A power supply device

Abstract

The present invention discloses a power supply device, including a casing and a magnetic device arranged inside the casing, the casing is provided with a fixing column and a fixing plate for fixing the position of the magnetic device, and one end of the fixing column is connected to the inner wall of the casing, and the other end is connected to the fixing plate; a heat-conducting substrate is provided between the casing and the magnetic device, and one side of the heat-conducting substrate is in contact with the magnetic device, and the other side is in contact with the inner wall of the casing. The power supply device provided by the present application utilizes the heat-conducting substrate to conduct the heat of the magnetic device to the casing, and dissipates the heat to the external environment through the casing, so that the heat of the magnetic device is reduced and its influence on surrounding components is reduced, thereby achieving the effect of extending the service life of the power supply device.

Description

Technical Field

[0001] The present invention relates to the technical field of power supply equipment, and more specifically, to a power supply device. Background Art

[0002] Power supply devices often use magnetic devices such as inductors or transformers to output electrical energy. During operation, magnetic devices will generate a lot of heat, especially for high-power LED driver power supplies. However, since the magnetic devices are wrapped inside the power supply device, they cannot be dissipated in time after the temperature rises, causing the power supply device to overheat and causing a sharp drop in working efficiency. In addition, the temperature of components around the magnetic devices will also rise, and the service life of components such as transistors will be reduced or even destroyed under high temperature conditions.

[0003] In summary, how to quickly and effectively dissipate heat from magnetic devices is a problem that currently needs to be solved urgently by those skilled in the art. Summary of the invention

[0004] In view of this, an object of the present invention is to provide a power supply device, which can dissipate heat from magnetic components, reduce the internal temperature thereof, and thus prolong the service life.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] A power supply device comprises a casing and a magnetic device arranged inside the casing, wherein the inner wall of the casing is provided with a fixing column for limiting the movement of the magnetic device, and the end of the fixing column away from the casing is provided with a fixing plate for pressing the magnetic device; a heat-conducting substrate is provided between the casing and the magnetic device, and one side of the heat-conducting substrate is in contact with the magnetic device, and the other side is in contact with the inner wall of the casing.

[0007] Preferably, the fixing column is arranged on the bottom surface of the casing.

[0008] Preferably, the fixing column and the housing are integrally formed parts.

[0009] Preferably, a mounting hole is provided in the middle of the fixing plate, and a fastener connected to the end of the fixing column is provided in the mounting hole; and / or a high temperature resistant sol is provided between the fixing plate and the magnetic device.

[0010] Preferably, it further comprises a driving module for converting the magnetic energy of the magnetic device into electrical energy, wherein the driving module is provided with a PCB board; and the magnetic device is provided with a coil lead connected to the PCB board.

[0011] Preferably, the fixing plate is provided with a wire outlet hole for avoiding the coil lead wire.

[0012] Preferably, the inner wall of the housing is provided with an annular groove extending circumferentially along the fixing column, the outer circumference of the fixing column is provided with an insulating sleeve, and the end of the insulating sleeve is arranged in the annular groove to improve the insulation between the fixing column and the magnetic device.

[0013] Preferably, the inner side wall of the housing is provided with a boss corresponding to the position of the magnetic device to improve insulation, and the annular groove is provided on the side of the boss facing the magnetic device.

[0014] Preferably, a through hole is provided in the middle of the magnetic device, and the fixing column is arranged in the through hole.

[0015] Preferably, at least two fixing columns are provided on the periphery of the magnetic device to limit the position of the magnetic device.

[0016] The power supply device provided by the present invention includes a casing and a magnetic device. The magnetic device is installed inside the casing through a fixing column and a fixing plate. A heat-conducting substrate is provided between the casing and the magnetic device. One side of the heat-conducting substrate is in contact with the magnetic device, and the other side is in contact with the inner wall of the casing.

[0017] The fixing plate and the casing cooperate to limit the movement of the magnetic device along the length direction of the fixing column. At the same time, the fixing column can limit the movement of the magnetic device along its own radial direction, and finally fix the magnetic device. During operation, since the two sides of the thermally conductive substrate are respectively attached to the magnetic device and the casing, the thermally conductive substrate can conduct the heat generated by the magnetic device to the casing, and dissipate the heat through the casing, thereby avoiding the problem of excessive temperature of other components in the casing caused by the heating of the magnetic device. The power supply device provided in the present application uses a fixing column and a fixing plate to fix the magnetic device, and dissipates the heat of the magnetic device through the casing, thereby avoiding damage to the components in the casing and achieving the effect of extending the service life of the power supply device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0019] Figure 1 A schematic diagram of the structure of a first power supply device provided by the present invention;

[0020] Figure 2 A schematic diagram of the structure of a second power supply device provided by the present invention;

[0021] Figure 3A schematic diagram of the structure of a third power supply device provided by the present invention;

[0022] Figure 4 A schematic diagram of the structure of a fourth power supply device provided by the present invention;

[0023] Figure 5 A schematic diagram of the structure of a fifth power supply device provided by the present invention;

[0024] Figure 6 A three-dimensional schematic diagram of a power supply device provided by the present invention;

[0025] Figure 7 for Figure 6 Top view of the .

[0026] Figures 1 to 7 The reference numerals in the drawings are:

[0027] The housing 1 , the heat-conducting substrate 2 , the insulating sleeve 3 , the magnetic device 4 , the fixing plate 5 , the coil lead 6 , the fastener 7 , the fixing column 8 , the annular groove 9 , the boss 10 , and the driving module 11 . DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] The core of the present invention is to provide a power supply device, which can dissipate heat for magnetic components, thereby reducing the temperature of the power supply device and increasing its service life.

[0030] Please refer to Figures 1 to 7 , Figures 1 to 5 The schematic diagrams of the structures of five power supply devices provided by the present invention are respectively shown; Figure 6 A three-dimensional schematic diagram of a power supply device provided by the present invention; Figure 7 for Figure 6 Top view of the .

[0031] The present invention provides a power supply device, including a casing 1 and a magnetic device 4 arranged inside the casing 1, the inner wall of the casing 1 is provided with a fixing column 8 for limiting the movement of the magnetic device 4, and the end of the fixing column 8 away from the casing 1 is provided with a fixing plate 5 for pressing the magnetic device 4; a heat-conducting substrate 2 is provided between the casing 1 and the magnetic device 4, and one side of the heat-conducting substrate 2 is in contact with the magnetic device 4, and the other side is in contact with the inner wall of the casing 1.

[0032] Specifically, the housing 1 is used to accommodate the magnetic device 4 and other components and dissipate heat to the outside. The magnetic device 4 can be an inductor, a transformer or other components, which are installed inside the housing 1 through a fixing member.

[0033] Both sides of the heat conductive substrate 2 are respectively attached to the inner wall of the housing 1 and the magnetic device 4 , so as to conduct the heat generated by the magnetic device 4 to the housing 1 . The shape of the heat conductive substrate 2 can be flexibly selected according to the shape of the magnetic device 4 .

[0034] It should be noted that, since the housing 1 needs to dissipate heat to the outside, it is preferably made of a metal material with good heat dissipation effect, such as an aluminum housing. In addition, in actual use, the housing 1 needs to be in an insulating state to ensure the safety of the user, so the thermal conductive substrate 2 is preferably made of a material with good thermal conductivity and electrical insulation, such as an alumina ceramic sheet. It is understandable that the housing 1 can also be made of an insulating material with a certain heat dissipation effect to achieve the purpose of heat conduction and insulation.

[0035] During operation, the heat generated by the magnetic device 4 is conducted to the housing 1 through the heat-conducting substrate 2, and dissipated to the external environment through the housing 1, so that the heat of the magnetic device 4 is reduced and the impact of high temperature on surrounding components is reduced. Since the temperature inside the power supply device provided by the present application is relatively low, the problem of excessive temperature of other components inside the housing 1 caused by the heating of the magnetic device 4 is avoided, thereby achieving the effect of extending the service life.

[0036] It is worth noting that the preferred fixing member of the present application includes a fixing column 8 and a fixing plate 5, wherein the fixing column 8 is arranged on the inner side wall of the housing 1 and extends toward the inside of the housing 1, and is mainly used to limit the movement of the magnetic device 4 along the direction of the vertical axis. The axis of the fixing column 8 is preferably perpendicular to the surface of the housing 1 in the area connected thereto. In addition, in order to facilitate the assembly of the power supply device, the fixing column 8 is preferably arranged on the bottom surface inside the housing 1. In the actual processing process, the fixing column 8 and the housing 1 can be processed by an integral molding method, or they can be processed separately and fixed by welding or bonding.

[0037] The fixing plate 5 is arranged at the end of the fixing column 8, and the two can be fixed by self-tapping screws or other types of fasteners 7. At this time, a mounting hole is opened in the middle of the fixing plate 5, and the fastener 7 passes through the mounting hole and is fixed to the end of the fixing column 8, so as to realize the connection between the fixing plate 5 and the fixing column 8. In the assembled state, the fixing plate 5 and the housing 1 sandwich the magnetic device 4 in the middle, thereby limiting the installation position of the magnetic device 4 along the length direction of the fixing column 8.

[0038] Optionally, in order to prevent the magnetic device 4 from interfering with other components in the housing 1, an epoxy board or other insulating member with good hardness is preferably used as the fixing plate 5. In addition, in order to enhance the fixing effect of the magnetic device 4, a high temperature resistant sol can also be provided between the fixing plate 5 and the magnetic device 4.

[0039] Optionally, in order to optimize the use effect of the power supply device, the power supply device in this embodiment also includes a driving module 11 for converting the magnetic energy of the magnetic device 4 into electrical energy, and the driving module 11 is provided with a PCB board; the magnetic device 4 is provided with a coil lead 6 connected to the PCB board.

[0040] Specifically, the driving module 11 is used to convert energy so that the power supply device outputs electric energy. The working principle of the driving module 11 and the specific circuit structure of the PCB board can refer to the prior art. The magnetic device 4 is connected to the corresponding connection hole of the PCB board through the coil lead 6. In the actual connection process, since the fixed plate 5 is in contact with the end surface of the magnetic device 4, it is preferred to open a wire outlet hole on the fixed plate 5 for avoiding the coil lead 6. The coil lead 6 is connected to the PCB board after passing through the wire outlet hole; it is understandable that the coil lead 6 can also be led out from the side of the magnetic device 4 and kept connected to the PCB board.

[0041] Further, in order to enhance the insulation effect of the housing 1, on the basis of any of the above embodiments, the inner side wall of the housing 1 is provided with an annular groove 9 extending along the circumference of the fixing column 8, and an insulating sleeve 3 is sleeved on the outer circumference of the fixing column 8, and the end of the insulating sleeve 3 is arranged in the annular groove 9. Specifically, the annular groove 9 is located at the outer circumference of the end of the fixing column 8. One end of the insulating sleeve 3 abuts against the annular groove 9, and the other end extends to the fixing plate 5, so that the fixing column 8 is wrapped inside itself, so that the fixing column 8 is insulated from the magnetic device 4, thereby improving the insulation between the fixing column 8 and the magnetic device 4.

[0042] In order to further improve the insulation effect of the housing 1, in an embodiment provided in the present application, the inner wall of the housing 1 is provided with a boss 10 corresponding to the position of the magnetic device 4 and used to improve the insulation.

[0043] Specifically, the boss 10 and the magnetic device 4 are distributed on both sides of the thermally conductive substrate 2, and both are attached to the thermally conductive substrate 2. In addition, the cross-sectional area of ​​the boss is smaller than the cross-sectional area of ​​the thermally conductive substrate 2. Figure 3 Taking the perspective shown in FIG. 1 as an example, compared with a structure without the boss 10, the boss 10 can increase the creepage distance between the magnetic device 4 and the housing 1 by L, where L is the distance between the bottom edge of the thermal conductive substrate 2 and the top edge of the boss 10. Therefore, the boss 10 can improve the insulation of the housing 1 and also allow the user to appropriately reduce the thickness of the thermal conductive substrate 2.

[0044] It is understandable that when the boss 10 is used in conjunction with the insulating sleeve 3 , the annular groove 9 needs to be opened on the end surface of the boss 10 , that is, the annular groove 9 is provided on the side of the boss 10 facing the magnetic device 4 .

[0045] Furthermore, in an embodiment of the present application in which a magnetic device 4 is fixedly fixed with a fixing post 8, a through hole is provided in the middle of the magnetic device 4, and the fixing post 8 is provided in the through hole. Specifically, for a magnetic device 4 having a ring-shaped cross section and a through hole in the middle thereof, the fixing post 8 is preferably sleeved in the through hole to achieve a limiting effect on the magnetic device 4.

[0046] For the annular magnetic device, in the actual assembly process, the insulating sleeve 3 can be firstly sleeved on the outer periphery of the fixing column 8, and then the thermal conductive substrate 2 and the magnetic device 4 are sequentially sleeved on the outer periphery of the insulating sleeve 3, and then the fixing plate 5 and the fastener 7 are installed, and finally the coil lead 6 is connected to the PCB board of the driving module 11.

[0047] It should be noted that, in actual use, the user can set two or more magnetic devices 4 inside the housing 1 according to actual needs. In this case, each magnetic device 4 with a through hole needs to be fixed with a corresponding fixing column 8. For details, please refer to Figure 4 .

[0048] Furthermore, in another embodiment of the magnetic device 4 provided by the present application, which is fixed in cooperation with the fixing column 8, for the non-annular magnetic device 4, since there is no through hole in the middle thereof, at least two fixing columns 8 can be arranged on the periphery of the magnetic device 4 to limit the position of the magnetic device 4. Specifically, two or more fixing columns 8 are evenly arranged on the periphery of the magnetic device 4, preferably two fixing columns 8 are arranged, and the connecting line of the two passes through the center of the magnetic device 4. In addition, all the fixing columns 8 are connected to the same fixing plate 5 through corresponding fasteners 7 to fix the magnetic device 4.

[0049] It is worth noting that reference Figure 5 When two or more non-annular magnetic components 4 are arranged inside the housing 1 , all the magnetic components 4 can be fixed by the same fixing plate 5 , and at this time, adjacent magnetic components 4 share a fixing column 8 .

[0050] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0051] The power supply device provided by the present invention is introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A power supply device, comprising a housing (1) and a magnetic device (4) arranged inside the housing (1), characterized in that: The inner wall of the housing (1) is provided with a fixing column (8) for limiting the movement of the magnetic device (4), and the end of the fixing column (8) away from the housing (1) is provided with a fixing plate (5) for pressing the magnetic device (4); a heat-conducting substrate (2) is provided between the housing (1) and the magnetic device (4), and one side of the heat-conducting substrate (2) is in contact with the magnetic device (4) and the other side is in contact with the inner wall of the housing (1); A through hole is provided in the middle of the magnetic device (4), and the fixing column (8) is arranged in the through hole.

2. The power supply device according to claim 1, characterized in that: The fixing column (8) is arranged on the bottom surface of the casing (1).

3. The power supply device according to claim 1, characterized in that: A mounting hole is provided in the middle of the fixing plate (5), and a fastener (7) connected to the end of the fixing column (8) is provided in the mounting hole; and / or a high temperature resistant sol is provided between the fixing plate (5) and the magnetic device (4).

4. The power supply device according to claim 1, characterized in that: It also includes a drive module (11) for converting the magnetic energy of the magnetic device (4) into electrical energy, wherein the drive module (11) is provided with a PCB board; and the magnetic device (4) is provided with a coil lead (6) connected to the PCB board.

5. The power supply device according to claim 4, characterized in that: The fixing plate (5) is provided with a wire outlet hole for avoiding the coil lead wire (6).

6. The power supply device according to claim 1, characterized in that: The inner side wall of the housing (1) is provided with an annular groove (9) extending along the circumference of the fixing column (8); an insulating sleeve (3) is sleeved on the outer circumference of the fixing column (8); an end of the insulating sleeve (3) is arranged in the annular groove (9) to improve the insulation between the fixing column (8) and the magnetic device (4).

7. The power supply device according to claim 6, characterized in that: The inner wall of the housing (1) is provided with a boss (10) corresponding to the position of the magnetic device (4) and used to improve insulation, and the annular groove (9) is provided on a side of the boss (10) facing the magnetic device (4).

8. The power supply device according to any one of claims 1 to 7, characterized in that: The fixing column (8) and the housing (1) are integrally formed parts.

9. The power supply device according to any one of claims 1 to 7, characterized in that: At least two fixing columns (8) are provided on the periphery of the magnetic device (4) to limit the position of the magnetic device (4).

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