area 110 is located in the middle of the substrate 100, and the non-touch area 120 is arranged around the touch area 110. The substrate 100 may be, but is not limited to, any one of a polycarbonate (PC) panel, a polyethylene terephthalate (PET) panel, and a glass (GLASS) panel.

[0051] Step S520, forming conductive pattern layers 200 on two opposite sides of the substrate 100. Figure 6 As shown, the conductive pattern layer 200 includes a touch pattern 210 located in the touch area 110 and a lead pattern 220 located in the non-touch area 120, the lead pattern 220 is a non-transparent conductive pattern, the lead pattern 220 includes a routing portion 221 electrically connected to the touch pattern 210 and a shielding portion 222a electrically connected to the routing portion 221 and located at the edge of the substrate 100 (the shielding portion 222a can be a whole piece of etching plate that has not been pattern-etched, and the shielding portion 222a can form a binding portion 222 with a gold finger after pattern etching), the shielding portion 222a is used to block the penetration of light, and the projections of the shielding portions on both sides of the substrate 100 on the same horizontal plane are spaced from each other.

[0052] Specifically, in this embodiment, forming the conductive pattern layer 200 on two opposite sides of the substrate 100 includes the following steps:

[0053] Step S521, providing a first conductive material and a second conductive material, and sequentially stacking the first conductive material and the second conductive material on two opposite sides of the substrate 100 to form a first conductive layer and a second conductive layer. The material of the first conductive layer can be indium tin oxide or graphene, and the material of the second conductive layer can be metal silver or metal copper.

[0054] When the material of the first conductive layer is indium tin oxide, the indium tin oxide is coated on the substrate 100 by magnetron sputtering to form the first conductive layer. When the material of the first conductive layer is graphene, the graphene is transferred to the substrate 100 by chemical vapor deposition to form the first conductive layer. When the material of the second conductive layer is metallic silver or metallic copper, the metallic silver or metallic copper is coated on the first conductive layer by a vacuum coater to form the second conductive layer.

[0055] Step S522 , performing window opening processing on the second conductive layer to remove the second conductive layer located in the touch area 110 .

[0056] Specifically, in this embodiment, performing window opening processing on the second conductive layer includes the following steps:

[0057] Step S522a, applying a dry film. In this embodiment, a laminating machine is used to apply a dry film material for ultraviolet exposure to the upper surface of the second conductive layer to form a thin film layer.

[0058] Step S522b, exposing the dry film layer to cure the dry film layer. In this embodiment, the typeset film is attached to the upper surface of the dry film layer, and after the ultraviolet light of the exposure machine is irradiated through the film, the dry film can undergo a polymerization reaction to form a stable substance attached to the upper surface of the second conductive layer, and the designed non-touch area pattern is transferred to the dry film on the upper surface of the second conductive layer.

[0059] Step S522c, developing the pattern on the second conductive layer in the non-touch area. In this embodiment, the film is removed from the dry film layer, and a developer is used to develop the pattern transferred on the dry film layer in the non-touch area. The developer can be a sodium carbonate or potassium carbonate solution with a concentration of 2%-4%.

[0060] Step S522d, etching the second conductive layer. In this embodiment, copper etching solution or silver etching solution is used to etch away the second conductive layer without pattern in the touch area, thereby retaining the second conductive layer with pattern in the non-touch area.

[0061] Step S522e, performing a film stripping process on the dry film in the non-touch area. In this embodiment, the substrate 100 after etching the second conductive layer is cleaned of the dry film layer attached to the upper surface of the second conductive layer using a film stripping solution.

[0062] The above-mentioned process of applying dry film, exposing, developing, etching and stripping the second conductive layer is called yellow light process. Through the above-mentioned window opening treatment of the second conductive layer, the second conductive layer in the center of the substrate 100 is removed, and the first conductive layer of the touch area 110 is exposed, thereby forming a transparent window touch area 110 to facilitate the subsequent formation of the touch pattern 210 in the touch area 110.

[0063] Step S523, patterning the second conductive layer and the first conductive layer after the windowing process to form a touch pattern 210 and a lead pattern 220. Specifically, in this embodiment, the second conductive layer and the first conductive layer after the windowing process can be patterned by using a yellow light process or a fully automatic printing process.

[0064] The yellow light process may specifically include the following steps:

[0065] Step S523a, coating a negative photoresist on the front surface of the first conductive layer and the second conductive layer, and curing the negative photoresist in the preset conductive pattern area by exposure.

[0066] Step S523b: Develop the negative photoresist using an organic solution (such as an organic solution containing potassium carbonate or sodium carbonate) to remove the uncured negative photoresist.

[0067] Step S523c, etching the conductive layer with an acid solution (such as hydrochloric acid, nitric acid or a mixed solution thereof), and etching away the conductive layer in areas other than the preset conductive patterns in the touch area and the non-touch area, leaving the conductive layer area protected by the negative photoresist.

[0068] In step S523d, the remaining negative photoresist is stripped with an alkaline solution (such as caustic soda solution) to obtain the touch pattern 210 in the touch area 110 and the lead pattern 220 having the wiring portion 221 and the shielding portion 222 in the non-touch area 120 .

[0069] The fully automatic printing process can specifically include the following steps:

[0070] Step S523e: Print ultraviolet light-curable acid-resistant polyester on the preset conductive pattern areas on the first conductive layer and the second conductive layer by screen printing.

[0071] Step S523f, etching the conductive layer with an acid solution (such as hydrochloric acid, nitric acid or a mixed solution thereof), and etching away the conductive layer in areas other than the preset conductive patterns in the touch area and the non-touch area, leaving the conductive layer area protected by polyester.

[0072] Step S523g, using an alkaline solution (such as caustic soda solution) to strip the remaining polyester, thereby obtaining the touch pattern 210 of the touch area 110 and the lead pattern 220 having the routing portion 221 and the shielding portion 222 in the non-touch area 120 .

[0073] Step S530, combining Figure 3 and Figure 4 , a protective film layer 300 covering the touch pattern 210 and the lead pattern 220 is formed on both sides of the substrate 100. The material of the protective film layer 300 can be a UV-curable or heat-curable resin composition such as epoxy resin. Specifically, in the present embodiment, the material of the protective film layer 300 is a UV-curable resin such as epoxy resin. In the present embodiment, the protective film layer 300 can protect the touch pattern 210 and the lead pattern 220 to prevent the touch pattern 210 and the lead pattern 220 from being damaged by external force in the post-process operation, and can prevent other conductive materials such as photosensitive silver powder from being deposited on the touch pattern 210 and the lead pattern 200 to cause conductive abnormalities.

[0074] Step S540, exposing and developing the protective film layer 300 to form a notch groove 310 exposing the adjacent shielding portion on the protective film layer 300. Specifically, in this embodiment, exposing and developing the protective film layer 300 includes the following steps:

[0075] Step S541, performing unilateral light shielding treatment on the protective film layer 300, the protective film layer 300 comprises a main body and a developing part connected to the main body, the developing part is directly opposite to the adjacent shielding part, and the side of the developing part away from the adjacent shielding part is subjected to light shielding treatment.

[0076] In step S542 , the main body of the protective film layer 300 is exposed to light, so that the exposed main body reacts to the light source.

[0077] In step S543 , a developer is used to remove the unirradiated developing portion, so as to form a notch groove 310 exposing the adjacent shielding portion on the protective film layer 300 .

[0078] Step S550, as Figure 6 and Figure 7 As shown, the shielding portion 222a is patterned to form a binding portion 222 with a gold finger. Specifically, in this embodiment, the shielding portion can be patterned by using a yellow light process or a fully automatic printing process. The specific steps are not repeated here.

[0079] Step S560, combining Figure 3 and Figure 4 , provide a flexible circuit board 400, and electrically connect the flexible circuit board 400 to the binding part 222 having a gold finger.

[0080] Step S570, providing a protective cover plate, and attaching the protective cover plate to the protective film layer 300. Specifically, in this embodiment, transparent optical adhesive is used to attach the protective cover plate to the protective film layer 300. The protective cover plate can be made of glass, polycarbonate or polymethyl methacrylate.

[0081] Step S580, providing a display screen, and attaching the display screen to the protective film layer 300 on the side away from the protective cover plate. Specifically, in this embodiment, transparent optical adhesive is used to attach the display screen to the protective film layer 300.

[0082] In the above touch screen manufacturing method, since the shielding portion 222a for blocking light penetration is reserved in advance in the formation of the lead pattern 220, and the projections of the shielding portions 222a on both sides of the substrate 100 on the same horizontal plane are spaced from each other, that is, the shielding portions 222a on both sides are staggered, so that when the protective film layer 300 is exposed and developed, it is not necessary to shield both sides of the protective film layer 300, that is, it is not necessary to shield both sides of the substrate 100, and only one side of the protective film layer 300 adjacent to the shielding portion 222a needs to be shielded. It is sufficient to shield light, thereby avoiding the formation of opposite notches 310 on the protective film layer 300 on both sides of the substrate 100 that are directly opposite to the shielding portion 222a. After the single-sided notch 310 of the present invention is formed, the shielding portion 222a is further patterned to form a binding portion 222 with a gold finger. The binding portion 222 is electrically connected to the flexible circuit board 400, eliminating the influence of the stress of the opposite notch 310 on the connection between the flexible circuit board 400 and the binding portion 222, thereby increasing the reliability of the electrical connection between the flexible circuit board 400 and the binding portion 222.

[0083] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0084] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for manufacturing a touch screen, characterized in that: The steps include: Providing a substrate, the substrate comprising a touch area and a non-touch area connected to the touch area; Conductive pattern layers are formed on two opposite sides of the substrate, the conductive pattern layers include a touch pattern located in the touch area and a lead pattern located in the non-touch area, the lead pattern is a non-transparent conductive pattern, the lead pattern includes a routing portion electrically connected to the touch pattern and a shielding portion electrically connected to the routing portion and located at an edge of the substrate, the shielding portion is used to block the penetration of light, the projections of the shielding portions on the same horizontal plane on both sides of the substrate are spaced from each other, and the shielding portions on both sides are staggered with each other; forming protective film layers covering the touch pattern and the lead pattern on both sides of the substrate respectively; Exposing and developing the protective film layer to form a notch groove exposing the adjacent shielding portion on the protective film layer; Performing patterning on the shielding portion to form a binding portion with a gold finger; as well as A flexible circuit board is provided, and the flexible circuit board is electrically connected to the binding part having the gold finger.

2. The method for manufacturing a touch screen according to claim 1, characterized in that: The step of forming conductive pattern layers on two opposite sides of the substrate comprises: Providing a first conductive material and a second conductive material, and sequentially stacking the first conductive material and the second conductive material on two opposite sides of the substrate to form a first conductive layer and a second conductive layer on two opposite sides of the substrate respectively; Performing window processing on the second conductive layer to remove the second conductive layer located in the touch control area; The second conductive layer and the first conductive layer after the window opening process are patterned to form the touch pattern and the lead pattern.

3. The method for manufacturing a touch screen according to claim 2, characterized in that: The step of sequentially stacking the first conductive material and the second conductive material on two opposite sides of the substrate to form a first conductive layer and a second conductive layer on two opposite sides of the substrate, specifically includes: The first conductive material is indium tin oxide, and the second conductive material is metallic silver or metallic copper. The indium tin oxide is coated on the substrate by magnetron sputtering to form the first conductive layer, and the metallic silver or metallic copper is coated on the first conductive layer by a vacuum coater to form the second conductive layer; or The first conductive material is graphene, and the second conductive material is metallic silver or metallic copper. The graphene is transferred to the substrate by chemical vapor deposition to form the first conductive layer, and the metallic silver or metallic copper is coated on the first conductive layer by a vacuum coater to form the second conductive layer.

4. The method for manufacturing a touch screen according to claim 2, characterized in that: The window opening process is performed on the second conductive layer to remove the second conductive layer located in the touch control area, specifically: The second conductive layer is subjected to a yellow light process to remove the second conductive layer located in the touch control area.

5. The method for manufacturing a touch screen according to claim 2, characterized in that: The patterning process is performed on the second conductive layer after the window opening process and the first conductive layer to form the touch pattern and the lead pattern, specifically: The first conductive layer and the second conductive layer after the window opening process are subjected to yellow light process; or the first conductive layer and the second conductive layer after the window opening process are subjected to full-automatic printing process.

6. The method for manufacturing a touch screen according to claim 1, characterized in that: The step of exposing and developing the protective film layer to form a notch groove exposing the adjacent shielding portion on the protective film layer specifically includes: The protective film layer is subjected to a unilateral light shielding treatment, wherein the protective film layer comprises a main body and a developing part connected to the main body, the developing part is directly opposite to the adjacent shielding part, and a side of the developing part away from the adjacent shielding part is subjected to a light shielding treatment; Exposing the main body of the protective film layer to cause the exposed main body to react to the light source; The developing portion that is not irradiated is removed by using a developer to form the notch groove on the protective film layer.

7. The method for manufacturing a touch screen according to claim 1, characterized in that: The blocking portion is patterned to form a binding portion with a gold finger, specifically: The shielding portion is subjected to yellow light process; or the shielding portion is subjected to full-automatic printing process.

8. A touch screen manufactured by the touch screen manufacturing method according to any one of claims 1 to 7, characterized in that: include: A substrate, comprising a touch area and a non-touch area connected to the touch area; A touch pattern formed in the touch area; A lead pattern is formed in the non-touch area, the lead pattern includes a routing portion electrically connected to the touch pattern and a binding portion electrically connected to the routing portion and located at an edge of the substrate, the binding portion has a gold finger, and projections of the binding portions on the same horizontal plane on both sides of the substrate are spaced apart from each other; a protective film layer, formed on two opposite sides of the substrate and covering the touch pattern and the lead pattern, the protective film layer being provided with a notch groove exposing the adjacent binding portion; and A flexible circuit board is electrically connected to the binding portion.

9. The touch screen according to claim 8, characterized in that: The material of the touch pattern is indium tin oxide or graphene, and the material of the lead pattern is metal silver or metal copper.

10. An intelligent terminal, characterized in that: include: case; The touch screen according to claim 8 or 9, wherein the touch screen is disposed in the housing.

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