An intelligent computer CPU cooling water cooling head

Abstract

The invention discloses an intelligent computer CPU cooling water cooling head, comprising a main body. The device is provided with a semiconductor cooling plate with a built-in temperature sensor in the main body, and the semiconductor cooling plate is used as a heat-conducting bottom plate. Under continuous cooling, the temperature of the heat dissipation surface will rise, and then the heat generated by the heat dissipation surface will be taken away by the liquid flowing through, so that the device can achieve cooling and heat dissipation at the same time. In terms of cooling, a control panel is provided to automatically control it, so that the temperature difference set by the program in the control panel will not generate condensed water, so the semiconductor cooling plate can be directly applied to the surface of the electronic chip. In terms of heat dissipation, an overheating automatic power-off device is provided in the control panel to avoid high temperature burning of the semiconductor cooling plate due to the inability of the semiconductor to dissipate heat when the water flow is not circulated. In addition, the control panel adopts a liquid crystal screen plus a circuit board, so the control panel is smaller in size and more powerful in function, and can be installed in a smaller position.

Description

Technical Field

[0001] The invention relates to the field of water cooling heads, and in particular to an intelligent computer CPU refrigeration water cooling head. Background Art

[0002] All CPU water cooling heads on the market now have thermal conductive base plates made of a copper plate. Due to the heat absorption characteristics of the copper plate, the temperature of the CPU surface is conducted through the copper plate, and a sealed system is formed through the upper cover composed of a sealing ring, allowing water to flow through the copper plate surface to take away the heat of the CPU to achieve the effect of cooling and heat dissipation. Including the liquid cooling solutions currently used in industry, the water cooling heads (heat absorbing heads) are all formed based on this principle.

[0003] Its advantages are low cost and simple structure, but its disadvantage is that all accessories operate at room temperature, which means that the temperature of the chip being cooled must be much higher than the room temperature for this passive cooling structure using water flow. If the temperature on the surface of the CPU or other chips rises sharply, serious consequences will occur, and the bottleneck of this structure cannot be broken.

[0004] The traditional semiconductor refrigeration chip itself is only equipped with positive and negative wires. When used with a traditional control box, the temperature required for refrigeration is manually set on the control box, and then the refrigeration chip starts working, reaches the set temperature and then cuts off the power. The heat dissipation surface adopts fin-shaped heat sinks and fans for passive heat dissipation. The control box used in the whole system is generally composed of a single chip machine, so it is large in size. It is generally installed separately from the semiconductor and connected by a cable. The advantages of this type of structure and matching are low cost and convenient procurement. The disadvantage is that the semiconductor refrigeration chip itself cannot detect the temperature of the refrigeration surface, but the control box issues instructions to power on or off. In addition, the temperature of the control box is set manually. If the working environment temperature of the refrigeration chip changes, condensation water will be generated due to the large difference between the temperature set by the control box and the ambient temperature. In this case, condensation water will continue to be generated, which will cause serious harm to electronic components. In addition, the heat dissipation surface of the traditional semiconductor, because there is no temperature detection, only relies on fin-shaped heat sinks and fans for passive heat dissipation. If the fan stops due to a fault, the temperature of the heat dissipation surface will continue to rise, and then burn the semiconductor refrigeration chip, causing losses.

[0005] Therefore, there is an urgent need for an intelligent CPU water cooling head that can perform cooling and heat dissipation at the same time, can be directly applied to the surface of electronic components, does not need to occupy much space, and can avoid the generation of condensed water. Summary of the invention

[0006] In order to solve the above problems, the present invention provides an intelligent computer CPU cooling water cooling head.

[0007] The present invention is achieved through the following technical solutions:

[0008] An intelligent computer CPU cooling water cooling head comprises a main body, an upper cover plate is arranged on one side of the main body, bolts are screwed on the upper cover plate, a water inlet installation port and a water outlet installation port are respectively arranged on the upper cover plate, a first through slot is arranged on the upper cover plate, the first through slot is arranged between the water inlet installation port and the water outlet installation port, a first wire slot and a second wire slot are arranged on a side wall of the top of the main body, the first wire slot and the second wire slot are arranged perpendicular to each other and the first wire slot and the second wire slot are connected, the second wire slot is a through slot, a concave slot is arranged in the main body, the concave slot divides the main body into three areas, wherein One side is the water inlet area, and the other side is the water outlet area. Two first sealing grooves are arranged on the top surfaces of the water inlet area and the water outlet area, and a first sealing ring is embedded in each first sealing groove. Four mounting blocks are evenly arranged at the four corners of the inner wall of the concave groove, and the four mounting blocks are integrally formed with the concave groove by casting. Threaded holes are arranged on the four mounting blocks, and a control panel is arranged on the same side of the four mounting blocks, and bolts are screwed on the control panel. A mounting hole is fixedly arranged at the center of the bottom surface of the concave groove, and a first temperature control sensor is fixedly embedded in the mounting hole, and one end of the first temperature control sensor with a detection head passes through the mounting hole A semiconductor refrigeration plate is arranged in the main body, and the semiconductor refrigeration plate is composed of a cooling surface, a heat dissipation surface and a semiconductor refrigeration plate main body. A lower cover plate is arranged at the bottom end of the cooling surface, and bolts are screwed at the four corners of the lower cover plate respectively. A second sealing groove is arranged on the bottom surface of the main body, and a second sealing ring is embedded in the second sealing groove. Two wiring grooves are symmetrically arranged on one side of the second sealing groove. The two wiring grooves are L-shaped, and the two wiring grooves are respectively communicated with the second wire groove. The two wiring grooves are arranged on the main body, and the four corners of the outer wall of the lower cover plate are respectively fixedly installed with clamps. The lower cover plate and the clamps are integrally formed by casting. A second through groove is provided on the lower cover plate, and the main body of the semiconductor refrigeration plate is composed of a ceramic upper panel, a ceramic lower panel, a silicone sealing frame, a cooling layer and a second temperature control sensor. The silicone sealing frame is arranged between the ceramic upper panel and the ceramic lower panel, and a cooling layer is bonded in the silicone sealing frame. The second temperature control sensor is embedded in the ceramic lower panel. The detection head of the first temperature control sensor is bonded to the heat dissipation surface. The control panel adopts an integrated circuit control panel with a processor and a liquid crystal screen. The cooling layer is composed of P / N particles, and the second temperature control sensor adopts a patch temperature sensor.

[0009] Compared with the existing technology, the beneficial effects of the present invention are as follows: the device uses a semiconductor refrigeration plate with a built-in temperature sensor in the main body, and adopts the semiconductor refrigeration plate as a heat-conducting base plate. Under continuous cooling, the temperature of the heat dissipation surface will rise, and then the heat generated by the heat dissipation surface will be taken away by the liquid flowing through, so that the device can achieve cooling and heat dissipation at the same time. In terms of cooling, a control panel is provided to enable automatic control, so that the temperature difference set by the program in the control panel will not produce condensed water, so the semiconductor refrigeration plate can be directly applied to the surface of the electronic chip. In terms of heat dissipation, an overheating automatic power-off device is provided in the control panel to avoid high temperature burning of the semiconductor refrigeration plate due to the inability of the semiconductor to dissipate heat when the water flow is not circulated. In addition, the control panel adopts a liquid crystal screen plus a circuit board, so the control board is smaller in size and more powerful in function, and can be installed in a smaller position. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a structural diagram of the structure of the present invention;

[0011] Figure 2 It is a left side view of the upper cover plate of the structure of the present invention;

[0012] Figure 3 It is a left side view of the structural main body of the present invention;

[0013] Figure 4 It is a right side view of the structural main body of the present invention;

[0014] Figure 5 It is a right side view of the lower cover plate of the structure of the present invention;

[0015] Figure 6 It is a structural diagram of the semiconductor refrigeration sheet of the present invention.

[0016] In the figure: main body 1, upper cover plate 2, water inlet mounting port 3, water outlet mounting port 4, first through groove 5, first sealing groove 6, first sealing ring 7, concave groove 8, mounting block 9, control panel 10, first temperature control sensor 11, mounting hole 12, threaded hole 13, semiconductor cooling plate 14, second sealing groove 15, second sealing ring 16, lower cover plate 17, clamp 18, second temperature control sensor 19, second through groove 20, water inlet area 21, water outlet area 22, ceramic upper panel 23, ceramic lower panel 24, silicone sealing frame 25, cooling layer 26, first wire groove 27, cooling surface 28, second wire groove 29, wiring groove 30, heat dissipation surface 31. DETAILED DESCRIPTION

[0017] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments:

[0018] like Figure 1 , Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6As shown, an intelligent computer CPU cooling water cooling head comprises a main body 1, an upper cover plate 2 is arranged on one side of the main body 1, bolts are screwed on the upper cover plate 2, a water inlet installation port 3 and a water outlet installation port 4 are respectively arranged on the upper cover plate 2, a first through groove 5 is arranged on the upper cover plate 2, and the first through groove 5 is arranged between the water inlet installation port 3 and the water outlet installation port 4, a first wire groove 27 and a second wire groove 29 are arranged on a side wall of the top of the main body 1, the first wire groove 27 and the second wire groove 29 are arranged perpendicular to each other and the first wire groove 27 and the second wire groove 29 are connected, and the second wire groove 29 is a through groove, and a concave groove 8 is arranged in the main body 1, and the concave groove 8 divides the main body 1 into three areas, one side of which is the inlet The water inlet area 21 and the water outlet area 22 are provided with two first sealing grooves 6 on the top surfaces of the water inlet area 21 and the water outlet area 22, and a first sealing ring 7 is embedded in each of the first sealing grooves 6. Four mounting blocks 9 are evenly arranged at the four corners of the inner wall of the concave groove 8, and the four mounting blocks 9 are integrally formed with the concave groove 8 by casting. Threaded holes 13 are arranged on the four mounting blocks 9, and a control panel 10 is arranged on the same side of the four mounting blocks 9, and bolts are screwed on the control panel 10. A mounting hole 12 is fixedly arranged at the center of the inner bottom surface of the concave groove 8, and a first temperature control sensor 11 is fixedly embedded in the mounting hole 12, and one end of the first temperature control sensor 11 with a detection head passes through the mounting hole 12, and the main body 1 is provided with a A semiconductor refrigeration sheet 14 is arranged, and the semiconductor refrigeration sheet 14 is composed of a cooling surface 28, a heat dissipation surface 31 and a main body of the semiconductor refrigeration sheet 14. A lower cover plate 17 is arranged at the bottom end of the cooling surface 28, and bolts are screwed at the four corners of the lower cover plate 17. A second sealing groove 15 is arranged on the bottom surface of the main body 1, and a second sealing ring 16 is embedded in the second sealing groove 15. Two wiring grooves 30 are symmetrically arranged on one side of the second sealing groove 15. The two wiring grooves 30 are L-shaped, and the two wiring grooves 30 are respectively communicated with the second wire groove 29. The two wiring grooves 30 are arranged on the main body 1, and the four corners of the outer wall of the lower cover plate 17 are respectively fixedly installed with clamps 18. The lower cover plate 17 and the clamps 18 are integrally formed by casting. A second through groove 20 is provided on the plate 17, and the main body of the semiconductor refrigeration plate 14 is composed of a ceramic upper panel 23, a ceramic lower panel 24, a silicone sealing frame 25, a cooling layer 26 and a second temperature control sensor 19. The silicone sealing frame 25 is arranged between the ceramic upper panel 23 and the ceramic lower panel 24, and the cooling layer 26 is bonded to the silicone sealing frame 25. The second temperature control sensor 19 is embedded in the ceramic lower panel 24. The detection head of the first temperature control sensor 11 is bonded to the heat dissipation surface 31. The control panel 10 adopts an integrated circuit control panel with a processor and a liquid crystal screen. The cooling layer 26 is composed of P / N particles, and the second temperature control sensor 19 adopts a patch temperature sensor.

[0019] Working Principle: When installing and using this device, first refer to the attached Figure 1 , press the device against the Figure 1 After the installation is performed as shown, the water inlet installation port 3 is connected to the external water inlet pipe, and the water outlet installation port 4 is connected to the external water outlet pipe, so that the device can work normally. The two first sealing rings 7 and the second sealing ring 16 can well ensure the sealing of the device, so that water enters the water inlet area 21 along the water inlet installation port 3, and then flows into the water outlet area 22 through the installation hole 12 and the heat dissipation surface 31, and then is discharged from the water outlet installation port 4, forming a complete cycle, and the heat dissipation surface 31 of the semiconductor refrigeration plate 14 is dissipated. At the same time, the semiconductor refrigeration plate 14 is used as a heat-conducting base plate, the refrigeration surface 28 is attached to the surface of the electronic component 28 that needs heat dissipation, and the heat dissipation surface 31 is facing the upper cover plate 2 containing the first sealing ring 7, and the coolant is attached to the heat dissipation surface 31. Under continuous cooling, the temperature of the heat dissipation surface 31 will increase, and then the coolant flowing through will take away the heat emitted by the heat dissipation surface 31, so that the device can achieve both cooling and heat dissipation.

[0020] The cooling surface 28 of the semiconductor refrigeration sheet 14 is equipped with a second temperature control sensor 19 for detecting the cooling temperature, which can transmit the temperature of the cooling surface 28 to the control panel 10 in real time. The control panel 10 has a built-in program, and a third temperature sensor is installed indoors, so that it is connected to the control panel 10 through a line, so that the control panel 10 can automatically set the temperature difference between the room temperature and the cooling surface 28 to a certain value, and can automatically adjust the temperature of the cooling surface 28 according to the change of the room temperature (assuming that the room temperature is 30 degrees, and the program requires that the temperature of the cooling surface 28 be maintained at 4 degrees below the room temperature, then when the temperature of the cooling surface 28 is 26 degrees, the control board will issue an instruction to cut off the power of the semiconductor refrigeration sheet 14. If the room temperature rises to 35 degrees, the program will automatically issue an instruction to control the temperature of the cooling surface 28 to above 31 degrees). This has the advantage that the cooling temperature of the cooling surface 28 of the semiconductor refrigeration sheet 14 will be automatically controlled by the control panel 10, and the temperature difference set by the program in the control panel 10 will not produce condensed water, so the semiconductor refrigeration sheet 14 can be directly applied to the surface of the electronic chip.

[0021] A first temperature control sensor 11 is set on the surface of the heat dissipation surface of the semiconductor refrigeration chip 14. The maximum limit temperature of the first temperature control sensor 11 is set in the control panel 10. When the limit temperature is exceeded, the control panel will issue a command to cut off the power to the semiconductor refrigeration chip 14 to avoid burning. In addition, the control panel 10 adopts a liquid crystal screen plus a circuit board, so the control panel is smaller in size and more powerful in function, and can be installed in a smaller position.

[0022] The length and width of the heat dissipation surface 31 of the semiconductor refrigeration plate 14 are greater than the length and width of the cooling surface 28, so that the second through groove 20 can be better engaged and fixed by the lower cover plate 17, and two wiring grooves 30 are set, so that the sensing connection line of the second temperature control sensor 19 and the power line of the semiconductor refrigeration plate 14 can pass through the second wire groove 29 at the same time, and then be connected to the control panel 10. The first temperature control sensor 11 is connected to the control panel 10 through the line, and the third temperature control sensor arranged indoors is extended into the main body 1 through the first wire groove 27 and connected to the control panel 10, thereby ensuring the normal use of the device.

[0023] And there are no products with this structure on the market now. This device can be used for computer chip heat dissipation, LED chip heat dissipation, and intelligent machine equipment chip heat dissipation, and the heat dissipation range is very wide.

[0024] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. An intelligent computer CPU cooling water cooling head, comprising a main body (1), an upper cover plate (2) is arranged on one side of the main body (1), bolts are screwed on the upper cover plate (2), and a water inlet installation port (3) and a water outlet installation port (4) are respectively arranged on the upper cover plate (2), characterized in that: The upper cover plate (2) is provided with a first through groove (5), the first through groove (5) being arranged between the water inlet installation port (3) and the water outlet installation port (4), and a first wire groove (27) and a second wire groove (29) being arranged on a side wall at the top end of the main body (1).The first wire groove (27) and the second wire groove (29) are arranged perpendicular to each other and communicate with each other. The second wire groove (29) is a through groove. A concave groove (8) is arranged in the main body (1). The concave groove (8) divides the main body (1) into three areas, one side of which is a water inlet area (21) and the other side is a water outlet area (22). Two first sealing grooves (6) are arranged on the top surfaces of the water inlet area (21) and the water outlet area (22). A first sealing ring (7) is embedded in each of the first sealing grooves (6). Four mounting blocks (9) are evenly arranged at the four corners of the inner wall of the concave groove (8). The four mounting blocks (9) are integrally formed with the concave groove (8) by casting. , four mounting blocks (9) are all provided with threaded holes (13), a control panel (10) is provided on the same side of the four mounting blocks (9), bolts are screwed on the control panel (10), a mounting hole (12) is fixedly provided at the center of the inner bottom surface of the concave groove (8), a first temperature control sensor (11) is fixedly embedded in the mounting hole (12), one end of the first temperature control sensor (11) with a detection head passes through the mounting hole (12), a semiconductor cooling plate (14) is provided in the main body (1), the semiconductor cooling plate (14) is composed of a cooling surface (28), a heat dissipation surface (31) and a main body of the semiconductor cooling plate (14), a lower cover plate (17) is provided at the bottom end of the cooling surface (28), and the lower cover plate (17) 7) bolts are respectively screwed at the four corners, a second sealing groove (15) is arranged on the bottom surface of the main body (1), a second sealing ring (16) is embedded in the second sealing groove (15), two wiring grooves (30) are symmetrically arranged on one side of the second sealing groove (15), the two wiring grooves (30) are L-shaped, the two wiring grooves (30) are respectively communicated with the second wire groove (29), the two wiring grooves (30) are arranged on the main body (1), the outer wall of the lower cover plate (17) is respectively fixed with clamps (18) at the four corners, the lower cover plate (17) and the clamps (18) are integrally formed by casting, the lower cover plate (17) is provided with a second through groove (20), the main body of the semiconductor cooling plate (14) is composed of a ceramic upper panel (2 3), a ceramic lower panel (24), a silicone sealing frame (25), a cooling layer (26) and a second temperature control sensor (19), wherein the silicone sealing frame (25) is arranged between the ceramic upper panel (23) and the ceramic lower panel (24), the cooling layer (26) is laminated in the silicone sealing frame (25), the second temperature control sensor (19) is embedded in the ceramic lower panel (24), the detection head of the first temperature control sensor (11) is laminated with the heat dissipation surface (31), the control panel (10) adopts an integrated circuit control panel with a processor and a liquid crystal screen, the cooling layer (26) is composed of P / N particles, and the second temperature control sensor (19) adopts a patch temperature sensor.

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