Silicon wafer adsorption unit and silicon wafer transmission device

Abstract

The present invention provides a silicon wafer adsorption unit and a silicon wafer transfer device, which relate to the technical field of semiconductor manufacturing equipment and are designed to solve the problem that existing silicon wafer transfer devices occupy a large space. The silicon wafer adsorption unit includes a stator assembly and a mover assembly, the stator assembly includes a base, and the base is provided with a guide portion; the mover assembly includes a moving portion and a suction head, the moving portion and the guide portion are plugged in and matched, and a circumferential limiting structure for limiting the relative rotation between the moving portion and the guide portion is provided between the moving portion and the guide portion; the suction head is fixedly provided on the moving portion, and the two are arranged along the plug-in direction of the moving portion and the guide portion. The silicon wafer transfer device includes the above-mentioned silicon wafer adsorption unit. The silicon wafer adsorption unit and silicon wafer transfer device provided by the present invention eliminate the rotation limiting structure provided on the side of the suction cup in the existing multi-suction cup integrated structure, so that the overall structure of the silicon wafer adsorption unit is compact.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing equipment, and in particular to a silicon wafer adsorption unit and a silicon wafer transmission device. Background Art

[0002] With the development of the semiconductor industry, the overall structure of the lithography machine worktable is becoming more and more complex. Under the limitation of the overall size, higher requirements are also placed on the compactness of each component. Usually, the transportation and delivery of the silicon wafer 70 is achieved by a silicon wafer transfer device. Specifically, Figure 1 As shown, the silicon wafer transmission device includes a base 10, a driving mechanism 20, a guide mechanism 30, a connecting plate 40 and a plurality of suction cups 50, wherein the driving mechanism 20 is provided in multiple groups, each group of the driving mechanism 20 includes a stator 22 fixedly provided on the base 10 and a mover 21 that can move up and down relative to the stator 22, the plurality of movers 21 are rigidly connected through the connecting plate 40, and the plurality of suction cups 50 are installed on the connecting plate 40, and an air supply pipeline 60 for providing an air source to the suction cups 50 is provided in the base 10, the connecting plate 40 and other components. In addition, a guide mechanism 30 is also provided between the connecting plate 40 and the base 10, wherein the guide mechanism 30 includes a guide shaft 31 fixedly provided on the base 10 and a slider 32 fixedly connected to the connecting plate 40, and the slider 32 slides with the guide shaft 31 to guide the connecting plate 40 to move upward, thereby guiding the upward movement of the suction cup 50; the guide mechanism 30 also includes a rotation limiting structure 33, which is used to limit the rotation of the connecting plate 40, thereby limiting the rotation of the suction cup 50, so as to ensure reliable adsorption and transmission of the silicon wafer 70.

[0003] Although the silicon wafer 70 can be transferred and transported by using the above-mentioned silicon wafer transfer device, the above-mentioned silicon wafer transfer device occupies a large space, which seriously limits the arrangement space of other surrounding components. Summary of the Invention

[0004] The first object of the present invention is to provide a silicon wafer adsorption unit to solve the technical problem that the existing silicon wafer transmission device occupies a large space.

[0005] The silicon wafer adsorption unit provided by the present invention includes a stator assembly and a movable assembly, wherein the stator assembly includes a base provided with a guide portion; the movable assembly includes a moving portion and an adsorption head, the moving portion is plugged into and matched with the guide portion, and a circumferential limit structure is provided between the moving portion and the guide portion for limiting relative rotation between the two portions; the adsorption head is fixedly provided on the moving portion, and the two are arranged along the plugging direction between the moving portion and the guide portion;

[0006] The stator assembly also includes a coil fixedly arranged relative to the base, and the movable assembly also includes a magnet fixedly connected to the moving part, and the coil is at least partially arranged around the magnet; the moving part includes a transmission shaft, the transmission shaft is inserted into the sleeve, the adsorption head is fixedly arranged on the transmission shaft, and an accommodating cavity is provided inside the transmission shaft, the magnet is located in the accommodating cavity, the inner cavity of the transmission shaft is provided with a step, and one end of the magnet is against the step; the coil is arranged around the transmission shaft.

[0007] Furthermore, the base includes a base and a sleeve fixedly arranged on the base, and the sleeve forms the guide part; the movable part includes a transmission shaft, the transmission shaft is inserted into the sleeve, the adsorption head is fixedly arranged on the transmission shaft, and an accommodating cavity is provided inside the transmission shaft, the magnetic steel is located in the accommodating cavity, and the coil is arranged around the transmission shaft.

[0008] Furthermore, the stator assembly also includes a shell, which is fixedly connected to the base, and the sleeve, the transmission shaft, the magnetic steel and the coil are all arranged in the shell, and the adsorption head can protrude from the shell.

[0009] Furthermore, a first liquid flow channel is provided in the shell, and the first liquid flow channel is configured to allow the coolant to flow; and / or a second liquid flow channel is provided in the base, and the second liquid flow channel is configured to allow the coolant to flow.

[0010] Furthermore, the first liquid flow channel is connected to the second liquid flow channel to form a cooling flow channel, and the base is provided with a water inlet and a water outlet, and the water inlet and the water outlet are respectively connected and provided at two ends of the cooling flow channel.

[0011] Furthermore, an air film is provided between the transmission shaft and the sleeve, and the air film is configured to perform lubrication between the transmission shaft and the sleeve.

[0012] Furthermore, a first sealing ring and a second sealing ring are arranged between the sleeve and the outer shell. Along the axial direction of the sleeve, the first sealing ring and the second sealing ring are spaced apart, and the sleeve and the outer shell form an air cavity between the first sealing ring and the second sealing ring; the base is provided with a first air port, and the first air port is connected to the air cavity. The sleeve is provided with a channel connected to the air cavity, and the air source can enter between the sleeve and the transmission shaft through the first air port, the air cavity, and the channel in sequence to form the air film.

[0013] Furthermore, the base is also provided with a second air port, which is configured to introduce a vacuum air source; along the axial direction of the transmission shaft, a vacuum air duct is opened in the mover assembly, and the second air port is connected to the vacuum air duct through an air pipe, for providing vacuum adsorption force to the adsorption head.

[0014] Furthermore, the material of the air pipe is conductive rubber; the material of the base, the sleeve, the shell and the transmission shaft are all metal.

[0015] Furthermore, the adsorption head includes an adsorption section, a flexible section and a connecting section arranged in sequence, wherein the adsorption section is used to adsorb components; the connecting section is used to connect with the moving part; the flexible section is configured to enable the adsorption section to have rotational freedom around the X-axis, rotational freedom around the Y-axis and movement freedom along the Z-axis, and the Z-axis is the moving direction of the moving part.

[0016] Furthermore, the adsorption section and the connection section are made of metal, and the flexible section is made of conductive rubber.

[0017] Furthermore, the movable component also includes a grating scale, which is fixed relative to the moving part; the stator component also includes a reading head, which is fixed relative to the base, and the reading head is configured to read data from the grating scale.

[0018] Furthermore, the base is provided with a lower limit portion, which is used to limit the maximum stroke of the transmission shaft when it moves downward; and / or the housing is provided with an upper limit portion, which is used to limit the maximum stroke of the transmission shaft when it moves upward.

[0019] The beneficial effects brought about by the silicon wafer adsorption unit of the present invention are:

[0020] The silicon wafer adsorption unit provided by the present invention includes a stator assembly and a movable assembly, wherein the stator assembly includes a base provided with a guide portion, and the movable assembly includes an adsorption head and a movable portion plugged into the guide portion. The adsorption head is fixedly arranged on the movable portion, and the adsorption head and the movable portion are arranged along the plug-in direction of the movable portion and the guide portion (that is, the adsorption head and the movable portion are arranged along the moving direction of the movable portion), and a circumferential limiting structure is provided between the movable portion and the guide portion for limiting the relative rotation of the two.

[0021] The silicon wafer adsorption unit arranges a circumferential limiting structure between the moving part and the guide part, so that the circumferential limiting structure surrounds the power output structure, thereby realizing the spatial integration of the power output structure and the circumferential limiting structure of the silicon wafer adsorption unit, eliminating the limiting rotation structure arranged on the side of the suction cup in the existing multi-suction cup integrated structure, making the overall structure of the silicon wafer adsorption unit compact and reducing the lateral space occupied.

[0022] In addition, the adsorption head and the moving part are arranged along the moving direction of the moving part, so that the moving direction of the adsorption head and the moving direction of the moving part are basically collinear, thereby simplifying the transmission path of the driving force from the moving part to the adsorption head, and ensuring the timeliness and reliability of the adsorption head in adsorbing the silicon wafer.

[0023] The second object of the present invention is to provide a silicon wafer transfer device to solve the technical problem that the existing silicon wafer transfer device occupies a large space.

[0024] The silicon wafer transfer device provided by the present invention includes a mounting base, on which at least one silicon wafer adsorption unit as described above is installed.

[0025] Furthermore, a grounding loop is provided in the mounting base.

[0026] The beneficial effects brought about by the silicon wafer transfer device of the present invention are:

[0027] By arranging the above-mentioned silicon wafer adsorption unit in the silicon wafer transfer device, the silicon wafer transfer device accordingly has all the advantages of the above-mentioned silicon wafer adsorption unit, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0029] Figure 1 A schematic diagram of the structure of a silicon wafer transfer device provided by the prior art;

[0030] Figure 2 A schematic structural diagram of a silicon wafer adsorption unit provided in an embodiment of the present invention;

[0031] Figure 3 A partial structural cross-sectional view of a silicon wafer adsorption unit provided in an embodiment of the present invention.

[0032] Description of reference numerals:

[0033] 10-base; 20-driving mechanism; 21-moving element; 22-stator; 30-guide mechanism; 31-guide shaft; 32-slider; 33-rotation limiting structure; 40-connecting plate; 50-suction cup; 60-air supply line; 70-silicon wafer;

[0034] 010-silicon wafer adsorption unit; 110-base; 120-coil; 130-housing; 140-first sealing ring; 150-second sealing ring; 160-air cavity; 170-trachea; 180-reading head;

[0035] 111 - base; 112 - sleeve; 113 - second liquid flow channel; 114 - first air port; 115 - second air port; 116 - lower limit portion; 117 - water inlet;

[0036] 131 - shell cover; 132 - shell; 133 - first liquid flow channel; 134 - connection ear; 135 - opening;

[0037] 210- transmission shaft; 220- adsorption head; 230- magnet; 240- connection seat; 250- fixed seat; 260- grating scale; 270- third sealing ring;

[0038] 221-adsorption section; 222-flexible section; 223-connecting section. DETAILED DESCRIPTION

[0039] In order to make the above-mentioned objects, features and advantages of the present invention more clearly understood, the following detailed description of the specific embodiments of the present invention is given in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0040] Figure 2 This is a schematic structural diagram of the silicon wafer adsorption unit 010 provided in this embodiment. Figure 3 This is a partial structural cross-sectional view of the silicon wafer adsorption unit 010 provided in this embodiment. Figure 2 and Figure 3 As shown, this embodiment provides a silicon wafer adsorption unit 010, including a stator assembly and a movable assembly, specifically, the stator assembly includes a base 110, and the base 110 is provided with a guide portion; the movable assembly includes a moving portion and an adsorption head 220, wherein the moving portion and the guide portion are plugged into each other, and a circumferential limiting structure is provided between the moving portion and the guide portion for limiting the relative rotation between the two; the adsorption head 220 is fixedly provided on the moving portion, and the two are arranged along the plug-in direction of the moving portion and the guide portion.

[0041] The silicon wafer adsorption unit 010 arranges a circumferential limiting structure between the moving part and the guide part, so that the circumferential limiting structure surrounds the power output structure, thereby realizing the spatial integration of the power output structure and the circumferential limiting structure of the silicon wafer adsorption unit 010, eliminating the limiting rotation structure 33 arranged on the side of the suction cup 50 in the existing multi-suction cup 50 integrated structure, making the overall structure of the silicon wafer adsorption unit 010 compact and reducing the lateral space occupied.

[0042] In addition, the adsorption head 220 and the moving part are arranged along the moving direction of the moving part, so that the moving direction of the adsorption head 220 is basically colinear with the moving direction of the moving part, thereby simplifying the transmission path of the driving force from the moving part to the adsorption head 220, and ensuring the timeliness and reliability of the adsorption head 220 in adsorbing the silicon wafer.

[0043] Please continue to refer to Figure 3 In this embodiment, the stator assembly further includes a coil 120 fixedly arranged relative to the base 110, and the mover assembly further includes a magnet 230 fixedly connected to the moving part, wherein the coil 120 is at least partially arranged around the magnet 230.

[0044] During operation, the silicon wafer adsorption unit 010 applies a magnetic field force to the magnet 230 by energizing the coil 120, driving the magnet 230 to move, thereby driving the movable portion. Furthermore, by varying the current within the coil 120, the magnet 230 can be moved up and down. Specifically, when a high current is applied to the coil 120, the magnet 230 drives the movable portion upward. When a low current is applied to the coil 120, the force acting on the magnet 230 is less than the weight of the magnet 230. Consequently, under the weight of the magnet 230 and the movable portion fixedly connected thereto, the movable portion moves downward.

[0045] This form of utilizing the cooperation between the energized coil 120 and the magnetic steel 230 to realize the upward and downward movement of the moving part has a simple structure and reliable function.

[0046] Please continue to refer to Figure 3 In this embodiment, the base 110 may include a base 111 and a sleeve 112 fixedly arranged on the base 111. Specifically, the sleeve 112 forms a guide part; the moving part includes a transmission shaft 210, the transmission shaft 210 is inserted into the sleeve 112, the adsorption head 220 is fixedly arranged on the transmission shaft 210, and an accommodating cavity is provided inside the transmission shaft 210. The magnet 230 is located in the accommodating cavity, and the coil 120 is arranged around the transmission shaft 210.

[0047] This structural form of using the accommodating cavity inside the transmission shaft 210 to install the magnet 230 effectively utilizes the internal space of the transmission shaft 210, not only further improving the structural compactness of the silicon wafer adsorption unit 010 of this embodiment, but also protecting the magnet 230, reducing damage to the magnet 230 during the assembly process, and extending the service life of the magnet 230.

[0048] Please continue to refer to Figure 3Specifically, the inner cavity of the transmission shaft 210 is provided with a step, and one end of the magnet 230 abuts against the step, being restrained by the step, and the magnet 230 is bonded and fixed to the transmission shaft 210. This arrangement not only ensures the assembly accuracy of the magnet 230, but also ensures the reliability of the connection between the magnet 230 and the transmission shaft 210.

[0049] Please continue to refer to Figure 2 and Figure 3 In this embodiment, the mover assembly further includes a connecting seat 240 , which is located between the adsorption head 220 and the transmission shaft 210 and is used to fix the adsorption head 220 to the transmission shaft 210 .

[0050] In this embodiment, specifically, the cross-section of the inner cavity of the sleeve 112 is rectangular, and accordingly, the cross-section of the transmission shaft 210 is also rectangular, matching the rectangular shape of the inner cavity of the sleeve 112. This arrangement achieves circumferential rotational limit of the transmission shaft 210 and the sleeve 112, namely, the transmission shaft 210 is limited in its freedom of movement along the X-axis, the freedom of movement along the Y-axis, the freedom of rotation about the X-axis, the freedom of rotation about the Y-axis, and the freedom of rotation about the Z-axis, so that the transmission shaft 210 can only move along the Z-axis, thereby ensuring efficient adsorption of silicon wafers by the adsorption head 220.

[0051] Preferably, the cross section of the inner cavity of the sleeve 112 is square, and accordingly, the cross section of the transmission shaft 210 is also square.

[0052] Please continue to refer to Figure 2 and Figure 3 In this embodiment, the stator assembly further includes a housing 130. Specifically, the housing 130 is fixedly connected to the base 111. The sleeve 112, the transmission shaft 210, the magnet 230, and the coil 120 are all disposed within the housing 130. The adsorption head 220 can protrude from the housing 130. The coil 120 is adhesively fixed to the housing 130.

[0053] The setting of the shell 130 ensures the structural sealing of the silicon wafer adsorption unit 010 of this embodiment, which not only protects components such as the sleeve 112, the transmission shaft 210, the magnet 230 and the coil 120, thereby extending the working life, but also prevents heat from being dissipated outward, thereby reducing the impact of the silicon wafer adsorption unit 010 on the environment during operation.

[0054] Please continue to refer to Figure 2 and Figure 3Specifically, housing 130 includes a shell 132 and a cover 131. Shell 132 is fixedly connected to base 111 and has an open top. Cover 131 is fixedly connected to shell 132 to close the open top. This arrangement facilitates the fabrication of housing 130 and the overall assembly of silicon wafer adsorption unit 010 in this embodiment.

[0055] Please continue to refer to Figure 2 and Figure 3 An opening 135 is provided in the middle of the shell cover 131 , and the adsorption head 220 can protrude from the above opening 135 .

[0056] Please continue to refer to Figure 3 In this embodiment, a first liquid flow channel 133 is provided within the housing 130. First liquid flow channel 133 is configured to allow coolant to flow. During operation of the silicon wafer adsorption unit 010, coolant can be introduced into the first liquid flow channel 133 to dissipate heat generated by the coil 120. This coolant reduces the adverse effects of high temperatures on components within the housing 130, thereby ensuring the operational reliability of the silicon wafer adsorption unit 010 in this embodiment.

[0057] Preferably, the first liquid flow channel 133 is spiral, and the spiral first liquid flow channel 133 is arranged around the coil 120. Such an arrangement greatly increases the cooling range of the first liquid flow channel 133, so that heat can be quickly taken away, ensuring timely cooling.

[0058] Please continue to refer to Figure 3 In this embodiment, a second liquid flow channel 113 is provided within the base 111. This second liquid flow channel 113 is also configured to allow the flow of coolant. During operation of the silicon wafer adsorption unit 010, coolant can be introduced into the second liquid flow channel 113 to remove heat transferred to the base 111, thereby reducing the adverse effects of high temperatures and further improving the operational reliability of the silicon wafer adsorption unit 010 of this embodiment.

[0059] Preferably, the second liquid flow channel 113 is spirally arranged along the circumference of the base 111. This arrangement can increase the cooling range of the second liquid flow channel 113, allowing the heat in the base 111 to be quickly taken away, thereby further improving the cooling efficiency.

[0060] Specifically, in this embodiment, the first liquid flow channel 133 and the second liquid flow channel 113 are connected to form a cooling flow channel, and the base 111 is provided with a water inlet 117 and a water outlet, wherein the water inlet 117 and the water outlet are respectively connected and arranged at both ends of the cooling flow channel.

[0061] When the silicon wafer adsorption unit 010 is working, the coolant enters the cooling channel from the water inlet 117. As the coolant flows in the cooling channel, the heat generated in the base 111 and the shell 130 is taken away, and then flows out from the water outlet, thereby cooling the silicon wafer adsorption unit 010 of this embodiment.

[0062] It should be noted that, in this embodiment, the coolant may be water or other liquids with cooling function, and this embodiment is not limited to this.

[0063] It should also be noted that the positions of the water inlet 117 and the water outlet on the base 111 can be interchanged.

[0064] Specifically, in this embodiment, an air film is formed between the drive shaft 210 and the sleeve 112, and the air film is configured to lubricate the space between the drive shaft 210 and the sleeve 112. This arrangement not only ensures smooth movement of the drive shaft 210 and enables smooth extension and retraction of the suction head 220, but also avoids the situation in which traditional grease lubrication methods, such as grease volatilization, can cause particle contamination of the silicon wafer, thereby reducing damage to the silicon wafer.

[0065] Please continue to refer to Figure 3 In this embodiment, a first sealing ring 140 and a second sealing ring 150 are arranged between the sleeve 112 and the housing 130. The first sealing ring 140 and the second sealing ring 150 are arranged at intervals along the axial direction of the sleeve 112, wherein the sleeve 112 and the housing 130 form an air cavity 160 between the first sealing ring 140 and the second sealing ring 150; the base 111 is provided with a first air port 114, which is connected to the air cavity 160, and the sleeve 112 is provided with a channel connected to the air cavity 160. The air source can enter between the sleeve 112 and the transmission shaft 210 through the first air port 114, the air cavity 160, and the channel in sequence to form the above-mentioned air film.

[0066] During operation of the silicon wafer adsorption unit 010, the gas source enters the air cavity 160 between the shell 130 and the sleeve 112 through the first gas port 114, and then enters between the sleeve 112 and the transmission shaft 210 through the channel opened in the sleeve 112, forming an air film between the sleeve 112 and the transmission shaft 210 to achieve lubrication of the transmission shaft 210.

[0067] The provision of the first sealing ring 140 and the second sealing ring 150 ensures the sealing of the air cavity 160 and avoids gas leakage, thereby ensuring the reliability of the formation of the air film.

[0068] Please continue to refer to Figure 3Specifically, a third sealing ring 270 is provided between the connecting section 223 and the connecting seat 240 . The third sealing ring 270 is used to achieve sealing between the connecting seat 240 and the connecting section 223 to reduce gas leakage and ensure the adsorption reliability of the adsorption head 220 .

[0069] Please continue to refer to Figure 2 and Figure 3 In this embodiment, the mover assembly may further include a grating scale 260, wherein the grating scale 260 is fixedly disposed relative to the transmission shaft 210; correspondingly, the stator assembly includes a reading head 180, which is fixedly disposed relative to the base 111 and is configured to read data from the grating scale 260. Specifically, the grating scale 260 is adhesively fixed to the fixing base 250, and the fixing base 250 is fixedly connected to the transmission shaft 210.

[0070] During the operation of the silicon wafer adsorption unit 010, as the transmission shaft 210 moves in the Z-axis direction, the grating scale 260 moves synchronously. During this process, the reading head 180 reads the data on the grating scale 260, and can accurately know the current position of the adsorption head 220, thereby facilitating the control of the adsorption process of the adsorption head 220.

[0071] Specifically, the reading head 180 can be electrically connected to the controller of the silicon wafer adsorption unit 010. At the same time, the coil 120 is also electrically connected to the controller of the silicon wafer adsorption unit 010. When the reading head 180 reads the scale of the grating ruler 260, the data is fed back to the controller. The controller calculates the current height of the adsorption head 220 and then adjusts the height of the adsorption head 220 by controlling the current flowing into the coil 120.

[0072] It should be noted that how to perform feedback adjustment on the adsorption head 220 based on the data read by the reading head 180 is an existing technology well known to those skilled in the art. This embodiment does not make any improvements to this, so it will not be described in detail.

[0073] Please continue to refer to Figure 3 In this embodiment, the base 111 is further provided with a second air port 115, which is configured to introduce a vacuum air source. A vacuum air passage is provided in the mover assembly along the axial direction of the transmission shaft 210. The second air port 115 is connected to the vacuum air passage via an air pipe 170 to provide vacuum suction to the suction head 220.

[0074] Specifically, the drive shaft 210, magnet 230, connector 240, and suction head 220 all have hollow structures. These hollow structures are arranged substantially collinearly to form a vacuum air passage. This arrangement of the actuator assembly centralizes the vacuum air passage at the center of the wafer suction unit 010, further enhancing its compactness.

[0075] Please continue to refer to Figure 3 In this embodiment, the base 111 is provided with a lower limiter 116, which is used to limit the maximum downward travel of the transmission shaft 210. This configuration can prevent the transmission shaft 210 from excessively moving downward and causing ineffective travel, thereby improving the operating efficiency of the silicon wafer adsorption unit 010 in this embodiment to a certain extent.

[0076] Similarly, please refer to Figure 3 The housing 130 is provided with an upper limit portion, which is used to limit the maximum upward travel of the transmission shaft 210. This configuration can avoid invalid travel caused by excessive upward movement of the transmission shaft 210, further improving the working efficiency of the silicon wafer adsorption unit 010 of this embodiment.

[0077] In this embodiment, the air pipe 170 is made of conductive rubber, while the base 111, sleeve 112, housing 130, and transmission shaft 210 are all made of metal. This arrangement allows the silicon wafer adsorption unit 010 to conduct static electricity downward when in use, reducing product defects caused by static electricity.

[0078] Please continue to refer to Figure 2 and Figure 3 In this embodiment, the adsorption head 220 includes an adsorption section 221, a flexible section 222 and a connecting section 223 arranged in sequence. Specifically, the adsorption section 221 is used to adsorb silicon wafers; the connecting section 223 is used to connect with the connecting base 240 so as to be fixed to the transmission shaft 210 through the connecting base 240; the flexible section 222 is configured to enable the adsorption section 221 to have rotational freedom around the X-axis, rotational freedom around the Y-axis and movement freedom along the Z-axis, wherein the Z-axis is the movement direction of the transmission shaft 210.

[0079] This structural form in which the middle section of the adsorption head 220 is set as the flexible section 222 allows the silicon wafer adsorption unit 010 to have the adsorption section 221 with rotational freedom around the X-axis, rotational freedom around the Y-axis and movement freedom along the Z-axis during operation, so that it can fully fit with the surface of the silicon wafer during the transmission of the silicon wafer, thereby improving the adsorption force and ensuring the transmission reliability of the silicon wafer.

[0080] Specifically, in this embodiment, the adsorption section 221 and the connecting section 223 are made of metal, and the flexible section 222 is made of conductive rubber. This arrangement allows static electricity generated on the surface of the silicon wafer to be directly conducted downward through the adsorption head 220, thereby promptly reducing the static electricity generated on the silicon wafer surface and thus reducing damage to the silicon wafer caused by static discharge.

[0081] Please continue to refer to Figure 2 and Figure 3 In this embodiment, the outer surface of the housing 130 partially extends outward to form a connecting ear 134, which is used to securely connect to the mounting base of the silicon wafer transfer device. The overall resistance from the suction end surface of the suction section 221 to the connecting ear 134 is less than 1 MΩ, effectively preventing damage to the silicon wafer due to electrostatic discharge.

[0082] In other embodiments, the flexible section 222 may also adopt a flexible hinge.

[0083] This embodiment further provides a silicon wafer transfer device, comprising a mounting base, wherein the mounting base is installed with at least one of the above-mentioned silicon wafer adsorption units 010.

[0084] By setting the above-mentioned silicon wafer adsorption unit 010 in the silicon wafer transmission device, the silicon wafer transmission device accordingly has all the advantages of the above-mentioned silicon wafer adsorption unit 010, which will not be described in detail here.

[0085] In addition, the silicon wafer transfer device adopts the above-mentioned independently controlled silicon wafer adsorption unit 010, so that when multiple silicon wafer adsorption units 010 are used to transfer silicon wafers, the positions of the multiple silicon wafer adsorption units 010 can be freely arranged, and the appropriate number of silicon wafer adsorption units 010 can be selected according to the actual size of the silicon wafer, so that the transfer of silicon wafers does not need to be restricted by the specifications of the silicon wafers, thereby improving the versatility of the silicon wafer transfer device of this embodiment.

[0086] Preferably, the silicon wafer transfer device includes three silicon wafer adsorption units 010. This arrangement can greatly improve the adsorption reliability of the silicon wafer, thereby ensuring reliable transmission of the silicon wafer.

[0087] Specifically, when the silicon wafer transfer device includes multiple silicon wafer suction units 010, each of the multiple silicon wafer suction units 010 can be independently controlled. In this case, the reading heads 180 of each silicon wafer suction unit 010 and the grating scale 260 used in conjunction with the reading heads 180 can be utilized to achieve synchronized movement of each silicon wafer suction unit 010. This arrangement reduces the connection structure between the suction cup 50 and the mover 21 in the prior art integrated structure, thereby improving the structural compactness of the silicon wafer transfer device and significantly reducing the layout space of the silicon wafer transfer device.

[0088] Specifically, a grounding loop is provided within the mounting base. When the silicon wafer adsorption unit 010 is mounted on the mounting base, static electricity generated by the silicon wafer is transferred to the mounting base through the silicon wafer adsorption unit 010, and then to the ground through the grounding loop, completing the static discharge and reducing damage to the silicon wafer.

[0089] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the scope defined by the claims.

[0090] Finally, it should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprises" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article, or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprises a ..." does not exclude the presence of other identical elements in the process, method, article, or device that includes the element.

[0091] In the above embodiments, the descriptions of directions such as “upper”, “lower”, and “side” are all based on the drawings.

[0092] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A silicon wafer adsorption unit, characterized in that: The invention comprises a stator assembly and a mover assembly, wherein the stator assembly comprises a base (110), the base (110) is provided with a guide portion, the base (110) comprises a seat (111) and a sleeve (112) fixedly arranged on the seat (111), and the sleeve (112) forms the guide portion; the mover assembly comprises a moving portion and an adsorption head (220), the moving portion and the guide portion are plugged together, and a circumferential limiting structure for limiting relative rotation between the moving portion and the guide portion is provided between the moving portion and the guide portion; the adsorption head (220) is fixedly arranged on the moving portion, and the two are arranged along the plugging direction of the moving portion and the guide portion; The stator assembly further comprises a coil (120) fixedly arranged relative to the base (110), the movable assembly further comprises a magnet (230) fixedly connected to the moving part, and the coil (120) is at least partially arranged around the magnet (230); the moving part comprises a transmission shaft (210), the transmission shaft (210) is plugged into the sleeve (112), the adsorption head (220) is fixedly arranged on the transmission shaft (210), an accommodating cavity is provided inside the transmission shaft (210), the magnet (230) is located in the accommodating cavity, the inner cavity of the transmission shaft (210) is provided with a step, and one end of the magnet (230) is against the step; the coil (120) is arranged around the transmission shaft (210).

2. The silicon wafer adsorption unit according to claim 1, characterized in that: The stator assembly further includes a housing (130), wherein the housing (130) is fixedly connected to the base (111), the sleeve (112), the transmission shaft (210), the magnetic steel (230) and the coil (120) are all arranged in the housing (130), and the adsorption head (220) can protrude from the housing (130).

3. The silicon wafer adsorption unit according to claim 2, characterized in that: A first liquid flow channel (133) is provided in the housing (130), and the first liquid flow channel (133) is configured to allow a coolant to flow; And / or, a second liquid flow channel (113) is provided in the base (111), and the second liquid flow channel (113) is configured to allow cooling liquid to flow.

4. The silicon wafer adsorption unit according to claim 3, characterized in that: The first liquid flow channel (133) is connected to the second liquid flow channel (113) to form a cooling flow channel. The base (111) is provided with a water inlet (117) and a water outlet. The water inlet (117) and the water outlet are respectively connected and arranged at two ends of the cooling flow channel.

5. The silicon wafer adsorption unit according to claim 2, characterized in that: An air film is provided between the transmission shaft (210) and the sleeve (112), and the air film is configured to lubricate between the transmission shaft (210) and the sleeve (112).

6. The silicon wafer adsorption unit according to claim 5, characterized in that: A first sealing ring (140) and a second sealing ring (150) are provided between the sleeve (112) and the housing (130), and the first sealing ring (140) and the second sealing ring (150) are spaced apart along the axial direction of the sleeve (112), and an air cavity (160) is formed between the sleeve (112) and the housing (130) between the first sealing ring (140) and the second sealing ring (150); the base (111) is provided with a first air port (114), and the first air port (114) is communicated with the air cavity (160), and the sleeve (112 is provided with a channel communicated with the air cavity (160), so that the air source can enter between the sleeve (112) and the transmission shaft (210) through the first air port (114), the air cavity (160), and the channel in sequence to form the air film.

7. The silicon wafer adsorption unit according to claim 2, characterized in that: The base (111) is further provided with a second air port (115), which is configured to introduce a vacuum air source; a vacuum air duct is opened in the mover assembly along the axial direction of the transmission shaft (210), and the second air port (115) is connected to the vacuum air duct through an air pipe (170) to provide a vacuum adsorption force to the adsorption head (220).

8. The silicon wafer adsorption unit according to claim 7, characterized in that: The material of the air pipe (170) is conductive rubber; the material of the base (111), the sleeve (112), the housing (130) and the transmission shaft (210) are all metal.

9. The silicon wafer adsorption unit according to any one of claims 1 to 8, characterized in that: The adsorption head (220) comprises an adsorption section (221), a flexible section (222) and a connecting section (223) which are arranged in sequence, wherein the adsorption section (221) is used to adsorb components; the connecting section (223) is used to be connected to the moving part; and the flexible section (222) is configured so that the adsorption section (221) has a rotational degree of freedom around the X-axis, a rotational degree of freedom around the Y-axis and a movement degree of freedom along the Z-axis, wherein the Z-axis is the movement direction of the moving part.

10. The silicon wafer adsorption unit according to claim 9, characterized in that: The adsorption section (221) and the connection section (223) are made of metal, and the flexible section (222) is made of conductive rubber.

11. The silicon wafer adsorption unit according to any one of claims 1 to 8, characterized in that: The movable component further includes a grating ruler (260), and the grating ruler (260) is fixedly arranged relative to the moving part; the stator component further includes a reading head (180), and the reading head (180) is fixedly arranged relative to the base (110), and the reading head (180) is configured to read data from the grating ruler (260).

12. The silicon wafer adsorption unit according to any one of claims 2 to 8, characterized in that: The base (111) is provided with a lower limit portion (116), and the lower limit portion (116) is used to limit the maximum stroke of the transmission shaft (210) when moving downward; And / or, the housing (130) is provided with an upper limit portion, and the upper limit portion is used to limit the maximum stroke of the transmission shaft (210) when moving upward.

13. A silicon wafer transport device, characterized in that: It comprises a mounting seat, on which at least one silicon wafer adsorption unit according to any one of claims 1 to 12 is installed.

14. The silicon wafer transfer device according to claim 13, wherein: A grounding loop is provided in the mounting base.

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