A non-standard chip automatic testing device

Abstract

The present invention relates to a non-standard chip automatic testing device, wherein a first stepper motor is installed on a first mounting seat, a first transmission gear is installed on the first stepper motor, a second mounting seat is also installed on the first mounting seat, a first transmission belt is installed on the second mounting seat, a first chip pickup module is installed on the first transmission belt, a second stepper motor is also installed on the main frame, a second transmission gear is provided on one side of the second stepper motor, a second transmission belt is installed on the fourth mounting seat, a second chip pickup module is installed on the second transmission belt, a multi-chip test module is provided on the main frame, a lead screw is provided on the main frame, a third stepper motor is installed on the fifth mounting seat, and a second tray is installed on the lead screw. The present invention realizes the detection of multiple chips or the detection of different chips, and effectively improves the efficiency of chip detection.

Description

Technical Field

[0001] The invention relates to the technical field of chip testing, and in particular to an automatic testing device for non-standard chips. Background Art

[0002] At present, the semiconductor industry is developing in depth in China. Since semiconductor chips vary greatly from one another, they need to be tested, screened, and classified at the back end. There are many packaging and testing companies in China that can provide packaging and testing services, but most of the testing equipment of these manufacturers is imported equipment, which is expensive and has high maintenance costs, so the price of the testing services they provide is relatively high. On the other hand, these equipment cannot meet the needs of some specialized applications in order to ensure universality. Summary of the invention

[0003] The purpose of the present invention is to provide a non-standard chip automatic testing device to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a non-standard chip automatic testing device, comprising a main frame, a first mounting seat is provided at the upper end of the main frame, a first stepper motor is installed on the first mounting seat, a first transmission gear is installed on the first stepper motor, a second mounting seat is also installed on the first mounting seat, a first transmission belt connected to the first transmission gear is installed on the second mounting seat, a first chip picking module driven by the first transmission belt is installed on the first transmission belt, a fourth mounting seat is also installed on the main frame, a second stepper motor is installed on the fourth mounting seat, and a first stepper motor of the second stepper motor is installed on the first mounting seat. A second transmission gear is provided on the side, a third mounting seat is installed on the fourth mounting seat, a second transmission belt connected to the second transmission gear is installed on the third mounting seat, a second chip picking module driven by the second transmission belt is installed on the second transmission belt, a multi-chip testing module is provided on the main frame and below the first chip picking module and the second chip picking module, a fifth mounting seat is provided on the main frame and below the first chip picking module and the second chip picking module, a screw rod is installed on the fifth mounting seat, a third stepping motor for driving the screw rod to extend and retract is installed on the fifth mounting seat, and a second tray is installed on the screw rod.

[0005] As a further solution of the present invention: the first chip picking module includes a first mounting plate, a second mounting plate and a third mounting plate, the first mounting plate is mounted with a first cylinder and a first mounting frame, the first mounting frame is mounted with a third transmission rack, the first transmission belt is on a first transmission rack meshing with the third transmission rack, a first telescopic rod is connected between the first cylinder and the second mounting plate, a first piston shaft is provided on a side of the first mounting plate close to the second mounting plate, a first piston is provided on a side of the first piston shaft close to the second mounting plate, the first piston is fixed to the second mounting plate, first connecting pipes are provided on both sides of the third mounting plate, a plurality of first suction nozzles are provided on the upper end of the third mounting plate, a first suction nozzle mounting seat connected to the first suction nozzle is provided on a side of the third mounting plate away from the first suction nozzle, a plurality of first limiting holes connected to the first suction nozzle are provided on the first suction nozzle mounting seat, and the third mounting plate is connected to the first connecting pipe.

[0006] As a further solution of the present invention: a plurality of first movable holes are provided on the second mounting plate, a first telescopic axis that is telescopic along the first movable hole is provided on the side of the second mounting plate close to the third mounting plate, an end of the first telescopic axis away from the second mounting plate is fixed to the third mounting plate, a first spring is provided between the second mounting plate and the third mounting plate, and the first spring is sleeved on the outer periphery of the first telescopic axis.

[0007] As a further solution of the present invention: a first guide shaft is provided on one side of the first mounting seat, a first guide block sliding along the first guide shaft is provided on the first mounting plate, and a first guide cavity for the first guide shaft to pass through is provided in the first guide block.

[0008] As a further solution of the present invention: the second chip picking module includes a fourth mounting plate, a fifth mounting plate and a sixth mounting plate, the fourth mounting plate is provided with a third piston shaft on a side close to the fifth mounting plate, the third piston shaft is provided with a third piston on a side close to the fifth mounting plate, the third piston is fixed on the fifth mounting plate, the upper end of the fourth mounting plate is provided with a second cylinder and a second mounting bracket, the second cylinder is provided with a second telescopic rod connected to the fifth mounting plate on a side close to the fifth mounting plate, the second mounting bracket is provided with a fourth transmission rack, the second transmission belt is provided with a second transmission rack meshed with the fourth transmission rack, second connecting pipes are provided on both sides of the sixth mounting plate, a plurality of second suction nozzles are provided on the upper end of the sixth mounting plate, a plurality of second suction nozzle mounting seats are provided on a side of the sixth mounting plate away from the fifth mounting plate, the second suction nozzle mounting seats are provided with second limiting holes connected to the second suction nozzle, and the sixth mounting plate is connected to the second connecting pipe.

[0009] As a further solution of the present invention: a plurality of second movable holes are provided on the fifth mounting plate, a second telescopic axis that is telescopic along the second movable holes is provided on the side of the fifth mounting plate close to the sixth mounting plate, the second telescopic axis is fixed to the sixth mounting plate on the side away from the fifth mounting plate, a second spring is provided between the fifth mounting plate and the sixth mounting plate, and the second spring is sleeved on the outer periphery of the second telescopic axis.

[0010] As a further solution of the present invention: a second guide shaft is provided on one side of the fourth mounting seat, a second guide block sliding along the second guide shaft is provided on the upper end of the fourth mounting plate, and a second guide cavity for the second guide shaft to pass through is provided in the second guide block.

[0011] As a further solution of the present invention: the first guide rail and the second guide rail are installed on the upper end of the fifth mounting seat, the first slider which slides along the first guide rail is provided at the lower end of the second tray, and the second slider which slides along the second guide rail is also provided at the lower end of the second tray.

[0012] As a further solution of the present invention: the fifth mounting seat is provided with a limit seat for the extension and retraction of the screw rod.

[0013] As a further solution of the present invention: the multi-chip testing module includes a first tray installed on a main frame, the first tray is located below the first chip picking module, a plurality of chip bases are provided at the upper end of the first tray, the chip bases are each provided with a third limiting hole, and the first tray is provided with a third connecting tube connected to the third limiting hole.

[0014] Compared with the prior art, the beneficial effect of the present invention is that when in use, different chips or multiple chips of the same kind are placed on the second tray, and the second chip picking module adsorbs and moves the chip to the multi-chip testing module for detection. After the detection, the first chip picking module adsorbs and moves the detected chip, thereby realizing the detection of multiple chips or the detection of different chips, and effectively improving the efficiency of chip detection.

[0015] Other features and advantages of the present invention will be disclosed in detail in the following specific embodiments and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a structural schematic diagram of the non-standard chip automatic testing device of the present invention from a first perspective;

[0017] Figure 2 It is a structural schematic diagram of the first chip picking module in the non-standard chip automatic testing device of the present invention;

[0018] Figure 3 This is a bottom view of the first chip picking module in the non-standard chip automatic testing device of the present invention;

[0019] Figure 4 It is a structural schematic diagram of the second chip picking module in the non-standard chip automatic testing device of the present invention;

[0020] Figure 5 This is a bottom view of the second chip picking module in the non-standard chip automatic testing device of the present invention;

[0021] Figure 6 A top view of a multi-chip test module in the non-standard chip automatic test device of the present invention;

[0022] Figure 7 for Figure 1 A local enlarged schematic diagram of the middle A;

[0023] Figure 8 This is a structural schematic diagram of the non-standard chip automatic testing device of the present invention from a second viewing angle.

[0024] In the figure: 1, main frame; 2, multi-chip test module; 201, first tray; 202, third connecting pipe; 203, chip base; 204, third limiting hole; 3, first chip pickup module; 301, first mounting plate; 302, second mounting plate; 303, first cylinder; 304, first guide block; 305, first guide cavity; 306, first mounting frame; 307, third transmission rack; 308, first telescopic rod; 309, third mounting plate; 310, first piston; 311, first mounting plate; 312, first mounting plate; 313, first mounting plate; 314, first mounting plate; 315, first mounting plate; 316, first mounting plate; 317, first mounting plate; 318, first mounting plate; 319, first mounting plate; 320, first mounting plate; 321, first mounting plate; 322, first mounting plate; 323, first mounting plate; 324, first mounting plate; 325, first mounting plate; 326, first mounting plate; 327, first mounting plate; 328, first mounting plate; 329, first mounting plate; 330, first mounting plate; 331, first mounting plate; 332, first mounting plate; 333, first mounting plate; 334, first mounting plate; 335, first mounting plate; 336, first mounting plate; 337, first mounting plate; 338, first mounting plate; 339, first mounting plate; 340, first mounting plate; 341, first mounting plate; 342, first mounting plate; 343, first mounting plate; 344, first mounting plate; 345, first mounting plate; 346, first mounting plate; 347, first mounting plate; 348, first mounting plate; 349, first mounting plate; 350, first mounting plate; 1. First piston shaft; 312. Second piston shaft; 313. Second piston; 314. First telescopic shaft; 315. First spring; 316. First movable hole; 317. First connecting pipe; 318. First suction nozzle; 319. First suction nozzle mounting seat; 320. First limiting hole; 4. First mounting seat; 5. First stepper motor; 6. First transmission gear; 7. Second chip picking module; 701. Fourth mounting plate; 702. Fifth mounting plate; 703. Second cylinder; 704. Second Guide block; 705, second guide cavity; 706, second mounting frame; 707, fourth transmission rack; 708, second telescopic rod; 709, sixth mounting plate; 710, third piston; 711, third piston shaft; 712, fourth piston shaft; 713, fourth piston; 714, second telescopic shaft; 715, second spring; 716, second movable hole; 717, second connecting pipe; 718, second suction nozzle; 719, second suction nozzle mounting seat; 720, second limiting hole; 8, first transmission Belt; 801, first transmission rack; 9, second transmission belt; 901, second transmission rack; 10, first guide shaft; 11, second guide shaft; 12, second stepper motor; 13, second transmission gear; 14, fourth mounting seat; 15, third mounting seat; 16, second mounting seat; 17, first guide rail; 18, first slider; 19, second tray; 20, lead screw; 21, third stepper motor; 22, limit seat; 23, second guide rail; 24, second slider; 25, fifth mounting seat. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] See also Figures 1 to 8In an embodiment of the present invention, a non-standard chip automatic testing device includes a main frame 1, a first mounting seat 4 is provided at the upper end of the main frame 1, a first stepper motor 5 is installed on the first mounting seat 4, a first transmission gear 6 is installed on the first stepper motor 5, a second mounting seat 16 is also installed on the first mounting seat 4, a first transmission belt 8 connected to the first transmission gear 6 is installed on the second mounting seat 16, a first chip picking module 3 driven by the first transmission belt 8 is installed on the first transmission belt 8, a fourth mounting seat 14 is also installed on the main frame 1, a second stepper motor 12 is installed on the fourth mounting seat 14, and a second transmission gear 6 is installed on one side of the second stepper motor 12 13, a third mounting seat 15 is mounted on the fourth mounting seat 14, a second transmission belt 9 connected to the second transmission gear 13 is mounted on the third mounting seat 15, a second chip pickup module 7 driven by the second transmission belt 9 is mounted on the second transmission belt 9, a multi-chip test module 2 is arranged on the main frame 1 and below the first chip pickup module 3 and the second chip pickup module 7, a fifth mounting seat 25 is arranged on the main frame 1 and below the first chip pickup module 3 and the second chip pickup module 7, a lead screw 20 is mounted on the fifth mounting seat 25, a third stepping motor 21 for driving the lead screw 20 to extend and retract is mounted on the fifth mounting seat 25, and a second tray 19 is mounted on the lead screw. When in use, different chips or multiple chips of the same kind are placed on the second tray 19, the second chip pickup module 7 absorbs and moves the chips to the multi-chip test module 2 for detection, and the first chip pickup module 3 absorbs and moves the detected chips after detection, thereby realizing the detection of multiple chips or the detection of different chips, and effectively improving the efficiency of chip detection.

[0027] In this embodiment, the first chip picking module 3 includes a first mounting plate 301, a second mounting plate 302 and a third mounting plate 309, the first mounting plate 301 is mounted with a first cylinder and a first mounting frame 306, the first mounting frame 306 is mounted with a third transmission rack 307, the first transmission belt 8 is meshed with a first transmission rack 801 of the third transmission rack 307, a first telescopic rod 308 is connected between the first cylinder 303 and the second mounting plate 302, a first piston shaft 311 is provided on the side of the first mounting plate 301 close to the second mounting plate 302, and the first piston shaft A first piston 310 is provided on the side 311 close to the second mounting plate 302, and the first piston 310 is fixed on the second mounting plate 302. First connecting pipes 317 are provided on both sides of the third mounting plate 309. A plurality of first suction nozzles 318 are provided on the upper end of the third mounting plate 309. A first suction nozzle mounting seat 319 connected with the first suction nozzle 318 is provided on the side of the third mounting plate 309 away from the first suction nozzle 318. A plurality of first limiting holes 320 connected with the first suction nozzle 318 are provided on the first suction nozzle mounting seat 319, and the third mounting plate 309 is connected to the first connecting pipe 317. The first connecting pipe 317 is externally connected to a coolant tank, and the first connecting pipe 317 realizes inputting the coolant into the third mounting plate 309, and the first connecting pipe 317 on the other side of the third mounting plate 309 outputs the coolant, realizing one-in-one-out of the coolant, and ensuring the temperature of the third mounting plate 309. In addition, the first suction nozzle 318 is externally connected to an electromagnetic valve, and negative pressure is generated at the first limiting hole 320. The negative pressure at the first limiting hole 320 realizes the adsorption and picking of the chip, and the electromagnetic valve is controlled by software to achieve the purpose of adsorbing and placing each chip. The first cylinder 303 drives the first telescopic rod 308 to move in the vertical direction, so that the adsorbed chip can be moved. In addition, since a plurality of first limiting holes 320 are provided, different chips or multiple chips can be adsorbed, and then different chips or multiple chips can be tested, which effectively improves the efficiency of chip adsorption.

[0028] In this embodiment, a plurality of first movable holes 316 are provided on the second mounting plate 302, a first telescopic shaft 314 that telescopes along the first movable hole 316 is provided on one side of the second mounting plate 302 close to the third mounting plate 309, an end of the first telescopic shaft 314 that is away from the second mounting plate 302 is fixed to the third mounting plate 309, a first spring 315 is provided between the second mounting plate 302 and the third mounting plate 309, and the first spring 315 is sleeved on the outer circumference of the first telescopic shaft 314. By providing a plurality of first movable holes 316 on the second mounting plate 302, the first telescopic shaft 314 telescopes in the first movable holes 316, so that the stability of the movement of the third mounting plate 309 can be ensured, and the stability of chip movement can be improved.

[0029] In this embodiment, a first guide shaft 10 is provided on one side of the first mounting seat 4, a first guide block 304 is provided on the first mounting plate 301 to slide along the first guide shaft 10, and a first guide cavity 305 is provided in the first guide block 304 for the first guide shaft 10 to pass through. By providing the first guide shaft 10 on one side of the first mounting seat 4 and providing the first guide block 304 to slide along the first guide shaft on the first mounting plate 301, the stability of the movement of the first chip pickup module 3 can be improved.

[0030] In this embodiment, the second chip picking module 7 includes a fourth mounting plate 701, a fifth mounting plate 702 and a sixth mounting plate 709, a third piston shaft 711 is provided on a side of the fourth mounting plate 701 close to the fifth mounting plate 702, a third piston 710 is provided on a side of the third piston shaft 711 close to the fifth mounting plate 702, and the third piston 710 is fixed on the fifth mounting plate 702, a second cylinder 703 and a second mounting bracket 706 are installed on the upper end of the fourth mounting plate 701, a second extension 703 connected to the fifth mounting plate 702 is provided on a side of the second cylinder 703 close to the fifth mounting plate 702 The retracted rod 708 is provided on the second mounting frame 706, and the second transmission rack 901 which meshes with the fourth transmission rack 707 is provided on the second transmission belt 9. The sixth mounting plate 709 is provided with a second connecting pipe 717, and a plurality of second suction nozzles 718 are provided on the upper end of the sixth mounting plate 709. A plurality of second suction nozzle mounting seats 719 are provided on the side of the sixth mounting plate 709 away from the fifth mounting plate 702. The second suction nozzle mounting seats 719 are all provided with second limiting holes 720 which are connected with the second suction nozzles 718, and the sixth mounting plate 709 is connected with the second connecting pipe 717. The second connecting pipe 717 is connected to a cooling liquid tank, and the second connecting pipe 717 realizes inputting the cooling liquid into the sixth mounting plate 709, and the cooling liquid is outputted from the second connecting pipe 717 on the other side of the sixth mounting plate 709, thereby realizing one inlet and one outlet of the cooling liquid, and ensuring the temperature of the sixth mounting plate 709. In addition, the second suction nozzle 718 is connected to an electromagnetic valve, and a negative pressure is generated at the second limiting hole 720, so that the chip is adsorbed and picked up at the second limiting hole 720, and the electromagnetic valve is controlled by software to achieve the purpose of sucking and placing each chip by the second The cylinder 703 drives the second telescopic shaft 714 to move in the vertical direction, thereby realizing the vertical movement of the picked chip. In addition, the second transmission rack 901 on the second transmission belt 9 is meshed with the fourth transmission rack 707. The rotation of the second transmission belt 9 drives the second chip picking module 7 to move, thereby realizing the movement of the adsorbed chip. In addition, since a plurality of second limiting holes 720 are provided, different chips can be detected, and multiple chips can also be detected, thereby improving the flexibility and efficiency of chip detection.

[0031] In this embodiment, the fifth mounting plate 702 is provided with a plurality of second movable holes 716, and a second telescopic shaft 714 is provided on a side of the fifth mounting plate 702 close to the sixth mounting plate 709, which is telescopic along the second movable hole 716. A side of the second telescopic shaft 714 away from the fifth mounting plate 702 is fixed to the sixth mounting plate 709, and a second spring 715 is provided between the fifth mounting plate 702 and the sixth mounting plate 709, and the second spring 715 is sleeved on the outer circumference of the second telescopic shaft 714. By making the second telescopic shaft 714 telescopic in the second movable hole 716, the stability of the sixth mounting plate 709 when moving is ensured, and thus the stability of the chip picking movement can be ensured.

[0032] In this embodiment, a second guide shaft 11 is provided on one side of the fourth mounting seat 14, a second guide block 704 is provided on the upper end of the fourth mounting plate 701 to slide along the second guide shaft 11, and a second guide cavity 705 is provided in the second guide block 704 for the second guide shaft 11 to pass through. By providing the second guide shaft 11 on one side of the fourth mounting seat 14 and providing the second guide block 704 on the upper end of the fourth mounting plate 701 to slide along the second guide rail 23, the stability of the movement of the second chip pickup module 7 can be improved.

[0033] In this embodiment, the first guide rail 17 and the second guide rail 23 are installed on the upper end of the fifth mounting seat 25, the first slider 18 sliding along the first guide rail 17 is provided at the lower end of the second tray 19, and the second slider 24 sliding along the second guide rail 23 is also provided at the lower end of the second tray 19. By installing the first guide rail 17 and the second guide rail 23 on the fifth mounting seat 25, the first slider 18 sliding along the first guide rail 17 and the second slider 24 sliding along the second guide rail 23 are provided at the lower end of the second tray 19, so that the stability of the movement of the second tray 19 is ensured, thereby improving the stability of the movement of the chip.

[0034] In this embodiment, the fifth mounting seat 25 is provided with a limit seat 22 for the extension and retraction of the screw rod 20. By providing the limit seat 22 for the extension and retraction of the screw rod 20 on the fifth mounting seat 25, the stability of the movement of the screw rod 20 can be effectively improved, ensuring that the second tray 19 for placing chips has better stability during movement.

[0035] In this embodiment, the multi-chip test module 2 includes a first tray 201 installed on the main frame 1, the first tray 201 is located below the first chip pickup module 3, a plurality of chip bases 203 are provided at the upper end of the first tray 201, the chip bases 203 are each provided with a third limiting hole 204, and the first tray 201 is provided with a third connecting pipe 202 connected with the third limiting hole 204. The third connecting pipe 202 is externally connected to a cylinder, and the cylinder generates negative pressure at the third limiting hole 204 to achieve chip adsorption. Since a plurality of third limiting holes 204 are provided, different chips can be tested simultaneously, thereby improving the efficiency of chip testing.

[0036] It can be understood that a second piston 313 is provided on the side of the third mounting plate 309 close to the second mounting plate 302, a second piston shaft 312 connected to the second piston 313 is provided on the side of the second mounting plate 302 close to the third mounting plate 309, and the second piston shaft 312 is fixed on the third mounting plate 309 on the side close to the third mounting plate 309.

[0037] It can be understood that a fourth piston 713 is provided on the side of the sixth mounting plate 709 close to the fifth mounting plate 702, a fourth piston shaft 712 connected to the fourth piston 713 is provided on the side of the fifth mounting plate 702 close to the sixth mounting plate 709, and one end of the fourth piston shaft 712 close to the sixth mounting plate 709 is fixed on the sixth mounting plate 709.

[0038] It is understandable that the chip automation test uses multiple chips to test, screen, and classify simultaneously, which can effectively improve the test efficiency (this embodiment uses 26 chips to test, screen, and classify simultaneously), overcome the disadvantage of slow movement speed of the robot arm, and avoid the technical difficulty of increasing the movement speed of the robot arm.

[0039] It is also understandable that compared with existing test machines, the chip automated test device is only designed for specific chips and can meet certain special requirements for testing a chip (for example, providing large current, providing a constant temperature environment, etc.), providing services for chip testing, screening, and classification. The chip automated test device is simple to manufacture and maintain, and the device manufacturing cost is low. When the chip is mass-produced, it can reduce the cost of chip manufacturing companies; and companies can conduct chip testing, screening, and classification within the company without outsourcing to packaging and testing companies.

[0040] It can also be understood that the implementation method of the non-standard chip automatic testing device proposed in the present invention only tests specific chips and is designed for special requirements, such as: maintaining constant temperature, providing high current testing, etc.; chip picking, placement, testing and other modules abandon the traditional single chip operation and use multiple chips simultaneously to effectively improve efficiency.

[0041] It can also be understood that the first suction nozzle 318, the second suction nozzle 718, the third mounting plate 309 and the sixth mounting plate 709 are all made of aluminum alloy, which is a good conductor of heat, thereby ensuring heat absorption and release.

[0042] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0043] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A non-standard chip automatic testing device, characterized in that: The invention comprises a main frame, wherein a first mounting seat is provided at the upper end of the main frame, a first stepper motor is installed on the first mounting seat, a first transmission gear is installed on the first stepper motor, a second mounting seat is also installed on the first mounting seat, a first transmission belt connected to the first transmission gear is installed on the second mounting seat, a first chip pickup module driven by the first transmission belt is installed on the first transmission belt, a fourth mounting seat is also installed on the main frame, a second stepper motor is installed on the fourth mounting seat, a second transmission gear is provided on one side of the second stepper motor, a third mounting seat is installed on the fourth mounting seat, a second transmission belt connected to the second transmission gear is installed on the third mounting seat, a second chip pickup module driven by the second transmission belt is installed on the second transmission belt, a multi-chip test module is provided on the main frame and below the first chip pickup module and the second chip pickup module, a fifth mounting seat is provided on the main frame and below the first chip pickup module and the second chip pickup module, a lead screw is installed on the fifth mounting seat, a third stepper motor for driving the lead screw to extend and retract is installed on the fifth mounting seat, and a second tray is installed on the lead screw; The first chip picking module comprises a first mounting plate, a second mounting plate and a third mounting plate, wherein a first cylinder and a first mounting frame are mounted on the first mounting plate, a third transmission rack is mounted on the first mounting frame, a first transmission rack on the first transmission belt meshing with the third transmission rack, a first telescopic rod is connected between the first cylinder and the second mounting plate, a first piston shaft is provided on a side of the first mounting plate close to the second mounting plate, a first piston is provided on a side of the first piston shaft close to the second mounting plate, the first piston is fixed to the second mounting plate, first connecting pipes are provided on both sides of the third mounting plate, a plurality of first suction nozzles are provided on the upper end of the third mounting plate, a first suction nozzle mounting seat connected to the first suction nozzle is provided on a side of the third mounting plate away from the first suction nozzle, a plurality of first limiting holes connected to the first suction nozzle are provided on the first suction nozzle mounting seat, and the third mounting plate is connected to the first connecting pipe; The second mounting plate is provided with a plurality of first movable holes, a first telescopic shaft telescopic along the first movable hole is provided on a side of the second mounting plate close to the third mounting plate, an end of the first telescopic shaft away from the second mounting plate is fixed to the third mounting plate, a first spring is provided between the second mounting plate and the third mounting plate, and the first spring is sleeved on the outer circumference of the first telescopic shaft; A first guide shaft is disposed at one side of the first mounting seat, a first guide block sliding along the first guide shaft is disposed on the first mounting plate, and a first guide cavity for the first guide shaft to pass through is disposed in the first guide block.

2. The non-standard chip automatic testing device according to claim 1, characterized in that: The second chip picking module includes a fourth mounting plate, a fifth mounting plate and a sixth mounting plate, wherein a third piston shaft is provided on a side of the fourth mounting plate close to the fifth mounting plate, a third piston is provided on a side of the third piston shaft close to the fifth mounting plate, and the third piston is fixed to the fifth mounting plate, a second cylinder and a second mounting bracket are installed on the upper end of the fourth mounting plate, a second telescopic rod connected to the fifth mounting plate is provided on the side of the second cylinder close to the fifth mounting plate, a fourth transmission rack is provided on the second mounting bracket, a second transmission rack meshed with the fourth transmission rack is provided on the second transmission belt, second connecting pipes are provided on both sides of the sixth mounting plate, a plurality of second suction nozzles are provided on the upper end of the sixth mounting plate, a plurality of second suction nozzle mounting seats are provided on the side of the sixth mounting plate away from the fifth mounting plate, a second limiting hole connected to the second suction nozzle is provided on the second suction nozzle, and the sixth mounting plate is connected to the second connecting pipe.

3. The non-standard chip automatic testing device according to claim 2, characterized in that: The fifth mounting plate is provided with a plurality of second movable holes, a second telescopic shaft telescopic along the second movable hole is provided on a side of the fifth mounting plate close to the sixth mounting plate, a side of the second telescopic shaft away from the fifth mounting plate is fixed to the sixth mounting plate, a second spring is provided between the fifth mounting plate and the sixth mounting plate, and the second spring is sleeved on the outer periphery of the second telescopic shaft.

4. The non-standard chip automatic testing device according to claim 2, characterized in that: A second guide shaft is disposed at one side of the fourth mounting seat, a second guide block sliding along the second guide shaft is disposed at the upper end of the fourth mounting plate, and a second guide cavity for the second guide shaft to pass through is disposed in the second guide block.

5. The non-standard chip automatic testing device according to claim 1, characterized in that: The upper end of the fifth mounting seat is provided with a first guide rail and a second guide rail, the lower end of the second tray is provided with a first slider which slides along the first guide rail, and the lower end of the second tray is also provided with a second slider which slides along the second guide rail.

6. The non-standard chip automatic testing device according to claim 5, characterized in that: The fifth mounting seat is provided with a limiting seat for the lead screw to be extended and retracted.

7. The non-standard chip automatic testing device according to claim 1, characterized in that: The multi-chip test module includes a first tray installed on a main frame, the first tray is located below a first chip pickup module, a plurality of chip bases are provided at the upper end of the first tray, the chip bases are each provided with a third limiting hole, and the first tray is provided with a third connecting tube connected to the third limiting hole.

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