Planar coil diaphragm of loudspeaker, and loudspeaker

Abstract

The present invention discloses a loudspeaker, comprising a vibration component, a magnet component, a circuit cover component and a shell, wherein the vibration component and the magnet component are encapsulated between the circuit cover component and the shell, and the magnet component is arranged on the lower surface of the circuit cover component; the vibration component comprises a diaphragm and at least one group of support ring components; the circuit cover component comprises a positive pole for inputting alternating audio current of the loudspeaker and a negative pole for outputting; the magnet component comprises at least one group of outer magnetic ring and inner magnetic ring combination. It has the following advantages: it solves the problem of how to effectively connect the internal end points of the closed coil with the outside, the membrane area of ​​the product after adopting this solution is utilized to the maximum extent, the vibration mass is light, the connection is reliable, the assembly process is simple, it is suitable for mass industrial automation production, the product performance is excellent, the cost is low, and it is very suitable for use as a loudspeaker for electronic products such as mobile phones, headphones, speakers, computers, and televisions.

Description

Technical Field

[0001] The invention relates to a planar coil diaphragm of a loudspeaker, a loudspeaker and application thereof, belonging to the technical field of electroacoustics. Background Art

[0002] Loudspeakers, commonly known as "horns", are electroacoustic transducers that are widely used in devices or facilities that need to produce sound, such as speakers, headphones, mobile phones, wearable devices, robots, and home appliances. Current loudspeakers include dynamic loudspeakers, electrostatic loudspeakers, and planar coil diaphragm loudspeakers based on their working principles.

[0003] Dynamic speakers are the most widely used speakers at present because of their simple structure, mature technology and good performance. However, the disadvantages of dynamic speakers are that the transient characteristics are not good due to the large vibration mass of the coil, etc.; the uneven mass distribution and the asymmetry of the BL electromagnetic driving force lead to different degrees of swing vibration; because on the membrane surface that pushes the air to make sounds, only the bonding part of the coil and the membrane is completely synchronized (the soft membrane surface is not rigid enough and deforms), and the other parts of the membrane surface cannot vibrate synchronously with the coil, so the membrane surface produces split vibrations at different frequencies (the membrane surface that pushes the air to make sounds is not synchronized at a certain moment), resulting in serious peaks and valleys in the frequency response curve. Such problems lead to high product distortion, poor speaker frequency response, and great challenges to improving acoustic performance.

[0004] The structure of traditional dynamic speakers is as follows: Figure 1 As shown in the figure, D1-diaphragm body; D2-magnetic (metal) sheet; D3-coil; D4-magnetic cover (magnetic metal sheet); D5-magnet; D6-coil and membrane bonding part, the dynamic speaker includes D3 coil. The coil of the traditional dynamic speaker is a "cylindrical" three-dimensional structure. This "cylindrical" coil is subjected to electromagnetic force in the magnetic gap and reciprocates in the vertical direction, driving the diaphragm body to push the air to produce sound.

[0005] Electrostatic speakers such as Figure 2As shown, the advantages of electrostatic speakers are: because the membrane is extremely light and has good transient response, excellent resolution, and very good high-frequency response characteristics, which can exceed 40KHz; because of the large-area plane force drive, the distortion is very low, and the sound is natural and comfortable. But the disadvantages are: because the driving force is inversely proportional to the square of the distance from the membrane to the plate, the electrostatic force acting on the electrostatic membrane is F = ε*S*(U2 / d2), ε is the dielectric constant, S is the membrane area, U is the signal voltage between the membrane and the plate, and d is the distance between the membrane and the plate. The electrostatic force is proportional to the square of the signal voltage and inversely proportional to the square of the distance from the membrane to the plate, so the low-frequency sound is insufficient; the alternating audio signal must be boosted to several hundred volts to produce a sound that consumers can accept. The wide-band, low-distortion, and high-boosting ratio boosting process greatly increases the product cost, which is why the speakers and headphones using electrostatic speakers cost tens of thousands of yuan or even hundreds of thousands of yuan.

[0006] Planar coil diaphragm speakers, as the name implies, are coils that are unfolded into a plane. They are no longer a three-dimensional "cylindrical" structure like dynamic coil speakers, but a closed curve structure similar to a circle or serpentine line. This serpentine line closed curve coil is attached to the largest possible surface of the diaphragm body and becomes a vibrating body with the diaphragm body. Magnets are set on one or both sides of the plane of the serpentine line closed curve diaphragm body. The magnetic lines of force of the magnets usually pass vertically through the straight part of the coil in the plane direction of the coil diaphragm body. When an alternating audio current is passed through the coil, the coil in the orthogonal magnetic field is subjected to the vertical electromagnetic force and drives the diaphragm body to move back and forth near the equilibrium position, thereby pushing the air to produce sound.

[0007] Planar coil speakers such as Figure 3 As shown in the figure, the magnetization direction of the P1 magnet is, as shown in the figure, the direction of the arrow on the left is the N pole, and the direction on the right is the S pole; P2 magnet, a total of 6; P3-magnet gap (sound entry and exit channel); P4 flat diaphragm body; P5 on the membrane support; P6 under the membrane support; P7 The direction of the current in the coil is perpendicular to the paper surface and outward (pointing to the reader); P8 The direction of the current in the coil is perpendicular to the paper surface and inward (away from the reader); P9 The planar coil group on the lower surface of the membrane; P10 The magnet on the lower side of the membrane, a total of 6.

[0008] Because the coil of the planar coil speaker is unfolded into a plane and adhered to the entire plane of the diaphragm body, this structural change brings the following advantages: First, the coil and the diaphragm body are both thin layers with very small mass and extremely light vibration mass, so the transient and high-frequency characteristics are very good; second, the coil is evenly distributed on the membrane surface. When there is an AC audio current, the entire larger surface of the membrane will be affected by the electromagnetic force and vibrate synchronously, avoiding or reducing swing and split vibration; third, the heat of the coil plane distribution is easy to dissipate (the coil of the dynamic speaker is stacked vertically in many layers, so the heat is not easy to dissipate), avoiding various negative effects caused by coil heating, such as the softening of the membrane causing the vibration system to be unstable; fourth, there is no need for an additional separate power amplifier boost drive like an electrostatic speaker, the overall cost of the product is low, and it is easy to reduce costs and achieve mass sales. Planar coil speakers not only carry forward the advantages of the small mass and planar drive of the planar diaphragm body of electrostatic speakers, but also avoid the design and structural defects of dynamic speakers, and solve the shortcomings of difficult driving and high cost of electrostatic speakers. They are the next generation of directional products and solutions for upgrading the technology of traditional electric field devices.

[0009] However, planar coil speakers also have their disadvantages, mainly because the planar coil has low working efficiency in the magnetic field formed by the planar magnet. In order to improve efficiency, the greater the electromagnetic force, the better. According to the electromagnetic force formula F=BLI (where B is the magnetic field strength, L is the coil line length in the magnetic field, and I is the alternating current), it is necessary to increase the effective magnetic field strength B as much as possible, and at the same time maximize the coil line length L in the effective magnetic field. There are currently two implementation schemes for planar coil speakers. One is the bar magnet scheme, in which the planar coil is a serpentine routing; the other is the concentric circle magnet scheme, in which the planar coil is a concentric circle, or a nearly concentric circle, or a spiral structure. Both structures will face the challenge of how to lead out the coil outlet or inlet while maximizing the coil routing without affecting the free vibration of the membrane. So far, there is no effective solution. This not only restricts the improvement of the performance of planar coil speakers, but also makes the production efficiency of such products low. The material cost and production cost of the product are high. Finally, the high price limits the promotion of the product, making a product that is most likely to be promoted on a large scale become a high-priced niche product.

[0010] The methods for solving the shortcomings of planar coil speakers in the prior art include the following aspects:

[0011] 1. The patent application number of "CN204206457" and the patent name of "Spiral Supercharged Planar Diaphragm Body Loudspeaker" applied by the applicant "Guangdong Oppo Mobile Communications Co., Ltd." adopts a circular coaxial magnetic ring solution. The 8th paragraph of the patent specification discloses that "Specifically, when observing the vibration system in the same direction, if the front spiral winding plate is wound in a clockwise direction, the back spiral winding plate is wound in a counterclockwise direction; if the front spiral winding plate is wound in a counterclockwise direction, the back spiral winding plate is wound in a clockwise direction." The 14th paragraph of the specification discloses that "Specifically, a through hole penetrating the two sides of the diaphragm body is provided at the center of the diaphragm body, and the first end of the front spiral winding plate and the first end of the back spiral winding plate are connected by spot welding through the through hole to form a passage." The attached patent specification discloses that "Specifically, the vibration system is observed in the same direction, if the front spiral winding plate is wound in a clockwise direction, the back spiral winding plate is wound in a counterclockwise direction; if the front spiral winding plate is wound in a counterclockwise direction, the back spiral winding plate is wound in a clockwise direction." Fig.10 It is a patented membrane structure. To summarize the solution of this patent, if the front spiral winding plate 120 is wound from the outside to the inside in a clockwise direction, the end of the coil must be in the middle of the membrane. If the back spiral winding plate 130 is wound in a counterclockwise direction, the end of the coil must also be in the middle of the membrane. The middle ends of the two coils on the two surfaces of the membrane are connected up and down by "spot welding", so that the two coils on the upper and lower surfaces are connected in series from the middle circuit (maximizing the line length L). When viewed in the same direction, the spiral coils on the two surfaces are wound in opposite directions to achieve the same current direction in the coils in the same magnetic field at the same position, so that they are subjected to forces in the same direction, achieving force superposition instead of reaction forces.

[0012] The spot welding technology used in the above patent refers to a welding method that uses a cylindrical electrode to form a welding spot between the contact surfaces of two overlapping workpieces during welding. During spot welding, pressure is first applied to make the workpieces in close contact, and then the current is turned on. The contact between the workpieces melts under the action of resistance heat, and a welding spot is formed after cooling. In order to reduce the vibration mass, the membrane and coil thickness of the planar coil speaker are extremely thin. The membrane thickness in actual products is often less than 10 microns, that is, 1x10-5 meters. Spot welding on both sides of such a thin membrane is very easy to break down, or it cannot be welded, resulting in extremely low product yield and extremely high product cost. At the same time, there are holes in the membrane. When the product vibrates, the connection point is easy to disconnect, resulting in product failure, resulting in serious poor sound output of the speaker. The winding directions on the two sides of the membrane are opposite, which is not conducive to consistent processing and improved production efficiency.

[0013] 2. The patent application filed by the applicant "Jettech Technology Co., Ltd." is named "Planar Voice Coil Loudspeaker" and the publication number is "CN110278514A". In paragraph 64 of its specification, it states that " Fig. 9 FIG. 2 is a schematic diagram of a second embodiment of a planar diaphragm body coil. Fig. 9As shown, a back coil 35 is further provided on the second surface 23, and the back coil 35 is electrically connected to the planar coil 30. The back coil 35 can be connected to the planar coil 30 at the periphery of the planar coil diaphragm 20. It can also be connected to each other through the connecting hole 25 of the planar coil diaphragm 20. The connecting hole 25 passes through the first surface 21 and the second surface 23, and a conductive glue can be provided in the connecting hole 25 so that the back coil 35 is electrically connected to the planar coil 30. Fig. 9 As shown, the planar coil diaphragm 20 is a circular diaphragm body, the connecting hole 25 is opened at the center of the circular diaphragm body, and the back coil 35 is electrically connected to the planar coil 30 by conductive glue. Figure 8 and Fig. 9 The back coil 35 and the planar coil 30 are both Archimedean spiral coils. Thus, when a current signal is introduced into the planar coil 30, it can flow out of the back coil 35, or vice versa.

[0014] From the above invention content, it can be known that the connection method of the coils on the upper and lower surfaces of the membrane of this patent is to connect the coils on the upper and lower surfaces of the membrane through the hole in the center of the membrane, and use conductive glue to connect the wire ends of the coils on the upper and lower surfaces at the center. The disadvantage of this connection method is that the center of the membrane is the part with the largest amplitude (the amplitude of this circular membrane with fixed periphery is the largest in the middle when vibrating, and the amplitude is smaller towards the outer edge, and the minimum amplitude is zero at the edge), and the tension consistency of the membrane will be destroyed when the hole is punched in the middle of the membrane; when the conductive glue is used to bond the coils on the upper and lower surfaces, because there is a through hole in the middle, the glue in the hole is suspended, which is easy to cause loose bonding; the conductive glue has thickness, which will reduce the vibration space of the membrane and increase the vibration mass.

[0015] The patent application filed by the applicant "Guoguang Electric Co., Ltd." with the name "A flat speaker and headphones" and the authorization announcement number "CN209964299U" adopts a method similar to the above-mentioned patent of Jettech Co., Ltd. on how to connect the spiral coils on the upper and lower surfaces of the membrane in series, that is, drilling a hole in the middle of the membrane, and connecting the center ends of the spiral coils on the upper and lower surfaces of the membrane in series through conductive glue. Similarly, the challenges faced by this solution are the same as those of the above-mentioned patent of Jettech Co., Ltd.

[0016] 3. The patent application of the applicant "Shenzhen Jiruidelong Electronic Technology Co., Ltd." with the patent name "Planar Diaphragm Body Speaker" and the authorization announcement number "CN207475867U" adopts a solution of serpentine routing of the coil wire to match the bar magnet. From the invention content of this patent, for the coil with serpentine routing of the coil wire, because the coil is a conductor, the crossing between the conductors will short-circuit, so the starting end and the ending end of the coil always have one end inside the winding coil and the other end outside the winding coil, which requires an additional space, as shown in the attached manual. Figure 2The wiring winding segment 106 in the wiring winding segment is used to provide extra space for the two ends to cooperate with other components and connect the two ends to the external circuit. This not only wastes space, makes it difficult to miniaturize the product, but also increases the material and production costs of the product. In addition, because the coil length in the wiring winding segment 106 is not under the effective magnetic field, this part of the coil only increases the wire length, that is, it only increases the resistance and reduces the current, thereby reducing the product output sound and reducing the product performance. This patented solution only uses one side of the membrane, that is, there is a coil only on one side of the membrane. Compared with the double-sided wiring solution, the sensitivity will undoubtedly drop by 3dBSPL. However, if a double-sided wiring solution is used, how to connect the coils on the upper and lower surfaces of the membrane is also a major challenge that has not been effectively solved.

[0017] In summary, the existing technical solutions for planar coil speakers, whether it is a spiral coil solution or a serpentine routing coil solution, the coil must be a group of closed concentric circle-like curves, or spirals, or serpentine curves connected in series end to end. This closed line group always has a "starting end" and an "ending end"; and because the coil is usually a conductor, any two coils cannot intersect, which results in one of the two endpoints always being inside the closed coil and the other endpoint being outside the closed coil; the endpoint outside the closed coil is very easy to connect to an external circuit, such as a PCB pad, but how to export the endpoint inside the closed coil and connect it to an external circuit faces great challenges. From the above analysis, the current spot welding solution, the solution of perforating the middle of the membrane and connecting the coil ends on the upper and lower surfaces of the membrane through conductive glue, and the solution of serpentine routing of the coil all have their own shortcomings.

[0018] Regardless of the coil solution, how to effectively export the endpoints inside the closed coil and reliably connect them to the external circuit while achieving the best acoustic performance while improving production efficiency and reducing product costs has become a technical bottleneck that needs to be urgently resolved in the industry. Summary of the invention

[0019] The technical problem to be solved by the present invention is to provide a planar coil diaphragm of a speaker, a speaker and its application in view of the above shortcomings, which solves the problem of how to effectively connect the internal end points of a closed coil with the outside. After adopting this solution, the membrane area of ​​the product is utilized to the maximum extent, the vibration mass is light, the connection is reliable, the assembly process is simple, and it is suitable for large-scale industrial automated production. The product has excellent performance and low cost, and is very suitable for use as a speaker for electronic products such as mobile phones, headphones, speakers, computers, and televisions.

[0020] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0021] A planar coil diaphragm of a loudspeaker comprises a diaphragm body, a coil is attached to at least one of the upper and lower surfaces of the diaphragm body, an end point located inside the coil and an end point located outside the coil are respectively provided at both ends of the coil, an insulating layer is attached to the coil, a conductive layer is attached to the insulating layer, and the conductive layer is used to lead the end point located inside the coil to be conductively connected to the outside of the coil;

[0022] The coil and two ends of the coil are both conductors capable of conducting electricity.

[0023] Furthermore, a front coil and a back coil are attached to the upper surface and the lower surface of the diaphragm body respectively, and the front coil and the back coil are arranged in a mirror-symmetrical manner with the central plane of the diaphragm body as the symmetry plane.

[0024] Furthermore, a front insulating layer is attached to the front coil, and the front insulating layer is located between a second endpoint provided at one end inside the front coil and a third endpoint provided on the upper surface of the diaphragm body. The front insulating layer forms an insulating area between the second endpoint and the third endpoint. The second endpoint is located inside the front coil, and the third endpoint is located outside the front coil.

[0025] Furthermore, a reverse insulating layer is attached to the reverse coil, and the reverse insulating layer is located between a fifth endpoint provided at one end inside the reverse coil and a sixth endpoint provided on the lower surface of the diaphragm body, and the reverse insulating layer forms an insulating area between the fifth endpoint and the sixth endpoint, the fifth endpoint is located inside the reverse coil, and the sixth endpoint is located outside the reverse coil.

[0026] Furthermore, a first endpoint is provided at one end outside the front coil, and the first endpoint is located outside the front coil; a fourth endpoint is provided at one end outside the back coil, and the fourth endpoint is located outside the back coil.

[0027] Furthermore, a first conductive layer is provided on the surface of the front insulating layer, and two ends of the first conductive layer are respectively connected to the second end point and the third end point;

[0028] A second conductive layer is disposed on the surface of the reverse insulating layer, and two ends of the second conductive layer are respectively connected to a fifth endpoint and a sixth endpoint.

[0029] Furthermore, the coil can be formed by first physically vapor depositing a thin conductive layer on the upper and lower surfaces of the diaphragm body respectively, and then laser etching the upper and lower surfaces of the diaphragm body with the conductive coating to form the coil.

[0030] Furthermore, the insulating material of the insulating layer may be a vacuum vapor deposited Parylene insulating material.

[0031] Furthermore, the conductive layer is formed by inkjet printing or printing conductive ink on the insulating layer.

[0032] A speaker comprises a vibration assembly, a magnet assembly, a circuit cover assembly and a housing, wherein the vibration assembly and the magnet assembly are encapsulated between the circuit cover assembly and the housing, and the magnet assembly is arranged on the lower surface of the circuit cover assembly;

[0033] The vibration assembly includes a diaphragm and at least one set of support ring assemblies;

[0034] The circuit cover assembly includes a positive electrode for inputting alternating audio current of the loudspeaker and a negative electrode for outputting;

[0035] The magnet assembly at least comprises a combination of an outer magnetic ring and an inner magnetic ring, wherein the outer magnetic ring is arranged around the outside of the inner magnetic ring, the outer magnetic ring and the inner magnetic ring are arranged coaxially, and the surface of the outer magnetic ring is plated with a conductive coating.

[0036] Further, the vibration assembly includes an upper support ring assembly and a lower support ring assembly, the diaphragm is flatly attached to the upper surface of the lower support ring assembly, the upper support ring assembly is pressed on the diaphragm, and the diaphragm is fixed between the upper support ring assembly and the lower support ring assembly;

[0037] The upper support ring assembly comprises an upper support ring, on the lower surface of which an upper ring second welding pad and an upper ring third welding pad are fixed, the position between the lower ring second welding pad and the lower ring third welding pad corresponds to the position between the fourth endpoint and the sixth endpoint, the upper ring second welding pad is connected to the first endpoint, and the upper ring third welding pad is connected to the third endpoint;

[0038] The lower support ring assembly includes a lower support ring, and a lower ring first welding pad, a lower ring second welding pad and a lower ring third welding pad are fixed on the upper surface of the lower support ring, the lower ring first welding pad and the lower ring second welding pad are connected by a lower ring wire, the position between the lower ring second welding pad and the lower ring third welding pad corresponds to the position between the fourth endpoint and the sixth endpoint, the lower ring second welding pad is connected to the fourth endpoint, and the lower ring third welding pad is connected to the sixth endpoint.

[0039] Furthermore, an upper ring first pad is fixed on the upper surface of the upper support ring, and a penetrating upper ring first metallized hole is provided between the upper ring first pad and the upper ring second pad;

[0040] A lower ring fourth pad is fixed on the lower surface of the lower support ring, and a penetrating lower ring second metallized hole is provided between the lower ring fourth pad and the lower ring third pad.

[0041] Furthermore, the upper support ring is provided with an upper ring second metallized hole on the side where the upper ring third pad is provided, and the upper ring second metallized hole is connected to the upper ring third pad;

[0042] A first lower ring pad is also fixed on the upper surface of the lower support ring, and a first lower ring metallized hole is provided on the side of the lower support ring where the first lower ring pad is provided, and the first lower ring metallized hole is connected to the first lower ring pad;

[0043] The second metallized holes in the upper ring are connected to the first metallized holes in the lower ring through an inter-hole conductor.

[0044] Furthermore, the magnet assembly includes a radial magnetized magnetic ring, a vertical outer magnetic ring and a vertical inner magnetic ring, the radial magnetized magnetic ring is fixed in the shell, the radial magnetized magnetic ring is in close contact with the vibration assembly, the shell is provided with a shell sound outlet hole, and the middle inner hole of the radial magnetized magnetic ring is coaxially arranged with the shell sound outlet hole;

[0045] The surface coating of the vertical outer magnetic ring is in close contact with the supporting assembly;

[0046] An insulating ring is provided between the outer side wall of the vertical outer magnetic ring and the inner wall of the shell, and the height of the insulating ring is not higher than the height of the vertical outer magnetic ring.

[0047] Furthermore, the vibration component is arranged between the radial magnetized magnetic ring and the vertical outer magnetic ring and the vertical inner magnetic ring. The magnetizing direction of the radial magnetized magnetic ring is radial magnetization, and the magnetizing directions of the vertical outer magnetic ring and the vertical inner magnetic ring are vertical magnetization. The magnetizing direction of the vertical outer magnetic ring is opposite to the magnetizing direction of the vertical inner magnetic ring. The direction of the magnetic field generated by the upper surface of the radial magnetized magnetic ring and the lower surface of the diaphragm is the same as the direction of the magnetic field generated by the lower surfaces of the two vertical magnetic rings and the upper surface of the diaphragm.

[0048] Furthermore, the circuit cover assembly includes an epoxy resin substrate, the upper surface and the lower surface of the epoxy resin substrate are covered with copper foil, the copper foil on the upper surface of the epoxy resin substrate is partially removed to form an etching groove and a large area of ​​grounding copper foil, the copper foil in the etching groove is removed to form an insulating area, the etching groove is surrounded by a positive electrode and a negative electrode, the positive electrode and the negative electrode are separated from the large area of ​​grounding copper foil by the etching groove, a plurality of negative electrode connection bridges are provided on the etching groove surrounding the negative electrode, the negative electrode connection bridges connect the negative electrode to the large area of ​​grounding copper foil, and a shell curling edge is formed on the top of the shell, and the shell curling edge is in close contact with the large area of ​​grounding copper foil.

[0049] Furthermore, the upper surface copper foil of the epoxy resin substrate is partially removed to form a lower surface positive electrode, the large-area grounding copper foil is provided with an air leakage hole penetrating the epoxy resin substrate, and the positive electrode is provided with a positive electrode metallization hole penetrating the lower surface positive electrode, and the positive electrode metallization hole connects the positive electrode with the circuit of the lower surface positive electrode;

[0050] The lower surface positive pole is in close contact with the magnet assembly.

[0051] Furthermore, a conductor ring is provided in the shell, the shell is in close contact with the conductor ring, the radial magnetized magnetic ring is placed in the middle hole of the conductor ring, and the conductor ring is in close contact with the support assembly.

[0052] Furthermore, the magnet assembly also includes a magnetic conductive sheet, the vertical outer magnetic ring and the vertical inner magnetic ring are fixed on the magnetic conductive sheet, and the vertical outer magnetic ring, the vertical inner magnetic ring and the magnetic conductive sheet are coaxially arranged.

[0053] An application of a loudspeaker, the loudspeaker can also be used as a microphone.

[0054] The present invention adopts the above technical solution, and has the following technical effects compared with the prior art:

[0055] 1. A coil is attached to at least one of the upper and lower surfaces of the diaphragm body. The two ends of the coil are respectively provided with an endpoint located inside the coil and an endpoint located outside the coil. An insulating layer is attached to the coil, and a conductive layer is attached to the insulating layer. The conductive layer is used to lead the endpoint located inside the coil to be conductively connected to the outside of the coil. The advantages of this solution are as follows:

[0056] 1) All operations are performed on the membrane surface, avoiding damage to the membrane by existing technical solutions such as spot welding or perforation bonding. The diaphragm body of this solution has stable tension and good consistency, which can effectively avoid split vibration or swing vibration, and the speaker distortion is low.

[0057] 2) The insulation layer is made of Parylene insulation material, which is usually a few microns thick and very thin. The film tension and quality are almost unaffected. It has excellent adhesion and insulation properties, and is the future technical direction of insulation coatings.

[0058] 3) The conductive layer is printed by inkjet printing or printing conductive ink, which is simple, high-precision, and easy to operate in industrial batches and efficiently. The cured conductive layer has a small mass, high adhesion, and excellent conductive properties, representing the future direction of 3D printing technology.

[0059] 2. The front coil and the back coil are attached to the upper and lower surfaces of the diaphragm body respectively. The front coil and the back coil are mirror-symmetrically arranged with the central plane of the diaphragm body as the symmetry plane (that is, the coil on the upper surface is copied and translated to the bottom of the membrane without changing the direction). In this way, the metal on the surface of the membrane can be formed in one step by laser etching. The coils using this solution have high adhesion firmness, good product consistency, and the production efficiency is doubled or more.

[0060] 3. There are two vertically magnetized concentric magnetic rings on the top of the diaphragm, and a radially magnetized magnetic ring under the diaphragm. This design makes the coil on the surface of the diaphragm have a stronger uniform transverse magnetic field. According to Faraday's electromagnetic force formula F = BLI, the stronger the magnetic sound, the greater the force on the diaphragm, the higher the efficiency of the speaker, and the better the performance. At the same time, the uniform magnetic field can significantly reduce the second and third harmonic distortion caused by the nonlinearity of the magnetic field, and ultimately make the speaker have lower distortion and more pleasant sound.

[0061] 4. The magnet assembly can provide a magnetic field and also serve as a conductive component; the outer shell has both supporting and protective functions as well as conductive functions; the same material can achieve multiple functions, improve material utilization, simplify operations, and reduce product costs.

[0062] In summary, the present invention proposes a comprehensive solution for how to effectively connect the internal endpoints of a closed coil with the outside, and how to use magnets, housings, etc. to transmit electrical signals. The membrane area of ​​the product after adopting this solution is utilized to the maximum extent, the vibration mass is light, the connection is reliable, and a new way of multifunctional use of materials is achieved by using structural parts such as magnets and housings. The assembly process is simple, and finally all parts are wrapped by a rolling sealing process. This method is suitable for large-scale industrial automated production, has excellent product performance, and is low in cost, and is very suitable for use as a speaker for electronic products such as mobile phones, headphones, speakers, computers, and televisions. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for the specific embodiments or the description of the prior art. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn according to the actual scale.

[0064] Figure 1 It is a structural schematic diagram of a traditional dynamic loudspeaker in the background technology of the present invention;

[0065] Figure 2 It is a structural schematic diagram of an electrostatic speaker in the background technology of the present invention;

[0066] Figure 3 It is a schematic diagram of the structure of a planar coil speaker in the background technology of the present invention;

[0067] Figure 4 Schematic diagram of the cross-sectional structure of the planar coil loudspeaker in Embodiment 1 of the present invention;

[0068] Figure 5 An exploded view of the planar coil loudspeaker in Embodiment 1 of the present invention;

[0069] Figure 6 It is a front view of a printed circuit board in Embodiment 1 of the present invention;

[0070] Figure 7 This is a reverse view of the printed circuit board in Example 1 of the present invention;

[0071] Figure 8 is a cross-sectional view of a printed circuit board in Embodiment 1 of the present invention;

[0072] Fig. 9It is an assembly diagram of the diaphragm body and the upper and lower support rings in Example 1 of the present invention;

[0073] Fig.10 This is an exploded view of the diaphragm body and the upper and lower support rings in Example 1 of the present invention (viewed from top to bottom);

[0074] Fig.11 This is an exploded view of the diaphragm body and the upper and lower support rings in Example 1 of the present invention (viewed from bottom to top);

[0075] Fig.12 It is a front view of the diaphragm body with only the coil in Embodiment 1 of the present invention;

[0076] Fig.13 It is a rear view of the diaphragm body with only the coil in Embodiment 1 of the present invention;

[0077] Fig.14 It is a front view of the diaphragm body with an insulating layer attached to the coil surface in Example 1 of the present invention;

[0078] Fig.15 This is a rear view of the diaphragm body with an insulating layer attached to the coil surface in Example 1 of the present invention;

[0079] Fig.16 It is a front view of the planar coil diaphragm in Example 1 of the present invention;

[0080] Fig.17 This is a rear view of the planar coil diaphragm in Example 1 of the present invention;

[0081] Fig.18 It is a cross-sectional view of the magnetization direction of the magnet assembly in Example 1 of the present invention;

[0082] Fig.19 This is a flow chart of the internal current loop of the planar coil speaker in Embodiment 1 of the present invention;

[0083] Fig. 20 This is a schematic diagram of the structure of a speaker with a single-sided magnetic circuit PCB for sound output in Example 2 of the present invention;

[0084] Fig.21 A cross-sectional view of a speaker with a single-sided magnetic circuit PCB for sound output in Embodiment 2 of the present invention;

[0085] Fig. 22 A cross-sectional view of a loudspeaker with a single-sided magnetic circuit housing for emitting sound in Embodiment 3 of the present invention;

[0086] Fig.23 A cross-sectional view of a loudspeaker with a symmetrical radial magnetic circuit housing for sound output in Embodiment 4 of the present invention;

[0087] Fig.24 It is a cross-sectional view of a loudspeaker with two vertical magnetic rings symmetrical in the upper and lower parts in Embodiment 5 of the present invention;

[0088] Fig.25 It is a front view of the serpentine routing coil in Example 6 of the present invention;

[0089] Fig.26 This is an exploded view of the serpentine routing coil in Example 6 of the present invention. DETAILED DESCRIPTION

[0090] Example 1

[0091] like Figure 4 , Fig.12 and Fig.13 As shown, a planar coil diaphragm loudspeaker includes a diaphragm 5, and the diaphragm 5 includes a diaphragm body 50. The upper surface and the lower surface of the diaphragm body 50 are respectively attached with a front coil 52 and a back coil 52b. The front coil 52 and the back coil 52b are mirror-symmetrically arranged with the central plane of the diaphragm body 50 as the symmetry plane.

[0092] The front coil 52 and the back coil 52b are arranged in a spiral pattern.

[0093] The front coil 52 has a first endpoint 51 and a second endpoint 54 at both ends, the first endpoint 51 is located outside the front coil 52, and the second endpoint 54 is located inside the front coil 52; the back coil 52b has a fourth endpoint 51b and a fifth endpoint 54b at both ends, the fourth endpoint 51b is located outside the back coil 52b, and the fifth endpoint 54b is located inside the back coil 52b.

[0094] The upper surface of the diaphragm body 50 is further provided with a third endpoint 53, and the third endpoint 53 is located outside the front coil 52. The lower surface of the diaphragm body 50 is further provided with a sixth endpoint 59, and the sixth endpoint 59 is located outside the back coil 52b.

[0095] The front coil 52, the back coil 52b, the first terminal 51, the second terminal 54, the fourth terminal 51b, the fifth terminal 54b, the third terminal 53 and the sixth terminal 59 are all conductors capable of conducting electricity.

[0096] like Fig.14 As shown, a front insulating layer 55 is attached to the front coil 52 between the second terminal 54 and the third terminal 53 , and the front insulating layer 55 completely covers the front coil 52 between the second terminal 54 and the third terminal 53 , forming an insulating area thereon.

[0097] like Fig.15 As shown, a reverse insulating layer 57 is attached between the fifth terminal 54b and the sixth terminal 59, and the reverse insulating layer 57 completely covers the reverse coil 52b between the fifth terminal 54b and the sixth terminal 59, forming an insulating area thereon.

[0098] The front insulating layer 55 and the back insulating layer 57 are preferably in the shape of long strips, but are not limited to the shape of long strips, and may also cover the entire coil surface, or a large part of it.

[0099] When the front insulating layer 55 and the back insulating layer 57 are arranged symmetrically, the speaker has the best effect.

[0100] like Fig.16 As shown, a first conductive layer 56 is disposed on the surface of the front insulating layer 55 , and two ends of the first conductive layer 56 are respectively connected to the second terminal 54 and the third terminal 53 .

[0101] like Fig.17 As shown, a second conductive layer 58 is disposed on the surface of the reverse insulating layer 57 , and two ends of the second conductive layer 58 are connected to the fifth terminal 54 b and the sixth terminal 59 respectively.

[0102] The diaphragm body 5 is usually a plastic film with a thickness of several microns to tens of microns. The film material is usually PEN, PET, PPS, etc. It can also be a multi-layer composite material diaphragm body.

[0103] The front coil 52 and the back coil 52b can be formed by first physically vapor depositing a thin conductive layer on the upper and lower surfaces of the diaphragm body respectively, such as using a magnetron sputtering coating process, and then laser or chemically etching the upper and lower surfaces of the diaphragm body with the conductive coating to form a spiral coil, wherein the coating material can be metal materials such as aluminum, nickel, silver, gold, or two or more of the above metals, or a conductive non-metallic material such as graphene.

[0104] The front coil 52 and the back coil 52b may also be formed by printing or spraying other conductive materials on the surface of the diaphragm body 50, or by pasting processed coil conductive materials, such as aluminum foil, on the surface of the diaphragm body.

[0105] The insulating material of the front insulating layer 55 and the back insulating layer 57 can be Parylene insulating material deposited by vacuum vapor deposition, preferably Parylene C in this case, or N-type, D-type or HT-type material, to form an insulating layer several to tens of microns thick.

[0106] The front insulating layer 55 and the back insulating layer 57 can also be formed by brushing or spraying insulating materials such as insulating paint on the surface of the conductive coil and curing them to form an insulating layer.

[0107] The first conductive layer 56 and the second conductive layer 58 are preferably formed by inkjet printing or printing conductive ink, or by screen printing, brushing or spraying conductive glue or other conductive materials, or by secondary vacuum vapor deposition of conductive materials such as gold, silver, or aluminum in specific areas.

[0108] like Figure 4 , Fig.10 and Fig.11 As shown, the planar coil diaphragm speaker also includes an upper supporting ring assembly 6 and a lower supporting ring assembly 4, the diaphragm 5 is flatly attached to the upper surface of the lower supporting ring assembly 4, the upper supporting ring assembly 6 is pressed on the diaphragm 5, the diaphragm 5 is fixed between the upper supporting ring assembly 6 and the lower supporting ring assembly 4, and the diaphragm 5, the upper supporting ring assembly 6 and the lower supporting ring assembly 4 are assembled together to form a vibration assembly 300.

[0109] The upper support ring assembly 6 includes an upper support ring 60, on the lower surface of which are fixed an upper ring second welding pad 64 and an upper ring third welding pad 65, the position between the upper ring second welding pad 64 and the upper ring third welding pad 65 corresponds to the position between the first endpoint 51 and the third endpoint 53, the upper ring second welding pad 64 is connected to the first endpoint 51, and the upper ring third welding pad 65 is connected to the third endpoint 53.

[0110] An upper ring first pad 61 is fixed on the upper surface of the upper support ring 60 , and an upper ring first metallized hole 62 is provided between the upper ring first pad 61 and the upper ring second pad 64 .

[0111] The side surface of the upper support ring 60 where the upper ring third pad 65 is provided is provided with an upper ring second metallized hole 63 , and the upper ring second metallized hole 63 is connected to the upper ring third pad 65 .

[0112] The lower support ring assembly 4 includes a lower support ring 40, and a lower ring first welding pad 42, a lower ring second welding pad 43 and a lower ring third welding pad 44 are fixed on the upper surface of the lower support ring 40, the first welding pad 42 and the lower ring second welding pad 43 are connected by a lower ring wire 46, the position between the lower ring second welding pad 43 and the lower ring third welding pad 44 corresponds to the position between the fourth endpoint 51b and the sixth endpoint 59, the lower ring second welding pad 43 is connected to the fourth endpoint 51b, and the lower ring third welding pad 44 is connected to the sixth endpoint 59.

[0113] A lower ring first metallized hole 41 is provided on the side of the lower support ring 40 where the lower ring first pad 42 is provided. The lower ring first metallized hole 41 is connected to the lower ring first pad 42 .

[0114] A lower ring fourth pad 47 is fixed to the lower surface of the lower support ring 40 , and a penetrating lower ring second metallized hole 45 is provided between the lower ring fourth pad 47 and the lower ring third pad 44 .

[0115] The upper ring second metallized holes 63 and the lower ring first metallized holes 41 are connected via an inter-hole conductor 66 . The inter-hole conductor 66 may be solder, or may be a wire or other conductive material such as a flexible circuit board such as an FPC.

[0116] The upper support ring 60 and the lower support ring 40 are preferably made of PCB epoxy resin board or FPC flexible circuit board material, but other similar functional materials can also be used.

[0117] The diaphragm 5, the upper support ring assembly 6 and the lower support ring assembly 4 are preferably bonded together with an adhesive in a non-conductive area. Other mechanical locking methods, such as screws, may also be used to fasten the three components together.

[0118] When the diaphragm 5, the upper support ring assembly 6 and the lower support ring assembly 4 are fixed, the first endpoint 51 is aligned with the second soldering pad 64 of the upper ring and is placed in close contact and is reliably connected together; the third endpoint 53 is aligned with the third soldering pad 65 of the upper ring and is placed in close contact and is reliably connected together, and the third soldering pad 65 of the upper ring is directly connected to the second metallized hole 63 of the upper ring; the fourth endpoint 51b is aligned with the second soldering pad 43 of the lower ring and is placed in close contact and is reliably connected together; the sixth endpoint 59 is aligned with the third soldering pad 44 of the lower ring and is placed in close contact and is reliably connected together.

[0119] The connection between the end points of all coils and the corresponding support ring pads can also be bonded together using a conductive adhesive, such as conductive glue, which can simultaneously play a bonding and conductive role.

[0120] The assembly diagram formed by the above process is as follows Fig. 9 As shown, the upper ring second metallized hole 63 on the side of the upper support ring component 6 is connected to the lower ring first metallized hole 41 on the side of the lower support ring component 4 by using an inter-hole conductor 66.

[0121] like Figure 4 and Fig.18 As shown, the planar coil diaphragm loudspeaker also includes a magnet assembly, which includes a radially magnetized magnetic ring 3, a vertically outer magnetic ring 7 and a vertically inner magnetic ring 8. The preferred magnet assembly also includes a magnetic conductive sheet 10. The radially magnetized magnetic ring 3 and the vertically outer magnetic ring 7 are hollow cylindrical, and the vertically inner magnetic ring 8 can be a hollow cylindrical or a solid cylindrical. The vertically outer magnetic ring 7 and the vertically inner magnetic ring 8 are adsorbed or glued to the lower surface of the magnetic conductive sheet 10, and the three are coaxially arranged.

[0122] The vertical outer magnetic ring 7 surrounds the outside of the vertical inner magnetic ring 8, and a vibration component 300 is provided between the radial magnetized magnetic ring 3 and the vertical outer magnetic ring 7 and the vertical inner magnetic ring 8. The radial magnetized magnetic ring 3, the vibration component 300, the vertical outer magnetic ring 7, the vertical inner magnetic ring 8 and the magnetic conductive sheet 10 constitute an electromagnetic force system.

[0123] If the radial magnetized magnetic ring 3 is Fig.18The radial magnetization direction is shown, and the inner part of the radial magnetization magnetic ring 3 is the S pole, and the outer part is the N pole. A horizontal magnetic field from the outside to the inside is generated on the upper surface of the radial magnetization magnetic ring 3 and under the diaphragm body; the vertical outer magnetic ring 7 is according to Fig.18 The vertical inner magnetic ring 8 is magnetized in the direction shown, with the S pole on the top and the N pole on the bottom. The vertical inner magnetic ring 8 is magnetized in the opposite direction to the magnetization direction of the vertical outer magnetic ring 7, with the N pole on the top and the S pole on the bottom. The magnetic lines of force point from the N pole at the bottom of the vertical outer magnetic ring 7 to the S pole at the bottom of the vertical inner magnetic ring 8, generating a horizontal magnetic field from the outside to the inside on the lower surfaces of the two concentric magnetic rings and the diaphragm body. If the coils on the upper and lower surfaces of the diaphragm body are energized, at a certain moment, the direction of the current is as follows: Fig.18 As shown, according to Faraday's left-hand rule, the diaphragm body is forced downward. If the current is reversed, the diaphragm body is forced upward. If an alternating audio current is applied, the diaphragm body vibrates up and down under the action of electromagnetic force, pushing the air to produce sound.

[0124] Of course, the radial magnetizing ring 3 can change its magnetizing direction, that is, the inner center hole is the N pole and the outer side is the S pole, then the direction of the vertical outer magnetic ring 7 also needs to be reversed, that is, the bottom is the S pole and the top is the N pole, and the direction of the vertical inner magnetic ring 8 becomes the S pole on the top and the N pole on the bottom. Under the same current direction, the direction of the magnetic field changes, and the electromagnetic force changes accordingly.

[0125] like Figure 4-Figure 8 As shown, the planar coil diaphragm loudspeaker also includes a circuit cover assembly 200, which includes an epoxy resin substrate 207. The upper and lower surfaces of the epoxy resin substrate 207 are covered with copper foil. The copper foil on the upper surface of the epoxy resin substrate 207 is removed by etching to form an etching groove 208 and a large-area grounding copper foil 206. The copper foil in the etching groove 208 is removed to form an insulating area. The etching groove 208 is surrounded by a positive electrode 201 and a negative electrode 202. The positive electrode 201 and the negative electrode 202 are separated from the large-area grounding copper foil 206 by the etching groove 208. A plurality of negative electrode connecting bridges 209 are provided on the etching groove 208 surrounding the negative electrode 202, and the negative electrode connecting bridges 209 connect the negative electrode 202 to the large-area grounding copper foil 206.

[0126] The copper foil on the upper surface of the epoxy resin substrate 207 is removed by etching to form a lower surface positive electrode 203. The large-area grounded copper foil 206 is provided with an air leakage hole 205 penetrating the epoxy resin substrate 207. The air leakage hole 205 is used to maintain the air pressure balance inside and outside the speaker. The positive electrode 201 is provided with a positive electrode metallization hole 204 penetrating the lower surface positive electrode 203. The positive electrode metallization hole 204 connects the positive electrode 201 with the circuit of the lower surface positive electrode 203.

[0127] like Figure 4 and Figure 5As shown, the planar coil diaphragm loudspeaker also includes a shell 1, a conductor ring 2 is provided at the bottom of the shell 1, the inner wall of the shell 1 is in close contact with the outer wall and the bottom of the conductor ring 2, and the radially magnetized magnetic ring 3 is fixed to the bottom of the shell 1 by adhesive bonding or magnetic attraction after radial magnetization, and the radially magnetized magnetic ring 3 is placed in the middle hole of the conductor ring 2, and a shell sound outlet hole 1a is opened at the bottom center of the shell 1, and the middle inner hole of the radially magnetized magnetic ring 3 is coaxially arranged with the shell sound outlet hole 1a.

[0128] The vibration assembly 300 is placed on the upper surface of the conductor ring 2 and in close contact with it. The lower ring fourth pad 47 of the lower support ring assembly 4 is in close contact with the upper surface of the conductor ring 2 .

[0129] An insulating ring 9 is provided between the outer wall of the vertical outer magnetic ring 7 and the inner wall of the outer shell 1. The height of the insulating ring 9 is not higher than the sum of the heights of the vertical outer magnetic ring 7 and the magnetic conductive sheet 10. The vertical outer magnetic ring 7, the vertical inner magnetic ring 8 and the insulating ring 9 are all placed on the upper surface of the vibration component 300. The surface of the vertical outer magnetic ring 7 is plated with conductive materials, such as nickel, colored zinc, etc., which play an anti-oxidation and conductive role. The surface coating of the vertical outer magnetic ring 7 is in close contact with the upper ring first welding pad 61 of the upper surface 300 of the vibration component.

[0130] The circuit cover assembly 200 is placed on the upper surface of the magnetic conductive sheet 10 , the lower surface positive pole 203 is in close contact with the upper surface of the magnetic conductive sheet 10 , and the lower surface of the magnetic conductive sheet 10 is in close contact with the upper surface of the vertical outer magnetic ring 7 .

[0131] The top of the shell 1 is deformed and bent under mechanical pressure to form a shell curling edge 1b, which is in close contact with the large-area grounding copper foil 206. The "curling and crimping" here can usually adopt a rolling sealing process to encapsulate all components in the shell 1.

[0132] like Fig.19As shown, when the above-mentioned planar coil speaker is working, its internal current loop is as follows: the current starts from the positive electrode 201, passes through the positive electrode metallized hole 204, reaches the lower surface positive electrode 203, then passes through the magnetic conductive sheet 10, flows through the vertical outer magnetic ring 7, reaches the first welding pad 61 of the upper ring, then passes through the first metallized hole 62 of the upper ring, reaches the second welding pad 64 of the upper ring, passes through the first terminal 51 of the upper surface plating of the diaphragm body, enters the front spiral coil 52 of the upper surface of the diaphragm body, and finally flows out from the second terminal 54, passes through the first conductive layer 56, reaches the third terminal 53, flows through the third welding pad 65 of the upper ring, the second metallized hole 63 of the upper ring, and the two metallized holes 63 are soldered with solder. 41 forms an inter-hole conductor 66, sends the current into the first metallized hole 41 of the lower ring, and then flows through the first pad 42 of the lower ring, the wire 46 of the lower ring, the second pad 43 of the lower ring, and the fourth terminal 51b in sequence, enters the spiral coil 52b on the reverse side of the membrane, and then flows out from the fifth terminal 54b, flows through the second conductive layer 58, the sixth terminal 59, the third pad 44 of the lower ring, and the second metallized hole 45 of the lower ring in sequence, and then flows out from the fourth pad 47 of the lower ring into the conductor ring 2, flows through the shell 1, and then through the shell curling 1b at the top of the shell, flows to the large-area grounding copper foil 206 crimped together with the shell curling 1b, where the "crimping" can usually adopt a rolling sealing process. Then pass through the negative electrode connection bridge 209, and finally reach the negative electrode 202 output, forming a closed loop. When an alternating audio current is input to the positive electrode 201 and the negative electrode 202 of the circuit cover assembly 200, the diaphragm body 50 vibrates up and down under the action of the electromagnetic force, pushing the air to emit sound from the sound outlet 1a of the housing.

[0133] In this embodiment, the conductor ring 2 can be removed so that the lower support ring assembly 4 is in direct contact with the outer shell 1; the magnetic conductive sheet 10 can also be removed so that the positive pole 203 on the lower surface of the circuit cover assembly 200 is in direct contact with the vertical outer magnetic ring 7; these schemes can utilize the above-mentioned coil lead-out method to design a new structure of a planar diaphragm body speaker.

[0134] Example 2

[0135] The same parts as those in Example 1 have been discussed in detail in Example 1 and will not be repeated here. Compared with Example 1, this example is modified as follows:

[0136] like Fig. 20 and Fig.21 The magnet assembly includes a vertical outer magnetic ring 7, a vertical inner magnetic ring 8 and a magnetic conductive sheet 10. The vertical outer magnetic ring 7 and the vertical inner magnetic ring 8 are both in the shape of circular rings. The vertical outer magnetic ring 7 and the vertical inner magnetic ring 8 are adsorbed or glued to the upper surface of the magnetic conductive sheet 10, and the three are coaxially arranged.

[0137] The vibration assembly 300 is placed between the magnet assembly and the circuit cover assembly 200 , the fourth lower pad 47 of the lower support ring assembly 4 is in close contact with the upper surface of the vertical outer magnetic ring 7 , and the circuit cover assembly 200 is in close contact with the first upper pad 61 .

[0138] The radial magnetized magnets above the diaphragm body are removed, and there are two coaxial vertical magnetized magnets below the diaphragm body. The electrical signal enters from the positive pole 201, is transmitted to the lower surface of the circuit cover assembly 200 through the metallized hole, and then flows into the upper ring first welding pad 61 on the upper surface of the upper support ring 60. According to the same current path as in Example 1, the current flows through the 7 vertical outer magnetic rings, passes through the outer shell and returns to the negative pole 202 to form a complete loop. The sound emitted by the vibration of the diaphragm body is emitted from the sound outlet hole 210 at the edge of the circuit board and the sound outlet hole 211 in the center of the circuit board on the circuit cover assembly 200.

[0139] Example 3

[0140] The same parts as those in Example 1 have been discussed in detail in Example 1 and will not be repeated here. Compared with Example 1, this example is modified as follows:

[0141] like Fig. 22 As shown, the magnet assembly includes a vertical outer magnetic ring 7, a vertical inner magnetic ring 8 and a magnetic conductive sheet 10. The vertical outer magnetic ring 7 and the vertical inner magnetic ring 8 are adsorbed or glued to the lower surface of the magnetic conductive sheet 10, and the three are coaxially arranged.

[0142] The vibration assembly 300 is placed between the magnet assembly and the bottom of the outer shell 1, the fourth welding pad 47 of the lower ring of the lower support ring assembly 4 is in close contact with the bottom of the outer shell 1, the lower surface of the vertical outer magnetic ring 7 is in close contact with the first welding pad 61 of the upper ring, and the circuit cover assembly 200 is in close contact with the magnetic conductive sheet 10.

[0143] Based on the method of closing the internal end point of the coil of the present invention, the vibration assembly 300 is the same as that of Example 1, except that the radial magnetization magnet below the diaphragm body is removed, and only two coaxial vertical magnetization magnets above the diaphragm body are retained. The electrical signal starts from the positive electrode 201, flows out from the fourth welding pad of the lower ring 47 of the lower surface 4 of the lower support ring assembly along the same path as Example 1, passes through the housing 1 and returns to the negative electrode 202 to form a complete loop, and the sound emitted by the vibration of the diaphragm body under the action of the electromagnetic force is emitted from the housing sound outlet 1a of the housing.

[0144] Example 4

[0145] The same parts as those in Example 1 have been discussed in detail in Example 1 and will not be repeated here. Compared with Example 1, this example is modified as follows:

[0146] like Fig.23As shown, the magnet assembly includes a radially magnetized magnetic ring 3, a vertical outer magnetic ring 7, a vertical inner magnetic ring 8 and a magnetic conductive sheet 10. The vertical outer magnetic ring 7 and the vertical inner magnetic ring 8 are adsorbed or glued to the upper surface of the magnetic conductive sheet 10. The three are coaxially arranged. The magnetic conductive sheet 10 is placed at the bottom of the housing 1, and a plurality of sound outlet holes are provided on the magnetic conductive sheet 10.

[0147] The radial magnetized magnetic ring 3 is fixed to the lower surface of the circuit cover assembly 200 by adhesive bonding or magnetic attraction after radial magnetization. The radial magnetized magnetic ring 3 is placed in the center hole of the conductor ring 2. An insulating ring 9 is provided between the conductor ring 2 and the inner wall of the outer shell 1. The height of the insulating ring 9 is not higher than that of the conductor ring 2.

[0148] The fourth lower pad 47 of the lower support ring assembly 4 is in close contact with the coating on the upper surface of the vertical outer magnetic ring 7 , and the first upper pad 61 is in close contact with the lower surface of the conductor ring 2 .

[0149] Based on the method of closing the internal terminal of the coil of the present invention, the vibration component 300 remains the same as that of Example 1. The electrical signal starts from the positive electrode 201, is transmitted to the lower surface positive electrode 203 through the positive electrode metallized hole of the circuit cover assembly 200, and then flows into the upper ring first welding pad 61 on the upper surface of the upper support ring 60 through the conductor ring 2, and flows out from the lower ring fourth welding pad 47 on the lower surface of the lower support ring assembly 4 in the same path as Example 1, passes through the vertical outer magnetic ring 7 and the magnetic conductive sheet 10, and then flows back to the negative electrode 202 through the outer shell to form a complete loop, and the sound emitted by the vibration of the diaphragm body under the action of the electromagnetic force is emitted from the sound outlet 1a of the outer shell.

[0150] Example 5

[0151] The same parts as those in Example 1 have been discussed in detail in Example 1 and will not be repeated here. Compared with Example 1, this example is modified as follows:

[0152] like Fig.24 As shown, the magnet assembly adopts two groups of double vertical magnetic ring structures which are symmetrically arranged up and down, each double vertical magnetic ring structure includes a vertical outer magnetic ring 7, a vertical inner magnetic ring 8 and a magnetic conductive sheet 10, and the magnetic conductive sheet 10 is provided with a plurality of sound outlet holes 10a, and a vibration assembly 300 is arranged between the two groups of double vertical magnetic ring structures, and the magnetization directions of the two vertical outer magnetic rings which are symmetrical up and down of the membrane are opposite, and the magnetization directions of the two vertical inner magnetic rings which are symmetrical up and down of the membrane are opposite, and the magnetization directions of the inner and outer magnetic rings are opposite.

[0153] Based on the method of closing the internal end point of the coil of the present invention, the vibration assembly 300 remains the same as that of Example 1. The current flows in from the positive electrode 201, flows along the same path as that of Example 1, flows out from the fourth welding pad 47 of the lower ring on the lower surface of the lower support ring assembly 4, passes through the vertical outer magnetic ring 7 and the magnetic conductive sheet 10, and then flows back to the negative electrode 202 through the shell to form a complete loop. The sound emitted by the vibration of the diaphragm body under the action of electromagnetic force is emitted from the sound outlet hole 1a of the shell through the primary sound hole 10a of the magnetic conductive sheet.

[0154] Example 6

[0155] The same parts as those in Example 1 have been discussed in detail in Example 1 and will not be repeated here. Compared with Example 1, this example is modified as follows:

[0156] like Fig.25 and Fig.26 As shown, the routing method of the front coil 52 and the back coil 52b is a serpentine routing or other routing methods.

[0157] The above solution, in combination with a bar magnet, can also solve the problem of how to effectively lead out the internal endpoints of the serpentine wiring closed coil.

[0158] Example 7

[0159] The same parts as those in Example 1 have been discussed in detail in Example 1 and will not be repeated here. Compared with Example 1, this example is modified as follows:

[0160] The coil is attached to only one of the upper and lower surfaces of the diaphragm body 50 .

[0161] Example 8

[0162] An application of a planar coil diaphragm speaker. The speakers described in Examples 1 to 7 can be used as microphones. For example, when used in in-ear headphones, the speakers described in the present invention can be used as a speaker to emit sound, and can also pick up the voice in the ear canal when a person is speaking. This voice signal is used as a reference for the voice signal input of a chip noise reduction algorithm. The algorithm eliminates environmental noise and enhances voice clarity.

[0163] The description of the present invention is given for the purpose of illustration and description, and is not intended to be exhaustive or to limit the invention to the disclosed form. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for particular uses.

Claims

1. A planar coil diaphragm of a loudspeaker, characterized in that: The diaphragm body (50) comprises a diaphragm body (50), wherein at least one of the upper and lower surfaces of the diaphragm body (50) is attached with a coil, and the two ends of the coil are respectively provided with an end point located inside the coil and an end point located outside the coil, an insulating layer is attached to the coil, and a conductive layer is attached to the insulating layer, and the conductive layer is used to lead the end point located inside the coil to be conductively connected to the outside of the coil; The coil and the two ends of the coil are conductors capable of conducting electricity; The upper surface and lower surface of the diaphragm body (50) are respectively attached with a front coil (52) and a back coil (52b); The front coil (52) and the back coil (52b) are arranged in a mirror-symmetrical manner with the central plane of the diaphragm body (50) as a symmetry plane; A front insulating layer (55) is attached to the front coil (52), and the front insulating layer (55) is located between a second endpoint (54) provided at one end inside the front coil (52) and a third endpoint (53) provided on the upper surface of the diaphragm body (50). The front insulating layer (55) forms an insulating region between the second endpoint (54) and the third endpoint (53), and the second endpoint (54) is located inside the front coil (52), and the third endpoint (53) is located outside the front coil (52); A reverse insulating layer (57) is attached to the reverse coil (52b), and the reverse insulating layer (57) is located between a fifth endpoint (54b) provided at one end inside the reverse coil (52b) and a sixth endpoint (59) provided on the lower surface of the diaphragm body (50), and the reverse insulating layer (57) forms an insulating area between the fifth endpoint (54b) and the sixth endpoint (59), and the fifth endpoint (54b) is located inside the reverse coil (52b), and the sixth endpoint (59) is located outside the reverse coil (52b); A first endpoint (51) is provided at one end outside the front coil (52), and the first endpoint (51) is located outside the front coil (52); a fourth endpoint (51b) is provided at one end outside the back coil (52b), and the fourth endpoint (51b) is located outside the back coil (52b); A first conductive layer (56) is provided on the surface of the front insulating layer (55), and two ends of the first conductive layer (56) are respectively connected to the second end point (54) and the third end point (53); A second conductive layer (58) is provided on the surface of the reverse insulating layer (57), and two ends of the second conductive layer (58) are respectively connected to a fifth endpoint (54b) and a sixth endpoint (59); The coil can be formed by first physically vapor depositing a thin conductive layer on the upper and lower surfaces of the diaphragm body, respectively, and then using laser or chemical etching to process the coil on the upper and lower surfaces of the diaphragm body with the conductive coating.

2. A planar coil diaphragm for a loudspeaker as claimed in claim 1, characterized in that: The insulating layer is made of vacuum atmospherically deposited parylene material, or printed insulating material, or sprayed insulating material.

3. The planar coil diaphragm of a loudspeaker according to claim 1, characterized in that: The conductive layer is formed by inkjet printing conductive ink on the insulating layer, or printing conductive ink on the insulating layer, or vacuum physical vapor deposition of conductive material on the insulating layer, or screen printing of conductive material on the insulating layer, or brushing conductive material on the insulating layer.

4. A loudspeaker, characterized in that: It comprises a vibration component (300), a magnet component, a circuit cover component (200) and a housing (1), wherein the vibration component (300) and the magnet component are encapsulated between the circuit cover component (200) and the housing (1); The vibration assembly (300) comprises a planar coil diaphragm (5) as claimed in any one of claims 1 to 3 and at least one set of supporting ring assemblies; The support ring assembly is used to support the planar coil diaphragm (5) and conduct electricity, and the support assembly is provided with a welding pad connected to the end point of the coil and a welding pad in close contact with the magnet assembly; The circuit cover assembly (200) comprises a positive electrode for inputting alternating audio current of a loudspeaker and a negative electrode for outputting; The magnet assembly includes at least one combination of an outer magnetic ring and an inner magnetic ring. The outer magnetic ring is arranged around the outside of the inner magnetic ring. The outer magnetic ring and the inner magnetic ring are coaxially arranged. The surface of the outer magnetic ring is plated with a conductive coating. The support ring assembly is in close contact with the conductive coating to conduct electricity. The conductive coating enables the magnet assembly to be used as a conductor in addition to providing a magnetic field.

5. A loudspeaker as claimed in claim 4, characterized in that: The vibration assembly (300) comprises an upper support ring assembly (6) and a lower support ring assembly (4); the planar coil diaphragm (5) is flatly attached to the upper surface of the lower support ring assembly (4); the upper support ring assembly (6) is pressed on the planar coil diaphragm (5); and the planar coil diaphragm (5) is fixed between the upper support ring assembly (6) and the lower support ring assembly (4); The upper support ring assembly (6) comprises an upper support ring (60), a second upper ring welding pad (64) and a third upper ring welding pad (65) are fixed on the lower surface of the upper support ring (60), the position between the second lower ring welding pad (43) and the third lower ring welding pad (44) corresponds to the position between the fourth endpoint (51b) and the sixth endpoint (59), the second upper ring welding pad (64) is connected to the first endpoint (51), and the third upper ring welding pad (65) is connected to the third endpoint (53); The lower support ring assembly (4) comprises a lower support ring (40), wherein a first lower ring welding pad (42), a second lower ring welding pad (43) and a third lower ring welding pad (44) are fixed on the upper surface of the lower support ring (40), the first lower ring welding pad (42) and the second lower ring welding pad (43) are connected via a lower ring wire (46), the position between the second lower ring welding pad (43) and the third lower ring welding pad (44) corresponds to the position between the fourth endpoint (51b) and the sixth endpoint (59), the second lower ring welding pad (43) is connected to the fourth endpoint (51b), and the third lower ring welding pad (44) is connected to the sixth endpoint (59).

6. A loudspeaker as claimed in claim 5, characterized in that: An upper ring first pad (61) is fixed on the upper surface of the upper support ring (60), and a penetrating upper ring first metallized hole (62) is provided between the upper ring first pad (61) and the upper ring second pad (64); A lower ring fourth pad (47) is fixed to the lower surface of the lower support ring (40), and a penetrating lower ring second metallized hole (45) is provided between the lower ring fourth pad (47) and the lower ring third pad (44).

7. A loudspeaker as claimed in claim 6, characterized in that: The upper support ring (60) is provided with an upper ring second metallized hole (63) on the side where the upper ring third pad (65) is provided, and the upper ring second metallized hole (63) is connected to the upper ring third pad (65); A first lower ring pad (42) is also fixed on the upper surface of the lower support ring (40); a first lower ring metallized hole (41) is provided on the side surface of the lower support ring (40) where the first lower ring pad (42) is provided; and the first lower ring metallized hole (41) is connected to the first lower ring pad (42); The second metallized hole (63) of the upper ring is connected to the first metallized hole (41) of the lower ring via an inter-hole conductor (66).

8. A loudspeaker as claimed in claim 4, characterized in that: The magnet assembly comprises a radial magnetizing magnetic ring (3), a vertical outer magnetic ring (7) and a vertical inner magnetic ring (8); the vibration assembly (300) is arranged between the radial magnetizing magnetic ring (3) and the vertical outer magnetic ring (7) and the vertical inner magnetic ring (8); the magnetizing direction of the radial magnetizing magnetic ring (3) is radial magnetizing; the magnetizing directions of the vertical outer magnetic ring (7) and the vertical inner magnetic ring (8) are vertical magnetizing; the magnetizing direction of the vertical outer magnetic ring (7) is opposite to the magnetizing direction of the vertical inner magnetic ring (8); the direction of the magnetic field generated by the upper surface of the radial magnetizing magnetic ring (3) and the lower surface of the planar coil diaphragm (5) is the same as the direction of the magnetic field generated by the lower surfaces of the two vertical magnetic rings and the upper surface of the planar coil diaphragm (5); The surface coating of the vertical outer magnetic ring (7) is in close contact with the welding pad on the supporting component.

9. A loudspeaker as claimed in claim 4, characterized in that: The circuit cover assembly (200) comprises an epoxy resin substrate (207), the upper surface and the lower surface of the epoxy resin substrate (207) are both covered with copper foil, the copper foil portion of the upper surface of the epoxy resin substrate (207) is removed to form a positive electrode (201), a negative electrode (202) and a large-area grounding copper foil (206), the negative electrode (202) is connected to the large-area grounding copper foil (206), the positive electrode (201) and the large-area grounding copper foil (206) are completely separated, and a shell curling edge (1b) is formed on the top of the shell (1), and the shell curling edge (1b) is in close contact with the large-area grounding copper foil (206); The copper foil portion of the upper surface of the epoxy resin substrate (207) is removed to form a lower surface positive electrode (203), and the lower surface positive electrode (203) is connected to the positive electrode (201); The lower surface positive electrode (203) is in close contact with the conductive coating of the outer magnetic ring.

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