A TSV adapter plate with microchannel heat dissipation function and a preparation method thereof

Abstract

The present invention discloses a TSV adapter plate with microfluidic heat dissipation function and a preparation method thereof, which belongs to the field of integrated circuit packaging technology, including an adapter plate body, a microfluidic plate body groove is concavely provided in the adapter plate body; a microfluidic plate body formed by bonding a microfluidic inlet and outlet and a microfluidic is arranged in the microfluidic plate body groove, and the microfluidic plate body is connected to the adapter plate body through an adapter plate adhesive; an upper rewiring layer and a lower rewiring layer are respectively manufactured on the upper surface and the lower surface of the adapter plate body. The present invention embeds the microfluidic plate body into the adapter plate body to form a TSV adapter plate with an internally embedded microfluidic plate body, which makes up for the deficiency of the TSV adapter plate body being limited by the traditional heat dissipation capacity, gives the adapter plate body active heat dissipation capacity, and effectively improves the heat dissipation level of the adapter plate body. The present invention can effectively increase the heat dissipation capacity of the TSV adapter plate, realize high power density 2.5D / 3D system-level packaging, and is safe and reliable.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit packaging, and in particular to a TSV adapter plate with microchannel heat dissipation function and a preparation method thereof. Background Art

[0002] As electronic products develop towards miniaturization, high performance, and high reliability, the system integration is also increasing. In this case, the way to improve performance by further reducing the feature size of integrated circuits and the line width of interconnects is limited by the physical properties of materials and equipment processes. The traditional Moore's Law is difficult to continue to develop, so the 2.5D / 3D integration technology based on TSV is proposed.

[0003] The ITRS (International Technology Roadmap for Semiconductors) report points out that when the gate width of silicon transistors reaches 10nm, the energy density of a single high-performance chip will exceed 100W / cm 2 If high-performance chips are integrated with 2.5D / 3D high density based on TSV, high power points will be distributed in three-dimensional space, and the energy density will be the sum of the energy density of the stacked chips, which will far exceed the heat dissipation capacity of existing heat dissipation methods. How to effectively dissipate heat has become a major challenge in the development and application of 2.5D / 3D integration technology. Therefore, in order to meet the development needs of high performance and high heat dissipation of 2.5D / 3D microelectronic systems, it is urgent to develop an embedded TSV adapter plate structure with microchannel heat dissipation function. Summary of the invention

[0004] The object of the present invention is to provide a TSV adapter plate with microchannel heat dissipation function and a preparation method thereof, so as to solve the problem that the existing TSV adapter plate structure has poor heat dissipation function.

[0005] In order to solve the above technical problems, the present invention provides a TSV adapter board with microchannel heat dissipation function, comprising:

[0006] An adapter plate body, wherein the adapter plate body is concavely provided with a microfluidic plate body groove;

[0007] A microfluidic plate body is arranged in the microfluidic plate body groove;

[0008] An upper rewiring layer and a lower rewiring layer are respectively manufactured on the upper surface and the lower surface of the adapter board.

[0009] Optionally, the microfluidic channel plate body includes a microfluidic channel inlet and outlet and a microfluidic channel, and the microfluidic channel inlet and outlet and the microfluidic channel are bonded by a bonding layer.

[0010] Optionally, the depth of the microfluidic plate groove does not exceed the thickness of the adapter plate; the depth of the microfluidic inlet and outlet does not exceed the microfluidic plate groove; the thickness of the microfluidic channel does not exceed the depth of the microfluidic plate groove.

[0011] Optionally, the material of the bonding layer includes gold, copper, tin-lead, tin-silver, tin-silver-copper and organic resin.

[0012] Optionally, the microfluidic plate body is fixed in the microfluidic plate body groove by an adapter plate adhesive.

[0013] Optionally, a through hole is provided in the adapter plate body, the through hole is filled with a connector, and the upper rewiring layer and the lower rewiring layer are electrically connected via the connector.

[0014] Optionally, the material of the adapter plate includes silicon and glass.

[0015] Optionally, a plurality of array bumps are provided on the lower rewiring layer, and the array bumps are electrically connected to the lower rewiring layer.

[0016] Optionally, the structure of the microchannel includes a straight line type, an S-type and a folded line type.

[0017] The present invention also provides a method for preparing a TSV adapter plate with a microchannel heat dissipation function, comprising:

[0018] Providing a substrate, and manufacturing a plurality of adapter plates with a required pitch and aspect ratio on the substrate;

[0019] A through hole penetrating the substrate and a required microfluidic plate groove are made on each adapter plate; the size of the microfluidic plate groove is determined according to needs, and its depth does not exceed that of the adapter plate;

[0020] The substrate is re-provided to manufacture the microfluidic inlet and outlet and the microfluidic channel; the depth of the microfluidic inlet and outlet does not exceed the microfluidic plate body groove; the thickness of the microfluidic channel does not exceed the depth of the microfluidic plate body groove; the structure of the microfluidic channel includes a straight line type, an S-type and a broken line type;

[0021] Bonding the microchannel inlet and outlet and the microchannel through a bonding layer to form a microchannel plate body;

[0022] The microfluidic plate body is buried in the microfluidic plate body groove through the adapter plate adhesive body, and the connector is filled in the through hole;

[0023] An upper rewiring layer and a lower rewiring layer are respectively manufactured on the upper surface and the lower surface of the adapter board; the upper rewiring layer and the lower rewiring layer are electrically connected through a connector;

[0024] A plurality of array bumps are made on the surface of the lower rewiring layer, and the array bumps are electrically connected to the lower rewiring layer.

[0025] The present invention provides a TSV adapter plate with microfluidic heat dissipation function and a preparation method thereof, comprising an adapter plate body, wherein a microfluidic plate body groove is concavely provided in the adapter plate body; a microfluidic plate body formed by bonding a microfluidic inlet and outlet and a microfluidic is arranged in the microfluidic plate body groove, and the microfluidic plate body is connected to the adapter plate body through an adapter plate adhesive; an upper rewiring layer and a lower rewiring layer are respectively manufactured on the upper surface and the lower surface of the adapter plate body.

[0026] The present invention embeds the microfluidic plate body into the adapter plate body to form a TSV adapter plate with the microfluidic plate body embedded inside, which makes up for the deficiency of the TSV adapter plate body being limited by the traditional heat dissipation capacity, gives the adapter plate body active heat dissipation capacity, and effectively improves the heat dissipation level of the adapter plate body. The present invention can effectively increase the heat dissipation capacity of the TSV adapter plate, realize high power density 2.5D / 3D system-level packaging, and is safe and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of a TSV adapter board with microchannel heat dissipation function provided by the present invention;

[0028] Figure 2 Schematic diagram of the structure of the microfluidic plate;

[0029] Figure 3 is a schematic diagram of a transfer plate body prepared by a substrate;

[0030] Figure 4 is a schematic diagram of obtaining microfluidic inlets and outlets through substrate preparation;

[0031] Figure 5 is a schematic diagram of obtaining a microfluidic channel through substrate preparation;

[0032] Figure 6 It is a schematic diagram of placing the microfluidic plate body in the adapter plate body;

[0033] Figure 7 It is a schematic diagram of preparing an upper rewiring layer and a lower rewiring layer on the upper and lower surfaces of a transfer board. DETAILED DESCRIPTION

[0034] The following is a further detailed description of a TSV adapter plate with microchannel heat dissipation function and a preparation method thereof proposed by the present invention in combination with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer according to the following description and claims. It should be noted that the accompanying drawings are in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0035] Embodiment 1

[0036] The present invention provides a TSV adapter plate with microchannel heat dissipation function, such as Figure 1 As shown, it includes a transfer plate body 1, and the material of the transfer plate body 1 is silicon or glass. The transfer plate body 1 is concavely provided with a microfluidic plate body groove ( Figure 1 (not shown in the figure), the depth of the microfluidic plate body groove does not exceed the thickness of the adapter plate body 1. The microfluidic plate body 4 is fixedly arranged in the microfluidic plate body groove by the adapter plate adhesive 8, forming a TSV adapter plate with the microfluidic plate body buried inside, giving the adapter plate active heat dissipation capability, effectively improving the heat dissipation level of the adapter plate, and meeting the high performance and high heat dissipation packaging requirements of 2.5D / 3D microelectronic systems.

[0037] like Figure 2 The figure shows a schematic diagram of the structure of a microfluidic plate body 4, wherein the microfluidic plate body 4 includes a microfluidic inlet and outlet 5 and a microfluidic channel 6, wherein the microfluidic inlet and outlet 5 and the microfluidic channel 6 are bonded together by a bonding layer 7. The structure of the microfluidic channel 6 can be a straight line, an S-shaped, a zigzag line, or other shapes. The material of the bonding layer 7 includes gold, copper, tin-lead, tin-silver, and tin-silver-copper. The depth of the microfluidic inlet and outlet 5 does not exceed the microfluidic plate body groove 3; the thickness of the microfluidic channel 6 does not exceed the depth of the microfluidic plate body groove 3.

[0038] Please continue reading Figure 1 , an upper rewiring layer 9 and a lower rewiring layer 11 are respectively manufactured on the upper and lower surfaces of the adapter board body 1. A through hole 2 is provided in the adapter board body 1, and a connector 10 is filled in the through hole 2. The upper rewiring layer 9 and the lower rewiring layer 11 are electrically connected through the connector 10. A through hole 2 is provided in the adapter board body 1, and a connector 10 is filled in the through hole 2. The upper rewiring layer 9 and the lower rewiring layer 11 are electrically connected through the connector 10. A plurality of array bumps 12 are provided on the lower rewiring layer 11, and the array bumps 12 are electrically connected to the lower rewiring layer 11.

[0039] Embodiment 2

[0040] The present invention provides a method for preparing a TSV adapter plate with a microchannel heat dissipation function, comprising the following steps:

[0041] like Figure 3 As shown, a substrate 13 is provided, and the material of the substrate 13 is silicon, glass or other materials; a plurality of transfer plates 1 distributed in an array with a required pitch and aspect ratio are manufactured on the substrate 13 by a conventional TSV process;

[0042] A through hole 2 is made on each adapter plate 1, and the through hole 2 penetrates the substrate 13. The required microfluidic plate groove 3 is made on each adapter plate 1 by conventional etching process, such as Figure 3 As shown; the size of the microfluidic plate groove 3 is determined according to needs, and its depth does not exceed the thickness of the adapter plate 1;

[0043] like Figure 4 As shown, a substrate 13 is provided again, and the material of the substrate 13 is silicon, glass or other materials; a conventional etching process is used to manufacture the microchannel inlet and outlet 5 of the required size on the substrate 13. Figure 4 In the embodiment, a plurality of microchannel inlets and outlets 5 distributed in an array are obtained on the substrate 13, and independent microchannel inlets and outlets 5 are obtained by conventional dicing process, and the depth of the microchannel inlets and outlets 5 does not exceed the depth of the microchannel plate body groove 3;

[0044] like Figure 5 As shown, a substrate 13 is provided again, and the material of the substrate 13 is silicon, glass or other materials; a microchannel 6 with a required structure and aspect ratio is manufactured on the substrate 13 by using a conventional etching process. Figure 5 In the embodiment, a plurality of microfluidic channels 6 distributed in an array are obtained on the substrate 13, and independent microfluidic channels 6 are obtained by cutting through a conventional dicing process, the thickness of the microfluidic channels 6 does not exceed the depth of the microfluidic channel plate groove 3, and the structure of the microfluidic channels 6 is a straight line, an S-shaped, a folded line, etc.

[0045] See also Figure 2 A bonding layer 7 is made on the surface of the microchannel inlet and outlet 5 and the microchannel 6 through electroplating, printing and bonding processes, and the microchannel inlet and outlet 5 and the microchannel 6 are bonded through the bonding layer 7 to form an independent microchannel plate body 4 through bonding processes such as hot pressing welding and reflow welding. Figure 2 In the embodiment, the size of the microfluidic plate body 4 does not exceed the microfluidic plate body groove 3; the thickness of the bonding layer 7 is determined according to the bonding layer material, bonding process and product requirements, and the material of the bonding layer 7 can be gold, copper, tin-lead, tin-silver, tin-silver-copper and organic resin and other materials.

[0046] like Figure 6 As shown, Figure 2 The microfluidic plate body 4 shown is embedded in the microfluidic plate body groove 3, and the microfluidic plate body 4 is fixedly bonded to the adapter plate body 1 through the adapter plate bonding body 8. The material of the adapter plate bonding body 8 is a common bonding material such as bonding glue and alloy sheet. Figure 6 In the example, the through hole 2 of the adapter plate 1 can be filled with a connector 10 by a filling process, and the connector 10 fills the through hole 2. Specifically, the connector 10 can be filled with a process commonly used in the technical field, and the specific process will not be repeated here;

[0047] like Figure 7As shown, an upper rewiring layer 9 and a lower rewiring layer 11 are respectively manufactured on the upper surface and the lower surface of the adapter board 1 by photolithography but not limited to the photolithography process; the upper rewiring layer 9 and the lower rewiring layer 11 are electrically connected through a connector 10; the upper rewiring layer 9 covers the microfluidic channel board 4;

[0048] like Figure 1 As shown, laser drilling is used but not limited to the laser drilling process to form a through hole at the position of the microchannel inlet and outlet 5, and a standard ball planting process is used to make an array of bumps 12 on the lower rewiring layer 11 to realize the signal lead-out of the adapter board 1. The size of the array of bumps 12 is determined according to the diameter and pitch of the pads on the surface of the adapter board 1. The material of the array of bumps 12 can be tin-lead, tin-silver, tin-silver-copper and other materials.

[0049] The manufacturing method provided by the present invention embeds a microfluidic plate body 4 with efficient active heat dissipation function into the adapter plate body 1, thereby effectively increasing the heat dissipation capacity of the adapter plate body 1, thereby meeting the high-performance and high-heat dissipation packaging requirements of the 2.5D / 3D microelectronic system.

[0050] The above description is only a description of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Any changes or modifications made by a person skilled in the art in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A TSV adapter board with microchannel heat dissipation function, characterized in that: include: An adapter plate body (1), wherein a microfluidic plate body groove (3) is concavely provided in the adapter plate body (1); A microfluidic plate body (4) is arranged in the microfluidic plate body groove (3); An upper rewiring layer (9) and a lower rewiring layer (11) are respectively manufactured on the upper surface and the lower surface of the adapter plate body (1); The microfluidic channel plate body (4) comprises a microfluidic channel inlet and outlet (5) and a microfluidic channel (6), wherein the microfluidic channel inlet and outlet (5) and the microfluidic channel (6) are bonded together via a bonding layer (7); The depth of the microfluidic plate groove (3) does not exceed the thickness of the adapter plate (1); the depth of the microfluidic inlet and outlet (5) does not exceed the microfluidic plate groove (3); the thickness of the microfluidic channel (6) does not exceed the depth of the microfluidic plate groove (3); The material of the bonding layer (7) includes gold, copper, tin-lead, tin-silver, tin-silver-copper or organic resin.

2. The TSV adapter board with microchannel heat dissipation function as claimed in claim 1, characterized in that: The microfluidic plate body (4) is fixed in the microfluidic plate body groove (3) via an adapter plate adhesive (8).

3. The TSV adapter board with microchannel heat dissipation function as claimed in claim 1, characterized in that: The adapter plate body (1) is provided with a through hole (2), the through hole (2) is filled with a connector (10), and the upper rewiring layer (9) and the lower rewiring layer (11) are electrically connected via the connector (10).

4. The TSV adapter board with microchannel heat dissipation function as claimed in claim 1, characterized in that: The material of the adapter plate (1) includes silicon or glass.

5. The TSV adapter board with microchannel heat dissipation function as claimed in claim 1, characterized in that: A plurality of array bumps (12) are provided on the lower rewiring layer (11), and the array bumps (12) are electrically connected to the lower rewiring layer (11).

6. The TSV adapter board with microchannel heat dissipation function as claimed in claim 1, characterized in that: The structure of the microchannel (6) includes a straight line type, an S-type or a folded line type.

7. A method for preparing a TSV adapter plate with microchannel heat dissipation function, characterized in that: include: Providing a substrate, and manufacturing a plurality of adapter plates with a required pitch and aspect ratio on the substrate; A through hole penetrating the substrate and a required microfluidic plate groove are made on each adapter plate; the size of the microfluidic plate groove is determined according to needs, and its depth does not exceed that of the adapter plate; The substrate is re-provided to manufacture the microfluidic inlet and outlet and the microfluidic channel; the depth of the microfluidic inlet and outlet does not exceed the microfluidic plate body groove; the thickness of the microfluidic channel does not exceed the depth of the microfluidic plate body groove; the structure of the microfluidic channel includes a straight line type, an S-type or a folded line type; Bonding the microchannel inlet and outlet and the microchannel through a bonding layer to form a microchannel plate body; The microfluidic plate body is buried in the microfluidic plate body groove through the adapter plate adhesive body, and the connector is filled in the through hole; An upper rewiring layer and a lower rewiring layer are respectively manufactured on the upper surface and the lower surface of the adapter board; the upper rewiring layer and the lower rewiring layer are electrically connected through a connector; A plurality of array bumps are made on the surface of the lower rewiring layer, and the array bumps are electrically connected to the lower rewiring layer.

Images