A micro device and electronic device capable of tolerance

Abstract

The present invention provides a micro device and electronic device with tolerance, and relates to the field of antenna technology. The micro device with tolerance includes a microwave dielectric substrate; the microwave dielectric substrate includes a first base surface, a second base surface, a first end surface, and a second end surface; a first electrode layer with conductivity and a second electrode layer with conductivity are arranged on the first base surface and the second base surface, and there is a blank area between the first electrode layer and the second electrode layer on both the first base surface and the second base surface, the position of the first electrode layer on the first base surface corresponds to the position of the second electrode layer on the second base surface, and the position of the second electrode layer on the first base surface corresponds to the position of the first electrode layer on the second base surface; the first electrode layer is connected to the signal feed line, and the second electrode layer is connected to the ground line. The electronic device includes an electronic device body and a micro device with tolerance; the micro device with tolerance is arranged on the electronic device body. The technical effect of high production yield is achieved.

Description

Technical Field

[0001] The present invention relates to the field of antenna technology, and in particular to a micro device and electronic equipment with tolerance. Background Art

[0002] Benefiting from the rapid progress of wireless communication technology, personalized mobile electronic products such as mobile phones, wireless local area networks (WLAN) and satellite navigation (GPS) have also flourished. The vast market competition and the pursuit of higher quality by consumers have made mobile electronic products focus on pursuing unique designs in terms of appearance in addition to standardized electrical characteristics. In contrast, the antenna, which is an essential element for receiving / transmitting signals, has gradually changed from the original exposed design to an embedded hidden design. However, the purpose of the antenna hidden in the small space inside the casing for the sake of appearance is still to provide electronic products with good and clear signals. The most common hidden antennas are monopole antennas (Monopole) and PIFA (Planar Inverted F Antenna). Monopole antennas have a simple structure and are cheap, but due to the limitation of antenna efficiency, the antenna length cannot be effectively reduced. Therefore, the device looks less beautiful when installed on the mobile device body, and the market usage is gradually decreasing. In addition, the PIFA antenna is also called a planar inverted F antenna. It can be hidden inside a mobile device and change its flat geometric shape with the device. It also has a wider transmitting structure and a larger operating bandwidth, so it is widely used in the market.

[0003] However, there are errors in equipment debugging, and printing deviation is prone to occur during the production process. When printing deviation occurs, it will cause the frequency of the antenna to shift, resulting in an increase in the defective rate.

[0004] Therefore, providing a micro device with high yield and tolerance becomes an important technical problem to be solved by those skilled in the art. Summary of the invention

[0005] The purpose of the present invention is to provide a micro device and an electronic device with tolerance to errors, so as to alleviate the technical problem of high defect rate in the production process in the prior art.

[0006] In a first aspect, an embodiment of the present invention provides a micro device with tolerance, connected to at least one signal feed line and at least one ground line to transmit and receive signals, including a microwave dielectric substrate;

[0007] The microwave dielectric substrate comprises a first base surface, a second base surface, a first end surface and a second end surface, the first base surface is opposite to the second base surface, and the first end surface is opposite to the second end surface;

[0008] A first electrode layer having conductivity and a second electrode layer having conductivity are disposed on the first base surface and the second base surface, and a blank area exists between the first electrode layer and the second electrode layer on both the first base surface and the second base surface, a position of the first electrode layer on the first base surface corresponds to a position of the second electrode layer on the second base surface, and a position of the second electrode layer on the first base surface corresponds to a position of the first electrode layer on the second base surface;

[0009] The first electrode layer is connected to the signal feeding line, and the second electrode layer is connected to the ground line.

[0010] In combination with the first aspect, an embodiment of the present invention provides a possible implementation of the first aspect, wherein a first end electrode connected to the first electrode layer is arranged on the above-mentioned first end face, a blank area exists between the second electrode layer and the first end electrode, and the first end electrode is connected to the signal feed line.

[0011] In combination with the first aspect, an embodiment of the present invention provides a possible implementation of the first aspect, wherein the first end electrode is further connected to the ground line.

[0012] In combination with the first aspect, an embodiment of the present invention provides a possible implementation of the first aspect, wherein the first terminal electrode is disposed on both the first base surface and the second base surface;

[0013] The first end electrodes on the first base surface and the second base surface are both connected to the first end electrode on the first end surface.

[0014] In combination with the first aspect, an embodiment of the present invention provides a possible implementation of the first aspect, wherein a second end electrode connected to the second electrode layer is arranged on the above-mentioned second end face, a blank area exists between the first electrode layer and the second end electrode, and the second end electrode is connected to the ground wire.

[0015] In combination with the first aspect, an embodiment of the present invention provides a possible implementation of the first aspect, wherein the second terminal electrode is disposed on both the first base surface and the second base surface;

[0016] The second terminal electrodes on the first base surface and the second base surface are both connected to the second terminal electrode on the second end surface.

[0017] In combination with the first aspect, an embodiment of the present invention provides a possible implementation of the first aspect, wherein the material of the above-mentioned microwave dielectric matrix includes ceramic material, glass material, magnetic material, polymer material or a composite material of the above materials.

[0018] In combination with the first aspect, an embodiment of the present invention provides a possible implementation of the first aspect, wherein the first electrode layer and the second electrode layer are both conductive metal electrode layers or conductive non-metal electrode layers.

[0019] In combination with the first aspect, an embodiment of the present invention provides a possible implementation of the first aspect, wherein the first electrode layer and the second electrode layer are respectively arranged on the first base surface and the second base surface by adopting a thin film process, a thick film process or adhering to a conductive sheet.

[0020] In a second aspect, an embodiment of the present invention provides an electronic device, including an electronic device body and the micro-device capable of tolerance;

[0021] The micro device capable of tolerance is arranged on the electronic device body.

[0022] Beneficial effects:

[0023] The present invention provides a micro device with tolerance, which is connected to at least one signal feed line and at least one ground line to send and receive signals, and comprises a microwave dielectric substrate; the microwave dielectric substrate comprises a first base surface, a second base surface, a first end surface and a second end surface, the first base surface is opposite to the second base surface, and the first end surface is opposite to the second end surface; a first electrode layer with conductivity and a second electrode layer with conductivity are arranged on the first base surface and the second base surface, and there is a blank area between the first electrode layer and the second electrode layer on both the first base surface and the second base surface, the position of the first electrode layer on the first base surface corresponds to the position of the second electrode layer on the second base surface, and the position of the second electrode layer on the first base surface corresponds to the position of the first electrode layer on the second base surface; the first electrode layer is connected to the signal feed line, and the second electrode layer is connected to the ground line.

[0024] Specifically, the first electrode layer and the second electrode layer on the first base surface and the second base surface correspond to each other, so that the first electrode layer and the second electrode layer overlap to form a sandwich space with a capacitor function, thereby receiving a signal. The first electrode layer and the second electrode layer are arranged on both the first base surface and the second base surface, which can improve the yield rate in the production process. When printing the electrode layer, the first electrode layer and the second electrode layer of the first base surface are completed first, and then the microwave dielectric substrate is turned over to complete the first electrode layer and the second electrode layer of the second base surface. Through such a setting, even if there is a printing offset in the printing tool, the overlapping area of ​​the first electrode layer on the first base surface and the second electrode layer on the second base surface, as well as the overlapping area of ​​the second electrode layer on the first base surface and the first electrode layer on the second base surface can still be guaranteed, thereby ensuring that the micro device with tolerance will not have frequency offset and improving the yield rate.

[0025] The present invention provides an electronic device, comprising an electronic device body and a micro device with tolerance; the micro device with tolerance is arranged on the electronic device body. Compared with the prior art, the electronic device has the above advantages, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A schematic diagram of the structure of a micro device with tolerance provided by an embodiment of the present invention.

[0028] icon:

[0029] 100 - microwave dielectric substrate; 110 - first base surface; 120 - second base surface; 130 - first end surface; 140 - second end surface;

[0030] 210 - first electrode layer; 220 - second electrode layer; 230 - blank area;

[0031] 310 - first terminal electrode; 320 - second terminal electrode. DETAILED DESCRIPTION

[0032] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0035] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] The present invention is further described in detail below through specific embodiments in conjunction with the accompanying drawings.

[0037] See also Figure 1 As shown, this embodiment provides a micro device with tolerance, connected to at least one signal feed line and at least one ground line to send and receive signals, including a microwave dielectric substrate 100; the microwave dielectric substrate 100 includes a first base surface 110, a second base surface 120, a first end surface 130 and a second end surface 140, the first base surface 110 is opposite to the second base surface 120, and the first end surface 130 is opposite to the second end surface 140; the first base surface 110 and the second base surface 120 are both provided with a conductive first electrode layer 210 and a conductive The second electrode layer 220 is provided on the first base surface 110, and there is a blank area 230 between the first electrode layer 210 and the second electrode layer 220 on both the first base surface 110 and the second base surface 120. The position of the first electrode layer 210 on the first base surface 110 corresponds to the position of the second electrode layer 220 on the second base surface 120, and the position of the second electrode layer 220 on the first base surface 110 corresponds to the position of the first electrode layer 210 on the second base surface 120. The first electrode layer 210 is connected to the signal feeding line, and the second electrode layer 220 is connected to the ground line.

[0038] Specifically, the first electrode layer 210 and the second electrode layer 220 on the first base surface 110 and the second base surface 120 correspond to each other, so that the first electrode layer 210 and the second electrode layer 220 overlap to form an interlayer space with a capacitor function, thereby receiving signals. The first electrode layer 210 and the second electrode layer 220 are both arranged on the first base surface 110 and the second base surface 120, which can improve the yield rate in the production process. When printing the electrode layer, the first electrode layer 210 and the second electrode layer 220 of the first base surface 110 are completed first, and then the microwave dielectric substrate 100 is turned over to complete the first electrode layer 210 and the second electrode layer 220 of the second base surface 120. Through such a setting, even if there is a printing offset in the printing tool, the overlapping area of ​​the first electrode layer 210 on the first base surface 110 and the second electrode layer 220 on the second base surface 120, as well as the overlapping area of ​​the second electrode layer 220 on the first base surface 110 and the first electrode layer 210 on the second base surface 120 can still be guaranteed, thereby ensuring that the micro device with tolerance will not have frequency offset, thereby improving the yield rate.

[0039] Among them, the micro-device with tolerance provided in this embodiment forms a sandwich space with capacitor function by overlapping the first electrode layer 210 and the second electrode layer 220, thereby receiving signals, but the surface size of the stacked part will directly affect the signal receiving frequency of the antenna. Because there are errors in the debugging of the printing equipment, the structural method in the prior art will cause the position of the first base surface 110 and the second base surface 120 on the microwave dielectric substrate 100 to be printed and offset during production, thereby causing the size of the sandwich space with capacitor function formed by the overlap of the first electrode layer 210 and the second electrode layer 220 to deviate, thereby causing the antenna to have a frequency offset, and ultimately causing the antenna yield to decrease. The micro-device with tolerance provided in the present embodiment is provided with the first electrode layer 210 and the second electrode layer 220 on both the first base surface 110 and the second base surface 120, and the first electrode layer 210 on the first base surface 110 is arranged opposite to the second electrode layer 220 on the second base surface 120, and the second electrode layer 220 on the first base surface 110 is arranged opposite to the electrode layer on the first base surface 110. During production, the first electrode layer 210 and the second electrode layer 220 on the first base surface 110 are processed first, and then the microwave dielectric substrate 100 is turned over, and then the first electrode layer 210 and the second electrode layer 220 on the second base surface 120 are processed. With such an arrangement, even if the printing equipment has a printing deviation, it will not affect the sandwich space with a capacitor function formed by the overlapping of the first electrode layer 210 and the second electrode layer 220. Therefore, it will not affect the receiving signal of the micro-device with tolerance provided in the present embodiment, and the frequency deviation phenomenon will not occur, thereby ensuring the yield rate.

[0040] Among them, the microwave dielectric substrate 100 can be set to a rectangular shape, the first electrode layer 210 and the second electrode layer 220 can be set to a rectangular shape, and the first base surface 110 is covered by the first electrode layer 210 and the second electrode layer 220 (in the length direction and the width direction) except for the blank area 230 between the first electrode layer 210 and the second electrode layer 220. Therefore, when the printing device in the prior art is offset, it will not affect the quality of the micro-device with tolerance provided by this embodiment. In the antenna in the prior art, an electrode layer is separately set on the upper surface of the substrate, and an electrode layer is separately set on the lower surface. According to the setting requirements, the length direction of the upper and lower surfaces of the substrate in the prior art cannot be fully covered by the electrode layer (full coverage will cause a short circuit). Therefore, when the printing device in the prior art is offset, the electrode layers of the antenna structure in the prior art will be close to or away from each other, thereby causing the receiving frequency of the antenna to change, resulting in the antenna being unqualified. The above-mentioned length direction and width direction are shown in the figure.

[0041] See also Figure 1 As shown, in an optional solution of this embodiment, a first end electrode 310 connected to the first electrode layer 210 is disposed on the first end surface 130, a blank area 230 exists between the second electrode layer 220 and the first end electrode 310, and the first end electrode 310 is connected to the signal feeding line.

[0042] Specifically, the first end electrode 310 is printed on the first end surface 130 , so as to connect the first base surface 110 and the first electrode layer 210 of the second base surface 120 together, and then connected to the signal feeding line through the first end electrode 310 .

[0043] See also Figure 1 As shown, in an optional solution of this embodiment, the first end electrode 310 is also connected to the ground line.

[0044] Specifically, the first end electrode 310 may also be connected to a ground line.

[0045] See also Figure 1 As shown, in an optional solution of this embodiment, first terminal electrodes 310 are disposed on both the first base surface 110 and the second base surface 120 ; the first terminal electrodes 310 on the first base surface 110 and the second base surface 120 are connected to the first terminal electrode 310 on the first end surface 130 .

[0046] Specifically, the first terminal electrode 310 is disposed on both the first base surface 110 and the second base surface 120 , which can improve the connection reliability between the first terminal electrode 310 and the first electrode layer 210 on both the first base surface 110 and the second base surface 120 .

[0047] See also Figure 1As shown, in an optional solution of this embodiment, a second end electrode 320 connected to the second electrode layer 220 is disposed on the second end surface 140, a blank area 230 exists between the first electrode layer 210 and the second end electrode 320, and the second end electrode 320 is connected to the ground line.

[0048] Specifically, the second terminal electrode 320 is printed on the second end surface 140 , so as to connect the first base surface 110 and the second electrode layer 220 on the second base surface 120 together, and then connected to the ground line through the second terminal electrode 320 .

[0049] See also Figure 1 As shown, in an optional solution of this embodiment, second terminal electrodes 320 are disposed on both the first base surface 110 and the second base surface 120 ; the second terminal electrodes 320 on the first base surface 110 and the second base surface 120 are connected to the second terminal electrode 320 on the second end surface 140 .

[0050] Specifically, the second terminal electrode 320 is disposed on both the first base surface 110 and the second base surface 120 , which can improve the connection reliability between the second terminal electrode 320 and the second electrode layer 220 on both the first base surface 110 and the second base surface 120 .

[0051] In an optional solution of this embodiment, the material of the microwave dielectric substrate 100 includes ceramic material, glass material, magnetic material, polymer material or a composite material of the above materials.

[0052] Specifically, the microwave dielectric substrate 100 may be made of ceramic material, glass material, magnetic material, polymer material or a composite material of the above materials, and those skilled in the art may select the material according to their needs.

[0053] In an optional solution of this embodiment, both the first electrode layer 210 and the second electrode layer 220 are made of conductive metal electrode layers or conductive non-metal electrode layers.

[0054] Specifically, both the first electrode layer 210 and the second electrode layer 220 may be a conductive metal electrode layer or a conductive non-metal electrode layer, and those skilled in the art may select one according to their needs.

[0055] In an optional solution of this embodiment, the first electrode layer 210 and the second electrode layer 220 are respectively disposed on the first base surface 110 and the second base surface 120 by using a thin film process, a thick film process or by attaching a conductive sheet.

[0056] Specifically, the first electrode layer 210 and the second electrode layer 220 can be produced by a thin film process, a thick film process or by attaching a conductive sheet, and those skilled in the art can make their own selections as needed.

[0057] This embodiment provides an electronic device, including an electronic device body and a micro device capable of tolerance; the micro device capable of tolerance is arranged on the electronic device body.

[0058] Specifically, the electronic device body can be a mobile phone, a computer, a tablet computer, a walkie-talkie, or other device that needs to receive messages.

[0059] Specifically, the electronic device provided in this embodiment has the above advantages compared with the prior art, which will not be described in detail here.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A micro device with tolerance, connected to at least one signal feed line and at least one ground line to send and receive signals, characterized in that: include: A microwave dielectric substrate (100); The microwave dielectric substrate (100) comprises a first base surface (110), a second base surface (120), a first end surface (130) and a second end surface (140), wherein the first base surface (110) is opposite to the second base surface (120), and the first end surface (130) is opposite to the second end surface (140); A first electrode layer (210) having conductivity and a second electrode layer (220) having conductivity are disposed on the first base surface (110) and the second base surface (120), and a blank area (230) exists between the first electrode layer (210) and the second electrode layer (220) on both the first base surface (110) and the second base surface (120), the position of the first electrode layer (210) on the first base surface (110) corresponds to the position of the second electrode layer (220) on the second base surface (120), and the position of the second electrode layer (220) on the first base surface (110) corresponds to the position of the first electrode layer (210) on the second base surface (120); The first electrode layer (210) is connected to the signal feeding line, and the second electrode layer (220) is connected to the ground line; A first end electrode (310) connected to the first electrode layer (210) is disposed on the first end surface (130), a blank area (230) exists between the second electrode layer (220) and the first end electrode (310), and the first end electrode (310) is connected to the signal feed line; The first terminal electrode (310) is also connected to the ground wire; The first terminal electrode (310) is disposed on both the first base surface (110) and the second base surface (120); The first end electrodes (310) on the first base surface (110) and the second base surface (120) are both connected to the first end electrode (310) on the first end surface (130); A second end electrode (320) connected to the second electrode layer (220) is disposed on the second end surface (140), a blank area (230) exists between the first electrode layer (210) and the second end electrode (320), and the second end electrode (320) is connected to the ground line; The second terminal electrode (320) is disposed on both the first base surface (110) and the second base surface (120); The second end electrodes (320) on the first base surface (110) and the second base surface (120) are both connected to the second end electrode (320) on the second end surface (140).

2. The micro-device capable of tolerance according to claim 1, characterized in that: The material of the microwave dielectric matrix (100) includes ceramic material, glass material, magnetic material, polymer material or a composite material of the above materials.

3. The micro-device capable of tolerance according to claim 1, characterized in that: The first electrode layer (210) and the second electrode layer (220) are both made of conductive metal electrode layers or conductive non-metal electrode layers.

4. The micro-device capable of tolerance according to claim 3, characterized in that: The first electrode layer (210) and the second electrode layer (220) are respectively arranged on the first base surface (110) and the second base surface (120) by using a thin film process, a thick film process or by adhering to a conductive sheet.

5. An electronic device, characterized in that: An electronic device comprising an electronic device body and a micro device capable of tolerance as claimed in any one of claims 1 to 4; The micro device capable of tolerance is arranged on the electronic device body.

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