Silicon wafer cleaning mechanism

Abstract

The invention discloses a silicon wafer cleaning mechanism, comprising a frame and two cleaning tanks arranged on the frame, a cleaning device mounting frame, a cleaning device mounting frame swinging device, a stabilizing device, and a cleaning basket movably mounted on the cleaning device mounting frame; the cleaning device mounting frame swinging device comprises a first transverse rotating shaft arranged between the two cleaning tanks, the left and right ends of the first transverse rotating shaft are symmetrically fixed with rotating plates of equal length, and the two rotating plates are respectively equipped with a second transverse rotating shaft; the two ends of the cleaning device mounting frame are respectively connected to the two second transverse rotating shafts; the left and right ends of the bottom end of the cleaning device mounting frame are respectively provided with vertical plates perpendicular to the second transverse rotating shaft, and a cleaning basket is horizontally installed between the two vertical plates; the top end of the cleaning device mounting frame is horizontally provided with a cleaning drive motor, and the cleaning drive motor is connected to the silicon wafer rotating drive device of the cleaning basket. The silicon wafer cleaning mechanism of the invention has the characteristics of high cleaning efficiency.

Description

Technical Field

[0001] The invention relates to a cleaning mechanism, and in particular to a silicon wafer cleaning mechanism. Background Art

[0002] Wafer acid etching is an important process in the production of semiconductor wafers. In this process, the damaged layer on the surface of the wafer after grinding is required to be removed, and the surface color is required to be consistent, reaching a certain glossiness, roughness, and thickness and TTV (wafer thickness variation) geometric parameter requirements. It has a great impact on the quality of the subsequent processing of the wafer.

[0003] Most of the existing acid etching machines are early generation equipment. The mechanical structure design itself is designed for silicon wafers below 6 inches. The rotation speed of the silicon wafer during the processing cannot be controlled and adjusted. When cleaning the silicon wafer, it is necessary to change the dressing. The existing cleaning and dressing change efficiency is low. The medicine needs to be put into the cleaning container before cleaning. The waiting time for the dressing change is long, resulting in low cleaning efficiency. In addition, the cleaning effect is average due to contact with the medicine during cleaning. In addition, the cleaning basket of the existing technology mostly uses an extrusion method to fix the silicon wafer and rotate the silicon wafer, which easily causes the edge of the silicon wafer to have fixture marks, affecting the color difference and the edge TTV (silicon wafer thickness variation). Summary of the invention

[0004] The purpose of the present invention is to provide a silicon wafer cleaning mechanism to address the deficiencies of the prior art.

[0005] The technical solution adopted by the present invention is as follows.

[0006] A silicon wafer cleaning mechanism comprises a frame, two cleaning tanks arranged in front and back on the frame, a cleaning device mounting frame, a cleaning device mounting frame swinging device, a stabilizing device, and a cleaning basket movably mounted on the cleaning device mounting frame.

[0007] The swing device of the cleaning device mounting frame includes a first transverse rotating shaft arranged between the two cleaning tanks, and equal-length rotating plates are symmetrically fixed to the left and right ends of the first transverse rotating shaft, and a second transverse rotating shaft is respectively mounted on the ends of the two rotating plates away from the first transverse rotating shaft, and the central axes of the two second transverse rotating shafts are on the same straight line; the two ends of the cleaning device mounting frame are respectively connected to the two second transverse rotating shafts; and the first transverse rotating shaft is connected to the first transverse rotating shaft driving motor.

[0008] A vertical plate perpendicular to the second horizontal rotation axis is respectively arranged at the left and right ends of the bottom end of the cleaning device mounting frame, and a cleaning basket is horizontally installed between the two vertical plates; a cleaning drive motor is horizontally arranged at the top end of the cleaning device mounting frame, and the cleaning drive motor is connected to the silicon wafer rotation drive device of the cleaning basket.

[0009] The stabilizing device includes two longitudinal rods and two cleaning device mounting frame limiting devices; longitudinal rods are respectively arranged directly above the two vertical plates at the top of the frame body, and a cleaning device mounting frame limiting device is vertically mounted on each longitudinal rod, and each cleaning device mounting frame limiting device is provided with a second transverse rotating shaft limiting groove which is vertically arranged and opens downward, and each second transverse rotating shaft is respectively located in the second transverse rotating shaft limiting groove which is closest to it; when the first transverse rotating shaft rotates to make the cleaning device mounting frame enter and exit the two cleaning grooves, the second transverse rotating shaft moves up and down in the second transverse rotating shaft limiting groove which is closest to it and each cleaning device mounting frame limiting device reciprocates on the longitudinal rod mounted thereon.

[0010] The beneficial effects of the present invention are as follows: two cleaning tanks are arranged, and when one of the two cleaning tanks is being cleaned, the other cleaning tank can change the liquid, thus saving the time of waiting for adding the medicine solution; the cleaning basket enters the two cleaning tanks under the action of the first transverse rotating shaft, and a stabilizing mechanism is provided to prevent the cleaning basket from shaking when entering and exiting the cleaning tanks, and the silicon wafers of the cleaning basket are connected in a rotating driving device, the silicon wafers are cleaned in different liquids in the two cleaning tanks during rotation, and the cleaning TTV (silicon wafer thickness variation) is uniform; the cleaning effect is good, and the invention is suitable for cleaning silicon wafers larger than 6 inches.

[0011] As an optimal technical solution, the cleaning basket includes a left longitudinal plate and a right longitudinal plate which are symmetrically arranged on the left and right sides, a number of partition longitudinal plates of the same size as the left and right longitudinal plates, at least two transversely arranged positioning clamping rotating shafts, a transversely arranged dynamic clamping rotating shaft, and a number of transversely arranged connecting shafts; the left longitudinal plate, the right longitudinal plate and each partition longitudinal plate are fixedly connected by connecting shafts.

[0012] Each positioning clamping rotation axis is located below the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate; the dynamic clamping rotation axis is located above the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate.

[0013] The radial outer circumferential surfaces of the positioning clamping rotating shaft and the dynamic clamping rotating shaft are provided with a plurality of annular grooves whose planes are perpendicular to their central axes. The distance from the radial outer circumferential surfaces of the annular grooves of each positioning clamping rotating shaft and the dynamic clamping rotating shaft to the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate is equal to the radius of the silicon wafer to be cleaned.

[0014] An arc-shaped through hole with an arc-shaped bottom is provided at the same position above the left longitudinal plate, the right longitudinal plate and each dividing longitudinal plate, and the distance from the bottom of each arc-shaped through hole to the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate is equal; the dynamic clamping rotating shaft passes through the arc-shaped through holes of the left longitudinal plate, the right longitudinal plate and each dividing longitudinal plate and can move in the arc-shaped through holes. When the dynamic clamping rotating shaft moves in the arc-shaped through holes, the distance between the dynamic clamping rotating shaft and a positioning clamping rotating shaft on both sides of it can be made larger than the diameter of the silicon wafer to be corroded, thereby forming a silicon wafer entrance and exit.

[0015] The connecting shaft is located outside the silicon wafer entrance and exit; the distance between the radial outer peripheral surface of the connecting shaft and the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate is greater than the radius of the silicon wafer to be cleaned; a plurality of dynamic position clamping rotating shaft locking rod sockets are provided on the left longitudinal plate and the right longitudinal plate, and the dynamic position clamping rotating shaft locking rods that can separate the arc-shaped through holes on the dynamic position clamping rotating shaft locking rod sockets are inserted.

[0016] Of the two vertical plates, the bottom end of the vertical plate on the left side of the frame is connected to the left longitudinal plate, and the bottom end of the vertical plate on the right side of the frame is connected to the right longitudinal plate. The silicon wafer rotation drive device includes a silicon wafer rotation drive shaft.

[0017] A silicon wafer rotating drive shaft is coaxially mounted on the left longitudinal plate, a main gear is coaxially arranged on the left side of the left longitudinal plate of the silicon wafer rotating drive shaft, and a sub-gear that can mesh with the main gear is coaxially arranged on the left side of the dynamic clamping rotating shaft and each positioning clamping rotating shaft located on the left side of the left longitudinal plate; a transmission shaft that is coaxially arranged with the silicon wafer rotating drive shaft and can be movably connected with the silicon wafer rotating drive shaft is provided at the bottom end of the vertical plate located on the left side of the frame, a transmission wheel is provided on the transmission shaft, and the output wheel of the cleaning drive motor is arranged just above the transmission wheel, and the output wheel of the cleaning drive motor is connected to the transmission wheel on the transmission shaft; the right longitudinal plate is connected to the frame body,

[0018] or,

[0019] A silicon wafer rotating drive shaft is mounted on the right vertical plate, and a main gear is coaxially arranged on the right side of the right vertical plate of the silicon wafer rotating drive shaft, and sub-gears that can mesh with the main gear are coaxially arranged on the right side of the right vertical plate for the dynamic clamping rotating shaft and each positioning clamping rotating shaft; a transmission shaft that is arranged and movably connected to the silicon wafer rotating drive shaft is provided at the bottom end of the vertical plate on the right side of the frame, and a transmission wheel is provided on the transmission shaft, and an output wheel of the cleaning drive motor is arranged directly above the transmission wheel, and the output wheel of the cleaning drive motor is connected to the transmission wheel; the left vertical plate is connected to the frame.

[0020] By adopting this technical solution, a silicon wafer rotating drive shaft is only arranged on one side of the cleaning basket. The rotation of the silicon wafer rotating drive shaft drives the positioning clamping rotating shaft and the dynamic clamping rotating shaft to rotate. The transmission route is simple, and it is easy to ensure the synchronization of the rotation of each clamping rotating shaft and the dynamic clamping rotating shaft. The distance from the radial outer peripheral surface of the annular groove of each positioning clamping rotating shaft and the radial outer peripheral surface of the annular groove of the dynamic clamping rotating shaft to the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate is equal to the radius of the silicon wafer to be cleaned. The positioning clamping rotating shaft and the dynamic clamping rotating shaft do not squeeze the silicon wafer. When the positioning clamping rotating shaft rotates, the silicon wafer rotates by the friction force generated by the silicon wafer's own gravity. The silicon wafer and the cleaning basket are in point contact, which reduces the contact area between the silicon wafer and the cleaning basket, reduces the disturbance to the edge of the silicon wafer during the cleaning process, eliminates the color difference of the silicon wafer edge, makes the surface color more uniform, improves the TTV value of the silicon wafer edge, and reduces the probability of corrosion marks on the silicon wafer after corrosion.

[0021] As a preferred technical solution, the output wheel of the cleaning drive motor is connected to the transmission wheel on the transmission shaft through a chain or a belt.

[0022] Alternatively, the output wheel of the cleaning drive motor and the transmission wheel on the transmission shaft are gears, and the output wheel of the cleaning drive motor and the transmission wheel on the transmission shaft are connected through a plurality of transmission gears installed on the vertical plate closest to them;

[0023] Alternatively, the output wheel of the cleaning drive motor and the transmission wheel on the transmission shaft are gears, and the output wheel of the cleaning drive motor and the transmission wheel on the transmission shaft are meshed with each other;

[0024] Alternatively, the output wheel of the cleaning drive motor and the transmission wheel on the transmission shaft are gears, and the output wheel of the cleaning drive motor and the transmission wheel on the transmission shaft are connected through a vertically arranged liftable rack installed on the vertical plate closest to them.

[0025] As a preferred technical solution, the bottom ends of the two vertical plates are each provided with a lap platform, and the lap platform is provided with a horizontally arranged arc groove opening upward;

[0026] When the left longitudinal plate is coaxially sleeved with a silicon wafer rotating drive shaft, the left end of the silicon wafer rotating drive shaft is placed on the arc-shaped groove of the overlap platform located at the left end of the frame, and the left end of the silicon wafer rotating drive shaft is plugged and connected with the transmission shaft; a overlap shaft whose central axis is in the same straight line as the central axis of the silicon wafer rotating drive shaft is provided on the right side surface of the right longitudinal plate, and the overlap shaft is placed on the arc-shaped groove of the overlap platform located at the right end of the frame, and a latch hole is provided on the overlap shaft, and a latch is inserted in the latch hole to prevent the overlap shaft from rotating on the overlap platform;

[0027] When the silicon wafer rotation driving shaft is coaxially mounted on the right longitudinal plate, the right end of the silicon wafer rotation driving shaft is placed on the arc-shaped groove of the overlapping platform located at the right end of the frame, and the right end of the silicon wafer rotation driving shaft is plugged and connected to the transmission shaft; a overlapping shaft with a central axis coaxial with the central axis of the silicon wafer rotation driving shaft is provided on the left side surface of the left longitudinal plate, and the overlapping shaft is placed on the arc-shaped groove of the overlapping platform located at the left end of the frame; a pin hole is provided on the overlapping shaft, and a pin is inserted in the pin hole to prevent the overlapping shaft from rotating on the overlapping platform.

[0028] As a preferred technical solution, a circular plug hole for inserting the transmission shaft and a plurality of connection grooves with openings facing the transmission shaft end are provided near the transmission shaft end of the silicon wafer rotation drive shaft, and a plurality of connection protrusions adapted to the positions of the connection grooves are provided near the silicon wafer rotation drive shaft, the transmission shaft is inserted into the circular plug hole and the connection protrusions are engaged with the corresponding connection grooves to realize plug-in connection;

[0029] or,

[0030] A square hole for inserting the transmission shaft is provided near the transmission shaft end of the silicon wafer rotation driving shaft, and the transmission shaft is inserted into the square hole to realize plug-in connection.

[0031] As a preferred technical solution, the cleaning basket includes a plurality of transversely arranged rotating columns.

[0032] Each rotating column is located below the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate; the distance from the radial outer circumferential surface of the annular groove of each positioning clamping rotating shaft, the radial outer circumferential surface of the annular groove of the dynamic clamping rotating shaft, and the radial outer circumferential surface of each rotating column to the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate is equal to the radius of the silicon wafer to be cleaned.

[0033] When the silicon wafer rotating drive shaft is coaxially mounted on the left longitudinal plate, a sub-gear that can mesh with the main gear is coaxially mounted on the left side of each rotating column; when the silicon wafer rotating drive shaft is coaxially mounted on the right longitudinal plate, a sub-gear that can mesh with the main gear is coaxially mounted on the right side of each rotating column on the right longitudinal plate.

[0034] With this technical solution, when the rotating column rotates, the friction force generated by the silicon wafer's own gravity causes the silicon wafer to rotate, thus assisting the rotation of the silicon wafer.

[0035] As a preferred technical solution, a plurality of fins are provided between the annular grooves on the radial outer peripheral surfaces of the positioning clamping rotating shaft and the dynamic clamping rotating shaft. The fins can increase the disturbance of the liquid at the edge of the silicon wafer and improve the cleaning effect.

[0036] As a preferred technical solution, a ring array of fins is arranged on the radial outer peripheral surfaces of the positioning clamping rotating shaft and the dynamic clamping rotating shaft between the annular grooves; the thickness of each fin at the end away from the connection line between the center of the left longitudinal plate and the center of the right longitudinal plate is less than the thickness of the end close to the connection line between the center of the left longitudinal plate and the center of the right longitudinal plate. By adopting this technical solution, the disturbance of the liquid at the edge of the silicon wafer can be further increased, thereby improving the cleaning effect.

[0037] As a preferred technical solution, when the silicon wafer rotating drive shaft is mounted on the left longitudinal plate, no annular groove is provided between the left longitudinal plate and the nearest partition longitudinal plate on the radial outer peripheral surface of each positioning clamping rotating shaft and the dynamic clamping rotating shaft, and the right side surface of the rotating shaft does not contact the nearest partition longitudinal plate; the spacing between the left longitudinal plate and the nearest partition longitudinal plate is smaller than the spacing between the partition longitudinal plates and smaller than the spacing between the right longitudinal plate and the nearest partition longitudinal plate;

[0038] When the silicon wafer rotating drive shaft is mounted on the right longitudinal plate, no annular groove is provided between the right longitudinal plate and the nearest partition longitudinal plate on the radial outer peripheral surface of each positioning clamping rotating shaft and the dynamic clamping rotating shaft, and the left side surface of the rotating shaft is not in contact with the nearest partition longitudinal plate; the spacing between the right longitudinal plate and the nearest partition longitudinal plate is smaller than the spacing between the partition longitudinal plates and smaller than the spacing between the left longitudinal plate and the nearest partition longitudinal plate (53).

[0039] As an optimal technical solution, when the left vertical plate is equipped with a silicon wafer rotation drive shaft, the right side surface of the silicon wafer rotation drive shaft is in the same plane as the right side surface of the left vertical plate; when the right vertical plate is equipped with a silicon wafer rotation drive shaft, the left side surface of the silicon wafer rotation drive shaft is in the same plane as the left side surface of the right vertical plate.

[0040] As a preferred technical solution, each cleaning device mounting frame limiting device has a row of rolling wheels vertically arranged at the front and rear ends of the side close to the other cleaning device mounting frame limiting device, and the two vertical plates are respectively located in the two rows of rolling wheels of the cleaning device mounting frame limiting device closest to it, or,

[0041] Each cleaning device mounting frame limiting device is provided with a side limiting groove in the vertical direction close to the side of the other cleaning device mounting frame limiting device, and the two vertical plates are respectively located in the side limiting grooves of the cleaning device mounting frame limiting device closest to it, or,

[0042] A baffle is vertically arranged at the front and rear ends of each cleaning device mounting frame limiting device close to another cleaning device mounting frame limiting device, and the two vertical plates are respectively located in the two baffles of the cleaning device mounting frame limiting device closest thereto.

[0043] As a preferred technical solution, the top end of the limiting device of each cleaning device mounting frame is laterally provided with an upper roller layer and a lower roller layer that can clamp the longitudinal rod therebetween.

[0044] As a preferred technical solution, each of the partition longitudinal plates is provided with a transverse through hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 It is a three-dimensional structural schematic diagram of a preferred embodiment of the silicon wafer etching machine of the present invention. Figure 2 yes Figure 1 A partial enlarged view of part A. Figure 3 yes Figure 1 A partial enlarged view of part B. Figure 4 yes Figure 1 A front view of a silicon wafer etching machine is shown. Figure 5 yes Figure 1 Left view of the silicon wafer etching machine shown. Figure 6 yes Figure 1 A top view of a silicon wafer etching machine is shown. Figure 7 yes Figure 6A partial enlarged view of part D. Figure 8 yes Figure 6 The cross-sectional view of the silicon wafer etching machine along CC' is shown. Fig. 9 yes Figure 8 A partial enlarged view of part E. Fig.10 yes Figure 8 A partial enlarged view of part F. Fig.11 It is a three-dimensional structural schematic diagram of a cleaning basket. Fig.12 yes Fig.11 A partial enlarged view of part G. Fig.13 yes Fig.11 A partial enlarged view of part H. Fig.14 yes Fig.11 A partial enlarged view of part I. Fig.15 yes Fig.11 Front view of wash basket shown. Fig.16 yes Fig.15 A partial enlarged view of part J. Fig.17 yes Fig.15 A partial enlarged view of part K. Fig.18 yes Fig.11 Right side view of wash basket shown. Fig.19 yes Fig.11 A state diagram of the wash basket is shown. Fig. 20 yes Fig.19 A partial enlarged view of the L part. Fig.21 It is a three-dimensional structural schematic diagram of a cleaning basket. Fig. 22 yes Fig.21 Right side view of wash basket shown. Fig.23 yes Fig.21 A partial enlarged view of part M. Fig.24 It is a three-dimensional structural schematic diagram of a cleaning basket. Fig.25 It is a three-dimensional structural schematic diagram of a cleaning basket. Fig.26 yes Fig.25 A local enlarged view of part N. Fig. 27 It is a three-dimensional structural schematic diagram of a preferred embodiment of the silicon wafer etching machine of the present invention. Fig.28 yes Fig. 27 A partial enlarged view of part O. Fig.29 It is a three-dimensional structural schematic diagram of a preferred embodiment of the silicon wafer etching machine of the present invention. Fig.30 yes Fig.29 A partial enlarged view of part P. Fig.31 It is a three-dimensional structural schematic diagram of a preferred embodiment of the silicon wafer etching machine of the present invention. Fig.32 yes Fig.31 A partial enlarged view of the Q part. Fig.33 yes Fig.31 A partial enlarged view of the R part. Fig.34 It is a three-dimensional structural schematic diagram of a preferred embodiment of the silicon wafer etching machine of the present invention. Fig.35 It is a three-dimensional structural schematic diagram of a preferred embodiment of the silicon wafer etching machine of the present invention. Fig.36 yes Figure 1 A state diagram of a silicon wafer etching machine is shown. Fig.37 yes Figure 1 A state diagram of a silicon wafer etching machine is shown.

[0046] Among them: frame 1; cleaning tank 2; first transverse rotating shaft 3; second transverse rotating shaft 32; rotating plate 33; first transverse rotating shaft driving motor 31; cleaning device mounting frame 4; vertical plate 41; cleaning driving motor 42; transmission shaft 43; transmission wheel 44; output wheel of cleaning driving motor 45; belt 46; transmission gear 47; lifting rack 48; overlapping platform 49; latch 410; cleaning basket 5; rotating column 50; left longitudinal plate 51; right longitudinal plate 52; partition longitudinal plate 53; positioning clamping rotating shaft 54; dynamic clamping rotating shaft 55; connecting shaft 56; Annular groove-57; arc through hole-58; dynamic position clamping rotating shaft locking rod-59; silicon wafer rotating drive shaft-510; main gear-511; sub-gear-512; overlap shaft-513; circular socket-514; connecting groove-515; connecting protrusion-516; square hole-517; fin-518; pin hole-519; dynamic position clamping rotating shaft locking rod socket-520; transverse through hole-521; longitudinal rod-6; cleaning device mounting frame limiting device-61; second transverse rotating shaft limiting groove-62; rolling wheel-63; side limiting groove-64; baffle-65; upper roller layer-66; lower roller layer-67. DETAILED DESCRIPTION

[0047] The present invention is further described below in conjunction with specific embodiments.

[0048] Example 1. Figure 1-20 As shown in 36-37, a silicon wafer cleaning mechanism includes a frame 1 and two cleaning tanks 2 arranged in front and back on the frame 1, a cleaning device mounting frame 4, a cleaning device mounting frame swing device, a stabilizing device, and a cleaning basket 5 movably mounted on the cleaning device mounting frame 4.

[0049] The swing device of the cleaning device mounting frame includes a first transverse rotating shaft 3 arranged between the two cleaning tanks 2, and equal-length rotating plates 33 are symmetrically fixed to the left and right ends of the first transverse rotating shaft 3, and the ends of the two rotating plates 33 away from the first transverse rotating shaft 3 are respectively provided with a second transverse rotating shaft 32, and the central axes of the two second transverse rotating shafts 32 are on the same straight line; the two ends of the cleaning device mounting frame 4 are respectively connected to the two second transverse rotating shafts 32; the first transverse rotating shaft 3 is connected to the first transverse rotating shaft driving motor 31.

[0050] A vertical plate 41 perpendicular to the second horizontal rotation axis 32 is respectively provided at the left and right ends of the bottom end of the cleaning device mounting frame 4, and a cleaning basket 5 is horizontally installed between the two vertical plates 41; a cleaning drive motor 42 is horizontally provided at the top end of the cleaning device mounting frame 4, and the cleaning drive motor 42 is connected to the silicon wafer rotation drive device of the cleaning basket 5.

[0051] The stabilizing device includes two longitudinal rods 6 and two cleaning device mounting frame limiting devices 61; longitudinal rods 6 are respectively arranged just above the two vertical plates 41 at the top of the frame body 1, and a cleaning device mounting frame limiting device 61 is vertically mounted on each longitudinal rod 6, and each cleaning device mounting frame limiting device 61 is provided with a second transverse rotation axis limiting groove 62 which is vertically arranged and opens downward, and each second transverse rotation axis 32 is respectively located in the second transverse rotation axis limiting groove 62 which is closest to it; when the first transverse rotation axis 3 rotates to make the cleaning device mounting frame 4 enter and exit the two cleaning slots 2, the second transverse rotation axis 32 moves up and down in the second transverse rotation axis limiting groove 62 which is closest to it, and each cleaning device mounting frame limiting device 61 reciprocates on the longitudinal rod 6 which is mounted thereon. The function of the second transverse rotation axis limiting groove 62 of the stabilizing device is to limit the lateral swing of the second transverse rotation axis 32.

[0052] The cleaning basket 5 includes a left longitudinal plate 51 and a right longitudinal plate 52 which are symmetrically arranged, two partition longitudinal plates 53 of the same size as the left longitudinal plate 51 and the right longitudinal plate 52, two transversely arranged positioning clamping rotating shafts 54, a transversely arranged dynamic position clamping rotating shaft 55, and three transversely arranged connecting shafts 56; the left longitudinal plate 51, the right longitudinal plate 52 and each partition longitudinal plate 53 are fixedly connected by the connecting shafts 56. The spacing between the two partition longitudinal plates 53 is equal to the spacing between the left longitudinal plate 51 and the nearest partition longitudinal plate 53 and is equal to the spacing between the right longitudinal plate 52 and the nearest partition longitudinal plate 53.

[0053] The two positioning clamping rotating shafts 54 are respectively located below the line connecting the center of the left longitudinal plate 51 and the center of the right longitudinal plate 52 ; the dynamic clamping rotating shaft 55 is located above the line connecting the center of the left longitudinal plate 51 and the center of the right longitudinal plate 52 .

[0054] The radial outer circumferential surfaces of the positioning and clamping rotating shaft 54 ​​and the moving position clamping rotating shaft 55 are provided with a plurality of annular grooves 57 in a plane perpendicular to their central axes. The distance from the radial outer circumferential surfaces of the annular grooves 57 of each positioning and clamping rotating shaft 54 ​​and the radial outer circumferential surfaces of the annular grooves 57 of the moving position clamping rotating shaft 55 to the line connecting the center of the left longitudinal plate 51 and the center of the right longitudinal plate 52 is equal to the radius of the silicon wafer to be cleaned.

[0055] An arc-shaped through hole 58 with an arc-shaped bottom is provided at the same position above the left longitudinal plate 51, the right longitudinal plate 52 and each partition longitudinal plate 53, and the distance from the bottom of each arc-shaped through hole 58 to the line connecting the center of the left longitudinal plate 51 and the center of the right longitudinal plate 52 is equal; the dynamic clamping rotating shaft 55 passes through the arc-shaped through holes 58 of the left longitudinal plate 51, the right longitudinal plate 52 and each partition longitudinal plate 53 and can move in the arc-shaped through holes 58. When the dynamic clamping rotating shaft 55 moves in the arc-shaped through holes 58, the distance between the dynamic clamping rotating shaft 55 and a positioning clamping rotating shaft 54 ​​on both sides thereof can be made larger than the diameter of the silicon wafer to be corroded, thereby forming a silicon wafer entrance and exit.

[0056] The connecting shaft 56 is located outside the silicon wafer entrance and exit; the distance between the radial outer peripheral surface of the connecting shaft 56 and the line connecting the center of the left longitudinal plate 51 and the center of the right longitudinal plate 52 is greater than the radius of the silicon wafer to be cleaned; a plurality of dynamic position clamping rotating shaft locking rod holes 520 are provided on the left longitudinal plate 51 and the right longitudinal plate 52, and the dynamic position clamping rotating shaft locking rods 59 that can separate the arc-shaped through holes 58 thereon are inserted into the dynamic position clamping rotating shaft locking rod holes 520.

[0057] Of the two vertical plates 41, the bottom end of the vertical plate 41 located on the left side of the frame is connected to the left longitudinal plate 51, and the bottom end of the vertical plate 41 located on the right side of the frame is connected to the right longitudinal plate 52. The silicon wafer rotation drive device includes a silicon wafer rotation drive shaft 510.

[0058] The right vertical plate 52 is provided with a silicon wafer rotating drive shaft 510, and a main gear 511 is coaxially provided on the right side of the right vertical plate 52 of the silicon wafer rotating drive shaft 510, and a sub-gear 512 that can mesh with the main gear 511 is coaxially provided on the right side of the right vertical plate 52 of the dynamic clamping rotating shaft 55 and each positioning clamping rotating shaft 54; a transmission shaft 43 that is arranged and movably connected with the silicon wafer rotating drive shaft 510 is provided at the bottom end of the vertical plate 41 located on the right side of the frame, and a transmission wheel 44 is provided on the transmission shaft 43, and an output wheel 45 of the cleaning drive motor is arranged just above the transmission wheel 44, and the output wheel 45 of the cleaning drive motor is connected to the transmission wheel 44; the left vertical plate 51 is connected to the frame body 1. The left side surface of the silicon wafer rotating drive shaft 510 is on the same plane as the left side surface of the right vertical plate 52.

[0059] A lap platform 49 is respectively provided at the bottom end of the two upright plates 41 , and a transversely arranged arc-shaped groove opening upward is provided on the lap platform 49 .

[0060] The right end of the silicon wafer rotation driving shaft 510 is placed on the arc-shaped groove of the overlapping platform 49 located at the right end of the frame 1, and the right end of the silicon wafer rotation driving shaft 510 is plugged and connected to the transmission shaft 43; a overlapping shaft 513 whose central axis is in the same straight line as the central axis of the silicon wafer rotation driving shaft 510 is provided on the left side surface of the left longitudinal plate 51, and the overlapping shaft 513 is placed on the arc-shaped groove of the overlapping platform 49 located at the left end of the frame 1; a pin hole 519 is provided on the overlapping shaft 513, and a pin 410 is inserted in the pin hole 519 to prevent the overlapping shaft 513 from rotating on the overlapping platform 49.

[0061] The silicon wafer rotation driving shaft 510 is provided with a circular socket 514 for inserting the transmission shaft 43 and a plurality of connecting grooves 515 with openings facing the end of the transmission shaft 43 near the end of the transmission shaft 43. The transmission shaft 43 is provided with a plurality of connecting protrusions 516 adapted to the positions of the connecting grooves 515 near the silicon wafer rotation driving shaft 510. The transmission shaft 43 is inserted into the circular socket 514 and the connecting protrusions 516 are engaged with the corresponding connecting grooves 515 to realize plug-in connection.

[0062] A plurality of fins 518 are provided between the annular grooves 57 on the radial outer peripheral surfaces of the positioning clamping rotating shaft 54 ​​and the moving clamping rotating shaft 55. The fins can increase the disturbance of the liquid at the edge of the silicon wafer and improve the cleaning effect.

[0063] The fins 518 are arranged in an annular array on the radial outer peripheral surfaces of the positioning clamping rotating shaft 54 ​​and the dynamic clamping rotating shaft 55 between the annular grooves 57; the thickness of each fin 518 at the end away from the connection line between the center of the left longitudinal plate 51 and the center of the right longitudinal plate 52 is smaller than the thickness of the end close to the connection line between the center of the left longitudinal plate 51 and the center of the right longitudinal plate 52. This technical solution can further increase the disturbance of the liquid at the edge of the silicon wafer and improve the cleaning effect.

[0064] The output wheel 45 of the cleaning drive motor and the transmission wheel 44 on the transmission shaft 43 are gears. The output wheel 45 of the cleaning drive motor and the transmission wheel 44 on the transmission shaft 43 are connected through a plurality of transmission gears 47 installed on the vertical plate 41 closest to them.

[0065] An upper roller layer 66 and a lower roller layer 67 are laterally disposed at the top of each cleaning device mounting frame limiting device 61 so as to clamp the longitudinal rod 6 therebetween.

[0066] A row of rolling wheels 63 are vertically arranged at the front and rear ends of each cleaning device mounting frame limiting device 61 near another cleaning device mounting frame limiting device 61, and the two vertical plates 41 are respectively located in the two rows of rolling wheels 63 of the cleaning device mounting frame limiting device 61 closest to it. The two rows of rolling wheels 63 can prevent the cleaning basket from rotating.

[0067] Each partition longitudinal plate 53 is provided with a transverse through hole 521. Two cleaning tanks 2 are provided. When one of the two cleaning tanks 2 is being cleaned, the other cleaning tank can be changed with liquid, saving the time of waiting for adding liquid medicine. The cleaning basket 5 enters the two cleaning tanks under the action of the first transverse rotating shaft 3, and a stabilizing mechanism is provided to prevent the cleaning basket from shaking when entering and exiting the cleaning tank. In addition, the silicon wafers of the cleaning basket 5 are connected to the rotating driving device, and the silicon wafers are cleaned in different liquids in the two cleaning tanks during rotation, and the cleaning TTV (silicon wafer thickness variation) is uniform; the cleaning effect is good, and it is suitable for cleaning silicon wafers larger than 6 inches. A silicon wafer rotation driving shaft 510 is only arranged on one side of the cleaning basket. The rotation of the silicon wafer rotation driving shaft 510 drives the positioning clamping rotating shaft and the dynamic clamping rotating shaft to rotate. The transmission route is simple, and it is easy to ensure the synchronization of the rotation of the clamping rotating shaft and the dynamic clamping rotating shaft. The distance from the radial outer peripheral surface of the annular groove of each positioning clamping rotating shaft and the radial outer peripheral surface of the annular groove of the dynamic clamping rotating shaft to the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate is equal to the radius of the silicon wafer to be cleaned. The positioning clamping rotating shaft and the dynamic clamping rotating shaft do not squeeze the silicon wafer. When the positioning clamping rotating shaft rotates, the silicon wafer rotates by the friction force generated by the silicon wafer's own gravity. The silicon wafer and the cleaning basket are in point contact, which reduces the contact area between the silicon wafer and the cleaning basket, reduces the disturbance to the edge of the silicon wafer during the cleaning process, eliminates the color difference of the silicon wafer edge, and makes the surface color more uniform. The value of the TTV value of the silicon wafer edge is improved, which can reduce the probability of corrosion marks on the silicon wafer after corrosion.

[0068] Example 2. Figure 21-23 As shown, the difference between this embodiment and embodiment 1 is that the cleaning basket 5 includes a plurality of transversely arranged rotating columns 50 .

[0069] Each rotating column 50 is located below the line connecting the center of the left longitudinal plate 51 and the center of the right longitudinal plate 52; the distance from the radial outer peripheral surface of the annular groove 57 of each positioning clamping rotating shaft 54, the radial outer peripheral surface of the annular groove 57 of the dynamic clamping rotating shaft 55, and the radial outer peripheral surface of each rotating column 50 to the line connecting the center of the left longitudinal plate 51 and the center of the right longitudinal plate 52 is equal to the radius of the silicon wafer to be cleaned. Each rotating column 50 is coaxially provided with a secondary gear 512 that can mesh with the main gear 511 on the right side of the right longitudinal plate 52.

[0070] With this technical solution, when the rotating column rotates, the friction force generated by the silicon wafer's own gravity causes the silicon wafer to rotate, thus assisting the rotation of the silicon wafer.

[0071] Example 3. Fig.24As shown, the difference between this embodiment and embodiment 2 lies in that: no annular groove is provided between the right longitudinal plate 52 and the nearest partition longitudinal plate 53 on the radial outer peripheral surface of each positioning clamping rotating shaft 54 ​​and the dynamic clamping rotating shaft 55, and the left side surface of the rotating shaft is not in contact with the nearest partition longitudinal plate 53; the distance between the right longitudinal plate 52 and the nearest partition longitudinal plate 53 is smaller than the distance between each partition longitudinal plate 53 and smaller than the distance between the left longitudinal plate 51 and the nearest partition longitudinal plate 53.

[0072] Example 4. Figure 25-26 As shown, the difference between this embodiment and the first embodiment is that: a silicon wafer rotating drive shaft 510 is coaxially mounted on the left longitudinal plate 51, a main gear 511 is coaxially arranged on the left side of the left longitudinal plate 51 of the silicon wafer rotating drive shaft 510, and a sub-gear 512 that can mesh with the main gear 511 is coaxially arranged on the left side of the left longitudinal plate 51 of the dynamic clamping rotating shaft 55 and each positioning clamping rotating shaft 54; a transmission shaft that is coaxially arranged with the silicon wafer rotating drive shaft 510 and can be movably connected with the silicon wafer rotating drive shaft 510 is arranged at the bottom end of the vertical plate 41 located on the left side of the frame, and a transmission wheel is arranged on the transmission shaft, and the output wheel 45 of the cleaning drive motor is arranged just above the transmission wheel, and the output wheel of the cleaning drive motor is connected to the transmission wheel on the transmission shaft. The right longitudinal plate is connected to the frame. There is no annular groove between the left longitudinal plate 51 and the nearest partition longitudinal plate 53 on the radial outer circumferential surface of each positioning clamping rotating shaft 54 ​​and the dynamic clamping rotating shaft 55, and there is no contact between the right side surface of the rotating shaft and the nearest partition longitudinal plate 53; the distance between the left longitudinal plate 51 and the nearest partition longitudinal plate 53 is smaller than the distance between each partition longitudinal plate 53 and smaller than the distance between the right longitudinal plate 52 and the nearest partition longitudinal plate 53.

[0073] Example 5. Figure 27-28 As shown, the difference between this embodiment and embodiment 1 is that the output wheel 45 of the cleaning drive motor is connected to the transmission wheel 44 on the transmission shaft 43 through a belt 46.

[0074] Example 6. Figure 29-30 As shown, the difference between this embodiment and the first embodiment is that the output wheel 45 of the cleaning drive motor and the transmission wheel 44 on the transmission shaft 43 are gears, and the output wheel 45 of the cleaning drive motor and the transmission wheel 44 on the transmission shaft 43 are connected through a vertically arranged lifting rack 48 installed on the vertical plate 41 closest to them. The silicon wafer rotating drive shaft 510 is provided with a square hole 517 for inserting the transmission shaft 43 near the end of the transmission shaft 43, and the transmission shaft 43 is inserted into the square hole 517 to achieve plug-in connection.

[0075] Example 7. Figure 31-33As shown, the difference between this embodiment and the first embodiment is that the output wheel 45 of the cleaning drive motor and the transmission wheel 44 on the transmission shaft 43 are gears, and the output wheel 45 of the cleaning drive motor and the transmission wheel 44 on the transmission shaft 43 are meshed. A silicon wafer rotation drive shaft 510 is coaxially sleeved on the left longitudinal plate 51. The left end of the silicon wafer rotation drive shaft 510 is placed on the arc groove of the lap platform 49 located at the left end of the frame 1, and the left end of the silicon wafer rotation drive shaft 510 is plugged and connected with the transmission shaft 43; a lap shaft 513 whose central axis is in the same straight line as the central axis of the silicon wafer rotation drive shaft 510 is provided on the right side surface of the right longitudinal plate 52, and the lap shaft 513 is placed on the arc groove of the lap platform 49 located at the right end of the frame 1, and a latch hole is provided on the lap shaft 513, and a latch 410 is inserted into the latch hole to prevent the lap shaft 513 from rotating on the lap platform 49.

[0076] Example 8. Fig.34 As shown, the difference between this embodiment and embodiment 1 is that: each cleaning device mounting frame limit device 61 is provided with a baffle 65 vertically at the front and rear ends close to the side of the other cleaning device mounting frame limit device 61, and the two vertical plates 41 are respectively located in the two baffles 65 of the cleaning device mounting frame limit device 61 closest to it.

[0077] Example 9. Fig.35 As shown, the difference between this embodiment and embodiment 1 is that each cleaning device mounting frame limiting device 61 is provided with a side limiting groove 64 in the vertical direction close to the side of the other cleaning device mounting frame limiting device 61, and the two vertical plates 41 are respectively located in the side limiting groove 64 of the cleaning device mounting frame limiting device 61 closest to it.

Claims

1. A silicon wafer cleaning mechanism, characterized in that: It includes a frame body and two cleaning tanks arranged in front and back on the frame body, a cleaning device mounting frame, a cleaning device mounting frame swinging device, a stabilizing device, and a cleaning basket movably mounted on the cleaning device mounting frame; The washing device mounting frame swing device comprises a first transverse rotating shaft arranged between two washing tanks, the left and right ends of the first transverse rotating shaft are symmetrically fixed with rotating plates of equal length, the ends of the two rotating plates away from the first transverse rotating shaft are respectively equipped with a second transverse rotating shaft, and the central axes of the two second transverse rotating shafts are on the same straight line; the two ends of the washing device mounting frame are respectively connected to the two second transverse rotating shafts; the first transverse rotating shaft is connected to the first transverse rotating shaft driving motor; A vertical plate perpendicular to the second horizontal rotation axis is respectively provided at the left and right ends of the bottom end of the cleaning device mounting frame, and a cleaning basket is horizontally installed between the two vertical plates; a cleaning drive motor is horizontally provided at the top end of the cleaning device mounting frame, and the cleaning drive motor is connected to the silicon wafer rotation drive device of the cleaning basket; The stabilizing device comprises two longitudinal rods and two cleaning device mounting frame limiting devices; longitudinal rods are respectively arranged directly above the two vertical plates at the top of the frame body, and a cleaning device mounting frame limiting device is vertically mounted on each longitudinal rod, and each cleaning device mounting frame limiting device is provided with a second transverse rotating shaft limiting groove which is vertically arranged and opens downward, and each second transverse rotating shaft is respectively located in the second transverse rotating shaft limiting groove which is closest to it; when the first transverse rotating shaft rotates to make the cleaning device mounting frame enter and exit the two cleaning grooves, the second transverse rotating shaft moves up and down in the second transverse rotating shaft limiting groove which is closest to it, and each cleaning device mounting frame limiting device reciprocates on the longitudinal rod mounted thereon; The cleaning basket includes a left longitudinal plate and a right longitudinal plate which are symmetrically arranged on the left and right sides, a plurality of partition longitudinal plates of the same size as the left longitudinal plate and the right longitudinal plate, at least two transversely arranged positioning clamping rotating shafts, a transversely arranged dynamic position clamping rotating shaft, and a plurality of transversely arranged connecting shafts; the left longitudinal plate, the right longitudinal plate and the partition longitudinal plates are fixedly connected through the connecting shafts; Each positioning clamping rotation axis is located below the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate; the dynamic clamping rotation axis is located above the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate; A plurality of annular grooves are provided on the radial outer peripheral surfaces of the positioning clamping rotating shaft and the dynamic clamping rotating shaft, and the distance from the radial outer peripheral surfaces of the annular grooves of each positioning clamping rotating shaft and the radial outer peripheral surfaces of the annular grooves of the dynamic clamping rotating shaft to the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate is equal to the radius of the silicon wafer to be cleaned; An arc-shaped through hole with an arc-shaped bottom is provided at the same position above the left longitudinal plate, the right longitudinal plate and each partition longitudinal plate, and the distance from the bottom of each arc-shaped through hole to the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate is equal; the dynamic clamping rotating shaft passes through the arc-shaped through holes of the left longitudinal plate, the right longitudinal plate and each partition longitudinal plate and can move in the arc-shaped through holes, and when the dynamic clamping rotating shaft moves in the arc-shaped through holes, the distance between the dynamic clamping rotating shaft and a positioning clamping rotating shaft on both sides thereof can be made greater than the diameter of the silicon wafer to be etched, thereby forming a silicon wafer inlet and outlet; The connecting shaft is located outside the silicon wafer inlet and outlet; the distance between the radial outer peripheral surface of the connecting shaft and the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate is greater than the radius of the silicon wafer to be cleaned; the left longitudinal plate and the right longitudinal plate are provided with a plurality of dynamic position clamping rotating shaft locking rod insertion holes, and the dynamic position clamping rotating shaft locking rods that can separate the arc-shaped through holes on the dynamic position clamping rotating shaft locking rod insertion holes are inserted; Of the two vertical plates, the bottom end of the vertical plate located on the left side of the frame is connected to the left longitudinal plate, and the bottom end of the vertical plate located on the right side of the frame is connected to the right longitudinal plate; the silicon wafer rotation drive device includes a silicon wafer rotation drive shaft; The left longitudinal plate is coaxially provided with a silicon wafer rotating drive shaft, the left side of the left longitudinal plate of the silicon wafer rotating drive shaft is coaxially provided with a main gear, and the dynamic position clamping rotating shaft and each positioning clamping rotating shaft located on the left side of the left longitudinal plate are coaxially provided with a sub-gear that can mesh with the main gear; the bottom end of the vertical plate located on the left side of the frame is provided with a transmission shaft that is coaxially arranged with the silicon wafer rotating drive shaft and can be movably connected with the silicon wafer rotating drive shaft, and a transmission wheel is provided on the transmission shaft, and the output wheel of the cleaning drive motor is arranged just above the transmission wheel, and the output wheel of the cleaning drive motor is connected to the transmission wheel on the transmission shaft; the right longitudinal plate is connected to the frame body; or, The right vertical plate is provided with a silicon wafer rotating drive shaft, and a main gear is coaxially arranged on the right side of the right vertical plate of the silicon wafer rotating drive shaft, and a sub-gear that can mesh with the main gear is coaxially arranged on the right side of the right vertical plate of the dynamic clamping rotating shaft and each positioning clamping rotating shaft; a transmission shaft that is arranged and movably connected with the silicon wafer rotating drive shaft is arranged at the bottom end of the vertical plate on the right side of the frame, and a transmission wheel is arranged on the transmission shaft, and the output wheel of the cleaning drive motor is arranged just above the transmission wheel, and the output wheel of the cleaning drive motor is connected to the transmission wheel; the left vertical plate is connected to the frame body; A plurality of fins are arranged between the annular grooves on the radial outer peripheral surfaces of the positioning clamping rotating shaft and the dynamic clamping rotating shaft; When the silicon wafer rotating drive shaft is mounted on the left longitudinal plate, the right side surface of the silicon wafer rotating drive shaft is in the same plane as the right side surface of the left longitudinal plate; when the silicon wafer rotating drive shaft is mounted on the right longitudinal plate, the left side surface of the silicon wafer rotating drive shaft is in the same plane as the left side surface of the right longitudinal plate; The top end of the limiting device of each cleaning device mounting frame is laterally provided with an upper roller layer and a lower roller layer which can clamp the longitudinal rod therebetween.

2. A silicon wafer cleaning mechanism as claimed in claim 1, characterized in that: The output wheel of the cleaning drive motor is connected to the transmission wheel on the transmission shaft through a chain or belt. Alternatively, the output wheel of the cleaning drive motor and the transmission wheel on the transmission shaft are gears, and the output wheel of the cleaning drive motor and the transmission wheel on the transmission shaft are connected through a plurality of transmission gears installed on the vertical plate closest to them; Alternatively, the output wheel of the cleaning drive motor and the transmission wheel on the transmission shaft are gears, and the output wheel of the cleaning drive motor and the transmission wheel on the transmission shaft are meshed with each other; Alternatively, the output wheel of the cleaning drive motor and the transmission wheel on the transmission shaft are gears, and the output wheel of the cleaning drive motor and the transmission wheel on the transmission shaft are connected through a vertically arranged liftable rack installed on the vertical plate closest to them.

3. A silicon wafer cleaning mechanism as claimed in claim 1, characterized in that: The bottom ends of the two vertical plates are respectively provided with a lap platform, and the lap platform is provided with a horizontally arranged arc groove opening upward; When the left longitudinal plate is coaxially sleeved with a silicon wafer rotating drive shaft, the left end of the silicon wafer rotating drive shaft is placed on the arc-shaped groove of the overlap platform located at the left end of the frame, and the left end of the silicon wafer rotating drive shaft is plugged and connected with the transmission shaft; a overlap shaft whose central axis is in the same straight line as the central axis of the silicon wafer rotating drive shaft is provided on the right side surface of the right longitudinal plate, and the overlap shaft is placed on the arc-shaped groove of the overlap platform located at the right end of the frame, and a latch hole is provided on the overlap shaft, and a latch is inserted in the latch hole to prevent the overlap shaft from rotating on the overlap platform; When the silicon wafer rotation driving shaft is coaxially mounted on the right longitudinal plate, the right end of the silicon wafer rotation driving shaft is placed on the arc-shaped groove of the overlapping platform located at the right end of the frame, and the right end of the silicon wafer rotation driving shaft is plugged and connected to the transmission shaft; a overlapping shaft with a central axis coaxial with the central axis of the silicon wafer rotation driving shaft is provided on the left side surface of the left longitudinal plate, and the overlapping shaft is placed on the arc-shaped groove of the overlapping platform located at the left end of the frame; a pin hole is provided on the overlapping shaft, and a pin is inserted in the pin hole to prevent the overlapping shaft from rotating on the overlapping platform.

4. A silicon wafer cleaning mechanism as claimed in claim 3, characterized in that: A circular plug hole for inserting the transmission shaft and a plurality of connection grooves with openings facing the transmission shaft end are provided near the transmission shaft end of the silicon wafer rotation drive shaft, and a plurality of connection protrusions adapted to the positions of the connection grooves are provided near the silicon wafer rotation drive shaft, the transmission shaft is inserted into the circular plug hole and the connection protrusions are meshed with the corresponding connection grooves to realize plug-in connection; or, A square hole for inserting the transmission shaft is provided near the transmission shaft end of the silicon wafer rotation driving shaft, and the transmission shaft is inserted into the square hole to realize plug-in connection.

5. A silicon wafer cleaning mechanism as claimed in claim 1, characterized in that: The cleaning basket includes a plurality of transversely arranged rotating columns; Each rotating column is located below the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate; the distance from the radial outer peripheral surface of the annular groove of each positioning clamping rotating shaft, the radial outer peripheral surface of the annular groove of the dynamic clamping rotating shaft, and the radial outer peripheral surface of each rotating column to the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate is equal to the radius of the silicon wafer to be cleaned; When the silicon wafer rotating drive shaft is coaxially mounted on the left longitudinal plate, a secondary gear that can mesh with the main gear is coaxially arranged on the left side of each rotating column; When the silicon slice rotating drive shaft is mounted on the right longitudinal plate, each rotating column is coaxially provided with a secondary gear meshing with the main gear on the right side of the right longitudinal plate.

6. A silicon wafer cleaning mechanism as claimed in claim 1, characterized in that: An annular array of fins is arranged on the parts between the annular grooves on the radial outer peripheral surfaces of the positioning clamping rotating shaft and the dynamic clamping rotating shaft; the thickness of each fin at the end away from the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate is smaller than the thickness of the end close to the line connecting the center of the left longitudinal plate and the center of the right longitudinal plate.

7. A silicon wafer cleaning mechanism as claimed in claim 1, characterized in that: When the silicon wafer rotating drive shaft is mounted on the left longitudinal plate, no annular groove is provided between the left longitudinal plate and the nearest partition longitudinal plate on the radial outer peripheral surface of each positioning clamping rotating shaft and the dynamic clamping rotating shaft, and the right side surface of the rotating shaft does not contact the nearest partition longitudinal plate; the spacing between the left longitudinal plate and the nearest partition longitudinal plate is smaller than the spacing between the partition longitudinal plates and smaller than the spacing between the right longitudinal plate and the nearest partition longitudinal plate; When the silicon wafer rotation drive shaft is mounted on the right longitudinal plate, no annular groove is provided between the right longitudinal plate and the nearest partition longitudinal plate on the radial outer circumferential surface of each positioning clamping rotation shaft and the dynamic clamping rotation shaft, and the left side surface of the rotation shaft does not contact the nearest partition longitudinal plate; the distance between the right longitudinal plate and the nearest partition longitudinal plate is smaller than the distance between each partition longitudinal plate and smaller than the distance between the left longitudinal plate and the nearest partition longitudinal plate.

8. A silicon wafer cleaning mechanism as claimed in claim 1, characterized in that: A row of rolling wheels is vertically arranged at the front and rear ends of each cleaning device mounting frame limiting device near another cleaning device mounting frame limiting device, and the two vertical plates are respectively located in the two rows of rolling wheels of the cleaning device mounting frame limiting device closest to it, or, Each cleaning device mounting frame limiting device is provided with a side limiting groove in the vertical direction close to the side of the other cleaning device mounting frame limiting device, and the two vertical plates are respectively located in the side limiting grooves of the cleaning device mounting frame limiting device closest to it, or, A baffle is vertically arranged at the front and rear ends of each cleaning device mounting frame limiting device close to another cleaning device mounting frame limiting device, and the two vertical plates are respectively located in the two baffles of the cleaning device mounting frame limiting device closest thereto.

Images