A double-wire cutting method and device for brittle and hard materials

Abstract

The present invention relates to the field of brittle and hard material processing, and discloses a double-wire cutting method and device for brittle and hard materials, including fixing the brittle and hard material; setting the positions of the first cutting line and the second cutting line so that the first cutting line is located ahead of the cutting feed direction relative to the second cutting line; controlling the first cutting line and the second cutting line or the brittle and hard material to move along the cutting feed direction to cut the brittle and hard material. The above technical solution includes a first cutting line and a second cutting line, and the first cutting line is located ahead of the cutting feed direction relative to the second cutting line. The brittle and hard material is cut by the first cutting line and the second cutting line, and the second cutting line can perform secondary cutting or grinding on the cutting end face formed by cutting the first cutting line, which can greatly improve the cutting effect and cutting efficiency of the brittle and hard material.

Description

Technical Field

[0001] The invention relates to the field of brittle and hard material processing, and in particular to a double-wire cutting method and device for brittle and hard materials. Background Art

[0002] Currently, diamond wire is mainly used for squaring and cutting of brittle and hard materials such as stone and silicon crystal. The wire saw is equipped with multiple cutting guide wheels to form a cutting wheel train. The diamond wire is a ring-shaped cutting wire structure with a closed head and tail. The diamond wire is arranged in the guide wheel groove of the cutting wheel train. After the cutting wheel train rotates, it drives the diamond wire to do linear motion. The cutting action is generally only performed in the lower half of the diamond wire. The middle part of the wheel train is a clearance window to avoid interference between the wheel train and the ingot. The cutting wheel train is usually driven by a linear motion module installed on the frame to feed, thereby achieving cutting.

[0003] Wire saws such as diamond wire saws have high cutting accuracy, but the cut end surface of brittle and hard materials is rough after cutting, and still requires subsequent processing such as rough grinding, fine grinding, and polishing to ensure the quality of the cut end surface, which leads to complicated cutting process of brittle and hard materials and low production efficiency.

[0004] With the advancement of processes such as pulling, the specifications of brittle and hard materials are getting larger and larger. In order to avoid interference between the cutting wheel system and the ingot, the structure of the wire saw also needs to be enlarged, which increases the cost.

[0005] For example, the patent with application number CN201780048352.6 discloses a method for cutting a silicon ingot, a method for manufacturing a silicon wafer, and a silicon wafer. Paragraph 0062 of the specification discloses that "then, in step S2, the outer periphery of the obtained silicon ingot is ground to make its diameter uniform, and then the silicon ingot is cut by the above-mentioned silicon ingot cutting method based on the present invention, and the slices are sliced ​​into a thickness of about 1 mm to obtain a silicon wafer." And paragraph 0065 discloses that "then, in step S4, the obtained silicon wafer is transported to a polishing device, and the silicon wafer is ground using an alumina polishing agent or the like."

[0006] For example, the patent with application number CN201280045340.5 discloses a method for cutting a workpiece and a wire saw, and paragraph 0079 of its specification discloses that "as described above, in the present invention, it is possible to suppress the local thinning of the workpiece at the start of cutting, especially on the wire recovery side where the groove spacing is narrow, thereby improving TTV, and therefore, the processing allowance in subsequent processes such as polishing and grinding can be reduced." The technical solutions disclosed in the above two patents both illustrate that in the prior art, the subsequent processing steps of grinding or polishing brittle and hard materials such as silicon crystals after cutting with wire saws all have the problems of complex production processes and low production efficiency. Summary of the invention

[0007] Therefore, it is necessary to provide a double-wire cutting method for brittle and hard materials to solve the technical problems of complex processing procedures and low processing efficiency of brittle and hard materials in the prior art.

[0008] To achieve the above object, the present invention provides a double-wire cutting method for brittle and hard materials, comprising the following steps:

[0009] Fixing the brittle and hard material;

[0010] Setting the positions of the first cutting line and the second cutting line so that the first cutting line is located ahead of the second cutting line in the cutting feed direction;

[0011] The first cutting line and the second cutting line or the brittle hard material are controlled to move along the cutting feed direction to cut the brittle hard material.

[0012] Furthermore, the position setting of the first cutting line and the second cutting line also includes the steps of: adjusting the position of the first cutting line or the second cutting line so that the second cutting line is offset perpendicular to the cutting feed direction, and performing secondary cutting or grinding on the cutting end face formed by cutting the first cutting line.

[0013] Further, the spacing between the first cutting line and the second cutting line is 50-1000 mm, and the step of adjusting the position of the first cutting line or the second cutting line so that the second cutting line is offset perpendicular to the cutting feed direction includes:

[0014] Controlling the first cutting line and the second cutting line to deflect relative to the cutting feed direction so that the inclination angle of the plane where the first cutting line and the second cutting line are located relative to the cutting feed direction is 0.1-5°; or

[0015] A cutting guide wheel is used to push the second cutting line in a direction perpendicular to the cutting feed direction, so that the second cutting line is close to the cutting end face formed by the first cutting line, and the cutting end face formed by cutting the first cutting line is subjected to secondary cutting or grinding.

[0016] Furthermore, the offset distance of the second cutting line along the direction perpendicular to the cutting feed direction is less than or equal to the cutting groove width of the first cutting line.

[0017] Furthermore, the first cutting line and the second cutting line are driven by the same linear motion mechanism to move along the cutting feed direction, the first cutting line and the second cutting line are single lines respectively, or the first cutting line and the second cutting line are line bodies of the same annular cutting line at different spatial positions.

[0018] Furthermore, the first cutting line and the second cutting line are installed on a cutting guide wheel, and the first cutting line and the second cutting line generate self-rotation during cutting.

[0019] In order to solve the above technical problems, the present invention also provides another technical solution:

[0020] A double-wire cutting device for brittle and hard materials, comprising:

[0021] A clamping mechanism, the clamping mechanism is used to fix the brittle and hard material;

[0022] A cutting mechanism, the cutting mechanism comprising a first cutting line and a second cutting line, the first cutting line being located ahead of the second cutting line in a cutting feed direction;

[0023] A linear motion mechanism is connected to the cutting mechanism or the clamping mechanism and is used to control the cutting mechanism or the clamping mechanism to move along the cutting feed direction to cut the brittle and hard material.

[0024] Furthermore, the cutting mechanism also includes an adjusting mechanism, which is used to adjust the position of the first cutting line or the second cutting line, so that the second cutting line is offset perpendicular to the cutting feed direction, and the cutting end face formed by the first cutting line is cut twice or polished.

[0025] Furthermore, the adjustment mechanism includes a rotation adjustment mechanism, which is connected to the mounting bracket of the cutting wheel system of the first cutting line and the second cutting line, and is used to control the deflection of the first cutting line and the second cutting line relative to the cutting feed direction, so that the second cutting line is offset in a direction perpendicular to the cutting feed direction.

[0026] Furthermore, the rotation adjustment mechanism includes the mounting bracket, the sliding bracket, the sliding rail and the sliding block, wherein the cutting guide wheels of the first cutting line and the second cutting line are mounted on the mounting bracket, and the top of the mounting bracket is movably connected to the sliding bracket through a hinge structure, so that the mounting bracket can adjust the angle with the vertical direction around the hinge structure.

[0027] Furthermore, the adjustment mechanism includes a top-pressure adjustment mechanism, which includes at least one top-pressure wheel, which is arranged relative to the cutting end face and is used to press the second cutting line along a direction perpendicular to the cutting feed direction, so that the second cutting line is offset along a direction perpendicular to the cutting feed direction.

[0028] Furthermore, the cutting mechanism includes a cutting wheel system having multiple cutting guide wheels, the first cutting line and the second cutting line are installed on the cutting guide wheels, the spacing between at least two of the multiple cutting guide wheels is adjustable, the first cutting line and the second cutting line are single lines respectively, or the first cutting line and the second cutting line are line bodies of the same annular cutting line at different spatial positions.

[0029] Different from the prior art, the above technical solution includes a first cutting line and a second cutting line, and the first cutting line is located in front of the second cutting line in the cutting feed direction. The brittle and hard materials are cut by the first cutting line and the second cutting line. The second cutting line can perform secondary cutting or grinding on the cutting end face formed by the first cutting line, which can greatly improve the cutting effect and cutting efficiency of the brittle and hard materials.

[0030] Furthermore, the above technical solution also adjusts the position of the second cutting line so that the second cutting line is offset perpendicular to the cutting feed direction, thereby effectively cutting the cutting line marks or burrs formed by the first cutting line.

[0031] Furthermore, in the above technical solution, the first cutting line and the second cutting line rotate during the cutting process, so that the first cutting line and the second cutting line contact the brittle and hard material more evenly, effectively extending the service life of the cutting line and achieving better economic benefits.

[0032] Furthermore, the distance between the cutting guide wheels of the first cutting line and the second cutting line of the above technical solution is adjustable, which can meet the cutting needs of large-sized brittle and hard materials, while ensuring that the cutting equipment has a compact structure and reduces the cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the structure of the first cutting line and the second cutting line in a specific implementation manner;

[0034] Figure 2 for Figure 1 Schematic diagram of the cross section along the AA direction;

[0035] Figure 3 It is a schematic diagram of the first cutting line and the second cutting line when cutting in a specific embodiment;

[0036] Figure 4 It is a flowchart of the steps of the double-wire cutting method for brittle and hard materials described in the specific implementation method;

[0037] Figure 5 for Figure 1 A schematic cross-sectional view of the AA direction after the first cutting line and the second cutting line are adjusted;

[0038] Figure 6is a schematic diagram of a specific embodiment of the present invention when the first cutting line and the second cutting line are cut after the first cutting line and the second cutting line are adjusted;

[0039] Figure 7 It is a schematic diagram of the three-dimensional structure of the rotation adjustment mechanism described in the specific implementation method;

[0040] Figure 8 for Figure 7 Side view of

[0041] Fig. 9 It is a three-dimensional structural schematic diagram of the top pressure adjustment mechanism described in the specific implementation method;

[0042] Fig.10 for Fig. 9 Side view of

[0043] Description of reference numerals:

[0044] 11. First cutting line;

[0045] 12. Second cutting line;

[0046] 2. Brittle and hard materials;

[0047] 21. Cutting end face;

[0048] 22. Cutting groove;

[0049] 3. Cutting guide wheel;

[0050] 31. Top pressure wheel;

[0051] 32. Install the bracket;

[0052] 321. Articulated structure;

[0053] 322. Fixed structure;

[0054] 33. Sliding bracket;

[0055] 34. Slide rail;

[0056] 341, slider;

[0057] 100, rack;

[0058] h1, the cutting groove width of the first cutting line;

[0059] h2, the cutting groove width of the first cutting line and the second cutting line;

[0060] θ, the inclination angle of the plane where the first cutting line and the second cutting line are located relative to the cutting feed direction; DETAILED DESCRIPTION

[0061] In order to explain the technical content, structural features, achieved objectives and effects of the technical solution in detail, the following is a detailed description in conjunction with specific embodiments and accompanying drawings.

[0062] See also Figures 1 to 10 , this embodiment provides a double-wire cutting method and device for brittle and hard materials. Wherein, the brittle and hard materials include but are not limited to one or more of stone, silicon crystal materials, concrete, and glass. The double-wire cutting method includes but is not limited to cutting using a first cutting wire 11 and a second cutting wire 12, wherein the first cutting wire 11 and the second cutting wire 12 can be diamond wires or shaped cutting wires made of other high-hardness materials. Depending on the different brittle and hard materials to be cut, the diameter range of the first cutting wire 11 and the second cutting wire is 0.1-1.0mm. In the double-wire cutting method, the brittle material is cut or polished by the first cutting wire and the second cutting wire at the same time, thereby improving the cutting efficiency and cutting effect.

[0063] like Figure 1 The above is a schematic diagram of the structure of the first cutting line 11 and the second cutting line 12 in a specific implementation manner. In this implementation manner, the first cutting line 11 and the second cutting line 12 are line bodies of the same annular cutting line at different spatial positions. The first cutting line 11 and the second cutting line 12 are arranged on a cutting wheel train. The cutting wheel train includes a plurality of cutting guide wheels 3. At least one of the cutting guide wheels 3 is connected to a driving device. The driving device can be a rotating power element such as an electric motor. The driving device drives the first cutting line 11 and the second cutting line to run through the cutting guide wheel 3, so as to perform a brittle and hard material cutting process.

[0064] Combination Figure 2 and Figure 3 As shown, the first cutting line 11 and the second cutting line 12 are both used to cut brittle and hard materials, the first cutting line 11 is located in front of the cutting feed direction, and the second cutting line 12 is located behind the first cutting line 11 in the cutting feed direction. Figures 1 to 3 As shown, the direction indicated by the arrow X in the figure is the cutting feed direction. During the double-line cutting process, the first cutting line 11 and the second cutting line 12 are driven by a linear motion mechanism (i.e., a cutting feed mechanism) and move together along the cutting feed direction indicated by the arrow X to the brittle hard material 2. The first cutting line 11 performs a first cut on the brittle hard material 2, and the second cutting line 12 performs a second cut or polishing on the cutting end face 21 or cutting groove 22 formed by the first cutting line 11. In some embodiments, the positions of the first cutting line 11 and the second cutting line 12 are fixed, and the linear motion mechanism is connected to a clamping device for the brittle hard material 2, and is used to drive the clamping device and the brittle hard material 2 thereon to move in the direction of the first cutting line 11 and the second cutting line 12 (i.e., Figure 1The first cutting line 11 and the second cutting line 12 are cut at a linear speed of 15-160 m / s. Preferably, the first cutting line 11 and the second cutting line 12 have an optimal linear speed of 20-120 m / s.

[0065] In the above embodiment, the first cutting line 11 and the second cutting line 12 are set to cut the same cutting position of the brittle and hard material, so two cuts can be performed in one cutting operation, and the second cutting line 12 can perform secondary cutting or grinding on the cutting line marks or burrs on the cutting end face 21 formed by the first close line 11, thereby greatly improving the flatness of the cutting end face. After double-line cutting, the cutting end face does not need to be ground or polished, or the workload of the grinding or polishing process is greatly reduced.

[0066] exist Figure 1 In the embodiment shown, the first cutting line 11 and the second cutting line 12 are the line bodies of the same annular cutting line at different spatial positions, that is, Figure 1 The lower half of the middle annular cutting line is the first cutting line 11, and the upper half is the second line body. In other embodiments, the first cutting line 11 and the second cutting line 12 can also be single lines, that is, the first cutting line and the second cutting line are respectively composed of independent cutting lines, and the first cutting line and the second cutting line are respectively provided with independent cutting wheel trains and driving devices.

[0067] like Figure 4 As shown, it is a flow chart of a double-wire cutting method for brittle and hard materials according to a specific embodiment, and the double-wire cutting method for brittle and hard materials comprises the steps of:

[0068] S401, fixing the brittle and hard material 2;

[0069] S402, setting the positions of the first cutting line 11 and the second cutting line 12 so that the first cutting line 11 is located ahead of the second cutting line 12 in the cutting feed direction;

[0070] S403, controlling the first cutting line 11 and the second cutting line 12 or the brittle hard material to move along the cutting feed direction to cut the brittle hard material.

[0071] Wherein, in step S401, the brittle and hard material 2 can be clamped and fixed by the existing clamping device of the wire saw. In step S402, the positions of the first cutting line 11 and the second cutting line 12 can be pre-set before step S401, and along the cutting feed direction, the first cutting line 11 is in front of the second cutting line 12. The first cutting line and the second cutting line can be diamond wires with a diameter of 0.1-1.0, and the spacing between the first cutting line 11 and the second cutting line 12 is 50-1000mm. The cutting length of the first cutting line and the second cutting line is 50-2000mm, that is, the first cutting line and the second cutting line can cut workpieces with a size between 50-2000mm.

[0072] In step S403, the first cutting line and the second cutting line are cut at a speed range of 15-160 m / s, and the optimal speed is 20-120 m / s. Figures 1 to 3 As shown, the cutting feed direction (i.e., the direction indicated by the arrow X in the figure) is fed from top to bottom in the vertical direction, that is, the first cutting line and the second cutting line cut the brittle and hard material from top to bottom. In other embodiments, the first cutting line 11 and the second cutting line 12 can be fed in the horizontal direction to cut the brittle and hard material, that is, the brittle and hard material is cut from one end to the other end of the horizontal direction. In addition, during cutting, a clamping mechanism for the brittle and hard material can be set to be fixed, and a linear motion mechanism drives the first cutting line and the second cutting line to feed for cutting; or, the positions of the first cutting line and the second cutting line are fixedly set, and the linear motion mechanism drives the clamping mechanism and the brittle and hard material thereon to feed in the direction of the first cutting line and the second cutting line for cutting; or, a direct motion mechanism simultaneously drives the first cutting line and the second cutting line and the clamping mechanism to move relative to each other for cutting.

[0073] In the double-wire cutting method for brittle and hard materials, the brittle and hard materials are cut by the first cutting wire and the second cutting wire. The second cutting wire can perform secondary cutting or grinding on the cutting end face formed by the first cutting wire, which can greatly improve the cutting effect and efficiency of the brittle and hard materials.

[0074] In step S403, the first cutting line and the second cutting line are installed on a cutting guide wheel, and the first cutting line and the second cutting line rotate when cutting, so that the circumference of the first cutting line and the second cutting line can evenly contact and cut the brittle and hard materials, so that the first cutting line and the second cutting line are evenly worn, effectively extending the service life of the cutting line and achieving better economic benefits.

[0075] like Figure 5 and Figure 6As shown in FIG. 1 , an embodiment of the above embodiment is improved and optimized. Different from the above embodiment, in this embodiment, not only is the first cutting line 11 arranged in front of the cutting feed direction of the second cutting line 12, but also the position of the second cutting line 12 is adjusted so that the position of the second cutting line 12 is offset in a direction perpendicular to the above cutting feed direction, that is, in the direction perpendicular to the above cutting feed direction. Figure 5 and Figure 6 The second cutting line 12 is moved a certain distance in the direction indicated by the middle arrow Y, so that the second cutting line 12 can be close to the cut end surface 21 generated by the first cutting line 11 cutting the brittle hard material 2, so that the second cutting line 12 performs secondary cutting or grinding on the cut end surface 21. In this embodiment, by adjusting the position of the second cutting line 12, the second cutting line is offset in a direction perpendicular to the cutting feed direction, so as to effectively cut the cutting line marks or burrs formed by the first cutting line, and improve the flatness of the cut end surface of the brittle hard material.

[0076] The second cutting line 12 can be controlled to be offset by a certain distance along the vertical cutting feed direction in the following manner.

[0077] like Figure 7 and Figure 8 As shown, in this specific embodiment, a rotation adjustment mechanism can be set to adjust the position of the first cutting line and the second cutting line. The rotation adjustment mechanism includes a mounting bracket 32, a sliding bracket 33, a slide rail 34 and a slider 341, wherein the cutting guide wheel 3 of the first cutting line 11 and the second cutting line 12 is mounted on the outer surface of the mounting bracket, the mounting bracket 32 ​​is arranged opposite to the sliding bracket, and the top of the mounting bracket 32 ​​is movably connected to the sliding bracket 33 through a hinge structure 321, so that the mounting bracket 32 ​​can adjust the angle with the vertical direction (i.e., the cutting feed direction) around the hinge structure 321. The sliding bracket 33 is slidably arranged on the frame 100 through the slide rail 34 and the slider 341, wherein the slide rail 34 extends in the vertical direction, so the sliding bracket 33 and the mounting bracket 32 ​​can slide in the vertical direction. In this embodiment, the vertical direction is the cutting feed direction. When cutting brittle and hard materials, the linear motion mechanism drives the rotation adjustment mechanism and the first cutting line 11 and the second cutting line 12 thereon to move from top to bottom for cutting. Moreover, during cutting, the second cutting line 12 can be made close to the cutting end face 21 formed by cutting the first cutting line 11 by adjusting the angle between the mounting bracket 32 ​​and the sliding bracket 33 (i.e., adjusting the angle between the plane where the first cutting line and the second cutting line are located and the cutting feed direction), and the line marks or burrs on the cutting end face 21 can be cut off for the second time.

[0078] The plane where the first cutting line and the second cutting line are located is inclined at a certain angle θ relative to the cutting feed direction, that is, the angle between the mounting bracket 32 ​​and the sliding bracket 33 is θ, wherein the angle θ is 0-20°, and preferably, the optimal value of the inclination angle θ of the plane where the first cutting line and the second cutting line are located relative to the cutting feed direction is 0.1-5°. In one embodiment, a fixed structure 322 is further provided between the mounting bracket 32 ​​and the sliding bracket 33 for fixing the inclination angle of the mounting bracket 32. The fixed structure 322 is provided on the side of the mounting bracket 32, and includes a positioning bar and a positioning column, a slide groove is provided on the positioning bar, the positioning column is located in the slide groove, the positioning column can be a tightening bolt, and the positioning column can slide in the slide groove or lock at any position in the slide groove.

[0079] like Fig. 9 and Fig.10 As shown, in another embodiment, a top pressure adjustment mechanism is provided to adjust the position of the second cutting line. Among them, the top pressure adjustment mechanism adds a top pressure wheel 31 on the basis of the existing cutting wheel system, and the first cutting line 11 and the second cutting line 12 are arranged on the cutting guide wheel 3 of the existing cutting wheel system, and the first cutting line 11 and the second cutting line 12 can be tensioned and driven for cutting. The structure of the top pressure wheel 31 is the same as that of the cutting guide wheel 3. The wheel surface of the top pressure wheel 31 has a wire groove. The top pressure wheel 31 is arranged relative to the cutting end face 21, that is, the top pressure wheel 31 is arranged toward the cutting end face 21, so that the top pressure wheel can press the second cutting line 12 in a direction perpendicular to the cutting feed direction (that is, in the direction indicated by the arrow Y in the figure), so that the second cutting line 12 is offset in a direction perpendicular to the cutting feed direction, so that the second cutting line 12 can effectively cut the cutting line marks or burrs formed by the first cutting line. Preferably, in order to enable the second cutting line 12 to contact the entire cutting end surface 21, the pressing wheels 31 are at least two groups, and the two groups of pressing wheels 31 are spaced apart at both ends of the cutting working area of ​​the second cutting line 12 to press the second cutting line toward the cutting end surface.

[0080] Alternatively, in another embodiment, the first cutting line and the second cutting line are formed by the same annular cutting line (eg Figure 1 As shown in the figure, there is no need to set the above-mentioned rotating adjustment mechanism or top pressure wheel. The cutting wheel system of the annular cutting line has multiple cutting guide wheels. Only by adjusting the position relationship of each cutting guide wheel 3 in the existing cutting wheel system of the wire saw, the second cutting line is offset in a direction perpendicular to the cutting feed direction so as to be close to the cutting end face 21.

[0081] Alternatively, in another embodiment, the first cutting line and the second cutting line are single lines respectively, and the above-mentioned rotation adjustment mechanism or top pressure wheel does not need to be set. The second cutting line can be offset in a direction perpendicular to the cutting feed direction simply by setting the position of the second cutting line and its cutting wheel system.

[0082] In order to ensure the cutting or grinding effect of the second cutting line on the cutting end surface, the offset distance of the second cutting line 12 along the direction perpendicular to the cutting feed direction is less than or equal to the width h1 of the cutting groove 22 of the first cutting line. Figure 6 As shown, the width of the cutting groove formed by the first cutting line 11 is h1, h2 is the width of the cutting groove formed after cutting by the first cutting line and the second cutting line, h2 is less than or equal to twice h1, wherein the distance offset by the second cutting line 12 in the direction indicated by the arrow Y is less than or equal to h1, so that during cutting, the second cutting line 12 is cut or polished on the surface of the cutting end face 21 formed by the first cutting line, rather than forming another cutting groove and cutting end face on the brittle and hard material.

[0083] Another embodiment provides a double-wire cutting device for brittle and hard materials, which is used to implement the double-wire cutting method for brittle and hard materials. The double-wire cutting device for brittle and hard materials at least includes a frame 100, a clamping mechanism, a cutting mechanism and a linear motion mechanism. The clamping mechanism can be a workpiece clamping mechanism of an existing wire saw, which is used to fix the brittle and hard material to be cut; the cutting mechanism is used to cut the brittle and hard material, wherein the cutting mechanism includes a first cutting line and a second cutting line, and the first cutting line is located in front of the cutting feed direction relative to the second cutting line; the linear motion mechanism is connected to the cutting mechanism or the clamping mechanism, and is used to control the cutting mechanism or the clamping mechanism to move along the cutting feed direction to cut the brittle and hard material.

[0084] The first cutting line 11 and the second cutting line 12 are the line bodies of the same annular cutting line at different spatial positions, that is, Figure 1 The lower half of the middle annular cutting line is the first cutting line 11, and the upper half is the second line body. In other embodiments, the first cutting line 11 and the second cutting line 12 can also be single lines, that is, the first cutting line and the second cutting line are respectively composed of independent cutting lines, and the first cutting line and the second cutting line are respectively provided with independent cutting wheel trains and driving devices.

[0085] In this embodiment, the first cutting line 11 performs the first cut on the brittle and hard material 2, and the second cutting line 12 performs a second cut or polishing on the cutting end face 21 or cutting groove 22 formed by the first cutting line 11, which can effectively remove the cutting line marks or burrs on the cutting end face, thereby greatly improving the flatness of the cutting end face. After double-line cutting, the cutting end face does not need to be ground or polished, or the workload of the grinding or polishing process is greatly reduced.

[0086] The linear speed range of the first cutting line 11 and the second cutting line 12 during cutting is 15-160 m / s. Preferably, the optimal linear speed range of the first cutting line 11 and the second cutting line 12 during cutting is 20-120 m / s.

[0087] like Figures 1 to 3 As shown, the cutting feed direction (i.e., the direction indicated by the arrow X in the figure) is fed from top to bottom in the vertical direction, that is, the first cutting line and the second cutting line cut the brittle and hard material from top to bottom. In other embodiments, the first cutting line 11 and the second cutting line 12 can be fed in the horizontal direction to cut the brittle and hard material, that is, the brittle and hard material is cut from one end to the other end of the horizontal direction. In addition, during cutting, a clamping mechanism for the brittle and hard material can be set to be fixed, and a linear motion mechanism drives the first cutting line and the second cutting line to feed for cutting; or, the positions of the first cutting line and the second cutting line are fixedly set, and the linear motion mechanism drives the clamping mechanism and the brittle and hard material thereon to feed in the direction of the first cutting line and the second cutting line for cutting; or, a direct motion mechanism simultaneously drives the first cutting line and the second cutting line and the clamping mechanism to move relative to each other for cutting.

[0088] The cutting mechanism also includes an adjusting mechanism, which is used to adjust the position of the first cutting line or the second cutting line, so that the second cutting line is offset perpendicular to the cutting feed direction, and the cutting end surface formed by cutting the first cutting line is subjected to secondary cutting or grinding.

[0089] In one embodiment, the adjustment mechanism may be the one described in the above embodiment. Figure 7 and Figure 8 The rotary adjustment mechanism shown in .

[0090] In another embodiment, the adjustment mechanism can be the one described in the above embodiment. Fig. 9 and Fig.10 The top pressure adjustment mechanism shown.

[0091] Alternatively, in another embodiment, the first cutting line and the second cutting line are formed by the same annular cutting line (eg Figure 1 As shown), the cutting wheel system of the annular cutting line has multiple cutting guide wheels, and the adjustment mechanism is only an improvement on the position of each cutting guide wheel 3 in the existing cutting wheel system of the wire saw. The adjusted position of the cutting guide wheel causes the second cutting line to be offset in a direction perpendicular to the cutting feed direction, thereby being close to the cutting end face 21.

[0092] Alternatively, in another embodiment, the first cutting line and the second cutting line are respectively single lines, and the adjustment mechanism is only improved by setting the position of the second cutting line and its cutting wheel train. After the position of the second cutting line and its cutting wheel train is improved, the second cutting line is offset in a direction perpendicular to the cutting feed direction, so as to be close to the cutting end face 21.

[0093] It should be noted that, although the above embodiments have been described in this article, the patent protection scope of the present invention is not limited thereby. Therefore, based on the innovative concept of the present invention, changes and modifications made to the embodiments described herein, or equivalent structures or equivalent process changes made using the contents of the present invention specification and drawings, directly or indirectly applying the above technical solutions to other related technical fields, are all included in the patent protection scope of the present invention.

Claims

1. A double-wire cutting method for brittle and hard materials, characterized in that: The following steps are involved: Fixing the brittle and hard material; Setting the positions of the first cutting line and the second cutting line so that the first cutting line is located ahead of the second cutting line in the cutting feed direction; Controlling the first cutting line and the second cutting line or the brittle hard material to move along the cutting feed direction to cut the brittle hard material; The setting of the positions of the first cutting line and the second cutting line also includes the steps of: adjusting the position of the first cutting line or the second cutting line so that the second cutting line is offset perpendicular to the cutting feed direction, and performing secondary cutting or grinding on the cutting end surface formed by cutting the first cutting line; The spacing between the first cutting line and the second cutting line is 50-1000 mm, and the step of adjusting the position of the first cutting line or the second cutting line so that the second cutting line is offset perpendicular to the cutting feed direction comprises: Controlling the first cutting line and the second cutting line to deflect relative to the cutting feed direction so that the inclination angle of the plane where the first cutting line and the second cutting line are located relative to the cutting feed direction is 0.1-5°; or A pressing wheel is used to press the second cutting line in a direction perpendicular to the cutting feed direction, so that the second cutting line is close to the cutting end surface formed by the first cutting line, and the cutting end surface formed by cutting the first cutting line is subjected to secondary cutting or grinding.

2. The double-wire cutting method for brittle and hard materials according to claim 1, characterized in that: The distance that the second cutting line is offset along a direction perpendicular to the cutting feed direction is less than or equal to the cutting groove width of the first cutting line.

3. The double-wire cutting method for brittle and hard materials according to claim 1, characterized in that: The first cutting line and the second cutting line are driven by the same linear motion mechanism to move along the cutting feed direction. The first cutting line and the second cutting line are single lines respectively, or the first cutting line and the second cutting line are line bodies of the same annular cutting line at different spatial positions.

4. The double-wire cutting method for brittle and hard materials according to claim 1, characterized in that: The first cutting line and the second cutting line are installed on the cutting guide wheel, and the first cutting line and the second cutting line generate self-rotation during cutting.

5. A double-wire cutting device for brittle and hard materials, characterized in that: include: A clamping mechanism, the clamping mechanism is used to fix the brittle and hard material; A cutting mechanism, the cutting mechanism comprising a first cutting line and a second cutting line, the first cutting line being located ahead of the second cutting line in a cutting feed direction; the cutting mechanism comprising a cutting wheel train having a plurality of cutting guide wheels, the first cutting line and the second cutting line being mounted on the cutting guide wheels; A linear motion mechanism, the linear motion mechanism is connected to the cutting mechanism or the clamping mechanism, and is used to control the cutting mechanism or the clamping mechanism to move along the cutting feed direction to cut the brittle and hard material; The cutting mechanism also includes an adjusting mechanism, which is used to adjust the position of the first cutting line or the second cutting line, so that the second cutting line is offset in a direction perpendicular to the cutting feed direction, and the cutting end face formed by cutting the first cutting line is subjected to secondary cutting or grinding; the adjusting mechanism includes a rotating adjusting mechanism, which is connected to the mounting bracket of the cutting wheel system of the first cutting line and the second cutting line, and is used to control the deflection of the first cutting line and the second cutting line relative to the cutting feed direction, so that the second cutting line is offset in a direction perpendicular to the cutting feed direction; or the adjusting mechanism is a top-pressing adjusting mechanism, which includes at least one top-pressing wheel, which is arranged relative to the cutting end face, and is used to press the second cutting line in a direction perpendicular to the cutting feed direction, so that the second cutting line is offset in a direction perpendicular to the cutting feed direction.

6. The double-wire cutting device for brittle and hard materials according to claim 5, characterized in that: The rotation adjustment mechanism includes the mounting bracket, the sliding bracket, the sliding rail and the sliding block, wherein the cutting guide wheels of the first cutting line and the second cutting line are mounted on the mounting bracket, and the top of the mounting bracket is movably connected to the sliding bracket through a hinge structure, so that the mounting bracket can adjust the angle with the vertical direction around the hinge structure.

7. The double-wire cutting device for brittle and hard materials according to claim 5, characterized in that: The spacing between at least two of the multiple cutting guide wheels is adjustable, the first cutting line and the second cutting line are single lines respectively, or the first cutting line and the second cutting line are line bodies of the same annular cutting line at different spatial positions.

Images