Semiconductor device lead assembly equipment

Abstract

The present invention discloses a semiconductor device lead assembly equipment, which relates to the field of semiconductor device production technology, including a cabinet, the cabinet includes a work surface, and a lead arrangement device, a lead grabbing device, an eagle eye recognition device and a lead installation device are arranged on the work surface, the lead arrangement device includes a vibration plate mounting base, a vibration plate and a jacking mechanism; the lead grabbing device includes a manipulator mounting seat, a four-axis manipulator and a lead grabbing mechanism; the eagle eye recognition device includes an eagle eye mounting frame, an eagle eye moving mechanism and a CCD industrial camera; the lead installation device includes a graphite box positioning plate mechanism and a graphite box transmission mechanism; a PLC controller is arranged in the cabinet, and the lead arrangement device, the lead grabbing device, the eagle eye recognition device and the lead installation device are electrically connected to the PLC controller. The present invention has the advantages of improving labor efficiency, reducing labor intensity and improving product quality.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor device production, and in particular relates to a semiconductor device lead assembly device. Background Art

[0002] Semiconductor devices are widely used in rail transit, home appliances, new energy, power supplies, inverters, consumer electronics, computers and peripherals, network communications, automotive electronics, LEDs and other fields. Semiconductor discrete devices are composed of chips, welding materials, lead frames, and packaging materials. Among them, three-dimensional semiconductor discrete devices have four external leads perpendicular to the heat dissipation surface. During the production process, they need to be assembled and welded from multiple parts. Traditional production processes use manual installation of leads, which is inefficient and labor-intensive. Employees' shoulders, necks, arms and other parts are prone to strain. If employees are not careful, quality problems such as missing or reverse insertion are also prone to occur. Summary of the invention

[0003] The object of the present invention is to provide a semiconductor device lead assembly equipment which can improve labor efficiency, reduce labor intensity and improve product quality.

[0004] The objective of the present invention is achieved through the following technical solutions:

[0005] A semiconductor device lead assembly device includes a cabinet, characterized in that: the cabinet includes a work surface, on which a lead arrangement device, a lead grabbing device, an eagle-eye recognition device and a lead installation device are arranged, the lead arrangement device includes a vibration plate mounting base, a vibration plate and a lifting mechanism; the lead grabbing device includes a manipulator mounting seat, a four-axis manipulator and a lead grabbing mechanism; the eagle-eye recognition device includes an eagle-eye mounting frame, an eagle-eye moving mechanism and a CCD industrial camera; the lead installation device includes a graphite box positioning plate mechanism and a graphite box transmission mechanism; a PLC controller is arranged in the cabinet, and the lead arrangement device, the lead grabbing device, the eagle-eye recognition device and the lead installation device are electrically connected to the PLC controller.

[0006] Preferably, the vibration plate comprises a chassis, a storage bin, an ascending spiral feeding section, a directional screening feeding section, a descending feeding section and a discharging section; the storage bin is arranged on the chassis, the inner periphery of the storage bin is provided with an ascending spiral feeding section, the outer periphery of the storage bin is provided with a directional screening feeding section, a descending feeding section and a discharging section in sequence in the transmission direction of the pull ring, and the discharging section is provided with a lifting mechanism away from the storage bin end.

[0007] Preferably, the lifting mechanism includes a lifting cylinder, a lifting body, a wire lead hole, a light sensor, a lifting mounting seat and a lifting retraction block. The lifting body is fixedly arranged on the work surface through the lifting mounting seat. The lifting body is provided with a lifting cylinder and a light sensor. The upper part of the lifting body is provided with a wire lead hole and a lifting retraction block. The wire lead hole can accommodate two wires. The lifting retraction block is connected to the protruding end of the lifting cylinder. The lifting cylinder and the light sensor are connected to the PLC controller.

[0008] Preferably, the manipulator mounting seat is fixedly connected to the work surface, the four-axis manipulator is rotatably connected to the manipulator mounting seat, and the lead grasping mechanism is installed on the four-axis manipulator.

[0009] Preferably, the lead wire grabbing mechanism comprises two lead wire grabbing cylinders and two lead wire grabbing blocks, the lead wire grabbing cylinders are fixedly connected to the lead wire grabbing blocks, a lead wire half hole is arranged at the lower end of the lead wire grabbing block, and the lead wire half holes arranged on the two lead wire grabbing blocks form a cavity that can accommodate a lead wire.

[0010] Preferably, the Hawkeye mounting frame is fixedly mounted on a work surface, the Hawkeye moving mechanism is mounted on the Hawkeye mounting frame, the Hawkeye moving mechanism includes a Hawkeye moving lead screw, a Hawkeye moving slide rail and a Hawkeye moving lead screw motor, the Hawkeye moving lead screw motor is arranged on the Hawkeye mounting frame, the Hawkeye moving lead screw motor drives the Hawkeye moving lead screw to rotate, the Hawkeye moving lead screw is arranged in the Hawkeye moving slide rail, the Hawkeye moving slide rail is fixedly connected to the Hawkeye mounting frame, the Hawkeye moving lead screw is provided with a Hawkeye moving nut that cooperates with the Hawkeye moving lead screw, the Hawkeye moving nut is fixedly connected to the CCD industrial camera mounting plate, and the CCD industrial camera is fixedly mounted on the CCD industrial camera mounting plate.

[0011] Preferably, the graphite box positioning plate mechanism comprises a positioning mounting plate, the positioning mounting plate is provided with support columns, the support columns are used to place the graphite box, and a plurality of limit blocks are provided around the positioning mounting plate.

[0012] Preferably, a partition plate is arranged in the middle of the positioning and mounting plate.

[0013] Preferably, the graphite box transmission mechanism includes a graphite box transmission screw, a graphite box transmission slide rail and a graphite box transmission screw motor. The graphite box transmission screw motor is arranged on the work table. The graphite box transmission screw motor drives the graphite box transmission screw to rotate. The graphite box transmission screw is arranged in the graphite box transmission slide rail. The graphite box transmission slide rail is fixedly connected to the work table. The graphite box transmission screw is provided with a graphite box transmission nut that cooperates with the graphite box transmission screw. The graphite box transmission nut is fixedly connected to the positioning mounting plate.

[0014] Preferably, there are two lead wire installation devices, which are respectively arranged on both sides of the lead wire grabbing device.

[0015] The beneficial effects of this technical solution are as follows:

[0016] 1. The semiconductor device lead assembly equipment provided by the present invention comprises a cabinet, the cabinet comprises a work surface, and a lead arrangement device, a lead grabbing device, an eagle-eye recognition device and a lead installation device are arranged on the work surface. The lead arrangement device comprises a vibration plate installation base, a vibration plate and a lifting mechanism; the lead grabbing device comprises a manipulator mounting seat, a four-axis manipulator and a lead grabbing mechanism; the eagle-eye recognition device comprises an eagle-eye mounting frame, an eagle-eye moving mechanism and a CCD industrial camera; the lead installation device comprises a graphite box positioning plate mechanism and a graphite box transmission mechanism; a PLC controller is arranged in the cabinet, and the lead arrangement device, the lead grabbing device, the eagle-eye recognition device and The lead installation device is electrically connected to the PLC controller; when in use, the semiconductor device lead assembly equipment is started by the PLC controller, the vibration plate is started, the lead is placed in the vibration plate, the vibration is arranged to the discharge section, the graphite box is manually placed on the lead installation device, the lead installation device moves to the Hawkeye recognition device, the Hawkeye recognition device takes a photo of the graphite, collects position information, and transmits it to the PLC controller, the lead installation device moves to the pin station, the lead grabbing device clamps the arranged lead, moves to the top of the lead installation device, inserts it into the graphite box, the lead installation device moves the mold filled with leads out of the pin station, and manually takes out the graphite box. The present invention has the advantages of improving labor efficiency, reducing labor intensity, and improving product quality.

[0017] 2. The semiconductor device lead assembly equipment provided by the present invention comprises a vibration plate including a chassis, a storage bin, an upward spiral feeding section, a directional screening feeding section, a downward feeding section and a discharging section; the storage bin is arranged on the chassis, the inner circumference of the storage bin is provided with an upward spiral feeding section, the outer circumference of the storage bin is provided with a directional screening feeding section, a downward feeding section and a discharging section in sequence in the transmission direction of the pull ring, a lifting mechanism is provided at the discharging section away from the storage bin end, after the lead is placed in the storage bin, the lead is arranged in the downward feeding section in the upward spiral feeding section and the directional screening feeding section due to the different upper and lower ends of the lead, and the lead is fed to the discharging section, a lifting mechanism is provided at the discharging section away from the storage bin end, the lead is ejected upward under the action of the lifting mechanism, and it is convenient for the lead grasping device to grasp the lead.

[0018] 3. The semiconductor device lead assembly equipment provided by the present invention comprises a lifting mechanism including a lifting cylinder, a lifting body, a lead hole, a light sensor, a lifting mounting seat and a lifting shrinkage block. The lifting body is fixedly arranged on the workbench through the lifting mounting seat. The lifting body is provided with a lifting cylinder and a light sensor. The upper part of the lifting body is provided with a lead hole and a lifting shrinkage block. The lead hole can accommodate two leads. The lifting shrinkage block is connected to the protruding end of the lifting cylinder. The lifting cylinder and the light sensor are connected to the PLC controller. The lead enters the lead hole from the discharge section. The light sensor detects the lead. If the light sensor does not detect it, the lifting cylinder is started by the PLC controller, and the lifting shrinkage block lifts the lead under the action of the lifting cylinder.

[0019] 4. The semiconductor device lead assembly equipment provided by the present invention has a manipulator mounting seat fixedly connected to the workbench, a four-axis manipulator rotatably connected to the manipulator mounting seat, a lead grasping mechanism installed on the four-axis manipulator, and the four-axis manipulator moves the lead grasping mechanism to the discharge section. After the lead grasping mechanism grasps the lead, the four-axis manipulator moves the lead grasping mechanism to the graphite box, and the lead grasping mechanism inserts the lead into the graphite box, so that the pin insertion speed is faster and more accurate.

[0020] 5. The semiconductor device lead assembly equipment provided by the present invention comprises a lead grabbing mechanism including two lead grabbing cylinders and two lead grabbing blocks. The lead grabbing cylinder is fixedly connected to the lead grabbing block. A lead half hole is arranged at the lower end of the lead grabbing block. The lead half holes arranged on the two lead grabbing blocks form a cavity that can accommodate a lead. When the lead grabbing cylinder releases air, the lead grabbing block moves outward to loosen the lead. After the lead enters the cavity, the lead grabbing block moves inward to grab the lead when the lead grabbing cylinder takes air.

[0021] 6. The semiconductor device lead assembly equipment provided by the present invention, the Hawkeye mounting frame is fixedly installed on the workbench, the Hawkeye moving mechanism is installed on the Hawkeye mounting frame, the Hawkeye moving mechanism includes a Hawkeye moving lead screw, a Hawkeye moving slide rail and a Hawkeye moving lead screw motor, the Hawkeye moving lead screw motor is arranged on the Hawkeye mounting frame, the Hawkeye moving lead screw motor drives the Hawkeye moving lead screw to rotate, the Hawkeye moving lead screw is arranged in the Hawkeye moving slide rail, the Hawkeye moving slide rail is fixedly connected to the Hawkeye mounting frame, the Hawkeye moving lead screw is provided with a Hawkeye moving nut that cooperates with the Hawkeye moving lead screw, the Hawkeye moving nut is fixedly connected to the CCD industrial camera mounting plate, the CCD industrial camera is fixedly installed on the CCD industrial camera mounting plate, the Hawkeye mounting frame is also provided with a Hawkeye transmission chain, a cable accommodating cavity is arranged in the Hawkeye transmission chain, the CCD industrial camera moves back and forth under the action of the Hawkeye moving mechanism, collects position information, and transmits it to the PLC controller, and the setting of the Hawkeye transmission chain makes the cable not easily damaged.

[0022] 7. The semiconductor device lead assembly equipment provided by the present invention, the graphite box positioning plate mechanism includes a positioning mounting plate, a support column is arranged on the positioning mounting plate, the support column is used to place the graphite box, a plurality of limit blocks are arranged around the positioning mounting plate, a positioning plate transmission chain is arranged on the side of the positioning mounting plate, a cable accommodating cavity is arranged in the positioning plate transmission chain, the graphite is placed on the support column, the limit blocks arranged around the positioning mounting plate fix the graphite box on the positioning mounting plate, and the arrangement of the positioning plate transmission chain makes it difficult for the cable moving back and forth to be damaged.

[0023] 8. In the semiconductor device lead assembly equipment provided by the present invention, a partition plate is provided in the middle of the positioning and mounting plate, so that the positioning and mounting plate can simultaneously mount multiple graphite boxes.

[0024] 9. The semiconductor device lead assembly equipment provided by the present invention, the graphite box transmission mechanism includes a graphite box transmission screw, a graphite box transmission slide rail and a graphite box transmission screw motor, the graphite box transmission screw motor is arranged on the work table, the graphite box transmission screw motor drives the graphite box transmission screw to rotate, the graphite box transmission screw is arranged in the graphite box transmission slide rail, the graphite box transmission slide rail is fixedly connected to the work table, the graphite box transmission screw is provided with a graphite box transmission nut that cooperates with the graphite box transmission screw, the graphite box transmission nut is fixedly connected to the positioning mounting plate, the graphite box positioning plate mechanism realizes reciprocating motion under the graphite box transmission mechanism, which is convenient for putting in and taking out the graphite box and inserting the leads.

[0025] 10. The semiconductor device lead assembly equipment provided by the present invention has two lead assembly devices, which are respectively arranged on both sides of the lead grasping device, thereby reducing the waiting time for placing and taking out the graphite box and improving labor efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The foregoing and following detailed description of the present invention will become more apparent when read in conjunction with the following drawings, in which:

[0027] Figure 1 It is a schematic diagram of the structure of the present invention;

[0028] Figure 2 It is a structural schematic diagram of the lead arrangement device of the present invention;

[0029] Figure 3 It is a structural schematic diagram of the jacking mechanism of the present invention;

[0030] Figure 4 It is a structural schematic diagram of the top lead grabbing mechanism of the present invention;

[0031] Figure 5 It is a schematic diagram of the structure of the Hawkeye recognition device of the present invention;

[0032] Figure 6It is a schematic structural diagram of the lead installation device of the present invention;

[0033] In the figure:

[0034] 1. Cabinet; 2. Work surface; 3. Lead arrangement device; 4. Lead grabbing device; 5. Hawkeye identification device; 6. Lead installation device; 7. Vibration plate installation base; 8. Vibration plate; 9. Lifting mechanism; 10. Manipulator mounting seat; 11. Four-axis manipulator; 12. Lead grabbing mechanism; 13. Hawkeye mounting frame; 14. Hawkeye moving mechanism; 15. CCD industrial camera; 16. Graphite box positioning plate mechanism; 17. Graphite box transmission mechanism; 18. Chassis; 19. Storage bin; 20. Upward spiral feeding section; 21. Directional screening feeding section; 2 2. Downward feeding section; 23. Discharging section; 24. Lifting body; 25. Lead hole; 26. Lifting mounting seat; 27. Lead grabbing cylinder; 28. Lead grabbing block; 29. ​​Hawkeye moving lead screw; 30. Hawkeye moving slide rail; 31. Hawkeye moving lead screw motor; 32. CCD industrial camera mounting plate; 33. Hawkeye transmission chain; 34. Positioning mounting plate; 35. Support column; 36. Limit block; 37. Positioning disk transmission chain; 38. Partition plate; 39. Graphite box transmission lead screw; 40. Graphite box transmission slide rail; 41. Graphite box transmission lead screw motor. DETAILED DESCRIPTION

[0035] The following is a further explanation of the technical solution for achieving the purpose of the present invention through several specific embodiments. It should be noted that the technical solution claimed for protection by the present invention includes but is not limited to the following embodiments.

[0036] Example 1

[0037] As a most basic implementation scheme of the present invention, this embodiment discloses a semiconductor device lead assembly device, such as Figure 1 As shown, it includes a cabinet 1, the cabinet 1 includes a work surface 2, and the work surface 2 is provided with a lead arrangement device 3, a lead grabbing device 4, an eagle eye recognition device 5 and a lead installation device 6, the lead arrangement device 3 includes a vibration plate mounting base 7, a vibration plate 8 and a lifting mechanism 9; the lead grabbing device 4 includes a manipulator mounting seat 10, a four-axis manipulator 11 and a lead grabbing mechanism 12; the eagle eye recognition device 5 includes an eagle eye mounting frame 13, an eagle eye moving mechanism 14 and a CCD industrial camera 15; the lead installation device 6 includes a graphite box positioning plate mechanism 16 and a graphite box transmission mechanism 17; a PLC controller is arranged in the cabinet 1, and the lead arrangement device 3, the lead grabbing device 4, the eagle eye recognition device 5 and the lead installation device 6 are electrically connected to the PLC controller.

[0038] The semiconductor device lead assembly equipment provided by the present invention comprises a cabinet 1, the cabinet 1 comprises a work surface 2, a lead arrangement device 3, a lead grabbing device 4, an eagle eye recognition device 5 and a lead installation device 6 are arranged on the work surface 2, the lead arrangement device 3 comprises a vibration plate installation base 7, a vibration plate 8 and a lifting mechanism 9; the lead grabbing device 4 comprises a manipulator mounting seat 10, a four-axis manipulator 11 and a lead grabbing mechanism 12; the eagle eye recognition device 5 comprises an eagle eye mounting frame 13, an eagle eye moving mechanism 14 and a CCD industrial camera 15; the lead installation device 6 comprises a graphite box positioning plate mechanism 16 and a graphite box transmission mechanism 17; a PLC controller is arranged in the cabinet 1, the lead arrangement device 3, the lead grabbing device 4, the eagle eye recognition device 5 and the lead installation device 6 4. The Hawkeye recognition device 5 and the lead installation device 6 are electrically connected to the PLC controller; when in use, the semiconductor device lead assembly equipment is started by the PLC controller, the vibration plate 8 is started, the lead is placed in the vibration plate 8, and the lead is arranged to the discharge section 23 by vibration. The graphite box is manually placed on the lead installation device 6, and the lead installation device 6 moves to the Hawkeye recognition device 5. The Hawkeye recognition device 5 takes a photo of the graphite and collects the position information, and transmits it to the PLC controller. The lead installation device 6 moves to the pin station, the lead grabbing device 4 clamps the arranged lead, moves to the top of the lead installation device 6, and inserts it into the graphite box. The lead installation device 6 moves the mold filled with leads out of the pin station, and manually takes out the graphite box. The present invention has the advantages of improving labor efficiency, reducing labor intensity, and improving product quality.

[0039] Example 2

[0040] As a preferred embodiment of the present invention, this embodiment discloses a semiconductor device lead assembly device, such as Figure 1 As shown, it includes a cabinet 1, the cabinet 1 includes a work surface 2, and the work surface 2 is provided with a lead arrangement device 3, a lead grabbing device 4, an eagle eye recognition device 5 and a lead installation device 6, the lead arrangement device 3 includes a vibration plate mounting base 7, a vibration plate 8 and a lifting mechanism 9; the lead grabbing device 4 includes a manipulator mounting seat 10, a four-axis manipulator 11 and a lead grabbing mechanism 12; the eagle eye recognition device 5 includes an eagle eye mounting frame 13, an eagle eye moving mechanism 14 and a CCD industrial camera 15; the lead installation device 6 includes a graphite box positioning plate mechanism 16 and a graphite box transmission mechanism 17; a PLC controller is arranged in the cabinet 1, and the lead arrangement device 3, the lead grabbing device 4, the eagle eye recognition device 5 and the lead installation device 6 are electrically connected to the PLC controller.

[0041] like Figure 2As shown, preferably, the vibration plate 8 includes a chassis 18, a storage bin 19, an upward spiral feeding section 20, a directional screening feeding section 21, a downward feeding section 22 and a discharging section 23; the storage bin 19 is arranged on the chassis 18, the inner periphery of the storage bin 19 is provided with an upward spiral feeding section 20, the outer periphery of the storage bin 19 is provided with a directional screening feeding section 21, a downward feeding section 22 and a discharging section 23 in sequence in the transmission direction of the pull ring, and the discharging section 23 is provided with a lifting mechanism 9 away from the end of the storage bin 19.

[0042] like Figure 3 As shown, preferably, the lifting mechanism 9 includes a lifting cylinder, a lifting body 24, a wire lead hole 25, a light sensor, a lifting mounting seat 26 and a lifting contraction block. The lifting body 24 is fixedly arranged on the work surface 2 through the lifting mounting seat 26. The lifting body 24 is provided with a lifting cylinder and a light sensor. The upper part of the lifting body 24 is provided with a wire lead hole 25 and a lifting contraction block. The wire lead hole 25 can accommodate two wires. The lifting contraction block is connected to the protruding end of the lifting cylinder. The lifting cylinder and the light sensor are connected to the PLC controller.

[0043] Preferably, the manipulator mounting seat 10 is fixedly connected to the work surface 2 , the four-axis manipulator 11 is rotatably connected to the manipulator mounting seat 10 , and the lead grabbing mechanism 12 is installed on the four-axis manipulator 11 .

[0044] like Figure 4 As shown, preferably, the lead wire grabbing mechanism 12 includes two lead wire grabbing cylinders 27 and two lead wire grabbing blocks 28, the lead wire grabbing cylinders 27 are fixedly connected to the lead wire grabbing blocks 28, a lead wire half hole is arranged at the lower end of the lead wire grabbing block 28, and the lead wire half holes arranged on the two lead wire grabbing blocks 28 form a cavity that can accommodate a lead wire.

[0045] like Figure 5 As shown, preferably, the Hawkeye mounting frame 13 is fixedly mounted on the work surface 2, the Hawkeye moving mechanism 14 is mounted on the Hawkeye mounting frame 13, the Hawkeye moving mechanism 14 includes a Hawkeye moving screw 29, a Hawkeye moving slide rail 30 and a Hawkeye moving screw motor 31, the Hawkeye moving screw motor 31 is arranged on the Hawkeye mounting frame 13, the Hawkeye moving screw motor 31 drives the Hawkeye moving screw 29 to rotate, the Hawkeye moving screw 29 is arranged in the Hawkeye moving slide rail 30, the Hawkeye moving slide rail 30 is fixedly connected to the Hawkeye mounting frame 13, the Hawkeye moving screw 29 is provided with a Hawkeye moving nut that cooperates with the Hawkeye moving screw 29, the Hawkeye moving nut is fixedly connected to the CCD industrial camera mounting plate 32, the CCD industrial camera 15 is fixedly mounted on the CCD industrial camera mounting plate 32, and the Hawkeye mounting frame 13 is also provided with a Hawkeye transmission chain 33, and a cable accommodating cavity is provided in the Hawkeye transmission chain 33.

[0046] like Figure 6 As shown, preferably, the graphite box positioning disk mechanism 16 includes a positioning mounting plate 34, a support column 35 is provided on the positioning mounting plate 34, the support column 35 is used to place the graphite box, a plurality of limit blocks 36 are provided around the positioning mounting plate 34, a positioning disk transmission chain 37 is provided on the side of the positioning mounting plate 34, and a cable accommodating cavity is provided in the positioning disk transmission chain 37.

[0047] Preferably, a partition plate 38 is provided in the middle of the positioning and mounting plate 34 .

[0048] Preferably, the graphite box transmission mechanism 17 includes a graphite box transmission screw 39, a graphite box transmission slide rail 40 and a graphite box transmission screw motor 41, the graphite box transmission screw motor 41 is arranged on the work table 2, the graphite box transmission screw motor 41 drives the graphite box transmission screw 39 to rotate, the graphite box transmission screw 39 is arranged in the graphite box transmission slide rail 40, the graphite box transmission slide rail 40 is fixedly connected to the work table 2, the graphite box transmission screw 39 is provided with a graphite box transmission nut cooperating with the graphite box transmission screw 39, and the graphite box transmission nut is fixedly connected to the positioning mounting plate 34.

[0049] Preferably, there are two lead wire installation devices 6 , and the lead wire installation devices 6 are respectively arranged on both sides of the lead wire grabbing device 4 .

[0050] The semiconductor device lead assembly equipment provided by the present invention comprises a cabinet 1, the cabinet 1 comprises a work surface 2, a lead arrangement device 3, a lead grabbing device 4, an eagle eye recognition device 5 and a lead installation device 6 are arranged on the work surface 2, the lead arrangement device 3 comprises a vibration plate installation base 7, a vibration plate 8 and a lifting mechanism 9; the lead grabbing device 4 comprises a manipulator mounting seat 10, a four-axis manipulator 11 and a lead grabbing mechanism 12; the eagle eye recognition device 5 comprises an eagle eye mounting frame 13, an eagle eye moving mechanism 14 and a CCD industrial camera 15; the lead installation device 6 comprises a graphite box positioning plate mechanism 16 and a graphite box transmission mechanism 17; a PLC controller is arranged in the cabinet 1, the lead arrangement device 3, the lead grabbing device 4, the eagle eye recognition device 5 and the lead installation device 6 4. The Hawkeye recognition device 5 and the lead installation device 6 are electrically connected to the PLC controller; when in use, the semiconductor device lead assembly equipment is started by the PLC controller, the vibration plate 8 is started, the lead is placed in the vibration plate 8, and the lead is arranged to the discharge section 23 by vibration. The graphite box is manually placed on the lead installation device 6, and the lead installation device 6 moves to the Hawkeye recognition device 5. The Hawkeye recognition device 5 takes a photo of the graphite and collects the position information, and transmits it to the PLC controller. The lead installation device 6 moves to the pin station, the lead grabbing device 4 clamps the arranged lead, moves to the top of the lead installation device 6, and inserts it into the graphite box. The lead installation device 6 moves the mold filled with leads out of the pin station, and manually takes out the graphite box. The present invention has the advantages of improving labor efficiency, reducing labor intensity, and improving product quality.

[0051] The vibration plate 8 includes a chassis 18, a storage bin 19, an upward spiral feeding section 20, a directional screening feeding section 21, a downward feeding section 22 and a discharging section 23; the storage bin 19 is arranged on the chassis 18, and the inner periphery of the storage bin 19 is provided with an upward spiral feeding section 20, and the outer periphery of the storage bin 19 is provided with a directional screening feeding section 21, a downward feeding section 22 and a discharging section 23 in the transmission direction of the pull ring in sequence, and the discharging section 23 is provided with a jacking mechanism 9 at the end away from the storage bin 19. After the lead wire is put into the storage bin 19, the lead wire is arranged in the downward feeding section 22 in the upward spiral feeding section 20 and the directional screening feeding section 21 due to the different upper and lower ends of the lead wire, and the lead wire is sent to the discharging section 23, and the discharging section 23 is provided with a jacking mechanism 9 at the end away from the storage bin 19. The lead wire is ejected upward under the action of the jacking mechanism 9, so that the lead wire grabbing device 4 grabs the lead wire. The lifting mechanism 9 includes a lifting cylinder, a lifting body 24, a wire lead hole 25, a light sensor, a lifting mounting seat 26 and a lifting and shrinking block. The lifting body 24 is fixedly arranged on the work surface 2 through the lifting mounting seat 26. The lifting body 24 is provided with a lifting cylinder and a light sensor. The upper part of the lifting body 24 is provided with a wire lead hole 25 and a lifting and shrinking block. The wire lead hole 25 can accommodate two wires. The lifting and shrinking block is connected to the protruding end of the lifting cylinder. The lifting cylinder and the light sensor are connected to the PLC controller. The lead wire enters the wire lead hole 25 from the discharge section 23. The light sensor detects the lead wire. If the light sensor does not detect it, the lifting cylinder is started by the PLC controller, and the lifting and shrinking block lifts the lead wire under the action of the lifting cylinder. The manipulator mounting seat 10 is fixedly connected to the work table 2, the four-axis manipulator 11 is rotatably connected to the manipulator mounting seat 10, the lead grabbing mechanism 12 is installed on the four-axis manipulator 11, the four-axis manipulator 11 moves the lead grabbing mechanism 12 to the discharge section 23, after the lead grabbing mechanism 12 grabs the lead, the four-axis manipulator 11 moves the lead grabbing mechanism 12 to the graphite box, and the lead grabbing mechanism 12 inserts the lead into the graphite box, so that the pin insertion speed is faster and more accurate. The lead wire grabbing mechanism 12 includes two lead wire grabbing cylinders 27 and two lead wire grabbing blocks 28. The lead wire grabbing cylinders 27 are fixedly connected to the lead wire grabbing blocks 28. A lead wire half hole is set at the lower end of the lead wire grabbing block 28. The lead wire half holes set on the two lead wire grabbing blocks 28 form a cavity that can accommodate a lead wire. When the lead wire grabbing cylinders 27 exhaust air, the lead wire grabbing blocks 28 move outward to loosen the lead wire. After the lead wire enters the cavity, the lead wire grabbing blocks 28 move inward when the lead wire grabbing cylinders 27 intake air to grab the lead wire.The eagle eye mounting frame 13 is fixedly mounted on the work surface 2, and the eagle eye moving mechanism 14 is mounted on the eagle eye mounting frame 13. The eagle eye moving mechanism 14 includes an eagle eye moving lead screw 29, an eagle eye moving slide rail 30 and an eagle eye moving lead screw motor 31. The eagle eye moving lead screw motor 31 is arranged on the eagle eye mounting frame 13. The eagle eye moving lead screw motor 31 drives the eagle eye moving lead screw 29 to rotate. The eagle eye moving lead screw 29 is arranged in the eagle eye moving slide rail 30. The eagle eye moving slide rail 30 is fixedly connected to the eagle eye mounting frame 13. The eagle eye moving lead screw 29 is provided with an eagle eye moving nut that cooperates with the eagle eye moving lead screw 29. The eagle eye moving nut is fixedly connected to the CCD industrial camera mounting plate 32. The CCD industrial camera 15 is fixedly mounted on the CCD industrial camera mounting plate 32. The Hawkeye mounting frame 13 is also provided with a Hawkeye transmission chain 33. A cable accommodating cavity is provided in the Hawkeye transmission chain 33. The CCD industrial camera 15 moves back and forth under the action of the Hawkeye moving mechanism 14, collects position information, and transmits it to the PLC controller. The setting of the Hawkeye transmission chain 33 makes the cable not easily damaged. The graphite box positioning plate mechanism 16 includes a positioning mounting plate 34. A support column 35 is provided on the positioning mounting plate 34. The support column 35 is used to place the graphite box. A plurality of limit blocks 36 are arranged around the positioning mounting plate 34. A positioning plate transmission chain 37 is arranged on the side of the positioning mounting plate 34. A cable accommodating cavity is provided in the positioning plate transmission chain 37. The graphite is placed on the support column 35. The limit blocks 36 arranged around the positioning mounting plate 34 fix the graphite box on the positioning mounting plate 34. The setting of the positioning plate transmission chain 37 makes the cable moving back and forth not easily damaged. A partition plate 38 is provided in the middle of the positioning mounting plate 34 so that the positioning mounting plate 34 can simultaneously install multiple graphite boxes. The graphite box transmission mechanism 17 includes a graphite box transmission screw 39, a graphite box transmission slide rail 40 and a graphite box transmission screw motor 41. The graphite box transmission screw motor 41 is provided on the work table 2. The graphite box transmission screw motor 41 drives the graphite box transmission screw 39 to rotate. The graphite box transmission screw 39 is provided in the graphite box transmission slide rail 40. The graphite box transmission slide rail 40 is fixedly connected to the work table 2. A graphite box transmission screw nut that cooperates with the graphite box transmission screw 39 is provided on the graphite box transmission screw 39. The graphite box transmission screw nut is fixedly connected to the positioning mounting plate 34. The graphite box positioning plate mechanism 16 realizes reciprocating motion under the graphite box transmission mechanism 17, which is convenient for putting in and taking out the graphite box and inserting the lead wire. There are two lead wire installation devices 6, which are respectively arranged on both sides of the lead wire grasping device 4, so as to reduce the waiting time for putting in and taking out the graphite box and improve the labor efficiency.

Claims

1. A semiconductor device lead assembly device, comprising a cabinet (1), characterized in that: The cabinet (1) comprises a work surface (2), on which a lead arrangement device (3), a lead grabbing device (4), an eagle eye recognition device (5) and a lead installation device (6) are arranged, the lead arrangement device (3) comprising a vibration plate mounting base (7), a vibration plate (8) and a lifting mechanism (9); the lead grabbing device (4) comprising a manipulator mounting base (10), a four-axis manipulator (11) and a lead grabbing mechanism (12); the eagle eye recognition device (5) comprising an eagle eye mounting frame (13), an eagle eye moving mechanism (14) and a CCD industrial camera (15); the lead installation device (6) comprising a graphite box positioning plate mechanism (16) and a graphite box transmission mechanism (17); a PLC controller is arranged in the cabinet (1), and the lead arrangement device (3), the lead grabbing device (4), the eagle eye recognition device (5) and the lead installation device (6) are electrically connected to the PLC controller; The lifting mechanism (9) comprises a lifting cylinder, a lifting body (24), a wire lead hole (25), a light sensor, a lifting mounting seat (26) and a lifting contraction block. The lifting body (24) is fixedly mounted on the work surface (2) via the lifting mounting seat (26). The lifting cylinder and the light sensor are arranged inside the lifting body (24). The upper part of the lifting body (24) is provided with a wire lead hole (25) and a lifting contraction block. The wire lead hole (25) can accommodate two wires. The lifting contraction block is connected to the protruding end of the lifting cylinder. The lifting cylinder and the light sensor are connected to a PLC controller. When in use, the semiconductor device lead assembly equipment is started through the PLC controller, the vibration plate (8) is started, the leads are placed in the lead arrangement device (3), and arranged by vibration to the discharge section (23), the graphite box is manually placed on the lead installation device (6), the lead installation device (6) moves to the eagle eye recognition device (5), the eagle eye recognition device (5) takes a photo of the graphite box, collects position information, and transmits it to the PLC controller, the lead installation device (6) moves to the pin insertion station, the lead grabbing device (4) clamps the arranged leads, moves to the top of the lead installation device (6), and inserts them into the graphite box, the lead installation device (6) moves the mold filled with leads out of the pin insertion station, and the graphite box is manually taken out.

2. The semiconductor device lead assembly equipment according to claim 1, characterized in that: The vibration plate (8) comprises a chassis (18), a storage bin (19), an upward spiral feeding section (20), a directional screening feeding section (21), a downward feeding section (22) and a discharge section (23); the storage bin (19) is arranged on the chassis (18), the inner periphery of the storage bin (19) is provided with an upward spiral feeding section (20), the outer periphery of the storage bin (19) is provided with a directional screening feeding section (21), a downward feeding section (22) and a discharge section (23) in sequence in the transmission direction of the pull ring, and the discharge section (23) is provided with a lifting mechanism (9) at the end away from the storage bin (19).

3. The semiconductor device lead assembly equipment according to claim 1, characterized in that: The manipulator mounting seat (10) is fixedly connected to the work surface (2), the four-axis manipulator (11) is rotatably connected to the manipulator mounting seat (10), and the lead wire grabbing mechanism (12) is mounted on the four-axis manipulator (11).

4. The semiconductor device lead assembly equipment according to claim 1, characterized in that: The lead wire grabbing mechanism (12) comprises two lead wire grabbing cylinders (27) and two lead wire grabbing blocks (28), wherein the lead wire grabbing cylinders (27) are fixedly connected to the lead wire grabbing blocks (28), and a lead wire half hole is arranged at the lower end of the lead wire grabbing block (28), and the lead wire half holes arranged on the two lead wire grabbing blocks (28) form a cavity capable of accommodating a lead wire.

5. The semiconductor device lead assembly equipment according to claim 1, characterized in that: The eagle eye mounting frame (13) is fixedly mounted on the work surface (2); the eagle eye moving mechanism (14) is mounted on the eagle eye mounting frame (13); the eagle eye moving mechanism (14) comprises an eagle eye moving screw (29), an eagle eye moving slide rail (30) and an eagle eye moving screw motor (31); the eagle eye moving screw motor (31) is arranged on the eagle eye mounting frame (13); the eagle eye moving screw motor (31) drives the eagle eye moving screw (29) to rotate; the eagle eye moving screw (29) is arranged in the eagle eye moving slide rail (30); the eagle eye moving slide rail (30) is fixedly connected to the eagle eye mounting frame (13); an eagle eye moving screw nut cooperating with the eagle eye moving screw (29) is arranged on the eagle eye moving screw (29); the eagle eye moving screw nut is fixedly connected to a CCD industrial camera mounting plate (32); and the CCD industrial camera (15) is fixedly mounted on the CCD industrial camera mounting plate (32).

6. The semiconductor device lead assembly equipment according to claim 1, characterized in that: The graphite box positioning plate mechanism (16) comprises a positioning mounting plate (34), on which a support column (35) is arranged, the support column (35) being used to place the graphite box, and a plurality of limit blocks (36) are arranged around the positioning mounting plate (34).

7. The semiconductor device lead assembly equipment according to claim 6, characterized in that: A partition plate (38) is provided in the middle of the positioning and mounting plate (34).

8. The semiconductor device lead assembly equipment according to claim 1, characterized in that: The graphite box transmission mechanism (17) comprises a graphite box transmission screw (39), a graphite box transmission slide rail (40) and a graphite box transmission screw motor (41). The graphite box transmission screw motor (41) is arranged on the work surface (2). The graphite box transmission screw motor (41) drives the graphite box transmission screw (39) to rotate. The graphite box transmission screw (39) is arranged in the graphite box transmission slide rail (40). The graphite box transmission slide rail (40) is fixedly connected to the work surface (2). A graphite box transmission nut cooperating with the graphite box transmission screw (39) is arranged on the graphite box transmission screw (39). The graphite box transmission nut is fixedly connected to the positioning mounting plate (34).

9. The semiconductor device lead assembly equipment according to claim 1, characterized in that: There are two lead wire installation devices (6), and the lead wire installation devices (6) are respectively arranged on both sides of the lead wire grabbing device (4).

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