Antenna module and electronic device including the same

Abstract

The present disclosure relates to a communication method and system, which integrates a fifth generation (5G) communication system supporting a higher data rate than a fourth generation (4G) system data rate with an Internet of Things (IoT) technology. The present disclosure can be applied to smart services based on 5G communication technology and IoT-related technologies, such as smart homes, smart buildings, smart cities, smart cars, connected cars, healthcare, digital education, smart retail, security and safety services. The present disclosure relates to an antenna module and an electronic device including an antenna module. In various embodiments, the antenna module includes: a first printed circuit board (PCB) stacked with at least one layer, and a second PCB disposed on an upper surface of the first PCB and stacked with at least one layer. The antenna module also includes: a wireless communication chip, which is disposed on an upper surface of the second PCB and controls an electrical signal for radio frequency; a first structure, which is disposed on an upper surface of the first PCB and surrounds the upper surface of the first PCB; a first antenna, which is disposed on an inner surface of the first structure to face the first PCB; and a feeder, which electrically connects the first antenna and the wireless communication chip.

Description

Technical Field

[0001] The present disclosure relates to an antenna module and an electronic device including the antenna module. Background Art

[0002] In order to meet the demand for wireless data services that have increased since the deployment of 4G communication systems, efforts are being made to develop improved 5G or pre-5G communication systems. Therefore, 5G or pre-5G communication systems are also referred to as "super 4G networks" or "post-LTE systems". 5G communication systems are considered to be implemented on higher frequency (millimeter wave) bands (e.g., 60 GHz bands) to achieve higher data rates. In order to reduce the path loss of radio waves and increase the transmission distance, beamforming, massive multiple-input multiple-output (MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, and massive antenna technology are discussed in 5G communication systems. In addition, in 5G communication systems, development of system network improvements based on advanced small cells, cloud radio access networks (RANs), ultra-dense networks, device-to-device (D2D) communications, wireless backhaul, mobile networks, collaborative communications, coordinated multi-point (CoMP), receiving-end interference elimination, etc. is underway. In 5G systems, hybrid FSK and QAM modulation (FQAM) and sliding window superposition coding (SWSC) have been developed as advanced coding modulation (ACM), and filter bank multi-carrier (FBMC), non-orthogonal multiple access (NOMA) and sparse code multiple access (SCMA) have been developed as advanced access technologies.

[0003] Currently, the Internet, a human-centric connected network where humans generate and consume information, is evolving towards the Internet of Things (IoT), in which distributed entities (such as things) exchange and process information without human intervention. The Internet of Everything (IoE) has emerged, which is a combination of IoT technology and big data processing technology through connection with cloud servers. Since technical elements such as "sensing technology", "wired / wireless communication and network architecture", "service interface technology" and "security technology" are required for the realization of IoT, sensor networks, machine-to-machine (M2M) communication, machine-type communication (MTC), etc. have been studied recently. This IoT environment can provide intelligent Internet technology services that create new value for human life by collecting and analyzing data generated by connected things. IoT can be applied to various fields including smart homes, smart buildings, smart cities, smart cars or connected vehicles, smart grids, healthcare, smart instruments and advanced medical services through the integration and combination between existing information technology (IT) and various industrial applications.

[0004] In line with this, various attempts have been made to apply 5G communication systems to IoT networks. For example, technologies such as sensor networks, machine type (MTC) communications, and machine-to-machine (M2M) communications can be implemented through beamforming, MIMO, and array antennas. Cloud radio access network (RAN) applications, which are the above-mentioned big data processing technologies, can also be considered as an example of the fusion between 5G technology and IoT technology. Summary of the invention

[0005] According to the present disclosure, the antenna module may include: a first printed circuit board (PCB), the first PCB being stacked with at least one layer; a second PCB, the second PCB being arranged on the upper surface of the first PCB and being stacked with at least one layer; a wireless communication chip, the wireless communication chip being arranged on the upper surface of the second PCB and controlling electrical signals for radio frequency; a first structure, the first structure being arranged on the upper surface of the first PCB and surrounding the upper surface of the first PCB; a first antenna, the first antenna being arranged on the inner surface of the first structure facing the first PCB; and a feeder line, the feeder line electrically connecting the first antenna and the wireless communication chip.

[0006] According to the present disclosure, the antenna module may include: a first printed circuit board (PCB), the first PCB being stacked with at least one layer; a second PCB, the second PCB being arranged on the upper surface of the first PCB and being stacked with at least one layer; a wireless communication chip, the wireless communication chip being arranged on the upper surface of the second PCB and controlling an electrical signal for radio frequency; a first structure, the first structure being arranged on the upper surface of the first PCB and surrounding the upper surface of the first PCB; a first antenna, the first antenna being arranged on an inner surface of the first structure facing the first PCB; a second antenna, the second antenna being arranged on the inner surface of the first structure facing the first PCB; a third antenna, the third antenna being arranged on the inner surface of the first structure facing the first PCB; a fourth antenna, the fourth antenna being arranged on the inner surface of the first structure facing the first PCB; a first feeder, the first feeder electrically connecting the first antenna and the wireless communication chip; a second feeder, the second feeder electrically connecting the second antenna and the wireless communication chip; a third feeder, the third feeder electrically connecting the third antenna and the wireless communication chip; and a fourth feeder, the fourth feeder electrically connecting the fourth antenna and the wireless communication chip.

[0007] According to the present disclosure, an electronic device may include an antenna module, which may include: an antenna module, the antenna module including: a first printed circuit board (PCB), the first PCB being stacked with at least one layer; a second PCB, the second PCB being arranged on an upper surface of the first PCB and being stacked with at least one layer; a wireless communication chip, the wireless communication chip being arranged on an upper surface of the second PCB and controlling an electrical signal for radio frequency; a first structure, the first structure being arranged on an upper surface of the first PCB and surrounding the upper surface of the first PCB; a first antenna, the first antenna being arranged on an inner surface of the first structure facing the first PCB; and a feeder line, the feeder line electrically connecting the first antenna and the wireless communication chip.

[0008] According to an embodiment of the present disclosure, the length of the feeding path between the antenna and the wireless communication chip is reduced, thereby reducing the path loss in the antenna module even in the ultra-high frequency band. In addition, the performance of the antenna module can be improved by effectively dissipating the heat generated by the antenna module. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0010] Figure 1 is a diagram showing a typical antenna module structure.

[0011] Figure 2 is a diagram illustrating a structure of an antenna module in an electronic device according to an embodiment of the present disclosure.

[0012] Figure 3 is a diagram showing a structure of an antenna module according to an embodiment of the present disclosure.

[0013] Figure 4 is a diagram showing an antenna module including four RF variations according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0014] Now, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the description of the following embodiments, descriptions of technologies that are well known in the art and not directly related to the present disclosure are omitted. This is to clearly convey the subject matter of the present disclosure by omitting any unnecessary explanations.

[0015] For the same reason, some elements in the drawings are enlarged, omitted or schematically shown. Similarly, the size of each element cannot fully reflect the actual size. In the drawings, the same or corresponding elements are represented by the same reference numerals.

[0016] The advantages and features of the present disclosure and the manner in which they are achieved will become apparent with reference to the embodiments described in detail below and with reference to the accompanying drawings. However, the present disclosure may be implemented in many different forms and should not be considered to be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure is thorough and complete and fully conveys the scope of the present disclosure to those skilled in the art. The present disclosure is limited only by the scope of the claims.

[0017] It should be understood that each block of the flowchart diagram and the combination of blocks in the flowchart diagram can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer or other programmable data processing device, thereby producing a machine, so that these computer program instructions, when executed by the processor of the computer or other programmable data processing device, produce a device that implements the functions / actions specified in one or more flow charts. These computer program instructions can also be stored in a computer-usable or computer-readable memory, and these instructions can make the computer or other programmable data processing device work in a specific way, so that the instructions stored in the computer-usable or computer-readable memory produce a product of instruction means including the functions specified in one or more flow charts or block diagrams. The computer program instructions can also be loaded onto a computer or other programmable data processing device, so that a series of operable steps are performed on the computer or other programmable device to produce a computer-implemented process, so that the instructions executed on the computer or other programmable device provide steps for implementing the functions specified in one or more blocks of the flow chart and / or block diagram.

[0018] In addition, each frame in the flowchart can represent a code module, a code fragment or a code portion, and the code module, code fragment or code portion includes one or more executable instructions for implementing (one or more) specific logic functions. It should be noted that in some alternative implementations, the functions marked in the frame may occur out of order. For example, depending on the functions involved, the two frames shown in succession can actually be executed substantially at the same time, or the two frames can sometimes be executed in reverse order.

[0019] The term "unit" used herein is a software or hardware component or device that performs a specific task, such as a field programmable gate array (FPGA) or a specific application integrated circuit (ASIC). The unit can be advantageously configured to be present in an addressable storage medium and configured to execute on one or more processors. Therefore, for example, a module or unit can include components (e.g., software components, object-oriented software components, class components, and task components), processes, functions, attributes, processes, subroutines, fragments of program code, drivers, firmware, microcodes, circuits, data, databases, data structures, tables, arrays, and variables. The functionality provided in multiple components and units can be combined into fewer components and units, or divided into other components and units or modules. In addition, components and units can be implemented to operate one or more central processing units (CPUs) in a device or a secure multimedia card. In an embodiment, a specific unit can include one or more processors.

[0020] Figure 1 is a diagram showing a typical antenna module structure.

[0021] Generally, the antenna module may include a first printed circuit board (PCB) 111 stacked with at least one layer and a second PCB 121 stacked with at least one layer. Generally, the first PCB 111 and the second PCB 121 may be connected to each other through a ball grid array (BGA) 141 interposed therebetween.

[0022] In a typical antenna module, a wireless communication chip 101 may be disposed on a lower surface of a first PCB 111, and an antenna 131 for radiating radio waves may be disposed on an upper surface of a second PCB 121. The second PCB 121 may be a main PCB of the antenna module, and the first PCB 111 may be a sub-PCB of the antenna module. According to various embodiments, the accuracy of the second PCB 121 may be higher than that of the first PCB 111. The first PCB 111 and the second PCB 121 may be different in pattern accuracy or density, respectively.

[0023] The wireless communication chip 101 may control an electrical signal for generating a radio frequency. Specifically, the wireless communication chip 101 may generate a radio frequency by receiving various electrical signals (e.g., a local frequency, an intermediate frequency component, etc.) from the second PCB 121, and transmit the generated radio frequency to the antenna 131. For example, the wireless communication chip 101 may control a phase shifter or the like disposed therein to enable the antenna 131 to perform beamforming.

[0024] Figure 2 is a diagram illustrating a structure of an antenna module in an electronic device according to an embodiment of the present disclosure.

[0025] According to an embodiment, an electronic device may include at least one antenna and at least one wireless communication chip. Figure 2 The structure of sixty-four antennas and sixteen wireless communication chips in an electronic device according to an embodiment of the present disclosure is exemplarily shown. Figure 2 In this case, a single wireless communication chip can control four antennas. Figure 2 In this case, one wireless communication chip controls four radio frequency (RF) chains.

[0026] As described above, as the frequency band used for communication increases, it is expected to reduce the number of RF links controlled by one wireless communication chip. This is because as the number of RF links increases, the antenna gain loss due to the feeder may increase. Therefore, compared with typical technologies (e.g., a case where one wireless communication chip controls sixteen antennas), the present disclosure provides a technology for increasing the antenna gain value by allowing one wireless communication chip to control four antennas.

[0027] According to an embodiment, the wireless communication chip 211 may be electrically connected to the first antenna 201, the second antenna 202, the third antenna 203, and the fourth antenna 204. In various embodiments, the wireless communication chip 211 may provide an electrical signal for generating an RF frequency to each of the antennas 201, 202, 203, and 204 through a feed line corresponding to each antenna.

[0028] exist Figure 2 In order to simplify the description, reference numerals 211, 201, 202, 203 and 204 are used to indicate only one wireless communication chip and the corresponding four antennas. The description of the components indicated by the reference numerals also applies to other components not indicated by the reference numerals. Figure 2 The illustrated embodiments are exemplary only and are not to be construed as limiting the present disclosure.

[0029] Figure 3 is a diagram showing a structure of an antenna module according to an embodiment of the present disclosure.

[0030] According to an embodiment, the antenna module may include a first printed circuit board (PCB) 301 stacked with at least one layer, and a second PCB 311 disposed above the upper surface of the first PCB 301 and stacked with at least one layer. The antenna module may further include: a wireless communication chip 321 disposed on the upper surface of the second PCB 311 to control an electrical signal for a radio frequency; a first structure 361 disposed on the upper surface of the first PCB 301 to surround the upper surface of the first PCB 301; a first antenna 341 disposed on an inner surface of the first structure 361 to face the first PCB 301; and a feed line 371 electrically connecting the first antenna 341 and the wireless communication chip 321.

[0031] According to an embodiment, the first PCB 301 and the second PCB 311 may be combined with each other through a ball grid array (BGA) or a land grid array (LGA). The BGA inserted between the first PCB 301 and the second PCB 311 may provide mechanical and electrical connections between the first PCB 301 and the second PCB 311 while maintaining a uniform space between the first PCB 301 and the second PCB 311.

[0032] According to an embodiment, the first PCB 301 may be a main PCB of the antenna module and may send a frequency signal for generating power or radio frequency to the wireless communication chip 321 through the second PCB 311. For example, the first PCB 301 may send a local frequency or an intermediate frequency for generating radio frequency to the wireless communication chip 321.

[0033] According to an embodiment, the antenna module may further include a second antenna 351 disposed on an outer surface of the first structure 361. That is, the second antenna 351 may be disposed on a surface of the first structure 361 opposite to an inner surface on which the first antenna 341 is disposed.

[0034] According to an embodiment, the first antenna 341 and the second antenna 351 may be spaced apart from each other at a certain interval determined by the first structure 361. The certain interval between the first antenna 341 and the second antenna 351 may be determined based on the wavelength of radio waves to be radiated by the antenna module.

[0035] According to an embodiment, the first structure 361 may be formed of a dielectric material. According to various embodiments, the gain value of the antenna module may be increased by adjusting the dielectric constant and thickness of the first structure 361 (ie, the aforementioned interval between the first antenna and the second antenna).

[0036] According to an embodiment, the antenna module may further include a second structure 331, which is disposed on the upper surface of the second PCB 311 to surround the wireless communication chip 321 and the second PCB 311. The second structure 331 may be made of or may include a metal material for blocking electromagnetic waves. For example, the second structure 331 may be a so-called shielding can. The second structure 331 may be used as a ground layer for the first antenna 341 and / or the second antenna 351.

[0037] According to an embodiment, the second structure 331 may be connected to the upper surface of the first PCB 301 through one or more connectors 391 and 392. For example, the one or more connectors 391 and 392 may be formed of spring pins or any other equivalents.

[0038] According to an embodiment, the feed line 371 may penetrate the second structure 331 and directly connect the wireless communication chip 321 and the first antenna 341. According to another embodiment, the feed line 371 may be spaced a certain distance from the first antenna 341. That is, capacitive coupling technology may be used as a feeding method for the antenna. In this case, the spacing distance between the antenna and the feeding pad may be determined based on the radio waves to be radiated by the antenna or based on the dielectric constant of the space between the antenna and the feeding pad.

[0039] According to an embodiment, a thermal interface material (TIM) 325 may be disposed between the second structure 331 and the wireless communication chip 321. One surface of the TIM 325 may be combined with the second structure 331, and the other surface of the TIM 325 may be combined with the wireless communication chip 321.

[0040] According to an embodiment, the heat generated at the wireless communication chip 321 may be transferred to the second structure 331 through the TIM 325, thereby being dissipated to the outside of the antenna module. Figure 3 Although not shown, a heat sink or a heat sink may be combined with the second structure 331 to further improve the heat dissipation performance of the antenna module.

[0041] Figure 4 is a diagram showing an antenna module including four RF variations according to an embodiment of the present disclosure.

[0042] According to an embodiment, the antenna module may include a first PCB 401 stacked with at least one layer, and a second PCB 411 disposed on the upper surface of the first PCB 401 and stacked with at least one layer. The antenna module may further include: a wireless communication chip 421 disposed on the upper surface of the second PCB 411 to control an electrical signal for a radio frequency; and a first structure 461 disposed on the upper surface of the first PCB 401 to surround the upper surface of the first PCB 401. In addition, the antenna module may include a first antenna 441, a second antenna 442, a third antenna 443, and a fourth antenna 444, each of which is disposed on an inner surface of the first structure 461 to face the first PCB 401. Moreover, the antenna module may include a first feeder 471 electrically connecting the first antenna 441 and the wireless communication chip 421, a second feeder 472 electrically connecting the second antenna 442 and the wireless communication chip 421, a third feeder 473 electrically connecting the third antenna 443 and the wireless communication chip 421, and a fourth feeder 474 electrically connecting the fourth antenna 444 and the wireless communication chip 421. According to various embodiments, the first antenna 441, the second antenna 442, the third antenna 443, and the fourth antenna 444 may be spaced apart from each other at predetermined intervals. For example, the first antenna 441, the second antenna 442, the third antenna 443, and the fourth antenna 444 may be arranged at regular or irregular intervals.

[0043] According to an embodiment, the first PCB 401 and the second PCB 411 may be combined with each other through a ball grid array (BGA) or a land grid array (LGA). The BGA inserted between the first PCB 401 and the second PCB 411 may provide mechanical and electrical connections between the first PCB 401 and the second PCB 411 while maintaining a uniform space between the first PCB 401 and the second PCB 411.

[0044] According to an embodiment, the first PCB 401 may be a main PCB of the antenna module and may send a frequency signal for generating power or radio frequency to the wireless communication chip 421 through the second PCB 411. For example, the first PCB 401 may send a local frequency or an intermediate frequency for generating radio frequency to the wireless communication chip 421.

[0045] According to an embodiment, the antenna module may further include a fifth antenna 451, a sixth antenna 452, a seventh antenna 453, and an eighth antenna 454, each of which is respectively disposed on an outer surface of the first structure 461. That is, the fifth antenna 451 may be disposed on a surface opposite to an inner surface of the first structure 461 on which the first antenna 441 is disposed, and the sixth antenna 452 may be disposed on a surface opposite to an inner surface of the first structure 461 on which the second antenna 442 is disposed. Similarly, the seventh antenna 453 may be disposed on a surface opposite to an inner surface of the first structure 461 on which the third antenna 443 is disposed, and the eighth antenna 454 may be disposed on a surface opposite to an inner surface of the first structure 461 on which the fourth antenna 444 is disposed.

[0046] According to an embodiment, the first antenna 441 and the fifth antenna 451 may be spaced apart from each other at a specific interval determined by the first structure 361. The specific interval between the first antenna 441 and the fifth antenna 451 may be determined based on the wavelength of the radio wave to be radiated by the antenna module. The specific interval between the second antenna 442 and the sixth antenna 452, the specific interval between the third antenna 443 and the seventh antenna 453, and the specific interval between the fourth antenna 444 and the eighth antenna 454 may be similarly determined.

[0047] According to an embodiment, the first structure 461 may be made of a dielectric material. According to various embodiments, the gain value of the antenna module may be increased by adjusting the dielectric constant and thickness of the first structure 461 (ie, the aforementioned interval between the first antenna and the fifth antenna).

[0048] According to an embodiment, the antenna module may further include a second structure 431, which is disposed above the upper surface of the second PCB 411 to surround the wireless communication chip 421 and the second PCB 411. The second structure 431 may be made of or may include a metal material for blocking electromagnetic waves. For example, the second structure 431 may be a so-called shielding can. The second structure 431 may be used as a ground layer for the antenna of the antenna module.

[0049] According to an embodiment, the second structure 431 may be connected to the upper surface of the first PCB 401 through one or more connectors 491 and 492. For example, the one or more connectors 491 and 492 may be formed of spring pins or any other equivalents.

[0050] According to an embodiment, the first feeder 471 can penetrate the second structure 431 and directly connect the wireless communication chip 421 and the first antenna 441. Similarly, the second feeder 472 can penetrate the second structure 431 and directly connect the wireless communication chip 421 and the second antenna 442, the third feeder 473 can penetrate the second structure 431 and directly connect the wireless communication chip 421 and the third antenna 443, and the fourth feeder 474 can penetrate the second structure 431 and directly connect the wireless communication chip 421 and the fourth antenna 444. According to another embodiment, each of the feeders 471, 472, 473 and 474 can be spaced a certain distance from each of the antennas 441, 442, 443 and 444, respectively. That is, capacitive coupling technology can be used as a feeding method for these antennas. In this case, the spacing distance between the antenna and the feeding pad can be determined based on the radio wave to be radiated by the antenna or based on the dielectric constant of the space between each antenna and the feeding pad of each feeder.

[0051] According to an embodiment, a thermal interface material (TIM) 425 may be disposed between the second structure 431 and the wireless communication chip 421. One surface of the TIM 425 may be combined with the second structure 431, and the other surface of the TIM 425 may be combined with the wireless communication chip 421.

[0052] According to an embodiment, the heat generated at the wireless communication chip 421 may be transferred to the second structure 431 through the TIM 425, thereby being dissipated to the outside of the antenna module. Figure 4 Although not shown, a heat sink or a heat sink may be combined with the second structure 431 to further improve the heat dissipation performance of the antenna module.

[0053] Figure 3 and Figure 4The antenna module structure shown is only exemplary and should not be interpreted as limiting the present disclosure. That is, it can be at least partially modified within the ordinary technical level according to the needs of the designer. Figure 3 and Figure 4 The antenna module structure shown.

[0054] According to an embodiment, an antenna module may include: a first printed circuit board (PCB) stacked with at least one layer, a second PCB stacked with at least one layer above the upper surface of the first PCB, a wireless communication chip disposed above the upper surface of the second PCB and controlling an electrical signal for radio frequency, a first structure disposed above the upper surface of the first PCB and surrounding the upper surface of the first PCB, a first antenna disposed on an inner surface of the first structure to face the first PCB, and a feeder electrically connecting the first antenna and the wireless communication chip.

[0055] According to an embodiment, the antenna module may further include a second antenna disposed on an outer surface of the first structure, and the second antenna may be disposed on a surface opposite to an inner surface of the first structure on which the first antenna is disposed.

[0056] According to an embodiment, the first PCB and the second PCB may be combined with each other through a ball grid array (BGA), and the first PCB may transmit a frequency signal for generating power or radio frequency to the wireless communication chip through the second PCB.

[0057] According to an embodiment, the antenna module may further include a second structure disposed over the upper surface of the second PCB and surrounding the wireless communication chip and the second PCB, and the second structure may be formed of or include a metal material for blocking electromagnetic wave interference.

[0058] According to an embodiment, the second structure may be connected to the upper surface of the first PCB through one or more connectors, and the second structure may serve as a ground layer for the first antenna.

[0059] According to an embodiment, the antenna module may further include a thermal interface material (TIM) disposed between and combined with the second structure and the wireless communication chip.

[0060] According to an embodiment, the antenna module may include: a first printed circuit board (PCB) stacked with at least one layer; a second printed circuit board arranged above an upper surface of the first printed circuit board and stacked with at least one layer; a wireless communication chip arranged above an upper surface of the second PCB and controlling an electrical signal for radio frequency; a first structure arranged above an upper surface of the first PCB and surrounding an upper surface of the first PCB; a first antenna arranged on an inner surface of the first structure to face the first PCB; a second antenna arranged on an inner surface of the first structure to face the first PCB; a third antenna arranged on an inner surface of the first structure to face the first PCB; a fourth antenna arranged on an inner surface of the first structure to face the first PCB; a first feeder electrically connecting the first antenna and the wireless communication chip; a second feeder electrically connecting the second antenna and the wireless communication chip; a third feeder electrically connecting the third antenna and the wireless communication chip; and a fourth feeder electrically connecting the fourth antenna and the wireless communication chip.

[0061] According to an embodiment, the antenna module may further include: a fifth antenna arranged on the outer surface of the first structure; a sixth antenna arranged on the outer surface of the first structure; a seventh antenna arranged on the outer surface of the first structure; and an eighth antenna arranged on the outer surface of the first structure, wherein the fifth antenna may be arranged on a surface opposite to an inner surface of the first structure on which the first antenna is arranged, the sixth antenna may be arranged on a surface opposite to an inner surface of the first structure on which the second antenna is arranged, the seventh antenna may be arranged on a surface opposite to an inner surface of the first structure on which the third antenna is arranged, and the eighth antenna may be arranged on a surface opposite to an inner surface of the first structure on which the fourth antenna is arranged.

[0062] According to an embodiment, the first PCB and the second PCB may be combined with each other through a ball grid array (BGA), and the first PCB may transmit a frequency signal for generating power or radio frequency to the wireless communication chip through the second PCB.

[0063] According to an embodiment, the antenna module may further include a second structure disposed over the upper surface of the second PCB and surrounding the wireless communication chip and the second PCB, and the second structure may be formed of or include a metal material for blocking electromagnetic wave interference.

[0064] According to an embodiment, the second structure may be connected to the upper surface of the first PCB through one or more connectors, and the second structure may serve as a ground layer for the first antenna, the second antenna, the third antenna, and the fourth antenna.

[0065] According to an embodiment, the antenna module may further include a thermal interface material (TIM) disposed between and combined with the second structure and the wireless communication chip.

[0066] According to an embodiment, an electronic device may include an antenna module, which may include: a first printed circuit board (PCB) stacked with at least one layer, a second PCB arranged above an upper surface of the first PCB and stacked with at least one layer, a wireless communication chip arranged above an upper surface of the second PCB and controlling an electrical signal for radio frequency, a first structure arranged above the upper surface of the first PCB and surrounding the upper surface of the first PCB, a first antenna arranged on an inner surface of the first structure to face the first PCB, and a feeder electrically connecting the first antenna and the wireless communication chip.

[0067] According to an embodiment, the antenna module may further include a second antenna disposed on an outer surface of the first structure, and the second antenna may be disposed on a surface opposite to an inner surface of the first structure on which the first antenna is disposed.

[0068] According to an embodiment, the first PCB and the second PCB may be combined with each other through a ball grid array (BGA), and the first PCB may transmit a frequency signal for generating power or radio frequency to the wireless communication chip through the second PCB.

[0069] According to an embodiment, the antenna module may further include a second structure disposed over the upper surface of the second PCB and surrounding the wireless communication chip and the second PCB, and the second structure may be formed of or include a metal material for blocking electromagnetic wave interference.

[0070] According to an embodiment, the second structure may be connected to the upper surface of the first PCB through one or more connectors, and the second structure may serve as a ground layer for the first antenna.

[0071] According to an embodiment, the antenna module may further include a thermal interface material (TIM) disposed between and combined with the second structure and the wireless communication chip.

[0072] While the inventive concept has been particularly shown and described with reference to exemplary embodiments thereof, it will be apparent to those skilled in the art that various changes in form and details may be made thereto without departing from the spirit and scope of the inventive concept as defined in the following claims.

Claims

1. An antenna module, the antenna module include: a first printed circuit board, wherein the first printed circuit board is stacked with at least one layer; a second printed circuit board, the second printed circuit board being disposed on an upper surface of the first printed circuit board and being stacked with at least one layer; a wireless communication chip, the wireless communication chip being disposed on an upper surface of the second printed circuit board and configured to control an electrical signal for radio frequency, the upper surface of the second printed circuit board being away from the first printed circuit board; a first structure, the first structure being disposed on an upper surface of the first printed circuit board and surrounding the upper surface of the first printed circuit board; a second structure, the second structure being disposed on an upper surface of the first printed circuit board and surrounding the wireless communication chip and the second printed circuit board; a first antenna, the first antenna being disposed on an inner surface of the first structure facing the first printed circuit board; a second antenna disposed on an outer surface of the first structure; a third antenna, the third antenna being arranged on the inner surface of the first structure facing the first printed circuit board; a fourth antenna, the fourth antenna being arranged on the inner surface of the first structure facing the first printed circuit board; a fifth antenna, the fifth antenna being arranged on the inner surface of the first structure facing the first printed circuit board; a first feed line, the first feed line penetrating the second structure and directly electrically connecting the first antenna and the wireless communication chip; a second feed line, the second feed line penetrating the second structure and directly electrically connecting the third antenna and the wireless communication chip; a third feed line, the third feed line penetrating the second structure and directly electrically connecting the fourth antenna and the wireless communication chip; a fourth feed line, the fourth feed line penetrating the second structure and directly electrically connecting the fifth antenna and the wireless communication chip, and wherein the second antenna is disposed on the outer surface of the first structure opposite to the inner surface on which the first antenna is disposed, and The second structure is made of or includes a metal material for blocking electromagnetic waves, the second structure is connected to the upper surface of the first printed circuit board through a connector, and the second structure serves as a ground layer of the first antenna.

2. The antenna module according to claim 1, wherein the antenna module further comprises: include: a sixth antenna disposed on the outer surface of the first structure opposite to the inner surface of the first structure on which the third antenna is disposed; a seventh antenna disposed on the outer surface of the first structure opposite to the inner surface of the first structure on which the fourth antenna is disposed; as well as An eighth antenna is disposed on the outer surface of the first structure opposite to the inner surface of the first structure on which the fifth antenna is disposed.

3. The antenna module according to claim 1, in, The first printed circuit board and the second printed circuit board are combined by a ball grid array, and The first printed circuit board sends a frequency signal for generating power or radio frequency to the wireless communication chip through the second printed circuit board.

4. The antenna module according to claim 1, wherein the antenna module further comprises: include: A thermal interface material is disposed on an inner surface of the second structure facing the wireless communication chip and is coupled to the wireless communication chip. 5 . An electronic device comprising the antenna module according to claim 1 .

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