Communication device, dielectric filter and design method thereof

Abstract

The present invention relates to a communication device, a dielectric filter and a design method thereof. The dielectric filter comprises a dielectric block and a first metal layer coated on the outer surface of the dielectric block. The dielectric filter is provided with a first surface and a second surface arranged opposite to the first surface. The first surface is protruded outwardly in a direction away from the second surface to form a boss. The boss is provided with a metallized blind hole, and the hole wall of the metallized blind hole is used to be electrically connected to an antenna circuit board or a radio frequency connector. In the above-mentioned dielectric filter, the metallized blind hole is also the connection port of the dielectric filter, which is used to be electrically connected to an antenna circuit board or a radio frequency connector. The boss can deepen the hole depth of the metallized blind hole to a certain extent, thereby preventing the PIN pin from falling off, being skewed, poorly welded or having a fracturing defect due to the insufficient hole depth of the metallized blind hole, thereby ensuring good welding performance and improving the product quality of the dielectric filter.

Description

Technical Field

[0001] The present invention relates to the technical field of communication products, and in particular to a communication device, a dielectric filter and a design method thereof. Background Art

[0002] Filters are indispensable frequency-selective devices in communication devices. As communication systems enter the 5G era with rapid development, the miniaturization of devices is the key to the development of communication devices. Dielectric filters have broad application prospects in 5G communication devices because they have all the characteristics of 5G equipment miniaturization.

[0003] For most dielectric filters, in order to meet the delay requirements of the connection ports for input and output signals, the hole depth of the metallized blind hole is generally small, and the hole depth of the PIN needle inserted into the metallized blind hole is generally small. For example, taking the frequency of 2.6GHZ as an example, if the delay is to reach 2.15ns, the hole depth of the metallized blind hole is only 0.3mm. Since the PIN needle is inserted into the hole too small, the welding strength of the PIN needle will be affected, affecting the welding quality, and there will even be a risk of the PIN needle being skewed and falling off. When the PIN needle is skewed, it will cause the dielectric block to be fractured, so the reliability of traditional dielectric filters is poor. Summary of the invention

[0004] Based on this, it is necessary to overcome the defects of the prior art and provide a communication device, a dielectric filter and a design method thereof, which can improve the reliability of the product.

[0005] The technical solution is as follows: a dielectric filter comprises a dielectric block and a first metal layer coated on the outer surface of the dielectric block, the dielectric filter is provided with a first surface and a second surface arranged opposite to the first surface, the first surface is protruded outward in a direction away from the second surface to form a boss, the boss is provided with a metallized blind hole, and the hole wall of the metallized blind hole is used to be electrically connected to an antenna circuit board or a radio frequency connector.

[0006] In the above-mentioned dielectric filter, the metallized blind hole is also the connection port of the dielectric filter, which is used to electrically connect to the antenna circuit board or the RF connector. The boss can deepen the hole depth h3 of the metallized blind hole to a certain extent. When the height h1 of the boss protrudes from the first surface is greater, the hole depth h3 of the metallized blind hole is correspondingly greater. This can prevent the PIN needle from falling off, skewing, poor welding or fracturing defects due to insufficient hole depth h3 of the metallized blind hole, thereby ensuring good welding performance and improving the product quality of the dielectric filter.

[0007] In one embodiment, a frequency adjustment hole is formed inwardly on the second surface toward the first surface.

[0008] In one of the embodiments, the frequency adjustment hole is arranged opposite to the metallized blind hole and is coaxially arranged with the metallized blind hole.

[0009] In one embodiment, the metallized blind hole is a circular hole or a regular polygonal hole; the frequency adjustment hole is a circular hole or a regular polygonal hole.

[0010] In one of the embodiments, the second metal layer of the metallized blind hole wall and the first metal layer form a partition ring.

[0011] In one embodiment, the dielectric block is a ceramic dielectric block; the first metal layer is a metal silver layer, a metal copper layer, a metal platinum layer or a metal gold layer plated, sprayed or bonded on the dielectric block; the second metal layer is a metal silver layer, a metal copper layer, a metal platinum layer or a metal gold layer plated, sprayed or bonded on the wall of the metallized blind hole.

[0012] In one embodiment, the boss includes a top surface arranged parallel to the second surface and a side surface connected to the top surface, and the side surface is arranged perpendicular to the top surface.

[0013] A communication device comprises the dielectric filter and an antenna circuit board or a radio frequency connector electrically connected to the metallized blind hole.

[0014] In the above-mentioned communication device, the metallized blind hole is also the connection port of the dielectric filter, which is used to electrically connect to the antenna circuit board or the RF connector. The boss can deepen the hole depth h3 of the metallized blind hole to a certain extent. When the height h1 of the boss protrudes from the first surface is greater, the hole depth h3 of the metallized blind hole is correspondingly greater. This can prevent the PIN needle from falling off, skewing, poor welding or fracturing defects due to insufficient hole depth h3 of the metallized blind hole, thereby ensuring good welding performance and improving the product quality of the dielectric filter.

[0015] In one embodiment, if the communication device includes the antenna circuit board, the communication device also includes a PIN needle and a first grounding PCB board, the first grounding PCB board is arranged between the antenna circuit board and the dielectric filter, the first grounding PCB board is provided with a first through hole corresponding to the position of the boss, the boss is arranged in the first through hole, one end of the PIN needle is inserted into the metallized blind hole and is welded to the wall of the metallized blind hole, and the other end of the PIN needle is welded to the antenna circuit board.

[0016] In one embodiment, if the communication device includes the antenna circuit board, the communication device also includes a first grounding PCB board, the first grounding PCB board is arranged between the antenna circuit board and the dielectric filter, the first grounding PCB board is provided with a first through hole corresponding to the position of the boss, the boss is arranged in the first through hole, the surface of the boss close to the antenna circuit board is flush with the surface of the first grounding PCB board close to the antenna circuit board, and the metallized blind hole opening is connected to the antenna circuit board by soldering.

[0017] In one embodiment, if the communication device includes the antenna circuit board, the communication device also includes a first grounding PCB board and a metal gasket, the first grounding PCB board is arranged between the antenna circuit board and the dielectric filter, the first grounding PCB board is provided with a first through hole corresponding to the position of the boss, the boss is arranged in the first through hole, the distance between the surface of the boss close to the antenna circuit board and the antenna circuit board is smaller than the distance between the surface of the first grounding PCB board close to the antenna circuit board and the antenna circuit board, the metal gasket is welded at the opening of the metallized blind hole, and the metal gasket is welded to the antenna circuit board.

[0018] In one of the embodiments, if the communication device includes the RF connector, the RF connector includes a shell, an inner core and a second grounded PCB board; the shell is electrically connected to the second grounded PCB board; the inner core includes a PIN needle, the second grounded PCB board is provided with a second through hole corresponding to the position of the boss, the boss is arranged in the second through hole, and one end of the PIN needle is inserted into the metallized blind hole and is welded to the hole wall of the metallized blind hole.

[0019] A design method for the dielectric filter includes the following steps: increasing the height h1 of the boss so that the depth h3 of the metallized blind hole increases synchronously.

[0020] In the above-mentioned design method of the dielectric filter, the boss can deepen the hole depth h3 of the metallized blind hole to a certain extent. When the height h1 of the boss protruding from the first surface is greater, the hole depth h3 of the metallized blind hole is correspondingly greater. In this way, the PIN pin can be prevented from falling off, skewing, poor welding or fracturing defects due to insufficient hole depth h3 of the metallized blind hole, thereby ensuring good welding performance and improving the product quality of the dielectric filter.

[0021] In one embodiment, the design method of the dielectric filter further includes the following step: if it is necessary to maintain both the frequency and the delay within a preset range, this is achieved by adjusting the hole depth h2 of the frequency adjustment hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 A schematic diagram of a top view of the structure of an antenna device according to an embodiment of the present invention;

[0025] Figure 2 for Figure 1 A cross-sectional view of an embodiment at AA;

[0026] Figure 3 for Figure 2 A schematic diagram of the enlarged structure at circle B;

[0027] Figure 4 for Figure 1 A cross-sectional view of another embodiment at AA;

[0028] Figure 5 for Figure 4 A schematic diagram of the enlarged structure at circle C;

[0029] Figure 6 for Figure 1 A cross-sectional view of another embodiment at AA;

[0030] Figure 7 for Figure 6 A schematic diagram of the enlarged structure at circle D;

[0031] Figure 8 for Figure 1 A cross-sectional view of another embodiment at AA;

[0032] Fig. 9 for Figure 8 A schematic diagram of the enlarged structure at circle E;

[0033] Fig.10 for Figure 1 A cross-sectional view of another embodiment at AA;

[0034] Fig.11 for Fig.10 A schematic diagram of the enlarged structure at circle F;

[0035] Fig.12 for Figure 3 A schematic diagram of a time delay simulation of the antenna device shown;

[0036] Fig.13 for Figure 3 A schematic diagram of a time delay simulation of the antenna device shown;

[0037] Fig.14 for Figure 3 A schematic diagram of a time delay simulation of the antenna device shown;

[0038] Fig.15 for Figure 3 A schematic diagram of a time delay simulation of the antenna device shown;

[0039] Fig.16 for Figure 3 Schematic diagram of the time delay simulation of the antenna device shown.

[0040] 10. Dielectric filter; 11. Dielectric block; 111. Boss; 112. Metalized blind hole; 12. First metal layer; 13. Second metal layer; 14. Frequency adjustment hole; 15. Partition ring; 20. Antenna circuit board; 30. PIN needle; 40. First grounding PCB board; 41. First through hole; 50. Metal gasket; 60. Solder. DETAILED DESCRIPTION

[0041] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0042] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0043] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0044] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0046] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0047] See also Figures 1 to 3 , Figure 1 FIG. 4 shows a schematic diagram of a top view of an antenna device in an embodiment of the present invention. Figure 2 for Figure 1 A schematic diagram of the structure of an embodiment at AA, Figure 3 for Figure 2An enlarged structural diagram at B. A dielectric filter 10 provided by an embodiment of the present invention comprises a dielectric block 11 and a first metal layer 12 coated on the outer surface of the dielectric block 11. The dielectric filter 10 has a first surface and a second surface arranged opposite to the first surface, that is, Figure 3 The upper and lower surfaces of the dielectric block 11 are shown. The first surface is convexly formed with a boss 111 in a direction away from the second surface. The boss 111 is provided with a metalized blind hole 112, and the hole wall of the metalized blind hole 112 is used to electrically connect with the antenna circuit board 20 or the RF connector.

[0048] The above-mentioned dielectric filter 10, the metallized blind hole 112 is also the connection port of the dielectric filter 10, which is used to electrically connect with the antenna circuit board 20 or the RF connector. The boss 111 can deepen the hole depth h3 of the metallized blind hole 112 to a certain extent. When the height h1 of the boss 111 protruding from the first surface is greater, the hole depth h3 of the metallized blind hole 112 is correspondingly greater. In this way, the PIN needle 30 can be prevented from falling off, being skewed, poorly welded or fracturing due to the insufficient hole depth h3 of the metallized blind hole 112, thereby ensuring good welding performance and improving the product quality of the dielectric filter 10.

[0049] See also Figure 3 In this embodiment, the second surface is recessed inward to form a frequency adjustment hole 14. Specifically, the frequency adjustment hole 14 can be a round hole, a square hole or a special-shaped hole. The frequency adjustment hole 14 can affect the frequency of the dielectric filter 10. The smaller the size of the frequency adjustment hole 14 (for example, reducing the hole depth h2 of the frequency adjustment hole 14), the higher the frequency of the dielectric filter 10, and the greater the time delay. Therefore, by changing the size of the frequency adjustment hole 14, the frequency and time delay of the dielectric filter 10 can be adjusted.

[0050] The so-called time delay is the time delay at a certain frequency. When the height h1 of the boss 111 is increased so that the hole depth h3 of the metalized blind hole 112 can also be increased synchronously, the frequency of the dielectric filter 10 will be lowered and the time delay will be reduced. At this time, the hole depth h2 of the frequency adjustment hole 14 can be adjusted to shallower depth h2 of the frequency adjustment hole 14, so as to adjust the frequency back to a specific frequency and adjust the time delay to a specific time delay.

[0051] It should be noted that, in other embodiments, when the frequency meets the set value, the frequency does not need to be adjusted, and the frequency adjustment hole 14 is not necessary.

[0052] It should be noted that the height h1 of the boss 111, the depth h2 of the frequency adjustment hole 14, and the depth h3 of the metalized blind hole 112 can refer to Figure 3The height h1 of the boss 111 refers to the height h1 of the boss 111 protruding from the first surface, that is, the height of the top surface of the boss 111 relative to the first surface excluding the boss 111. The depth h2 of the frequency adjustment hole 14 refers to the distance between the orifice of the frequency adjustment hole 14 and the bottom wall of the frequency adjustment hole 14. The depth h3 of the metallized blind hole 112 refers to the distance between the orifice of the metallized blind hole 112 and the bottom wall of the frequency adjustment hole 14.

[0053] See also Figure 3 Further, the frequency adjustment hole 14 is located on the second surface and is arranged opposite to the metallized blind hole 112, and is arranged coaxially with the metallized blind hole 112. In this way, the frequency adjustment hole 14 has a higher accuracy when implementing frequency adjustment.

[0054] See also Figure 3 In one embodiment, the metallized blind hole 112 is a circular hole or a regular polygon hole. In this way, the circular or regular polygonal metallized blind hole 112 has a regular shape and is easy to process, so the production process of the dielectric filter 10 can be more convenient. Moreover, since the size of the circular metallized blind hole 112 can be accurately characterized by the hole diameter and the hole depth h3, the size of the regular polygonal metallized blind hole 112 can be represented by the side length and the hole depth h3. Therefore, when determining the size of the metallized blind hole 112 according to the required time delay, the size of the metallized blind hole 112 is easier to determine, thereby further facilitating the processing of the dielectric filter 10.

[0055] See also Figure 3 Furthermore, the frequency adjustment hole 14 is a circular blind hole or a regular polygonal blind hole. The circular and regular polygonal blind holes are regular in shape and easy to process, so the production process of the dielectric filter 10 can be more convenient. Moreover, since the size of the circular blind hole can be accurately characterized by the hole diameter and the hole depth h2, the size of the regular polygonal blind hole can be represented by the side length and the hole depth h2. Therefore, when the frequency adjustment is realized by using the frequency adjustment hole 14, the size of the frequency adjustment hole 14 is easier to determine and process.

[0056] See also Figure 3In one embodiment, the second metal layer 13 and the first metal layer 12 of the hole wall of the metallized blind hole 112 form a partition ring 15. It should be noted that there is no metal layer at the partition ring 15. In this way, when the partition ring 15 is set on the surface of the boss 111, that is to say, the second metal layer 13 on the hole wall of the metallized blind hole 112 extends outward to the hole edge of the metallized blind hole 112, that is, the second metal layer 13 on the hole wall of the metallized blind hole 112 and the second metal layer 13 at the hole edge of the metallized blind hole 112 are still connected to each other, and the second metal layer 13 at the hole edge of the metallized blind hole 112 is separated from the first metal layer 12 in the remaining area on the first surface by the partition ring 15. By setting the isolating ring 15, on the one hand, the isolating ring 15 plays a role in preventing the first metal layer 12 from being electrically connected to the second metal layer 13, the first metal layer 12 is electrically connected to the grounded PCB board for grounding, and the second metal layer 13 is electrically connected to the antenna PCB board for transmitting antenna signals; on the other hand, when the width of the isolating ring 15 is adjusted, the size of the delay at a specific frequency can be adjusted accordingly, but the present embodiment is not limited to using this method to adjust the size of the delay at a specific frequency. In addition, the shape of the isolating ring 15 is not limited, and can be a circular ring, an elliptical ring, or other irregular shapes, which are not limited here.

[0057] It should be noted that no metal layer is provided at the partition ring 15 and the wall surface of the dielectric block 11 is exposed. Specifically, the metal layer at the partition ring 15 is removed to expose the wall surface. Of course, the wall surface of the dielectric block 11 corresponding to the partition ring 15 may not be electroplated or sprayed with a metal layer, thereby exposing the wall surface of the dielectric block 11.

[0058] In one embodiment, the dielectric block 11 is a ceramic dielectric block 11. The first metal layer 12 is a metal silver layer, a metal copper layer, a metal platinum layer or a metal gold layer plated, sprayed or bonded on the dielectric block 11. The second metal layer 13 is a metal silver layer, a metal copper layer, a metal platinum layer or a metal gold layer plated, sprayed or bonded on the hole wall of the metallized blind hole 112.

[0059] See also Figure 3 In one embodiment, the boss 111 includes a top surface arranged parallel to the second surface and a side surface connected to the top surface, and the side surface is arranged perpendicular to the top surface.

[0060] That is to say, the outer wall surface of the boss 111 is a regular shape, for example, it can be a square boss 111 or a circular boss 111 formed by the first surface protruding outward. When the boss 111 is a square boss 111, the size of the boss 111 can be accurately characterized by, for example, length, width and height. After the length, width and height of the boss 111 are determined during the product design process, since the outer wall surface of the boss 111 is a regular shape, it can be easily processed according to the determined size. It can be seen that the above-mentioned dielectric filter 10 is more convenient to produce.

[0061] It should be noted that the outer wall surface of the boss 111 may also be an irregular shape. For example, the top surface and the side surface of the boss 111 are not vertically arranged, but may be arranged at an obtuse angle or an acute angle, which is not limited here.

[0062] It should be noted that in the infringement comparison, the "boss 111" can be "a part of the dielectric block 11", that is, the "boss 111" is integrally formed with the "other parts of the dielectric block 11"; it can also be an independent component that can be separated from the "other parts of the dielectric block 111", that is, the "boss 111" can be independently manufactured and then combined with the "other parts of the dielectric block 11" into a whole. As shown in the figure, in one embodiment, the "boss 111" is a part of the "dielectric block 11" that is integrally formed.

[0063] See also Figures 1 to 3 In one embodiment, a communication device includes the dielectric filter 10 of any of the above embodiments, and also includes an antenna circuit board 20 or a radio frequency connector electrically connected to the metallized blind hole 112.

[0064] In the above-mentioned communication device, the metallized blind hole 112 is also the connection port of the dielectric filter 10, which is used to electrically connect with the antenna circuit board 20 or the RF connector. The boss 111 can deepen the hole depth h3 of the metallized blind hole 112 to a certain extent. When the height h1 of the boss 111 protruding from the first surface is greater, the hole depth h3 of the metallized blind hole 112 is correspondingly greater. In this way, the PIN needle 30 can be prevented from falling off, being skewed, poorly welded or fracturing due to the insufficient hole depth h3 of the metallized blind hole 112, thereby ensuring good welding performance and improving the product quality of the dielectric filter 10.

[0065] See also Figures 1 to 3 In one embodiment, if the communication device includes an antenna circuit board 20, the communication device also includes a PIN needle 30 and a first grounding PCB board 40. The first grounding PCB board 40 is disposed between the antenna circuit board 20 and the dielectric filter 10, and the first grounding PCB board 40 is provided with a first through hole 41 corresponding to the position of the boss 111. The boss 111 is disposed in the first through hole 41. One end of the PIN needle 30 is inserted into the metalized blind hole 112 and connected to the hole wall of the metalized blind hole 112 by welding, and the other end of the PIN needle 30 is connected to the antenna circuit board 20 by welding.

[0066] See also Figure 1 , Figure 4 and Figure 5 , Figure 4 for Figure 1 A cross-sectional view of another embodiment at AA; Figure 5 for Figure 4A schematic diagram of the enlarged structure at circle C. In one embodiment, if the communication device includes an antenna circuit board 20, the communication device also includes a first grounding PCB board 40. The first grounding PCB board 40 is disposed between the antenna circuit board 20 and the dielectric filter 10, and the first grounding PCB board 40 is provided with a first through hole 41 corresponding to the position of the boss 111. The boss 111 is disposed in the first through hole 41, and the surface of the boss 111 close to the antenna circuit board 20 is flush with the surface of the first grounding PCB board 40 close to the antenna circuit board 20, and the opening of the metallized blind hole 112 is connected to the antenna circuit board 20 by soldering 60.

[0067] See also Figure 1 , Figure 6 and Figure 7 , Figure 6 for Figure 1 A cross-sectional view of another embodiment at AA; Figure 7 for Figure 6 Schematic diagram of the enlarged structure at circle D. In one embodiment, if the communication device includes an antenna circuit board 20, the communication device also includes a first grounded PCB board 40 and a metal gasket 50. The first grounded PCB board 40 is arranged between the antenna circuit board 20 and the dielectric filter 10, and the first grounded PCB board 40 is provided with a first through hole 41 corresponding to the position of the boss 111. The boss 111 is arranged in the first through hole 41, and the distance between the surface of the boss 111 close to the antenna circuit board 20 and the antenna circuit board 20 is smaller than the distance between the surface of the first grounded PCB board 40 close to the antenna circuit board 20 and the antenna circuit board 20. A metal gasket 50 is welded at the opening of the metalized blind hole 112, and the metal gasket 50 is welded to the antenna circuit board 20. In this way, the distance between the surface of the boss 111 close to the antenna circuit board 20 and the antenna circuit board 20 is smaller than the distance between the surface of the first ground PCB board 40 close to the antenna circuit board 20 and the antenna circuit board 20, that is, with the second surface as a reference, the height of the surface of the boss 111 close to the antenna circuit board 20 relative to the second surface is lower than the height of the surface of the first ground PCB board 40 close to the antenna circuit board 20 relative to the second surface. It is also a feasible solution to weld and set a metal gasket 50 on the top surface of the boss 111 so that the surface of the metal gasket 50 is flush with the surface of the first ground PCB board 40 close to the antenna circuit board 20, and the metal gasket 50 is welded and connected to the antenna circuit board 20. In addition, at this time, it is not necessary to electrically connect the hole wall of the metalized blind hole 112 with the antenna circuit board 20 through the PIN needle 30, which can prevent the PIN needle 30 from falling off, skewing, poor welding or fracturing due to the insufficient hole depth h3 of the metalized blind hole 112, and ensure good welding performance, thereby improving the product quality of the dielectric filter 10.

[0068] See also Figure 1 , Figure 8 and Fig. 9 , Figure 8 for Figure 1 A cross-sectional view of another embodiment at AA; Fig. 9 for Figure 8 An enlarged structural diagram at circle E. Further, when the distance between the surface of the boss 111 close to the antenna circuit board 20 and the antenna circuit board 20 is smaller than the distance between the surface of the first ground PCB board 40 close to the antenna circuit board 20 and the antenna circuit board 20, that is, taking the second surface as a reference, the height of the surface of the boss 111 close to the antenna circuit board 20 relative to the second surface is lower than the height of the surface of the first ground PCB board 40 close to the antenna circuit board 20 relative to the second surface. Fig. 9 The dielectric filter 10 is schematically shown with Figure 7 The only difference of the illustrated dielectric filter 10 is that there is no need to weld a metal gasket 50 on the top surface of the boss 111. Instead, more solder 60 is added to the surface of the boss 111 close to the antenna circuit board 20. By increasing the thickness of the solder 60, the hole wall of the metallized blind hole 112 is welded to the antenna circuit board 20, which is also a feasible solution.

[0069] See also Figure 1 , Fig.10 and Fig.11 , Fig.10 for Figure 1 A cross-sectional view of another embodiment at AA; Fig.11 for Fig.10 An enlarged structural diagram at circle F. Further, the surface of the boss 111 close to the antenna circuit board 20 is flush with the surface of the first ground PCB board 40 close to the antenna circuit board 20, that is, with the second surface as a reference, the height of the surface of the boss 111 close to the antenna circuit board 20 relative to the second surface is the same as the height of the surface of the first ground PCB board 40 close to the antenna circuit board 20 relative to the second surface. Fig.11 The dielectric filter 10 is schematically shown with Figure 5 The only difference of the illustrated dielectric filter 10 is that the first metal layer 12 of the surface of the protrusion 111 close to the antenna circuit board 20 can also be directly electrically connected to the ground terminal of the antenna circuit board 20 through the solder 60 .

[0070] In one embodiment, if the communication device includes a radio frequency connector (not shown in the figure), the radio frequency connector includes a housing, an inner core and a second grounded PCB board. The housing is electrically connected to the second grounded PCB board. The inner core includes a PIN pin, and the second grounded PCB board is provided with a second through hole corresponding to the position of the boss 111. The boss 111 is arranged in the second through hole, and one end of the PIN pin is inserted into the metalized blind hole 112 and connected to the hole wall of the metalized blind hole 112 by welding.

[0071] Furthermore, the shell is generally formed of a good conductor metal material such as copper or silver. Moreover, the inner core and the shell are insulated to insulate the PIN from the shell. The RF connector can use a common RF connector on the market, and the structure of the RF connector will not be described in detail.

[0072] Furthermore, the metallized blind hole 112 is used for inserting the PIN pin of the RF connector. When the RF connector is installed on the dielectric filter 10, the second grounded PCB board is attached to the first surface and electrically contacts the first metal layer 12, specifically, for example, it is connected by welding with solder 60. The PIN pin is inserted into the metallized blind hole 112 and contacts the hole wall of the metallized blind hole 112, and the PIN pin is connected by welding with the hole wall of the metallized blind hole 112 with solder 60. In this way, the shell and the inner core of the RF connector will respectively realize signal connection with the first metal layer 12 of the dielectric filter 10 and the inside of the dielectric block 11, and the RF connector can be used as a signal port of the dielectric filter 10 to realize the import and export of microwave signals.

[0073] In one embodiment, please refer to Figures 1 to 3 A design method of the dielectric filter 10 of any of the above embodiments comprises the following steps: increasing the height h1 of the boss 111 so that the depth h3 of the metallized blind hole 112 increases synchronously.

[0074] In the design method of the dielectric filter 10 described above, the boss 111 can deepen the hole depth h3 of the metallized blind hole 112 to a certain extent. When the height h1 of the boss 111 protruding from the first surface is greater, the hole depth h3 of the metallized blind hole 112 is correspondingly greater. In this way, the PIN pin 30 can be prevented from falling off, being skewed, having poor welding or fracturing defects due to the insufficient hole depth h3 of the metallized blind hole 112, thereby ensuring good welding performance and improving the product quality of the dielectric filter 10.

[0075] Furthermore, the design method of the dielectric filter 10 further includes the following steps: if it is necessary to maintain both the frequency and the delay within a preset range, this is achieved by adjusting the hole depth h2 of the frequency adjustment hole 14. Thus, when the hole depth h2 of the frequency adjustment hole 14 is reduced, the higher the frequency of the dielectric filter 10, the greater the delay, thereby achieving the goal of maintaining both the frequency and the delay within a preset range, thereby ensuring the quality of the product.

[0076] When any of the three parameters, the height h1 of the boss 111 , the depth h2 of the frequency adjustment hole 14 , and the depth h3 of the metalized blind hole 112 , changes, the delay and frequency of the dielectric filter 10 may change.

[0077] See also Fig.12 , Fig.12 Indicated Figure 3 The schematic diagram of the delay simulation of the antenna device shown. Fig.12 The specific frequency shown is 2684MHz, and the specific delay is 2.07ns, corresponding to Fig.12 The position of the triangle marked 1. In order to ensure that the specific frequency and the specific time delay remain unchanged, correspondingly, when h1=0, h2=4mm, h3=1mm; when h1=0.5, h2=3.7mm, h3=1.5mm; when h1=1.5, h2=3.5mm, h3=2.0mm. Among them, the units of the height h1 of the boss 111, the hole depth h2 of the frequency adjustment hole 14 and the hole depth h3 of the metalized blind hole 112 are generally in millimeter order, and the above values ​​can also simply express the proportional relationship between the parameters. It can be seen from the above three sets of results that if the frequency and the time delay are maintained unchanged, when the height h1 of the boss 111 increases, the hole depth h2 of the frequency adjustment hole 14 will become shallower, and the hole depth h3 of the metalized blind hole 112 will increase synchronously.

[0078] See also Fig.13 , Fig.13 Indicated Figure 3 The schematic diagram of the delay simulation of the antenna device shown. Fig.13 As shown in the figure, when h1=0, h2=4mm, h3=1mm, the specific frequency is 2684MHz, and the specific delay is 2.07ns, corresponding to Fig.13 The position of the triangle number 1; when h1 = 0, h2 = 4.5mm, h3 = 1mm, the specific frequency is 2428MHz, and the specific delay is 1.2ns, corresponding to Fig.13 The position of the triangle number 2. From the above two sets of results, it can be seen that when the height h1 of the boss 111 and the hole depth h3 of the metalized blind hole 112 remain unchanged, the hole depth h2 of the frequency adjustment hole 14 will become deeper, the frequency will go down, and the delay will be reduced.

[0079] See also Fig.14 , Fig.14 Indicated Figure 3 The schematic diagram of the delay simulation of the antenna device shown. Fig.14 As shown in the figure, when h1=0, h2=4mm, h3=1mm, the specific frequency is 2684MHz, and the specific delay is 2.07ns, corresponding to Fig.14 The position of the triangle number 1; when h1 = 0, h2 = 4mm, h3 = 1.5mm, the specific frequency is 2621MHz, the specific delay is 1.28ns, corresponding to Fig.14 The position of the triangle number 2. From the above two sets of results, it can be seen that when the height h1 of the boss 111 and the depth h2 of the frequency adjustment hole 14 remain unchanged, the depth h3 of the metalized blind hole 112 becomes deeper, the frequency will go down, and the delay will become smaller.

[0080] See also Fig.15 , Fig.15 Indicated Figure 3 The schematic diagram of the delay simulation of the antenna device shown. Fig.15 As shown in the figure, when h1=0, h2=4mm, h3=1mm, the specific frequency is 2684MHz, and the specific delay is 2.07ns, corresponding to Fig.15 The position of the triangle number 1; when h1 = 1, h2 = 4mm, h3 = 1.5mm, the specific frequency is 2672MHz, and the specific delay is 6.35ns, corresponding to Fig.15 The position of the triangle number 2. From the above two sets of results, it can be seen that when the hole depth h2 of the frequency adjustment hole 14 and the hole depth h3 of the metalized blind hole 112 remain unchanged, the height h1 of the boss 111 increases, the frequency will go down, and the delay will increase.

[0081] See also Fig.16 , Fig.16 Indicated Figure 3 The schematic diagram of the delay simulation of the antenna device shown. Fig.16 As shown in the figure, when h1=0, h2=4mm, h3=1mm, the specific frequency is 2684MHz, and the specific delay is 2.07ns, corresponding to Fig.16 The position of the triangle number 1; when h1 = 1, h2 = 4mm, h3 = 1mm, the specific frequency is 2672MHz, and the specific delay is 6.35ns, corresponding to Fig.16 When h1=1, h2=4mm, h3=1mm, the boss 111 is specifically a cylindrical boss 111, and when the diameter of the boss 111 is increased, the specific frequency is 2750MHz, and the specific delay is 4.1ns, corresponding to Fig.16 The position of the triangle marked 3.

[0082] It can be seen from the above three groups of results that, first, when the hole depth h2 of the frequency adjustment hole 14 and the hole depth h3 of the metalized blind hole 112 remain unchanged, the height h1 of the boss 111 increases, the frequency will go down, and the time delay will increase; second, when the three parameters of the height h1 of the boss 111, the hole depth h2 of the frequency adjustment hole 14 and the hole depth h3 of the metalized blind hole 112 remain unchanged, when the diameter of the boss 111 is increased, the frequency will increase, and the time delay will decrease.

[0083] Therefore, in the process of designing the dielectric filter 10, while changing the height h1 of the boss 111 and the hole depth h3 of the metalized blind hole 112, the delay and frequency can be adjusted by synchronously adjusting the hole depth h2 of the frequency adjustment hole 14 and the diameter of the boss 111. In this way, the dielectric filter 10 can meet the delay and frequency requirements while ensuring that the metalized via 101 has a greater depth.

[0084] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0085] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A dielectric filter, characterized in that: It includes a dielectric block and a first metal layer coated on the outer surface of the dielectric block. The dielectric filter is provided with a first surface and a second surface arranged opposite to the first surface. The first surface is protruded outward in a direction away from the second surface to form a boss. The boss is provided with a metallized blind hole. The hole wall of the metallized blind hole is used for electrical connection with an antenna circuit board or a radio frequency connector.

2. The dielectric filter according to claim 1, characterized in that: The second surface is concavely formed with a frequency adjustment hole in a direction toward the first surface.

3. The dielectric filter according to claim 2, characterized in that: The frequency adjustment hole is arranged opposite to the metallized blind hole and is coaxially arranged with the metallized blind hole.

4. The dielectric filter according to claim 2, characterized in that: The metalized blind hole is a circular hole or a regular polygonal hole; the frequency adjustment hole is a circular hole or a regular polygonal hole.

5. The dielectric filter according to claim 1, characterized in that: The second metal layer on the wall of the metallized blind hole and the first metal layer form a partition ring.

6. The dielectric filter according to claim 5, characterized in that The dielectric block is a ceramic dielectric block; the first metal layer is a metal silver layer, a metal copper layer, a metal platinum layer or a metal gold layer plated, sprayed or adhered on the dielectric block; the second metal layer is a metal silver layer, a metal copper layer, a metal platinum layer or a metal gold layer plated, sprayed or adhered on the wall of the metallized blind hole.

7. The dielectric filter according to claim 1, characterized in that: The boss includes a top surface arranged parallel to the second surface and a side surface connected to the top surface, and the side surface is arranged perpendicular to the top surface.

8. A communication device, characterized in that: It comprises the dielectric filter as claimed in any one of claims 1 to 7, and also comprises an antenna circuit board or a radio frequency connector electrically connected to the metallized blind hole.

9. The communication device according to claim 8, characterized in that: If the communication device includes the antenna circuit board, the communication device also includes a PIN needle and a first grounding PCB board, the first grounding PCB board is arranged between the antenna circuit board and the dielectric filter, the first grounding PCB board is provided with a first through hole corresponding to the position of the boss, the boss is arranged in the first through hole, one end of the PIN needle is inserted into the metallized blind hole and is welded to the wall of the metallized blind hole, and the other end of the PIN needle is welded to the antenna circuit board.

10. The communication device according to claim 8, characterized in that: If the communication device includes the antenna circuit board, the communication device also includes a first grounding PCB board, which is arranged between the antenna circuit board and the dielectric filter. The first grounding PCB board is provided with a first through hole corresponding to the position of the boss, and the boss is arranged in the first through hole. The surface of the boss close to the antenna circuit board is flush with the surface of the first grounding PCB board close to the antenna circuit board, and the metallized blind hole opening is connected to the antenna circuit board by soldering.

11. The communication device according to claim 8, characterized in that: If the communication device includes the antenna circuit board, the communication device also includes a first grounding PCB board and a metal gasket, the first grounding PCB board is arranged between the antenna circuit board and the dielectric filter, the first grounding PCB board is provided with a first through hole corresponding to the position of the boss, the boss is arranged in the first through hole, the distance between the surface of the boss close to the antenna circuit board and the antenna circuit board is smaller than the distance between the surface of the first grounding PCB board close to the antenna circuit board and the antenna circuit board, the metal gasket is welded at the opening of the metallized blind hole, and the metal gasket is welded to the antenna circuit board.

12. The communication device according to claim 8, characterized in that: If the communication device includes the RF connector, the RF connector includes a shell, an inner core and a second grounded PCB board; the shell is electrically connected to the second grounded PCB board; the inner core includes a PIN needle, the second grounded PCB board is provided with a second through hole corresponding to the position of the boss, the boss is arranged in the second through hole, and one end of the PIN needle is inserted into the metallized blind hole and is welded to the hole wall of the metallized blind hole.

13. A method for designing a dielectric filter according to any one of claims 1 to 7, characterized in that: The method comprises the following steps: increasing the height h1 of the boss so that the hole depth h3 of the metallized blind hole increases synchronously.

14. The method for designing a dielectric filter according to claim 13, characterized in that: The method further includes the following steps: if it is necessary to maintain both the frequency and the delay within a preset range, this is achieved by adjusting the hole depth h2 of the frequency adjustment hole.

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