Processing method for improving asymmetric processing warpage of laminated board and laminated board thereof

Abstract

The present invention discloses a processing method for improving warping of asymmetric processing of laminated boards, the method comprising: opening a cavity on the middle core layer of the laminated board at a position corresponding to the surface layer processing area; filling the cavity of the middle core layer with a high-strength material; symmetrically laying the surface layer material on the upper and lower surfaces of the middle core layer, and hot pressing and curing under high temperature, high pressure and vacuum conditions; and performing fine processing on the surface layer processing area of ​​the laminated board formed by hot pressing and curing. The present invention also discloses a laminated board obtained by the above processing method, comprising an middle core layer and surface layers laid on the upper and lower surfaces of the middle core layer, a through cavity is opened on the middle core layer at a position corresponding to the surface layer processing area on the upper surface, and the cavity is filled with a high-strength material. The present invention improves the phenomenon of unbalanced internal stress caused by the removal of part of the surface layer material by milling during the fine processing process, improves the strength of the laminated board, and avoids the occurrence of warping.

Description

Technical Field

[0001] The invention relates to the technical field of composite board materials, and in particular to a processing method for improving asymmetric processing warping of laminated boards and the laminated boards. Background Art

[0002] Laminated panels, also known as sandwich panels, are usually laminated with two or more high-strength thin plates as surface layers and a lightweight sandwich layer filled between the upper and lower layers. In recent years, with the high requirements of electronic products for lightness and durability, sandwich panels with carbon fiber composite materials for the surface layer and lightweight glass fiber reinforced epoxy resin composite materials for the core layer have been increasingly widely used in 3C electronic products. Due to the multi-layer composite structure of sandwich panels, they are more prone to warping than homogeneous materials. For this reason, sandwich panels are generally designed to have a symmetrical structure to minimize warping. However, when sandwich panels are used specifically, it is usually necessary to perform processing on a single surface layer of the sandwich panel, such as designing some grooves and holes for placing some functional electronic components. Since the fine processing on a single surface layer of the sandwich panel destroys the symmetry of the sandwich panel structure, asymmetric internal stress is generated, resulting in significant warping of the sandwich panel. However, current electronic products, such as 3C electronic products, have higher requirements on the warpage of sandwich panels. Excessive warpage will affect the installation of functional electronic components on the sandwich panel and the overall assembly of the sandwich panel.

[0003] Therefore, the above-mentioned problems have become technical issues that need to be solved urgently. Summary of the invention

[0004] The purpose of the present invention is to provide a processing method for improving the warping of asymmetric processing of laminated boards and its laminated boards, a cavity is opened on the middle core layer corresponding to the area to be processed of the surface layer, and high-strength material is filled in the cavity to improve the internal stress imbalance caused by the milling removal of part of the surface layer material during the fine processing process, thereby improving the strength of the laminated board and avoiding the occurrence of warping.

[0005] In order to solve the above technical problems, the technical solution provided by the present invention is: a processing method for improving the asymmetric processing warping of a laminate, the method comprising: opening a cavity on the middle core layer of the laminate at a corresponding position relative to the surface layer to be processed area; filling the cavity of the middle core layer with high-strength material; symmetrically laying the surface layer material on the upper and lower surfaces of the middle core layer, and hot pressing and curing under high temperature, high pressure and vacuum conditions; and performing fine processing on the surface layer to be processed area of ​​the laminate formed by hot pressing and curing.

[0006] The present invention adopts the above-mentioned technical solution, by opening a cavity in the portion of the middle core layer corresponding to the area to be processed on the surface layer, and replacing it with a high-strength material. When the area to be processed on the surface layer is undergoing fine processing, the high-strength material below the fine processing area plays a role in strengthening support, improving the internal stress imbalance, preventing the occurrence of warping, and improving the strength and quality of the laminate.

[0007] In the above-mentioned processing method for improving asymmetric processing warping of laminated boards, the cavity passes through the middle core layer.

[0008] In the above processing method for improving asymmetric processing warping of laminated boards, the thickness of the high-strength material filled in the cavity of the middle core layer is the same as the depth of the cavity.

[0009] In the above processing method for improving asymmetric warping of laminated boards, the plane area of ​​the cavity on the middle core layer is larger than the area of ​​the area to be processed on the surface layer. During fine processing, the processing area on the surface layer can be supported by the high-strength material filled in the cavity to avoid warping and deformation.

[0010] In the above-mentioned processing method for improving asymmetric processing warping of laminated boards, the high-strength material filled on the middle core layer includes at least one of high-strength glass fiber material, high-strength carbon fiber material and high-strength aramid fiber material.

[0011] In the above-mentioned processing method for improving asymmetric processing warping of laminated boards, the intermediate core layer is made of a lightweight glass fiber reinforced epoxy resin composite material.

[0012] Another technical solution provided by the present invention is: a laminate obtained by the above-mentioned processing method, comprising an intermediate core layer and surface layers laid on the upper and lower surfaces of the intermediate core layer, a through cavity is opened on the intermediate core layer at a position corresponding to the surface layer to be processed on the upper surface, and a high-strength material is filled in the cavity.

[0013] The present invention adopts the above technical solution. By opening a cavity on the middle core layer inside the laminate and filling it with high-strength material, the strength of the laminate is improved, the internal stress imbalance caused by part of the surface material being milled away during the finishing process is improved, and the occurrence of warping is prevented.

[0014] The beneficial effects achieved by the present invention are: the processing method of the present invention is simple, highly operable, effectively improves the strength of the laminate, improves the internal stress imbalance caused by asymmetric processing, avoids the occurrence of warping, and enables the laminate to maintain a smooth surface after fine processing, which will not affect the assembly of electronic components in the fine processing area. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic diagram of the exploded structure of a laminated board according to an embodiment of the present invention;

[0016] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of a laminate according to an embodiment of the present invention. DETAILED DESCRIPTION

[0017] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0018] Reference Figure 1 and Figure 2 As shown, a processing method for improving asymmetric processing warpage of a laminated board comprises:

[0019] The cavities 3a and 3b are formed on the middle core layer 1 of the laminate at positions corresponding to the to-be-processed areas 4a and 4b of the surface layer 2A;

[0020] Filling the cavities 3a, 3b of the middle core layer 1 with high-strength materials 3a1, 3b1;

[0021] The surface layer material is symmetrically laid on the upper and lower surfaces of the middle core layer 1, and hot-pressed and cured under high temperature, high pressure and vacuum conditions;

[0022] The surface layer processing areas 4a and 4b of the laminated board formed by heat pressing and curing are subjected to finishing operations.

[0023] In this processing method, the cavities 3 a and 3 b penetrate the intermediate core layer 1 .

[0024] The thickness of the high-strength material 3a1, 3b1 filled in the cavities 3a, 3b of the intermediate core layer 1 is the same as the depth of the cavities 3a, 3b.

[0025] The plane area of ​​the cavities 3a, 3b on the middle core layer 1 is larger than the area of ​​the to-be-processed regions 4a, 4b on the surface layer.

[0026] The high-strength material 3a1, 3b1 filled on the middle core layer 1 includes at least one of a high-strength glass fiber material, a high-strength carbon fiber material and a high-strength aramid fiber material.

[0027] The middle core layer 1 is made of a lightweight glass fiber reinforced epoxy resin composite material.

[0028] like Figure 1 and Figure 2 As shown, a laminate obtained by the processing method described in the above embodiment includes an intermediate core layer 1 and surface layers 2A, 2B laid on the upper and lower surfaces of the intermediate core layer 1, and through cavities 3a, 3b are opened at the positions of the to-be-processed areas 4a, 4b of the surface layer 2A on the upper surface of the intermediate core layer 1, and high-strength materials 3a1, 3b1 are filled in the cavities 3a, 3b.

[0029] In a specific implementation of the present invention, cavities 3a, 3b are opened on the middle core layer 1 corresponding to the positions of the to-be-processed areas 4a, 4b on the surface layer 2A, and then high-strength materials 3a1, 3b1 are filled at the positions of the cavities 3a, 3b, wherein the thickness of the high-strength materials 3a1, 3b1 is the same as the depth of the cavities, so that the overall thickness of the middle core layer 1 is flat, and the surface layers 2A, 2B are symmetrically laid on the middle core layer 1. When fine processing is performed on the to-be-processed areas 4a, 4b of the surface layer 2A, the filled high-strength materials 3a1, 3b1 play a role in supporting the surface layer 2A, thereby avoiding the warping caused by the imbalance of internal stress caused by the asymmetric processing method, and improving the structural strength of the laminate.

[0030] The high-strength material described in this embodiment can be a semi-cured sheet of high-strength fiber, or can be a cured high-strength fiber composite material. In the present invention, the cavity includes but is not limited to cavity 3a and cavity 3b. In other embodiments, the number of cavities and the high-strength materials filled should be designed according to actual processing needs.

[0031] In summary, the present invention has been made into actual samples and tested for multiple times as described in the specification and the drawings. From the results of the test, it can be proved that the present invention can achieve its intended purpose, and its practical value is beyond doubt. The above embodiments are only used to illustrate the present invention, and are not intended to limit the present invention in any form. Any person with ordinary knowledge in the technical field, if it does not depart from the scope of the technical features of the present invention, uses the equivalent embodiments of the technical content disclosed by the present invention to make partial changes or modifications, and does not depart from the technical features of the present invention, all still fall within the scope of the technical features of the present invention.

Claims

1. A method for improving asymmetric warping of laminated boards, characterized in that: The method comprises: opening cavities (3a, 3b) on a middle core layer (1) of a laminate at positions corresponding to areas (4a, 4b) to be processed on a surface layer (2A); Filling the cavities (3a, 3b) of the middle core layer (1) with high-strength materials (3a1, 3b1); The surface layer material is symmetrically laid on the upper and lower surfaces of the middle core layer (1), and is hot-pressed and cured under high temperature, high pressure and vacuum conditions; Performing fine processing on the surface layer to-be-processed areas (4a, 4b) of the laminate formed by heat-pressing and curing; The cavities (3a, 3b) penetrate the middle core layer (1); The thickness of the high-strength material (3a1, 3b1) filled in the cavities (3a, 3b) of the intermediate core layer (1) is the same as the depth of the cavities (3a, 3b); The high-strength material (3a1, 3b1) filled on the intermediate core layer (1) comprises at least one of a high-strength glass fiber material, a high-strength carbon fiber material and a high-strength aramid fiber material.

2. The method for improving asymmetric warping of laminated boards according to claim 1, characterized in that: The plane area of ​​the cavity (3a, 3b) on the middle core layer (1) is larger than the area of ​​the to-be-processed region (4a, 4b) on the surface layer.

3. The method for improving asymmetric warping of laminated boards according to claim 1, characterized in that: The intermediate core layer (1) is made of a lightweight glass fiber reinforced epoxy resin composite material.

4. A laminate obtained by the processing method according to any one of claims 1 to 3, characterized in that: The invention comprises an intermediate core layer (1) and surface layers (2A, 2B) laid on the upper and lower surfaces of the intermediate core layer (1); a through cavity (3a, 3b) is provided on the intermediate core layer (1) at a position corresponding to a to-be-processed area (4a, 4b) of the surface layer (2A) on the upper surface; and a high-strength material (3a1, 3b1) is filled on the cavity (3a, 3b).

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