Electronic device including interposer

Abstract

The present invention discloses an electronic device. According to various embodiments, the electronic device may include: a first circuit board; a first interposer disposed on the first circuit board and having a first height; a second circuit board electrically connected to the first interposer and disposed on the first interposer; a second interposer disposed on the first circuit board to form an outside of the first interposer and having a second height; and a third circuit board electrically connected to the second interposer and disposed on the second interposer. There may be various embodiments.

Description

Technical Field

[0001] Various embodiments relate to electronic devices including interposers. In particular, various embodiments relate to electronic devices including interposers forming a multi-step or spacer structure. Background Art

[0002] For the convenience and aesthetics of users, the thickness of electronic devices is getting thinner and thinner. The internal space of electronic devices is limited. In order to improve the utilization rate of the internal space of electronic devices, the application of stacked structures of different printed circuit boards (PCBs) is gradually increasing.

[0003] The portable electronic device may have an interposer including a conductive element in order to ensure a mounting space for the electronic device or various active devices when a millimeter wave (mmWave) module is applied. Summary of the invention

[0004] (Technical issues to be solved)

[0005] The interposer can electrically connect the substrates. The interposer is formed to a certain height so that there can be a height difference between the height of the electronic components mounted on the substrate and the height difference between the substrates. It is difficult to set up substrates with different heights for various electronic components, which will cause a waste of space.

[0006] The interposer may be formed into a closed curve shape along the edge to correspond to the substrate shape. Since the interposer supports the edge of the substrate, the area of ​​the substrate not supported by the interposer may be easily bent or twisted due to stress. A solution is needed that can reduce the constraints of the height or thickness of the electronic component and prevent warpage.

[0007] In order to prevent the substrate from being warped, the present invention provides an electronic device including an interposer forming a multi-step or spacer structure according to various embodiments.

[0008] (Methods of solving the problem)

[0009] According to various embodiments, the electronic device may include: a first circuit board; a first intermediary layer arranged on the first circuit board and having a first height; a second circuit board electrically connected to the first intermediary layer and arranged on the first intermediary layer; a second intermediary layer arranged on the first circuit board to be formed outside the first intermediary layer and having a second height; and a third circuit board electrically connected to the second intermediary layer and arranged on the second intermediary layer.

[0010] According to various embodiments, an electronic device may include: a first circuit board; a first intermediary layer disposed on the first circuit board and having a first height; a second circuit board electrically connected to the first intermediary layer and disposed on the first intermediary layer; and a partition disposed in the first intermediary layer and formed to support at least a portion of the second circuit board.

[0011] According to various embodiments, the electronic device may include: a first circuit board, including a first surface on which at least one component is provided and facing a first direction, and a second surface facing in an opposite direction to the first direction; a first intermediary layer, provided on the first surface of the first circuit board to be electrically connected to the first circuit board, and including a first area having a first height based on the first surface of the first circuit board and a second area having a second height based on the first surface; a second intermediary layer, provided on the first surface of the first circuit board to be electrically connected to the first circuit board, and including a third area having the first height based on the first surface of the first circuit board; a second circuit board, facing the first surface of the first circuit board and provided on the first area of ​​the first intermediary layer and the third area of ​​the second intermediary layer; and a third circuit board, facing the first surface of the first circuit board and provided on the second area of ​​the first intermediary layer.

[0012] (Effects of the Invention)

[0013] An electronic device including an interposer according to various embodiments may stack a plurality of substrates, thereby making it possible to increase space utilization in a vertical direction.

[0014] Furthermore, the electronic device including the interposer according to various embodiments may include a spacer capable of supporting the substrate, thereby preventing warpage. The electronic device may arrange electronic components in separate areas through the spacer, thereby reducing signal interference. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a front perspective view of a mobile electronic device according to an embodiment.

[0016] Figure 2 yes Figure 1 A rear perspective view of an electronic device.

[0017] Figure 3 yes Figure 1 An expanded perspective view of an electronic device.

[0018] Figure 4 is a perspective view showing a circuit board provided with an interposer including a spacer according to an embodiment.

[0019] Figure 5 Yes Figure 4 A cross-sectional view of a circuit board cut along the A-A' direction.

[0020] Figure 6 is a perspective view showing a circuit board provided with an interposer including a stepped portion.

[0021] Figure 7 Yes Figure 6 A cross-sectional view of a circuit board cut along the B-B' direction.

[0022] Figure 8 It represents the deformed integration of the interposer and part of the substrate on the circuit board.

[0023] Fig. 9 Indicates a structure in which an additional circuit board is further included on the circuit board.

[0024] Fig.10 is a perspective view showing a circuit board provided with an interposer including a spacer forming a step portion.

[0025] Fig.11 Yes Fig.10 A cross-sectional view of a circuit board cut along the C-C' direction.

[0026] Fig.12 The figure is a perspective view showing a circuit board provided with an interposer including a stepped portion and a spacer.

[0027] Fig.13 2 is a cross-sectional view of a circuit board provided with an interposer including a stepped portion and a spacer.

[0028] Fig.14a , 14b 14c and 14c show a manufacturing process of an interposer including a stepped portion. DETAILED DESCRIPTION

[0029] Hereinafter, various embodiments of the present specification will be described with reference to the accompanying drawings.

[0030] Figure 1 is a perspective view showing an electronic device 100 according to one of various embodiments described in this specification. Figure 2 It means looking from behind Figure 1 1 is a perspective view of an electronic device 100.

[0031] refer to Figure 1 and Figure 2 According to an embodiment, the electronic device 100 may include a housing 110 having a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side surface (or side wall) 110C surrounding a space between the first surface 110A and the second surface 110B. In another embodiment (not shown), the housing may refer to a housing formed by Figure 1The structure of a portion of the first surface 110A, the second surface 110B and the side surface 110C.

[0032] According to an embodiment, the first surface 110A may be formed based on a front plate 102 (e.g., a glass plate or a polymer plate including a plurality of coatings) that is substantially transparent in at least a portion thereof. According to an embodiment, the front plate 102 may include a curved portion that is curved and seamlessly extends from the first surface 110A toward the rear plate 111 at least at a side edge portion.

[0033] According to various embodiments, the second surface 110B may be formed according to a substantially opaque rear plate 111. For example, the rear plate 111 may be formed according to coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. According to an embodiment, the rear plate 111 may include a curved portion that is curved from the second surface 110B to the front plate 102 at least at one end and extends seamlessly.

[0034] According to various embodiments, the side 110C is combined with the front plate 102 and the back plate 111 and can be formed according to a side frame structure (or "side member or side wall") 118 including metal and / or polymer. In some embodiments, the back plate 111 and the side frame structure 118 are formed as one piece and can include the same material (e.g., a metal material such as aluminum).

[0035] According to an embodiment, the electronic device 100 may include at least one of a display 101, an audio module (103, 114), a sensor module, a camera module 105, a key input device 117, and a connector hole 108. In some embodiments, the electronic device 100 may omit at least one of the components (e.g., the key input device 117), or may further include other components. For example, the electronic device 100 may include a sensor module not shown. For example, a sensor such as a proximity sensor or an illumination sensor may be incorporated into the display 101 in the area provided by the front panel 102, or may be disposed at a position near the display 101. In some embodiments, the electronic device 100 may further include a light emitting device, and the light emitting device may be disposed at a position near the display 101 in the area provided by the front panel 102. For example, the light emitting device may provide status information of the electronic device 100 in the form of light. In another embodiment, for example, the light emitting device may provide a light source that is linked to the operation of the camera module 105. For example, the light emitting device may include an LED, an IR LED, and a xenon lamp.

[0036] For example, the display 101 may be exposed through a considerable portion of the front plate 102. In some embodiments, the corners of the display 101 may be formed to be substantially the same shape as the peripheral shape (e.g., curved surface) near the front plate 102. In another embodiment (not shown), in order to expand the area where the display 101 is exposed, the intervals between the periphery of the display 101 and the periphery of the front plate 102 may be formed to be substantially the same. In another embodiment (not shown), a groove or opening is formed on a portion of the screen display area of ​​the display 101, and other electronic components aligned with the groove or opening may be included, such as a camera module 105, a proximity sensor not shown, or an illumination sensor.

[0037] In another embodiment (not shown), at least one of the camera module (112, 113), the fingerprint sensor 116 and the flash 106 may be included on the back of the screen display area of ​​the display 101. In another embodiment (not shown), the display 101 may be combined with a touch sensing circuit, a pressure sensor that can measure the touch intensity (pressure) and / or a stylus digitizer that detects magnetic fields, or may be disposed in a nearby position.

[0038] The audio module (103, 114) may include a microphone hole and a speaker hole. The microphone hole may be provided with a microphone therein to obtain external sound. In some embodiments, multiple microphones may be provided to sense the direction of the sound. In some embodiments, the speaker hole and the microphone hole may be implemented as one hole 103, or there may be no speaker hole but a speaker (e.g., a piezoelectric speaker). The speaker hole may include an external speaker hole and a call receiver hole 114.

[0039] The electronic device 100 includes a sensor module not shown in the figure, so that an electrical signal or data value corresponding to an internal operating state or an external environmental state can be generated. For example, the sensor module may further include a proximity sensor disposed on the first side 110A of the housing 110, a fingerprint sensor incorporated into the display 101 or disposed near the display 101, and / or a biometric sensor (e.g., HRM sensor) disposed on the second side 110B of the housing 110. The electronic device 100 may further include a sensor module not shown in the figure, for example, at least one of a gesture sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0040] The camera module (105, 112, 113, 106) may include a first camera device 105 disposed on a first side 110A of the electronic device 100, a second camera device (112, 113) disposed on a second side 110B, and / or a flash 106. The camera device (105, 112, 113) may include one or more lenses, an image sensor, and / or an image signal processor. For example, the flash 106 may include a light emitting diode or a xenon lamp. In some embodiments, more than two lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 100.

[0041] The key input device 117 may be disposed on the side surface 110C of the housing 110. In another embodiment, the electronic device 100 may not include a part or all of the key input devices 117 mentioned above, and the key input devices 117 not included may be implemented as other forms such as a soft keyboard on the display 101. In some embodiments, the key input device may include at least a part of the fingerprint sensor 116 disposed on the second surface 110B of the housing 110.

[0042] The connector hole 108 may accommodate a connector for transmitting and receiving power and / or data with an external electronic device, and / or a connector for transmitting and receiving audio signals with an external electronic device. For example, the connector hole 108 may include a USB connector or a headphone jack.

[0043] refer to Figure 3 , the electronic device 200 may include a side frame structure 210, a first support member 211 (e.g., a bracket), a front panel 320, a display 230, a printed circuit board 240, a battery 250, a second support member 260 (e.g., a rear shell), an antenna 270, and a rear panel 280. In some embodiments, the electronic device 200 may omit at least one of the components (e.g., the first support member 211, or the second support member 260), or may further include other components. At least one of the components of the electronic device 200 may be different from the components of the electronic device 200. Figure 1 or Figure 2 At least one of the constituent elements of the electronic device 100 is the same or similar, and repeated description is omitted below.

[0044] The first support member 211 may be disposed inside the electronic device 200 so as to be connected to the side frame structure 210, or may be formed as one piece with the side frame structure 210. For example, the first support member 211 may be formed as a metal material and / or a non-metallic (e.g., polymer) material. The first support member 211 may be combined with the display 230 on one side and with the printed circuit board 240 on the other side. A processor, a memory, and / or an interface may be mounted on the printed circuit board 240. For example, the processor may include one or more of a central processing unit, an application processor, a graphics processor, an image signal processor, a sensor hub processor, or a communication processor.

[0045] For example, the memory may include volatile memory or non-volatile memory.

[0046] For example, the interface may include an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. For example, the interface may electrically or physically connect the electronic device 200 with an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0047] The battery 250 is a device for providing power to at least one component of the electronic device 200, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. For example, at least a portion of the battery 250 may be disposed on substantially the same plane as the printed circuit board 240. The battery 250 may be disposed integrally within the electronic device 200, or may be disposed to be detachable from the electronic device 200.

[0048] The antenna 270 may be disposed between the back plate 280 and the battery 250. For example, the antenna 270 may include an NFC (nearfield communication) antenna, a wireless charging antenna, and / or an MST (magnetic secure transmission) antenna. For example, the antenna 270 may communicate with an external device in a short distance, or may wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by a portion of the side frame structure 210 and / or the first support member 211, or a combination thereof.

[0049] Figure 4 is a perspective view showing a circuit board provided with an interposer including a spacer according to an embodiment, Figure 5 Yes Figure 4 A cross-sectional view of a circuit board cut along the A-A' direction.

[0050] refer to Figure 4 , the electronic device 400 may include a first circuit board 410 (eg: Figure 3 The first interposer 430 includes a printed circuit board 240, a second circuit board 420, and a first interposer 430 forming an internal space between the first circuit board 410 and the second circuit board 420. The first interposer 430 may be formed as a closed curve that encloses the internal space to shield the internal space formed between the first circuit board 410 and the second circuit board 420. The first interposer 430 may be implemented in a shape in which a through hole is formed in a prism with a polygonal bottom. For example, the first interposer 430 may be implemented in a shape in which a through hole is formed in a quadrangular prism.

[0051] According to an embodiment, the electronic device 400 may include a second interposer 432 used as a partition. The second interposer 432 may cross the internal space formed by the first interposer 430 to divide it into two regions. For example, the second interposer 432 may divide the internal space between the first interposer 430, the first circuit board 410, and the second circuit board 420 into a first region 430A and a second region 430B. For example, the second interposer 432 may support at least one region of the second circuit board 420 (e.g., the second surface 422 of the second circuit board 420).

[0052] According to various embodiments, the first circuit board 410 may include a first surface 411 facing the first direction 41 and a second surface 412 facing the second direction 42. Various electronic components 450 (e.g., processors, modem chips, various active devices) may be disposed on the first surface 411 of the first circuit board 410. The first circuit board 410 may include wiring and ground for electrically connecting one or more electronic components 450. The second circuit board 420 may include a second surface 422 facing the first surface 411 of the first circuit board 410 and a first surface 421 facing the opposite direction of the second surface 422 of the second circuit board 420.

[0053] According to an embodiment, electronic components may be disposed on the first surface 421 of the second circuit board 420 .

[0054] According to another embodiment, electronic components may be disposed on the second surface 422 of the second circuit board 420. The electronic components disposed on the second surface 422 of the second circuit board 420 may be disposed to prevent interference with the electronic components 450 disposed on the first surface 411 of the first circuit board 410.

[0055] In various embodiments, the first interposer 430 may be disposed between the first circuit board 410 and the second circuit board 420 to surround the space between the first circuit board 410 and the second circuit board 420. By disposing the first interposer 430, an internal space may be formed between the first interposer 430, the first circuit board 410, and the second circuit board 420.

[0056] In one embodiment, the second circuit board 420 may be disposed between the first circuit board 410 and the rear board (eg, Figure 3 That is, the second circuit board 420 may be disposed on the first surface 411 of the first circuit board 410 facing the rear plate 280 (for example: Figure 4 41 direction). For example, the second circuit board 420 may be an antenna substrate that radiates RF signals. A communication module may be provided on the first surface 421 of the second circuit board 420 that faces the rear plate 280. In this case, the second circuit board 420 may be provided between the first circuit board 410 and the rear plate 280 so that the RF signal radiated from the electronic component (e.g., the communication module) of the second circuit board 420 passes through at least a portion of the rear plate 280.

[0057] In another embodiment, the second circuit board 420 may be disposed between the first circuit board 410 and the first supporting member (eg, Figure 3 The second circuit board 420 may include one or more electronic devices, wiring electrically connecting the one or more electronic devices, and grounding.

[0058] In one embodiment, the first interposer 430 may be disposed between the first side 411 of the first circuit board 410 and the second side 422 of the second circuit board 420, and may connect the first side 411 and the second side 422. The first interposer 430 may include at least one conductive member 435, and the at least one conductive member 435 is used to electrically connect the first circuit board 410 or at least one electronic component 450 included in the first circuit board 410 with the second circuit board 420 or at least one electronic component included in the second circuit board. According to one embodiment, the first interposer 430 includes a body (wall portion) (or "at least one side wall portion") formed as a non-conductive member, and may include at least one conductive member 435 (e.g., a conductive path) penetrating the body. For example, a through hole may be formed on the body of the first interposer 430, so that the at least one conductive member 435 penetrates the body of the first interposer 430. For example, the body or at least one side wall portion of the first interposer 430 may be disposed along at least one area of ​​the edge of the first circuit board 410 and / or the second circuit board 420. By the structure of the main body of the first intermediary layer 430, an internal space can be formed between the first circuit board 410 and the second circuit board 420. For example, the internal space can be enclosed by the first circuit board 410, the second circuit board 420 and the first intermediary layer 430. The conductive member 435 can be configured so that one part is a power line and the other part is a signal transmission line. The conductive member 435 can be connected to the battery (for example: Figure 3 The power transmitted by the battery 250 of the first circuit board 410 is transmitted to at least one electronic component included on the first circuit board 410 or the second circuit board 420, and signals provided between the processor and the electronic components of the first circuit board 410 and the second circuit board 420 can be transmitted and received mutually. According to one embodiment, the second interposer 432 also includes a body (wall portion) (or "side wall portion") formed as a non-conductive member similar to the first interposer 430, and may include at least one conductive member passing through the body. For example, the body (wall portion) of the second interposer 432 may be formed to extend from one point to another point of the body (wall portion) of the first interposer 430. For example, at least one through hole may be formed in the body of the second interposer 432, so that at least one conductive member passes through the body of the second interposer 432. According to an electronic device of one embodiment, the electronic components included on the first circuit board 410 and the electronic components included on the second circuit board 420 may be electrically connected through the first interposer 430 and / or the second interposer 432.

[0059] refer to Figure 5 , the first interposer 430 is as follows Figure 4The structure shown may include a body 431 formed in a closed curve shape to shield the internal space formed between the first circuit board 410 and the second circuit board 420, a conductive member 435 penetrating the interior of the body 431, and a conductive frame 441 formed along the outer side of the body 431 enclosing the internal space formed between the first circuit board 410 and the second circuit board 420. For example, the conductive frame 441 may have a shielding surface facing a third direction (43, 44, 45 and / or 46) that is actually perpendicular to the first direction 41 or the second direction 42. The conductive frame 441, as a strip-shaped element extending in one direction with the shielding surface, may surround the space inside the laminated PCB substrate. According to various embodiments, the internal space surrounded by the conductive frame 441 may actually be shielded, but as long as the shielding effect can be ensured, even a structure that is not sealed due to the presence of a thin groove or a slit may be used. The conductive frame 441 may shield the internal space of the laminated PCB structure formed by the interposer 430.

[0060] According to various embodiments, the conductive frame 441 may be disposed on the circuit board 410 to enclose at least one electronic component 450. According to one embodiment, the conductive frame 441 may be electrically connected to the ground portion of the circuit board 410. According to various embodiments, the second interposer 432 is disposed in the internal space formed by the first interposer 430, the first circuit board 410, and the second circuit board 420, so that the internal space can be distinguished. For example, the second interposer 432 is disposed in the internal space, dividing the internal space into a first area 430A and a second area 430B. Each electronic component 450 may be disposed in the space distinguished by the second interposer 432. For example, the first electronic component 451 may be disposed on the first area 430A distinguished by the second interposer 432, and the remaining second electronic component 452 and the third electronic component 453 may be disposed on the second area 430B.

[0061] According to an embodiment, the first interposer 430 may be formed to a first height, and the second interposer 432 may be formed to a second height. For example, the first height and the second height may be the same, but are not limited thereto.

[0062] According to an embodiment, the second interposer 432 may support at least a portion of the second circuit board 420. Since the second interposer 432 supports at least a portion of the second circuit board 420, the second circuit board 420 may be prevented from being twisted.

[0063] Figure 6 is a perspective view showing a circuit board provided with an interposer including a stepped portion.

[0064] refer to Figure 6 , the electronic device 600 may include a first circuit board 610 (eg: Figure 3A printed circuit board 240), a second circuit board 620, a third circuit board 670 and an intermediate layer 630 having a multi-level structure.

[0065] According to various embodiments, the first circuit board 610 is attached to a support member (eg, Figure 3 The first circuit board 610 is supported by a second surface 612 on one side of the support member 211, and at least one first electronic component 650 (for example: Figure 4 support member 450).

[0066] According to one embodiment, the first intermediary layer 633a is formed to a first height h1 and may be disposed on the first side 611 of the first circuit board 610. The first intermediary layer 633a may be disposed to enclose at least one electronic component 650 disposed on the first side 611 of the first circuit board 610. The second intermediary layer 632 may be disposed on the first side 611 of the first circuit board 610 to be formed outside the first intermediary layer 633a. For example, the second intermediary layer 632 may be formed along an outer edge of the first intermediary layer 633a to surround the first intermediary layer 633a. According to various embodiments, the second intermediary layer 632 and the first intermediary layer 633a may be formed as one body.

[0067] According to various embodiments, the second interposer 632 may be formed to a second height h2. The second height h2 may be higher than the first height h1. For example, the interposer formed by the first interposer 633a and the second interposer 632 is formed to a higher height near the outer edge, and is formed to a lower height in the direction facing the area where the electronic component 650 is included. According to various embodiments, one side of the first interposer 633a and the second interposer 632 may be disposed on the first side 611 of the first circuit board 610. The other sides of the first interposer 633a and the second interposer 632 facing the side of the interposer contacting the first circuit board 610 may be formed to different heights from each other. For example, the interposer may include a step portion at the boundary between the first interposer 633a and the second interposer 632.

[0068] According to various embodiments, the second surface 622 of the second circuit board 620 may face the first surface 611 of the first circuit board 610 and form an internal space. The second surface 622 of the second circuit board 620 may contact the other surface of the second interposer 632. The first circuit board 610 and the second circuit board 620 may be electrically connected to each other through the second interposer 632.

[0069] According to various embodiments, the third circuit board 670 may be formed to be smaller than the second circuit board 620. For example, the third circuit board 670 may be disposed on the inner side of the stepped portion formed by the first interposer 633a and the second interposer 632, and the second circuit board 620 may be disposed on a higher surface extending from the stepped portion formed by the first interposer 633a and the second interposer 632. For example, the third circuit board 670 may be supported by the first interposer 633a, and the second circuit board 620 may be supported by the second interposer 632. The conductive member 635 included in the first interposer 633a is connected to the wiring of the first circuit board 610, and is connected to the wiring of the third circuit board 670, so that the substrates may be electrically connected.

[0070] According to various embodiments, the second side 672 of the third circuit board 670 may face the first side 611 of the first circuit board 610 and form an internal space. The second side 672 of the third circuit board 670 may contact the other side of the second interposer 633a. The first circuit board 610 and the third circuit board 670 may be electrically connected to each other. According to various embodiments, at least one electronic component 650 mounted on the first circuit board 610 and an electronic component 680 (e.g., communication circuit, active device) mounted on the third circuit board 670 may be electrically connected through the first interposer 633a. The third circuit board 670 may include wiring or power wiring for signal transmission.

[0071] Figure 7 Yes Figure 6 A cross-sectional view of a circuit board cut along the B-B' direction.

[0072] refer to Figure 7 , the first circuit board 610 can install the first intermediary layer 633a and the second intermediary layer 632 on the first surface 611, and can install at least one electronic component 650. Intermediary layer ( Figure 6 The interposer 630) may be provided to enclose a region where at least one electronic element 650 is provided. For example, the interposer ( Figure 6 The intermediate layer 630) can be arranged along the periphery of the electronic component 650.

[0073] For example, the interposer 630 may include a first interposer 63a having a first height h1 and a second interposer 632 having a second height h2. According to various embodiments, the second interposer 632 may be formed along the periphery of the first interposer 633a. The first interposer 633a and the second interposer 632 may be formed as one body, and a step portion may be formed at the boundary between the first interposer 633a and the second interposer 632. One end of the first interposer 633a may be surface mounted on the first surface 611 of the first circuit board 610. The other end of the first interposer 633a may be surface mounted on the second surface 672 of the third circuit board 670 to support at least a portion of the third circuit board 670. At least one electronic component (680, 685) may be disposed on both the first surface 671 and the second surface 672 of the third circuit board 670. According to an embodiment of the present invention, surface mounting may mean that a component (e.g., the first interposer 633a) is directly mounted on a circuit board (e.g., the third circuit board 670), and the same representation is used below.

[0074] According to various embodiments, at least one electronic component 650 disposed on the first side 611 of the first circuit board 610 and at least one electronic component 685 disposed on the second side 672 of the third circuit board 670 may be located in a space between the third circuit board 670 and the first circuit board 610. The electronic component 650 disposed on the first side 611 of the first circuit board 610 may be disposed so as not to interfere with the electronic component 685 disposed on the second side 672 of the third circuit board 670.

[0075] According to various embodiments, one end of the second interposer 632 may be surface mounted on the first surface 611 of the first circuit board 610. The other end of the second interposer 632 may be surface mounted on at least one side of the second surface 622 of the second circuit board 620 to support at least a portion of the second circuit board 620. At least one electronic component (690, 695) may be disposed on both the first surface 621 and the second surface 622 of the second circuit board 620.

[0076] According to various embodiments, the electronic component 680 disposed on the first side 671 of the third circuit board 670 and the electronic component 695 disposed on the second side 622 of the second circuit board 620 may be located in a space between the second circuit board 620 and the third circuit board 670. The at least one electronic component 680 disposed on the first side 671 of the third circuit board 670 may be disposed so as not to interfere with the at least one electronic component 695 disposed on the second side 622 of the second circuit board 620.

[0077] refer to Figure 7According to various embodiments, an interposer including a first interposer 633a and a second interposer 632 (eg: Figure 6 The interposer 630 may include a body 634 formed into a closed curve, a conductive member (635, 637a) and a conductive frame 641. At least one of the constituent elements of the interposer according to various embodiments may be Figure 5 The intermediary layer (for example: Figure 5 At least one of the components of the intermediate layer 430 is the same or similar, and the repeated description is omitted below. For example, the conductive frame 641 can have a direction for the first direction (for example: Figure 6 61) or the second direction (for example: Figure 6 62) is actually a vertical third direction (for example: Figure 6 63, 64, 65 and / or 66) of the shielding surface.

[0078] The conductive member 637a included on the first interposer 633a is connected to the wiring of the first circuit board 610 and the wiring of the third circuit board 670, so that the substrates can be electrically connected. Conductive pads 631 may be added to both ends of the conductive member 637a. The conductive pad 631 may contact the wiring of the first circuit board 610 and the third circuit board 670, and may transmit electrical signals or electricity. The first interposer 633a is different from the above content and may be formed at an edge inside the second interposer 632. According to one embodiment, the electronic device 600 may include an additional first interposer 633b that is the same as the first interposer 633a having the first height h1. According to one embodiment, the first interposer 633a may be formed in the shape of a closed curve 633c that closes the internal space between the first circuit board 610 and the third circuit board 670. The additional first interposer 633b may be formed in a closed curve 633d shape that closes the internal space between the first circuit board 610 and the third circuit board 670 in the same manner as the first interposer 633a, and may include a conductive member 637b and a conductive pad 631. The first interposer 633a is disposed separately from the additional first interposer 633b, and an internal space 636 in which at least one electronic element (e.g., 650, 685) is disposed may be formed between the first interposer 633a and the additional first interposer 633b.

[0079] According to various embodiments, at least one electronic component 650 mounted on the first circuit board 610 and an electronic component mounted on the second circuit board 620 may be electrically connected through the second interposer 632. The conductive member 635 included on the second interposer 632 is connected to the wiring of the first circuit board 610 and to the wiring of the second circuit board 620, so that the substrates can be electrically connected. Conductive pads 631 may be added to both ends of the conductive member 635. The conductive pads 631 may contact the wiring of the first circuit board 610 and the second circuit board 620, and may transmit electrical signals or power.

[0080] According to various embodiments, the internal space surrounded by the conductive frame 641 can actually be shielded, but as long as the shielding effect can be ensured, even a structure that is not sealed due to the presence of fine grooves or slits can be used. The conductive frame 641 can shield the internal space of the stacked PCB structure formed by the interposer 630.

[0081] According to various embodiments, the conductive frame 641 may be disposed on the circuit board 610 to enclose at least one electronic component ( 650 , 680 , 685 , 690 and / or 695 ). According to one embodiment, the conductive frame 641 may be electrically connected to a ground portion of the circuit board 610 .

[0082] Figure 8 It represents the deformed integration of the interposer and part of the substrate on the circuit board.

[0083] refer to Figure 8 , in the conductive pad 631 formed on the end of the conductive member (637a, 637b) of the first intermediary layer (633a, 633b), the conductive pad 631 of the second circuit board 620 and the third circuit board 670 can be connected by a conductive wire 639. According to one embodiment, the conductive wire 639 can be a bonding wire. The bonding wire can refer to a wiring material that electrically connects the cover on the circuit board (e.g., the third circuit board 670) and the conductive pad (e.g., the conductive pad 631). For example, the bonding wire can be formed of gold, aluminum, etc. One end of the conductive wire 639 can be connected to the wiring of the third circuit board 670, and the other end of the conductive wire 639 can be connected to the conductive pad 631 formed on the first intermediary layer (633a, 633b). In this way, the first circuit board 610 can be electrically connected to the third circuit board 670.

[0084] Fig. 9 Indicates a structure in which an additional circuit board is further included on the circuit board.

[0085] refer to Fig. 9, the first intermediary layer 633 may be formed by protruding from the second intermediary layer 632. The first intermediary layer 633 may be extended from the central portion of the second intermediary layer 632 to the inner space. According to various embodiments, the first intermediary layer 633 may electrically connect the third circuit board 670a and the fourth printed circuit board 670b. The third circuit board 670a and the fourth printed circuit board 670b may have electronic components (680a, 680b) mounted on each side. Through the first intermediary layer 633, the electronic components (680a, 680b) mounted on one side of the third circuit board 670a and the fourth printed circuit board 670b may be electrically connected.

[0086] Fig.10 is a perspective view showing a circuit board provided with an interposer including a spacer forming a step portion.

[0087] refer to Fig.10 , the electronic device 1000 may include a first circuit board 1010 (eg: Figure 3 The first interposer 1030 may be formed as a closed curve (e.g., a curve that encloses the inner space formed between the first circuit board 1010 and the second circuit board 1020a) and the second interposer 1032 may be formed as a closed curve (e.g., a curve that encloses the inner space formed between the first circuit board 1010 and the second circuit board 1020a). Fig.11 1042), so that the internal space provided with the first intermediary layer 1030 can be completely shielded. According to one embodiment, the first intermediary layer 1030 can be implemented in the shape of a polygonal prism with a through hole formed therein. The second intermediary layer 1032 can be formed as a closed curve (for example: Fig.11 1043), so that the inner space where the second interposing layer 1032 is disposed can be completely shielded. The second interposing layer 1032 can be implemented in the shape of a polygonal prism with a through hole formed therein.

[0088] According to one embodiment, the first intermediary layer 1030 and the second intermediary layer 1032 may be formed into one intermediary layer, wherein the one intermediary layer includes first walls ( Fig.11 1030a) and the second wall ( Fig.11 1030b), due to the first wall ( Fig.11 1030a) and the second wall ( Fig.11 1030b) height difference, in the first wall ( Fig.11 1030a) and the second wall ( Fig.111030b) can form multiple levels ( Fig.11 1033).

[0089] According to various embodiments, the first intermediary layer 1030 may be formed to a first height, and the second intermediary layer 1032 may be formed to a second height different from the first height. The heights of the first intermediary layer 1030 and the second intermediary layer 1032 may be determined according to the height of at least one electronic component (1050a, 1050b) disposed in the internal space formed by each intermediary layer. For example, in the case where the height of some components (e.g., 1050a) in at least one electronic component is higher than the height of other components (e.g., 1050b) in at least one electronic component, the electronic component with a higher height (e.g., 1050b) may be formed by an intermediary layer with a higher height (e.g., the first intermediary layer 1030), and the electronic component with a relatively lower height (e.g., 1050b) may be formed by an intermediary layer with a relatively lower height (e.g., the second intermediary layer 1032).

[0090] According to various embodiments, the first circuit board 1010 may include a first surface 1011 facing the first direction and a second surface 1012 facing the second direction. A variety of electronic components may be arranged on the first surface 1011 of the first circuit board 1010. The first circuit board 1010 may include wiring and grounding for electrically connecting more than one electronic component (1050a, 1050b). There may be multiple electronic components (1050a, 1050b) installed on the first circuit board 1010. The electronic components (1050a, 1050b) installed on the first circuit board 1010 may be arranged in the internal space 1051 formed by the first intermediary layer 1030 or the internal space 1052 formed by the second intermediary layer 1032.

[0091] According to various embodiments, the second circuit board 1020a may include a second face 1022a facing the first face 1011 of the first circuit board 1010, and a first face 1021a facing the second face 1022a of the second circuit board 1020a. The second circuit board 1020a may include an electronic component disposed on the first face 1021a. According to another embodiment, an electronic component 1070 mounted on the second circuit board 1020a may be disposed in an internal space formed between the second circuit board 1020a and the first circuit board 1010. For example, an electronic component may be disposed on the second face 1022a of the second circuit board 1020a. At least one electronic component 1070 disposed on the second face 1022a of the second circuit board 1020a may be disposed to prevent interference with the electronic component 1050a disposed on the first face 1011 of the first circuit board 1010.

[0092] In various embodiments, the first interposer 1030 may be formed between the first circuit board 1010 and the second circuit board 1020 a to surround an inner space between the first circuit board 1010 and the second circuit board 1020 a .

[0093] According to various embodiments, the third circuit board 1020b may include a second surface 1022b facing the first surface 1011 of the first circuit board 1010, and a first surface 1021b facing the second surface 1022b of the third circuit board 1020b. At least one electronic component may be arranged on the first surface 1021b of the third circuit board 1020b. According to another embodiment, in various embodiments, the second interposer 1032 may be formed between the first circuit board 1010 and the third circuit board 1020b to surround the internal space between the first circuit board 1010 and the third circuit board 1020b. According to an embodiment, the second interposer 1032 may be formed to a second height, and the second height may refer to a height at which the electronic component 1050b may be arranged on at least one side of the first circuit board 101 in the space formed by the second interposer 1032.

[0094] Fig.11 The figure shows a configuration in which at least one interposer and a conductive member are provided in an electronic device.

[0095] refer to Fig.11 , the first interposer 1030 may connect the first side 1011 of the first circuit board 1010 and the second side 1022a of the second circuit board 1020a. The second interposer 1032 may connect the first side 1011 of the first circuit board 1010 and the second side 1022b of the third circuit board 1020b. The first interposer 1030 may include a conductive member 1035a for electrically connecting the first circuit board 1010 or at least one electronic component (1050a, 1050b) included in the first circuit board 1010 with the second circuit board 1020a or at least one electronic component included in the second circuit board 1020a. The second interposer 1032 may include a conductive member 1035b for electrically connecting the first circuit board 1010 or at least one electronic component (1050a, 1050b) included in the first circuit board 1010 with the third circuit board 1020b or at least one electronic component included in the third circuit board 1020b. The first interposer 1030 and the second interposer 1032 may include a body formed of a non-conductive member and may include a conductive member (1035a, 1035b) (eg, a conductive path) penetrating the body. A portion of the conductive member 1035a may be a power line and another portion may be a signal transmission line.

[0096] According to various embodiments, the first interposer 1030 and the second interposer 1032 may be formed as one body. The first interposer 1030 may have a first height, and the second interposer 1032 may have a second height lower than the first height. Due to the different heights, the boundary between the first interposer 1030 and the second interposer 1032 may include a step portion. The boundary region 1037 of the first interposer 1030 and the second interposer 1032 formed with the step portion may be formed by a region 1037a having a first height supporting the second circuit board 1020a and a region 1037b having a second height supporting the third circuit board 1020b, and the region 1037a and the region 1037b may have a step portion.

[0097] According to various embodiments, the first intermediary layer 1030 can be formed as a closed curve that encloses the internal space formed between the first circuit board 1010 and the second circuit board 1020a, thereby may include a main body 1042 that can completely shield the internal space in which the first intermediary layer 1030 is disposed, a conductive member 1035a that passes through the interior of the main body 1042, and a first conductive frame 1041a formed along the outer side surface of the main body 1042.

[0098] The second intermediary layer 1032 can be formed as a closed curve that encloses the internal space formed between the first circuit board 1010 and the third circuit board 1020b, thereby including a main body 1043 that can completely shield the internal space in which the second intermediary layer 1032 is provided, a conductive member 1035b that passes through the interior of the main body 1043, and a first conductive frame 1041b formed along the outer side surface of the main body 1043.

[0099] For example, the first conductive frame 1041a and the second conductive frame 1041b may have a direction corresponding to the first direction (for example: Fig.10 1001) or the second direction (for example: Fig.10 1002) is actually a vertical third direction (for example: Fig.10 The first conductive frame 1041a and the second conductive frame 1041b are strip-shaped elements extending in one direction from the shielding surface, and can surround the space inside the laminated PCB substrate.

[0100] According to various embodiments, the first conductive frame 1041a may be disposed on the first circuit board 1010 to enclose at least one electronic component 1050a. According to one embodiment, the conductive frame 1041a may be electrically connected to a ground portion of the first circuit board 1010. The second conductive frame 1041b may be disposed on the first circuit board 1010 to enclose at least one component 1050b, and may be electrically connected to a ground portion of the first circuit board 1010.

[0101] According to another embodiment, the first conductive frame 1041a and the second conductive frame 1041b may be formed as one body. For example, the first conductive frame 1041a and the second conductive frame 1041b may be formed along the outer portion of the interposer in which the first interposer 1030 and the second interposer 1032 are formed as one body.

[0102] Fig.12 The figure is a perspective view showing a circuit board provided with an interposer including a stepped portion and a spacer.

[0103] refer to Fig.12 The electronic device 1200 may include a first circuit board 1210 , a second circuit board 1220 a , a third circuit board 1270 a , a fourth circuit board 1270 b and an interposer 1230 .

[0104] According to various embodiments, at least one electronic component (1250a, 1250b) and an interposer 1230 may be mounted on a first surface of the first circuit board 1210. One surface of the interposer 1230 may be formed such that the entire surface is in contact with the first circuit board 1210. The other surface of the interposer 1230 may include a stepped portion to dispose the second circuit board 1220a, the third circuit board 1270a, and the fourth circuit board 1270b.

[0105] At least one component 1250a may be mounted in the internal space 1251 between the first circuit board 1210 and the third circuit board 1270a, and other components 1250b mounted on the first circuit board 1210 may be mounted in the internal space 1252 between the first circuit board 1210 and the fourth circuit board 1270b. According to various embodiments, at least one electronic component (1280a, 1280b) may be mounted on the third circuit board 1270a or the fourth circuit board 1270b.

[0106] Fig.13 2 is a cross-sectional view of a circuit board provided with an interposer including a stepped portion and a spacer.

[0107] refer to Fig.13 , the intermediary layer 1230 may include a first intermediary layer 1230b, a second intermediary layer 1230a, and a third intermediary layer 1232. The first intermediary layer 1230b may be provided to enclose the electronic components (1250a, 1250b) provided on the first circuit board 1210. The first intermediary layer 1230b may have a first height. The second intermediary layer 1230a may be formed to enclose the outside of the first intermediary layer 1230b, and it is provided on the first circuit board 1210. The second intermediary layer 1230a may have a second height higher than the first height.

[0108] According to various embodiments, a second circuit board 1220a may be disposed on the second intermediary layer 1230a, and a third circuit board 1270a and a fourth circuit board 1270b may be disposed on the first intermediary layer 1230b.

[0109] According to an embodiment, the electronic device 1200 may include a third interposer 1232 used as a partition. The third interposer 1232 may cross the internal space formed by the first interposer 1230b to be divided into two areas. The third interposer 1232 may support the second circuit board 1220a. The third interposer 1232 may include a protruding area having a second height and contacting the second circuit board 1220a, and an area formed around the protruding area and supporting the third circuit board 1270a and the fourth circuit board 1270b.

[0110] According to various embodiments, the first circuit board 1210 may be mounted with at least one electronic component 1250a disposed on a space formed between the first circuit board 1210 and the third circuit board 1270a and at least one electronic component 1250b disposed on a space formed between the first circuit board 1210 and the fourth circuit board 1270b. Each at least one electronic component (1250a, 1250b) may be disposed in an area defined by the third interposer 1232. According to various embodiments, the third circuit board 1270a may be mounted with an electronic component 1280a disposed on a space formed between the third circuit board 1270a and the second circuit board 1220a. The fourth circuit board 1270b may be mounted with an electronic component 1280b disposed on a space formed between the fourth circuit board 1270b and the second circuit board 1220a. The third circuit board 1270a and the fourth circuit board 1270b may be arranged to be symmetrical to each other based on the third interposer 1232. At least one electronic component 1290 may be disposed outside the PCB laminate structure on the second circuit board 1220a.

[0111] According to various embodiments, the interposer 1230 may be formed as a closed curve that closes the internal space formed between the first circuit board 1210 and the second circuit board 1220a, and may include a body 1231 that can completely shield the internal space in which the interposer 1230 is disposed, a conductive member (1235a, 1235b) that passes through the interior of the body 1231, and a conductive frame 1241 formed along the outer side of the body 1231. For example, the conductive frame 1241 may have a direction toward the first direction (for example: Fig.12 121) or the second direction (for example: Fig.12 122) is actually a vertical third direction (for example: Fig.12The conductive frame 1241 is a strip-shaped element extending in one direction from the shielding surface, and can surround the space inside the laminated PCB substrate. The conductive frame 1241 can be arranged on the first circuit board 1210 to enclose at least one electronic component (1250a, 1250b, 1280a, 1280b). According to one embodiment, the conductive frame 1241 can be electrically connected to the grounding portion of the first circuit board 1210.

[0112] According to an embodiment, the third interposer 1232 may support at least a portion of the second circuit board 1220a. The third interposer 1232 supports the second circuit board 1220a, so that distortion of the second circuit board 1220a may be prevented.

[0113] The electronic device according to the various embodiments can divide the space inside the laminated PCB by using an interposer formed by a multi-step structure, a partition structure or a combination thereof, and can ensure the installation space in the vertical direction.

[0114] An electronic device according to various embodiments can prevent noise interference between electronic components installed in areas divided by a multi-step structure. An electronic device including an interposer having a multi-step partition structure can improve the efficiency of arranging electronic components on a narrow internal space of the electronic device.

[0115] Fig.14a , 14b 14c and 14c show a manufacturing process of an interposer including a stepped portion.

[0116] refer to Fig.14a , the interposer may be formed by stacking a plurality of layers.

[0117] According to one embodiment, a first layer 1401 including a plurality of conductive members 1405 may be prepared. At least one via hole 1402 penetrating the first layer 1401 is formed on the first layer 1401. The first conductive member 1405 is a via penetrating the via hole 1402, which is disposed in the via hole 1402 and may penetrate the first layer 1401. One side 1405a of the first layer 1401 penetrating the via hole 1402 faces a first direction of the first layer 1401, and the other side 1405b of the first conductive member 1405 may face a second direction of the first layer 1401 which is opposite to the first direction. According to one embodiment, the first conductive member 1405 may be electrically connected to wiring of each substrate on a laminated PCB to form a line for transmitting a signal or power. A first conductive pad 1407 formed at both ends (1405a, 1405b directions) of the first conductive member 1405 may be included. The first conductive pad 1407 may operate as a terminal portion contacting the wiring of the substrate.

[0118] According to various embodiments, the first layer 1401 may include a second layer 1411 thereon. The area of ​​the second layer 1411 may be smaller than that of the first layer 1401. The second layer 1411 may include a second conductive member 1415, and one end of the second conductive member 1415 may be connected to a first conductive pad 1407 formed at one end of the first conductive member 1405, and the other end may be connected to a second conductive pad 1417. The second conductive member 1415 may be connected to the first conductive member 1405. In addition, the first layer 1401 is formed to be different from the second layer 1411 so that a step 1490 may be formed between the first layer 1401 and the second layer 1411. The interposer may include a first region 1400B showing the first layer 1401 and having a first height hb, and a second region 1400A including the first layer 1401 and the second layer 1411 and having a second height ha. The circuit board disposed in the first area 1400B may be separated from the main board by a first height hb, and the circuit board disposed in the second area 1400A may be separated from the main board by a second height ha.

[0119] refer to Fig.14b ,and Fig.14a Likewise, a first layer 1401 including a first conductive member 1405 and a first conductive pad 1407 may be prepared.

[0120] According to various embodiments, the second layer 1421 may be a layer including a second conductive member 1425 and a second conductive pad 1427, similar to the first layer 1401. The second layer 1421 may be disposed on the first layer 1401. The region a where a step is required in the interposer is removed from the second layer 1421, thereby forming an interposer having a step. According to various embodiments, the region a of the second layer 1421 may be removed by laser etching or the like.

[0121] The interposer may include a first region 1400B showing a first layer 1401 and having a first height hb, and a second region 1400A including the first layer 1401 and the second layer 1421 and having a second height ha. A circuit board disposed in the first region 1400B may be separated from the main board by a distance of the first height hb, and a circuit board disposed in the second region 1400A may be separated from the main board by a distance of the second height ha.

[0122] refer to Fig.14c , an interposer body 1450 having a second height may be prepared. The body 1450 may be provided with a plurality of conductive members including a first conductive member 1455 and a second conductive member 1465. The body 1450 may be formed of a non-conductive material.

[0123] According to various embodiments, the body 1450 may include at least one via hole 1452 into which a first conductive member 1455 and a second conductive member 1465 may be inserted. The first conductive member 1455 and the second conductive member 1465 are electrically connected to the wiring of the stacked PCB, thereby being operable as a line for transmitting a signal or power. The first conductive member 1455 may include a first conductive pad 1457 at both ends thereof. The second conductive member 1465 may include conductive pads (1467, 1468) at both ends thereof. For example, the second conductive member 1465 may include a second conductive pad 1467 formed at one end in contact with the wiring of the main circuit board, and a third conductive pad 1468 formed at the other end.

[0124] According to various embodiments, the body 1450 may remove region b by laser etching to form a stepped portion 1490. The region b removed by laser etching may include a third conductive pad 1468 and a portion of the second conductive member 1465. The conductive pad is removed from the removed region b, so that a fourth conductive pad 1469 may be formed at the other end of the partially removed second conductive member 1465.

[0125] The interposer may include a first region 1400C where the region b is removed to have a first height hc, and a second region 1400D where the body 1450 remains in its original shape to have a second height hd. A circuit board disposed in the first region 1400C may be separated from the main board by a distance of the first height hc, and a circuit board disposed in the second region 1400D may be separated from the main board by a distance of the second height hd.

[0126] According to various embodiments of the present invention, an electronic device (e.g.: Figure 6 The electronic device 600 may include: a first circuit board (eg: Figure 6 The first circuit board 610 is disposed on the first circuit board and has a first height (for example: Figure 6 A first intermediate layer (for example: Figure 6 a first intermediary layer 633a); a second circuit board (for example: Figure 6 A third circuit board 670 is provided on the first circuit board to be formed outside the first intermediary layer and has a second height (for example: Figure 6 A second intermediate layer of a second height h2) (for example: Figure 6 a second intermediary layer 632); and a third circuit board (for example: Figure 6 a second circuit board 620).

[0127] According to one embodiment, the first interposer is formed as a closed curve (eg, referring to Figure 7 ), the second interposer is formed into a closed curve corresponding to the shape of the first interposer (for example, referring to Figure 7 ), so that it can be set near the first intermediate layer.

[0128] According to an embodiment, the first height may be lower than the second height.

[0129] According to one embodiment, a third intermediary layer (eg, Fig.12 , 13 A third intermediate layer 1232).

[0130] According to an embodiment, the third interposer is formed to the first height so as to support at least a portion of the second circuit board.

[0131] According to an embodiment, the third interposer protrudes at a portion to a second height, so as to support at least a portion of the third circuit board.

[0132] According to an embodiment, the first interposer may include a first conductive member (eg, Figure 7 A conductive member 637a), and a first through hole (for example: Fig.14a The second interposer may include a second conductive member (eg, a via hole 1402) connecting the first circuit board and the third circuit board. Figure 7 A conductive member 635), and a second through hole provided with the second conductive member (for example: Fig.14a through hole 1402).

[0133] According to an embodiment, the first interposer may include contact pads formed at both ends of the first conductive member (eg: Figure 7 The second interposer may include contact pads (eg, conductive pads 631) formed at both ends of the second conductive member. Figure 7 conductive pad 631).

[0134] According to various embodiments of the present invention, an electronic device (e.g.: Figure 4 , 13 The electronic device (400, 1200) may include: a first circuit board (for example: Figure 4 , 13 a first circuit board (410, 1210)); a first intermediate layer (for example: Figure 4 , 13a first intermediary layer (430, 1230b)); a second circuit board (for example: Figure 4 and a partition (for example: Figure 4 The second interposer 432, Fig.13 A third intermediate layer 1232).

[0135] According to an embodiment, the present invention may further include: a second intermediary layer (for example, a second intermediary layer) disposed on the first circuit board to be formed outside the first intermediary layer and having a second height. Fig.13 and a third circuit board (for example: Fig.13 The second circuit board 1220a).

[0136] According to one embodiment (reference Fig.12 ), the first intermediary layer is formed into a closed curve, and the second intermediary layer is formed into a closed curve corresponding to the shape of the first intermediary layer, so that it can be arranged near the first intermediary layer.

[0137] According to an embodiment, the first height may be lower than the second height.

[0138] According to an embodiment, the spacer is formed to the first height, so that a third interposer (eg, Fig.13 A third intermediate layer 1232).

[0139] According to an embodiment, the third interposer protrudes at a portion to a second height, so as to support at least a portion of the third circuit board.

[0140] According to an embodiment, the partition includes a third intermediary layer formed to the first height, and the third intermediary layer can electrically connect the first circuit board and the second circuit board.

[0141] According to an embodiment, the first interposer may include a first conductive member (eg, Fig.13 A conductive member 1235b), and a first through hole (eg, Fig.14a The second interposer may include a second conductive member (eg, a via hole 1402) connecting the first circuit board and the third circuit board. Fig.13 A conductive member 1235a), and a second through hole provided with the second conductive member (for example: Fig.14athrough hole 1402).

[0142] According to various embodiments of the present invention, an electronic device (e.g.: Fig.10 , 11 The electronic device 1000 may include: a first circuit board (eg: Fig.11 The first circuit board 1010 includes at least one component disposed thereon and facing a first direction (for example: Fig.10 The first side of 1001) (for example: Fig.11 a first surface 1011 facing the first direction), and a second surface facing the opposite direction of the first direction (for example: Fig.11 a first interposer disposed on the first surface of the first circuit board to be electrically connected to the first circuit board, and including a first region having a first height based on the first surface of the first circuit board and a second region having a second height based on the first surface; a second interposer disposed on the first surface of the first circuit board to be electrically connected to the first circuit board, and including a third region having the first height based on the first surface of the first circuit board (for example: Fig.11 1037b); Second circuit board (for example: Fig.11 A third circuit board 1020b) facing the first side of the first circuit board and disposed on the first area of ​​the first interposer and the third area of ​​the second interposer; and a third circuit board (for example: Fig.11 The second circuit board 1020a) faces the first surface of the first circuit board and is disposed on the second area of ​​the first intermediate layer.

[0143] According to an embodiment, the first interposer is formed to surround at least a portion of the at least one or more components (eg: Fig.10 The first height is lower than the second height, and the first region is arranged in a direction toward the inside of the closed curve of the first interposer.

[0144] According to one embodiment, the closed curve formed by the second intermediary layer crossing the first intermediary layer includes a fourth area with a second height based on the first surface (for example: Fig.11 1037a), the fourth area can support the third circuit board.

[0145] According to an embodiment, the second interposing layer is connected to an edge of the first interposing layer to form a closed curve, and the first region may be connected to the third region.

[0146] According to various embodiments of the present invention, an electronic device may include: a first circuit board including a first electronic component and a second electronic component, the first electronic component and the second electronic component being arranged on one side of the first circuit board; a second circuit board, separated from the first circuit board and including another side facing the one side on which the first electronic component and the second electronic component of the first circuit board are arranged; a first intermediary layer, located between the first circuit board and the second circuit board to form an internal space between the first circuit board and the second circuit board; and a second intermediary layer, located between the first circuit board and the second circuit board and dividing the internal space into a first area and a second area, the first electronic component of the first circuit board being arranged at a position corresponding to the first area, and the second electronic component being arranged at a position corresponding to the second area, and the first intermediary layer and the second intermediary layer can electrically connect the first circuit board and the second circuit board.

[0147] According to an embodiment, at least one wall portion is provided along edges of the first circuit board and the second circuit board, and the internal space may be closed by the first circuit board, the second circuit board, and the first interposer.

[0148] According to an embodiment, the second intermediary layer is disposed across the inner space and may extend from a side wall portion of the first intermediary layer to another side wall portion of the second intermediary layer.

[0149] According to an embodiment, a sidewall portion of the first interposer may have the same height as a sidewall portion of the second interposer.

[0150] According to an embodiment, the first interposer may include a body in a closed curve shape enclosing the internal space, a plurality of conductive members penetrating the body, and a plurality of through holes provided with the plurality of conductive members.

[0151] According to one embodiment, the closed curve shaped body may include a non-conductive component having a plurality of through holes, and a conductive frame, wherein the conductive frame is arranged along the non-conductive component to form a side of the closed curve shaped body and shield the internal space.

[0152] According to an embodiment, the conductive frame may be electrically connected to the ground.

[0153] According to an embodiment, the second interposer may include a body, a plurality of conductive members penetrating the body, and a plurality of through holes provided with the plurality of conductive members.

[0154] According to an embodiment, the body may include a non-conductive member provided with a plurality of through holes.

[0155] According to an embodiment, the first circuit board may include a first surface facing a first direction and provided with the first electronic component and the second electronic component, and a second surface facing a second direction.

[0156] According to an embodiment, the first direction may be a direction opposite to the second direction.

[0157] According to an embodiment, the second circuit board may include a third surface facing the first direction, and a fourth surface facing the first surface of the first circuit board on which the first electronic component and the second electronic component are disposed.

[0158] According to an embodiment, a third electronic component may be further included, which is disposed on the third surface of the second circuit board.

[0159] According to an embodiment, the first intermediary layer and the second intermediary layer may electrically connect the first electronic component and the second electronic component disposed on the first circuit board and the third electronic component disposed on the second circuit board.

[0160] According to an embodiment, a fourth electronic component may be further included, which is disposed on the fourth surface of the second circuit board.

[0161] According to an embodiment, the first intermediary layer and the second intermediary layer may electrically connect the first electronic component and the second electronic component disposed on the first circuit board and the fourth electronic component disposed on the second circuit board.

[0162] According to an embodiment, the fourth electronic component may be disposed so as not to interfere with the first electronic component or the second electronic component disposed on the first surface of the first circuit board.

[0163] According to an embodiment, the first interposer and the second interposer may be integrated with each other.

[0164] According to an embodiment, at least a portion of the first circuit board may extend across the first interposer.

[0165] The electronic devices according to various embodiments disclosed in this specification may be devices in various forms. For example, the electronic devices may include portable communication devices (e.g., smart phones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or household electrical appliances. The electronic devices according to the embodiments of this specification are not limited to the above devices.

[0166] The various embodiments of this specification and the terms used therein are not intended to limit the technical features described in this specification to specific embodiments, but should be understood to include various modifications, equivalents or substitutions of the embodiment. In conjunction with the description of the accompanying drawings, similar reference numerals may be used for similar or related constituent elements. Unless otherwise clearly stated in the context, the singular form of the noun corresponding to the project may include one or more of the projects. In this specification, each phrase such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include all possible combinations of the projects listed together with the corresponding phrases in the phrase. Terms such as "first", "second" or "first" or "second" may be used to simply distinguish the constituent element from other constituent elements, and do not limit the constituent element in other aspects (e.g., importance or order). When any (e.g., a first) component is mentioned as being “coupled” or “connected” to another (e.g., a second) component with or without the term “functionally” or “communicatively”, it means that any component may be connected to the other component directly (e.g., by wire), wirelessly, or through a third component.

[0167] The term "module" used in this specification may include a unit implemented in hardware, software or firmware, and may be used interchangeably with terms such as logic, logic block, element or circuit. A module may be a minimum unit or a part of an element that is set as an integral element or performs more functions. For example, according to one embodiment, a module may be implemented in the form of an ASIC (application-specific integrated circuit).

[0168] Various embodiments of the present specification may be implemented in software (e.g., program 1540) including one or more commands stored in a storage medium (storage medium) (e.g., internal memory 1536 or external memory 1538) that can be read by a machine (e.g., electronic device 1501). For example, a processor (e.g., processor 1520) of a machine (e.g., electronic device 1501) may call and execute at least one of the one or more commands stored by the storage medium. This enables the device to perform at least one function according to at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., electromagnetic waves). The term does not distinguish between the case where data is semi-permanently stored on the storage medium and the case where it is temporarily stored.

[0169] According to one embodiment, the method according to various embodiments disclosed in this specification can be provided by being included in a computer program product. The computer program product can be traded between a buyer and a seller as a product. The computer program product can be distributed in the form of a device-readable storage medium (e.g., compact disc readonly memory (CD-ROM)), or can be distributed directly and online (e.g., downloaded or uploaded) through an application store (e.g., Play Store TM) or between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product can be at least temporarily stored in a storage medium such as a memory of a manufacturer's server, an application store's server, or a relay server that can be read by a device, or can be temporarily generated.

[0170] According to various embodiments, each constituent element (e.g., module or program) of the constituent elements described may include singular or plural individuals. According to various embodiments, one or more constituent elements or operations in the above-mentioned constituent elements may be omitted, or one or more other constituent elements or operations may be added. Roughly or additionally, multiple constituent elements (e.g., module or program) may be integrated into one constituent element. In this case, the integrated constituent element may perform one or more functions of each constituent element of the multiple constituent elements that are the same or similar to the functions performed by the corresponding constituent elements in the multiple constituent elements before the integration. According to various embodiments, the operations performed by modules, programs or other constituent elements may be performed sequentially, in parallel, repeatedly or heuristically, or one or more operations in the operations may be performed or omitted in different orders, or one or more other operations may be added.

Claims

1. An electronic device, comprising: A first circuit board including a first electronic component and a second electronic component, wherein the first electronic component and the second electronic component are disposed on a first side of the first circuit board; a second circuit board separated from the first circuit board and having a second side facing the first side of the first circuit board; A first interposer disposed between the first circuit board and the second circuit board includes: A non-conductive body disposed between the first circuit board and the second circuit board, a plurality of through holes formed through the non-conductive body, and a plurality of conductive members disposed in the plurality of through holes for electrically connecting the first circuit board and the second circuit board, Wherein, the non-conductive body comprises: a first non-conductive body having a closed shape, and a second non-conductive body integrally formed to extend from a portion of the first non-conductive body to another portion of the first non-conductive body to provide a first inner space and a second inner space spatially isolated from each other, wherein the first electronic component on the first circuit board is arranged corresponding to the first internal space, and the second electronic component on the first circuit board is arranged corresponding to the second internal space, The conductive portion is formed along a side surface of the second non-conductive body, and the conductive portion is configured to shield a second electronic component disposed in the second internal space from a first electronic component disposed in the first internal space. Wherein, the second non-conductive body comprises: a protruding portion supporting the second circuit board; and an extending portion extending from the protruding portion and supporting a third circuit board, and Wherein, the electronic device further comprises: A second interposer is disposed around the first non-conductive body on the first circuit board, wherein a height of the second interposer is lower than a height of the first interposer; and The third circuit board is spaced apart from the first circuit board and is disposed on an upper portion of the second interposer and an upper portion of the extended portion of the second non-conductive body, and The second intermediate layer and the extended portion of the second non-conductive body are arranged between the first circuit board and the third circuit board.

2. The electronic device according to claim 1, in, The first non-conductive body includes a plurality of side wall portions, each of which is disposed along the periphery of the first circuit board and the second circuit board, and The first internal space is enclosed by the first circuit board, the second circuit board and the first non-conductive body.

3. The electronic device according to claim 2, wherein: The second non-conductive body includes a side wall portion formed by a non-conductive member, The side wall portion of the second non-conductive body extends from one of the plurality of side wall portions of the first non-conductive body to another of the plurality of side wall portions of the first non-conductive body.

4. The electronic device according to claim 3, wherein: Each of the plurality of side wall portions of the first non-conductive body has the same height as that of the side wall portion of the second non-conductive body.

5. The electronic device according to claim 3, wherein: At least one conductive member from among the plurality of conductive members included in the sidewall portion of the second non-conductive body is configured to shield one of the first interior space and the second interior space from the other.

6. The electronic device according to claim 1, wherein: The conductive structure is electrically connected to the ground.

7. The electronic device according to claim 1, wherein: The first circuit board includes: a first surface facing the first direction, and the first surface is a first side of the first circuit on which the first electronic component and the second electronic component are arranged, and The second surface faces the second direction.

8. The electronic device according to claim 7, wherein: The first direction is opposite to the second direction.

9. The electronic device according to claim 7, wherein: The second circuit board includes: a third surface facing the first direction, and The fourth surface faces the first surface of the first circuit board, the fourth surface is the second side of the second circuit board, and the second side faces the first side of the first circuit board on which the first electronic component and the second electronic component are arranged.

10. The electronic device according to claim 9, wherein: Also includes: The third electronic component is disposed on the third surface of the second circuit board.

11. The electronic device according to claim 10, wherein: The first intermediate layer electrically connects the first electronic component and the second electronic component disposed on the first circuit board and the third electronic component disposed on the second circuit board.

12. The electronic device according to claim 9, wherein: Also includes: The fourth electronic component is disposed on the fourth surface of the second circuit board.

13. The electronic device according to claim 12, wherein: The first intermediate layer is electrically connected to the first electronic component and the second electronic component disposed on the first circuit board and the fourth electronic component disposed on the second circuit board.

14. The electronic device according to claim 12, wherein: The fourth electronic component is disposed so as not to interfere with the first electronic component or the second electronic component disposed on the first surface of the first circuit board.

15. The electronic device according to claim 1, wherein: The first non-conductive body and the second non-conductive body are integrated with each other.

16. The electronic device according to claim 1, wherein: At least a portion of the first circuit board extends across the first non-conductive body.

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